Insulating anti-blocking structure and thin film capacitor thereof

By setting up an insulating anti-blocking structure in the film capacitor, including an insulating part, an adhesive part and a barrier block, the problem of overflow of injection molding materials is solved, and the production yield and insulation performance of the capacitor are improved.

CN222619567UActive Publication Date: 2025-03-14PANASONIC ELECTRONIC DEVICES (JIANGMEN) CO LTD
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Patent Information

Application Number
CN202421146646.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-23
Publication Date
2025-03-14
Estimated Expiration
2034-05-23

AI Technical Summary

Technical Problem

In the design of film capacitors, the gap between the insulating paper and the copper bar causes the injection molding material to overflow, affecting the production yield and insulation performance of the capacitor.

Method used

An insulating and anti-blocking structure is adopted, and the insulation performance between the first copper row and the second copper row is ensured by providing an insulating portion and an adhesive portion, and an outwardly extending barrier block is provided on the barrier block of the adhesive portion to prevent the injection molding material from overflowing.

Benefits of technology

It effectively avoids overflow of injection molded materials, improves the production yield and insulation performance of film capacitors, and ensures the product performance and structural stability of the capacitors.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an insulating anti-blocking structure and a thin film capacitor thereof. The insulating anti-blocking structure comprises an insulating part, a pasting part, a first copper bar and a second copper bar, the insulating part is positioned between the first copper bar and the second copper bar, so that the first copper bar and the second copper bar are insulated; two ends of the pasting part are respectively adhered to the insulating part and the first copper bar; the two sides of the pasting part are provided with blocking blocks extending outwards, and the blocking blocks are located between the first copper bar and the insulating part. By arranging the insulating part and the pasting part, the insulating property between the first copper bar and the second copper bar is ensured, and the production yield of the film capacitor is improved; by arranging the barrier block and the injection molding part, the injection molding material can be effectively prevented from overflowing between the insulating part and the first copper bar to influence the structural stability of the injection molding part and the product performance of the film capacitor.
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Description

Technical Field

[0001] The invention relates to the technical field of film capacitors, in particular to an insulating anti-blocking structure and a film capacitor thereof. Background Art

[0002] Film capacitors are capacitors that use metal foil as electrodes, overlap it with plastic films such as polyethylene, polypropylene, polystyrene or polycarbonate at both ends, and then wind it into a cylindrical structure. Film capacitors need to use copper bars as P / N electrode pins in design, and the P / N copper bars need to be insulated from each other. The common method is to attach insulating paper between the two copper bars for isolation and insulation. The insulating paper itself is not sticky, so it needs to be attached to the copper bar with double-sided tape. In order to avoid the double-sided tape from sticking and getting dirty, the double-sided tape needs to not exceed the edge of the copper bar, that is, the double-sided tape needs to be shortened and kept away from the edge of the copper bar. This design forms a small gap between the insulating paper and the copper bar, that is, the area where the double-sided tape is not attached. During the process of injection molding and hardening, the injection molding material will climb outward along this gap and overflow to the place outside the insulating paper, affecting the injection molding effect of the film capacitor and reducing the production yield of the capacitor. Summary of the invention

[0003] To solve the above problems, the purpose of the present invention is to provide an insulating anti-blocking structure and a film capacitor thereof. By setting an insulating part and an adhesive part, it can effectively avoid the overflow of injection molding material, affect the insulation performance between the first copper bar and the second copper bar, and improve the production yield of the film capacitor.

[0004] The technical solution adopted by the present invention to solve the problem is:

[0005] The first aspect of the utility model is an insulating anti-blocking structure, comprising an insulating portion, an adhesive portion, a first copper bar and a second copper bar; the insulating portion is located between the first copper bar and the second copper bar to insulate the first copper bar and the second copper bar; the two ends of the adhesive portion are respectively adhered to the insulating portion and the first copper bar; both sides of the adhesive portion are provided with outwardly extending blocking blocks, and the blocking blocks are located between the first copper bar and the insulating portion.

[0006] The above-mentioned insulating anti-blocking structure has at least the following beneficial effects: by providing the insulating part and the adhesive part, the insulation performance between the first copper bar and the second copper bar is ensured, and the production yield rate of the film capacitor is improved; by providing the barrier block, the injection molding material can be effectively prevented from overflowing from between the insulating part and the first copper bar, affecting the structural stability of the insulating anti-blocking structure and the product performance of the film capacitor.

[0007] Furthermore, the length of the barrier block beyond the first copper bar is greater than or equal to 1 mm. This structure can not only reduce the barrier block from being contaminated, but also effectively prevent the injection molding material from overflowing, thereby ensuring the product performance of the film capacitor.

[0008] Furthermore, the adhesive part and the blocking block are made of double-sided adhesive tape, which is convenient and easy to use, has good adhesion, and saves bonding time. The adhesive part and the blocking block are made of double-sided adhesive tape, which effectively improves the stability and production efficiency of the insulation anti-blocking structure.

[0009] Furthermore, the first copper bar and the second copper bar are both provided with through holes for fixing. By providing the through holes, the first copper bar and the second copper bar can be stably fixed in the capacitor to avoid loosening, thereby improving the stability of the insulation anti-blocking structure.

[0010] Furthermore, the lower ends of the first copper bar and the second copper bar are both provided with conductive strips for connecting the capacitor core. By providing the conductive strips, the conductivity of the first copper bar and the second copper bar with the capacitor core is improved, and the product performance of the film capacitor is guaranteed.

[0011] The second aspect of the utility model is a film capacitor, comprising a capacitor core, a shell and the insulating anti-blocking structure as described above; an injection molded part is filled between the capacitor core and the shell, and the top of the injection molded part is located on the side of the barrier block; the first copper bar and the second copper bar are both electrically connected to the capacitor core.

[0012] The above-mentioned film capacitor has at least the following beneficial effects: by providing the insulating part and the adhesive part, the insulation performance between the first copper bar and the second copper bar is ensured, and the production yield rate of the film capacitor is improved; by providing the barrier block and the injection molding part, it can effectively prevent the injection molding material from overflowing from between the insulating part and the first copper bar, affecting the structural stability of the injection molding part and the product performance of the film capacitor.

[0013] Furthermore, the capacitor core is formed by winding the film. By winding the film into a cylindrical structure, the film forms a capacitor core that matches the shell, thereby ensuring the basic performance and structural stability of the film capacitor, and preventing the capacitor core from deforming or falling off during use, thereby affecting the stability of the film capacitor.

[0014] Furthermore, the upper end of the shell is flush with the upper end of the barrier block. This structure can prevent the top of the injection molding part from being higher than the top of the barrier block, effectively improving the protection performance of the barrier block and improving the structural stability of the injection molding part.

[0015] Furthermore, the shell is made of polyphenylene sulfide, which has the advantages of high mechanical strength, high temperature resistance, chemical resistance, flame retardancy, good thermal stability, and excellent electrical properties. The shell is made of polyphenylene sulfide to ensure the structural strength of the film capacitor and avoid damage to the shell that affects the service life of the film capacitor.

[0016] Furthermore, the injection molding part is formed by injection molding of epoxy resin. Epoxy resin has the advantages of strong adhesion, low shrinkage and good insulation. The injection molding part is formed by injection molding of epoxy resin, which can effectively ensure the connection stability between the capacitor core, the shell and the insulation anti-blocking structure, and improve the production yield of the film capacitor.

[0017] An insulating anti-blocking structure and a thin film capacitor thereof provided in an embodiment of the present application ensure the insulation performance between the first copper bar and the second copper bar by setting an insulating part and an adhesive part, thereby improving the production yield rate of the thin film capacitor; and by setting a barrier block and an injection molding part, it can effectively prevent the injection molding material from overflowing from between the insulating part and the first copper bar, thereby affecting the structural stability of the injection molding part and the product performance of the thin film capacitor.

[0018] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a structural diagram of an insulation anti-blocking structure according to an embodiment of the present application;

[0020] Figure 2 This is a structural exploded diagram of an insulating anti-blocking structure according to an embodiment of the present application;

[0021] Figure 3 A side view of an insulating anti-blocking structure according to an embodiment of the present application;

[0022] Figure 4 This is a structural diagram of a thin film capacitor according to an embodiment of the present application;

[0023] Figure 5 This is a structural exploded diagram of a thin film capacitor according to an embodiment of the present application;

[0024] Figure 6 This is a cross-sectional view of a thin film capacitor according to an embodiment of the present application. DETAILED DESCRIPTION

[0025] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0026] Reference Figures 1 to 3 The embodiment of the utility model provides an insulation anti-blocking structure, including an insulating part 100, an adhesive part 200, a first copper bar 300 and a second copper bar 400; the insulating part 100 is located between the first copper bar 300 and the second copper bar 400 to insulate the first copper bar 300 and the second copper bar 400; the two ends of the adhesive part 200 are respectively adhered to the insulating part 100 and the first copper bar 300; both sides of the adhesive part 200 are provided with outwardly extending blocking blocks 210, and the blocking blocks 210 are located between the first copper bar 300 and the insulating part 100.

[0027] By providing the insulating portion 100 and the adhesive portion 200, the insulation performance between the first copper bus 300 and the second copper bus 400 is ensured, thereby improving the production yield rate of the film capacitor; by providing the barrier block 210, it is possible to effectively prevent the injection molding material from overflowing from between the insulating portion 100 and the first copper bus 300, thereby affecting the structural stability of the insulating anti-blocking structure and the product performance of the film capacitor.

[0028] In another embodiment, the length of the barrier block 210 beyond the first copper bar 300 is greater than or equal to 1 mm. This structure can reduce the barrier block 210 from being contaminated with dirt, and can also effectively prevent the injection material from overflowing, thereby ensuring the product performance of the film capacitor.

[0029] In another embodiment, the adhesive portion 200 and the blocking block 210 are made of double-sided adhesive tape. The double-sided adhesive tape has the advantages of being easy to use, having good adhesion, and saving bonding time. The adhesive portion 200 and the blocking block 210 are made of double-sided adhesive tape, which effectively improves the stability and production efficiency of the insulation anti-blocking structure.

[0030] In another embodiment, the first copper bar 300 and the second copper bar 400 are both provided with a through hole 310 for fixing. By providing the through hole 310, the first copper bar 300 and the second copper bar 400 can be stably fixed in the capacitor to avoid loosening, thereby improving the stability of the insulation anti-blocking structure.

[0031] In another embodiment, the lower ends of the first copper bar 300 and the second copper bar 400 are both provided with a conductive bar 320 for connecting the capacitor core. By providing the conductive bar 320, the conductivity of the first copper bar 300 and the second copper bar 400 and the capacitor core is improved, and the product performance of the film capacitor is guaranteed.

[0032] Reference Figures 4 to 6 The embodiment of the utility model also provides a film capacitor, including a capacitor core 500, a shell 600 and the insulating anti-blocking structure as described above; an injection molding part 510 is filled between the capacitor core 500 and the shell 600, and the top of the injection molding part 510 is located on the side of the blocking block 210; the first copper bus 300 and the second copper bus 400 are both electrically connected to the capacitor core 500.

[0033] By providing the insulating part 100 and the adhesive part 200, the insulation performance between the first copper bar 300 and the second copper bar 400 is ensured, and the production yield rate of the film capacitor is improved; by providing the barrier block 210 and the injection molding part 510, it is possible to effectively prevent the injection molding material from overflowing from between the insulating part 100 and the first copper bar 300, thereby affecting the structural stability of the injection molding part 510 and the product performance of the film capacitor.

[0034] In another embodiment, the capacitor core 500 is formed by winding a film. By winding the film into a cylindrical structure, the film forms the capacitor core 500 that matches the housing 600, thereby ensuring the basic performance and structural stability of the film capacitor, and preventing the capacitor core 500 from deforming or falling off during use, thereby affecting the stability of the film capacitor.

[0035] In another embodiment, the upper end of the housing 600 is flush with the upper end of the barrier block 210. This structure can prevent the top of the injection molding part 510 from being higher than the top of the barrier block 210, effectively improving the protection performance of the barrier block 210 and improving the structural stability of the injection molding part 510.

[0036] In another embodiment, the housing 600 is made of polyphenylene sulfide. Polyphenylene sulfide has the advantages of high mechanical strength, high temperature resistance, chemical resistance, flame retardancy, good thermal stability, and excellent electrical properties. The housing 600 is made of polyphenylene sulfide to ensure the structural strength of the film capacitor and avoid damage to the housing 600 to affect the service life of the film capacitor.

[0037] In another embodiment, the injection molding part 510 is formed by epoxy resin injection molding. Epoxy resin has the advantages of strong adhesion, low shrinkage, and good insulation. The injection molding part 510 is formed by epoxy resin injection molding, which can effectively ensure the connection stability between the capacitor core 500, the shell 600 and the insulation anti-blocking structure, and improve the production yield of the film capacitor.

[0038] The working principle of the utility model is further explained below.

[0039] During the production process, first, the insulating part 100, the first copper bar 300 and the second copper bar 400 of corresponding sizes are cut according to the specifications of the film capacitor; the adhesive part 200 and the blocking block 210 of appropriate sizes are cut on the double-sided tape, so that the width of the adhesive part 200 is 2mm longer than the width of the first copper bar 300, that is, the length of the blocking block 210 exceeding the first copper bar 300 is 1mm. The adhesive portion 200 and the insulating portion 100 are sequentially attached to the first copper bar 300 by using an automated device, so that the insulating portion 100 is located between the upper end of the first copper bar 300 and the upper end of the second copper bar 400, so as to ensure that the first copper bar 300 and the second copper bar 400 are in an insulating state; the film is wound into a cylindrical structure so that the film forms a capacitor core 500 that matches the shell 600 made of polyphenylene sulfide; then, the insulating anti-blocking structure and the capacitor core 500 are fixed in the shell 600 by an external device, and the conductive strips 320 on the first copper bar 300 and the second copper bar 400 are respectively in contact with the two poles of the capacitor core 500, and the shell 600 is 0 is flush with the upper end of the barrier block 210; finally, the injection molding part 510 is formed by epoxy resin injection molding, and it is ensured that the injection molding part 510 fills the gap between the through hole 310, the second copper bar 400 and the insulating part 100; during the injection molding process, the barrier block 210 that exceeds the side position of the first copper bar 300 can effectively block the injection molding material, effectively alleviate the climbing phenomenon of the injection molding material, and ensure that the injection molding part 510 can be quickly and stably formed; at the same time, since the height of the injection molding part 510 is lower than the height of the shell 600, it can ensure that the barrier block 210 is located between the first copper bar 300 and the insulating part 100, further ensuring the protection range of the barrier block 210. In this way, the production process of the film capacitor is completed. By changing the structure of the pasting part 200, there is no need to change the original pasting process, and there is no need to add additional tooling and fixtures, the climbing problem of the injection molding material is solved, and the product quality of the film capacitor is improved. The embodiment of the present application solves the problem of epoxy resin climbing during the injection molding process by providing an insulating anti-blocking structure, reduces the generation rate of defective products, reduces the time required for production workers to check the appearance of the product, and improves the production efficiency of film capacitors.

[0040] From the above description, it can be seen that the insulation anti-blocking structure and the film capacitor of the utility model ensure the insulation performance between the first copper bar 300 and the second copper bar 400 by setting the insulating part 100 and the adhesive part 200, thereby improving the production yield rate of the film capacitor; by setting the barrier block 210 and the injection molding part 510, it can effectively prevent the injection molding material from overflowing from between the insulating part 100 and the first copper bar 300, affecting the structural stability of the injection molding part 510 and the product performance of the film capacitor.

[0041] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. An insulation anti-blocking structure, characterized in that: include: An insulating portion, an adhesive portion, a first copper bar and a second copper bar; the insulating portion is located between the first copper bar and the second copper bar to insulate the first copper bar and the second copper bar; two ends of the adhesive portion are respectively adhered to the insulating portion and the first copper bar; both sides of the adhesive portion are provided with outwardly extending blocking blocks, and the blocking blocks are located between the first copper bar and the insulating portion.

2. The insulation anti-blocking structure according to claim 1, characterized in that: The length of the blocking block exceeding the first copper bar is greater than or equal to 1 mm.

3. The insulation anti-blocking structure according to claim 2, characterized in that: The adhesive portion and the barrier block are integrally made of double-sided adhesive tape.

4. The insulation anti-blocking structure according to claim 1, characterized in that: The first copper busbar and the second copper busbar are both provided with through holes for fixing.

5. The insulation anti-blocking structure according to claim 4, characterized in that: The lower ends of the first copper bar and the second copper bar are both provided with conductive bars for connecting the capacitor core.

6. A film capacitor, characterized in that: It comprises a capacitor core, a shell and an insulating anti-blocking structure as described in any one of claims 1 to 5 above; an injection-molded part is filled between the capacitor core and the shell, and the top of the injection-molded part is located on the side of the barrier block; the first copper bar and the second copper bar are both electrically connected to the capacitor core.

7. A film capacitor according to claim 6, characterized in that: The capacitor core is formed by winding a film.

8. A film capacitor according to claim 6, characterized in that: The upper end of the shell is flush with the upper end of the blocking block.

9. A film capacitor according to claim 8, characterized in that: The shell is made of polyphenylene sulfide.

10. The film capacitor according to claim 6, characterized in that: The injection-molded part is formed by injection molding of epoxy resin.

Citation Information

Cited By

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