Casting mold for metal casting production

Abstract

The utility model discloses a casting mold for metal casting production. The casting mold comprises a base, an upper mold, a lower mold and a circulating cooling device, cooling liquid used for cooling is injected into the base, a portal frame is fixedly arranged above the base, the upper mold is fixedly arranged on the portal frame, a corresponding metal casting mold cavity is formed in the upper mold, and a casting pipe is installed at the top of the portal frame. The bottom end of the casting pipe is connected with the upper die and used for injecting metal liquid into a die cavity of the upper die. The upper mold and the lower mold are convenient to assemble and disassemble, a metal casting is very convenient to take out, time and labor are saved, the working efficiency is improved, cooling liquid circulates into the base and overflows to the lower portion after being refrigerated by the semiconductor chilling plate, the temperature of the pumped cooling liquid is kept low, the difference between the follow-up cooling effect and the early-stage cooling effect is reduced, and the service life of the metal casting is prolonged. And the cooling continuity and the cooling effect are effectively ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of casting molds, and more specifically to a casting mold used for the production of metal castings. Background Art

[0002] In the metallurgical industry, casting molds are important process equipment for casting cast iron. During casting, the metal liquid is poured into the casting mold, and after the metal liquid is cooled and formed in the casting mold, a solidified metal casting blank is obtained. After the blank is taken out and finely processed, the metal casting finished product can be obtained.

[0003] A utility model with a publication number of CN214349534U disclosed a structurally stable mold for metal casting production, comprising a top cover, a base, an upper mold and a lower mold, wherein the top cover is detachably mounted on the base; the lower mold is mounted in the base; a mold cavity is arranged in the lower mold; an upper mold is arranged on the lower mold; an exhaust hole connected to the mold cavity is arranged on the upper mold; a casting port is connected in the top cover; a discharge port is arranged below the upper mold corresponding to the casting port; a first channel and a second channel are connected between the discharge port and the mold cavity; a water pump 1 and a water pump 2 electrically connected to a PLC controller are mounted in the base; and a water inlet and a water outlet are respectively connected on both sides of the base.

[0004] There are still the following deficiencies in actual use:

[0005] 1. In the above technology, the upper mold and the lower mold are installed in the base, and then the top cover is installed on the base, and fixed by the plug plate and the socket. After casting, the plug plate and the socket need to be separated, and the top cover and the upper mold need to be removed in turn to remove the metal casting from the lower mold. Installing the mold and removing the metal casting is not convenient, time-consuming and labor-intensive, and affects work efficiency.

[0006] 2. In the above technology, the water in the base is pumped out by a water pump for cooling. The water is cooled by heat exchange after contacting the mold, which improves the cooling effect compared to natural cooling. However, the recycling of the water after heat exchange causes its temperature to rise, which makes the subsequent cooling effect different from the previous cooling effect, and the cooling continuity and cooling effect are limited. Utility Model Content

[0007] In view of the problems existing in the prior art, the purpose of the utility model is to provide a casting mold for the production of metal castings.

[0008] To solve the above problems, the utility model adopts the following technical solutions.

[0009] A casting mold for producing metal castings comprises a base, an upper mold, a lower mold and a circulating cooling device.

[0010] The base is injected with cooling liquid for cooling, a gantry is fixedly provided above the base, the upper mold is fixedly provided on the gantry, the upper mold is provided with a corresponding metal casting mold cavity, a casting pipe is installed on the top of the gantry, the bottom end of the casting pipe is connected with the upper mold for injecting metal liquid into the mold cavity of the upper mold; the lower mold is located directly below the upper mold, a lifting assembly is installed between the lower mold and the base, and the lifting assembly controls the lifting of the lower mold to realize the closing and parting of the lower mold and the upper mold;

[0011] The circulating cooling device comprises a first water pump, a second water pump and a semiconductor refrigeration plate.

[0012] The water pump 1 is installed on one side of the base, and the water pump 1 pumps the coolant in the base into the upper mold for cooling; the water pump 2 is installed on one side of the base, and the water pump 2 pumps the coolant in the base into the lower mold for cooling; the semiconductor refrigeration plate is installed inside the base, and the hot end of the semiconductor refrigeration plate is located outside the base.

[0013] As a further description of the above technical solution: a spiral channel is opened inside the upper mold, and a water inlet joint 1 and a water outlet joint 1 located at the water inlet position and the water outlet position of the spiral channel are fixedly arranged on one side of the upper mold.

[0014] As a further description of the above technical solution: an annular channel is opened inside the lower mold, and one side of the lower mold is fixedly provided with a second water inlet joint and a second water outlet joint located at the water inlet position and the water outlet position of the annular channel.

[0015] As a further description of the above technical solution: the input end and output end of the water pump are respectively equipped with a water suction pipe 1 and a water inlet pipe 1, one end of the water suction pipe 1 extends into the base, one end of the water inlet pipe 1 is connected to a water inlet joint 1, and one end of the water outlet joint 1 is equipped with a water outlet pipe 1, and one end of the water outlet pipe 1 extends to the interior of the base.

[0016] As a further description of the above technical solution: the input end and output end of the water pump 2 are respectively installed with a water suction pipe 2 and a water inlet pipe 2, one end of the water suction pipe 2 extends into the base, one end of the water inlet pipe 2 is connected to the water inlet joint 2, and one end of the water outlet joint 2 is installed with a water outlet pipe 2, and one end of the water outlet pipe 2 extends to the inside of the base.

[0017] As a further description of the above technical solution: the second water inlet pipe and the second water outlet pipe both adopt retractable bellows, and the retractable amount of the second water inlet pipe and the second water outlet pipe is greater than the moving stroke of the lower mold.

[0018] As a further description of the above technical solution: an overflow plate is fixedly arranged inside the base, and the overflow plate is an inverted trapezoidal structure. The semiconductor refrigeration plate is located on the inner side of the overflow plate. One end of the water outlet pipe 1 and the water outlet pipe 2 extending into the base is located above the overflow plate, and the water pumping pipe 1 and the water pumping pipe 2 are located below the overflow plate.

[0019] As a further description of the above technical solution: the lifting assembly includes a lower base and an upper base respectively installed above the base and below the lower mold, the inner sides of the lower base and the upper base are fixedly provided with fixed shafts, the sides of the lower base and the upper base are provided with sliding grooves, and connecting shafts are slidably arranged in the sliding grooves, and support rods are hingedly installed between the fixed shafts and the connecting shafts distributed diagonally, and two adjacent support rods are hinged to each other, and a telescopic cylinder is fixedly installed on the lower base, and the movable end of the telescopic cylinder is connected to the connecting shaft below.

[0020] Compared with the prior art, the advantages of the present invention are:

[0021] 1. The lower mold is lifted and lowered by the lifting assembly, and the mold is closed and separated with the upper mold by the lifting of the lower mold. The upper and lower molds are convenient to close and separate, and the removal of metal castings is also very convenient, which saves time and effort and improves work efficiency.

[0022] 2. The coolant in the base is extracted through water pump 1 and water pump 2, and enters the spiral channel and annular channel inside the upper mold and the lower mold respectively, thereby cooling the upper mold and the lower mold to achieve cooling of the metal casting. The coolant after heat exchange will fall on the overflow plate, and then overflow to the bottom after being cooled by the semiconductor refrigeration plate, so that the temperature of the extracted coolant remains low, reducing the difference in the effect of subsequent cooling and previous cooling, and effectively ensuring the continuity and cooling effect of cooling. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;

[0024] Figure 2 It is a rear view structural schematic diagram of the utility model as a whole;

[0025] Figure 3 It is a partial cross-sectional schematic diagram of the upper mold of the utility model;

[0026] Figure 4 It is a cross-sectional structural schematic diagram of the lower mold of the utility model;

[0027] Figure 5 It is a three-dimensional structural schematic diagram of the lifting assembly of the utility model;

[0028] Figure 6It is a schematic cross-sectional structural diagram of the base of the utility model.

[0029] Description of the numbers in the figure:

[0030] 1. Base; 2. Upper mold; 21. Spiral channel; 22. Water inlet joint 1; 23. Water outlet joint 1; 3. Lower mold; 31. Annular channel; 32. Water inlet joint 2; 33. Water outlet joint 2; 4. Circulating cooling device; 41. Water pump 1; 411. Water suction pipe 1; 412. Water inlet pipe 1; 413. Water outlet pipe 1; 42. Water pump 2; 421. Water suction pipe 2; 422. Water inlet pipe 2; 423. Water outlet pipe 2; 43. Semiconductor refrigeration plate; 5. Gantry; 6. Casting pipe; 7. Lifting assembly; 71. Lower base; 72. Upper base; 73. Fixed shaft; 74. Slide; 75. Connecting shaft; 76. Support rod; 77. Telescopic cylinder; 8. Overflow plate. DETAILED DESCRIPTION

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention;

[0032] See also Figures 1 to 6 In the utility model, a casting mold for metal casting production includes a base 1, an upper mold 2, a lower mold 3 and a circulating cooling device 4.

[0033] A cooling liquid is injected into the base 1 for cooling. A gantry 5 is fixed above the base 1. The upper mold 2 is fixed on the gantry 5. The upper mold 2 is provided with a corresponding metal casting mold cavity. A casting pipe 6 is installed on the top of the gantry 5. The bottom end of the casting pipe 6 is connected to the upper mold 2 for injecting metal liquid into the mold cavity of the upper mold 2. The lower mold 3 is located directly below the upper mold 2. A lifting assembly 7 is installed between the lower mold 3 and the base 1. The lifting assembly 7 controls the lifting of the lower mold 3 to achieve the closing and parting of the lower mold 3 and the upper mold 2.

[0034] The circulating cooling device 4 includes a water pump 1 41 , a water pump 2 42 and a semiconductor refrigeration plate 43 .

[0035] Water pump 1 41 is installed on one side of the base 1, and water pump 1 41 pumps the coolant in the base 1 into the upper mold 2 for cooling; water pump 2 42 is installed on one side of the base 1, and water pump 2 42 pumps the coolant in the base 1 into the lower mold 3 for cooling; a semiconductor refrigeration plate 43 is installed inside the base 1, and the hot end of the semiconductor refrigeration plate 43 is located outside the base 1.

[0036] In the present embodiment, preferably, a spiral channel 21 is opened inside the upper mold 2, and a water inlet joint 22 and a water outlet joint 23 are fixedly provided on one side of the upper mold 2, which are located at the water inlet position and the water outlet position of the spiral channel 21; a water suction pipe 411 and a water inlet pipe 412 are respectively installed at the input end and the output end of the water pump 41, one end of the water suction pipe 411 extends into the base 1, one end of the water inlet pipe 412 is connected to the water inlet joint 22, and one end of the water outlet joint 23 is installed with a water outlet pipe 413, and one end of the water outlet pipe 413 extends to the inside of the base 1.

[0037] Specifically, the water pump 41 extracts the coolant in the base 1 through the water extraction pipe 411, and connects the water inlet joint 22 through the water inlet pipe 412 to pass the coolant into the spiral channel 21 to cool the upper mold 2. The coolant after heat exchange flows back to the base 1 through the water outlet joint 23 and the water outlet pipe 413 to realize circulation.

[0038] In the present embodiment, preferably, an annular channel 31 is opened inside the lower mold 3, and a water inlet joint 32 and a water outlet joint 33 are fixedly provided on one side of the lower mold 3, which are located at the water inlet position and the water outlet position of the annular channel 31; the input end and the output end of the water pump 42 are respectively installed with a water suction pipe 421 and a water inlet pipe 422, one end of the water suction pipe 421 extends into the base 1, one end of the water inlet pipe 422 is connected to the water inlet joint 32, and one end of the water outlet joint 33 is installed with a water outlet pipe 423, and one end of the water outlet pipe 423 extends to the inside of the base 1.

[0039] Specifically, the water pump 42 extracts the coolant in the base 1 through the water extraction pipe 421, and connects the water inlet joint 32 through the water inlet pipe 422 to pass the coolant into the annular channel 31 to cool the lower mold 3. The coolant after heat exchange flows back to the base 1 through the water outlet joint 33 and the water outlet pipe 423 to realize circulation.

[0040] In this embodiment, preferably, the second water inlet pipe 422 and the second water outlet pipe 423 both adopt retractable bellows, and the retractable amount of the second water inlet pipe 422 and the second water outlet pipe 423 is greater than the moving stroke of the lower mold 3.

[0041] Specifically, the second water inlet pipe 422 and the second water outlet pipe 423 are retractable bellows and the amount of retraction is greater than the moving stroke of the lower mold 3, so that no interference will occur when the lower mold 3 and the upper mold 2 are closed and separated.

[0042] In this embodiment, preferably, an overflow plate 8 is fixedly provided inside the base 1, and the overflow plate 8 is an inverted trapezoidal structure. The semiconductor refrigeration plate 43 is located on the inner side of the overflow plate 8, and one end of the water outlet pipe 1 413 and the water outlet pipe 2 423 extending to the inside of the base 1 is located above the overflow plate 8, and the water pumping pipe 1 411 and the water pumping pipe 2 421 are located below the overflow plate 8.

[0043] Specifically, the coolant after heat exchange that flows back to the base 1 through the outlet pipe 1 413 and the outlet pipe 2 423 will fall on the overflow plate 8, and then overflow to the bottom after being cooled by the semiconductor refrigeration plate, so that the temperature of the extracted coolant remains low.

[0044] In this embodiment, preferably, the lifting assembly 7 includes a lower base 71 and an upper base 72 respectively installed above the base 1 and below the lower mold 3, and a fixed shaft 73 is fixedly provided on the inner side of the lower base 71 and the upper base 72, and a slide groove 74 is opened on the side of the lower base 71 and the upper base 72, and a connecting shaft 75 is slidably provided in the slide groove 74, and a support rod 76 is hingedly installed between the diagonally distributed fixed shaft 73 and the connecting shaft 75, and two adjacent support rods 76 are hinged to each other, and a telescopic cylinder 77 is fixedly installed on the lower base 71, and the movable end of the telescopic cylinder 77 is connected to the connecting shaft 75 below.

[0045] Specifically, the telescopic cylinder 77 pulls the lower connecting shaft 75 to slide in the slide groove 74, and the connecting shaft 75 drives the mutually hinged support rods 76 to perform a scissor action, so that the distance between the upper base 72 and the lower base 71 is expanded or reduced, thereby realizing the lifting and lowering of the upper base 72, and the upper base 72 drives the lower mold 3 to lift and lower, realizing the mold closing or mold separation.

[0046] The working principle and use process of this utility model:

[0047] When in use, the lower mold 3 is raised and closed with the upper mold 2 through the lifting component 7. The lower mold 3 can be firmly fixed under the upper mold 2, and metal liquid is injected into the mold cavity of the upper mold 2 from the casting tube 6 until the metal liquid in the mold cavity is cooled and becomes a metal casting. Then the lower mold 3 is smoothly lowered by the lifting component 7, and the lower mold 3 and the upper mold 2 are separated. The closing and separation of the upper mold 2 and the lower mold 3 are convenient, and the removal of the metal casting is also very convenient, which saves time and effort and improves work efficiency.

[0048] In the above process, the coolant in the base 1 can be pumped out by water pump 1 41 and water pump 2 42, and enter the spiral channel 21 and the annular channel 31 inside the upper mold 2 and the lower mold 3 respectively, thereby cooling the upper mold 2 and the lower mold 3, thereby cooling the metal casting. The coolant after heat exchange will fall on the overflow plate 8, and then overflow to the bottom after being cooled by the semiconductor refrigeration plate, so that the temperature of the extracted coolant is kept low, reducing the difference in the effect of subsequent cooling and previous cooling, and effectively ensuring the continuity and cooling effect of cooling.

[0049] The electronic components and modules used in the content of this utility model can all be parts that are commonly used in the market and can realize the specific functions in this case, and the specific models and sizes can be selected and adjusted according to actual needs. The electronic components and modules are all connected to an external power supply and a control switch for use. Their specific circuit connection methods and methods of use are commonly used public technologies and will not be elaborated on here.

[0050] The above is only a preferred specific implementation of the utility model; however, the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and improved ideas of the utility model within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model.

Claims

1. A casting mold for metal casting production, characterized in that: include: A base (1), wherein a cooling liquid is injected into the base (1), and a gantry (5) is fixedly arranged above the base (1); An upper mold (2), the upper mold (2) being fixedly mounted on a gantry (5), the upper mold (2) being provided with a corresponding metal casting mold cavity, a casting pipe (6) being mounted on the top of the gantry (5), the bottom end of the casting pipe (6) being connected to the upper mold (2) for injecting metal liquid into the mold cavity of the upper mold (2); A lower mold (3), the lower mold (3) is located directly below the upper mold (2), a lifting assembly (7) is installed between the lower mold (3) and the base (1), and the lifting assembly (7) controls the lifting of the lower mold (3) to achieve mold closing and mold separation of the lower mold (3) and the upper mold (2); A circulating cooling device (4), wherein the circulating cooling device (4) comprises: A water pump (41), wherein the water pump (41) is installed on one side of the base (1), and the water pump (41) pumps the cooling liquid in the base (1) into the upper mold (2) for cooling; A second water pump (42), the second water pump (42) being installed on one side of the base (1), and the second water pump (42) pumps the coolant in the base (1) into the lower mold (3) for cooling; A semiconductor refrigeration plate (43), wherein the semiconductor refrigeration plate (43) is installed inside the base (1), and the hot end of the semiconductor refrigeration plate (43) is located outside the base (1).

2. A casting mold for metal casting production according to claim 1, characterized in that: A spiral channel (21) is provided inside the upper mold (2), and a water inlet joint (22) and a water outlet joint (23) are fixedly provided on one side of the upper mold (2) at the water inlet position and the water outlet position of the spiral channel (21).

3. A casting mold for metal casting production according to claim 2, characterized in that: An annular channel (31) is provided inside the lower mold (3), and a second water inlet joint (32) and a second water outlet joint (33) are fixedly provided on one side of the lower mold (3) and are located at the water inlet position and the water outlet position of the annular channel (31).

4. A casting mold for metal casting production according to claim 3, characterized in that: The input end and the output end of the water pump 1 (41) are respectively provided with a water suction pipe 1 (411) and a water inlet pipe 1 (412); one end of the water suction pipe 1 (411) extends into the base (1); one end of the water inlet pipe 1 (412) is connected to a water inlet joint 1 (22); one end of the water outlet joint 1 (23) is provided with a water outlet pipe 1 (413); one end of the water outlet pipe 1 (413) extends into the interior of the base (1).

5. A casting mold for metal casting production according to claim 4, characterized in that: The input end and the output end of the water pump 2 (42) are respectively provided with a water pumping pipe 2 (421) and a water inlet pipe 2 (422); one end of the water pumping pipe 2 (421) extends into the base (1); one end of the water inlet pipe 2 (422) is connected to the water inlet joint 2 (32); one end of the water outlet joint 2 (33) is provided with a water outlet pipe 2 (423); one end of the water outlet pipe 2 (423) extends into the interior of the base (1).

6. A casting mold for metal casting production according to claim 5, characterized in that: The second water inlet pipe (422) and the second water outlet pipe (423) are both retractable bellows, and the retractable amount of the second water inlet pipe (422) and the second water outlet pipe (423) is greater than the moving stroke of the lower mold (3).

7. A casting mold for metal casting production according to claim 5, characterized in that: An overflow plate (8) is fixedly arranged inside the base (1), and the overflow plate (8) is an inverted trapezoidal structure. The semiconductor refrigeration plate (43) is located on the inner side of the overflow plate (8), and one end of the water outlet pipe 1 (413) and the water outlet pipe 2 (423) extending into the base (1) is located above the overflow plate (8), and the water pumping pipe 1 (411) and the water pumping pipe 2 (421) are located below the overflow plate (8).

8. A casting mold for metal casting production according to claim 1, characterized in that: The lifting assembly (7) comprises a lower base (71) and an upper base (72) which are respectively mounted above the base (1) and below the lower mold (3); a fixed shaft (73) is fixedly arranged on the inner side of the lower base (71) and the upper base (72); a slide groove (74) is provided on the side of the lower base (71) and the upper base (72); a connecting shaft (75) is slidably arranged in the slide groove (74); a support rod (76) is hingedly installed between the fixed shaft (73) and the connecting shaft (75) which are diagonally distributed; two adjacent support rods (76) are hingedly connected to each other; a telescopic cylinder (77) is fixedly installed on the lower base (71); and a movable end of the telescopic cylinder (77) is connected to the connecting shaft (75) below.

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