Thermal module

Abstract

A thermal module includes a heat radiating unit, a heat transfer unit, and at least one cross-flow fan. The heat radiating unit has an air inlet and an air outlet that communicate with each other. The heat transfer unit has a heat absorbing section attached to a heat source and a heat dissipating section extended from the heat absorbing section to connect to the heat radiating unit. The cross-flow fan is arranged opposite to the heat radiating unit with an air-out side of the cross-flow fan located adjoining to the air inlet of the heat radiating unit. With the above arrangements, the thermal module occupies a largely reduced area while providing largely upgraded heat dissipation effect.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a thermal module, and more particularly to a thermal module that utilizes a cross-flow fan to reduce the area occupied by the thermal module while upgrading the heat dissipation ability thereof and overcoming the problem of vibration and noise caused by long blades of the conventionally designed fan used with a thermal module.BACKGROUND OF THE INVENTION[0002]Due to the rapid development in the electronic industry, the density of transistors contained in various kinds of chips, such as processors, executing units and the like, also increases quickly. While the electronic elements can process data more quickly, they also consume more power and generate more heat during the operation thereof. For the central processing unit (CPU) to work stably, it is necessary to use a high-efficiency heat radiating unit to radiate the high amount of heat produced by the CPU in operation. To maintain highly efficient heat radiating function,...

AI Technical Summary

Benefits of technology

The present invention provides a thermal module with improved heat dissipation ability and reduced vibration and noise caused by excessive bladedeformation. By using a cross-flow fan, the thermal module can have a smaller size and still produce a large volume of air flow, which improves heat dissipation. This also solves the problem of vibration and noise caused by long blades of other types of fans. Overall, this thermal module is ideal for limited space and provides better heat dissipation.

Problems solved by technology

While the electronic elements can process data more quickly, they also consume more power and generate more heat during the operation thereof.

However, the large-sized heat radiating unit forms a bottleneck in the design of notebook computers, tablet computers, smart mobile phones, and smart handheld electronic devices that all have very limited internal space.

While the length-extended radiating fins enable the radiating unit 12 to provide improved heat radiating effect, they also have excessively large volume and are absolutely not suitable for use with the notebook computer that is characterized by light weight as well as slim and compact configuration.

However, the miniaturized centrifugal fan 10 can only produce relatively reduced air flow, which results in limited heat dissipation effect.

Meanwhile, the miniaturized centrifugal fan 10 has blades that have relatively large areas but reduced thickness and therefore tend to deflect and swing and accordingly produce vibration and noise when the centrifugal fan 10 operates.

In brief, the conventional thermal module has the following disadvantages: (1) having a relatively large volume; (2) providing poor heat dissipating effect; and (3) tending to produce vibration and noise during operation.

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