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Heat dissipating apparatus

a technology of heat dissipation apparatus and heat dissipation chamber, which is applied in the direction of electrical apparatus, electrical apparatus, electrical apparatus contruction details, etc., can solve the problems of deterioration of server operation stability, damage to servers, and considerable heat generated during operation

Inactive Publication Date: 2013-10-31
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present patent relates to a heat dissipating apparatus for servers, which includes a heat exchanger. The technical effect of the patent is to provide a more efficient and precise method for removing heat from servers in a server system. The heat dissipating apparatus includes an enclosure, two heat exchangers, a supporting plate, and a partition plate, which work together to effectively dissipate heat and maintain an acceptable operating temperature of the servers. The enclosure has a unique design that allows for easy installation and accurate positioning of the heat exchangers. The heat dissipating apparatus can be easily installed and maintained in the server cabinet.

Problems solved by technology

Each of the servers includes at least a power supply device, a motherboard, a central processing unit (CPU), a hard disk drive, and an optical disk drive, and thus considerable heat is generated during operation.
Excess heat may cause deterioration in the operational stability of the servers and may damage the servers.
However, the heat exchanger is often so heavy that it is difficult to install the heat exchanger precisely in the cabinet.

Method used

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Examples

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Embodiment Construction

[0014]The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean “at least one.”

[0015]FIGS. 1-3 show a heat dissipating apparatus 1 in accordance with an embodiment. The heat dissipating apparatus 1 includes an enclosure 10, two heat exchangers 20, a supporting plate 30, and a partition plate 50.

[0016]The enclosure 10 includes a bottom plate 11, two opposite side plates 13, a first beam 151, and a second beam 152. The bottom plate 11 is connected to the two side plates 13. The two side plates 13 are substantially perpendicular to the bottom plate 11 and parallel to each other. The first beam 151 is connected to respective right edges of the two side plates 13. The second beam 152 is connected to respective left edges of th...

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PUM

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Abstract

A heat dissipating apparatus includes an enclosure, a supporting frame attached in the enclosure, and a heat exchanger. The enclosure includes two opposite side plates, each of which defines at least one guiding groove. The heat exchanger is mounted to the supporting frame. The heat exchanger includes two opposite sidewalls and at least one positioning post protruding from each of the two sidewalls. Each of the at least one positioning posts is slidably received in, positioned by, and held captive in, one of the at least one guiding grooves.

Description

REFERENCE TO RELATED APPLICATIONS[0001]This application claims all benefits accruing under 35 U.S.C. §119 from China Patent Application No. 201210126813.6, filed on Apr. 27, 2011 in the State Intellectual Property Office of China, the contents of the China Application are hereby incorporated by reference.BACKGROUND[0002]1. Technical Field[0003]The present disclosure generally relates to heat dissipating apparatuses, and particularly relates to a heat dissipating apparatus having at least one heat exchanger.[0004]2. Description of Related Art[0005]In a typical server system, multiple servers are densely arranged in a single cabinet. Each of the servers includes at least a power supply device, a motherboard, a central processing unit (CPU), a hard disk drive, and an optical disk drive, and thus considerable heat is generated during operation. Excess heat may cause deterioration in the operational stability of the servers and may damage the servers. Thus, excess heat must be removed qu...

Claims

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Application Information

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IPC IPC(8): F28F9/00
CPCF28F9/00F28F9/001F28F9/007H05K7/20709
Inventor YANG, XU
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD