Non-painting veneer composite board prepared under condition of low temperature and low pressure
A veneer composite board, low temperature and low pressure technology, applied to furniture parts, adhesive types, aldehyde/ketone condensation polymer adhesives, etc., can solve secondary pollution and other problems, achieve smooth and full board surface, and save wood resources and improve the effect of comprehensive utilization
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2011-09-07
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The invention relates to a composite plate. Background technique
[0002] Due to the increasing shortage of wood, the price of pure solid wood is relatively expensive, and the substitutes of pure solid wood wood are gradually filling the market, such as blockboard, blockboard MDF and impregnated film paper veneer wood-based panels. However, each board has its own disadvantages. Among them, when the blockboard is used for decoration, it needs to be sprayed with paint, which is easy to cause indoor air pollution; because the blockboard density board contains density boards in its composition, it is difficult to meet the requirements of interior decoration for water resistance and environmental protection; Adhesive paper-faced wood-based panels have the defects of high density, bulkiness, poor moisture resistance and poor processing performance. In addition, the melamine wood grain paper fixed on the film-coated paper-faced wood-based panels can only be ...
Examples
specific Embodiment approach 1
[0008] Specific implementation mode one: the following combination figure 1 This embodiment will be specifically described. A paint-free decorative composite board made under low temperature and low pressure conditions, which includes a base plate 1, which also includes an upper impregnated melamine wood grain paper layer 6, one side of the base plate 1 and the upper impregnated melamine wood grain paper layer 6 are laminated together Fixing, the above impregnated melamine wood grain paper layer 6 is realized under low temperature and low pressure conditions by using a melamine adhesive for curing and impregnating the impregnated wood grain paper. The processing condition is 1.0Mpa.
[0009] The upper impregnated melamine wood-grain paper layer 6 in this embodiment is realized by impregnating the wood-grain paper with a self-developed low-temperature curing impregnated melamine adhesive. Make the impregnated melamine-impregnated wood grain paper achieve better leveling and c...
specific Embodiment approach 2
[0012] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the substrate 1 is blockboard or plywood.
[0013] The substrate 1 in this embodiment is blockboard or plywood. The blockboard is made of high-quality northeast poplar, and the humidity of the board is kiln-dried to 6-12%, and the board is seamlessly assembled by vertical and horizontal machines. Splicing to improve the firmness and connection strength of the board.
specific Embodiment approach 3
[0014] Specific embodiment three: the difference between this embodiment and specific embodiment one is that the composition of the melamine adhesive for low-temperature curing dipping is formaldehyde, melamine, urea, water, and the mass ratio of the four materials is 6:3 :3:1.