Method for preparing boron-doped diamond film electrode for detecting dopamine
A technology of boron-doped diamond and thin-film electrodes, which is applied in the field of preparation of boron-doped diamond thin-film electrodes, can solve the problems of unfavorable implantation electrodes, shape, size limitation, unfavorable flexibility and sensitivity, etc., and achieve improved sensitivity and repeated detection effects Good, selective effect
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2012-06-27
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the field of diamond film electrodes and biosensors, in particular to a method for preparing a boron-doped diamond film electrode for detecting dopamine. Background technique
[0002] Dopamine (DA for short), as an important catecholamine neurotransmitter in the hypothalamus and pituitary gland, plays an important role in the control and prevention of health and disease. Changes in its content can lead to some diseases such as schizophrenia and Parkinson's disease. In addition, dopamine has the function of exciting the heart and increasing renal blood flow, and can be used to treat hemorrhagic, cardiogenic and septic shock. Therefore, the research on its determination method is of great significance in clinical application and diagnosis of related diseases.
[0003] The traditional methods for detecting dopamine mainly include microdialysis, gas chromatography-mass spectrometry, spectrophotometry, ion chromatography, chemilum...
Examples
Embodiment
[0044] A method for preparing a boron-doped diamond film electrode for detecting dopamine, using a pointed tungsten wire as a substrate, depositing a boron-doped diamond film on the tungsten wire, and aminating the surface of the diamond film, and then depositing a boron-doped diamond film on the boron-doped diamond film The tyrosinase modification layer is directly prepared, and the tungsten wire is connected to the wire through the silver paste. The specific preparation method is as follows.
[0045] 1. Making the tip tungsten wire base structure:
[0046] 1) Grind the 8mm tungsten wire with 800 grit sandpaper until the surface is smooth, and ultrasonically clean it in acetone solution for 5 minutes;
[0047] 2) Place the tungsten wire in the mixed solution of HF acid and concentrated nitric acid (V / V=1:1), place the tungsten wire vertically in the air, avoid contact with the container wall, and keep it for 10 minutes;