Inspection device, installation device and inspection method
An inspection device and image technology, applied in the direction of electrical components, electrical components, etc., can solve the problems of text disappearance, the inability to obtain the brightness difference of the image before loading, etc., and achieve the effect of high-precision inspection
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2020-07-14
Smart Images

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Abstract
Description
technical field
[0001] The present invention relates to an inspection device, a mounting device, and an inspection method for inspecting whether or not a component is mounted on a substrate. Background technique
[0002] As a mounting device, a mounting device including an inspection device for inspecting whether or not a component is mounted on a substrate is known using an imaging device mounted on a mounting head (for example, refer to Patent Document 1). In the inspection device described in Patent Document 1, the mounting surface of the board is photographed before and after the mounting of the parts, and the brightness difference between the pre-mounting image and the post-mounting image is obtained, thereby inspecting whether or not a part is mounted on the board mounting area. . In the inspection using the difference in luminance before and after mounting as described above, the difference in luminance in parts other than the components may have an influence. There...
Examples
Embodiment Construction
[0040] Next, the mounting device according to this embodiment will be described with reference to the drawings. figure 1 It is a schematic diagram which shows the whole mounting apparatus concerning this embodiment. figure 2 It is a schematic diagram which shows the periphery of the mounting head concerning this embodiment. 3 is a diagram showing an example of a pre-mounted image and a post-mounted image of a component according to a comparative example. In addition, the attachment device which concerns on this embodiment is just an example, and can be changed suitably.
[0041] Such as figure 1 As shown, the mounting device 1 is configured to supply parts P supplied from a parts supply unit 20 such as a tape feeder (see figure 2 ), is mounted on the mounting surface of the substrate W by a pair of mounting heads 40 . Wiring patterns, electrode pads, and the like are provided on the surface of the substrate W, and solder paste for bonding to terminals of the component P ...