38results about How to "High precision inspection" patented technology

A biometric identification apparatus that can accurately and rapidly perform liveness detection with a simple structure. [Solution] The apparatus includes a plurality of light sources 102, 103, 106 , and 107 , each having a wavelength different from one another, for emitting light to a finger 200 as an object to be identified, and receivers 104 and 105 for detecting the light passing through the finger. The ratio of the light emitted from the light sources to the light detected with the receivers is obtained as transmittance. Determination in liveness detection is made by comparing the transmittance with a previously-set threshold of transmittance.

Test piece, comprising at least two shaped probe elements and at least one connecting element for connecting the at least two shaped probe elements. Each connecting element is provided with at least one fastening element at one end of the connecting element for fastening a shaped probe element. Length variations of the at least two shaped probe elements and / or of the at least one connecting element are compensated by the fastening elements in such a way that the distance between respective two sensing points under standard measuring conditions is essentially constant.

The invention provides a box-manufacturing device 1 for blank detection in box manufacture process. The box-manufacturing device 1 is provided with a paper supply part 13 and a conveyor part 2 which conveys a blank 4 supplied by the paper supply part 13 to a box-manufacturing part 3; the box-manufacturing device 1 is provided with a blank detection part which comprises a shooting unit 5, a comparison unit 15 and a flaw detection unit, wherein the shooting unit 5 shots the single side or both sides of the blank 4 supplied by the conveyor part 2; the comparison unit 15 compares detecting images shot by the shooting unit 5 with a main image of the blank 4 as a detection object; and the flaw detection unit uses a part above a preset permitted value as a flaw part for detection when a comparison value obtained by the comparison unit 15 is above the preset permitted value.

The invention provides a ceramic body defect inspecting device and a defect inspecting method. Around an image capturing unit which captures images of an inspection target region from a normal line direction thereof, a plurality of unit lights, which are at equiangular intervals from one another, and each of which radiates illuminating light obliquely, with the same radiation angle, toward the inspection target region from a different radiation direction, are successively turned on and off. Each time each of the plurality of unit lights is turned on, the image generating unit captures an imageof the inspection target region, thereby generating a plurality of sets of image-capture data. A determination image generating unit generates minimum brightness image data in which the minimum valueof the brightness at the same pixel position from among the plurality of sets of image-capture data is set as a brightness value at said pixel position, and generates determination image data on thebasis of the minimum brightness image data. A defect determining unit determines the presence or absence of a defect on the basis of the determination image data.

A mura defect inspection apparatus 10 having an illuminating unit 12 which irradiates light onto a photomask 50 having a chip 55 on the surface thereof, the chip is formed with a repeated pattern that a unit pattern is regularly arranged, and a photoreceptor 13 which receives scattered light generated at the edge part of the unit pattern of the repeated pattern on the chip of the photomask and converts it to received light data, wherein the received light data is analyzed to detect a mura defect generated in the repeated pattern, wherein the illuminating unit irradiates light that is emitted from an illumination light source and has a orientation property of the rays almost parallel, the light having a parallelism within an angle of 2°, for example, onto a repeated pattern 51 on the chip 55 of the photomask 50. This application claims foreign priority based on Japanese Patent application No. 2004 - 106462 , filed Mar. 31, 2004 , the contents of which is incorporated herein by reference in its entirety.

This substrate inspection apparatus includes: a floating stage which allows a substrate to float; an observation device which observes an upper surface of the substrate transported on the floating stage; a transmission luminous source which illuminates the lower surface of the substrate with illuminating light; an illuminating light passing portion formed at the floating stage, and formed by a gap through which the illumination light passes; and a transmission member through which the illumination light is transmitted, inserted in the illuminating light passing portion.

An irregular flaw inspection method and system, and a fabricating method of a photomask are provided. The subject of the invention is to provide an irregular flaw inspection method capable of efficiently inspect an irregular flaw with high precision. In the irregular flaw inspection method for inspecting the irregular flaw produced in the repeating pattern of a photomask (50) having the repeating pattern wherein a large number of unit patterns are arranged regularly, a region having the repeating pattern becoming the inspection target of the irregular flaw is designated as an inspection area from the whole image of the photomask taken by the imaging camera (21) of a pattern data acquiring device (20) and the pattern data of the repeating pattern is acquired from the image, which is taken by a microscope (22), of the repeating pattern in the inspection area. The inspection condition of the irregular flaw due to an irregular flaw inspection device (10) is determined on the basis of the pattern data and the inspection of the irregular flaw is performed on the basis of the inspection condition by the irregular flaw inspection device.

Test piece, comprising at least two shaped probe elements and at least one connecting element for connecting the at least two shaped probe elements. Each connecting element is provided with at least one fastening element at one end of the connecting element for fastening a shaped probe element. Length variations of the at least two shaped probe elements and / or of the at least one connecting element are compensated by the fastening elements in such a way that the distance between respective two sensing points under standard measuring conditions is essentially constant.

A test method for a liquid crystal display panel in which the pixels providing liquid crystal elements having sealed in liquid crystal material are arranged in a matrix between opposing electrodes is comprised of a charging process for supplying charge to the above-mentioned liquid crystal element of a pixel under test, a measurement process for discharging the charge from the above-mentioned charged liquid crystal element and measuring the amount of charge discharged, and a decision process for determining whether defects are present in the liquid crystal element of the above-mentioned pixel under test from the above-mentioned measurement results.

An object of the present invention is to inspect a gas supply system with high accuracy. The method related to one aspect of the present invention includes: a first step of connecting the reference device to the other end of the connecting pipe; a second step of supplying gas from a flow controller to the pipe; a third step of closing a first After the valve, obtain the measured values ​​of the first pressure detector and the first temperature detector; in the fourth step, open the third valve and supply part of the gas in the piping to the storage tank; in the fifth step, obtain the first pressure measurement The measured value of the detector and the first temperature detector or the measured value of the second pressure detector and the second temperature detector; the sixth step uses Boyle-Charlie's law, and based on the measured value obtained in the third step, The volume of the piping is calculated from the measured value obtained in the fifth step and the volume of the closed space including the space in the storage tank when the third valve is closed.

The invention provides a quality control method for solder a joint portion, enabling highly accurate quality inspection in a non-damaged manner at a real time bases without an extra inspection process. The quality control method for a joint portion formed when solder and partial heat energy are supplied to a resin substrate, includes measuring temperature of the joint portion varying with time during jointing process, calculating a plurality of characteristic values based on the measured values, obtaining a single value index based on the plurality of characteristic values, and determining whether the joint portion is qualified or not by comparing the value index with the predetermined threshold, wherein the characteristic values includes time t1 indicating the time when the temperature of the joint portion is higher or equal to the predetermined time T1 which satisfied the conditions of (substrate vitrification temperature- 50 DEG C) <= T1<= (substrate vitrification temperature+250 DEG C), and time t2 indicating the time from utilizing heat energy to the temperature of the joint portion reaching the predetermined time T2 which satisfied the conditions of (substrate vitrification temperature-50 DEG C) <= T2<= (substrate vitrification temperature+250 DEG C).

PROBLEM TO BE SOLVED: To provide a high frequency equipment which has an inexpensive circuit board and can be reliably inspected. SOLUTION: In the high frequency equipment, the extension 2b of a circuit board 2 is provided with a mount hole 2c for receiving the projection 1d of a frame 1 thereinto and mounting the circuit board 2 thereto, and with a positioning hole 2d capable of receiving a guide rod 8 therein. Thus, when the device after being assembled is inspected, a probe 9 can be positioned with use of the positioning hole 2d having a wiring pattern 3 provided thereto as a reference, the position of the probe 9 relative to the wiring pattern 3 can be made accurate, and the device can be reliably inspected. Further, upon manufacturing the circuit board, the positioning hole 2d provided in the extension 2b of the circuit board 2 can be used also as a feed hole, a strip-shaped substrate 10 for use in manufacture of the circuit board 2 can be made small, and therefore an expensive circuit board can be obtained. COPYRIGHT: (C)2006,JPO&NCIPI

A liquid feeding system (2, 2') is provided with a plurality of liquid feeding pumps (14A, 14B) which operate independently of each other and feed a liquid as a mobile phase through a common flow channel (12); pressure sensors (16A, 16B) for detecting the pressure of the liquid being fed in the flow channel (12); and a liquid feeding failure detection unit (20, 28) that is configured to cyclically obtain the pressure of the liquid being fed, detected by the pressure sensors (16A, 16B), and to detect, through detection of variation in the pressure of the liquid being fed in relation to the respective drive cycles of the plurality of liquid feeding pumps (14A, 14B), failure in liquid feeding by either of the plurality of liquid feeding pumps (14A, 14B).

Whether a component is mounted on a substrate is inspected with high precision by simple processing. An inspection apparatus (60) inspects whether the component is mounted based on a pre-mounting image and a post-mounting image of the component taken before and after the component is mounted on a mounting surface of the substrate. The inspection device comprises a threshold setting section (62) for setting a threshold capable of recognizing the substrate according to the brightness value of the pre-mounting image; and a mask image generating section (63) for generating a mask image masking other than the substrate from the pre-mounting image according to the threshold. The specific areas corresponding to the mounting surface of the substrate of the pre-mounting image and the post-mounting image are compared with each other by employing the mask image, thereby inspecting whether the component is mounted or not.

An inspection method for an examination system configured to image an object and make a good / defective determination of the object on the basis of an image acquired by the imaging comprises displaying a sample image of the object, imaging the displayed sample image by a camera, and making a good / defective determination of the object indicated by the sample image on the basis of the image acquired by imaging of the camera.

The invention provides an ultrasonic inspection device which can accurately inspect the end part of an object to be inspected with less effort. The ultrasonic inspection device is an ultrasonic inspection device in which an object to be inspected is disposed between a transmission unit and a reception unit which are disposed at a distance from each other, and the reception unit receives ultrasonicwaves transmitted from the transmission unit to inspect the object to be inspected. The ultrasonic inspection device comprises a restricting unit that restricts a second propagation path different from a first propagation path of the ultrasonic wave that has passed through the object to be inspected and arrived at the receiving unit, from among propagation paths of the ultrasonic wave that has passed through the transmission unit and arrived at the receiving unit.

Provided is a preload inspection method for a wheel bearing device enabling more accurate checking of preload. The invention comprises: a press-fitting step (S02) for press-fitting an inner ring (4) to a small-diameter stepped part (3a); a first bearing preload value calculation step (S03) for calculating a first bearing preload value (P1) on the basis of a first axial direction negative clearance (G1); a first rotating torque measurement step (S05) for measuring a first rotating torque Ta after the press-fitting step; a swaging step (S06) for swaging the small-diameter stepped part to the inner ring after the first rotating torque measurement step; a second bearing preload value calculation step (S07) for calculating a second bearing preload value (P2) on the basis of a second axial direction negative clearance (G2); a second rotating torque measurement step (S08) for measuring a second rotating torque Tb after the swaging step; a third bearing preload value calculation step (S09) for calculating a third bearing preload value (P3) by adding, to the first bearing preload value, a preload change amount (Delta P) based on a differential torque (Delta T) between the first rotating torque and the second rotating torque; and a determination step (S10) for determining the suitability of the preload from the second bearing preload value and the third bearing preload value.

To provide a wafer inspection device which can realize an efficient configuration for suppressing an increase in footprint and can inspect a wafer with high accuracy.The wafer inspection device has a cassette part 2 and a wafer inspection part 3 including a microscope 6 and an XY stage 7 for moving the wafer 10. The cassette part 2 comprises a cassette 4 for holding the wafer 10 and an elevator 5. The wafer inspection part 3 comprises a carrying arm 18 that is arranged on the XY stage 7 to insert / extract the wafer 10 by arm pieces 181, 182 which can linearly move toward an opening of the cassette 4 and can be inserted between wafers 10 in the cassette 4, and a wafer rotary mounting base 22 which is vertically movable above the XY stage 7 to carry-in / carry-out the wafer to the carrying arm 18 by the vertical movement, a centering means for making the center of the wafer 10 and the rotary center of the wafer rotary mounting base 22 coincide with each other, and a detecting means for detecting the orientation of the wafer. (C)2004,JPO.