34results about How to "High precision inspection" patented technology

To provide a wafer inspection device which can realize an efficient configuration for suppressing an increase in footprint and can inspect a wafer with high accuracy.The wafer inspection device has a cassette part 2 and a wafer inspection part 3 including a microscope 6 and an XY stage 7 for moving the wafer 10. The cassette part 2 comprises a cassette 4 for holding the wafer 10 and an elevator 5. The wafer inspection part 3 comprises a carrying arm 18 that is arranged on the XY stage 7 to insert/extract the wafer 10 by arm pieces 181, 182 which can linearly move toward an opening of the cassette 4 and can be inserted between wafers 10 in the cassette 4, and a wafer rotary mounting base 22 which is vertically movable above the XY stage 7 to carry-in/carry-out the wafer to the carrying arm 18 by the vertical movement, a centering means for making the center of the wafer 10 and the rotary center of the wafer rotary mounting base 22 coincide with each other, and a detecting means for detecting the orientation of the wafer. (C)2004,JPO.

The invention provides a detecting method and a detecting device, which can remove the influences of back reflected image and detect the characteristics of surface shape with a high precision by a cheap device structure. The detecting method comprises the steps that: firstly, stripes applicable for a transparent plate-shaped body (3) (a detected object) are determined to be set in a separating manner in image signals which are acquired by photographing reflected images formed on the surface of the transparent plate-shaped body and the reflected images formed on the back surface of the transparent plate-shaped body; then, the determined stripes (1) are used, and the surface shape of the transparent plate-shaped body (3) is evaluated through image analysis only by the reflected images, which are formed on the surface of the transparent plate-shaped body (3), of the stripes (1).

The invention provides a box-manufacturing device 1 for blank detection in box manufacture process. The box-manufacturing device 1 is provided with a paper supply part 13 and a conveyor part 2 which conveys a blank 4 supplied by the paper supply part 13 to a box-manufacturing part 3; the box-manufacturing device 1 is provided with a blank detection part which comprises a shooting unit 5, a comparison unit 15 and a flaw detection unit, wherein the shooting unit 5 shots the single side or both sides of the blank 4 supplied by the conveyor part 2; the comparison unit 15 compares detecting images shot by the shooting unit 5 with a main image of the blank 4 as a detection object; and the flaw detection unit uses a part above a preset permitted value as a flaw part for detection when a comparison value obtained by the comparison unit 15 is above the preset permitted value.

A glass substrate defect inspecting device and an inspection method thereof are provided to reduce or remove bouncing phenomenon and steadily perform an inspection by reducing the corrected amount during the inspection. A glass substrate (100) comprises a lifting device, a transfer device, and an optical inspection device. The lifting device lifts up a glass substrate(P) using air. The transfer device transfers the glass substrate to an inspection area where the lifting device is absent. The optical inspection device takes a picture of the glass substrate, thereby performing an inspection. A glass substrate defect inspecting device comprises a reduction device. The reduction device reduces the displacement caused by the bouncing of an end part of the glass substrate toward a transferring direction.

This substrate inspection apparatus includes: a floating stage which allows a substrate to float; an observation device which observes an upper surface of the substrate transported on the floating stage; a transmission luminous source which illuminates the lower surface of the substrate with illuminating light; an illuminating light passing portion formed at the floating stage, and formed by a gap through which the illumination light passes; and a transmission member through which the illumination light is transmitted, inserted in the illuminating light passing portion.

Test piece, comprising at least two shaped probe elements and at least one connecting element for connecting the at least two shaped probe elements. Each connecting element is provided with at least one fastening element at one end of the connecting element for fastening a shaped probe element. Length variations of the at least two shaped probe elements and/or of the at least one connecting element are compensated by the fastening elements in such a way that the distance between respective two sensing points under standard measuring conditions is essentially constant.

The present invention provides a color blur inspection method and the apparatus thereof, which could inspect the existence and level of color blur in high precision without the influence by personal difference and status difference of individual. The present invention could eliminate the Mohr's stripes, adjust the focus of focusing optical system 34, employ a video camera device 35 to capture the substrate 31, and inspect the existence and level of color blur according to the photo data.

An industrial robot which works in a clean room can measure the amount of particles of dust and the like in the clean room with high precision and immediate. A light-scattering type particle counter measures the amount of particles in the clean room. The particle counter is provided on a hand portion of the industrial robot and a counter inlet is arranged on the tip of the hand portion. A laser beam used in the particle counter is formed a belt-shaped.

The invention provides an image processing device, a foreign object inspection device, an image processing method and a foreign object inspection method. The image processing device is capable of high-accuracy foreign object inspection. The image processing device include a background value setting section configured to (i) obtain a value for use as a background value on a basis of a first pixel value of at least one reference pixel present in the vicinity of a target pixel and having a predetermined positional relationship with the target pixel, and (ii) set the background value of the targetpixel to the value obtained.