Chip check apparatus

Abstract

To provide a wafer inspection device which can realize an efficient configuration for suppressing an increase in footprint and can inspect a wafer with high accuracy.The wafer inspection device has a cassette part 2 and a wafer inspection part 3 including a microscope 6 and an XY stage 7 for moving the wafer 10. The cassette part 2 comprises a cassette 4 for holding the wafer 10 and an elevator 5. The wafer inspection part 3 comprises a carrying arm 18 that is arranged on the XY stage 7 to insert / extract the wafer 10 by arm pieces 181, 182 which can linearly move toward an opening of the cassette 4 and can be inserted between wafers 10 in the cassette 4, and a wafer rotary mounting base 22 which is vertically movable above the XY stage 7 to carry-in / carry-out the wafer to the carrying arm 18 by the vertical movement, a centering means for making the center of the wafer 10 and the rotary center of the wafer rotary mounting base 22 coincide with each other, and a detecting means for detecting the orientation of the wafer. (C)2004,JPO.

Description

Technical field [0001] The present invention relates to wafer inspection equipment used for appearance inspection and film thickness inspection of semiconductor wafers. Background technique [0002] In the past, wafer inspection equipment used for appearance inspection, film thickness inspection, or defect inspection of semiconductor wafers, etc., mostly used the following structures, including: a microscope with an XY stage, a transfer robot for transferring wafers, and The cassette stage of the wafer cassette is composed of a combination thereof. [0003] This kind of wafer inspection equipment basically consists of a microscope, a transfer robot and a cassette stage each constitute an independent unit, and these units are combined to form a system, which can obtain a good configuration of freely configuring each unit and selecting models. effect. [0004] figure 1 This is a diagram showing the first past example (see Japanese Patent Application Laid-Open No. 6-229934). figur...

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Problems solved by technology

[0019] But, the inspection equipment of Japanese Unexamined Publication No. 6-229934 utilizes the concave-shaped transfer arm 102 to take out the wafer from the film cassette 104, and the convex-shaped repositioning platform 103 is raised, and after receiving the wafer from the concave-shaped transfer arm 102, the microscopic inspection is carried out. The stage 106 moves to get the wafer, so a swing stage for macroscopic inspection cannot be set between the cassette 104 and the stage 106 for microscope inspection.

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