A porcelain plate and manufacturing method for producing refrigeration parts
By using a copper plate layer and a copper oxide layer on the ceramic plate of the semiconductor refrigeration part, combined with organic bonding glue and oil degreasing agent treatment, the problem of insufficient performance of the ceramic plate metal layer in the prior art is solved, and high electrical insulation is achieved , excellent thermal conductivity and strength enhancement effect.
Patent Information
- Application Number
- CN201910545988.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2019-06-23
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2039-06-23
AI Technical Summary
The ceramic plates used in existing semiconductor refrigeration parts have poor electrical insulation performance, poor thermal conductivity, poor soldering properties and low strength, which affect their use effect, and the specifications of the metal layer do not meet the requirements, resulting in poor product quality.
The copper plate layer is used as the metal layer of the porcelain plate. Each copper plate is bonded to the welded grains on the porcelain plate. The copper oxide layer is formed on the outer periphery and the surface of the copper plate, with a thickness of 0.1 to 1 microns. The outline of the copper plate is larger than the grains and the surface is smooth. Planar structure and treated with organic bonding glue and oil degreaser solution to improve bonding strength.
The electrical insulation performance, thermal conductivity, soldering performance and strength of semiconductor refrigeration parts are improved, ensuring the improvement of product quality and refrigeration effect.
Smart Images
Figure CN110246819B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of semiconductor refrigeration component raw materials, in particular to a porcelain plate used for semiconductor production refrigeration components and a method for manufacturing the porcelain plate. Background Art
[0002] The semiconductor refrigeration component includes a porcelain plate and semiconductor grains welded on the porcelain plate. The main function of the refrigeration component is to be used for semiconductor refrigeration, temperature difference power generation, etc. The semiconductor grains are welded on the porcelain plate. The porcelain plate is a thin sheet structure product made of porcelain sheets. The porcelain plate plays the role of electrical insulation, heat conduction and support. The porcelain plate has a metal layer, and the grains are welded on the metal layer of the porcelain plate by tin. The main component of the grains is dibismuth tritelluride, which is the main functional component of the refrigeration component.
[0003] In the prior art, the ceramic plate used has a metal layer, and its metal layer is generally an alloy layer. The refrigeration parts made of such ceramic plates have the disadvantages of poor electrical insulation, poor thermal conductivity, poor solderability, low strength, etc., which affect its use effect.
[0004] In addition, the metal layer on the ceramic plate in the prior art is also formed by sintering the ceramic plate together with the ceramic plate body. The specifications of the metal layer formed by this method of forming the ceramic plate often do not meet the requirements, and semiconductor refrigeration parts with high precision, better product quality and better cooling effect cannot be produced. Summary of the invention
[0005] The object of the present invention is to provide a porcelain plate and a manufacturing method for producing refrigeration parts with good electrical insulation performance, high thermal conductivity, excellent soft soldering and high strength for use in refrigeration parts in view of the above-mentioned disadvantages.
[0006] The technical solution of the present invention for producing a porcelain plate for a refrigeration part is achieved as follows: a porcelain plate for producing a refrigeration part comprises a porcelain plate body, wherein the porcelain plate body is a thin sheet-type structure product made of porcelain sheets, and the porcelain plate has a metal layer, characterized in that the metal layer is a copper plate layer, and the copper plate layer is composed of a plurality of copper plates, each copper plate is bonded to the area below the grain to be welded, and the porcelain plates around each copper plate are exposed.
[0007] Furthermore, the outer periphery, upper surface and lower surface of the copper plate also have a cuprous oxide layer.
[0008] Furthermore, the thickness of the cuprous oxide layer is 0.1 to 1 micrometer.
[0009] Furthermore, the outline of each copper plate is larger than the grains to be welded.
[0010] Furthermore, the surface of the copper plate has a smooth planar structure.
[0011] Furthermore, it also includes a crystal grain welded on the copper plate, wherein the periphery of the crystal grain is outside the periphery of the copper plate.
[0012] The technical solution of the method for producing a porcelain plate for a refrigeration part of the present invention is achieved as follows: the method for producing a porcelain plate for a refrigeration part is to place the porcelain plate in a roller kiln for firing, and the porcelain plate and the copper plate are used, and the porcelain plate is a product of a thin sheet structure, which comprises the following steps:
[0013] a. Apply organic adhesive to the position on the porcelain plate where the copper plate is to be sintered;
[0014] b. Bond the copper plate to the above adhesive;
[0015] c. The porcelain plates are placed in a roller kiln and fired.
[0016] Furthermore, the outer periphery, upper surface and lower surface of the copper plate also have an oxide layer.
[0017] Furthermore, the ceramic plate has a soaking process before the above step a, and the soaking process is a process of placing the ceramic plate in a degreasing agent solution for 12-24 hours at a temperature of 50-60°C.
[0018] Furthermore, the degreasing agent solution contains 5-10% glycerin and 5-10% copper powder, and the copper powder is copper powder with a size smaller than 100 meshes.
[0019] The beneficial effects of the present invention are:
[0020] Such a ceramic plate installed on a semiconductor refrigeration unit has the advantages of good electrical insulation performance, high thermal conductivity, excellent soldering and high strength of the refrigeration unit;
[0021] Such a manufacturing method can produce the above-mentioned porcelain panels with better quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 It is a structural schematic diagram of the porcelain plate of the present invention.
[0023] Figure 2 yes Figure 1 Schematic diagram of the cross section along the A-A direction.
[0024] Figure 3 is a schematic diagram of the longitudinal section of the copper plate (i.e. Figure 2 Schematic diagram of the cross section of the copper plate in the B-B direction).
[0025] Figure 4 It is a schematic diagram of the structure of the present invention when the grains are welded.
[0026] Among them: 1. Porcelain plate body 2. Copper plate 3. Exposed area of porcelain plate 4. Cuprous oxide layer 5. Smooth plane 6. Crystal grains. DETAILED DESCRIPTION
[0027] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0028] like Figure 1 , 2 As shown in Figure 3, a ceramic plate used for producing refrigeration parts includes a ceramic plate body 1, wherein the ceramic plate body is a thin-sheet structure product made of ceramic sheets, and the ceramic plate has a metal layer, which is characterized in that the metal layer is a copper plate layer, and the copper plate layer is composed of multiple copper plates 2, each copper plate is bonded to the area below the grain to be welded, and the ceramic plates around each copper plate are exposed. Figure 3 is the exposed area of the ceramic plate.
[0029] The ceramic plate used in the prior art semiconductor cooling parts has an alloy layer on it, and the manufactured semiconductor cooling parts are crystal grains directly welded on the alloy layer, which has the disadvantage of weak bonding strength between the crystal grains and the ceramic plate; the ceramic plate used in the present invention has a copper plate layer on it, and when producing the semiconductor cooling parts, the crystal grains are welded on the copper plate layer, and the manufactured semiconductor cooling parts have the advantages of strong bearing capacity, high thermal conductivity and excellent soft soldering.
[0030] The method for testing its bearing capacity is: set (weld) a hanging nose on the crystal grain of the manufactured semiconductor refrigeration component, fix the bottom of the ceramic plate of the semiconductor refrigeration component (the side not connected to the crystal grain), hook the hanging nose with a dynamometer, apply force to the dynamometer from small to large, until the crystal grain just falls off the copper plate (metal layer), record the value of the dynamometer when the crystal grain falls off, and the test result is: the semiconductor refrigeration component whose metal layer on the ceramic plate is a copper plate layer has a higher bearing strength, that is to say, the semiconductor refrigeration component produced by the ceramic plate with a copper plate layer on the ceramic plate has a stronger bearing capacity.
[0031] The method used to test its thermal conductivity is to test the cooling and heating efficiency of semiconductor cooling parts of the same specifications under the same current and the same time. The test results show that the cooling and heating efficiency of semiconductor cooling parts with copper plates on the porcelain plate (and the porcelain plates around each copper plate are bare) is higher.
[0032] The method used to test its soldering performance is to detect the open soldering and the difficulty of soldering under the same conditions. The test results show that the semiconductor refrigeration parts with copper plates on the porcelain plates have higher cooling and heating efficiency.
[0033] Therefore, since the outer metal layer of this porcelain plate is a copper plate, it has the advantages of strong bearing capacity, high thermal conductivity and excellent soft soldering. In addition, it does not cover the entire outside of the porcelain plate, and has the advantage of good electrical insulation performance, which can meet the requirements of producing high-quality semiconductor refrigeration parts.
[0034] Furthermore, a cuprous oxide layer 4 is formed on the outer periphery, upper surface and lower surface of the copper plate 2 .
[0035] In this way, the grains are bonded to the refrigeration part more firmly, and the bearing capacity is stronger, the thermal conductivity is higher, and the soft soldering performance is more excellent.
[0036] Furthermore, the thickness of the cuprous oxide layer is 0.1 to 1 micrometer, which does not affect the use effect of the refrigeration component and has the advantage of more firm grain bonding.
[0037] Furthermore, the outline of each copper plate 2 is larger than the crystal grains to be welded, thus ensuring that the crystal grains exert a better cooling effect.
[0038] Furthermore, the surface of the copper plate is a smooth plane 5. In this way, the connection between the copper plate and the porcelain plate is more secure, and the connection between the crystal grain and the copper plate is more secure.
[0039] Further speaking, if Figure 4 Shown in Figure 2, it also comprises the crystal grain 6 that is welded on the copper plate, and described crystal grain is around the inside around the copper plate. So just become whole refrigeration part, need not next step production.
[0040] Example 1
[0041] A method for manufacturing a porcelain plate for a refrigeration component, wherein the porcelain plate is placed in a roller kiln and fired, and the porcelain plate and the copper plate are used. The porcelain plate is a product of a thin sheet structure, and the method comprises the following steps:
[0042] a. Apply organic adhesive to the position on the porcelain plate where the copper plate is to be sintered;
[0043] b. bonding the copper plate to the organic adhesive;
[0044] c. The porcelain plates are placed in a roller kiln and fired.
[0045] The manufacturing method of the present invention uses an organic adhesive which can achieve good fixing of the copper plate on the porcelain plate in the early stage of sintering. The main component of the organic adhesive is organic matter, most of which volatilizes during the heating process, leaving almost no residual ash, and does not affect the strength of the copper plate sintered on the porcelain plate. The organic adhesive used can be commonly used glue, paste, etc.
[0046] Use this porcelain plate, copper plate and crystal grain for testing: fix the porcelain plate and copper plate, set a hanging nose on the crystal grain, hook the hanging nose with a dynamometer, apply force to the dynamometer from small to large until the crystal grain just falls off the copper plate, and record the value of the dynamometer at this moment, which is 50N.
[0047] Example 2
[0048] The experiment in the above-mentioned embodiment 1 is repeated, and a cuprous oxide layer is further formed on the copper plate used. Such cuprous oxide layer can be formed by the copper plate itself in a high temperature and high oxygen environment.
[0049] When using such ceramic plates to produce semiconductor cooling parts, the grains have higher bearing strength. Under other equal conditions, the bearing capacity between the copper plate and the grains and between the copper plate and the ceramic plate is 1.3 to 1.5 times that of those without an oxide layer, and the cooling effect can also be increased by 1.2 to 1.3 times.
[0050] Using the above test method, record the value of the dynamometer at this moment, which is 62N.
[0051] Example 3
[0052] The experiments in Examples 1 and 2 above were repeated.
[0053] The ceramic plate is further subjected to a soaking process before the above step a, wherein the soaking process is to soak the ceramic plate in a 20% degreasing agent, wherein the degreasing agent is a degreasing agent used in daily life, such as alkali solution, detergent, etc. The soaking time is 12 to 24 hours, and the temperature is 50 to 60°C.
[0054] The ceramic plates produced by this method are used to produce semiconductor refrigeration parts, and the grains have higher bearing strength. Under the same conditions, the bearing capacity between the copper plate and the grains and between the copper plate and the ceramic plate is 1.1 to 1.2 times that of those without an oxide layer.
[0055] Example 4
[0056] The experiments in Examples 1 and 2 above were repeated.
[0057] The degreasing agent contains 5-10% glycerol (by weight) and 5-10% copper powder, wherein the copper powder is copper powder with a size smaller than 100 meshes.
[0058] The ceramic plates produced by this method are used to produce semiconductor refrigeration parts, and the grain bearing strength is higher. Under other same conditions, the copper plates used are 1.1 to 1.2 times that of the copper plates without oxide layer.
Claims
1. A method for producing a porcelain plate for a refrigeration component, wherein the porcelain plate is placed in a roller kiln and fired, and the porcelain plate and the copper plate are used. The porcelain plate is a product of a thin sheet structure, and the method comprises the following steps: a. Apply organic adhesive to the position of the porcelain plate where the copper plate is to be sintered; b. Bond the copper plate to the above adhesive; c. The porcelain plate is placed in a roller kiln for firing; The ceramic plate has a soaking process before the above step a, wherein the soaking process is to soak the ceramic plate in a degreasing agent solution for 12-24 hours at a temperature of 50-60°C; The degreasing agent solution also contains 5-10% glycerin and 5-10% copper powder, and the copper powder is copper powder with a size smaller than 100 meshes.
2. The manufacturing method according to claim 1, wherein the outer periphery, upper surface and lower surface of the copper plate further have a cuprous oxide layer.