A sensor internal wiring structure, a data center multi-point temperature measurement system and a sensor address modification method
By designing uplink and downlink communication conversion circuits and address modification methods inside the sensor in the temperature monitoring system, the problem of large workload of sensor connection and address modification is solved, and the series transmission of information between sensors and address modification is achieved.
Patent Information
- Application Number
- CN201910775540.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2019-08-21
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2039-08-21
AI Technical Summary
In the existing temperature monitoring system, each temperature sensor or probe needs to connect the power cord and signal cord, and the default communication address needs to be modified, resulting in a large workload.
A sensor internal wiring structure is designed, including uplink and downlink communication conversion circuits, through which series communication between sensors is realized, and a sensor address modification method is provided, and a computer transmits address information for gradual transmission, reducing address modification workload.
The information transmission between sensors is realized, the wiring process is simplified, and the address modification of all sensors is completed through one address change command, which significantly reduces the workload.
Smart Images

Figure CN110413556B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of temperature monitoring, and in particular to a sensor internal wiring structure, a data center multi-point temperature measurement system and a sensor address modification method. Background Art
[0002] At present, with the development of network technology and digital technology, enterprise data centers are becoming more and more common. It is estimated that the scale of my country's data center market will exceed 150 billion yuan in 2020. The power environment monitoring system for enterprise data center management plays an important role in the innovative construction, low-cost operation and maintenance of enterprise data centers.
[0003] Temperature monitoring and temperature cloud field are the basic functional requirements of dynamic environment monitoring. Current temperature monitoring mainly uses single-point temperature sensors, and each measuring point needs to be wired and connected.
[0004] The above-mentioned prior art solutions have the following defects: each temperature sensor or temperature probe needs to be connected to a power line and a signal line, and each temperature sensor and probe needs to modify the default communication address at the factory, resulting in a large workload. Summary of the invention
[0005] In view of the deficiencies in the prior art, the present invention provides a sensor internal wiring structure, a data center multi-point temperature measurement system and a sensor address modification method, which have the advantage of reducing workload.
[0006] To achieve the above object, the present invention provides the following technical solution: a sensor internal wiring structure, comprising:
[0007] Uplink debugging port, used to connect to a computer or the previous sensor and receive signals transmitted by the computer or sensor;
[0008] An uplink communication conversion circuit is electrically connected to the uplink debugging port and is used to receive signals transmitted by the uplink debugging port and perform signal conversion;
[0009] An uplink communication isolation circuit is electrically connected to the uplink communication conversion circuit, and is used to receive and output the signal output by the uplink communication conversion circuit, and isolate external interference signals;
[0010] An uplink communication output interface, electrically connected to the uplink communication isolation circuit, for outputting the converted signal to the CPU of the sensor;
[0011] A downlink communication isolation circuit is electrically connected to the CPU of the sensor, and is used to receive and output the signal output by the CPU of the sensor, and isolate external interference signals;
[0012] A downlink communication conversion circuit is electrically connected to the downlink communication isolation circuit and is used for converting the signal transmitted by the downlink communication isolation circuit;
[0013] The downlink output port is electrically connected to the downlink communication conversion circuit and is used to transmit the signal output by the downlink communication conversion circuit to the next sensor.
[0014] By adopting the above technical solution, when the address of the sensor is changed, the sensor connected to the computer receives the address information transmitted by the computer through the uplink debugging port. After receiving the address information, the uplink debugging port converts the address information through the uplink communication conversion circuit, so that the CPU of the sensor can process it. Then the uplink isolation circuit transmits the information to the uplink communication output interface. The uplink communication output interface transmits the information to the CPU of the sensor. The CPU of the sensor processes the information and then transmits it to the downlink communication isolation circuit. The downlink communication isolation circuit transmits the information to the downlink communication conversion circuit, converts it into a bus signal, and then transmits it to the next sensor through the downlink output port, thereby realizing the serial transmission of multiple sensors.
[0015] The present invention is further configured as follows: the uplink communication conversion circuit and the downlink communication conversion circuit are both 485 conversion circuits or CAN conversion circuits.
[0016] By adopting the above technical solution, both the 485 bus and the CAN bus can perform signal conversion through the uplink communication conversion circuit and the downlink communication conversion circuit, thereby enhancing adaptability.
[0017] To achieve the above object, the present invention provides the following technical solution: a multi-point temperature measurement system for a data center, comprising:
[0018] Infrared multi-point temperature sensor, used to obtain temperature information at multiple points in the data center;
[0019] A data collector, used to collect temperature information transmitted by an infrared multi-point temperature sensor;
[0020] Network switches, used to increase connection ports;
[0021] The main environment control server is used to receive externally transmitted data and perform processing and control;
[0022] Management terminal, used to obtain data transmitted by the environmental control main server and configure parameters;
[0023] The infrared multi-point temperature measurement sensor internally adopts the sensor internal wiring structure described in any one of claims 1 to 2.
[0024] By adopting the above technical solution, the infrared multi-point temperature sensor obtains the temperature information of multiple points in the data center and transmits the temperature information to the data collector. The data collector summarizes the temperature information and transmits it to the environmental control main server through the network switch. The environmental control main server processes the temperature information and generates the temperature cloud field information of the data center. The management terminal receives the temperature cloud field information and displays it, thereby realizing real-time monitoring of the temperature conditions of the data center.
[0025] The present invention is further configured as follows: the infrared multi-point temperature measuring sensor is configured as one or more than one infrared multi-point temperature measuring sensors, and the infrared multi-point temperature measuring sensors are connected in series.
[0026] By adopting the above technical solution, one or more temperature sensors are set according to the scale of the data center, which can provide more accurate feedback on the temperature of the data center. The infrared multi-point temperature sensors are connected in series, which reduces the lines and makes the wiring simpler.
[0027] The present invention is further configured as follows: the number of the data collector is one or more, and the data collector is electrically connected to one or more infrared multi-point temperature measurement sensors.
[0028] By adopting the above technical solution, the data collector can be set to one or more according to the number of infrared multi-point temperature measurement sensors. The data collector can be electrically connected to one or more infrared multi-point temperature measurement sensors, so that the wiring is more arbitrary and can be selected according to needs, which facilitates wiring construction.
[0029] The present invention is further configured such that: the infrared multi-point temperature measurement sensor adopts non-contact temperature measurement.
[0030] By adopting the above technical solution, since many high-voltage situations do not allow sensors to get close, non-contact temperature measurement can monitor the temperature of high-voltage cabinets, large transformers and other equipment, expanding the scope of application.
[0031] To achieve the above object, the present invention provides the following technical solution: a sensor address modification method, comprising:
[0032] The sensor at the front of the list obtains the address change command transmitted by the computer;
[0033] The sensor at the front of the list changes its address according to the address information in the address change command;
[0034] After the change is completed, the sensor at the front of the list modifies the address information in the address change command and transmits it to the following sensors;
[0035] The following sensor modifies the address according to the change address command transmitted by the previous sensor.
[0036] By adopting the above technical scheme, the sensor at the front of the list obtains the address change command transmitted by the computer, and makes changes according to the address information in the address change command. After the sensor at the front of the list completes the address change, the address in the address change command is changed and transmitted to the next sensor whose address needs to be modified. The subsequent sensors receive the address change command output by the previous sensors and pass them on in sequence, thereby completing the address modification of all sensors. The entire process only requires outputting the address change command once, reducing the workload of address modification.
[0037] The present invention is further configured as follows: the specific method for changing the address is to accumulate a numerical value on the original address information, and the accumulated numerical value is greater than or equal to 1 and is a positive integer.
[0038] By adopting the above technical solution, the address is modified in an accumulation manner, which makes it more convenient to make the addresses of different sensors different, thereby reducing the workload of address modification.
[0039] In summary, the present invention has the following beneficial effects:
[0040] 1. By setting up an uplink communication conversion circuit and a downlink communication conversion circuit, the communication between the bus and the CPU is realized, so that the information between the sensors can be transmitted in series without errors, so that the addresses of all sensors can be changed through one address change instruction, reducing the workload;
[0041] 2. By setting up infrared multi-point temperature sensors, the infrared multi-point temperature sensors can collect temperature at multiple points in the data center. One infrared multi-point temperature sensor is equivalent to multiple temperature sensors, which makes wiring and construction simpler and reduces workload. BRIEF DESCRIPTION OF THE DRAWINGS
[0042] Figure 1 This is the internal wiring structure diagram of the sensor;
[0043] Figure 2 This is a diagram of the multi-point temperature measurement system in the data center;
[0044] Figure 3 Step-by-step diagram of how to modify the sensor address.
[0045] Figure numerals: 10, uplink debugging port; 11, uplink communication conversion circuit; 12, uplink communication isolation circuit; 13, uplink communication output interface; 14, downlink communication isolation circuit; 15, downlink communication conversion circuit; 16, downlink output port; 20, infrared multi-point temperature sensor; 21, data collector; 22, network switch; 23, environmental control main server; 24, management terminal. DETAILED DESCRIPTION
[0046] The present invention is further described in detail below in conjunction with the accompanying drawings.
[0047] Reference Figure 1 , is a sensor internal wiring structure disclosed in the present invention, including an uplink debugging port 10, the uplink debugging port 10 is electrically connected to a computer or a previous sensor, the uplink debugging port 10 is electrically connected to an uplink communication conversion circuit 11, the uplink communication conversion circuit 11 is a 485 conversion circuit or a CAN conversion circuit, through the conversion of the uplink communication conversion circuit 11, the bus signal is converted into a TTL level signal that can be processed by the CPU of the sensor. The uplink communication conversion circuit 11 is electrically connected to an uplink communication isolation circuit 12, the uplink communication isolation circuit 12 is electrically connected to an uplink communication output interface 13, and the uplink communication output interface 13 is electrically connected to the CPU of the sensor.
[0048] The CPU of the sensor is electrically connected to a downlink communication isolation circuit 14, and the downlink communication isolation circuit 14 is electrically connected to a downlink communication conversion circuit 15, which is also a 485 conversion circuit or a CAN conversion circuit. Through the conversion of the downlink communication conversion circuit 15, the TTL level signal is converted into a bus signal, and the downlink communication conversion circuit 15 is electrically connected to a downlink output port 16, which is electrically connected to the uplink debugging port 10 of the next sensor.
[0049] When changing the sensor address, the sensor connected to the computer receives the address information transmitted by the computer through the uplink debugging port 10. After receiving the address information, the uplink debugging port 10 converts the address information through the uplink communication conversion circuit 11, so that the CPU of the sensor can process it. Then the uplink communication isolation circuit 12 transmits the information to the uplink communication output interface 13. The uplink communication output interface 13 transmits the information to the CPU of the sensor. The CPU of the sensor processes the information and then transmits it to the downlink communication isolation circuit 14. The downlink communication isolation circuit 14 transmits the information to the downlink communication conversion circuit 15, converts it into a bus signal, and then transmits it to the next sensor through the downlink output port 16, thereby realizing the serial transmission of multiple sensors.
[0050] Reference Figure 2 , which is a data center multi-point temperature measurement system disclosed by the present invention, including an infrared multi-point temperature measurement sensor 20, a data collector 21, a network switch 22, an environmental control main server 23 and a management terminal 24, a plurality of infrared multi-point temperature measurement sensors 20 are connected in series, and the infrared multi-point temperature measurement sensor 20 adopts Figure 1In the internal wiring structure of the sensor, the infrared multi-point temperature sensor 20 adopts non-contact temperature measurement, and the model of the infrared multi-point temperature sensor 20 is MLX90640ESF-BAB. The data collector 21 is electrically connected to multiple groups of infrared multi-point temperature sensors 20 connected in series, and several data collectors 21 are electrically connected to the network switch 22, the network switch 22 is electrically connected to the environmental control main server 23, and the management terminal 24 is electrically connected to the environmental control main server 23 and the network switch 22.
[0051] The infrared multi-point temperature sensor 20 obtains the temperature information of multiple points in the data center and transmits the temperature information to the data collector 21. The data collector 21 summarizes the temperature information and transmits it to the environmental control main server 23 through the network switch 22. The environmental control main server 23 processes the temperature information and generates the temperature cloud field information of the data center. The management terminal 24 receives the temperature cloud field information and displays it.
[0052] Reference Figure 3 , is a sensor address modification method disclosed in the present invention, comprising:
[0053] S1: The sensor at the front of the list obtains the address change command transmitted by the computer;
[0054] S2: The sensor at the front of the list changes its address according to the address information in the address change command;
[0055] S3: After the change is completed, the sensor at the front of the list modifies the address information in the address change command and transmits it to the subsequent sensor; while modifying its own address, the CPU inside the sensor accumulates the value on the original address information, and the accumulated value is greater than or equal to 1 and is a positive integer, and then transmits the modified address information to the next sensor.
[0056] S4: The subsequent sensor modifies the address according to the address change command transmitted by the previous sensor.
[0057] The sensor at the front of the list obtains the address change command transmitted by the computer and makes changes according to the address information in the address change command. After the sensor at the front of the list completes the address change, it changes the address in the address change command and transmits it to the next sensor that needs to modify the address. The subsequent sensors receive the address change command output by the previous sensors and pass it on in sequence, thereby completing the address modification of all sensors. The entire process only requires outputting the address change command once.
[0058] The implementation principle of this embodiment is: the infrared multi-point temperature sensor 20 obtains the temperature information of multiple points in the data center, and transmits the temperature information to the data collector 21, the data collector 21 summarizes the temperature information, and transmits it to the environmental control main server 23 through the network switch 22, the environmental control main server 23 processes the temperature information and generates the temperature cloud field information of the data center, the management terminal 24 receives the temperature cloud field information and displays it, thereby realizing real-time monitoring of the temperature conditions of the data center. When modifying the sensor address, the sensor connected to the computer receives the address information transmitted by the computer through the uplink debugging port 10. After receiving the address information, the uplink debugging port 10 converts the address information through the uplink communication conversion circuit 11, so that the CPU of the sensor can process it. Then the uplink isolation circuit transmits the information to the uplink communication output interface 13. The uplink communication output interface 13 transmits the information to the CPU of the sensor. The CPU changes the address according to the address information in the address change command. Then the CPU changes the address in the address change command and transmits it to the downlink communication isolation circuit 14. The downlink communication isolation circuit 14 transmits the information to the downlink communication conversion circuit 15, converts it into a bus signal, and then transmits it to the next sensor through the downlink output port 16. The subsequent sensor receives the address change command output by the previous sensor and passes it in sequence, thereby completing the address modification of all sensors. The entire process only requires outputting the address change command once.
[0059] The embodiments of this specific implementation method are all preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Therefore, any equivalent changes made based on the structure, shape, and principle of the present invention should be included in the protection scope of the present invention.
Claims
1. A sensor internal wiring structure, characterized in that: include: An uplink debugging port (10) is used to connect to a computer or a previous sensor and receive a signal transmitted by the computer or the sensor; An uplink communication conversion circuit (11) is electrically connected to the uplink debugging port (10) and is used to receive a bus signal transmitted by the uplink debugging port (10) and convert the signal into a TTL level signal that can be processed by the CPU of the sensor; An uplink communication isolation circuit (12) is electrically connected to the uplink communication conversion circuit (11), and is used to receive and output a TTL level signal output by the uplink communication conversion circuit (11), and to isolate external interference signals; An uplink communication output interface (13), electrically connected to the uplink communication isolation circuit (12), and used for outputting the converted signal to the CPU of the sensor; A downlink communication isolation circuit (14), electrically connected to the CPU of the sensor, for receiving and outputting a signal output by the CPU of the sensor, and isolating external interference signals; A downlink communication conversion circuit (15) is electrically connected to the downlink communication isolation circuit (14) and is used to convert the TTL level signal transmitted by the downlink communication isolation circuit (14) into a bus signal; The downstream output port (16) is electrically connected to the downstream communication conversion circuit (15) and is used to transmit the bus signal output by the downstream communication conversion circuit (15) to the next sensor, thereby realizing the serial transmission of multiple sensors, and the addresses of all sensors can be changed through one address change instruction.
2. The sensor internal wiring structure according to claim 1 is characterized in that: The uplink communication conversion circuit (11) and the downlink communication conversion circuit (15) are both 485 conversion circuits or CAN conversion circuits.
3. A multi-point temperature measurement system for a data center, characterized in that: include: Infrared multi-point temperature measurement sensor (20), used to obtain temperature information at multiple points in the data center; A data collector (21) for collecting temperature information transmitted by the infrared multi-point temperature measurement sensor (20); A network switch (22), used to increase connection ports; The environment control main server (23) is used to receive data transmitted from the outside and perform processing and control; A management terminal (24) is used to obtain data transmitted by the environmental control main server (23) and perform parameter configuration; The infrared multi-point temperature measurement sensor (20) internally adopts the sensor internal wiring structure as claimed in claim 1 or 2.
4. The data center multi-point temperature measurement system according to claim 3 is characterized in that: The infrared multi-point temperature measurement sensor (20) is provided as one or more than one infrared multi-point temperature measurement sensor (20), and the infrared multi-point temperature measurement sensors (20) are connected in series.
5. The data center multi-point temperature measurement system according to claim 3 is characterized in that: The number of the data collector (21) is one or more, and the data collector (21) is electrically connected to one or more infrared multi-point temperature measurement sensors (20).
6. The data center multi-point temperature measurement system according to claim 3 is characterized in that: The infrared multi-point temperature measurement sensor (20) adopts non-contact temperature measurement.
7. A sensor address modification method, characterized in that: The multiple sensors implemented herein use the sensor internal wiring structure as claimed in claim 1 or 2, and the sensor address modification method includes: The sensor at the front of the list obtains the address change command transmitted by the computer; The sensor at the front of the list changes its address according to the address information in the address change command; After the change is completed, the sensor at the front of the list modifies the address information in the address change command and transmits it to the following sensors; The following sensor modifies the address according to the change address command transmitted by the previous sensor.
8. The sensor address modification method according to claim 7, characterized in that: The specific method for changing the address is to accumulate a value on the original address information, and the accumulated value is greater than or equal to 1 and is a positive integer.
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