Infrared light receiving device and infrared remote control equipment

Abstract

The present invention provides an infrared light receiving device and an infrared remote control device, which relate to the field of infrared light remote control technology and are used to improve the anti-interference ability and sensitivity of the infrared light receiving device. The infrared light receiving device includes a housing, a bracket, a photosensitive chip, a signal processing chip and a cover body, wherein the housing is provided with a focusing lens, the bracket includes an electrical connection area provided in the housing and an output pin, a ground pin and a power pin extending out of the housing; the photosensitive chip and the signal processing chip are located in the housing and are installed on the electrical connection area; the cover body is located in the housing, the cover body is buckled on the photosensitive chip and the signal processing chip, and is connected to the electrical connection area; the cover body has openings facing the photosensitive surfaces of the focusing lens and the photosensitive chip respectively, and the light-transmitting area of ​​the opening is greater than or equal to the area of ​​the photosensitive surface. The infrared light receiving device provided by the present invention is used to receive infrared light signals and convert them into control instructions required by the execution device.

Description

Technical Field

[0001] The present invention relates to the field of infrared light remote control technology, and in particular to an infrared light receiving device and an infrared remote control equipment. Background Art

[0002] Infrared remote control technology is a commonly used communication and control technology. Due to its simple structure, low power consumption, strong anti-interference ability, high reliability and low cost, it is widely used in color TVs, VCRs, air conditioners, electric meters, sweepers and automatic parking lot barriers.

[0003] The infrared remote control system made according to the principle of infrared remote control technology usually includes an infrared light emitting device and an infrared light receiving device, wherein the infrared light receiving device is used to receive the infrared light signal emitted by the infrared light emitting device and output it after processing the infrared light signal. The common infrared light receiving device currently includes a housing, a bracket, a photosensitive chip and a signal processing chip, wherein the housing is provided with a focusing lens, the bracket includes an electrical connection area provided in the housing, and an output pin, a ground pin and a power pin connected to the electrical connection area and extending out of the housing; the photosensitive chip and the signal processing chip are located in the housing and installed on the electrical connection area, and the photosensitive surface of the photosensitive chip is arranged opposite to the focusing lens. The photosensitive chip is used to receive the infrared light signal emitted by the infrared light emitting device and send it to the signal processing chip for processing and output.

[0004] However, since the signal processing chip is also installed on the electrical connection area and is relatively close to the photosensitive chip, part of the infrared light signal that enters the housing through the focusing lens will irradiate the signal processing chip, affecting the performance of the signal processing chip and making the infrared light receiving device less anti-interference. In addition, it will also interfere with the signal processing chip's accurate processing of the received signal, reducing the sensitivity of the infrared light receiving device. Summary of the invention

[0005] The object of the present invention is to provide an infrared light receiving device and an infrared remote control device, which are used to improve the anti-interference ability and sensitivity of the infrared light receiving device.

[0006] In order to achieve the above-mentioned purpose, the present invention provides an infrared light receiving device on the one hand, which includes: the infrared light receiving device includes a shell, a bracket, a photosensitive chip, a signal processing chip and a cover body, wherein the shell is provided with a focusing lens, and the bracket includes an electrical connection area arranged in the shell and an output pin, a ground pin, and a power pin extending out of the shell; the photosensitive chip and the signal processing chip are located in the shell and installed on the electrical connection area; the cover body is located in the shell, the cover body is buckled on the photosensitive chip and the signal processing chip, and is connected to the electrical connection area; the cover body has openings that are respectively opposite to the photosensitive surfaces of the focusing lens and the photosensitive chip, and the light-transmitting area of ​​the opening is greater than or equal to the area of ​​the photosensitive surface.

[0007] Compared with the prior art, the infrared light receiving device provided by the present invention has the following advantages:

[0008] In the infrared light receiving device provided by the present invention, since a cover body with an opening is provided on the outer cover of the photosensitive chip and the signal processing chip, and the opening is directly opposite to the photosensitive surface of the photosensitive chip, the infrared light signal entering the shell can only irradiate the photosensitive chip exposed in the opening but cannot irradiate the signal processing chip. Therefore, compared with the prior art, the influence of the infrared light signal on the performance of the signal processing chip can be reduced or even avoided, thereby improving the anti-interference ability and sensitivity of the infrared light receiving device.

[0009] As an improvement of the above infrared light receiving device, the focusing lens is a hemispherical convex lens and is integrally formed with the shell.

[0010] As a further improvement of the above infrared light receiving device, the curvature radius of the condenser lens is 2 mm to 3 mm.

[0011] As an improvement of the above infrared light receiving device, the cover body and the electrical connection area of ​​the bracket are integrally formed, and the cover body is bent to cover the photosensitive chip and the signal processing chip.

[0012] As an improvement of the above-mentioned infrared light receiving device, the shell includes an upper shell and a lower shell, and the cross-sectional shapes of the upper shell and the lower shell are both trapezoidal; the large end of the upper shell is connected to the large end of the lower shell, and a focusing lens is provided at the small end of the upper shell, and the distance between the large end and the small end of the upper shell is 2.5mm~3mm.

[0013] As a further improvement of the above-mentioned infrared light receiving device, the angle between the side of the upper shell and the straight line perpendicular to the large end of the upper shell is 4°~8°, and the angle between the side of the lower shell and the straight line perpendicular to the large end of the lower shell is 4°~8°.

[0014] As a further improvement of the above infrared light receiving device, the housing is a filter housing made of a filter material capable of filtering out wavelengths less than or equal to 820 nm.

[0015] As a further improvement of the above infrared light receiving device, the focusing lens is a filter lens made of a filter material that can filter out wavelengths less than or equal to 820 nm.

[0016] As an improvement of the above-mentioned infrared light receiving device, the photosensitive chip is an infrared light photosensitive chip that can receive wavelengths in the range of 880nm to 1080nm.

[0017] As an improvement of the above infrared light receiving device, the output pin, the ground pin and the power pin are arranged in sequence, and the output pin and the power pin both have bending portions facing each other.

[0018] Another aspect of the present invention further provides an infrared remote control device, comprising the infrared light receiving device as described above. The infrared remote control device has the same advantages as the infrared light receiving device as described above, so it will not be described in detail here.

[0019] Preferably, the infrared remote control device is an electric meter, a sweeper or an automatic parking lot barrier.

[0020] On the other hand, the present invention provides an infrared light receiving device, comprising a shell, a carrier, a photosensitive chip, a signal processing chip and a cover body, wherein the shell is provided with a lens, the carrier comprises an electrical connection area arranged in the shell and at least one pin extending out of the shell; the photosensitive chip and the signal processing chip are located in the shell and installed on the electrical connection area; the cover body is located in the shell, the cover body covers the photosensitive chip and the signal processing chip, and is connected to the electrical connection area; the cover body has an opening / light-transmitting area which is respectively opposite to the photosensitive surface of the lens and the photosensitive chip.

[0021] As a further improvement of the above infrared light receiving device, the light-transmitting area of ​​the opening / light-transmitting region is greater than or equal to the area of ​​the photosensitive surface.

[0022] As a further improvement of the above infrared light receiving device, the carrier includes a bracket or a substrate.

[0023] As a further improvement of the above infrared light receiving device, the at least one pin includes an output pin, a ground pin, and a power pin.

[0024] In addition to the technical problems solved by the present invention, the technical features that constitute the technical scheme, and the beneficial effects brought about by the technical features of the technical scheme described above, other technical problems that can be solved by the infrared light receiving device and infrared remote control device provided by the present invention, other technical features included in the technical scheme, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments of the present invention or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only part of the embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A front view of an infrared light receiving device provided by an embodiment of the present invention;

[0027] Figure 2 A side view of an infrared light receiving device provided by an embodiment of the present invention;

[0028] Figure 3 A cross-sectional view of an infrared light receiving device provided by an embodiment of the present invention;

[0029] Figure 4 A top view of an infrared light receiving device provided by an embodiment of the present invention;

[0030] Figure 5 for Figure 1 A diagram showing the relative positions of the middle bracket and the cover;

[0031] Figure 6 for Figure 1 The connection diagram between the signal processing chip and the photosensitive chip;

[0032] Figure 7 for Figure 1 A curve relationship diagram between the responsivity and wavelength of the infrared light receiving device;

[0033] Figure 8 A curve relationship diagram between the sensitivity and angle of the sweeping machine provided by an embodiment of the present invention;

[0034] Fig. 9 This is a structural block diagram of an electric meter provided in an embodiment of the present invention.

[0035] Description of reference numerals:

[0036] B-First area,

[0037] C-second area, 1-bracket,

[0038] 10-housing, 11-upper housing,

[0039] 12-lower housing, 20-condenser lens,

[0040] 30-electrical connection area, 30a-first electrical connection area,

[0041] 30b - second electrical connection area, 30c - third electrical connection area,

[0042] 31- output pin, 31a, 33a- bending part,

[0043] 32- ground pin, 33- power pin,

[0044] 40-photosensitive chip, 50-signal processing chip,

[0045] 60-cover body, 61-opening,

[0046] 70-infrared light emitting device, 80-electrical value generator,

[0047] 90-Electricity value display,

[0048] 50a, 50b, 50c, 50d - wires. DETAILED DESCRIPTION

[0049] In order to improve the anti-interference ability and sensitivity of the infrared light receiving device, the embodiment of the present invention provides an improved infrared light receiving device and infrared remote control equipment, wherein the infrared light receiving device includes a housing and a photosensitive chip, a signal processing chip and a cover body arranged in the housing, the cover body is arranged on the photosensitive chip and the signal processing chip, and the cover body is provided with openings that are respectively opposite to the focusing lens on the housing and the photosensitive surface of the photosensitive chip, and the light-transmitting area of ​​the opening is greater than or equal to the area of ​​the photosensitive surface of the photosensitive chip. With such a design, the infrared light signal entering the housing through the focusing lens is irradiated from the opening to the photosensitive chip to complete the collection of the infrared light signal; and the cover body can prevent the infrared light from irradiating the signal processing chip, thereby improving the anti-interference ability and sensitivity of the infrared light receiving device.

[0050] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work belong to the scope of protection of the present invention.

[0051] See also Figure 1 to Figure 6 The infrared light receiving device provided in the embodiment of the present invention comprises: a housing 10, a bracket 1, a photosensitive chip 40, a signal processing chip 50 and a cover 60, the housing 10 is provided with a focusing lens 20, the bracket 1 comprises an electrical connection area 30 arranged in the housing 10, such as Figure 5 As shown, the electrical connection area 30 includes a first electrical connection area 30a, a second electrical connection area 30b and a third electrical connection area 30c, wherein the first electrical connection area 30a has a ground pin (GND) 32 extending out of the housing 10, the second electrical connection area 30b has an output pin (OUT) 31 extending out of the housing 10, and the third electrical connection area 30c has a power pin (VCC) 33 extending out of the housing 10; the photosensitive chip 40 and the signal processing chip 50 are located in the housing 10 and are respectively arranged in the first area ( Figure 5 Area B in the second area ( Figure 5 In the C area). Figure 6 As shown, the photosensitive chip 40 is electrically connected to the signal processing chip 50 through a wire 50a and transmits signals to the signal processing chip 50; the signal processing chip 50 is further electrically connected to the second electrical connection area 30b through a wire 50c to output signals, connected to the first electrical connection area 30a through a wire 50d to connect current to the ground, and then electrically connected to the third electrical connection area 30c through a wire 50b to receive power.

[0052] The cover 60 is located in the housing 10. The cover 60 is disposed on the photosensitive chip 40 and the signal processing chip 50 and is connected to the first electrical connection area 30a. In a preferred embodiment, as shown in FIG. 5, the first electrical connection area 30a and the cover 60 are an integrally formed structure, and the cover 60 is bent so as to be disposed on the photosensitive chip 40 and the signal processing chip 50. The cover 60 has an opening 61 that is respectively opposite to the photosensitive surface of the focusing lens 20 and the photosensitive chip 40. The light transmission area of ​​the opening 61 is greater than or equal to the area of ​​the photosensitive surface of the photosensitive chip 40. Therefore, the infrared light signal entering the housing 10 can only irradiate the photosensitive chip 40 exposed in the opening 61, but cannot irradiate the signal processing chip 50. Therefore, compared with the prior art, the infrared light signal can reduce or even avoid the performance influence of the signal processing chip 50, thereby improving the anti-interference ability and sensitivity of the infrared light receiving device, and enhancing the electromagnetic interference (EMI) defense effect.

[0053] In a preferred embodiment, the cover 60 can be a metal material or a non-metal material. The cover 60 can be a metal coating formed on the signal processing chip 50, the first electrical connection area 30a, and the area of ​​the photosensitive chip 40 except its photosensitive surface by electroplating or sputtering, and its thickness is about 10nm-20nm.

[0054] In a specific implementation, the housing 10 is used to cover components such as the first electrical connection area 30a, the second electrical connection area 30b, the third electrical connection area 30c, the photosensitive chip 40, the signal processing chip 50 and the cover 60. Figure 2 As shown, the housing 10 includes an upper housing 11 and a lower housing 12. The upper housing 11 or the lower housing 12 can be a metal housing or a plastic housing. For example, the upper housing 11 and the lower housing 12 are made of a metal sheet by punching a stamping machine and a stamping die; or, the upper housing 11 and the lower housing 12 are integrally formed by an injection molding machine and a mold. In one embodiment, the housing 10 is a solid covering internal device to seal and isolate external moisture. Among them, the signal processing chip 50 can be a complex programmable logic device (ASIC), a field programmable gate array (FPGA) or a complex programmable logic device (CPLD).

[0055] The cross-sectional shapes of the upper shell 11 and the lower shell 12 can be rectangular, trapezoidal or other polygonal shapes, such as Figure 2 or Figure 3 As shown, in this embodiment, the cross-sectional shapes of the upper shell 11 and the lower shell 12 are both trapezoidal, the small end of the upper shell 11 is the surface where the upper base (short side) of the trapezoid is located, the large end of the upper shell 11 is the surface where the lower base (long side) of the trapezoid is located, and the side surface of the upper shell 11 is the surface where the waist side of the trapezoid is located. Figure 2 In the orientation shown, the small end of the upper shell 11 is the left end of the upper shell 11, and the large end of the upper shell 11 is the right end of the upper shell 11. The structure of the lower shell 12 is basically the same as that of the upper shell 11, so it is not repeated.

[0056] A condenser lens 20 is disposed at the small end of the upper housing 11. In a preferred embodiment, the condenser lens 20 and the housing 10 are integrally formed of plastic. For example, the condenser lens 20, the upper housing 11 and the lower housing 12 are integrally formed by injection molding process, injection molding machine and mold. When the infrared light signal emitted by the infrared light emitting device is irradiated onto the condenser lens 20, the focusing characteristics of the condenser lens 20 are utilized to make the infrared light converge to the photosensitive surface of the photosensitive chip 40 through the condenser lens 20.

[0057] The support 1 generally comprises two parts, such as Figure 2 and Figure 5 As shown, one part is the first electrical connection area 30a, the second electrical connection area 30b, and the third electrical connection area 30c located in the shell 10; the other part is the output pin (OUT) 31 extending from the second electrical connection area 30b outside the shell 10, the ground pin (GND) 32 extending from the first electrical connection area 30a outside the shell 10, and the power pin (VCC) 33 extending from the third electrical connection area 30c outside the shell 10.

[0058] The photosensitive chip 40 is also called a photodiode / photosensitive transistor (PD / PT) chip, which is mounted in the first area ( Figure 5 The photosensitive chip 40 is located on the B area in the image processing unit 41 and is used to convert the infrared light signal into an infrared remote control electrical signal. The core of the photosensitive chip 40 is the photosensitive surface for receiving the infrared light signal and the conversion circuit for converting the infrared light signal into an infrared remote control electrical signal. The photosensitive surface of the photosensitive chip 40 is usually a PN junction made of special materials. The PN junction is generally formed by the following method: using a doping process, a P-type semiconductor and an N-type semiconductor are made on the same semiconductor substrate (such as a silicon substrate or a germanium substrate). The space charge area formed at the interface between the P-type semiconductor and the N-type semiconductor is called a PN junction. The PN junction has unidirectional conductivity. It should be added that in order to be able to receive more infrared light, the photosensitive surface of the photosensitive chip 40 is usually made larger.

[0059] The signal processing chip 50 is also called an IC chip, which is mounted in the second area ( Figure 5 The signal processing chip 50 is located on the same side as the photosensitive chip 40 and is connected to the photosensitive chip 40 by signal. The signal processing chip 50 generally includes a signal amplification circuit, a filtering circuit and an instruction decoding circuit, which are used to receive the infrared remote control electrical signal output by the photosensitive chip 40, amplify the infrared remote control electrical signal, filter out clutter and decode it, and finally output the instruction control signal required by the execution device. Among them, the IR light source emits an infrared light signal, which is received by the photosensitive surface of the photosensitive chip 40 and converted into a current signal and then output to the signal processing chip 50. The transimpedance amplifier (TIA) in the signal processing chip 50 converts the current signal into a voltage signal, controls the gain amplifier (CGA) function to amplify or reduce the voltage magnification (if there is no noise, the voltage magnification is amplified, and if there is noise, the voltage magnification is reduced), and then other clutter is filtered through a bandpass filter (BP), for example, leaving a frequency wave of 35 to 40kHz (if there is too much noise, return to CGA to adjust the voltage magnification to reduce noise), and finally the demodulation processor (DEM / INT) converts the original wave-shaped wave into a square wave output.

[0060] The cover body 60 is generally made of metal material or opaque non-metallic material, that is, the cover body 60 can be a metal cover body, a ceramic cover body or a plastic cover body. An opening 61 is provided on the cover body 60. After the cover body 60 is covered on the photosensitive chip and the signal processing chip, the photosensitive surface of the photosensitive chip 40 is exposed in the opening 61. The shape of the opening 61 can be rectangular, circular, or elliptical, and can be specifically designed according to the shape of the photosensitive surface of the photosensitive chip 40. For example, if the shape of the photosensitive surface of the photosensitive chip 40 is circular, the shape of the opening 61 is circular. For another example, Figure 5 and Figure 6As shown, the photosensitive surface of the photosensitive chip 40 is in a rectangular shape, and the opening 61 is in a rectangular shape. The opening 61 may be a light-transmitting area.

[0061] In addition, the light-transmitting area of ​​the opening 61 is generally larger than the area of ​​the photosensitive surface of the photosensitive chip 40, or the light-transmitting area of ​​the opening 61 is equal to the area of ​​the photosensitive surface of the photosensitive chip 40. Such a design can make the infrared light signal passing through the opening 61 converge on the photosensitive surface of the photosensitive chip 40, prevent the infrared light entering the housing 10 from irradiating the signal processing chip 50, and improve the utilization rate of the infrared light signal, thereby improving the sensitivity of the infrared light emitting device.

[0062] The working principle of the above-mentioned infrared light receiving device is as follows: the infrared light signal emitted by the infrared light emitting device is first irradiated to the focusing lens 20, enters the shell 10 after being focused by the focusing lens 20, and converges to the photosensitive surface of the photosensitive chip 40 from the opening 61 of the cover body 60. After receiving the infrared light signal, the photosensitive chip 40 converts it into an infrared remote control electrical signal and outputs it to the signal processing chip 50. The signal processing chip 50 amplifies, filters, decodes and other processes the infrared remote control electrical signal, and finally outputs the control instructions required by the execution device.

[0063] In the infrared light receiving device provided in the above embodiment, since a cover body 60 with an opening is provided on the outer cover of the photosensitive chip 40 and the signal processing chip 50, the opening 61 is directly opposite to the photosensitive surface of the photosensitive chip 40, and the light-transmitting area of ​​the opening 61 is greater than or equal to the area of ​​the photosensitive surface of the photosensitive chip 40, the infrared light signal entering the housing 10 can only irradiate the photosensitive chip 40 exposed in the opening 61, but cannot irradiate the signal processing chip 50. Therefore, compared with the prior art, the influence of the infrared light signal on the performance of the signal processing chip 50 can be reduced or even avoided, thereby improving the anti-interference ability and sensitivity of the infrared light receiving device.

[0064] In the above-mentioned infrared light receiving device, the focusing lens 20 is one of the key components for realizing the above-mentioned functions. The focusing lens 20 is usually a convex lens, and specifically can be a spherical convex lens and an aspherical convex lens. In order to facilitate installation and reduce costs, preferably, the focusing lens 20 is a hemispherical convex lens.

[0065] In the above infrared light receiving device, the photosensitivity of the photosensitive chip 40 is usually related to the radius of curvature of the condenser lens 20 and the distance from the condenser lens 20 to the photosensitive surface of the photosensitive chip. After a large number of experimental verifications and considering the miniaturization trend of infrared light receiving devices, the radius of curvature r of the condenser lens 20 can be selected to be between 2mm and 3mm. Preferably, the radius of curvature r of the condenser lens 20 is 2.5mm. In addition, the distance d from the condenser lens 20 to the photosensitive surface of the photosensitive chip can be considered as the distance between the large end and the small end of the upper shell 11. The distance between the large end and the small end of the upper shell is 2.5mm to 3mm. Preferably, the distance between the large end and the small end of the upper shell is 2.7mm.

[0066] In the above embodiments, it is mentioned that the cross-sectional shapes of the upper shell 11 and the lower shell 12 can be rectangular, trapezoidal or other polygonal shapes, and can be formed by an injection molding machine and a mold. Figure 4 In a preferred embodiment, the cross-sectional shape of the upper shell 11 and the lower shell 12 is a trapezoid, and the angle between the side of the upper shell 11 and the straight line perpendicular to the large end of the upper shell 11 is 4° to 8°, and the angle between the side of the lower shell 12 and the straight line perpendicular to the large end of the lower shell 12 is 4° to 8°. With such a design, when the upper shell 11 and the lower shell 12 are injection molded, it is convenient to smoothly remove the molded product from the mold.

[0067] like Figure 7 As shown, the wavelength range of infrared light that the photosensitive chip 40 can usually receive is between 600nm and 1100nm, but if the photosensitive chip 40 receives infrared light with a wavelength between 600nm and 880nm or above 1060nm, its responsivity is low (responsivity is lower than 0.6). Therefore, in order to make the responsivity of the photosensitive chip 40 above 0.6, the photosensitive chip 40 is usually designed to receive infrared light between 880nm and 1060nm, that is, the photosensitive chip is an infrared light photosensitive chip that can receive infrared light with a wavelength range of 880nm to 1080nm. Preferably, the photosensitive chip 40 is an infrared light photosensitive chip that receives infrared light with a wavelength of 940nm. In this case, the responsivity of the photosensitive chip 40 can reach or approach 1.

[0068] In the above embodiment, the housing 10 may be a plastic housing, and the plastic housing may be transparent and colorless, that is, the light transmittance of the transparent and colorless plastic housing is relatively good. Therefore, when the infrared light receiving device is used in a place with sufficient sunlight outdoors, in addition to the infrared light signal entering the housing 10 from the focusing lens 20, other light will enter the housing 10 from the housing part other than the focusing lens 20, and enter the photosensitive surface of the photosensitive chip 40 through the opening 61, so that the photosensitive chip receives some noise. In order to avoid this situation and not affect the reception of infrared light by the photosensitive chip 40, preferably, the housing 10 is a filter housing made of a filter material that can filter out wavelengths less than or equal to 820nm. For example, the shell 10 can be molded from materials such as epoxy encapsulant, silicone encapsulant, polyurethane encapsulant, thermosetting encapsulant, thermoplastic encapsulant or UV-curing encapsulant. The shell 10 needs to be doped with a filter material that can filter out wavelengths less than or equal to 820 nm. The filter material in the shell 10 is used to filter out light with a wavelength less than or equal to 820 nm, thereby reducing the amount of noise received by the photosensitive chip 40.

[0069] In a preferred embodiment, the focusing lens 20 and the shell 10 are formed as one piece. The material can be epoxy encapsulation glue, silicone encapsulation glue, polyurethane encapsulation glue, thermosetting encapsulation glue, thermoplastic encapsulation glue or ultraviolet light curing encapsulation glue and other materials. The injection molding process is used to form an integrally formed focusing lens 20, upper shell 11 and lower shell 12 through an injection molding machine and a mold. The material needs to be doped with a filter material that can filter out wavelengths less than or equal to 820nm. The filter material in the shell 10 is used to filter out light with a wavelength less than or equal to 820nm, thereby reducing the amount of noise received by the photosensitive chip 40. There are many ways to arrange the output pin 31, the ground pin 32 and the power pin 33 extending outside the shell 10, such as Figure 1 As shown, a commonly used arrangement is: the output pin 31, the ground pin 32 and the power pin 33 are arranged in sequence from left to right, that is, the ground pin 32 is located in the middle, and the output pin 31 and the power pin 33 are located on the outside. Due to the development trend of miniaturization of infrared light receiving devices, the shell of the infrared light receiving device is usually smaller, resulting in glue leakage at the connection between the output pin 31 and the power pin 33 located on the outside and the shell 10. In order to prevent glue leakage, preferably, the output pin 31 and the power pin 33 both have bending portions 31a and 33a facing each other, wherein the bending portion 31a of the output pin 31 is close to the connection between the output pin 31 and the shell 10, and the bending portion 33a of the power pin 33 is close to the connection between the power pin 33 and the shell 10.

[0070] The embodiment of the present invention further provides an infrared remote control device, which includes the infrared light receiving device described in the above embodiment. The infrared remote control device can be an electric meter, a sweeper, an automatic parking barrier, or a color TV, a refrigerator, and an air conditioner. Since the working principles of these infrared remote control devices are basically the same or similar, this article only uses the infrared remote control device as an electric meter, a sweeper, and an automatic parking barrier as an example for description. The working principles of other infrared remote control devices not mentioned can refer to the working principles of the electric meter, the sweeper, and the automatic parking barrier.

[0071] like Fig. 9 As shown, the infrared remote control device in this embodiment is an electric meter, which includes an infrared light receiving device, an infrared light emitting device 70, an electric power value generator 80 and an electric power value display 90. Among them, the infrared light receiving device in this embodiment is the same as the infrared light receiving device in the above embodiment, so the same technical content of the two will be omitted or simplified. The infrared light emitting device 70 is arranged opposite to the condenser lens 20 of the infrared light receiving device, the infrared light receiving device is connected to the electric power value generator 80 by signal, and the electric power value display 90 is connected to the electric power value generator 80 by signal.

[0072] The infrared light emitting device 70 includes an IR light source, which can continuously emit infrared light of different intensities according to different voltages. The infrared light signal emitted by the infrared light emitting device 70 enters the housing 10 after being focused by the focusing lens 20, and irradiates the photosensitive surface of the photosensitive chip 40 through the opening 61. The photosensitive chip 40 receives the infrared light signal and converts it into an infrared remote control electric signal, and outputs it to the signal processing chip 50. The signal processing chip 50 amplifies, filters, decodes, etc. the infrared remote control electric signal and outputs it to the power consumption value generator 80, which converts it into a specific power consumption value, and the power consumption value display 90 displays the power consumption value.

[0073] In addition to the advantages of the infrared light receiving device mentioned above, the electric meter is also suitable for various types of electric meters, can remotely confirm the value and related information of the electric meter, can maintain the sensitivity and high recognition of the electric meter for a long time, and can effectively prevent the influence of light interference on the reception of the electric meter.

[0074] The infrared remote control device can also be a sweeping machine, which includes an infrared light receiving device and an infrared light emitting device, wherein the infrared light emitting device has the advantages of the infrared light emitting device described in the above embodiments. Therefore, the sweeping machine also has advantages such as strong anti-interference ability and high sensitivity, so that the sweeping machine can still be used normally even in a room full of sunlight without causing functional disorders. In addition, the charging signal emitted by the charging base of the sweeping machine can be received remotely, and it can accurately return to the designated charging base for charging. In addition, different Code decoding methods can be used, which are suitable for different products.

[0075] like Figure 8 As shown, in order to further improve the accuracy of the sweeping machine, preferably, the infrared signal device in the sweeping machine has a wider angle. Normally, the angle range of the infrared signal device receiving the infrared light signal is generally between -40° and +40°, and the angle range of the infrared signal device in the sweeping machine receiving the infrared light signal is generally between -50° and +50°. Such a design can reduce the infrared light receiving device in the sweeping machine from missing the infrared light signal, improve the accuracy of the sweeping machine, and enable the sweeping machine to accurately return to the designated charging station for charging.

[0076] The infrared remote control device can also be an automatic parking barrier, which includes an infrared light receiving device and an infrared light emitting device, wherein the infrared light emitting device has the advantages of the infrared light receiving device described in the above embodiments, and therefore, the automatic parking barrier also has advantages such as strong anti-interference ability and high sensitivity, so that the automatic parking barrier can be used normally even in a sunny environment without causing functional disorders. In addition, the infrared light signal can be received remotely to realize the lifting or lowering function of the automatic parking barrier.

[0077] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0078] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An infrared light receiving device, characterized in that: It includes a housing, a bracket, a photosensitive chip, a signal processing chip and a cover, wherein: The housing is provided with a focusing lens, and the bracket includes an electrical connection area provided in the housing and an output pin, a ground pin, and a power pin extending out of the housing; the photosensitive chip and the signal processing chip are located in the housing and mounted on the electrical connection area; The cover body is located in the shell, the cover body is buckled on the photosensitive chip and the signal processing chip, and is connected to the electrical connection area; the cover body has openings facing the focusing lens and the photosensitive surface of the photosensitive chip respectively, and the light transmission area of ​​the opening is greater than or equal to the area of ​​the photosensitive surface; the cover body and the electrical connection area of ​​the bracket are integrally formed, and the cover body is covered on the photosensitive chip and the signal processing chip in a bending manner; wherein the shape of the opening is designed according to the shape of the photosensitive surface of the photosensitive chip; The housing is a filter housing made of a filter material capable of filtering out wavelengths less than or equal to 820 nm; the photosensitive chip is an infrared photosensitive chip capable of receiving wavelengths between 880 nm and 1080 nm; The shell includes an upper shell and a lower shell, and the cross-sectional shapes of the upper shell and the lower shell are both trapezoidal; the large end of the upper shell is connected to the large end of the lower shell, and a focusing lens is provided at the small end of the upper shell, and the distance between the large end and the small end of the upper shell is 2.5mm~3mm; the angle between the side of the upper shell and the straight line perpendicular to the large end of the upper shell is 4°~8°, and the angle between the side of the lower shell and the straight line perpendicular to the large end of the lower shell is 4°~8°.

2. The infrared light receiving device according to claim 1, characterized in that: The focusing lens is a hemispherical convex lens and is integrally formed with the housing.

3. The infrared light receiving device according to claim 2, characterized in that: The curvature radius of the focusing lens is 2 mm to 3 mm.

4. The infrared light receiving device according to any one of claims 1 to 3, characterized in that: The condenser lens is a filter lens made of a filter material capable of filtering out wavelengths less than or equal to 820 nm.

5. The infrared light receiving device according to claim 1, characterized in that: The output pin, the ground pin and the power pin are arranged in sequence, and the output pin and the power pin both have bending portions facing each other.

6. An infrared remote control device, characterized in that: It comprises the infrared light receiving device as described in any one of claims 1 to 5.

7. The infrared remote control device according to claim 6, characterized in that: The infrared remote control device is an electric meter, a sweeper or an automatic parking lot barrier.

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