An electronic tag with low decoding recovery rate

Abstract

The present invention provides an electronic tag with a low decoding revival rate, an electronic tag with a low decoding revival rate, comprising an insulating layer and a front circuit layer and a back circuit layer arranged on both sides of the insulating layer; the back circuit layer is a capacitor layer that mainly forms a capacitor plate portion; connection points or decoding points are also arranged at corresponding positions of the front circuit layer and the back circuit layer; it is characterized in that: the front circuit layer and the back circuit layer are both metal layers and the thickness of the back circuit layer is less than the thickness of the front circuit layer. The present invention solves the problem that the thickness of the front conductive layer of the existing label or EAS label in the prior art is equal to the thickness of the back conductive layer, that is, the thickness of the front circuit layer is the same as the thickness of the back circuit layer, at this time, the two circuit layers are easily separated or partially separated, and new parts similar to connection points or decoding points are generated, which easily leads to the revival of the originally invalid label.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic security tags, and in particular to an electronic tag with a low decoding recovery rate. Background Art

[0002] With the development of electronic technology, electronic tags with security and anti-counterfeiting functions have gradually entered our lives, such as a substrate-free electronic tag disclosed in the Chinese invention patent specification (authorization announcement number CN201429857Y). However, the thickness of the front conductive layer of this tag or EAS tag is equal to the thickness of the back conductive layer, that is, the thickness of the front circuit layer is the same as the thickness of the back circuit layer. At this time, the two circuit layers are prone to separation or partial separation, resulting in new parts similar to connection points or decoding points, which can easily lead to the revival of the originally invalid tag; and / or because the two circuit layers have the same width at corresponding positions, the edges of the two circuit layers are not covered by the insulating layer, and the distance is relatively close, the corresponding positions of the edges of the two circuit layers are also likely to produce new parts similar to connection points or decoding points, which can easily lead to the revival of the originally invalid tag.

[0003] Currently, such tags or EAS tags often have a high resurrection rate during use, which is generally as high as about 25%. Tag resurrection can easily cause misunderstandings and embarrassment between merchants and customers, and even disputes. For example, when an item has been paid, an unpaid alarm still occurs when it passes through the detection system.

[0004] How to effectively reduce the tag resurrection rate and provide an electronic tag with a low decoding resurrection rate has become an urgent problem to be solved. Summary of the invention

[0005] The purpose of the present invention is to provide an electronic tag with a low decoding revival rate, mainly to solve the problem one of the above-mentioned prior art: the thickness of the front conductive layer of the existing tag or EAS tag is equal to the thickness of the back conductive layer, that is, the thickness of the front circuit layer is the same as the thickness of the back circuit layer. At this time, the two circuit layers are prone to separation or partial separation, resulting in new parts similar to connection points or decoding points, which can easily lead to the problem of reviving the originally invalid tag.

[0006] Problem 2: Since the widths of the corresponding positions of the existing front and back circuit layers are the same, the edges of the two circuit layers are not covered by the insulating layer and are close to each other. It is very likely that new connection points or decoding points will appear at the corresponding positions of the edges of the two circuit layers, which can easily lead to the revival of the originally invalid tags.

[0007] In order to achieve the above-mentioned purpose, the technical solution adopted by the present invention is: an electronic tag with a low decoding resurrection rate, comprising an insulating layer and a front circuit layer and a back circuit layer arranged on both sides of the insulating layer; the back circuit layer is a capacitor layer that mainly forms a capacitor plate portion; connection points or decoding points are also arranged at corresponding positions of the front circuit layer and the back circuit layer; it is characterized in that: the front circuit layer and the back circuit layer are both metal layers and the thickness of the back circuit layer is less than the thickness of the front circuit layer.

[0008] Furthermore, the insulating layer is a hot melt adhesive layer.

[0009] Furthermore, the width of the metal layer forming the capacitor plate on the back circuit layer is smaller than the width of the metal layer forming the capacitor plate at a corresponding position on the front circuit layer.

[0010] Furthermore, the back circuit layer has a thickness of 5-50 μm.

[0011] Furthermore, the thickness of the front circuit layer is 40um-100μm.

[0012] Furthermore, the metal layer of the front circuit layer and the metal layer of the back circuit layer are aluminum foil layers.

[0013] Furthermore, the electronic tag with a low decoding resurrection rate also includes a first substrate layer and a second substrate layer, the first substrate layer is coated paper or polyester film, which is glued to the other side of the front circuit layer, and the second substrate layer is base paper, which is glued to the other side of the back circuit layer.

[0014] Furthermore, a first PET layer and a second PET layer are sequentially laminated between the base paper and the back circuit layer.

[0015] Furthermore, the electronic tag with a low decoding resurrection rate also includes a first substrate layer and a second substrate layer, the first substrate layer is coated paper or polyester film, which is glued to the other side of the back circuit layer, and the second substrate layer is base paper, which is glued to the other side of the front circuit layer.

[0016] Furthermore, a first PET layer is laminated between the base paper and the front circuit layer, and a second PET layer is laminated between the coated paper or polyester film and the back circuit layer.

[0017] In view of the above technical features, the present invention has the following beneficial effects:

[0018] 1. In the electronic tag with a low decoding resurrection rate of the present invention, the thickness of the back circuit layer is less than that of the front circuit layer. At this time, the back circuit layer is easily attached to the front circuit layer, and the two circuit layers are not easily separated or partially separated, thereby avoiding the generation of new parts similar to connection points or decoding points, effectively preventing the resurrection of the originally invalid label, and greatly reducing the decoding resurrection rate of the invalid label.

[0019] 2. In the present invention, an electronic tag with a low decoding resurrection rate has a metal layer width forming a capacitor plate on the back circuit layer that is smaller than the metal layer width forming a capacitor plate at a corresponding position on the front circuit layer. This can not only help the back circuit layer to be more fully attached to the front circuit layer, but also help to coat the thickness of the edges of the back circuit layer with an insulating layer during processing, further preventing the generation of new similar connection points or decoding points at corresponding positions on the edges of the two circuit layers, further preventing the resurrection of the originally invalid tags, and greatly reducing the decoding resurrection rate of the invalid tags. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the structure of the front circuit layer in an electronic tag with a low decoding recovery rate in Example 1.

[0021] Figure 2 It is a schematic structural diagram of the back circuit layer of an electronic tag with a low decoding recovery rate in Example 1.

[0022] Figure 3 It is a structural schematic diagram of the combination of the front circuit layer and the back circuit layer in an electronic tag with a low decoding recovery rate in Example 1.

[0023] Figure 4 yes Figure 3 Schematic diagram of the cross section at position A in the middle.

[0024] Figure 5 This is a schematic diagram of the structure of the front circuit layer in an electronic tag with a low decoding recovery rate in Example 2.

[0025] Figure 6 It is a schematic structural diagram of the back circuit layer of an electronic tag with a low decoding recovery rate in Example 2.

[0026] Figure 7 It is a structural schematic diagram of the combination of the front circuit layer and the back circuit layer in an electronic tag with a low decoding recovery rate in Example 2.

[0027] Figure 8 yes Figure 7 Schematic diagram of the cross section at position B in the middle.

[0028] Fig. 9 yes Figure 7 Schematic diagram of the cross section at position C in the middle.

[0029] Fig.10 This is a decomposition diagram of an electronic tag with a low decoding recovery rate in Example 3.

[0030] Fig.11 This is a decomposition diagram of an electronic tag with a low decoding recovery rate in Example 4.

[0031] In the figure: 1 is coated paper; 2 is the first glue; 3 is the second PET layer; 4 is the front circuit layer; 4-1 is the corresponding thickness of the parts around the edges of the front circuit layer; 4-2 is the width of the metal layer forming the capacitor plates at the corresponding position on the front circuit layer; 5 is the insulating layer; 6 is the back circuit layer; 6-1 is the corresponding thickness of the parts around the edges of the back circuit layer; 6-2 is the width of the metal layer forming the capacitor plates on the back circuit layer; 7 is the second glue; 8 is the first PET layer; 9 is the third glue; 10 is the base paper, 11 is the fourth glue, and 12 is the connection point. DETAILED DESCRIPTION

[0032] The present invention will be further described below in conjunction with specific embodiments. It should be understood that these embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention. In addition, it should be understood that after reading the content taught by the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms fall within the scope limited by the appended claims of the application equally.

[0033] First, the relevant terms or nouns involved in this patent are explained as follows: a "valid" label refers to a label that has not been decoded and can respond to the electronic detection system in the detection area; an "invalid" label refers to a label that has been decoded but cannot respond to the electronic detection system in the detection area; a "resurrected" label refers to a label that has been decoded but can respond to the electronic detection system in the detection area (that is, the original circuit structure is restored and resonance occurs again). Label decoding refers to the fact that the front circuit layer and the back circuit layer on the label are turned on at the decoding point or connection point.

[0034] The electronic tag with a low decoding resurrection rate involved in this patent is an electronic security tag used together with an electronic monitoring system. When the tag is in the monitoring system, its circuit can respond to the monitoring system. When the tag fails, the monitoring system has no effect. When the tag is revived, the monitoring system responds.

[0035] See also Figures 1 to 4, Specific embodiment 1, the present invention provides an electronic tag with a low decoding revival rate, comprising an insulating layer 5 and a front circuit layer 4 and a back circuit layer 6 arranged on both sides of the insulating layer 5, the three together constitute a resonant circuit composed of a wire or a coil and a capacitor; the back circuit layer 6 is a capacitor layer that mainly forms a capacitor plate part; connection points or decoding points are also arranged at corresponding positions of the front circuit layer 4 and the back circuit layer 6; it is characterized in that: the front circuit layer 4 and the back circuit layer 6 are both metal layers and the thickness of the back circuit layer 6 is less than the thickness of the front circuit layer 4.

[0036] The front circuit layer 4 is mainly a conductive layer circuit that forms a coil area, and the coil of a part of the circuit is a component of the capacitor plate part.

[0037] The back circuit layer 6 is a capacitor layer that mainly forms the capacitor plate portion, and part of its circuit also plays the role of a coil.

[0038] The overlapping area of ​​the front circuit layer 4 and the back circuit layer 6 forms a capacitor, and the insulating layer 5 becomes the medium of the capacitor. The front circuit layer 4 and the back circuit layer 6 are connected to the inductor coil and the capacitor through a connection point or a decoding point (connection point 12 in this embodiment 1) to form a resonant circuit.

[0039] The thickness of the back circuit layer 6 is less than that of the front circuit layer 4, that is, the back circuit layer 6 is thinner than the front circuit layer 4, which means that the back circuit layer 6 is softer than the front circuit layer 4. Compared with the case where the thickness of the back circuit layer 6 is equal to the thickness of the front circuit layer 4, an electronic tag with a low decoding resurrection rate in this embodiment 1 uses a structure with different thicknesses of the two, and the thinner and softer back circuit layer 6 can be more closely attached to the front circuit layer 4 through the insulating layer 5, and the adsorption and attachment effect between the front circuit layer 4 and the back circuit layer 6 is better, which can effectively avoid separation or partial separation between the front circuit layer 4 and the back circuit layer 6, avoid the possibility of generating similar new connection points or decoding points, and effectively reduce the possibility of electronic tags being decoded and revived due to the aforementioned reasons, that is, effectively reduce the decoding resurrection rate of electronic tags.

[0040] The thickness of the back circuit layer 6 is in the range of 5-50 μm (micrometers), and the thickness of the front circuit layer 4 is in the range of 40 μm-100 μm. Regardless of how the thickness of the two is selected, as long as the thickness of the back circuit layer 6 is less than that of the front circuit layer 4, the purpose of effectively reducing the decoding resurrection rate of the electronic tag can be achieved.

[0041] The insulating layer 5 is a hot melt adhesive layer, preferably an insulating glue, which is in a flowing liquid state when heated and used, and has both an insulating effect and a bonding effect on the front circuit layer 4 and the back circuit layer 6.

[0042] The metal layer of the front circuit layer 4 and the metal layer of the back circuit layer 6 are preferably aluminum foil layers, and may also be other metal layers, such as copper foil layers.

[0043] The present embodiment 1 is not only applicable to EAS tags, but also applicable to RFID tags.

[0044] Specific embodiment 2, see Figures 5 to 9 , this embodiment 2 provides an electronic tag with a low decoding revival rate. This embodiment 2 is basically the same as embodiment 1, except that: the width 6-2 of the metal layer forming the capacitor plate on the back circuit layer is smaller than the width 4-2 of the metal layer forming the capacitor plate at the corresponding position on the front circuit layer, that is, when the front circuit layer 4 and the back circuit layer 6 arranged on both sides of the insulating layer 5 are correspondingly fitted, no matter how the width 4-1 of the metal layer forming the capacitor plate on the front circuit layer 4 changes (for example, the width is always the same size, or the width gradually decreases from the outside to the inside), it is always larger than the width 6-2 of the metal layer forming the capacitor plate on the back circuit layer 6 at the corresponding positions of the two.

[0045] In this embodiment 2, the width 6-2 of the metal layer forming the capacitor plate on the back circuit layer ranges from 2.5mm (millimeter) to 9mm, and the width 4-2 of the metal layer forming the capacitor plate at the corresponding position on the front circuit layer ranges from 3mm to 10mm. No matter how the thickness of the metal layers of the two are selected, as long as the width 4-2 of the metal layer forming the capacitor plate on the front circuit layer 4 is always greater than the width 6-2 of the metal layer forming the capacitor plate on the back circuit layer 6 at the corresponding positions of the two, the purpose of effectively reducing the decoding resurrection rate of the electronic tag can be achieved.

[0046] The design that the width 6-2 of the metal layer forming the capacitor plate on the back circuit layer is smaller than the width 4-2 of the metal layer forming the capacitor plate at the corresponding position on the front circuit layer can effectively reduce the decoding recovery rate of the electronic tag. When the hot melt adhesive layer (generally insulating glue is used) is heated, liquid and coated on the front circuit layer 4, the back circuit layer 6 is correspondingly attached to the front circuit layer 4. At this time, the area of ​​the front circuit layer 4 and the insulating glue thereon is larger than the back circuit layer 6, and the peripheral edge of the back circuit layer 6 and the excess insulating glue (that is, the peripheral edge of the front circuit layer 4 and not attached to the back circuit layer 6) are not connected. At this time, the excess insulating glue will be coated along the peripheral edges of the back circuit layer 6 until the portions 6-1 of the corresponding thickness along the peripheral edges of the back circuit layer 6 are also coated with insulating glue. At this time, an insulating layer 5 is also effectively established between the portions 6-1 of the corresponding thickness along the peripheral edges of the back circuit layer 6 and the portions 4-1 of the corresponding thickness along the peripheral edges of the front circuit layer 4, avoiding the possibility of similar new connection points or decoding points between the two, effectively reducing the possibility of the electronic tag being decoded and revived due to the aforementioned reasons, that is, further reducing the decoding revivification rate of the electronic tag.

[0047] Because the width 6-2 of the metal layer forming the capacitor plate on the back circuit layer is smaller than the width 4-2 of the metal layer forming the capacitor plate at the corresponding position on the front circuit layer, during processing, the metal layer forming the capacitor plate on the back circuit layer is generally located in the middle part of the metal layer forming the capacitor plate at the corresponding position on the front circuit layer. At this time, there is a certain distance between the edge parts of the back circuit layer 6 and the edge parts of the front circuit layer 4 at the corresponding position. This distance can also help avoid the possibility of similar new connection points or decoding points being generated between the corresponding thickness parts 6-1 of the edges of the back circuit layer 6 and the corresponding thickness parts 4-1 of the edges of the front circuit layer 4, effectively reducing the possibility of the electronic tag being decoded and revived due to the aforementioned reasons, that is, further reducing the decoding revivification rate of the electronic tag.

[0048] Specific embodiment 3, see Fig.10 , this embodiment 3 provides an electronic tag with a low decoding revival rate. This embodiment 3 is basically the same as embodiment 2, except that: the electronic tag with a low decoding revival rate also includes a first substrate layer and a second substrate layer, the first substrate layer is attached to the other side of the front circuit layer 4, and the second substrate layer is attached to the other side of the back circuit layer 6.

[0049] The first substrate layer is coated paper 1 or polyester film. In this embodiment 3, the first substrate layer is preferably coated paper 1, which is adhered to the other side of the front circuit layer 4 through the first glue 2; the second substrate layer is base paper 10, which is adhered to the other side of the back circuit layer 6 through the third glue 9.

[0050] The first PET layer 8 and the second PET layer 3 are sequentially laminated between the base paper 10 and the back circuit layer 6, that is, the second PET layer 3 is laminated between the first PET layer 8 and the back circuit layer 6. The function of the second PET layer 3 is that before the back circuit layer 6 and the front circuit layer 4 are arranged at the positions corresponding to the two sides of the insulating layer 5, the back circuit layer 6 is first laminated on the second PET layer 3 through the fourth glue 11 (for example, Rohm and Haas (ADCOTE) 502S solvent-based adhesive), and the second PET layer 3 serves as a supporting part to support the back circuit layer 6, so as to facilitate the punching of the front circuit layer 4 and the back circuit layer 6 during the processing, and then the front circuit layer 4 and the insulating layer 5 are laminated to the back circuit layer 6 position correspondingly, so that the back circuit layer 6 and the front circuit layer 4 are arranged at the positions corresponding to the two sides of the insulating layer 5.

[0051] The first PET layer 8 is firstly bonded to the second PET layer 3 on one side through the second glue 7 to indirectly bond the back circuit layer 6, and then the other side of the first PET layer 8 is bonded to the base paper 10 through the third glue 9. The function of the first PET layer 8 is that when the back circuit layer 6 and the front circuit layer 4 are correspondingly arranged on both sides of the insulating layer 5, the back circuit layer 6 is indirectly bonded to the first PET layer 8, and the first PET layer 8 plays a supporting role, helping to set connection points or decoding points at corresponding positions of the front circuit layer 4 and the back circuit layer 6, that is, the first PET layer 8 serves as a supporting part and also plays a transition role during die-cutting, helping the front circuit layer 4 and the back circuit layer 6 to process the connection points or decoding points.

[0052] The first PET layer 8 can also be made of lightly coated paper.

[0053] Specific embodiment 4, see Fig.11 This embodiment 4 provides an electronic tag with a low decoding recovery rate. This embodiment 4 is basically the same as embodiment 3, except that:

[0054] The electronic tag with a low decoding resurrection rate also includes a first substrate layer and a second substrate layer, the first substrate layer is coated paper or polyester film, and in this embodiment 4, the first substrate layer is preferably coated paper 1, which is attached to the other side of the back circuit layer 6 through a first glue 2, and the second substrate layer is a base paper 10, which is attached to the other side of the front circuit layer 4 through a third glue 9;

[0055] A first PET layer 8 is also bonded between the base paper 10 and the front circuit layer 4, that is, one side of the first PET layer 8 is bonded to the other side of the front circuit layer 4 through the second glue 7. At this time, the base paper 10 is bonded to the other side of the first PET layer 8 through the third glue 9, and the base paper 10 is indirectly bonded and connected to the other side of the front circuit layer 4.

[0056] A second PET layer 3 is also bonded between the coated paper 1 and the back circuit layer 6, that is, one side of the second PET layer 3 is bonded to the other side of the back circuit layer 6 through the fourth glue 11. At this time, the coated paper 1 is bonded to the other side of the second PET layer 3 through the first glue 2, and the coated paper 1 is indirectly bonded and connected to the other side of the back circuit layer 6.

[0057] Embodiment 3 and Embodiment 4 are different because the front circuit layer 4, the insulating layer 5 and the back circuit layer 6 are swapped in their up-down positions as a whole after being bonded together, forming two structural differences and a change in the bonding position of the first PET layer 8 and the second PET layer 3. However, this does not affect the role played by the first PET layer 8 and the second PET layer 3, and ultimately can still achieve the purpose of reducing the label resurrection rate by using an electronic tag with a low decoding resurrection rate in this patent.

[0058] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. An electronic tag with a low decoding recovery rate, comprising an insulating layer and a front circuit layer and a back circuit layer arranged on both sides of the insulating layer; the back circuit layer is a capacitor layer that mainly forms a capacitor plate portion; connection points or decoding points are also arranged at corresponding positions of the front circuit layer and the back circuit layer; characterized in that: The front circuit layer and the back circuit layer are both metal layers, and the thickness of the back circuit layer is less than that of the front circuit layer. The back circuit layer is thinner than the front circuit layer, and the back circuit layer is softer than the front circuit layer. The thinner and softer back circuit layer is more closely attached to the front circuit layer through the insulating layer to avoid separation or partial separation between the front circuit layer and the back circuit layer to generate new connection points or decoding points; The width of the metal layer forming the capacitor plate on the back circuit layer is smaller than the width of the metal layer forming the capacitor plate at the corresponding position on the front circuit layer.

2. The electronic tag with low decoding recovery rate according to claim 1, characterized in that: The insulating layer is a hot melt adhesive layer.

3. The electronic tag with low decoding recovery rate according to claim 1, characterized in that: An insulating layer is coated on the thickness portion of the four edges of the back circuit layer.

4. An electronic tag with a low decoding recovery rate according to claim 1, 2 or 3, characterized in that: The back circuit layer has a thickness of 5-50 μm.

5. The electronic tag with low decoding recovery rate according to claim 4, characterized in that: The thickness of the front circuit layer is 40um-100μm.

6. The electronic tag with low decoding recovery rate according to claim 5, characterized in that: The metal layer of the front circuit layer and the metal layer of the back circuit layer are aluminum foil layers.

7. The electronic tag with low decoding recovery rate according to claim 6, characterized in that: The electronic tag with a low decoding resurrection rate also includes a first substrate layer and a second substrate layer. The first substrate layer is coated paper or polyester film, which is glued to the other side of the front circuit layer, and the second substrate layer is base paper, which is glued to the other side of the back circuit layer.

8. The electronic tag with low decoding recovery rate according to claim 7, characterized in that: A first PET layer and a second PET layer are sequentially laminated between the base paper and the back circuit layer. Before the back circuit layer and the front circuit layer are correspondingly arranged on both sides of the insulating layer, the back circuit layer is laminated on the second PET layer. The second PET layer is used to support the back circuit layer to facilitate punching and then the front circuit layer and the insulating layer are laminated to the back circuit layer accordingly. One side of the first PET layer is bonded to the second PET layer to indirectly bond the back circuit layer, and the other side of the first PET layer is bonded to the base paper. When the back circuit layer and the front circuit layer are correspondingly arranged on both sides of the insulating layer, the first PET layer supports the back circuit layer and plays a transition role during die-cutting, helping to set connection points or decoding points at corresponding positions of the front circuit layer and the back circuit layer.

9. The electronic tag with low decoding recovery rate according to claim 6, characterized in that: The electronic tag with a low decoding resurrection rate also includes a first substrate layer and a second substrate layer. The first substrate layer is coated paper or polyester film, which is glued to the other side of the back circuit layer, and the second substrate layer is base paper, which is glued to the other side of the front circuit layer.

10. The electronic tag with low decoding recovery rate according to claim 9, characterized in that: A first PET layer is also laminated between the base paper and the front circuit layer, and a second PET layer is also laminated between the coated paper or polyester film and the back circuit layer.

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