Coaxial gas-liquid assisted laser processing device and method

Abstract

The present invention discloses a coaxial gas-liquid assisted laser processing device and method, the device comprising a laser processing head, a water / gas inlet mechanism and an adjustment mechanism. The laser processing head irradiates a processing laser to a workpiece to be processed, and the water / gas inlet mechanism guides the auxiliary liquid or auxiliary gas into the laser processing head, and then ejects it synchronously with the laser; the adjustment mechanism adjusts the position of the laser processing head so that the laser emitted from the laser processing head is located at the center of the auxiliary liquid or auxiliary gas, and is parallel to the ejection direction of the auxiliary liquid or auxiliary gas, thereby realizing rapid switching between gas-assisted laser processing and liquid-assisted laser processing. The through hole formed by gas-assisted laser processing can become a channel for removing liquid and impurities during liquid-assisted laser processing, and impurities such as heat-affected zone and slag can be effectively removed during liquid-assisted laser processing. The processing device is small in size and easy to operate, and the heat-affected zone generated during laser processing is small, the processing quality is high, and the processing efficiency is high.

Description

Technical Field

[0001] The invention relates to the field of laser processing, and in particular to a coaxial gas-liquid assisted laser processing device and method. Background Art

[0002] Laser processing refers to the use of the thermal effect generated by projecting a laser beam onto the surface of a material to complete the processing process, including laser welding, laser engraving and cutting, surface modification, laser marking, laser drilling and micromachining.

[0003] Conventional pulse laser processing is prone to sputtering, slag, heat-affected zone, microcracks and other defects, which affect the application of conventional pulse lasers in the field of high-end laser microprocessing. Therefore, laser microprocessing generally uses short-pulse lasers such as nanosecond lasers combined with high-speed scanning galvanometers for processing. Nanosecond laser pulses have high energy and high processing efficiency, but there is a processing heat-affected zone of about 10μm to 20μm. In addition, the high-speed and high-temperature impurities splashed during laser processing will collide with the scanning galvanometer lens and contaminate the lens, which may cause damage to the lens.

[0004] In the prior art, gas-assisted laser processing is used to remove impurities generated during the laser processing, but the heat-affected zone generated by this processing method cannot be eliminated; another method in the prior art is to use liquid-assisted laser processing, which can effectively eliminate the heat-affected zone generated during the laser processing, but the impurities and residues generated during the processing cannot be discharged. Summary of the invention

[0005] In view of this, the present invention provides a coaxial gas-liquid assisted laser processing device, which can effectively reduce the heat affected zone generated during laser processing, facilitate the discharge of impurities, and has the advantages of good processing quality and high processing efficiency.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A coaxial gas-liquid assisted laser processing device, comprising:

[0008] A laser processing head, used for irradiating a processing laser beam to a workpiece to be processed;

[0009] A water / gas inlet mechanism, which is arranged outside the laser processing head and extends into the laser processing head, and is used to guide the auxiliary liquid or auxiliary gas into the laser processing head and then eject it synchronously with the laser beam; and

[0010] The adjustment mechanism is arranged on the top of the laser processing head and is used to adjust the position of the laser processing head so that the laser beam from the laser processing head is located at the center of the auxiliary liquid or auxiliary gas and is parallel to the ejection direction of the auxiliary liquid or auxiliary gas.

[0011] As a further solution of the present invention: the laser processing head comprises: a housing, a window piece and a nozzle;

[0012] The shell is an upwardly opened shell, the window piece is arranged at the upper opening in the shell, the nozzle is arranged at the bottom of the shell, and the nozzle is communicated with the inside of the shell;

[0013] The laser beam enters the laser processing head through the window piece and is emitted to the workpiece to be processed through the nozzle of the laser processing head.

[0014] As a further solution of the present invention: the laser processing head further comprises: a guide tube, which is sleeved in the nozzle and is used to allow the auxiliary liquid to be stably sprayed out from the nozzle.

[0015] As a further solution of the present invention: the laser processing head also includes: an exhaust port, which is arranged in the shell and located at the lower side of the window piece, and is used to release the gas in the shell to prevent bubbles from accumulating on the surface of the window piece.

[0016] As a further solution of the present invention: the water / air inlet mechanism comprises: a water / air inlet pipe and a water / air inlet channel;

[0017] The water / air inlet pipe is arranged outside the shell and extends through the shell to the inside of the shell;

[0018] The water / air inlet channel is a cavity in the shell and a channel extending to the nozzle.

[0019] As a further solution of the present invention: the adjustment mechanism comprises: an adjustment frame, a first thread pair, a tension spring, a second thread pair and a spring ejector pin;

[0020] At least two sets of first thread pairs are arranged in the Z direction of the adjustment frame, and at least one tension spring is arranged at the connection between the adjustment frame and the laser processing head for adjusting the Z direction and the horizontal angle to ensure that the laser beam emitted from the nozzle is parallel to the ejection direction of the laminar liquid;

[0021] The adjustment frame is provided with a set of second thread pairs in the X and Y directions, and the opposite surfaces of the second thread pairs are provided with a spring ejector pin for adjustment in the X and Y directions to ensure that the laser beam emitted from the nozzle is at the center of the laminar liquid.

[0022] As a further solution of the present invention: the device further comprises: a lifting mechanism, the lifting mechanism being arranged outside the side wall of the laser processing head and being used to adjust the distance between the end of the laser processing head and the workpiece to be processed;

[0023] The lifting mechanism comprises: a main body, a sliding pin, an adjusting knob and a centering shaft;

[0024] The main body is sleeved outside the laser processing head, the centering shaft is fixedly arranged on the main body, an adjusting knob is arranged outside the centering shaft, and a movable sliding groove passing through the center of the adjusting knob is arranged inside the adjusting knob;

[0025] The main body is provided with a vertical fixed slide groove, and the adjusting knob is provided with a sliding pin. When the adjusting knob is rotated, the sliding pin moves up and down in the clamping groove of the movable slide groove in the direction of the fixed slide groove;

[0026] The sliding pin passes through the side wall of the main body and extends into the laser processing head in the main body.

[0027] As a further solution of the present invention: the lifting mechanism further comprises: a self-lubricating ring for reducing the friction during the lifting and lowering of the laser processing head;

[0028] The self-lubricating ring is arranged on the outer wall of the housing.

[0029] As a further solution of the present invention: the lifting mechanism further comprises: a locking screw for fixing the relative position of the laser processing head and the main body to prevent the laser processing head from sliding down;

[0030] The locking screw is arranged on the main body, and the end of the locking screw abuts against the shell.

[0031] As a further solution of the present invention: a coaxial gas-liquid assisted laser processing method comprises the following steps:

[0032] Step 1, placing the workpiece to be processed at the focal position of the gas-assisted laser processing, and adjusting the adjustment mechanism so that the laser beam is at the center of the laminar liquid, and the emission direction of the laser beam is parallel to the ejection direction of the laminar liquid;

[0033] Step 2: Using gas-assisted laser processing technology, a through hole with a size smaller than the target size is obtained at the workpiece to be processed;

[0034] Step 3: Place the workpiece to be processed at the focal position of the liquid-assisted laser processing, and adjust the lifting mechanism so that the distance between the end of the laser processing head and the workpiece to be processed is within 10 mm-20 mm;

[0035] Step 4: Use liquid-assisted laser processing technology to obtain a through hole of a target size at the position to be processed on the workpiece.

[0036] As a further solution of the present invention:

[0037] The beneficial effects of the present invention include but are not limited to:

[0038] (1) The coaxial gas-liquid assisted laser processing device provided by the present invention has a laser processing head, a water / gas inlet mechanism, and an adjustment mechanism. The laser processing head irradiates the workpiece to be processed with a processing laser beam. The water / gas inlet mechanism guides the auxiliary liquid or auxiliary gas into the laser processing head and then ejects it synchronously with the laser beam. The adjustment mechanism adjusts the position of the laser processing head so that the laser beam coming out of the laser processing head is located at the center of the auxiliary liquid or auxiliary gas and is parallel to the ejection direction of the auxiliary liquid or auxiliary gas. Rapid switching between gas-assisted laser processing and liquid-assisted laser processing is achieved. The through hole formed by gas-assisted laser processing can become a channel for removing liquid and impurities during liquid-assisted laser processing, effectively improving the processing efficiency during liquid-assisted laser processing. During liquid-assisted laser processing, impurities such as the heat-affected zone and slag generated during gas-assisted laser processing can be effectively removed, and finally the target size can be accurately processed.

[0039] (2) Furthermore, the present invention ensures that when switching from gas-assisted laser processing to liquid-assisted laser processing, when the refractive index of the auxiliary liquid is greater than the refractive index of the auxiliary gas, the focal length of the laser beam entering the liquid becomes longer, and the laminar liquid becomes longer. If not adjusted, the laminar liquid will diverge, affecting the effect of laser processing. By adjusting the lifting mechanism, the distance between the end of the laser processing head and the workpiece can be shortened to avoid the divergence of the laminar liquid.

[0040] (3) Compared with single gas-assisted laser processing technology and single liquid-assisted laser processing technology, the heat-affected zone generated during the laser processing of the present invention is small, the processing quality is high, and the processing efficiency is high.

[0041] (4) The processing device of the present invention has the characteristics of small size and easy operation, and can realize rapid switching between gas-assisted laser processing and liquid-assisted laser processing, which greatly reduces manpower and material costs and further improves processing efficiency and production benefits. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 It is a structural schematic diagram of a coaxial gas-liquid assisted laser processing device provided in Example 1 of the present invention;

[0043] Figure 2 is a schematic diagram of the appearance of a coaxial gas-liquid assisted laser processing device provided in Example 1 of the present invention;

[0044] Figure 3 It is a lifting mechanism and an exploded schematic diagram provided in Example 1 of the present invention;

[0045] Figure 4 It is a schematic diagram of the working principle of realizing the lifting and lowering of the laser processing head when the sliding pin in the lifting mechanism provided by Embodiment 1 of the present invention is in different positions;

[0046] In the figure: 1-shell; 2-window; 3-water / air inlet; 4-nozzle; 5-guide tube; 6-main body; 7-adjustment frame; 8-first thread pair; 9-second thread pair; 10-spring ejector pin; 11-slide pin; 12-adjustment knob; 13-centering shaft; 14-locking screw; 15-first sealing ring; 16-threaded ring; 17-protection gasket; 18-self-lubricating ring; 19-exhaust port; 20-tension spring; 21-fixed slide groove; 22-quick-plug interface; 23-second sealing ring. DETAILED DESCRIPTION

[0047] The present invention is described in detail below in conjunction with embodiments, but the present invention is not limited to these embodiments.

[0048] like Figure 1 , Figure 2 and Figure 3 As shown, a coaxial gas-liquid assisted laser processing device comprises:

[0049] A laser processing head, used for irradiating a processing laser beam to a workpiece to be processed;

[0050] A water / gas inlet mechanism, which is arranged outside the laser processing head and extends into the laser processing head, and is used to guide the auxiliary liquid or auxiliary gas into the laser processing head and then eject it synchronously with the laser beam; and

[0051] The adjustment mechanism is arranged on the top of the laser processing head and is used to adjust the position of the laser processing head so that the laser beam from the laser processing head is located at the center of the auxiliary liquid or auxiliary gas and is parallel to the ejection direction of the auxiliary liquid or auxiliary gas.

[0052] The laser processing head includes: a housing 1, a window piece 2 and a nozzle 4;

[0053] The shell 1 is an upwardly opened shell 1, the window piece 2 is arranged at the upper opening in the shell 1, the nozzle 4 is arranged at the bottom of the shell 1, and the nozzle is communicated with the inside of the shell; the laser beam enters the laser processing head through the window piece 2, and is emitted to the workpiece to be processed through the nozzle 4 of the laser processing head.

[0054] The laser processing head further comprises: a flow guide tube 5 , which is sleeved in the nozzle 4 and is used to allow the auxiliary liquid to be stably sprayed out from the nozzle 4 .

[0055] The laser processing head also includes an exhaust port 19, which is arranged in the housing 1 and located at the lower side of the window piece 2, and is used to release the gas in the housing 1 to prevent bubbles from accumulating on the surface of the window piece 2 and improve the transmittance of the laser beam.

[0056] The water / air inlet mechanism comprises: a water / air inlet pipe 3 and a water / air inlet channel;

[0057] The water / air inlet pipe 3 is arranged outside the housing 1 and extends through the housing 1 to the inside of the housing 1;

[0058] The water / air inlet passage is a cavity in the housing 1 and a passage extending to the nozzle 4 .

[0059] The adjustment mechanism includes: an adjustment frame 7, a first thread pair 8, a tension spring 20, a second thread pair 9, and a spring ejector pin 10;

[0060] At least two sets of first thread pairs 8 are arranged in the Z direction of the adjustment frame 7, and at least one tension spring 20 is arranged at the connection between the adjustment frame 7 and the laser processing head for adjusting the Z direction and the horizontal angle to ensure that the laser beam emitted from the nozzle is parallel to the ejection direction of the laminar liquid;

[0061] A set of second thread pairs 9 is respectively arranged in the X and Y directions of the adjustment frame 7, and a spring ejector pin 10 is respectively arranged on the opposite surface of the second thread pairs for adjustment in the X and Y directions to ensure that the laser beam emitted from the nozzle is at the center of the laminar liquid.

[0062] Furthermore, the first thread pair 8 and the second thread pair 9 are ultra-fine thread pairs, composed of a high-strength steel screw and a copper sleeve, and adopt a 0.25mm or 0.35mm pitch, which can provide higher fine adjustment.

[0063] In addition, when switching from gas-assisted laser processing to liquid-assisted laser processing, when the refractive index of the auxiliary liquid is greater than the refractive index of the auxiliary gas, the focal length of the laser beam entering the liquid becomes longer, and the laminar liquid becomes longer. If the distance from the end of the laser processing head to the workpiece to be processed is not adjusted, the laminar liquid will diverge, affecting the effect of laser processing. Therefore, the device of the present invention also includes a lifting mechanism arranged outside the side wall of the laser processing head, which is used to adjust the distance between the end of the laser processing head and the workpiece to be processed;

[0064] The lifting mechanism of the present invention is designed based on the principle of the guide rod slider mechanism, and the lifting mechanism specifically includes: a main body 6, a sliding pin 11, an adjusting knob 12 and a centering shaft 13;

[0065] The main body 6 is sleeved outside the laser processing head, and the centering shaft 13 is fixedly arranged on the main body 6. The centering shaft 13 is provided with an adjusting knob 12 on its outer sleeve, and the adjusting knob 12 is provided with a movable slide groove passing through its center;

[0066] The main body 6 is provided with a vertical fixed slide groove 21, and a slide pin 11 is provided in the adjusting knob 12. When the adjusting knob 12 is turned, the slide pin 11 moves up and down in the clamping groove of the movable slide groove in the direction of the fixed slide groove 21;

[0067] The sliding pin 11 passes through the side wall of the main body 6 and extends into the laser processing head in the main body 6 .

[0068] When in use, the adjusting knob 12 is turned, and the adjusting knob 12 rotates around the centering shaft 13, and the sliding pin 11 can move in the fixed sliding groove 21 and the movable sliding groove at the same time, and the sliding pin 11 drives the laser processing head to achieve lifting and moving. Furthermore, a scale line is provided on the side of the adjusting knob 12 to facilitate observation and fine adjustment of the height of the laser processing head. The working principle of the lifting mechanism to achieve lifting and lowering of the laser processing head when the sliding pin 11 is in different positions is as follows Figure 4 shown.

[0069] In the present invention, the lifting mechanism further comprises: a self-lubricating ring 18 arranged on the outer wall of the housing 1, which is used to reduce the friction force during the lifting process of the laser processing head.

[0070] The lifting mechanism also includes: a locking screw 14, which is used to fix the relative position of the laser processing head and the main body 6 to prevent the laser processing head from sliding down;

[0071] Specifically, the locking screw 14 is disposed on the main body 6 , and the end of the locking screw 14 is pressed against the housing 1 , so that the thrust of the locking screw 14 on the housing 1 is used to prevent the laser processing head from sliding down.

[0072] The coaxial gas-liquid assisted laser processing device provided by the present invention has a laser processing head, a water / gas inlet mechanism, and an adjustment mechanism. The laser processing head irradiates the workpiece to be processed with a processing laser beam. The water / gas inlet mechanism guides the auxiliary liquid or auxiliary gas into the laser processing head and ejects it synchronously with the laser beam. The adjustment mechanism adjusts the position of the laser processing head so that the laser beam coming out of the laser processing head is located at the center of the auxiliary liquid or auxiliary gas and is parallel to the ejection direction of the auxiliary liquid or auxiliary gas. Rapid switching between gas-assisted laser processing and liquid-assisted laser processing is achieved. The through hole formed by gas-assisted laser processing can become a channel for removing liquid and impurities during liquid-assisted laser processing, effectively improving the processing efficiency during liquid-assisted laser processing. During liquid-assisted laser processing, impurities such as the heat-affected zone and slag generated during gas-assisted laser processing can be effectively removed, and finally the target size can be accurately processed.

[0073] A coaxial gas-liquid assisted laser processing method comprises the following steps:

[0074] Step 1, placing the workpiece to be processed at the focal position of the gas-assisted laser processing, and adjusting the adjustment mechanism so that the laser beam is at the center of the laminar liquid, and the emission direction of the laser beam is parallel to the ejection direction of the laminar liquid;

[0075] Step 2: Using gas-assisted laser processing technology, a through hole with a size smaller than the target size is obtained at the workpiece to be processed;

[0076] Step 3: Place the workpiece to be processed at the focal position of the liquid-assisted laser processing, and adjust the lifting mechanism so that the distance between the end of the laser processing head and the workpiece to be processed is within 10 mm-20 mm;

[0077] Step 4: Use liquid-assisted laser processing technology to obtain a through hole of a target size at the position to be processed on the workpiece.

[0078] Specifically, in step 2, the solenoid valve of the air supply line is opened while the solenoid valve of the liquid supply line is kept closed, and the gas enters the laser processing head from the water / air inlet pipe 3 and is ejected from the nozzle 4. The gas line pressure is set to 0.1MPa~1MPa. Turn on the laser beam, and the scanning galvanometer moves according to the set scanning path, changing the laser beam to irradiate the position of the workpiece to be processed, so as to obtain a through hole with a size about 0.1~1mm smaller than the target size. The edge of the hole may have a heat-affected zone of about 1μm~100μm. After the processing is completed, close the solenoid valve of the air supply line.

[0079] In step 4, the solenoid valve of the liquid supply pipeline is opened and maintained for 1 to 10 seconds to exhaust the gas in the laser processing head and form a stable laminar liquid at the nozzle 4. The pressure of the liquid pipeline can be set to 0.1MPa to 1MPa. Turn on the laser beam, and the scanning galvanometer moves according to the set scanning path, changing the position of the laser beam irradiated to the workpiece to be processed, and adjusting the distance between the laser processing head and the workpiece to obtain the hole type with the final size requirements. In this way, the heat-affected zone of about 1μm to 100μm in size generated in step 2 is also removed in this process, and a high-precision, low-damage hole type with basically no heat-affected zone is obtained. After the processing is completed, close the solenoid valve of the liquid supply pipeline.

[0080] The coaxial gas-liquid assisted laser processing method provided by the present invention can realize rapid switching between gas-assisted laser processing and liquid-assisted laser processing by switching the gas supply pipeline and the liquid supply pipeline, adjusting the position of the workpiece to be processed, and adjusting the distance between the end of the laser processing head and the workpiece. The through hole formed by the gas-assisted laser processing can become a channel for removing liquid and impurities during liquid-assisted laser processing, effectively improving the processing efficiency during liquid-assisted laser processing, and the heat-affected zone, slag and other impurities generated during gas-assisted laser processing can be effectively removed during liquid-assisted laser processing, and finally accurately processed to the target required size. The method of the present invention is simple, easy to operate, safe and reliable, can realize laser three-dimensional processing with large depth and high efficiency, and has good processing quality, and has broad application prospects.

[0081] Example:

[0082] This embodiment is a specific coaxial gas-liquid assisted laser processing device, such as Figure 1 , Figure 2 and Figure 3As shown, it includes a laser processing head, a water / air inlet mechanism arranged outside the laser processing head and extending into the laser processing head, and an adjustment mechanism arranged on the top of the laser processing head, wherein the adjustment mechanism is coaxially arranged with the laser processing head.

[0083] The laser processing head comprises a housing 1 with an opening facing upward, a window sheet 2, a nozzle 4 and a flow guide tube 5.

[0084] The window sheet 2 is arranged at the upper opening of the housing 1, and a first sealing ring 15 is arranged at the connection between the upper surface of the window sheet 2 and the housing 1, which is used to ensure that the gas or liquid in the housing 1 does not overflow from the window sheet 2. In addition, a threaded ring 16 is arranged at the bottom of the window sheet 2, which is used to fix the window sheet 2 at the upper opening of the housing 1. In addition, in order to prevent the window sheet 2 from being damaged, a protective gasket 17 is arranged between the window sheet 2 and the threaded ring 16.

[0085] The nozzle 4 is arranged at the bottom of the housing 1, and the nozzle 4 is in communication with the interior of the housing 1, and the gas or liquid in the housing 1 flows out from the nozzle 4. Preferably, the nozzle 4 is funnel-shaped, and the funnel mouth is fixedly connected to the bottom of the side wall of the housing 1 through the second sealing ring 23. Further, in order to ensure the stability of the liquid laminar flow from the nozzle 4, the present invention is provided with a guide tube 5 inside the nozzle 4.

[0086] In addition, when the device is converted to liquid-assisted laser processing, if there is gas in the shell 1, bubbles are likely to accumulate on the surface of the window piece 2 to increase the laser transmittance, thereby affecting the laser processing process. In order to exhaust the gas in the shell 1, the present invention further provides an exhaust port 19 in the shell 1, located on the lower side of the window piece 2.

[0087] The water / air inlet mechanism comprises: a water / air inlet pipe 3 and a water / air inlet channel;

[0088] The water / air inlet pipe 3 is arranged outside the housing 1 and passes through the side wall of the housing 1 and extends into the housing 1. A quick-plug interface 22 is arranged at one end of the water / air inlet pipe 3 away from the housing 1, which is used to realize the rapid switching between the gas-assisted laser processing mode and the liquid-assisted laser processing mode. Furthermore, in order to make the gas or liquid entering the housing 1 more evenly distributed, it is preferred to arrange a water / air inlet pipe 3 on the opposite side walls of the housing 1 respectively.

[0089] The water / air inlet passage is a cavity in the housing 1 and a passage extending to the nozzle 4 .

[0090] The adjustment mechanism includes a square ring-shaped adjustment frame 7, a first thread pair 8, a tension spring 20, a second thread pair 9 and a spring ejector pin 10;

[0091] At least two first thread pairs 8 are arranged in the Z direction on the adjustment frame 7, and preferably, four first thread pairs 8 are evenly arranged on the circumference of the adjustment frame 7. In addition, a through hole is arranged in the vertical direction in the adjustment frame 7, and a fixing hook is arranged in the through hole. A tension spring 20 is arranged between the adjustment frame 7 and the laser processing head, and one end of the tension spring 20 passes through the adjustment frame 7 and is fixed on the fixing hook, and the other end of the tension spring 20 is fixed on the housing 1. Preferably, the fixing hook and the tension spring 20 are arranged in the gap between two adjacent first thread pairs 8, and two groups of fixing hooks and tension springs 20 are evenly arranged in each gap. Through the first thread pairs 8 and the tension spring 20 in the vertical direction, it is ensured that the laser beam emitted from the nozzle is parallel to the ejection direction of the laminar liquid.

[0092] Two adjacent side walls of the adjustment frame 7 are respectively provided with a second thread pair 9 in the horizontal direction, and a spring ejector pin 10 is provided on the side wall opposite to each second thread pair 9. It is used for adjustment in the X and Y directions to ensure that the laser beam emitted from the nozzle is at the center of the laminar liquid.

[0093] In the present invention, the first thread pair 8 and the second thread pair 9 are composed of a steel screw and a copper sleeve, and the pitch is 0.25 mm, which can provide higher fine adjustment.

[0094] In the present invention, the gas-assisted laser processing method and the liquid-assisted laser processing method can be quickly switched, and the commonly used liquid is water. The refractive index of water 1.333 is greater than the refractive index of air 1, and the focal length of the laser beam entering the water will become longer. If the distance from the laser processing head to the workpiece is not adjusted, the end of the laser processing head will be too far away from the workpiece during water-assisted laser processing, and the water flow will be very long, which can easily cause the water flow to diverge. Therefore, the laminar water length cannot be set too long. In order to improve the stability of laminar water and reduce laser loss, it is appropriate for the end of the laser processing head to be 10 to 20 mm away from the workpiece. Based on this, the present invention sets a lifting mechanism for adjusting the distance from the laser processing head to the workpiece. The lifting mechanism includes a main body 6, a sliding pin 11, an adjustment knob 12 and a centering shaft 13;

[0095] The main body 6 is sleeved outside the laser processing head, and the centering shaft 13 is fixedly arranged on the main body 6. The centering shaft 13 is provided with an adjusting knob 12 on its outer sleeve, and the adjusting knob 12 is provided with a movable slide groove passing through its center;

[0096] The main body 6 is provided with a vertical fixed slide groove 21, and a slide pin 11 is provided in the adjusting knob 12. When the adjusting knob 12 is turned, the slide pin 11 moves up and down in the clamping groove of the movable slide groove in the direction of the fixed slide groove 21;

[0097] The sliding pin 11 passes through the side wall of the main body 6 and extends into the laser processing head in the main body 6 .

[0098] When in use, the adjusting knob 12 is turned, and the adjusting knob 12 rotates around the centering shaft 13, and the sliding pin 11 can move in the fixed sliding groove 21 and the movable sliding groove at the same time, and the sliding pin 11 drives the laser processing head to achieve lifting and moving. Furthermore, a scale line is provided on the side of the adjusting knob 12 to facilitate observation and fine adjustment of the height of the laser processing head. The working principle of the lifting mechanism to achieve lifting and lowering of the laser processing head when the sliding pin 11 is in different positions is as follows Figure 4 shown.

[0099] Furthermore, the lifting mechanism also includes: a self-lubricating ring 18 for reducing the friction during the lifting and lowering of the laser processing head;

[0100] The self-lubricating ring 18 is arranged on the outer wall of the housing 1 .

[0101] The lifting mechanism also includes: a locking screw 14, which is used to fix the relative position of the laser processing head and the main body 6 to prevent the laser processing head from sliding down;

[0102] Specifically, the locking screw 14 is disposed on the main body 6 , and the end of the locking screw 14 is pressed against the housing 1 , so that the thrust of the locking screw 14 on the housing 1 is used to prevent the laser processing head from sliding down.

[0103] The coaxial gas-liquid assisted laser processing device provided in this embodiment is provided with a laser processing head, a water / gas inlet mechanism, and an adjustment mechanism. The laser processing head irradiates the processing laser beam to the workpiece to be processed. The water / gas inlet mechanism guides the auxiliary liquid or auxiliary gas into the laser processing head and then ejects it synchronously with the laser beam. The adjustment mechanism adjusts the position of the laser processing head so that the laser beam coming out of the laser processing head is located at the center of the auxiliary liquid or auxiliary gas and is parallel to the ejection direction of the auxiliary liquid or auxiliary gas. Rapid switching between gas-assisted laser processing and liquid-assisted laser processing is achieved. The through hole formed by gas-assisted laser processing can become a channel for removing liquid and impurities during liquid-assisted laser processing, effectively improving the processing efficiency during liquid-assisted laser processing. During liquid-assisted laser processing, impurities such as the heat-affected zone and slag generated during gas-assisted laser processing can be effectively removed, and finally the target size can be accurately processed.

[0104] The above are only several embodiments of the present invention and are not intended to limit the present invention in any form. Although the present invention is disclosed as above in the form of a preferred embodiment, it is not intended to limit the present invention. Any technician familiar with the profession, without departing from the scope of the technical solution of the present invention, using the above disclosed technical content to make slight changes or modifications are equivalent to equivalent implementation cases and fall within the scope of the technical solution.

Claims

1. A coaxial gas-liquid assisted laser processing device, characterized in that: The device comprises: A laser processing head is used to irradiate a processing laser beam to a workpiece to be processed; the laser processing head comprises: a shell, a window sheet and a nozzle; the shell is a shell with an opening facing upward, the window sheet is arranged at the upper opening in the shell, the nozzle is arranged at the bottom of the shell, and the nozzle is communicated with the inside of the shell; the laser beam enters the laser processing head through the window sheet, and is emitted to the workpiece to be processed through the nozzle of the laser processing head; A water / gas inlet mechanism, which is arranged outside the laser processing head and extends into the laser processing head, and is used to guide the auxiliary liquid or auxiliary gas into the laser processing head and then eject it synchronously with the laser beam; and An adjustment mechanism is arranged on the top of the laser processing head and is coaxially arranged with the laser processing head, and is used to adjust the position of the laser processing head so that the laser beam emitted from the laser processing head is located at the center of the auxiliary liquid or the auxiliary gas and is parallel to the ejection direction of the auxiliary liquid or the auxiliary gas; A lifting mechanism, the lifting mechanism is arranged outside the side wall of the laser processing head and is used to adjust the distance between the end of the laser processing head and the workpiece to be processed; The lifting mechanism comprises: a main body, a sliding pin, an adjusting knob and a centering shaft; The main body is sleeved outside the laser processing head, the centering shaft is fixedly arranged on the main body, an adjusting knob is arranged outside the centering shaft, and a movable sliding groove passing through the center of the adjusting knob is arranged inside the adjusting knob; The main body is provided with a vertical fixed slide groove, and the adjusting knob is provided with a sliding pin. When the adjusting knob is rotated, the sliding pin moves up and down in the clamping groove of the movable slide groove in the direction of the fixed slide groove; The sliding pin passes through the side wall of the main body and extends into the laser processing head in the main body.

2. The coaxial gas-liquid assisted laser processing device according to claim 1, characterized in that: The laser processing head further comprises: a guide tube, which is sleeved in the nozzle and is used to allow the auxiliary liquid to be stably sprayed out from the nozzle.

3. The coaxial gas-liquid assisted laser processing device according to claim 1, characterized in that: The laser processing head further comprises: an exhaust port, which is arranged in the housing and located at the lower side of the window piece, and is used to release the gas in the housing to prevent bubbles from accumulating on the surface of the window piece.

4. The coaxial gas-liquid assisted laser processing device according to claim 1, characterized in that: The water / air inlet mechanism comprises: a water / air inlet pipe and a water / air inlet channel; The water / air inlet pipe is arranged outside the shell and extends through the shell to the inside of the shell; The water / air inlet channel is a cavity in the shell and a channel extending to the nozzle.

5. The coaxial gas-liquid assisted laser processing device according to claim 1, characterized in that: The adjustment mechanism comprises: an adjustment frame, a first thread pair, a tension spring, a second thread pair and a spring ejector pin; At least two sets of first thread pairs are arranged in the Z direction of the adjustment frame, and at least one tension spring is arranged at the connection between the adjustment frame and the laser processing head for adjusting the Z direction and the horizontal angle to ensure that the laser beam emitted from the nozzle is parallel to the ejection direction of the laminar liquid; The adjustment frame is provided with a set of second thread pairs in the X and Y directions, and the opposite surfaces of the second thread pairs are provided with a spring ejector pin for adjustment in the X and Y directions to ensure that the laser beam emitted from the nozzle is at the center of the laminar liquid.

6. The coaxial gas-liquid assisted laser processing device according to claim 1, characterized in that: The lifting mechanism also includes: a self-lubricating ring for reducing friction during the lifting and lowering of the laser processing head; The self-lubricating ring is arranged on the outer wall of the housing.

7. The coaxial gas-liquid assisted laser processing device according to claim 1, characterized in that: The lifting mechanism further includes: a locking screw for fixing the relative position of the laser processing head and the main body to prevent the laser processing head from sliding down; The locking screw is arranged on the main body, and the end of the locking screw abuts against the shell.

8. A coaxial gas-liquid assisted laser processing method based on the coaxial gas-liquid assisted laser processing device according to any one of claims 1 to 7, characterized in that: The following steps are involved: Step 1, placing the workpiece to be processed at the focal position of the gas-assisted laser processing, and adjusting the adjustment mechanism so that the laser beam is at the center of the laminar liquid, and the emission direction of the laser beam is parallel to the ejection direction of the laminar liquid; Step 2: Using gas-assisted laser processing technology, a through hole with a size smaller than the target size is obtained at the workpiece to be processed; Step 3: Place the workpiece to be processed at the focal position of the liquid-assisted laser processing, and adjust the lifting mechanism so that the distance between the end of the laser processing head and the workpiece to be processed is within 10 mm-20 mm; Step 4: Use liquid-assisted laser processing technology to obtain a through hole of a target size at the position to be processed on the workpiece.

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