A guiding mechanism and polishing equipment

Abstract

The present invention discloses a guide mechanism and a polishing device, and relates to the field of wafer manufacturing technology. The guide mechanism includes a base, a bearing, and a support rod arranged on the top of the base, the bearing is sleeved on the support rod, and the guide mechanism also includes an abutment component, the abutment component is fixedly connected to the top of the support rod, and the inner ring of the bearing is clamped and fixed between the abutment component and the base. When the base of the guide mechanism and the outer ring of the bearing are respectively connected to two relatively rotating parts, the guide mechanism is used as a relatively rotating medium between the two parts, so that the rotation guidance of the two rotating parts can be achieved, and the stable rotation of the two parts can be ensured. The polishing device includes a guide mechanism, and also includes a polishing wheel, a polishing assembly, and a connecting assembly. By connecting the base of the guide mechanism and the outer ring of the bearing to the relatively rotating polishing wheel and the connecting assembly, the rotation guidance of the polishing wheel and the connecting assembly is achieved, thereby ensuring that the polishing assembly rotates stably under the restriction of the connecting assembly.

Description

Technical Field

[0001] The invention relates to the technical field of wafer manufacturing, and in particular to a guiding mechanism and polishing equipment. Background Art

[0002] Chemical Mechanical Planarization (CMP) is a process that uses chemical corrosion and mechanical processing to smooth wafers or other substrate materials. The CMP process includes physical and chemical processes. The chemical process is a chemical reaction between the chemicals in the polishing liquid and the wafer, and a substance that is easier to remove is generated on the surface of the wafer, while the physical process uses the abrasive particles in the polishing liquid to physically rub against the surface of the wafer to form a smooth wafer by removing the surface material. However, during the physical friction process, the polishing head is prone to shaking, resulting in uneven polishing of the wafer surface, thus affecting product quality.

[0003] Therefore, how to improve the existing guide mechanism and polishing equipment to overcome the above problems is an urgent problem to be solved by those skilled in the art. Summary of the invention

[0004] The object of the present invention is to provide a guiding mechanism, which can realize rotational guiding between two relatively rotating parts and ensure the rotational stability thereof.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] A guiding mechanism, comprising:

[0007] Base;

[0008] A support rod, arranged on the top of the base;

[0009] A bearing, wherein the bearing is sleeved on the support rod; and

[0010] An abutment component is fixedly connected to the top of the support rod and clamps the inner ring of the bearing between the abutment component and the base.

[0011] Optionally, the dimension of the support rod along the axial direction is not greater than the axial dimension of the bearing;

[0012] The radial dimension of the abutment component is not greater than the outer ring raceway diameter of the bearing.

[0013] Optionally, the base comprises:

[0014] The first round table;

[0015] A frustum, the large diameter end of the frustum being connected to the first frustum; and

[0016] The second truncated cone is connected to the small diameter end of the frustum, the diameter of the second truncated cone is larger than the diameter of the support rod, and the bottom surface of the bearing is supported on the upper end of the second truncated cone.

[0017] Another object of the present invention is to provide a polishing device including the above-mentioned guide mechanism, which can be detachably connected to the polishing device to achieve stable rotation of the polishing head and ensure the polishing effect of the workpiece to be polished.

[0018] To achieve this object, the present invention adopts the following technical solutions:

[0019] A polishing device, comprising the above-mentioned guide mechanism, further comprising:

[0020] A polishing wheel, the polishing wheel being capable of rotating around its own axis, the polishing wheel being provided with a groove at its center, the base being fixed in the groove, and the bearing being at least partially exposed from the groove;

[0021] A polishing assembly, which is disposed above the polishing wheel and is used to press the workpiece to be polished onto the surface of the polishing wheel;

[0022] A connecting component, wherein the bottom end of the connecting component is sleeved on the outer side of the bearing, and the outer side of the bottom end of the connecting component cooperates with the polishing component to achieve the positioning of the polishing component.

[0023] Optionally, the polishing assembly comprises:

[0024] A polishing head, which is capable of pressing the workpiece to be polished onto the surface of the polishing wheel;

[0025] The first driving mechanism has an output end connected to the polishing head. The first driving mechanism can drive the polishing head to move in a vertical direction and rotate around the axis of the polishing head itself in the opposite direction relative to the polishing wheel.

[0026] Optionally, the connection component includes:

[0027] A processing wheel, sleeved on the outer ring of the bearing, the outer side of the processing wheel abuts against the polishing head;

[0028] The output end of the second driving mechanism is connected to the processing wheel, and the second driving mechanism can drive the processing wheel to rotate in the opposite direction relative to the polishing head, so that the processing wheel rotates in coordination with the polishing head.

[0029] Optionally, the outer side of the processing wheel is arranged as an elastic part, and the outer side of the elastic part can abut against the polishing head.

[0030] Optionally, the polishing assembly further comprises:

[0031] A carrier plate is arranged on the bottom surface of the polishing head, and the carrier plate can fix the workpiece to be polished so as to realize polishing of the workpiece to be polished by the polishing head.

[0032] Optionally, the polishing equipment also includes a top plate, the top end of the connecting component is fixed at the center position of the bottom surface of the top plate, and multiple polishing components are provided, and the multiple polishing components are arranged at intervals around the circumference of the connecting component and connected to the bottom surface of the top plate.

[0033] Optionally, the polishing device further comprises a flushing component, which is capable of flushing the surface of the polishing wheel.

[0034] Beneficial effects of the present invention:

[0035] The present invention provides a guide mechanism and a polishing device, wherein the guide mechanism comprises a base, a bearing and a support rod arranged on the top of the base, the bearing is sleeved on the support rod, and the guide mechanism further comprises an abutment component, the abutment component is fixedly connected to the top of the support rod, and the inner ring of the bearing is clamped and fixed between the abutment component and the base. When the base of the guide mechanism and the outer ring of the bearing are respectively connected to two relatively rotating components, the guide mechanism is used as a relatively rotating medium between the two components, so that the rotation guide of the two rotating components can be realized, and the stable rotation of the two components can be ensured.

[0036] The polishing device includes a guide mechanism and a polishing wheel. The base of the guide mechanism is fixed in a groove at the center of the polishing wheel, and the bearing is at least partially exposed in the groove. The polishing wheel can rotate around its own axis, thereby driving the guide mechanism to rotate along its own axis. The polishing device also includes a polishing assembly and a connecting assembly. The polishing assembly is arranged above the polishing wheel and is used to press the workpiece to be polished onto the surface of the polishing wheel. Since the bearing is at least partially exposed in the groove, the bottom end of the connecting assembly is sleeved on the outside of the bearing, and the outside of the bottom end of the connecting assembly cooperates with the polishing assembly. By connecting the base of the guide mechanism and the outer ring of the bearing to the relatively rotating polishing wheel and the connecting assembly respectively, the rotational guidance of the polishing wheel and the connecting assembly is realized, and the outside of the connecting assembly cooperates with the polishing assembly, so that the polishing assembly can rotate stably under the restriction of the connecting assembly.

[0037] At the same time, the connecting assembly and the polishing assembly both rotate in opposite directions relative to each other under the action of the driving component, so the connecting assembly and the polishing assembly can rotate in coordination, avoiding the situation where the polishing assembly does not rotate, ensuring smooth polishing of the workpiece to be polished and improving the polishing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 is an exploded view of the guide mechanism in an embodiment of the present invention;

[0039] Figure 2 is a top view of a portion of the structure of the guide mechanism in an embodiment of the present invention;

[0040] Figure 3 is a cross-sectional view of a portion of the structure of the guide mechanism in an embodiment of the present invention;

[0041] Figure 4 is a schematic structural diagram of a polishing wheel equipped with a guide mechanism in an embodiment of the present invention;

[0042] Figure 5 is a schematic structural diagram of a polishing device in an embodiment of the present invention;

[0043] Figure 6 yes Figure 5 A partial cross-sectional view of

[0044] Figure 7 yes Figure 6 A partial enlarged view of B.

[0045] In the figure:

[0046] 1. Guide mechanism; 2. Polishing wheel; 3. Top plate; 4. Connecting assembly; 5. Polishing assembly; 6. Flushing assembly;

[0047] 11. Base; 12. Support rod; 13. Bearing; 14. Abutment component; 41. Processing wheel; 51. Polishing head; 52. Carrying plate; 61. Liquid supply port; 62. Liquid collecting chamber; 63. Liquid outlet. DETAILED DESCRIPTION

[0048] In order to make the technical problem solved by the present invention, the technical solution adopted and the technical effect achieved more clearly, the technical solution of the present invention is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0049] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0051] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0052] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0053] The physical process of CMP requires physical friction between the abrasive particles in the polishing liquid and the surface of the wafer to remove the surface material and form a smooth wafer. However, during the physical friction process, problems such as the polishing head shaking are prone to occur, resulting in uneven polishing of the wafer surface, thus affecting product quality.

[0054] To solve the above problems, the present invention provides a guide mechanism 1, such as Figure 1-3 As shown, the guide mechanism 1 can be arranged in the polishing equipment to realize the rotational positioning between the polishing wheel 2 and the polishing head, and avoid the problems such as the shaking of the polishing head. Specifically, the guide mechanism 1 includes a base 11, a bearing 13, and a support rod 12 arranged on the top of the base 11, the bearing 13 is sleeved on the support rod 12, and the guide mechanism 1 also includes an abutment component 14, the abutment component 14 is fixedly connected to the top of the support rod 12, and the inner ring of the bearing 13 is clamped and fixed between the abutment component 14 and the base 11. When the base 11 and the outer side of the bearing 13 of the guide mechanism 1 are respectively connected to two relatively rotating parts, the guide mechanism 1 is used as the relative rotation medium between the two parts, so that the rotational guidance of the two rotating parts can be realized, and the stable rotation of the two parts can be ensured.

[0055] Specifically, Figure 1As shown, the base 11 includes a first truncated cone, a frustum and a second truncated cone, the large diameter end of the frustum is connected to the first truncated cone, the second truncated cone is connected to the small diameter end of the frustum, the diameter of the second truncated cone is larger than the diameter of the support rod 12, and the bottom surface of the bearing 13 is supported on the upper end of the second truncated cone. By setting the base 11 in a form in which the diameter of the first truncated cone is larger and the diameter of the second truncated cone is smaller, on the one hand, the center of gravity of the base 11 can be ensured to be lower, and the stability of the guide mechanism 1 can be improved. At the same time, when the guide mechanism 1 is detachably connected to the polishing equipment through the first truncated cone, the connection is more stable. On the other hand, it is also convenient for the second truncated cone not to contact the outer ring of the bearing 13 when the bearing 13 is sleeved on the support rod 12, so as to avoid affecting the center transmission of the guide mechanism 1 due to hindering the rotation of the outer ring of the bearing 13.

[0056] Optionally, the abutment member 14 may be configured as a fixed pressure block, such as Figure 1 As shown, the fixed pressure block can press against the inner ring of the bearing 13 to cooperate with the support rod 12 to ensure the stable rotation of the bearing 13. The fixed pressure block and the support rod 12 are correspondingly provided with threaded holes, and the fixed pressure block and the support rod 12 can be detachably connected by screwing the hexagonal screw into the threaded hole, so as to facilitate the replacement of the bearing 13 in the guide mechanism 1, that is, the corresponding type of bearing 13 can be adaptively selected according to the inner diameter of the rotating part, thereby improving the versatility of the guide mechanism 1.

[0057] To ensure that the inner and outer rings of the bearing 13 rotate synchronously with the two relatively rotating components, and to prevent other components from interfering with the rotation of the inner and outer rings of the bearing 13. In this embodiment, the dimension of the support rod 12 in the axial direction is not greater than the axial dimension of the bearing 13, so that when the bearing 13 is sleeved on the support rod 12, the support rod 12 does not protrude from the bearing 13, ensuring that the abutting component 14 can abut the inner ring of the bearing 13, so that the inner ring of the bearing 13 can rotate synchronously with the components connected thereto. At the same time, the dimension of the abutting component 14 in the radial direction is not greater than the inner diameter of the outer ring raceway of the bearing 13, so as to prevent the abutting component 14 from abutting the outer ring of the bearing 13 at the same time and interfering with the rotation of the outer ring of the bearing 13.

[0058] In cooperation with the guide mechanism 1, the embodiment of the present invention provides a polishing device, such as Figure 4-7As shown, the polishing device includes a guide mechanism 1 and a polishing wheel 2. The base 11 of the guide mechanism 1 is fixed in the groove at the center of the polishing wheel 2, and the bearing 13 is at least partially exposed in the groove. The polishing wheel 2 can rotate around its own axis, thereby driving the guide mechanism 1 to rotate along its own axis. The polishing device also includes a polishing assembly 5 and a connecting assembly 4. The polishing assembly 5 is arranged above the polishing wheel 2. The top of the connecting assembly 4 is fixed. Since the bearing 13 is at least partially exposed in the groove, the bottom end of the connecting assembly 4 is sleeved on the outside of the bearing 13, and the outside of the bottom end of the connecting assembly 4 cooperates with the polishing assembly 5. By connecting the base 11 of the guide mechanism 1 and the outside of the bearing 13 to the relatively rotating polishing wheel 2 and the connecting assembly 4, the rotational guidance of the polishing wheel 2 and the connecting assembly 4 is realized, and the outside of the connecting assembly 4 cooperates with the polishing assembly 5, so that the polishing assembly 5 can rotate stably under the restriction of the connecting assembly 4. Optionally, a power shaft is connected to the central lower end of the polishing wheel 2, and the other end of the power shaft is connected to the output end of the motor. The polishing wheel 2 rotates around its own axis under the drive of the motor. A guide mechanism 1 is detachably fixed in the central upper groove of the polishing wheel 2, and threaded holes are correspondingly arranged in the base 11 of the guide mechanism 1 and the central groove of the polishing wheel 2. The guide mechanism 1 can be detachably connected to the polishing wheel 2 by a hexagonal screw, thereby realizing timely replacement of the guide mechanism 1 and extending the service life of the polishing equipment.

[0059] In order to achieve the polishing of the workpiece to be polished by means of a polishing device, such as Figure 5-7 As shown, the polishing assembly 5 includes a polishing head 51 and a first driving mechanism. The polishing head 51 can press the workpiece to be polished onto the surface of the polishing wheel 2. The surface of the polishing wheel 2 is provided with a polishing cloth to polish the workpiece to be polished by the polishing cloth. The output end of the first driving mechanism is connected to the polishing head 51. On the one hand, the polishing head 51 is driven to move in a vertical direction to achieve contact and separation between the workpiece to be polished and the polishing wheel 2. On the other hand, the polishing head 51 is driven to rotate around its own axis in the opposite direction relative to the polishing wheel 2, so that the polishing strength of the workpiece to be polished is enhanced and the polishing effect is improved by the reverse rotation of the polishing head 51 and the polishing wheel 2. Optionally, the first driving mechanism has various forms, such as hydraulic transmission and mechanical transmission, to drive the polishing head 51 to move.

[0060] Specifically, in order to achieve stable rotation of the polishing head 51 to improve the polishing effect of the workpiece to be polished, the connecting assembly 4 includes a processing wheel 41 and a second driving mechanism, the outer side of the processing wheel 41 abuts against the polishing head 51, the output end of the second driving mechanism is connected to the processing wheel 41, and the second driving mechanism can drive the processing wheel 41 to rotate in the opposite direction relative to the polishing head 51, so that the processing wheel 41 cooperates with the polishing head 51 to rotate. Since the processing wheel 41 can stably rotate along its own axis under the action of the guide mechanism 1, when the outer side of the processing wheel 41 abuts against the polishing head 51, the position of the polishing head 51 in the horizontal direction can be limited to ensure the stable rotation of the polishing head 51. At the same time, the processing wheel 41 rotates in the opposite direction to the polishing head 51. When the polishing head 51 is stuck due to a minor fault, it can drive the polishing head 51 to rotate, avoiding the situation where the polishing head 51 does not rotate or shakes, ensuring the stable rotation of the polishing head 51, and thus improving the polishing effect of the workpiece to be polished. Optionally, the second driving mechanism can also be set as a motor to drive the processing wheel 41 to rotate. The specific setting form of the second driving mechanism can be selected according to actual conditions and is not specifically limited here.

[0061] In this embodiment, the outer side of the processing wheel 41 is provided as an elastic part, and the outer side of the elastic part can abut against the polishing head 51 to ensure the stability of the cooperation between the processing wheel 41 and the polishing head 51. When the polishing head 51 abuts against the processing wheel 41 and rotates, a small extrusion collision will inevitably occur. Therefore, the outer side of the processing wheel 41 is provided as an elastic part, which can prevent damage to the polishing head 51 and the processing wheel 41, and can also improve and extend the service life of the polishing equipment. The elastic part can be made of polyurethane or rubber. The polyurethane elastic ring has excellent wear resistance, heat resistance and high strength, is suitable for contact connection of the rotating mechanism, and has a long service life.

[0062] Specifically, Figure 6-7 As shown, the polishing head 51 proposed in this embodiment is provided with a carrier plate 52 at the bottom, and the carrier plate 52 can fix the workpiece to be polished, so as to realize the polishing of the workpiece to be polished by the polishing head 51. That is, the polishing head 51 is driven to move in the vertical direction by the first driving mechanism, so as to drive the workpiece to be polished fixed on the carrier plate 52 provided at the bottom thereof to contact with the polishing wheel 2, so as to realize the polishing of the surface of the workpiece to be polished, and the carrier plate 52 can also realize the attachment of workpieces to be polished of different sizes, so as to improve the versatility. Optionally, the workpiece to be polished can be set as a wafer, and in order to ensure that the carrier plate 52 fixes the wafer without scratching the surface of the wafer, the wafer can be fixed on the carrier plate 52 by bonding or adsorption, that is, the wafer can be manually bonded to the carrier plate 52 by a hot-peel double-sided tape, or an adsorption pad can be provided on the bottom surface of the carrier plate 52, and the wafer can be manually attached to the adsorption pad to realize the fixing of the wafer, and this fixing method can reduce the scratches on the surface of the wafer and improve the polishing effect. In addition, the carrier plate 52 can be set as a ceramic plate. The ceramic plate has the advantages of wear resistance and stability, and is suitable for attaching wafers thereon.

[0063] In this embodiment, the polishing device also includes a top plate 3, the top end of the connecting component 4 is fixed to the center position of the bottom surface of the top plate 3, and a plurality of polishing components 5 are provided, and the plurality of polishing components 5 are arranged at intervals around the circumference of the connecting component 4 and connected to the bottom surface of the top plate 3. Since the polishing components 5 are provided in plurality, the plurality of pieces to be polished can be respectively attached to the bottom of different polishing heads 51 to achieve simultaneous polishing of the plurality of pieces to be polished, thereby improving the polishing efficiency. At the same time, the plurality of polishing components 5 can synchronously abut the processing wheel 41, and cooperate to achieve the stable rotation of the plurality of polishing heads 51. In this embodiment, the polishing components 5 are provided in four, and the four polishing components 5 are arranged in a ring at intervals of 90° to avoid interference between the polishing components 5 and affect the operation of the polishing device.

[0064] In order to further improve the polishing efficiency and controllability of the polishing equipment, the polishing equipment also includes a PLC control system, which is connected to the driving mechanism and can control the pressure channel, polishing time and speed control of the polishing head 51. At the same time, the control system can detect whether there is a workpiece to be polished in the carrier plate 52. If there is a workpiece to be polished, the driving component of the polishing assembly 5 is controlled to drive the polishing head 51 to move in the vertical direction to polish the corresponding workpiece to be polished. For the control of the polishing time in the PLC control system, the internal clock of the control system can be used to achieve timing control of the polishing time through its own timer. When the timer reaches the required polishing time, the polishing equipment automatically stops polishing. In addition, the PLC control system can also perform corresponding segmented speed adjustment according to different materials and different shapes. Specifically, when the driving mechanism is set as a motor, the purpose of controlling the motor speed can be achieved by controlling the voltage at both ends of the driving mechanism.

[0065] It is worth noting that the programming of the PLC control system is a conventional setting in the art and will not be described in detail here. In addition, the PLC control system and its connection relationship with the drive component, the specific structure and the specific control method are all relatively conventional means in the art. This embodiment can adopt any connection relationship, specific structure and specific control method of the PLC control system and the drive component in the prior art, and this application will not describe it in detail.

[0066] In this embodiment, Figure 6As shown, the polishing device also includes a flushing component 6, which can flush the surface of the polishing wheel 2. Specifically, the flushing component 6 includes a liquid supply port 61 arranged above the top plate 3, a liquid collecting chamber 62 outside the polishing wheel 2, and a liquid outlet 63 connected to the liquid collecting chamber 62. The coolant can be discharged from the liquid supply port 61 and flush the surface of the polishing wheel 2. On the one hand, it can flush the grinding debris on the surface of the polishing wheel 2 to improve the polishing effect of the polishing wheel 2 on the polishing part to be polished. On the other hand, it can reduce the surface temperature of the polishing wheel 2 to avoid unexpected conditions of the equipment due to excessively high operating temperature. The coolant is thrown out into the liquid collecting chamber 62 through the surface of the polishing wheel 2. The height of the liquid collecting chamber 62 is higher than the surface of the polishing wheel 2 to prevent the coolant from being thrown out of the polishing device, and then the coolant flows out through the liquid outlet 63 below the liquid collecting chamber 62 to complete the cleaning and cooling of the entire polishing device.

[0067] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A polishing device, comprising a guide mechanism, wherein the guide mechanism (1) comprises: Base (11); A support rod (12) is arranged on the top of the base (11); A bearing (13), wherein the bearing (13) is sleeved on the support rod (12); and an abutment component (14), wherein the abutment component (14) is fixedly connected to the top of the support rod (12) and clamps and fixes the inner ring of the bearing (13) between the abutment component (14) and the base (11); Characterized in that the polishing equipment also includes: A polishing wheel (2), the polishing wheel (2) being capable of rotating around its own axis, a groove being arranged at the center of the polishing wheel (2), the base (11) being fixed in the groove, and the bearing (13) at least partially exposed from the groove; A polishing assembly (5), the polishing assembly (5) being arranged above the polishing wheel (2) and being used for pressing the workpiece to be polished onto the surface of the polishing wheel (2); A connecting component (4), wherein the bottom end of the connecting component (4) is sleeved on the outside of the bearing (13), and the outside of the bottom end of the connecting component (4) cooperates with the polishing component (5) to achieve positioning of the polishing component (5).

2. The polishing device according to claim 1, characterized in that: The dimension of the support rod (12) along the axial direction is not greater than the axial dimension of the bearing (13); The radial dimension of the abutment component (14) is no greater than the outer ring raceway diameter of the bearing (13).

3. The polishing device according to claim 1, characterized in that: The base (11) comprises: The first round table; A frustum, the large diameter end of the frustum being connected to the first frustum; and The second truncated cone is connected to the small diameter end of the frustum, the diameter of the second truncated cone is larger than the diameter of the support rod (12), and the bottom surface of the bearing (13) is supported on the upper end of the second truncated cone.

4. The polishing device according to claim 1, characterized in that: The polishing assembly (5) comprises: A polishing head (51), wherein the polishing head (51) is capable of pressing a workpiece to be polished onto the surface of the polishing wheel (2); A first driving mechanism, the output end of which is connected to the polishing head (51), is capable of driving the polishing head (51) to move in a vertical direction and to rotate around the axis of the polishing head (51) in the opposite direction relative to the polishing wheel (2).

5. The polishing device according to claim 4, characterized in that: The connection component (4) comprises: A processing wheel (41) is sleeved on the outer ring of the bearing (13), and the outer side of the processing wheel (41) is in contact with the polishing head (51); A second driving mechanism, the output end of which is connected to the processing wheel (41), is capable of driving the processing wheel (41) to rotate in the opposite direction relative to the polishing head (51), so that the processing wheel (41) rotates in coordination with the polishing head (51).

6. The polishing device according to claim 5, characterized in that: The outer side of the processing wheel (41) is arranged as an elastic part, and the outer side of the elastic part can abut against the polishing head (51).

7. The polishing device according to claim 4, characterized in that: The polishing assembly (5) further comprises: A carrier plate (52) is arranged on the bottom surface of the polishing head (51), and the carrier plate (52) is capable of fixing the workpiece to be polished so as to achieve polishing of the workpiece to be polished through the polishing head (51).

8. The polishing device according to any one of claims 4 to 7, characterized in that: The polishing device also includes a top plate (3), the top end of the connecting component (4) is fixed to the center position of the bottom surface of the top plate (3), and a plurality of polishing components (5) are provided. The plurality of polishing components (5) are arranged at intervals in the circumferential direction around the connecting component (4) and are connected to the bottom surface of the top plate (3).

9. The polishing device according to any one of claims 4 to 7, characterized in that: The polishing device further comprises a flushing component (6), and the flushing component (6) is capable of flushing the surface of the polishing wheel (2).

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