A system and method for quickly testing the hydrolysis resistance of LED chips

Abstract

The present invention discloses a system and method for quickly testing the anti-hydrolysis performance of LED chips, wherein the system comprises: a temperature and humidity regulator, the temperature and humidity regulator is provided with a cavity; a rotating device connected to the inner wall of the cavity, the rotating device can rotate along the inner wall of the cavity; a bracket, the bracket is a cup-shaped structure, the LED chip is mounted on the bracket and forms a conductive connection with the bracket; a test substrate, the bracket is fixed on the test substrate, and the bracket is conductively connected to the test substrate, and the test substrate is connected to the rotating device; the direction of the LED chip is adjusted by the rotating device, a reverse voltage is passed to the test substrate, and the temperature and humidity in the cavity are adjusted to perform an impact test on the LED chip. The direction of the LED chip is adjusted by the rotating device, and the hydrolysis speed of the LED chip is effectively accelerated, thereby shortening the detection time.

Description

Technical Field

[0001] The invention relates to a method for testing the hydrolysis resistance of an LED chip, and in particular to a system and method for quickly testing the hydrolysis resistance of an LED chip. Background Art

[0002] Light Emitting Diode, the abbreviation of the English word LED, mainly means: LED = Light Emitting Diode, is a solid-state semiconductor device that can convert electrical energy into visible light. As a lighting device, compared with traditional lighting devices, light-emitting diodes have considerable advantages - long life, high light efficiency, no radiation, low power consumption, and green environmental protection. At present, LED is mainly used in display screens, indicator lights, backlight sources and other fields.

[0003] Since LED applications are often placed in humid environments or exposed to rain outdoors, products with poor hydrolysis resistance will easily fail, so it is necessary to verify the product's hydrolysis resistance.

[0004] In order to save costs during the LED packaging stage, the packaging bracket, packaging glue and its process will be weakened in terms of water tightness, which requires the LED chip itself to have anti-hydrolysis properties.

[0005] The traditional way to verify the hydrolysis resistance of LED chips is to package the LED chips into LED lamp beads through die bonding, wire bonding, and sealing processes, and then place the LED lamp beads in an environmental chamber with a temperature of 85°C and a humidity of 85% RH, and apply reverse voltage for more than 168 hours of aging, and then test to determine whether they are invalid. Including the time for packaging and sample preparation, it takes more than 9 days. In addition, the existing detection methods are affected by factors such as packaging glue, brackets, and packaging processes, and have low reliability. Summary of the invention

[0006] The technical problem to be solved by the present invention is to provide a system for quickly testing the hydrolysis resistance of LED chips, which has high reliability and short detection time.

[0007] The technical problem that the present invention also aims to solve is to provide a method for quickly testing the hydrolysis resistance of LED chips, which has high reliability and short detection time.

[0008] In order to solve the above technical problems, the present invention provides a system for quickly testing the hydrolysis resistance of LED chips, comprising:

[0009] A temperature and humidity regulator, wherein the temperature and humidity regulator is provided with a cavity;

[0010] A rotating device connected to the inner wall of the cavity, wherein the rotating device can rotate along its own rotation axis in the cavity;

[0011] A bracket, wherein the bracket is a cup-shaped structure, and the LED chip is mounted on the bracket and forms a conductive connection with the bracket;

[0012] A test substrate, the bracket is fixed on the test substrate, and the bracket is conductively connected to the test substrate, and the test substrate is connected to the rotating device;

[0013] The direction of the LED chip is adjusted by a rotating device, a reverse voltage is applied to the test substrate, and the temperature and humidity in the cavity are adjusted to perform an impact test on the LED chip.

[0014] As an improvement of the above scheme, the bracket includes a cup bottom, a cup body and a cup mouth, the LED chip is fixed on the cup bottom, the cup body is arranged on the cup bottom and surrounds the LED chip, the cup mouth is located at the end of the cup body, and the water vapor in the cavity enters the cup body through the cup mouth and is trapped inside the cup body to accelerate the hydrolysis rate of the LED chip in the cup body.

[0015] As an improvement of the above scheme, the rotating device includes a dial and a rotating joint that rotates relative to the dial, the dial is fixed to the inner wall of the cavity, the rotating joint is connected to the dial through a rotating shaft and can rotate 360 ​​degrees, the rotating joint is provided with an insertion port, and the test substrate is connected to the rotating joint through the insertion port.

[0016] As an improvement of the above solution, the test substrate includes a mounting portion and an insertion portion, the insertion portion is arranged at one end of the mounting portion, the mounting portion is provided with a plurality of mounting points, the bracket is fixed on the mounting points, and the insertion portion is inserted into the insertion port of the rotary joint.

[0017] As an improvement of the above solution, a conductive sheet corresponding to the mounting point is provided on the insertion portion, and the conductive sheet forms a conductive connection with the corresponding mounting point through a wire;

[0018] The inner wall of the insertion port is provided with conductive points corresponding to the conductive sheets.

[0019] As an improvement of the above solution, the test substrate is a circuit substrate provided with a multi-circuit parallel structure.

[0020] As an improvement of the above solution, the rotary joint is conductively connected to the temperature and humidity regulator, and the power supply of the temperature and humidity regulator is used to pass a reverse voltage into the test substrate.

[0021] Accordingly, the present invention also provides a method for rapidly testing the hydrolysis resistance of an LED chip, which uses the system for rapidly testing the hydrolysis resistance of an LED chip according to the present invention, and comprises the following steps:

[0022] 1. Fix the LED chip on the bracket;

[0023] 2. Fix the bracket on the test substrate;

[0024] 3. Connect the test substrate to the rotating device to place the LED chip in the cavity of the temperature and humidity regulator;

[0025] 4. Turn the rotary joint to adjust the direction of the LED chip;

[0026] 5. Adjust the temperature and humidity in the chamber and apply reverse voltage to the test substrate to perform impact test on the LED chip.

[0027] As an improvement of the above solution, the rotating device is rotated to face the LED chip downward, and water vapor is surrounded around the LED chip by the bracket to accelerate the hydrolysis speed of the LED chip.

[0028] As an improvement of the above solution, the LED chip is fixed on the bracket by means of die bonding and wire bonding.

[0029] The implementation of the present invention has the following beneficial effects:

[0030] The present invention is a system for rapidly testing the hydrolysis resistance of LED chips. The LED chips are directly fixed in a bracket of a shaped structure, which effectively avoids the influence of packaging glue, packaging methods and other factors, thereby improving the reliability of the test.

[0031] In addition, the present invention can control the hydrolysis rate of the LED chip by adjusting the orientation of the LED chip through a rotating device, wherein the LED chip is facing downward so that more water vapor enters the bracket, and the special structure of the bracket makes it difficult for water vapor to overflow from the bracket, thereby effectively increasing the hydrolysis rate of the LED chip and shortening the detection time.

[0032] The testing method of the present invention does not require packaging of the LED chip, and the LED chip is directly fixed on the bracket through die bonding and wire bonding, thereby avoiding the influence of packaging glue, packaging method and other factors, thereby improving the reliability of the test.

[0033] In addition, the present invention fixes the LED chip in a cup-shaped bracket, and adjusts the orientation of the LED chip by a rotating device, so as to control the hydrolysis rate of the LED chip. The LED chip is placed downward to allow more water vapor to enter the bracket, and the special structure of the bracket makes it difficult for water vapor in the bracket to overflow, thereby effectively increasing the hydrolysis rate of the LED chip and shortening the detection time. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 is a schematic diagram of a system for rapidly testing the hydrolysis resistance of an LED chip according to the present invention;

[0035] Figure 2It is a structural schematic diagram of the rotating device of the present invention;

[0036] Figure 3 It is a schematic diagram of the structure of the LED chip to be tested installed on the bracket of the present invention;

[0037] Figure 4 It is a basic structural schematic diagram of the test of the present invention. DETAILED DESCRIPTION

[0038] In order to make the objectives, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below with reference to the accompanying drawings.

[0039] See also Figure 1 The present invention provides a system for quickly testing the hydrolysis resistance of an LED chip, comprising a temperature and humidity regulator 1, a rotating device 2, a bracket 3 and a test substrate 4.

[0040] The temperature and humidity regulator 1 of the present invention is used to provide a constant environment for the LED chip 5 to be tested, and is provided with a cavity 11 for placing the LED chip 5. The temperature in the cavity 11 can be adjusted within the range of 10 to 100°C, and the humidity can be adjusted within the range of 10%RH to 100%RH to meet the test requirements. Preferably, the temperature and humidity regulator 1 of the present invention is a constant temperature box, but is not limited thereto.

[0041] The rotating device 2 of the present invention is arranged on the inner wall of the temperature and humidity regulator cavity 11, and the rotating device 2 can rotate along its own rotation axis in the cavity 11. Specifically, the rotating device 2 can rotate 360 ​​degrees along the inner wall of the cavity 11.

[0042] join Figure 2 , the rotating device 2 includes a dial 21 and a rotating joint 22 that rotates relative to the dial 21. Specifically, the dial 21 is fixed to the inner wall of the cavity 11, and the rotating joint 22 is connected to the dial 21 through a rotating shaft and can rotate 360 ​​degrees. Different from the ordinary horizontal rotation method, the rotating joint of the present invention can make the LED chip face different directions, so that the LED chip can fully contact with water vapor, so that the LED chip hydrolyzes more fully and improves the reliability of detection; in addition, the rotating joint is used in conjunction with the invented bracket to accelerate the hydrolysis speed of the chip and shorten the detection time.

[0043] Preferably, the rotary joint 22 is perpendicular to the dial 21, and the tester can manually or automatically rotate the rotary joint 22 to meet the test requirements, and can obtain the rotation angle of the rotary joint 22 through the dial 21. Preferably, the rotary joint 22 can also realize the rotation function by rotating the connecting piece, but is not limited thereto.

[0044] Preferably, the rotary joint 22 is provided with an insertion port 23 , and the test substrate 4 is connected to the rotary device 2 via the insertion port 23 .

[0045] The support 3 of the present invention is a cup-shaped structure, which is not only used to fix the LED chip 5, but also used to accelerate the hydrolysis speed of the LED chip.

[0046] See also Figure 3 The bracket 3 includes a cup bottom 31, a cup body 32 and a cup mouth 33. The LED chip 5 is mounted on the cup bottom 31. The LED chip 5 to be tested can be directly fixed on the cup bottom 31 by means of die bonding and wire bonding, and does not need to be fixed on the bracket by materials such as packaging glue, so the influence of packaging glue, packaging method, etc. can be avoided, and the reliability of detection can be improved.

[0047] It should be noted that the LED chip 5 to be tested is conductively connected to the bracket 3 by means of die bonding and wire bonding. In addition, the LED chip 5 to be tested is fixedly connected to the cup bottom 31, and the LED chip 5 to be tested will not be separated from the cup bottom 31 even if the LED chip 5 faces downward.

[0048] The cup body 32 is arranged on the cup bottom 31 and surrounds the LED chip 5. The cup mouth 33 is located at the end of the cup body 32. The water vapor in the temperature and humidity regulator cavity enters the cup body 32 through the cup mouth 33 and is trapped inside the cup body 32 to accelerate the hydrolysis speed of the LED chip 5 in the cup body 32. The size of the cup mouth 33 is greater than, less than or equal to the size of the cup bottom 31. More preferably, the height of the cup body 32 is higher than the height of the LED chip 5.

[0049] Specifically, after the LED chip 5 is fixed on the bracket 3, the bracket 3 is then fixed on the test substrate 4. The LED chip 5 and the test substrate 4 form a conductive connection.

[0050] See also Figure 4 The test substrate 4 includes a mounting portion 41 and an insertion portion 42. The insertion portion 42 is arranged at one end of the mounting portion 41. The mounting portion 41 is provided with a plurality of mounting points 43. The bracket 3 is fixed on the mounting point 43. Each mounting point 43 is provided with a corresponding conductive sheet 44 on the insertion portion 42. The conductive sheet 44 forms a conductive connection with the corresponding mounting point 43 through a wire.

[0051] The test substrate 4 of the present invention can test multiple LED chips 5 at the same time, effectively improving the test efficiency. Preferably, the test substrate 4 is a circuit substrate, and is provided with a multi-circuit parallel structure.

[0052] Preferably, the inner wall of the insertion port 23 is provided with a conductive point 24 corresponding to the conductive sheet 44 , and when the insertion portion 42 is inserted into the insertion port 23 , the conductive sheet 44 is in close contact with the conductive point 24 , thereby forming a conductive connection.

[0053] Preferably, the support 3 is rotated by the rotating device 2 so that the cup mouth faces downward.

[0054] It should be noted that the rotating device 2 of the present invention is conductively connected to the temperature and humidity regulator 1, and the power supply of the temperature and humidity regulator 1 is used to pass a reverse voltage to the test substrate 4, and the direction of the LED chip 5 is adjusted by the rotating device 2, and the temperature and humidity in the cavity 11 are adjusted to perform an impact test on the LED chip 5. Specifically, by determining whether the tested LED chip 5 is failed, the strength of the hydrolysis resistance of the LED chip 5 can be quickly determined according to the direction, voltage and failure time of the test substrate 4.

[0055] Accordingly, the present invention also provides a method for rapidly testing the hydrolysis resistance of an LED chip, which uses the system for rapidly testing the hydrolysis resistance of an LED chip of the present invention to perform the test, and comprises the following steps:

[0056] 1. Fix the LED chip on the bracket;

[0057] See also Figure 3 The bracket 3 includes a cup bottom 31, a cup body 32 and a cup mouth 33. The LED chip 5 is mounted on the cup bottom 51. The LED chip 5 to be tested can be directly fixed on the cup bottom 31 by means of die bonding and wire bonding, and does not need to be fixed on the bracket by materials such as packaging glue, so the influence of packaging glue, packaging method, etc. can be avoided, and the reliability of detection can be improved.

[0058] It should be noted that the LED chip 5 to be tested is conductively connected to the bracket 3 by means of die bonding and wire bonding. In addition, the LED chip 5 to be tested is fixedly connected to the cup bottom 31, and the LED chip 5 to be tested will not be separated from the cup bottom 31 even if the LED chip 5 faces downward.

[0059] The cup body 32 is arranged on the cup bottom 31 and surrounds the LED chip 5. The cup mouth 33 is located at the end of the cup body 32. The water vapor in the temperature and humidity regulator cavity enters the cup body 32 through the cup mouth 33 and is trapped inside the cup body 32 to accelerate the hydrolysis speed of the LED chip 5 in the cup body 32. The size of the cup mouth 33 is greater than, less than or equal to the size of the cup bottom 31.

[0060] Specifically, after the LED chip 5 is fixed on the bracket 3, the bracket 3 is then fixed on the test substrate, wherein the LED chip 5 forms a conductive connection with the test substrate.

[0061] 2. Fix the bracket on the test substrate;

[0062] See also Figure 4 The test substrate 4 includes a mounting portion 41 and an insertion portion 42. The insertion portion 42 is arranged at one end of the mounting portion 41. The mounting portion 41 is provided with a plurality of mounting points 43. The bracket 3 is fixed on the mounting point 43. Each mounting point 43 is provided with a corresponding conductive sheet 44 on the insertion portion 42. The conductive sheet 44 forms a conductive connection with the corresponding mounting point 43 through a wire.

[0063] The test substrate 4 of the present invention can test multiple LED chips 5 at the same time, effectively improving the test efficiency. Preferably, the test substrate 4 is a circuit substrate, and is provided with a multi-circuit parallel structure.

[0064] 3. Connect the test substrate to the rotating device to place the LED chip in the cavity of the temperature and humidity regulator;

[0065] The temperature and humidity regulator of the present invention is used to provide a constant environment for the LED chip to be tested, and is provided with a cavity. The temperature and humidity regulator of the present invention is a constant temperature box, but is not limited thereto. Specifically, the temperature in the cavity can be adjusted within the range of 10 to 100°C, and the humidity can be adjusted within the range of 10%RH to 100%RH.

[0066] The rotating device of the present invention is connected to the inner wall of the temperature and humidity regulator cavity, and the rotating device can rotate along the inner wall of the cavity. Specifically, the rotating device can rotate 360 ​​degrees along the inner wall of the cavity.

[0067] join Figure 2 , the rotating device 2 includes a dial 21 and a rotating joint 22 that rotates relative to the dial 21. Specifically, the dial 21 is fixed to the inner wall of the cavity 11, and the rotating joint 22 is connected to the dial 21 through a rotating shaft and can rotate 360 ​​degrees. Different from the ordinary horizontal rotation method, the rotating joint of the present invention can make the LED chip face different directions, so that the LED chip can fully contact with water vapor, so that the LED chip hydrolyzes more fully and improves the reliability of detection; in addition, the rotating joint is used in conjunction with the invented bracket to accelerate the hydrolysis speed of the chip and shorten the detection time.

[0068] Preferably, the rotary joint 22 is perpendicular to the dial 21, and the tester can manually or automatically rotate the rotary joint 22 to meet the test requirements, and can obtain the rotation angle of the rotary joint 22 through the dial 21. Preferably, the rotary joint 22 can realize the rotation function through a rotating shaft and a rotating connector, but is not limited thereto.

[0069] Preferably, the rotary joint 22 is provided with an insertion port 23 , and the test substrate 4 is connected to the rotary device 2 via the insertion port 23 .

[0070] The support 3 of the present invention is a cup-shaped structure, which is not only used to fix the LED chip 5, but also used to accelerate the hydrolysis speed of the LED chip.

[0071] 4. Turn the rotary joint to adjust the direction of the LED chip;

[0072] Preferably, the support is rotated by a rotating device so that the cup mouth faces downward.

[0073] 5. Adjust the temperature and humidity in the chamber and apply reverse voltage to the test substrate to perform impact test on the LED chip.

[0074] Specifically, by determining whether the tested LED chip is failed, the strength of the LED chip's anti-hydrolysis ability can be quickly determined according to the orientation, voltage and failure time of the test substrate.

[0075] The testing method of the present invention does not require packaging of the LED chip, and the LED chip is directly fixed on the bracket through die bonding and wire bonding, thereby avoiding the influence of packaging glue, packaging method and other factors, thereby improving the reliability of the test.

[0076] In addition, the present invention fixes the LED chip in a cup-shaped bracket, and adjusts the orientation of the LED chip by a rotating joint, so that the hydrolysis rate of the LED chip can be controlled. The LED chip is placed downward to allow more water vapor to enter the bracket, and the special structure of the bracket makes it difficult for water vapor in the bracket to overflow, thereby effectively increasing the hydrolysis rate of the LED chip and shortening the detection time. The detection time of the present invention only takes 3 to 4 hours.

[0077] The above disclosure is only a preferred embodiment of the present invention, which certainly cannot be used to limit the scope of the present invention. Therefore, equivalent changes made according to the claims of the present invention are still within the scope of the present invention.

Claims

1. A system for rapidly testing the hydrolysis resistance of LED chips, characterized in that: include: A temperature and humidity regulator, wherein the temperature and humidity regulator is provided with a cavity; A rotating device connected to the inner wall of the cavity, wherein the rotating device can rotate along its own rotation axis in the cavity; A bracket, wherein the bracket is a cup-shaped structure, and the LED chip is mounted on the bracket and forms a conductive connection with the bracket; A test substrate, the bracket is fixed on the test substrate, and the bracket is conductively connected to the test substrate, and the test substrate is connected to the rotating device; The direction of the LED chip is adjusted by a rotating device, a reverse voltage is applied to the test substrate, and the temperature and humidity in the chamber are adjusted to perform an impact test on the LED chip; The rotating device includes a dial and a rotating joint that rotates relative to the dial. The dial is fixed to the inner wall of the cavity. The rotating joint is connected to the dial through a rotating shaft and can rotate 360 ​​degrees. The rotating joint is perpendicular to the dial. The rotating joint is provided with an insertion port, and the test substrate is connected to the rotating joint through the insertion port.

2. The system for rapidly testing the hydrolysis resistance of LED chips according to claim 1, characterized in that: The bracket includes a cup bottom, a cup body and a cup mouth, the LED chip is fixed on the cup bottom, the cup body is arranged on the cup bottom and surrounds the LED chip, the cup mouth is located at the end of the cup body, and the water vapor in the cavity enters the cup body through the cup mouth and is trapped inside by the cup body to accelerate the hydrolysis speed of the LED chip in the cup body.

3. The system for rapidly testing the hydrolysis resistance of LED chips according to claim 1, characterized in that: The test substrate comprises a mounting portion and an insertion portion, wherein the insertion portion is arranged at one end of the mounting portion, the mounting portion is provided with a plurality of mounting points, the bracket is fixed on the mounting points, and the insertion portion is inserted into the insertion port of the rotary joint.

4. The system for rapidly testing the hydrolysis resistance of LED chips according to claim 3, characterized in that: The inserting portion is provided with a conductive sheet corresponding to the mounting point, and the conductive sheet is conductively connected to the corresponding mounting point through a wire; The inner wall of the insertion port is provided with conductive points corresponding to the conductive sheets.

5. The system for rapidly testing the hydrolysis resistance of LED chips according to claim 4, characterized in that: The test substrate is a circuit substrate provided with a multi-circuit parallel structure.

6. The system for rapidly testing the hydrolysis resistance of LED chips according to claim 1, characterized in that: The rotary joint is conductively connected to the temperature and humidity regulator, and the power supply of the temperature and humidity regulator is used to pass a reverse voltage into the test substrate.

7. A method for rapidly testing the hydrolysis resistance of LED chips, characterized in that: The system for rapidly testing the hydrolysis resistance of LED chips as claimed in any one of claims 1 to 6 comprises the following steps:

1. Fix the LED chip on the bracket; 2. Fix the bracket on the test substrate; 3. Connect the test substrate to the rotating device to place the LED chip in the cavity of the temperature and humidity regulator; 4. Turn the rotary joint to adjust the direction of the LED chip; 5. Adjust the temperature and humidity in the chamber and apply reverse voltage to the test substrate to perform impact test on the LED chip.

8. The method for rapidly testing the hydrolysis resistance of an LED chip as claimed in claim 7, characterized in that: The rotating device is turned to face the LED chip downward, and water vapor is surrounded around the LED chip through the bracket to accelerate the hydrolysis speed of the LED chip.

9. The method for rapidly testing the hydrolysis resistance of LED chips according to claim 7, characterized in that: The LED chip is fixed on the bracket by means of crystal bonding and wire bonding.

Images