Rhinestone metal reflective hollow inlaid structure ornament and processing method thereof
By forming a base reflective conductive layer and metal outer layer on the surface of the rhinestone and using the hollow pattern structure to reveal it, the problems of damage and dirt in the gaps during the inlay process are solved, and safety and aesthetics are improved, while reducing the production costs.
Patent Information
- Application Number
- CN201911347771.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2019-01-24
- Filing Date
- 2019-12-24
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2039-12-24
AI Technical Summary
Existing rhinestone jewelry is prone to damage during the inlaying process, and there are gaps between the inlaying carrier and the rhinestone storing dirt, resulting in aesthetic impact and safety hazards, and the production cost is high.
The vacuum plating technology is used to form a base reflective conductive layer and metal outer layer on the surface of the rhinestone, and is exposed through the hollow pattern structure to form a metal reflective hollow inlay structure to avoid direct contact between the inlay carrier and the surface of the rhinestone, ensuring safety and aesthetics. Reduce production costs.
It achieves that the rhinestone jewelry is not damaged during the inlay process, avoids dirt and dirt hiding in the gaps, enhances safety and aesthetics, and reduces production costs.
Smart Images
Figure CN111466686B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to an ornament and a processing technology thereof, in particular to an ornament with a metal reflective hollow inlay structure of a rhinestone or crystal accessory and a processing method thereof. Background Art
[0002] Rhinestones, crystal accessories, and crystal pendants of various shapes have basically the same ingredients and production methods. Most of them are pressed and then ground into diamond facets or polished surfaces. At the same time, they can also be made into jewelry accessories. Rhinestones are also known as crystal diamonds and rhinestones. Their main ingredient is crystal glass, which is a kind of jewelry accessory obtained by cutting artificial crystal glass into diamond facets. This material is very popular because it is more economical and has a dazzling visual effect like diamonds.
[0003] Rhinestones are generally not used alone. They are often used after processing metal decorations or after welding the required metal accessories. They are usually fixed on metal brackets or metal edging by inlay to form rhinestone jewelry, which are used in various products, such as clothing, hairpins, necklaces, etc. The rhinestone inlay methods include claw setting, bead setting, groove setting, track setting, card setting, etc. The rhinestone jewelry used in clothing and hairpins usually includes a metal bracket and rhinestones. The metal bracket has a concave cavity that matches the bottom of the rhinestone. A plurality of claw buckles are evenly arranged around the metal bracket. The bottom surface of the rhinestone is plated with a silver layer, an aluminum layer, or a titanium layer as a reflective layer to increase the visual effect of the rhinestone. When installing, the bottom of the rhinestone is embedded in the concave cavity, and the claw buckle is pressed so that the claw buckle tightly buckles the front of the rhinestone, that is, it is inlaid by claw setting. However, this kind of rhinestone jewelry has the following problems: 1) When applying external force to press the claw buckle, the front of the rhinestone may be damaged, making the rhinestone jewelry Scrap; 2) The free end of the claw buckle is easy to hook clothes, etc., which will not only cause the claw buckle to tilt and the rhinestone to shake, but also damage the clothes and even hurt the user's skin; 3) Since the claw buckle is too large, it will not be able to embed the rhinestone. Therefore, the claw buckle is generally designed to be thinner or smaller to leave enough space for embedding the rhinestone, which will result in insufficient gripping force of the claw buckle. In this case, it is very easy for the rhinestone to fall off the metal bracket; 4) There is a gap between the cavity mouth and the rhinestone, and this gap is easy to hide dirt, thus affecting the beauty of the rhinestone jewelry. The rhinestone jewelry used in necklaces usually includes a metal edging and a rhinestone. The rhinestone is embedded in the metal edging, and a hanging ring is provided on the metal edging, that is, the rhinestone is embedded in the metal edging. However, this rhinestone jewelry has the following problems: 1) When applying external force to embed the rhinestone into the metal edging, the two surfaces of the rhinestone may be damaged, making the rhinestone jewelry scrapped; 2) There is a gap between the metal edging and the edge of the rhinestone, and this gap is easy to hide dirt, thereby affecting the beauty of the rhinestone jewelry. In addition, no matter what kind of rhinestone inlay method is used for rhinestone jewelry, it will be limited by the shape of the rhinestone, and the shape of the metal bracket or metal edging will change with the shape of the rhinestone, which will generate a lot of mold costs for making the metal bracket and metal edging. Summary of the invention
[0004] The technical problem to be solved by the present invention is to provide a rhinestone or crystal accessory metal reflective hollow inlay structure ornament and a processing method thereof. The rhinestone or crystal accessory belongs to a reflective hollow inlay structure ornament. During the inlay process of the rhinestone or crystal accessory, the two surfaces of the rhinestone or crystal accessory will not be damaged. There is no gap between the rhinestone or crystal accessory and the inlay carrier that is easy to hide dirt, the inlay carrier will not warp, the rhinestone or crystal accessory will not fall off, and the production cost is low; the processing method is simple.
[0005] The technical solution adopted by the present invention to solve the above technical problems is: a rhinestone or crystal accessory metal reflective hollow inlaid structure ornament, including a rhinestone or a crystal accessory, characterized in that: a base reflective conductive layer and a metal outer layer are sequentially and closely arranged on the outer surface of the rhinestone or the crystal accessory to form a semi-finished product, and a plurality of hollow pattern structures are arranged on the semi-finished product for the inlay carrier composed of the base reflective conductive layer and the metal outer layer, so that part of the surface of the rhinestone or the crystal accessory is exposed through the hollow pattern structure to form a metal reflective hollow inlaid structure ornament with a metal layered texture.
[0006] The base reflective conductive layer is composed of a base layer, a silver reflective layer and a copper conductive layer arranged in sequence from the inside to the outside. The base layer is formed by vacuum electroplating a layer of titanium, a layer of silicon or a layer of chromium on the outer surface of the rhinestone or the crystal accessory. The silver reflective layer is formed by vacuum electroplating a layer of silver on the outer surface of the base layer. The copper conductive layer is formed by vacuum electroplating a layer of copper on the outer surface of the silver reflective layer. The metal outer layer is formed by electrodepositing a layer of copper on the outer surface of the copper conductive layer. Here, a layer of titanium, silicon, chromium or other materials that can be well combined with glass can be vacuum plated on the outer surface of the rhinestone to form a base layer. In practical applications, chromium is not environmentally friendly and is not suitable for use in jewelry, so titanium or silicon can be preferred; since the titanium base layer formed by vacuum plating titanium has good bonding with glass rhinestones, the titanium layer is selected as the base layer; silver has a good reflective effect, so the silver layer is selected as the reflective layer; copper has a good conductive effect, so the copper layer is selected as the conductive layer; since the titanium base layer, the silver reflective layer and the copper conductive layer are all formed by vacuum plating, the thickness of the titanium base layer, the silver reflective layer and the copper conductive layer formed by vacuum plating can only reach micrometer level at most, and rhinestone jewelry usually needs to be welded with various accessories before use, so in order to be able to weld various accessories, a metal outer layer (micrometer level to millimeter level) is electrodeposited outside the copper conductive layer, and the thicker metal outer layer can highlight the metal layered texture of the rhinestone jewelry; in addition, the metal outer layer can be easily electrodeposited on the copper conductive layer. Here, the thickness of the titanium base layer can be set to nanometer level, and should not be too thick, because if it is too thick, it will affect the silver reflective layer; the thickness of the silver reflective layer and the copper conductive layer can be set to micrometer level; the thickness of the metal outer layer can be set to micrometer level to millimeter level.
[0007] The base reflective conductive layer is composed of a titanium base reflective layer and a copper conductive layer arranged in sequence from the inside to the outside. The titanium base reflective layer is formed by vacuum electroplating a layer of titanium on the outer surface of the rhinestone or the crystal accessory, the copper conductive layer is formed by vacuum electroplating a layer of copper on the outer surface of the titanium base reflective layer, and the metal outer layer is formed by electrodepositing a layer of copper on the outer surface of the copper conductive layer. Since the vacuum electroplated titanium layer has good compatibility with glass rhinestones, and the titanium layer can be made into a variety of different colors to play a reflective role, the vacuum electroplated titanium layer takes into account both the base and the reflective role, so the titanium layer is selected as the base reflective layer; copper has good conductivity, so the copper layer is selected as the conductive layer; since the titanium base reflective layer and the copper conductive layer are both formed by vacuum electroplating, the thickness of the titanium base reflective layer and the copper conductive layer formed by vacuum electroplating can only reach the micron level at most, and rhinestone jewelry usually needs to be welded to various accessories before use, so in order to be able to weld various accessories, a metal outer layer (micron level to millimeter level) is electrodeposited outside the copper conductive layer, and the thicker metal outer layer can highlight the metal layered texture of the rhinestone jewelry; in addition, the metal outer layer can be easily electrodeposited on the copper conductive layer. Here, the titanium base reflective layer plays a dual role of base and reflective, so the thickness can be set to micron level; the thickness of the copper conductive layer can be set to micron level; the thickness of the metal outer layer can be set to micron level to millimeter level.
[0008] The base reflective conductive layer is composed of a base layer and a silver reflective conductive layer arranged in sequence from the inside to the outside. The base layer is formed by vacuum electroplating a layer of titanium, a layer of silicon, or a layer of chromium on the outer surface of the rhinestone or the crystal accessory. The silver reflective conductive layer is formed by vacuum electroplating a layer of silver on the outer surface of the base layer. The metal outer layer is formed by electrodepositing a layer of copper on the outer surface of the silver reflective conductive layer. Here, a layer of titanium, silicon, chromium or other materials that can be well combined with glass can be vacuum plated on the outer surface of the rhinestone to form a base layer. In practical applications, chromium is not environmentally friendly and is not suitable for use in jewelry, so titanium or silicon can be preferred; since the titanium base layer formed by vacuum plating titanium has good bonding with the glass rhinestone, the titanium layer is selected as the base layer; silver has good reflective effect and silver has good electrical conductivity, so the silver layer is selected as the reflective conductive layer; since the titanium base layer and the silver reflective conductive layer are both formed by vacuum plating, the thickness of the titanium base layer and the silver reflective conductive layer formed by vacuum plating can only reach micrometer level at most, and rhinestone jewelry usually needs to be welded with various accessories before use, so in order to be able to weld various accessories, a metal outer layer (micrometer level to millimeter level) is electrodeposited outside the silver reflective conductive layer, and the thicker metal outer layer can highlight the metal layered texture of the rhinestone jewelry; in addition, the metal outer layer can be easily electrodeposited on the silver reflective conductive layer. Here, the thickness of the titanium base layer can be set to nanometer level, and should not be too thick, because if it is too thick, it will affect the silver reflective conductive layer; the thickness of the silver reflective conductive layer can be set to micrometer level; the thickness of the metal outer layer can be set to micrometer level to millimeter level.
[0009] The base reflective conductive layer is composed of a base layer and a silver reflective conductive layer arranged in sequence from the inside to the outside. The base layer is formed by vacuum electroplating a layer of titanium, a layer of silicon, or a layer of chromium on the outer surface of the rhinestone or the crystal accessory. The silver reflective conductive layer is formed by vacuum electroplating a layer of silver on the outer surface of the base layer. The metal outer layer is formed by electrodepositing a layer of silver on the outer surface of the silver reflective conductive layer.
[0010] Before the metal outer layer is electrodeposited, a layer of alkaline copper or copper pyrophosphate is electroplated as a transitional coating. Since alkaline copper contains cyanide, it can be omitted.
[0011] The hollow pattern structure is formed by etching the inlay carrier after spraying etching protection ink or electrophoretic etching protection paint. For inlay carriers with different structures, the etching process is slightly different: for an inlay carrier composed of a titanium base layer, a silver reflective layer, a copper conductive layer and a metal outer layer, the metal outer layer and the copper conductive layer are first etched with hydrochloric acid and ferric chloride or a commercially available copper etching solution, and then the silver reflective layer is etched with a silver etching solution or a dilute nitric acid solution. After removing the protective layer, a sodium hydroxide aqueous solution with a concentration of about 3% and a hydrogen peroxide concentration of about 30% are added, and the hydrogen peroxide with a weight percentage of about 15% is added to the sodium hydroxide aqueous solution to form an etching solution to etch the titanium base layer; for an inlay carrier composed of a titanium base reflective layer, a copper conductive layer and a metal outer layer, the metal outer layer and the copper conductive layer are first etched with hydrochloric acid and ferric chloride or a commercially available copper etching solution. After removing the protective layer, a sodium hydroxide aqueous solution with a concentration of about 3% and a hydrogen peroxide concentration of about 30% are added. The titanium bottom reflective layer is etched by adding hydrogen peroxide with a weight percentage of about 15% into a sodium hydroxide aqueous solution; for the inlay carrier composed of the titanium bottom layer, the silver reflective conductive layer and the metal outer layer, if the metal outer layer is made of copper, the metal outer layer is first etched by using hydrochloric acid and ferric chloride or a commercially available copper etching solution, and then the silver reflective conductive layer is etched by using a silver etching solution or a dilute nitric acid solution, and after removing the protective layer, a sodium hydroxide aqueous solution with a concentration of about 3% and hydrogen peroxide with a concentration of about 30% is added, and the hydrogen peroxide with a weight percentage of about 15% is added into the sodium hydroxide aqueous solution to form an etching solution to etch the titanium bottom layer; if the metal outer layer is made of silver, there is no need to use hydrochloric acid and ferric chloride or a commercially available copper etching solution to etch the metal outer layer, and the metal outer layer and the silver reflective conductive layer are directly etched by using a silver etching solution or a dilute nitric acid solution.
[0012] The hollow pattern structure is in the same shape as the surface of the rhinestone or the crystal accessory. The hollow pattern structure can be designed according to the desired rhinestone jewelry, and can be a pattern of various shapes. For example, if a hollow pattern structure of the same shape as the surface of the rhinestone is set only on one surface of the rhinestone, the inlay carrier with the hollow pattern structure has the function of an existing metal bracket; if a hollow pattern structure of the same shape as the surface of the rhinestone is set on both surfaces of the rhinestone, the inlay carrier with the hollow pattern structure has the function of an existing metal edging; the hollow pattern structure can also be in various shapes such as lace or flowers, plants, and animals.
[0013] The periphery of the hollow pattern structure is designed to be various lace shapes. Designing the periphery of the hollow pattern structure to be lace-shaped can increase the overall aesthetic feeling.
[0014] The region of the inlay carrier not provided with the hollow pattern structure is tin-welded or laser-welded with metal accessories, and a necklace or the like is made by welding the metal accessories.
[0015] The region of the inlay carrier not provided with the hollow pattern structure is provided with decorative plating, which can be gold or imitation gold or platinum or imitation platinum decorative plating.
[0016] The rhinestones or the crystal accessories are replaced with ornamental gemstones or ornamental zircons.
[0017] A rhinestone or crystal accessory metal reflective hollow inlaid structure ornament, comprising a rhinestone or crystal accessory, characterized in that: after the rhinestone or crystal accessory is bombarded by a bombardment power source, a reflective conductive layer and a metal outer layer are sequentially and closely arranged on the outer surface of the rhinestone or the crystal accessory to form a semi-finished product, and a plurality of hollow pattern structures are arranged on the semi-finished product for the inlay carrier composed of the reflective conductive layer and the metal outer layer, so that part of the surface of the rhinestone is exposed through the hollow pattern structure to form a metal reflective hollow inlaid structure ornament with a metal layered texture.
[0018] The reflective conductive layer is composed of a silver reflective layer and a copper conductive layer arranged in sequence from the inside to the outside. The silver reflective layer is formed by vacuum electroplating a layer of silver on the outer surface of the water rhinestone or the crystal accessory after being bombarded by the bombardment power supply. The copper conductive layer is formed by vacuum electroplating a layer of copper on the outer surface of the silver reflective layer. The metal outer layer is formed by electrodepositing a layer of copper on the outer surface of the copper conductive layer. Here, the water rhinestone is first bombarded with a bombardment power supply in a vacuum coating machine, so that there is no need for a titanium base layer, and a layer of silver is directly vacuum electroplated on the outer surface of the water rhinestone to form a silver reflective layer.
[0019] The reflective conductive layer is a silver reflective conductive layer, which is formed by vacuum electroplating a layer of silver on the outer surface of the water rhinestone or the crystal accessory after being bombarded by a bombardment power supply, and the metal outer layer is formed by electrodepositing a layer of copper on the outer surface of the silver reflective conductive layer. Here, the water rhinestone is first bombarded with a bombardment power supply in a vacuum coating machine, so that there is no need for a titanium base layer, and a layer of silver is directly vacuum electroplated on the outer surface of the water rhinestone to form a silver reflective conductive layer; the silver reflective conductive layer can also be replaced by a copper layer or other single metal layer or alloy layer.
[0020] A method for processing the above-mentioned rhinestone or crystal accessory metal reflective hollow inlaid structure ornaments, characterized in that it includes the following steps:
[0021] Step 1: Use vacuum electroplating technology to vacuum electroplate a layer of titanium on the outer surface of the rhinestone or crystal accessories to form a transparent titanium base layer;
[0022] Step 2: vacuum electroplating a layer of silver on the outer surface of the titanium base layer until it is opaque, forming an opaque silver reflective layer;
[0023] Step 3: vacuum electroplating a layer of copper on the outer surface of the silver reflective layer using vacuum electroplating technology to form a copper conductive layer;
[0024] Step 4: using the electrodeposition technology, the copper conductive layer is used as a cathode, and a layer of copper is electrodeposited on the outer surface of the copper conductive layer by electric current to form a metal outer layer, thereby obtaining an inlay carrier consisting of a titanium base layer, a silver reflective layer, a copper conductive layer and a metal outer layer, and a semi-finished product consisting of a rhinestone or crystal accessory and an inlay carrier wrapped around the rhinestone or crystal accessory;
[0025] Step 5: spray etching protection ink or electrophoretic etching protection paint on the semi-finished inlay carrier, and bake to form a protective layer;
[0026] Step 6: Use a laser marking machine to draw a pattern on the protective layer according to the designed pattern;
[0027] Step 7: Put the semi-finished product with the pattern into the etching machine, first etch the inlay carrier of the semi-finished product with the pattern using copper etching solution, and then etch it using silver etching solution or dilute nitric acid solution. If the titanium base layer is not completely removed after etching, remove the protective layer and then etch it again using titanium etching solution. After etching, a hollow pattern structure identical to the designed pattern is formed on the inlay carrier, and part of the surface of the rhinestone or crystal accessory is exposed through the hollow pattern structure to form a metal reflective hollow inlay structure ornament with a metal layered texture.
[0028] The thickness of the titanium base layer is 0.01 micron to 0.5 micron, the thickness of the silver reflective layer is 0.05 micron to 5 micron, the thickness of the copper conductive layer is 0.2 micron to 8 micron, and the thickness of the metal outer layer is greater than 0.01 mm; the titanium base layer, the silver reflective layer, and the copper conductive layer are vacuum plated using a multi-arc ion magnetron sputtering coating machine, and the process parameters are: the vacuum degree of the vacuum chamber is 8×10 -3 Pa, and a working gas with a flow rate of 20sccm to 150sccm is used to adjust the vacuum degree of the vacuum chamber and the product color; metal accessories are tin-welded or laser-welded on the area of the inlay carrier where the hollow pattern structure is not provided.
[0029] A method for processing the above-mentioned rhinestone or crystal accessory metal reflective hollow inlaid structure ornaments, characterized in that it includes the following steps:
[0030] Step 1: Use vacuum electroplating technology to vacuum electroplate a layer of titanium on the outer surface of the rhinestone or crystal accessories until it is opaque, forming an opaque titanium base reflective layer;
[0031] Step 2: vacuum electroplating a layer of copper on the outer surface of the titanium base reflective layer using vacuum electroplating technology to form a copper conductive layer;
[0032] Step 3: using the electrodeposition technology, with the copper conductive layer as the cathode, a layer of copper is electrodeposited on the outer surface of the copper conductive layer by electric current to form a metal outer layer, thereby obtaining an inlay carrier consisting of a titanium base layer, a silver reflective layer, a copper conductive layer and a metal outer layer, and a semi-finished product consisting of a rhinestone or crystal accessory and an inlay carrier wrapped around the rhinestone or crystal accessory;
[0033] Step 4: spray etching protection ink or electrophoretic etching protection paint on the semi-finished inlay carrier, and bake to form a protective layer;
[0034] Step 5: Use a laser marking machine to draw a pattern on the protective layer according to the designed pattern;
[0035] Step 6: Place the semi-finished product with a pattern into an etching machine, first use copper etching solution to etch the inlay carrier of the semi-finished product with a pattern, then remove the protective layer, and then use titanium etching solution to etch again. After etching, a hollow pattern structure identical to the designed pattern is formed on the inlay carrier, and part of the surface of the rhinestone or crystal accessory is exposed through the hollow pattern structure to form a metal reflective hollow inlay structure ornament with a metal layered texture.
[0036] The thickness of the titanium base reflective layer is 0.1 micron to 5 microns, the thickness of the copper conductive layer is 0.2 micron to 8 microns, and the thickness of the metal outer layer is greater than 0.01 mm; the titanium base reflective layer and the copper conductive layer are vacuum plated using a multi-arc ion magnetron sputtering coating machine, and the process parameters are: the vacuum degree of the vacuum chamber is 8×10 -3 Pa, and the vacuum degree and color of the vacuum chamber are adjusted with a working gas with a flow rate of 20sccm to 150sccm; metal accessories are tinned or laser welded on the area of the inlaid carrier that is not provided with the hollow pattern structure, or before the vacuum electroplating of the copper conductive layer, the metal accessories are glued on the titanium base reflective layer or the accessories are directly glued to the material before the base layer.
[0037] Compared with the prior art, the advantages of the present invention are:
[0038] 1) The rhinestone or crystal accessory metal reflective hollow inlay structure ornament has a base reflective conductive layer closely arranged on the outer surface of the rhinestone or crystal accessory, a metal outer layer closely arranged on the outer surface of the base reflective conductive layer, and then a plurality of hollow pattern structures are arranged on the inlay carrier composed of the base reflective conductive layer and the metal outer layer, so that part of the surface of the rhinestone or crystal accessory can be exposed through the hollow pattern structure to form a metal reflective hollow inlay structure ornament, and since the layers of the inlay carrier are arranged in a wrapped manner, the surface of the rhinestone or crystal accessory will not be damaged; since the layers of the inlay carrier are arranged closely in sequence, clothes will not be hooked, and skin will not be scratched; the rhinestone or crystal accessory is firmly fixed by the inlay carrier, and the rhinestone or crystal accessory will not fall off; there is no gap between the inlay carrier and the rhinestone or crystal accessory, and dirt will not be hidden.
[0039] 2) The arrangement of each layer of the inlay carrier of the rhinestone or crystal accessory metal reflective hollow inlay structure ornament does not require a mold and is not affected by the shape of the rhinestone or crystal accessory; and the metal outer layer does not need to be polished and ground, so the production cost is low.
[0040] 3) The processing method of the rhinestone or crystal accessory metal reflective hollow inlaid structure ornament only utilizes the existing vacuum electroplating technology, electrodeposition technology and etching technology, and the processing process is simple and the processing cost is low. BRIEF DESCRIPTION OF THE DRAWINGS
[0041] Figure 1 This is a schematic diagram of the appearance structure of the rhinestone metal reflective hollow inlaid structure ornament of Example 1;
[0042] Figure 2 It is a partial cross-sectional schematic diagram of the rhinestone metal reflective hollow inlaid structure ornament of Example 1;
[0043] Figure 3 It is a partial cross-sectional schematic diagram of the rhinestone metal reflective hollow inlaid structure ornament of the second embodiment;
[0044] Figure 4 It is a partial cross-sectional schematic diagram of the rhinestone metal reflective hollow inlaid structure ornament of Example 3. DETAILED DESCRIPTION
[0045] The present invention is further described in detail below with reference to the accompanying drawings.
[0046] Embodiment 1:
[0047] This embodiment proposes a rhinestone metal reflective hollow inlaid structure ornament, such as Figure 1 and Figure 2As shown, it includes a pentagonal rhinestone 1, on the outer surface of the rhinestone 1, a base reflective conductive layer 2 and a metal outer layer 3 are sequentially closely arranged to form a semi-finished product, and on the semi-finished product, eight hollow pattern structures 4 are arranged for the inlay carrier composed of the base reflective conductive layer 2 and the metal outer layer 3, so that part of the surface of the rhinestone 1 is exposed through the hollow pattern structure 4 to form a rhinestone metal reflective hollow inlay structure ornament with a metal layered texture.
[0048] Preferably, the bottom reflective conductive layer 2 is composed of a titanium bottom layer 21, a silver reflective layer 22 and a copper conductive layer 23 which are arranged in sequence from the inside to the outside. The titanium bottom layer 21 is formed by vacuum electroplating a layer of titanium on the outer surface of the diamond 1, the silver reflective layer 22 is formed by vacuum electroplating a layer of silver on the outer surface of the titanium bottom layer 21, the copper conductive layer 23 is formed by vacuum electroplating a layer of copper on the outer surface of the silver reflective layer 22, and the metal outer layer 3 is formed by electrodepositing a layer of copper on the outer surface of the copper conductive layer 23. Since the titanium base layer 21 formed by vacuum electroplating titanium has good bonding with the glass rhinestone 1, the titanium layer is selected as the base layer; silver has good reflective effect, so the silver layer is selected as the reflective layer; copper has good electrical conductivity, so the copper layer is selected as the conductive layer; since the titanium base layer 21, the silver reflective layer 22 and the copper conductive layer 23 are all formed by vacuum electroplating, the thickness of the titanium base layer 21, the silver reflective layer 22 and the copper conductive layer 23 formed by vacuum electroplating can only reach micrometer level at most, and rhinestone jewelry usually needs to be welded with various accessories before use, so in order to be able to weld various accessories, a metal outer layer 3 (micrometer level to millimeter level) is electrodeposited outside the copper conductive layer 23, and the thicker metal outer layer 3 can highlight the metal layered texture of the rhinestone jewelry; in addition, the metal outer layer 3 can be easily electrodeposited on the copper conductive layer 23. Here, the thickness of the titanium base layer 21 can be set to nanometer level, and should not be too thick, because if it is too thick, it will affect the silver reflective layer 22; the thickness of the silver reflective layer 22 and the copper conductive layer 23 can be set to micrometer level; the thickness of the metal outer layer 3 can be set to micrometer level to millimeter level.
[0049] In a preferred embodiment, the hollow pattern structure 4 is formed by etching after a protective layer is formed by spraying etching protective ink or electrophoretic etching protective paint on the inlaid carrier. Specifically, the metal outer layer 3 and the copper conductive layer 23 are etched with hydrochloric acid and ferric chloride or a commercially available copper etching solution, and then the silver etching solution or a dilute nitric acid solution is used to etch the silver reflective layer 22. After removing the protective layer, a sodium hydroxide aqueous solution with a concentration of about 3% and a hydrogen peroxide with a concentration of about 30% are used, and hydrogen peroxide with a weight percentage of about 15% is added to the sodium hydroxide aqueous solution to form an etching solution to etch the titanium base layer 21.
[0050] In a preferred embodiment, one hollow pattern structure 4 is in the same shape as the surface of the rhinestone 1, i.e., a five-pointed star shape, so that the middle area of one surface of the rhinestone 1 is exposed; five five-pointed star-shaped hollow pattern structures 4 are distributed on the five corners, so that part of the five corners of the rhinestone 1 is exposed; two circular hollow pattern structures 4 are distributed on the side, so that part of the side of the rhinestone 1 is exposed; the hollow pattern structure 4 can be designed according to the desired rhinestone jewelry, and can be a pattern of various shapes. For example, if a hollow pattern structure 4 with the same shape as the surface of the rhinestone 1 is provided on only one surface of the rhinestone 1, the inlay carrier with the hollow pattern structure 4 has the function of an existing metal bracket; if a hollow pattern structure 4 with the same shape as the surface of the rhinestone 1 is provided on both surfaces of the rhinestone 1, the inlay carrier with the hollow pattern structure 4 has the function of an existing metal edging; the hollow pattern structure 4 can also be in various shapes such as lace or flowers, plants, animals, etc.
[0051] In a preferred embodiment, the periphery of the hollow pattern structure 4 is designed to be various lace-like. The periphery of the hollow pattern structure 4 is designed to be lace-like to increase the overall aesthetic feeling, such as being designed to be wavy lace, flowers and plants.
[0052] In a preferred solution, a metal fitting 5 is tin-welded or laser-welded on the region of the inlay carrier where the hollow pattern structure 4 is not provided. A necklace or the like is made by welding the metal fitting 5.
[0053] Embodiment 2:
[0054] The rhinestone metal reflective hollow inlaid structure ornament proposed in this embodiment is different from the rhinestone metal reflective hollow inlaid structure ornament of the first embodiment only in that the structure of the bottom reflective conductive layer 2 is different, such as Figure 3As shown, the bottom reflective conductive layer 2 is composed of a titanium bottom reflective layer 24 and a copper conductive layer 23 arranged in sequence from the inside to the outside. The titanium bottom reflective layer 24 is formed by vacuum electroplating a layer of titanium on the outer surface of the diamond 1, and the copper conductive layer 23 is formed by vacuum electroplating a layer of copper on the outer surface of the titanium bottom reflective layer 24. The metal outer layer 3 is formed by electrodepositing a layer of copper on the outer surface of the copper conductive layer 23. Since the vacuum-plated titanium layer has good compatibility with the glass rhinestone 1, and the titanium layer can be made into a variety of different colors for reflective effect, the vacuum-plated titanium layer takes into account both the primer and reflective effects, so the titanium layer is selected as the primer reflective layer; copper has good conductivity, so the copper layer is selected as the conductive layer; since the titanium primer reflective layer 24 and the copper conductive layer 23 are both formed by vacuum plating, the thickness of the titanium primer reflective layer 24 and the copper conductive layer 23 formed by vacuum plating can only reach micrometer level at most, and rhinestone jewelry usually needs to be welded with various accessories before use, so in order to be able to weld various accessories, a metal outer layer 3 (micrometer level to millimeter level) is electrodeposited outside the copper conductive layer 23, and the thicker metal outer layer 3 can highlight the metal layered texture of the rhinestone jewelry; in addition, the metal outer layer 3 can be easily electrodeposited on the copper conductive layer 23. Here, the titanium primer reflective layer 24 plays a dual role of primer and reflective, so the thickness can be set to micrometer level; the thickness of the copper conductive layer 23 can be set to micrometer level; the thickness of the metal outer layer 3 can be set to micrometer level to millimeter level.
[0055] In a preferred embodiment, the hollow pattern structure 4 is formed by etching after a protective layer is formed by spraying etching protective ink or electrophoretic etching protective paint on the inlaid carrier. Specifically, the metal outer layer 3 and the copper conductive layer 23 are etched with hydrochloric acid and ferric chloride or a commercially available copper etching solution. After removing the protective layer, a sodium hydroxide aqueous solution with a concentration of about 3% and a hydrogen peroxide concentration of about 30% are added. The hydrogen peroxide with a weight percentage of about 15% is added to the sodium hydroxide aqueous solution to form an etching solution to etch the titanium base reflective layer 24.
[0056] Embodiment three:
[0057] The rhinestone metal reflective hollow inlaid structure ornament proposed in this embodiment is different from the rhinestone metal reflective hollow inlaid structure ornament of the first or second embodiment only in the structure of the bottom reflective conductive layer 2. Figure 4As shown, the bottom reflective conductive layer 2 is composed of a titanium bottom layer 21 and a silver reflective conductive layer 25 which are arranged in sequence from the inside to the outside. The titanium bottom layer 21 is formed by vacuum electroplating a layer of titanium on the outer surface of the diamond 1, the silver reflective conductive layer 25 is formed by vacuum electroplating a layer of silver on the outer surface of the titanium bottom layer 21, and the metal outer layer 3 is formed by electrodepositing a layer of copper on the outer surface of the silver reflective conductive layer 25. Since the titanium base layer 21 formed by vacuum electroplating titanium has good bonding with the glass rhinestone 1, the titanium layer is selected as the base layer; silver has good reflective effect and good electrical conductivity, so the silver layer is selected as the reflective conductive layer; since the titanium base layer 21 and the silver reflective conductive layer 25 are both formed by vacuum electroplating, the thickness of the titanium base layer 21 and the silver reflective conductive layer 25 formed by vacuum electroplating can only reach the micrometer level at most, and rhinestone jewelry usually needs to be welded with various accessories before use, so in order to be able to weld various accessories, a metal outer layer 3 (micrometer level to millimeter level) is electrodeposited outside the silver reflective conductive layer 25, and the thicker metal outer layer 3 can highlight the metal layered texture of the rhinestone jewelry; in addition, the metal outer layer 3 can be easily electrodeposited on the silver reflective conductive layer 25. Here, the thickness of the titanium base layer 21 can be set to nanometer level, and should not be too thick, because if it is too thick, it will affect the silver reflective conductive layer 25; the thickness of the silver reflective conductive layer 25 can be set to micrometer level; the thickness of the metal outer layer 3 can be set to micrometer level to millimeter level.
[0058] In a preferred embodiment, the hollow pattern structure 4 is formed by etching after a protective layer is formed by spraying etching protective ink or electrophoretic etching protective paint on the inlaid carrier. Specifically, the metal outer layer 3 is first etched with hydrochloric acid and ferric chloride or a commercially available copper etching solution, and then the silver reflective conductive layer 25 is etched with a silver etching solution or a dilute nitric acid solution. After removing the protective layer, a sodium hydroxide aqueous solution with a concentration of about 3% and a hydrogen peroxide with a concentration of about 30% are added, and the hydrogen peroxide with a weight percentage of about 15% is added to the sodium hydroxide aqueous solution to form an etching solution to etch the titanium base layer 21.
[0059] Embodiment 4:
[0060] The present embodiment proposes a rhinestone metal reflective hollow inlaid structure ornament, which is different from the rhinestone metal reflective hollow inlaid structure ornament of the third embodiment only in that the metal outer layer 3 is formed by electro-depositing a layer of silver on the outer surface of the silver reflective conductive layer 25 .
[0061] In a preferred embodiment, the hollow pattern structure 4 is formed by etching the embedded carrier after spraying etching protective ink or electrophoretic etching protective paint to form a protective layer. Specifically, there is no need to use hydrochloric acid plus ferric chloride or commercially available copper etching solution to etch the metal outer layer 3. The metal outer layer 3 and the silver reflective conductive layer 25 are directly etched using silver etching solution or dilute nitric acid solution.
[0062] Embodiment five:
[0063] The present embodiment proposes a rhinestone metal reflective hollow inlaid structure ornament, which is made into a part for stringing into a bracelet or necklace by setting a through hole on the basis of the rhinestone metal reflective hollow inlaid structure ornament proposed in the first, second or third embodiment, that is, a through hole for threading a hanging rope is set through the rhinestone to form a crystal bead, and multiple semi-finished products with through holes or multiple rhinestone ornaments with the same hollow pattern structure or multiple rhinestone ornaments with different hollow pattern structures can be strung into a bracelet or necklace, etc.
[0064] Embodiment six:
[0065] The present embodiment proposes a rhinestone metal reflective hollow inlaid structure ornament, which adds decorative plating on the basis of the rhinestone metal reflective hollow inlaid structure ornament proposed in the first, second, third or fourth embodiments, that is, decorative plating is provided on the area of the inlay carrier where the hollow pattern structure is not provided, and the decorative plating can be gold or silver or imitation gold or platinum or imitation platinum decorative plating, and the specific location and thickness of the decorative plating can be determined according to the aesthetics or other requirements of the rhinestone ornament to be produced.
[0066] Embodiment seven:
[0067] The present embodiment proposes a rhinestone metal reflective hollow inlaid structure ornament, which has the same other structures as the rhinestone metal reflective hollow inlaid structure proposed in the first or third embodiment, and the only difference is the base layer. The base layer in the present embodiment is a silicon base layer, which is formed by vacuum electroplating a layer of silicon on the outer surface of the rhinestone.
[0068] In actual processing, the primer materials are not limited to titanium and silicon, and other materials that have good bonding properties with glass and are environmentally friendly can also be used as primer materials.
[0069] Embodiment eight:
[0070] The present embodiment proposes a rhinestone metal reflective hollow inlaid structure ornament, which adds a transition coating on the basis of the rhinestone metal reflective hollow inlaid structure ornament proposed in the first, second or third embodiment, that is, before the metal outer layer is electroplated, a layer of alkaline copper or copper pyrophosphate is electroplated as a transition coating. For the structure of the first embodiment, the transition coating is located between the copper conductive layer and the metal outer layer; for the structure of the second embodiment, the transition coating is also located between the copper conductive layer and the metal outer layer; for the structure of the third embodiment, the transition coating is located between the silver reflective conductive layer and the metal outer layer.
[0071] Embodiment nine:
[0072] The present embodiment proposes a rhinestone metal reflective hollow inlaid structure ornament, which includes a rhinestone. After the rhinestone is bombarded by a bombardment power source, a reflective conductive layer and a metal outer layer are sequentially closely arranged on the outer surface of the rhinestone to form a semi-finished product. The semi-finished product is provided with a plurality of hollow pattern structures for the inlay carrier composed of the reflective conductive layer and the metal outer layer, so that part of the surface of the rhinestone is exposed through the hollow pattern structure to form a rhinestone metal reflective hollow inlaid structure ornament with a metal layered texture.
[0073] In a preferred solution, the reflective conductive layer is composed of a silver reflective layer and a copper conductive layer arranged in sequence from the inside to the outside. The silver reflective layer is formed by vacuum electroplating a layer of silver on the outer surface of the diamond after being bombarded by the bombardment power supply. The copper conductive layer is formed by vacuum electroplating a layer of copper on the outer surface of the silver reflective layer. The metal outer layer is formed by electrodepositing a layer of copper on the outer surface of the copper conductive layer. Here, the diamond is first bombarded with a bombardment power supply in a vacuum coating machine, so that there is no need for a titanium base layer, and a layer of silver is directly vacuum electroplated on the outer surface of the diamond to form a silver reflective layer.
[0074] Embodiment ten:
[0075] The present embodiment proposes a diamond metal reflective hollow inlaid structure ornament, which is basically the same as the structure of the eighth embodiment, except that the reflective conductive layer of the present embodiment is a silver reflective conductive layer, which is formed by vacuum electroplating a layer of silver on the outer surface of the diamond after being bombarded by the bombardment power supply, and the metal outer layer is formed by electrodepositing a layer of copper on the outer surface of the silver reflective conductive layer. Here, the diamond is first bombarded with the bombardment power supply in a vacuum coating machine, so that there is no need for a titanium base layer, and a layer of silver is directly vacuum electroplated on the outer surface of the diamond to form a silver reflective conductive layer; the silver reflective conductive layer can also be replaced by a copper layer or other single metal layer or alloy layer.
[0076] The metal hollow inlay structure of the rhinestone metal reflective hollow inlay structure jewelry of the above-mentioned embodiments can also be applied to crystal accessories such as crystal beads and crystal pendants with or without holes in various shapes, and can also be applied to jewelry gems or jewelry zircons. The jewelry gems need to be acid-resistant and alkali-resistant.
[0077] Embodiment eleven:
[0078] This embodiment provides a method for processing the rhinestone metal reflective hollow inlaid structure ornament of the first embodiment, which comprises the following steps:
[0079] Step 1: Use vacuum plating technology to vacuum plate a layer of titanium on the outer surface of the rhinestone to form a transparent titanium base layer.
[0080] Since titanium has good bonding properties with glass rhinestones and silver, a transparent titanium layer is first vacuum plated on the outer surface of the rhinestone. The setting of the titanium layer does not affect the reflective effect of the subsequent silver layer. Here, the thickness of the titanium base layer is generally designed to be 0.01 micron to 0.5 micron, such as 0.07 micron.
[0081] Step 2: Use vacuum electroplating technology to vacuum electroplate a layer of silver on the outer surface of the titanium base layer until it is opaque, forming an opaque silver reflective layer.
[0082] Since the silver layer is used as a reflective layer and has a reflective effect, the silver layer must be plated to at least an opaque state. Here, the thickness of the silver reflective layer is generally designed to be 0.05 microns to 5 microns, such as specifically designed to be 3 microns.
[0083] Step 3: vacuum electroplating a layer of copper on the outer surface of the silver reflective layer using vacuum electroplating technology to form a copper conductive layer.
[0084] The metallic silver actually has the function of conducting electricity and combining with the later electrodeposition, but in order to save costs, a copper layer is vacuum plated as a conductive layer. Here, the thickness of the copper conductive layer is generally designed to be 0.2 microns to 8 microns, such as 4 microns.
[0085] Step 4: Using the electroplating technology, the copper conductive layer is used as the cathode, and a layer of copper is electroplated on the outer surface of the copper conductive layer by electric current to form a metal outer layer. Thus, an inlay carrier consisting of a titanium base layer, a silver reflective layer, a copper conductive layer and a metal outer layer, and a semi-finished product consisting of a rhinestone and an inlay carrier wrapped around the rhinestone are obtained.
[0086] Here, the composition of the existing electrodeposition solution used in the electrodeposition technology is: 180-240 grams per liter of copper sulfate, 25-50 milliliters per liter of sulfuric acid, 60-100 milligrams per liter of chloride ions, and brightener. When configuring the electrodeposition solution, the amount of copper sulfate, sulfuric acid, chloride ions and brightener can be determined according to actual conditions; the thickness of the metal outer layer is greater than 0.01 mm, such as 0.06 mm in design.
[0087] Step 5: Spray etching protection ink or electrophoretic etching protection paint on the semi-finished inlay carrier, and bake to form a protective layer.
[0088] Step 6: Use a laser marking machine to draw the designed pattern on the protective layer.
[0089] The process of patterning is to expose the area to be etched so that it can be directly exposed to the etching liquid. Here, the laser marking machine can use the existing 30W fiber laser.
[0090] Step 7: Put the semi-finished product with the pattern into the etching machine, and first etch the inlay carrier of the semi-finished product with the pattern using copper etching solution, and then etch it using silver etching solution or dilute nitric acid solution. If the titanium base layer is not completely removed after etching, then remove the protective layer and then etch it again using titanium etching solution. After etching, a hollow pattern structure identical to the designed pattern is formed on the inlay carrier, and part of the surface of the rhinestone is exposed through the hollow pattern structure to form a rhinestone jewelry with a metal layered texture. Here, the copper etching solution is heated to 40℃~50℃ before use; the specific etching process is: first use hydrochloric acid plus ferric chloride or commercially available copper etching solution to etch the metal outer layer and the copper conductive layer, then use silver etching solution or dilute nitric acid solution to etch the silver reflective layer, and then use a sodium hydroxide aqueous solution with a concentration of about 3% and a hydrogen peroxide concentration of about 30% after removing the protective layer, and add hydrogen peroxide with a weight percentage of about 15% to the sodium hydroxide aqueous solution to form an etching solution to etch the titanium base layer.
[0091] As mentioned above, the vacuum electroplating titanium base layer, silver reflective layer, and copper conductive layer all adopt a multi-arc ion magnetron sputtering coating machine, and the process parameters are: the vacuum degree of the vacuum chamber is 8×10 -3 Pa, and use a working gas such as argon with a flow rate of 20sccm to 150sccm (such as 80sccm) to adjust the vacuum degree of the vacuum chamber and the product color, and the temperature adopts the temperature of conventional coating; the area where the inlaid carrier is not provided with a hollow pattern structure is tin-soldered or laser-welded with metal accessories.
[0092] Embodiment 12:
[0093] This embodiment provides a method for processing the rhinestone metal reflective hollow inlaid structure ornament of the second embodiment, which comprises the following steps:
[0094] Step 1: Use vacuum electroplating technology to vacuum electroplate a layer of titanium on the outer surface of the rhinestone until it is opaque, forming an opaque titanium base reflective layer. Since the combination of metal titanium and glass rhinestones is good, and the titanium layer can be made into a variety of different colors to play a reflective role, vacuum electroplating a layer of titanium takes into account both the base and the reflective role, so the titanium layer is selected as the base reflective layer. Of course, the thickness of the titanium layer as the base reflective layer should be appropriately thickened, and the thickness of the titanium base reflective layer is designed to be 0.1 microns to 5 microns, such as 2 microns.
[0095] Step 2: vacuum electroplating a layer of copper on the outer surface of the titanium base reflective layer using vacuum electroplating technology to form a copper conductive layer.
[0096] Since the combination of metal titanium and electrodeposition is not good, a copper layer is vacuum plated on the titanium layer. Here, the thickness of the copper conductive layer is generally designed to be 0.2 microns to 8 microns, such as 4 microns.
[0097] Step 3: Using the electroplating technology, the copper conductive layer is used as the cathode, and a layer of copper is electroplated on the outer surface of the copper conductive layer by electric current to form a metal outer layer. Thus, an inlay carrier consisting of a titanium base reflective layer, a copper conductive layer and a metal outer layer, and a semi-finished product consisting of a rhinestone and an inlay carrier wrapped around the rhinestone are obtained.
[0098] Here, the composition of the existing electrodeposition solution used in the electrodeposition technology is: 180-240 grams per liter of copper sulfate, 25-50 milliliters per liter of sulfuric acid, 60-100 milligrams per liter of chloride ions, and brightener. When configuring the electrodeposition solution, the amount of copper sulfate, sulfuric acid, chloride ions and brightener can be determined according to actual conditions; the thickness of the metal outer layer is greater than 0.01 mm, such as 0.06 mm in design.
[0099] Step 4: Spray etching protection ink or electrophoretic etching protection paint on the semi-finished inlay carrier, and bake to form a protective layer.
[0100] Step 5: Use a laser marking machine to draw a pattern on the protective layer according to the designed pattern.
[0101] Mapping is to expose the area to be etched so that it can directly contact the etching liquid. Here, the laser marking machine can use the existing 30W fiber laser.
[0102] Step 6: Place the semi-finished product with a pattern into the etching machine, first use copper etching liquid to etch the inlay carrier of the semi-finished product with a pattern, then remove the protective layer, and then use titanium etching liquid to etch again. After etching, a hollow pattern structure identical to the designed pattern is formed on the inlay carrier, and part of the surface of the rhinestone is exposed through the hollow pattern structure to form a rhinestone jewelry with a metal layered texture. Here, the copper etching liquid is heated to 40℃~50℃ before use; hydrochloric acid plus ferric chloride etching liquid can be used as the copper etching liquid, and sodium hydroxide plus hydrogen peroxide can be used as the titanium etching liquid.
[0103] As mentioned above, the vacuum electroplating titanium base reflective layer and copper conductive layer are both coated by multi-arc ion magnetron sputtering coating machine, and the process parameters are: the vacuum degree of the vacuum chamber is 8×10 -3 Pa, and use a working gas such as argon with a flow rate of 20sccm to 150sccm to adjust the vacuum degree of the vacuum chamber and the color of the product. The temperature adopts the temperature of conventional coating. The metal accessories are tin-welded or laser-welded on the area where the hollow pattern structure is not provided on the inlaid carrier, or before the vacuum electroplating of the copper conductive layer, the metal accessories are glued on the titanium base reflective layer or on the base material. The glue generally uses resin glue.
Claims
1. A rhinestone metal reflective hollow inlaid structure ornament, comprising rhinestones, characterized in that: The outer surface of the rhinestone is sequentially and closely provided with a base reflective conductive layer and a metal outer layer to form a semi-finished product, and the semi-finished product is provided with a plurality of hollow pattern structures for the inlay carrier formed by the base reflective conductive layer and the metal outer layer, so that part of the surface of the rhinestone is exposed through the hollow pattern structure to form a metal reflective hollow inlay structure ornament with a metal layered texture; The bottom reflective conductive layer is composed of a bottom layer, a silver reflective layer and a copper conductive layer arranged in sequence from the inside to the outside, or the bottom reflective conductive layer is composed of a titanium bottom reflective layer and a copper conductive layer arranged in sequence from the inside to the outside, and the metal outer layer is electrodeposited on the outer surface of the copper conductive layer; or the bottom reflective conductive layer is composed of a bottom layer and a silver reflective conductive layer arranged in sequence from the inside to the outside, and the metal outer layer is electrodeposited on the outer surface of the silver reflective conductive layer.
2. The rhinestone metal reflective hollow inlaid structure ornament according to claim 1, characterized in that: The base layer is formed by vacuum electroplating a layer of titanium, a layer of silicon or a layer of chromium on the outer surface of the rhinestone; the silver reflective layer is formed by vacuum electroplating a layer of silver on the outer surface of the base layer; the copper conductive layer is formed by vacuum electroplating a layer of copper on the outer surface of the silver reflective layer; and the metal outer layer is formed by electrodepositing a layer of copper on the outer surface of the copper conductive layer.
3. The rhinestone metal reflective hollow inlaid structure ornament according to claim 1, characterized in that: The titanium base reflective layer is formed by vacuum electroplating a layer of titanium on the outer surface of the rhinestone, the copper conductive layer is formed by vacuum electroplating a layer of copper on the outer surface of the titanium base reflective layer, and the metal outer layer is formed by electrodepositing a layer of copper on the outer surface of the copper conductive layer.
4. The rhinestone metal reflective hollow inlaid structure ornament according to claim 1, characterized in that: The base layer is formed by vacuum electroplating a layer of titanium, a layer of silicon or a layer of chromium on the outer surface of the rhinestone, the silver reflective conductive layer is formed by vacuum electroplating a layer of silver on the outer surface of the base layer, and the metal outer layer is formed by electrodepositing a layer of copper on the outer surface of the silver reflective conductive layer.
5. The rhinestone metal reflective hollow inlaid structure ornament according to claim 1, characterized in that: The base layer is formed by vacuum electroplating a layer of titanium, a layer of silicon or a layer of chromium on the outer surface of the rhinestone, the silver reflective conductive layer is formed by vacuum electroplating a layer of silver on the outer surface of the base layer, and the metal outer layer is formed by electrodepositing a layer of silver on the outer surface of the silver reflective conductive layer.
6. The rhinestone metal reflective hollow inlaid structure ornament according to any one of claims 2 to 5, characterized in that: Before electrodepositing the metal outer layer, a layer of alkaline copper or copper pyrophosphate is electroplated as a transition layer.
7. The rhinestone metal reflective hollow inlaid structure ornament according to claim 6, characterized in that: The hollow pattern structure is formed by etching the inlay carrier after spraying etching protection ink or electrophoresis etching protection paint.
8. The rhinestone metal reflective hollow inlaid structure ornament according to claim 7, characterized in that: The hollow pattern structure is in the same shape as the surface of the rhinestone, the periphery of the hollow pattern structure is designed to be lace-like, metal accessories are tinned or laser welded on the area of the inlay carrier where the hollow pattern structure is not provided, and decorative plating is provided on the area of the inlay carrier where the hollow pattern structure is not provided.
9. The rhinestone metal reflective hollow inlaid structure ornament according to claim 1, characterized in that: The rhinestones are replaced by ornamental gemstones or ornamental zircons or crystal beads, and the crystal beads are formed by penetrating a through hole for passing a hanging rope through the rhinestones.
10. A rhinestone metal reflective hollow inlaid structure ornament, comprising rhinestones, characterized in that: After the water rhinestone is bombarded by the bombardment power source, a reflective conductive layer and a metal outer layer are sequentially closely arranged on the outer surface of the water rhinestone to form a semi-finished product. On the semi-finished product, a plurality of hollow pattern structures are arranged for the inlay carrier composed of the reflective conductive layer and the metal outer layer, so that part of the surface of the water rhinestone is exposed through the hollow pattern structure to form a metal reflective hollow inlay structure ornament with a metal layered texture.
11. The rhinestone metal reflective hollow inlaid structure ornament according to claim 10, characterized in that: The reflective conductive layer is composed of a silver reflective layer and a copper conductive layer arranged in sequence from the inside to the outside. The silver reflective layer is formed by vacuum electroplating a layer of silver on the outer surface of the water diamond after being bombarded by a bombardment power source. The copper conductive layer is formed by vacuum electroplating a layer of copper on the outer surface of the silver reflective layer. The metal outer layer is formed by electrodepositing a layer of copper on the outer surface of the copper conductive layer.
12. The rhinestone metal reflective hollow inlaid structure ornament according to claim 10, characterized in that: The reflective conductive layer is a silver reflective conductive layer, which is formed by vacuum electroplating a layer of silver on the outer surface of the diamond after being bombarded by a bombardment power source, and the metal outer layer is formed by electro-depositing a layer of copper on the outer surface of the silver reflective conductive layer.
13. A method for processing the rhinestone metal reflective hollow inlaid structure jewelry according to claim 2, characterized in that: The following steps are involved: Step 1: Use vacuum electroplating technology to vacuum electroplate a layer of titanium on the outer surface of the rhinestone to form a transparent titanium base layer; Step 2: vacuum electroplating a layer of silver on the outer surface of the titanium base layer until it is opaque, forming an opaque silver reflective layer; Step 3: vacuum electroplating a layer of copper on the outer surface of the silver reflective layer using vacuum electroplating technology to form a copper conductive layer; Step 4: using the electrodeposition technology, the copper conductive layer is used as a cathode, and a layer of copper is electrodeposited on the outer surface of the copper conductive layer by electric current to form a metal outer layer, thereby obtaining an inlay carrier consisting of a titanium base layer, a silver reflective layer, a copper conductive layer and a metal outer layer, and a semi-finished product consisting of a diamond and an inlay carrier wrapped outside the diamond; Step 5: spray etching protection ink or electrophoretic etching protection paint on the semi-finished inlay carrier, and bake to form a protective layer; Step 6: Use a laser marking machine to draw a pattern on the protective layer according to the designed pattern; Step seven: put the semi-finished product with the pattern into the etching machine, first etch the inlay carrier of the semi-finished product with the pattern using copper etching solution, and then etch it using silver etching solution or dilute nitric acid solution. If the titanium base layer is not completely removed after etching, remove the protective layer and then etch it again using titanium etching solution. After etching, a hollow pattern structure identical to the designed pattern is formed on the inlay carrier, and part of the surface of the rhinestone, gemstone or zircon is exposed through the hollow pattern structure to form a metal reflective hollow inlay structure ornament with a metal layered texture.
14. The method for processing a metal reflective hollow inlaid structure ornament according to claim 13, characterized in that: The thickness of the titanium base layer is 0.01 micron to 0.5 micron, the thickness of the silver reflective layer is 0.05 micron to 5 micron, the thickness of the copper conductive layer is 0.2 micron to 8 micron, and the thickness of the metal outer layer is greater than 0.01 mm; the titanium base layer, the silver reflective layer, and the copper conductive layer are vacuum plated using a multi-arc ion magnetron sputtering coating machine, and the process parameters are: the vacuum degree of the vacuum chamber is 8×10 -3 Pa, and the vacuum degree and color of the vacuum chamber are adjusted with a working gas with a flow rate of 20sccm to 150sccm; metal accessories are tin-welded or laser-welded on the area of the inlay carrier where the hollow pattern structure is not provided.
15. A method for processing the rhinestone metal reflective hollow inlaid structure jewelry according to claim 3, characterized in that: The following steps are involved: Step 1: Use vacuum electroplating technology to vacuum electroplate a layer of titanium on the outer surface of the rhinestone until it is opaque, forming an opaque titanium base reflective layer; Step 2: vacuum electroplating a layer of copper on the outer surface of the titanium base reflective layer using vacuum electroplating technology to form a copper conductive layer; Step 3: using the electrodeposition technology, the copper conductive layer is used as a cathode, and a layer of copper is electrodeposited on the outer surface of the copper conductive layer by electric current to form a metal outer layer, thereby obtaining an inlay carrier consisting of a titanium base reflective layer, a copper conductive layer and a metal outer layer, and a semi-finished product consisting of a diamond and an inlay carrier wrapped outside the diamond; Step 4: spray etching protection ink or electrophoretic etching protection paint on the semi-finished inlay carrier, and bake to form a protective layer; Step 5: Use a laser marking machine to draw a pattern on the protective layer according to the designed pattern; Step 6: Place the semi-finished product with a pattern into the etching machine, first use copper etching solution to etch the inlay carrier of the semi-finished product with a pattern, then remove the protective layer, and then use titanium etching solution to etch again. After etching, a hollow pattern structure identical to the designed pattern is formed on the inlay carrier, and part of the surface of the rhinestone is exposed through the hollow pattern structure to form a metal reflective hollow inlay structure ornament with a metal layered texture.
16. The method for processing a metal reflective hollow inlaid structure ornament according to claim 15, characterized in that: The thickness of the titanium base reflective layer is 0.1 micron to 5 microns, the thickness of the copper conductive layer is 0.2 micron to 8 microns, and the thickness of the metal outer layer is greater than 0.01 mm; the titanium base reflective layer and the copper conductive layer are vacuum plated using a multi-arc ion magnetron sputtering coating machine, and the process parameters are: the vacuum degree of the vacuum chamber is 8×10 -3 Pa, and use a working gas with a flow rate of 20sccm to 150sccm to adjust the vacuum degree of the vacuum chamber and the product color; the inlay carrier is not provided with the hollow pattern structure in the area where the metal accessories are tinned or laser welded, or before the vacuum electroplating of the copper conductive layer, the metal accessories are glued on the titanium base reflective layer or on the base material before the base layer.