Display device
By designing the joint structure of the projection and depression on the pad electrode of the display panel, the problem of laser beam flowing into the display panel is solved, the reliability of the product is improved and the surrounding area is minimized.
Patent Information
- Application Number
- CN201911240951.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2019-03-25
- Filing Date
- 2019-12-06
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2039-12-06
AI Technical Summary
During side bonding of the display panel, the laser beam may flow into the interior of the display panel through the gap between the pad electrodes, resulting in damage to the signal line and the light-emitting element, affecting the reliability of the product.
A pad electrode is designed, including a projection and a depression such that the adjacent pad electrodes are arranged to engage, thereby preventing the inflow of the laser beam through the gap.
Through this structure, the laser beam is effectively prevented from entering the display panel, improving product reliability, and reducing the size of the surrounding area.
Smart Images

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Abstract
Description
Technical Field
[0001] The present invention relates to a display device, and more particularly to a display device including a pad electrode and a manufacturing method thereof. Background Art
[0002] Various display devices such as a liquid crystal display (LCD), an organic light emitting diode display (OLED), and a quantum dot display device include a display panel having a plurality of pixels capable of displaying images and a driving circuit unit capable of driving the display panel.
[0003] The display panel includes a display area in which a plurality of pixels are formed. A bezel area as a peripheral area in which an image cannot be displayed may be arranged around the display area. Various driving circuits and wirings may be arranged in the bezel area.
[0004] Recently, in order to reduce the peripheral area of the non-display area as described above, research and development of a side bonding technology for bonding an integrated circuit (IC) or other printed circuits, wiring, etc. to the side surface of a display panel has been actively conducted. Summary of the invention
[0005] An object of the embodiment is to provide a display device and a method for manufacturing the same as follows: a pad electrode includes a protruding portion and a recessed portion so that adjacent pad electrodes are arranged to be interlocked, thereby preventing a laser beam used in side bonding from flowing into a display panel through a gap between the pad electrodes, thereby improving product reliability, and eliminating the need for a separate dummy pattern, thereby minimizing the surrounding area.
[0006] A display device according to an embodiment includes: a display panel including a wiring layer; and a flexible circuit substrate, which is located on a first side of the display panel extending along a first direction and includes a side pad, wherein the wiring layer includes a pad electrode, the pad electrode is provided with a protruding portion on a first side, and is provided with a recessed portion on a second side opposite to the first side, the protruding portion and the recessed portion are arranged to be engaged between adjacent pad electrodes, and the side pad is electrically connected to the pad electrode on the first side.
[0007] The display panel may further include a second side surface extending along a second direction, the second direction being a direction crossing the first direction, and the flexible circuit substrate is arranged on the second side surface.
[0008] The protruding portion may protrude from the first edge in a direction by a first width, and the recessed portion may be recessed from the second edge in the direction by a second width.
[0009] The protruding portion and the recessed portion may have shapes corresponding to each other.
[0010] The protrusion may form an overlapping portion disposed deeper than an outermost side of the adjacent pad electrode, the overlapping portion having a third width.
[0011] The first width and the second width may be greater than or equal to the third width.
[0012] The protruding portion and the recessed portion may have a polygonal shape.
[0013] The first side may be provided with two or more of the protruding portions, and the second side may be provided with the same number of the concave portions as the protruding portions so as to be engaged with the first side.
[0014] The protruding portion and the recessed portion may have a shape including a curved portion.
[0015] The display panel may include a first display plate and a second display plate facing and attached to each other, the first display plate including the wiring layer.
[0016] The wiring layer may include a first wiring layer and a second wiring layer, the first wiring layer includes a first pad layer, the second wiring layer includes a second pad layer, and the first pad layer and the second pad layer constitute the pad electrode.
[0017] The first cushion layer and the second cushion layer may be in direct contact with each other.
[0018] The first wiring layer may further include a gate electrode, and the second wiring layer may further include a data line, a first electrode, and a second electrode.
[0019] A semiconductor layer may be disposed on the gate electrode, and the gate electrode, the semiconductor layer, the first electrode, and the second electrode constitute a transistor.
[0020] The second display panel may include a color filter.
[0021] A data driving unit or a gate driving unit may be mounted on the flexible circuit substrate, and a driving circuit substrate may be electrically connected to the flexible circuit substrate.
[0022] The side pad may be arranged at a portion corresponding to the pad electrode on the first side.
[0023] A method for manufacturing a display device according to an embodiment includes the following steps: cleaning a side of a display panel to which a first display panel and a second display panel facing the first display panel are attached; after the cleaning step, coating the side of the display panel with a conductive paste; and after the coating step, patterning the conductive paste with the laser beam to form a side pad, wherein the first display panel includes a wiring layer, a transistor, and a light-emitting element, the wiring layer includes a pad electrode, the pad electrode is provided with a protruding portion on a first side and a recessed portion on a second side opposite to the first side, and the side pad is electrically connected to the pad electrode on the first side.
[0024] The protrusion may protrude from the first edge in one direction by a first width, the recess may be recessed from the second edge in the one direction by a second width, the protrusion and the recess are arranged to bite each other, and the protrusion includes an overlapping portion arranged deeper than the outermost edge of the adjacent pad electrode.
[0025] In the step of forming the side pad, the laser beam is applied to the protruding portion of the pad electrode so that the laser beam cannot reach the wiring layer, the transistor, and the light emitting element.
[0026] According to an embodiment, a pad electrode having protrusions and depressions is formed on a substrate of a display panel, thereby preventing a laser beam from reaching a signal line, a transistor, etc. when a side pad is formed on a side of the display panel, thereby improving defects of the display device and enhancing product reliability.
[0027] Also, when forming the side pad, there is no need to form a dummy pattern for preventing damage to a signal line or the like inside the display panel, so that the surrounding area can be minimized. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] Figure 1 is a perspective view schematically illustrating a display device according to an embodiment.
[0029] Figure 2 is a perspective view schematically illustrating a portion of a display device according to an embodiment.
[0030] Figure 3 Observe from one direction Figure 2 Schematic floor plan of .
[0031] Figure 4 The diagram is based on Figure 2 A cross-sectional view of the cross section taken along line IV-IV'.
[0032] Figure 5 is a plan view schematically illustrating a portion of a display device according to an embodiment.
[0033] Figure 6 and Figure 7 Each of them is a plan view schematically illustrating a part of a display device according to another embodiment.
[0034] Figure 8 is a block diagram illustrating a method for manufacturing a display device according to an embodiment.
[0035] Fig. 9 , Fig.10 and Fig.11 It is a schematic diagram showing Figure 8 A three-dimensional diagram of a display device according to an embodiment of the present invention is provided.
[0036] Explanation of symbols
[0037] 1000: Display device 10: Display panel
[0038] 100: first display panel 200: second display panel
[0039] 110: first substrate 210: second substrate
[0040] 120: first wiring layer 170: second wiring layer
[0041] 120p: First cushion layer 170p: Second cushion layer
[0042] 400: Side pad 500: Flexible circuit substrate
[0043] 600: Driving circuit substrate PE: Pad electrode
[0044] PEa: convex part PEb: concave part DETAILED DESCRIPTION
[0045] Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings so that a person having basic knowledge in the technical field to which the present invention belongs can easily implement the present invention. The present invention can be implemented in many different forms and is not limited to the embodiments described herein.
[0046] In order to clearly describe the present invention, parts not related to the description are omitted, and the same or similar components are given the same reference numerals throughout the specification.
[0047] Furthermore, for the sake of convenience, the size and thickness of each structure shown in the drawings are arbitrarily shown, and therefore the present invention is not limited to the contents shown in the drawings. In order to clearly express multiple layers and regions in the drawings, the thickness is enlarged and shown. Furthermore, in the drawings, for the sake of convenience, the thickness of some layers and regions is exaggerated.
[0048] Furthermore, when a layer, film, region, plate or the like is mentioned as being "above" or "on" another part, it includes not only the case where the other part is "immediately above" but also the case where there is another part between the two. In contrast, when a part is mentioned as being "immediately above" another part, it means that there is no other part between the two. Furthermore, "above" or "on" a part used as a reference means being located above or below the part used as a reference, and does not necessarily mean being "above" or "on" in the direction opposite to gravity.
[0049] Furthermore, throughout the specification, when it is mentioned that a certain part “includes” a certain constituent element, unless otherwise stated, it does not mean that other constituent elements are excluded but rather that other constituent elements may be included.
[0050] Also, throughout the specification, when "on a plane" is mentioned, this means that the subject portion is observed from above, and when "on a section" is mentioned, this means that a section vertically cutting the subject portion is observed from the side.
[0051] Below, use Figure 1 A display device according to an embodiment is described. Figure 1 is a perspective view schematically illustrating a display device according to an embodiment.
[0052] Reference Figure 1 According to an embodiment, a display device 1000 includes a display panel 10, a flexible circuit substrate 500 attached to a side of the display panel 10, and a driving circuit substrate 600. The display panel 10 includes a first display plate 100 and a second display plate 200.
[0053] The display panel 10 may include a first display plate 100 and a second display plate 200 attached to each other, and although not shown, may further include a backlight unit at a lower portion of the first display plate 100 .
[0054] The display device 1000 of this embodiment may be a display device in which a liquid crystal layer 300 is disposed between a first display panel 100 and a second display panel 200 (see Figure 4 ) of a liquid crystal display (LCD: liquid crystal display). Moreover, the display device 1000 according to an embodiment may also be a display device in which an organic light emitting element is arranged between the first display panel 100 and the second display panel 200 instead of the liquid crystal layer 300 (refer to Figure 4) of an organic light emitting display device (OLED: organic light emitting diode display). At this time, at least one of the first display panel 100 and the second display panel 200 may include a touch electrode capable of sensing a touch from the outside. According to an embodiment, the display device 1000 may also be a quantum dot organic light emitting display device (QD-OLED: quantum dot-organic light emitting diode display) further including a color conversion layer including quantum dots between the first display panel 100 and the second display panel 200. Alternatively, the display device 1000 according to an embodiment may also include a color conversion layer including quantum dots but not including a color filter CF (refer to Figure 4 ) of a quantum dot light emitting display (QLED: quantum dot-light emitting display) with a color conversion layer. In this case, the display device 1000 may further include a backlight unit that emits blue light. The display device 1000 according to an embodiment is not limited to the above example.
[0055] In the display panel 10 according to an embodiment, the first display plate 100 may include a transistor (also referred to as a thin film transistor (TFT: Thin Film Transistor)) TR (see Figure 4 ), the second display panel 200 may include a color filter CF (see Figure 4 However, according to the embodiment, a color filter array (COA: Color filter On Array) structure in which the transistor TR and the color filter CF are located on the same substrate may also be used, and the positions of the transistor TR and the color filter CF are not limited thereto.
[0056] The first display plate 100 and the second display plate 200 of the display panel 10 may respectively include a rectangular shape having a long side extending along a first direction DR1 and a short side extending along a second direction DR2 intersecting the first direction DR1. According to an embodiment, the first display plate 100 and the second display plate 200 may also have a curved portion in a part of the area. The display panel 10 may include a first side surface S1 adjacent to the long side and a second side surface S2 adjacent to the short side. The display panel 10 may include a first side surface S1, a 1' side surface (not shown) facing the first side surface S1, a second side surface S2, and a 2' side surface (not shown) facing the second side surface S2, that is, it may include four side surfaces.
[0057] The first display panel 100 includes a first substrate 110 and a plurality of thin film layers arranged on the first substrate 110. A wiring layer 150 is arranged on the first substrate 110, and the wiring layer 150 includes a first wiring layer 120 and a second wiring layer 170. The wiring layer 150 can be etched into various shapes to form a transistor TR or a light emitting element for driving the display device 1000 and displaying an image in the display area DA. In particular, the wiring layer 150 includes a plurality of layers in the surrounding area PA. Figure 2 The pad electrode PE is described.
[0058] A flexible circuit substrate 500 and a driving circuit substrate 600 for driving the display device 1000 are arranged on one side of the display panel 10. The flexible circuit substrate 500 may include a first flexible circuit substrate 510 and a second flexible circuit substrate 520, and the driving circuit substrate 600 may include a first driving circuit substrate 610 and a second driving circuit substrate 620. The first flexible circuit substrate 510 and the first driving circuit substrate 610 are arranged on the first side S1 of the display device 1000, and the second flexible circuit substrate 520 and the second driving circuit substrate 620 are arranged on the second side S2 of the display device 1000.
[0059] The flexible circuit substrate 500 includes a side pad 400. The flexible circuit substrate 500 may be connected to the signal line SL on the display panel 10 through the side pad 400. The signal line SL on the display panel 10 may correspond to a portion of the wiring layer 150.
[0060] Although in Figure 1 The flexible circuit substrate 500 and the driving circuit substrate 600 are shown in the figure as being located on the entire first side surface S1 and the second side surface S2, but according to the embodiment, the first flexible circuit substrate 510 and the first driving circuit substrate 610 may be arranged only on the first side surface S1, or the second flexible circuit substrate 520 and the second driving circuit substrate 620 may be arranged only on the second side surface S2. The flexible circuit substrate 500 and the driving circuit substrate 600 may be arranged on at least one of the above four side surfaces of the display device 1000, and the position where the flexible circuit substrate 500 is connected to the display panel 10 through the side pad 400 is not limited thereto.
[0061] A flexible circuit substrate 500 is attached to one side of the display panel 10, and the side pad 400 is located between the flexible circuit substrate 500 and one side of the display panel 10, so it is shown as a dotted line. The "one side" can be selected from any one or more of the first side S1, the second side S2, and the two sides facing each other.
[0062] Here, the side pad 400 contacts and is electrically connected to the wiring layer 150 on the first substrate 110. In particular, the portion where the side pad 400 contacts the wiring layer 150 on the side surfaces S1 and S2 may correspond to the pad electrode PE. The detailed structure of the pad electrode PE will be described in detail. Figure 2 Provide a more detailed explanation.
[0063] The side pad 400 may be attached to the flexible circuit substrate 500 via an adhesive film (not shown). The adhesive film may also be omitted.
[0064] A data driving unit DD including at least one driving chip 511 may be disposed on the first flexible circuit substrate 510 , and a gate driving unit GD including at least one driving chip 521 may be disposed on the second flexible circuit substrate 520 .
[0065] The driving circuit substrate 600 may be electrically connected to one end of the flexible circuit substrate 500. Specifically, various connection wirings (not shown) may be electrically connected to each other at the portion where the flexible circuit substrate 500 contacts the driving circuit substrate 600. Accordingly, electrical signals such as gate signals, data signals, and image data output from the driving circuit substrate 600 may be transmitted to the flexible circuit substrate 500, and then transmitted to the wiring layer 150 of the display panel 10 through the side pad 400.
[0066] In the display device 1000 according to an embodiment, a protruding portion PEa (see Figure 3 ) and the recessed portion PEb (refer to Figure 3 ) of the pad electrode PE, thereby emitting a laser beam LB (refer to Figure 2 ) can prevent the laser beam LB from passing through one side and reaching the signal line SL and the transistor TR (refer to Figure 4 ), etc., and damage to the display panel 10 can be prevented. In the case where the display device 1000 according to an embodiment is an organic light-emitting display device (OLED), the laser beam LB emitted to one side of the display panel 10 can be prevented from reaching the light-emitting element, etc. As a result, wiring failure of the display device 1000 of side bonding can be prevented, and the reliability of the product can be improved.
[0067] Furthermore, there is no need to form an additional dummy pattern (not shown) to prevent damage to the signal line SL and the like inside the display panel 10 when forming the side pad 400, and since no space is required for arranging the dummy pattern, the surrounding area (also referred to as the frame area) can be further reduced. Figure 2 This is described in more detail below.
[0068] The outer circumferential surfaces of the first display panel 100 and the second display panel 200 are arranged to be aligned with each other. The outer circumferential surfaces of the first display panel 100 and the second display panel 200 are shown as surfaces extending parallel to the first direction DR1 and the second direction DR2.
[0069] The first display panel 100 and the second display panel 200 may include glass with rigid properties, or may include flexible plastic, etc. When the first display panel 100 and the second display panel 200 are flexible, they may include various plastics such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyacrylate (PAR), polyetherimide (PEI), polyethersulfone (PES), or polyimide (PI), metal films, or ultra-thin glass, etc.
[0070] The display panel 10 includes a display area DA that displays an image and a peripheral area PA that is located around the display area DA and does not display an image. The peripheral area PA may be variously referred to as a non-display area, a bezel area, etc. The peripheral area PA is arranged to surround the display area DA.
[0071] A plurality of pixels PX and a plurality of signal lines SL are arranged in the display area DA. The pixel PX is a unit capable of displaying an image and includes at least one pixel electrode 191 (see Figure 4 ), and can emit light of brightness corresponding to the color scale of the input image signal. In the present disclosure, a pixel PX can represent a unit area configured to emit light when viewed in a plane, and can be used as a term including components such as a transistor TR and a light-emitting element configured to emit light when viewed in a cross-section. A plurality of pixels PX can be arranged in a matrix form, but is not limited thereto.
[0072] The plurality of signal lines SL include m gate lines GL: GL1, ..., GLm and n data lines DL: DL1, ..., DLn. The gate lines GL and the data lines DL may be insulated from each other and arranged crosswise. The gate lines GL may extend along a first direction DR1 and be electrically connected to a gate driving unit GD. The data lines DL may extend along a second direction DR2 and be electrically connected to a data driving unit DD. In more detail, the data lines DL may extend along a second direction DR2 and be bent at a side surface of the display panel 10, and then be extended along a third direction DR3 and be electrically connected to the data driving unit DD. Similarly, the gate lines GL may extend along a first direction DR1 and be bent at a second side surface S2 of the display panel 10, and then be extended along a third direction DR3 and be electrically connected to the gate driving unit GD.
[0073] The data driving unit DD may include at least one driving chip 511. Figure 1 Six driving chips 511 are shown, but the number of driving chips 511 is not limited thereto. The gate driving unit GD may include at least one driving chip 521. Figure 1 Two driving chips 521 are shown in the figure, but the number of driving chips 521 is not limited thereto.
[0074] The driving circuit substrate 600 may include a timing controller (not shown). The timing controller (not shown) may be mounted on the driving circuit substrate 600 in the form of an integrated circuit chip (ICC) and electrically connected to the gate driving unit GD and the data driving unit DD. The timing controller (not shown) may output a gate control signal, a data control signal, and image data. According to an embodiment, the timing controller (not shown) may also be formed into an integrated circuit chip (ICC) together with the data driving unit DD and perform its function on the flexible circuit substrate 500.
[0075] The gate driving part GD and the data driving part DD may be bent together with the driving circuit substrate 600 toward the back surface (also referred to as the lower surface) of the first display plate 100 of the display panel 10 , so as to be hidden and invisible when the display panel 10 is observed from above along the third direction DR3 .
[0076] The gate driving unit GD may receive a gate control signal from a timing controller. The gate driving unit GD may generate a gate signal in response to the gate control signal, and sequentially output the generated gate signal. The gate signal may be provided to the pixel PX in a row unit through the gate line GL. As a result, the pixel PX may be driven in a row unit.
[0077] The data driving unit DD may receive image data and a data control signal from the timing controller. The data driving unit DD may generate and output a data voltage in an analog form corresponding to the image data in response to the data control signal. The data voltage may be provided to the pixel PX through the data line DL.
[0078] Although for the sake of explanation Figure 1 The display area DA, the peripheral area PA, the plurality of signal lines SL, and the plurality of pixels PX are shown as if they are located on the second display panel 200 , but they may be located on the first display panel 100 .
[0079] In accordance with Figure 1In the display device 1000, similar to the data driving unit DD, the gate driving unit GD may include a plurality of driving chips 521, and the plurality of driving chips 521 are mounted on a second flexible circuit substrate 520 located on one side of the display device, thereby being connected to the first display panel 100 in a tape carrier package (TCP) manner.
[0080] However, the position of the gate driver GD is not limited thereto. For example, the gate driver GD may be formed on the first side surface S1 simultaneously with the manufacturing process of the transistor TR driving the pixel PX, so as to be installed on the first display panel 100 in the form of an amorphous silicon thin film transistor gate driver circuit (ASG: Amorphous Silicon TFT Gate driver circuit) or an oxide silicon thin film transistor gate driver circuit (OSG: Oxide Silicon TFT Gate driver circuit).
[0081] The pixels PX may receive data voltages through the data lines DL in response to gate signals received through the gate lines GL. The pixels PX display a color scale corresponding to the data voltages, thereby being able to control transmittance of each region where each pixel PX is arranged.
[0082] Below, use Figure 2 , a display device according to an embodiment is described in more detail. Figure 2 is a perspective view schematically illustrating a portion of a display device according to an embodiment.
[0083] Reference Figure 2 , a portion of the first display panel 100 is shown. The first display panel 100 may include a first substrate 110 and a pad electrode PE, a signal line SL, a plurality of pixels PX, and a side pad 400 located on the first substrate 110. The pad electrode PE is located in the peripheral area PA of the display panel (refer to Figure 1 Although only three pad electrodes PE are shown for the sake of convenience, the number of pad electrodes PE does not limit the present invention. Figure 2 The flexible circuit substrate 500 and the driving circuit substrate 600 disposed on the side pad 400 at the first side surface S1 are omitted.
[0084] The wiring layer 150 includes a first wiring layer 120 and a second wiring layer 170. The first wiring layer 120 includes a first pad layer 120p, and the second wiring layer 170 includes a second pad layer 170p. The pad electrode PE may include the first pad layer 120p and the second pad layer 170p. Figure 2 As shown, the pad electrode PE may be formed as a double layer including a first pad layer 120 p and a second pad layer 170 p .
[0085] The first pad layer 120p may include the same material as the first wiring layer 120, and the second pad layer 170p may include the same material as the second wiring layer 170. In this case, no insulating layer may be provided between the first pad layer 120p and the second pad layer 170p of the pad electrode PE, but the first pad layer 120p and the second pad layer 170p may be in direct contact with each other. As described above, the pad electrode PE is formed as a double layer, so that it is possible to increase the connection with the display panel 10 (refer to FIG. 1 ). Figure 1 ) to increase the contact area of the side pad 400 on one side, thereby reducing the contact resistance of the display device 1000.
[0086] The first pad layer 120p and the second pad layer 170p have a first thickness d1 and a second thickness d2, respectively. The first thickness d1 and the second thickness d2 may be the thickness of commonly used wiring, which does not limit the present invention.
[0087] Adjacent pad electrodes PE may be formed to be spaced apart by a predetermined distance, and may be formed to be spaced apart at a constant interval.
[0088] The pad electrode PE may be connected to a signal line SL and a pixel PX. The signal line SL may be Figure 1 Any of the gate lines GL and data lines DL described above. The gate lines GL and the first wiring layer 120 can be formed on the same layer using the same material, and the data lines DL and the second wiring layer 170 can be formed on the same layer using the same material. An insulating layer is provided between the gate lines GL and the data lines DL, so that the two signal lines SL are electrically insulated from each other and are formed to cross each other.
[0089] The side pad 400 of the flexible circuit substrate 500 is attached to the portion corresponding to the pad electrode PE in the first side surface S1 of the first substrate 110. That is, the side pad 400 can be in contact with the pad electrode PE at the first side surface S1 and electrically connected. Figure 2 Only the side pad 400 is shown in the figure, but the flexible circuit substrate 500 may be attached in a manner of covering the side pad 400, so that the electrical signal generated in the data driving part DD or the driving circuit substrate 600 can be transmitted to the display panel.
[0090] Recently, the side bonding technology of bonding a circuit substrate, wiring, etc. to the side of a display panel in order to reduce the peripheral area PA as a non-display area of the display device has attracted much attention. When side bonding is performed on a circuit component for driving a display device, it is necessary to form a side pad 400 for electrically connecting it to a pad electrode PE located on one substrate of the display panel. The pad electrode PE is connected to a signal line SL such as a gate line GL or a data line DL. When forming such a side pad 400, the following technology is used: after the metal layer such as Ag constituting the side pad 400 is printed as a whole, it is patterned using a laser beam LB.
[0091] However, since the pad electrodes PE located around the display panel are formed at predetermined intervals, the laser beam LB used when forming the side pad 400 may be irradiated to one side of the display panel, and the laser beam LB may flow through between adjacent pad electrodes PE. Therefore, a problem may occur in which the signal line SL such as the driving wiring connected to the pad electrode PE inside the display panel is damaged.
[0092] Therefore, in the display device 1000 according to an embodiment, the pad electrode PE includes the protruding portion PEa and the recessed portion PEb, so that adjacent pad electrodes PE are engaged with each other, thereby preventing the laser beam LB used in side bonding from flowing into the display panel, thereby preventing the signal line SL from being damaged.
[0093] Below, use Figure 3 A display device including the pad electrode PE according to an embodiment is described in more detail. Figure 3 Observe from one direction Figure 2 Hereinafter, the parts substantially the same as those in the above-mentioned embodiment may be briefly described or omitted.
[0094] Reference Figure 3 , the pad electrode PE can be as Figure 2 The ground is constituted as a double layer of a first cushion layer 120p and a second cushion layer 170p, but Figure 3 Only a single overlapped state is shown as a plan view.
[0095] The pad electrode PE includes a protrusion PEa and a recess PEb. One pad electrode PE includes a first side RL1 and a second side RL2 opposite to the first side RL1. For ease of description, the right side is described as the first side RL1, and the left side is described as the second side RL2. The second side RL2 is the outermost side on the left side of the pad electrode PE. The first side RL1 and the second side RL2 may be parallel. The first side RL1 and the second side RL2 may be sides corresponding to the two sides of the pad electrode PE in a rectangular shape excluding the protrusion PEa and the recess PEb.
[0096] The protrusion PEa protrudes from the first side RL1 of the pad electrode PE to the right by a first width t1. The recessed portion PEb is recessed from the second side RL2 of the pad electrode PE to the right by a second width t2. The first width t1 and the second width t2 are the same, so that the protrusion PEa and the recessed portion PEb can be arranged to be engaged. Alternatively, as described later, if the protrusion PEa is arranged to overlap with the second side RL2, the first width t1 and the second width t2 can be similar but not the same.
[0097] A side pad 400 is attached to the first side surface S1 of the display panel 10. Figure 3 The side pad 400 is shown in a plan view as being attached to the lower side of the pad electrode PE. Here, each side pad 400 may be formed in plural by being patterned at a portion corresponding to each pad electrode PE.
[0098] The following describes the bite portion A between adjacent pad electrodes PE. In the bite portion A, the protrusion PEa of one pad electrode PE and the recess PEb of the other pad electrode PE are arranged to be interlocked with each other. In the bite portion A, the protrusion PEa protruding from the first side RL1 and the recess PEb recessed from the second side RL2 may be formed in respective shapes corresponding to each other. However, the height of the protrusion PEa and the height of the recess PEb may not be completely consistent.
[0099] The bite portion A includes an overlapping portion A1 as a portion where the protruding portion PEa and the recessed portion PEb overlap along the second direction DR2. The width of the overlapping portion A1 is equal to the width of the overlap of the first width t1 and the second width t2, hereinafter referred to as the third width t3. That is, in the bite portion A, the protruding portion PEa is arranged to be spaced from the second side RL2 to the right by the third width t3 and to bite the recessed portion PEb. The overlapping portion A1 plays a role of filling the gap between two adjacent pad electrodes PE. That is, the protruding portion PEa is arranged to be deeper than the second side RL2 as the outermost side of the pad electrode PE adjacent to the right, thereby forming the overlapping portion A1. The first width t1 and the second width t2 may be respectively greater than the third width t3.
[0100] In order to pattern the side pad 400 electrically connected to the pad electrode PE on one side of the display panel 10, a conductive paste CP (see Fig.10 ) is printed as a whole, and then the laser beam LB is applied. At this time, if the pad electrode PE has a simple quadrilateral shape with left and right sides corresponding to the first side RL1 and the second side RL2 without a pattern of the protruding portion PEa and the recessed portion PEb, the laser beam LB may flow into the gap between the adjacent pad electrodes PE, so that the signal line SL inside the display panel 10 is damaged due to heating.
[0101] In this regard, in the display device 1000 according to an embodiment, the pad electrode PE is provided with a protrusion PEa and a recess PEb, so that the laser beam LB irradiated to one side of the display panel 10 can be prevented from reaching the signal line SL inside the pad electrode PE. Specifically, the laser beam LB collides with the protrusion PEa and no longer travels inside the display panel 10. At this time, in the bite portion A, if the protrusion PEa is not arranged to be deeper than the second side RL2 of the adjacent pad electrode PE, a gap is left between the two pad electrodes PE, so that the laser beam LB may flow in from between the gap. That is, an overlapping portion A1 having a third width t3 where the first width t1 overlaps the second width t2 must be formed in the bite portion A.
[0102] As described above, the structure in which the protruding portion PEa and the recessed portion PEb of the pad electrode PE are engaged with each other can block the inflow of the laser beam LB applied to one side of the display panel 10. Accordingly, damage to the driving wiring for driving the display device 1000, the signal line SL for displaying an image on the display panel 10, or the light emitting element can be prevented, thereby improving the quality and reliability of the display device.
[0103] In the present embodiment, a pad electrode PE is shown to have a protruding portion PEa on the first side RL1 and a recessed portion PEb on the second side RL2 . However, the pad electrode PE may have a protruding portion PEa on the second side RL2 and a recessed portion PEb on the first side RL1 .
[0104] Furthermore, the protruding portions PEa and the recessed portions PEb may be alternately provided on one side of one pad electrode PE, and the recessed portions PEb and the protruding portions PEa may be alternately provided on one side of another pad electrode PE adjacent thereto so as to engage with the one side.
[0105] In the present embodiment, the protruding portion PEa and the recessed portion PEb are shown as having a trapezoidal polygonal shape, but they may also be rectangular or include a curved portion, and are not limited thereto. An example of various shapes of the protruding portion PEa and the recessed portion PEb will be described in detail below. Figure 6 and Figure 7 Provide explanation.
[0106] Below, refer to Figure 4 The side characteristics of a display device according to an embodiment are described. Figure 4 The diagram is along Figure 2 The cross-sectional view of the cross section taken along the line IV-IV'. Figure 2 The side pad 400 is shown only on the first side surface S1, but Figure 1 Same, Figure 4The first side surface S1 is shown to further include a flexible circuit substrate 500 and a driving circuit substrate 600. For ease of description, in this embodiment, the flexible circuit substrate 500 and the driving circuit substrate 600 are only shown on the first side surface S1. Figure 1 As shown, it can also be located on the second side S2.
[0107] In the following, parts substantially the same as those in the above-mentioned embodiment may be briefly described or their description may be omitted.
[0108] Reference Figure 4 The display device 1000 includes a display panel 10 , a flexible circuit substrate 500 attached to a side of the display panel 10 , and a driving circuit substrate 600 .
[0109] The display panel 10 may include a first display plate 100, a second display plate 200 facing and attached to each other, and a liquid crystal layer 300 disposed between the first display plate 100 and the second display plate 200. Hereinafter, the following case is taken as an example for description: the layer disposed between the two display plates 100 and 200 is the liquid crystal layer 300, and thus the display device 1000 according to an embodiment is a liquid crystal display device (LCD). However, if Figure 1 As described above, the display device 1000 according to an embodiment is not limited thereto.
[0110] The first display panel 100 may include a first substrate 110, a first wiring layer 120 disposed on the first substrate 110, an insulating film 123, a semiconductor layer 130, a second wiring layer 170, a protective layer 181, and a pixel electrode 191. The first wiring layer 120 and the second wiring layer 170 may be collectively referred to as a wiring layer 150.
[0111] A first wiring layer 120 is arranged on the first substrate 110, and the first wiring layer 120 includes a gate line (not shown), a gate electrode 121, and a first pad layer 120p constituting a pad electrode PE. An insulating film 123, which may be a gate insulating film, is arranged on the first wiring layer 120. A semiconductor layer 130 may be arranged on the insulating film 123 corresponding to the gate electrode 121.
[0112] A second wiring layer 170 may be arranged on the semiconductor layer 130. The second wiring layer 170 may include a data line 171, a first electrode 173, a second electrode 175, and a second pad layer 170p. The first electrode 173 and the second electrode 175 are arranged at portions corresponding to both ends of the semiconductor layer 130. If one of the first electrode 173 and the second electrode 175 is a source electrode, the other may be a drain electrode. The first electrode 173 may be a structure protruding from the data line 171. The data line 171 may be connected to the semiconductor layer 130. Figure 1 The described data lines DL correspond to and transfer data signals to the pixels PX.
[0113] The gate line (not shown), gate electrode 121 of the first wiring layer 120 and the data line 171, first electrode 173 and second electrode 175 of the second wiring layer 170 play the role of driving wiring for driving the display device 1000, so an insulating film 123 is arranged between the two wiring layers 120 and 170 to be electrically insulated from each other. On the contrary, other layers such as insulating film 123 may not be arranged between the first pad layer 120p and the second pad layer 170p constituting the pad electrode PE, but they are directly in contact and electrically connected. The purpose is to increase the contact area with the side pad 400 on one side of the display panel 10 by forming the pad electrode PE as a double layer, so as to increase conductivity.
[0114] The first wiring layer 120 and the second wiring layer 170 may include a conductive metal such as Ti or Cu. The first wiring layer 120 and the second wiring layer 170 may be formed as a single film or a multilayer film of two or more layers.
[0115] The gate electrode 121, the semiconductor layer 130, the first electrode 173, and the second electrode 175 may constitute a transistor TR. Figure 3 The transistor TR is shown as a bottom gate structure, but may also be a top gate structure in which the gate electrode 121 is located on the semiconductor layer 130 .
[0116] A protective layer 181 and a pixel electrode 191 are disposed on the transistor TR.
[0117] The pixel electrode 191 may include indium tin oxide (ITO), indium zinc oxide (IZO), or indium tin zinc oxide (ITZO), which are transparent electrode materials having good light transmittance, good electrical conductivity, and excellent thermal stability.
[0118] A protective layer 181 is disposed on the second wiring layer 170, and the protective layer 181 can play a role in flattening the interlayer step difference of the plurality of thin film layers below it. An opening is formed in the protective layer 181 to expose a portion of the first electrode 173. A pixel electrode 191 is disposed on the protective layer 181, and the pixel electrode 191 can be electrically connected to the first electrode 173 through the opening formed in the protective layer 181.
[0119] A sealant SE for attaching two display panels 100 and 200 to be described later, a dummy pattern DP, and the like may be disposed on the pad electrode PE.
[0120] The second display panel 200 may include a second substrate 210 , and a color filter CF, a light blocking member BM, a common electrode 270 , and the like disposed on the second substrate 210 .
[0121] A color filter CF and a light blocking member BM may be formed on the second substrate 210. The light blocking member BM may be arranged between the color filters CF to distinguish each pixel PX region, prevent light leakage of the display device 1000, and improve contrast. In addition, since the light blocking member BM clearly divides each region of the color filter CF, it is possible to block light incident to any region from invading other regions. Therefore, it is possible to prevent the mixing of different colors displayed by the display device 1000.
[0122] A common electrode 270 may be disposed on the color filter CF and the light blocking member BM.
[0123] The common electrode 270 may include indium tin oxide (ITO), indium zinc oxide (IZO), or indium tin zinc oxide (ITZO), which are transparent electrode materials having good light transmittance, good electrical conductivity, and excellent thermal stability.
[0124] A liquid crystal layer 300 including liquid crystal molecules may be disposed between the first display plate 100 and the second display plate 200, and may further include a sealant SE and a dummy pattern DP, etc. The layer disposed between the first display plate 100 and the second display plate 200 may include various elements other than the liquid crystal layer 300, such as an organic light emitting element.
[0125] If the transistor TR is turned on according to the gate signal applied to the gate electrode 121, the data signal is applied to the pixel electrode 191 through the transistor TR, and an electric field is generated between the pixel electrode 191 and the common electrode 270. Then, the liquid crystal molecules of the liquid crystal layer 300 can be rearranged according to the electric field, so that each pixel PX shows a color scale corresponding to the data signal.
[0126] The sealant SE prevents leakage of the liquid crystal layer 300 disposed between the first display panel 100 and the second display panel 200 , and may be disposed to surround edge portions of the two display panels 100 , 200 in order to attach the two display panels 100 , 200 .
[0127] The sealant SE and the dummy pattern DP may be located on the pad electrode PE arranged in the peripheral area PA of the display panel 10. At this time, although the dummy pattern DP is shown in contact with the side pad 400, the sealant SE and the dummy pattern DP may be interchanged to make the sealant SE contact with the side pad 400, or only one of the sealant SE and the dummy pattern DP may exist. The dummy pattern DP may be located at the outer contour of the display panel 10, thereby protecting the transistor TR from foreign matter such as moisture and dust particles. The dummy pattern DP may include an organic insulating material or an inorganic insulating material.
[0128] The sealant SE and the dummy pattern DP may be located on one side between the two display plates 100 and 200 of the display panel 10, or on four sides to wrap the edge portions of the two display plates 100 and 200. The dummy pattern DP may also be arranged in an island shape corresponding to the area where the side pad 400 is located.
[0129] exist Figure 4 In the embodiment, a flexible circuit substrate 500 and a driving circuit substrate 600 may be provided on the first side surface S1 located on the right side of the display panel 10. The flexible circuit substrate 500 may be provided in the form of a flexible printed circuit board (FPCB: flexible printed circuit board) and configured in the form of a chip on film (COF: Chip On Film). Accordingly, the data driving unit DD may be connected to the display panel 10 and the driving circuit substrate 600 in a tape carrier package (Tape Carrier Package) manner.
[0130] The side pad 400 may be a solution mixed with a metal. For example, it may include Ag, a curing agent, and a resin component. The curing agent may solidify the metal such as Ag, so that the mixed solution has a liquid state before heating and a solid state after heating. The resin, as a plastic material, may help the solid metal to have a liquid state.
[0131] When forming the side pad 400 in order to attach a circuit component to one side of the display panel 10, the material layer (conductive paste CP, see Fig.10 Here, when the side pad 400 is etched by the laser beam LB, since the pad electrodes PE are arranged at predetermined intervals, the laser beam LB may flow into the inside of the display panel 10 through the intervals between the pad electrodes PE, resulting in damage to the signal line SL, the transistor TR, the light emitting element, etc.
[0132] Therefore, in one embodiment of the present invention, the pad electrode PE on one substrate of the display panel 10 is provided with a protruding portion PEa and a recessed portion PEb, so that the laser beam LB can be prevented from flowing into the display panel 10 through the adjacent pad electrodes PE. Accordingly, not only the signal line SL of the drive wiring of the display device can be prevented from being damaged, but also the transistor TR, the light emitting element, etc. can be prevented from being damaged, and the quality and reliability of the display device can be improved.
[0133] Below, use Figure 5 The pad electrode PE and its surrounding structures in the display device according to an embodiment are described in more detail. Figure 5 is a plan view schematically illustrating a portion of a display device according to an embodiment. Figure 3 Hereinafter, the substantially same parts as those in the above-mentioned embodiment may be briefly described or the description thereof may be omitted.
[0134] Reference Figure 5 According to an embodiment, a display device 1000 includes a first display panel 100, and the first display panel 100 includes a pad electrode PE and a signal line SL.
[0135] The pad electrode PE is composed of a first pad layer 120p and a second pad layer 170p. The second pad layer 170p is arranged on the first pad layer 120p. No other thin film layer may be arranged between the two pad layers 120p and 170p, so that the two pad layers 120p and 170p may be in direct contact with each other. According to the embodiment, an insulating film or the like may also be arranged.
[0136] The second pad layer 170p may be formed on the first pad layer 120p in a shape corresponding to the edge portion of the first pad layer 120p. Figure 3 As shown, the first cushion layer 120p and the second cushion layer 170p can be formed into the same shape when viewed from a plane, but can also be formed as Figure 5 As shown, the second pad layer 170p is formed to have a smaller width than the first pad layer 120p at each corresponding edge portion of the pad electrode PE and the difference is slight. When the pad electrode PE is described below, since the second pad layer 170p is formed in a shape corresponding to the first pad layer 120p, the first pad layer 120p is used as a reference for the description.
[0137] The pad electrode PE includes a protrusion PEa and a depression PEb. The pad electrode PE has a first side RL1 on the right side and a second side RL2 on the left side. The first side RL1 and the second side RL2 may be parallel.
[0138] The protrusion PEa protrudes from the first side RL1 to the right side by a first width t1. The recessed portion PEb is recessed from the second side RL2 to the right side by a second width t2. The first width t1 and the second width t2 may be the same. A portion where the protrusion PEa and the recessed portion PEb are arranged to interlock with each other between adjacent pad electrodes PE is referred to as an interlocking portion A. The protrusion PEa and the recessed portion PEb may have shapes corresponding to each other so as to interlock with each other at the interlocking portion A.
[0139] The portion where the protrusion PEa and the recess PEb overlap in the second direction DR2 at the bite portion A is referred to as an overlap portion A1, and the width of the overlap portion A1 is referred to as a third width t3. That is, the protrusion PEa is formed to enter the inside of the recess PEb at the bite portion A so as to be formed on the right side of the second side RL2 which is the outermost side of the pad electrode PE.
[0140] The longitudinal length of the protruding portion PEa is referred to as a first length h1, and the longitudinal length of the recessed portion PEb is referred to as a second length h2. The first length h1 may be formed to be greater than the second length h2, so that the recessed portion PEb is formed to surround the protruding portion PEa at the bite portion A. According to an embodiment, the first length h1 and the second length h2 may also be formed identically, and the relationship between the first length h1 and the second length h2 is not limited thereto.
[0141] The signal line SL may include the gate line GL described above (see Figure 1 ) or data line DL (refer to Figure 1 ). The signal line SL is the gate line GL (refer to Figure 1 ), the signal line SL may be formed in the same layer as the first wiring layer 120 using the same material, and the signal line SL may be formed in the same layer as the data line DL (see Figure 1 ), it can be formed in the same layer using the same material as the second wiring layer 170.
[0142] exist Figure 5 In the embodiment, a side pad 400 is attached below the pad electrode PE (i.e., the first side surface S1 of the display panel 10). The side pad 400 is used to connect the flexible circuit substrate 500 equipped with a data driving unit to the display panel 10, and is in contact with and electrically connected to the pad electrode PE arranged on the upper surface of the first substrate.
[0143] In order to form the side pad 400, a patterning step using a laser is required. In order to form the side pad 400 at a position corresponding to each pad electrode PE, a laser beam LB may be applied for patterning. At this time, the laser beam LB penetrates between adjacent pad electrodes PE, causing a problem of damage to the signal line SL and the like located on the extension line of the laser beam LB.
[0144] In this regard, as described above, in the display device 1000 according to an embodiment, the pad electrode PE has the protruding portion PEa and the recessed portion PEb, thereby preventing the laser beam LB from flowing into the display panel 10. Specifically, the protruding portion PEa and the recessed portion PEb form an overlapping portion A1, thereby preventing the laser beam LB applied along the second direction DR2 from flowing into the signal line SL through the gap between the pad electrodes PE on one side of the display panel 10. Figure 5 As shown, the laser beam LB collides with the protrusion PEa and cannot penetrate into the inner space aligned in the second direction DR2 of the display panel 10. Thus, the signal line SL and other components of the display panel 10 can be prevented from being damaged or defective, thereby improving the quality and reliability of the display device 1000.
[0145] Hereinafter, the peripheral portion of the pad electrode PE will be described.
[0146] The first wiring layer 120 (see Figure 1 ) can also include a first opening 120c, an auxiliary pad 120a and a connecting portion in the first pad layer 120p. The first opening 120c can be formed on the upper part of the first pad layer 120p. For the convenience of description, Figure 5 Two first openings 120 c are shown in the figure, but the positions and number of the first openings 120 c are not limited thereto.
[0147] The second pad layer 170p may include a second opening 170c. The second opening 170c may be arranged between the first openings 120c located on both sides. For ease of description, one second opening 170c is shown in the figure, but the position and number of the second openings 170c are not limited thereto.
[0148] An auxiliary connection member 193 may be disposed on a portion where the first opening 120c of the first pad layer 120p is formed and a portion where the second opening 170c of the second pad layer 170p is formed. The auxiliary connection member 193 may be disposed on the pixel electrode 191 (see Figure 4 )The same layers are formed using the same material.
[0149] The first wiring layer 120 (see Figure 1 ) may further include an auxiliary pad 120a. The auxiliary pad 120a is a portion extending from the upper portion of the first pad layer 120p and connected to the first pad layer 120p, and may be connected to the signal line SL of the display panel 10.
[0150] Below, use Figure 6 and Figure 7 Various shapes of the pad electrode PE will be described. Figure 6 and Figure 7Schematically illustrate a plan view of a portion of a display device according to another embodiment. Figure 6 and Figure 7 Only the first display panel 100 of the display device is shown in the figure, and the side pad 400 is only shown on the first side S1, but can also be arranged on the second side S2. Hereinafter, the description of the same or similar parts as the above embodiment can be omitted, and the description will focus on the characteristic parts different from the above embodiment.
[0151] Reference Figure 6 , the first display panel 100 includes a pad electrode PE. One pad electrode PE includes a protrusion PEa and a recess PEb on both sides. There may be more than two protrusions PEa and recess PEb formed on both sides of the pad electrode PE. At this time, the protrusions PEa and recess PEb may be formed in equal numbers, so that the protrusions PEa and recess PEb may correspond to each other at the bite portion A between the two pad electrodes PE.
[0152] In the process of forming the side pad 400 on the first side surface S1 of the display panel, the laser beam LB can be blocked by the protruding portion PEa of the bite portion A, so that the laser beam LB cannot reach the signal line SL located on the extension line thereof. That is, the pad electrode PE is provided with a pattern of the protruding portion PEa and the recessed portion PEb, so that the laser beam LB or other pollutants will not flow into between the pad electrodes PE, thereby preventing the signal line SL or other elements inside the display panel from being defective, thereby improving the reliability of the display device.
[0153] Reference Figure 7 , one pad electrode PE includes a protruding portion PEa and a recessed portion PEb on both sides. At this time, the shapes of the protruding portion PEa and the recessed portion PEb are different from those in the above embodiment and may include curved portions instead of polygons.
[0154] Even if the protruding portion PEa and the recessed portion PEb include a curved portion, similarly, in the process of forming the side pad 400 on the first side surface S1 of the display panel, the laser beam LB can be blocked by the protruding portion PEa of the bite portion A, so that the laser beam LB cannot reach the signal line SL located on the extension line thereof. That is, by providing the pad electrode PE with the pattern of the protruding portion PEa and the recessed portion PEb, the laser beam LB or other contaminants will not flow into between the pad electrodes PE, thereby preventing the signal line SL or other elements inside the display panel from being defective, thereby improving the reliability of the display device.
[0155] Below, use Figure 8 , Fig. 9 , Fig.10 and Fig.11 A method for manufacturing a display device according to an embodiment is described. Figure 8is a block diagram showing a method for manufacturing a display device according to an embodiment, Fig. 9 , Fig.10 and Fig.11 It is a schematic diagram showing Figure 8 A three-dimensional diagram of a display device according to an embodiment of the present invention is provided.
[0156] and Figure 8 Reference together Fig. 9 , the display panel 10 to which the first display panel 100 and the second display panel 200 are attached is shown. The pad electrode PE and the signal line SL and the pixel PX connected thereto are shown on the first substrate 110 of the first display panel 100. The pad electrode PE is provided with a protruding portion PEa and a recessed portion PEb on both sides, and the adjacent pad electrodes PE are arranged to be interlocked with each other.
[0157] A plasma cleaning device P can be used to clean one side of the display panel 10 by atmospheric pressure plasma (step S100). Plasma cleaning can remove pollutants such as organic matter and copper oxide film remaining on the one side at one time. This can improve the bonding force between the conductive paste CP forming the side pad 400 described later and the one side of the display panel 10.
[0158] Next, refer to Fig.10 Then, a conductive paste CP is coated on one side of the display panel 10 after plasma cleaning (step S200 ). The conductive paste CP is a material layer forming the side pad 400 .
[0159] The conductive paste CP may be integrally formed by printing in a predetermined coating area of the first side surface S1 of the display panel 10 by stamping, or may be integrally formed in a predetermined coating area by spraying.
[0160] The conductive paste CP is coated on one side of the display panel 10 so as to be in contact with the pad electrode PE at the one side to be electrically connected.
[0161] According to an embodiment, the coating area of the conductive paste CP may be a portion of one side surface of the display panel 10, or may be formed on multiple side surfaces. Figure 1 As described above, when the flexible circuit substrate 500 is formed on the entire first side surface S1 and the second side surface S2 , the conductive paste CP may be applied to both side surfaces S1 and S2 .
[0162] The conductive paste CP may include a metal having conductivity, such as Ag, Cu, Au, and Al according to an embodiment, and may be Ag as an example, but the material included in the conductive paste CP is not limited thereto.
[0163] Next, although not shown, the conductive paste CP coated on one side of the display panel 10 can be heated again by laser (step S300). As described above, since the conductive paste CP can be an Ag mixed solution including Ag, a curing agent, and a resin, if laser heating is used, the curing agent can cure the Ag component to fix the shape of the conductive paste CP. Through such a curing step, the conductive paste CP can be firmly fixed to one side of the display panel 10 and the surface hardness can be improved.
[0164] Next, refer to Fig.11 , the cured conductive paste CP is patterned by a laser L generating a laser beam LB to form a side pad 400 (step S400). The side pads 400 can be formed at the portions corresponding to the pad electrodes PE on one side of the display panel 10 coated with the conductive paste CP. At this time, the laser beam LB collides with the protruding portion PEa of the pad electrode PE through the gap between the pad electrodes PE and cannot reach the signal line SL inside the display panel 10. Accordingly, damage and defects of the display device caused by the laser beam LB used when forming the side pad 400 can be improved and reliability can be improved. The side pads 400 can be formed in a number corresponding to the pad electrode PE, but the position and number of the side pads 400 are not limited thereto.
[0165] As described above, when the laser beam LB is applied to pattern the conductive paste CP, the laser beam LB is applied in a direction perpendicular to one side surface, thereby colliding with the protruding portion PEa of the pad electrode PE. Accordingly, the laser beam LB can be prevented from reaching the signal line SL and the like connected to the pad electrode PE, thereby improving the defect of the display panel 10 and improving the quality and reliability of the display device. In addition, the pad electrode PE is provided with a pattern of the protruding portion PEa and the recessed portion PEb, so that there is no need to arrange a separate dummy pattern (not shown) for preventing the inflow of the laser beam LB or other pollutants, etc., so that the surrounding area PA can be minimized.
[0166] Next, refer to Figure 1 Circuit elements such as a flexible circuit substrate 500 and a driving circuit substrate 600 are attached to the side pad 400 , so that the electrical signals supplied therefrom can be transmitted to the display panel 10 through the side pad 400 .
[0167] The embodiments of the present invention are described in detail above, but the scope of the present invention is not limited thereto. Various modifications and improvements made by those skilled in the art using the basic concepts of the present invention defined in the claims also fall within the scope of the present invention.
Claims
1. A display device, comprising: a substrate extending along a first direction and a second direction; A display panel including a wiring layer; and a flexible circuit substrate located at a first side of an end portion of the display panel in the first direction and comprising a side pad, Wherein, the wiring layer includes a pad electrode, The pad electrode is provided with a protruding portion on a first side and a recessed portion on a second side opposite to the first side. Between the adjacent pad electrodes, there is a bite portion including the convex portion and the concave portion in a bite arrangement, The engaging portion includes a portion where the protruding portion overlaps with the recessed portion along a second direction intersecting the first direction, and the recessed portion is formed to surround the protruding portion. The side pad is electrically connected to the pad electrode at the first side, When viewed from the second direction perpendicular to the first side surface, gaps between adjacent side surface pads overlap with the engaging portion.
2. The display device according to claim 1, wherein: The display panel further includes a second side surface at an end portion in the second direction, The flexible circuit substrate is arranged on the second side surface.
3. The display device according to claim 1, wherein: The protrusion protrudes from the first edge in one direction by a first width, The recessed portion is recessed from the second edge along the first direction by a second width.
4. The display device according to claim 3, wherein: The protruding portion and the recessed portion have shapes corresponding to each other, The protruding portion and the recessed portion have a polygonal shape, or a shape including a curved portion.
5. The display device according to claim 3, wherein: The overlapped portion includes an overlapped portion of the protrusion disposed deeper than the outermost edge of the adjacent pad electrode, The overlapping portion has a third width, The first width and the second width are greater than or equal to the third width.
6. The display device according to claim 1, wherein: The first side is provided with two or more protrusions. The second side is provided with the same number of the recessed portions as the protruding portions so as to mesh with the first side.
7. The display device according to claim 1, wherein: The display panel includes a first display plate and a second display plate facing and attached to each other, The first display panel includes the wiring layer, The wiring layer includes a first wiring layer and a second wiring layer, The first wiring layer includes a gate electrode, The second wiring layer includes a data line, a first electrode and a second electrode, A semiconductor layer is arranged on the gate electrode, The gate electrode, the semiconductor layer, the first electrode, and the second electrode constitute a transistor. And, the second display panel includes a color filter.
8. The display device according to claim 7, wherein: The first wiring layer includes a first pad layer, and the second wiring layer includes a second pad layer. The first pad layer and the second pad layer constitute the pad electrode.
9. The display device according to claim 8, wherein: The first pad layer and the second pad layer are in direct contact.
10. The display device according to claim 1, wherein: A data driving unit or a gate driving unit is installed on the flexible circuit substrate. The flexible circuit substrate is electrically connected to a driving circuit substrate.
11. The display device according to claim 1, wherein: The side pad is arranged at a portion corresponding to the pad electrode on the first side.
Citation Information
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