A refrigerant type chip cooler

Abstract

The present invention discloses a refrigerant chip cooler, including a cooler body, which includes an upper heat conducting plate and a lower heat conducting plate; the upper heat conducting plate has two liquid inlet and outlet slots extruded and formed corresponding to its outer edge, and a connecting channel is formed between the plate surface of the upper heat conducting plate corresponding to the two liquid inlet and outlet slots; the outer edge of the lower heat conducting plate is at least provided with a lower flange for covering the liquid inlet and outlet slots, and a mounting port is provided on the lower flange; the upper heat conducting plate is sealed and attached to the lower heat conducting plate so that a refrigerant channel is formed between the connecting channel and the lower heat conducting plate, and an inlet and outlet liquid channel is formed between the two liquid inlet and outlet slots and the plate surface of the lower heat conducting plate. The present invention has a simple and reasonable structure, and the inlet and outlet liquid pipe can be conveniently connected to the mounting port of the lower flange, which simplifies the connection of the inlet and outlet liquid pipe and ensures the connection effect between the cooler body and the inlet and outlet liquid pipe.

Description

Technical Field

[0001] The present invention relates to the technical field of chip coolers, and in particular to a refrigerant type chip cooler. Background Art

[0002] At present, most driver module chips are cooled by a refrigerant cooler, which includes a refrigerant channel for receiving refrigerant and guiding the flow of refrigerant. The refrigerant quickly takes away the heat of the chip to achieve rapid cooling and prevent the chip from being burned due to excessive temperature. At present, the refrigerant channel of the refrigerant cooler is generally defined by a tube body directly or by the grooves on two heat conducting plates. The inlet and outlet liquid pipes are connected to the inlet and outlet formed by the two heat conducting plates. Since the inlet and outlet liquid pipes are generally regular round pipes, in order to ensure the sealed connection between the inlet and outlet liquid pipes and the inlet and outlet, the grooves at the outer edges of the two heat conducting plates need to be matched to form a regular circle that matches the inlet and outlet liquid pipes, so as to ensure the connection effect between the two. However, it greatly increases the processing difficulty and is prone to deformation during the production process, which leads to reduced matching accuracy between the inlet and outlet and the inlet and outlet liquid pipes, making it difficult to ensure the sealing of the connection between the two. There is room for improvement. Summary of the invention

[0003] The present invention is to overcome the above-mentioned defects in the prior art and provide a refrigerant type chip cooler, wherein the inlet and outlet liquid pipes can be conveniently connected to the installation opening of the lower flange, thus greatly simplifying the installation between the inlet and outlet liquid pipes and the cooler body.

[0004] To achieve the above object, the present invention provides a refrigerant type chip cooler, which is used to be installed on a chip to cool the chip, and includes a cooler body, wherein the cooler body includes an upper heat conducting plate and a lower heat conducting plate, wherein the lower heat conducting plate is attached to the chip;

[0005] The plate body of the upper heat conducting plate is extruded at its outer edge to form two liquid inlet and outlet slots that are concave from the lower surface to the upper surface and connect the inside and outside of the plate body, and the plate surface of the upper heat conducting plate is extruded to form a connecting channel that is concave from the lower surface to the upper surface and connects the two liquid inlet and outlet slots;

[0006] The outer edge of the lower heat conducting plate is provided with a lower flange folded upward to cover the inlet and outlet groove at least corresponding to the inlet and outlet groove, and the lower flange is provided with a mounting opening communicated with the inlet and outlet groove;

[0007] The upper heat conducting plate is sealed and attached to the lower heat conducting plate so that the connecting groove on the upper heat conducting plate cooperates with the plate surface of the lower heat conducting plate to form a refrigerant channel for the flow of refrigerant, and the two inlet and outlet liquid grooves of the upper heat conducting plate cooperate with the plate surface of the lower heat conducting plate to form two inlet and outlet liquid channels.

[0008] It is further configured that: a sealing lip is formed by extending from at least the edge of the upper heat conducting plate corresponding to the liquid inlet and outlet slots.

[0009] It is further configured as follows: the lower heat conducting plate is provided with lower flanges arranged continuously or at intervals along its outer edge, the lower flanges at the corresponding outer edges of the lower heat conducting plate cooperate to form an inlay, and the upper heat conducting plate is embedded in the inlay formed by the lower heat conducting plate.

[0010] It is further configured that: the upper heat conducting plate is provided with upper flanges arranged continuously or at intervals along its outer edge, and the sealing lip is a part of the upper flanges.

[0011] It is further configured as follows: the cooler body also includes at least one matching plate stacked on the upper heat conducting plate, and a refrigerant expansion cavity connected to the refrigerant channel is formed by sealing between adjacent matching plates and the upper heat conducting plate or between two adjacent matching plates.

[0012] It is further configured that: the plate body of the matching plate is extruded with matching grooves and matching grooves that are recessed from the lower surface to the upper surface corresponding to the connecting grooves and the liquid inlet and outlet grooves, and the upper heat conducting plate is provided with a connecting port that penetrates the plate body corresponding to the liquid inlet and outlet grooves.

[0013] It is further configured that: a convex structure formed by a lower surface being concave toward an upper surface is extruded and formed on the plate surface of the lower heat conducting plate corresponding to the connecting groove and / or the liquid inlet and outlet groove.

[0014] It is further configured as follows: the depression depth of the inlet and outlet grooves on the upper heat conducting plate is greater than the depression depth of the connecting channel, and the connection between the two has a transition surface that is inclined or arc-shaped.

[0015] It is further configured that: the two liquid inlet and outlet slots on the upper heat conducting plate can be selectively arranged on the same side or on different sides.

[0016] It is further configured that: the connecting channels on the upper heat conducting plate are of a multi-channel structure or are arranged in a meandering serpentine shape.

[0017] Compared with the prior art, the present invention has a simple structure, is easy to manufacture, and is suitable for mass production. The device forms a refrigerant channel by combining the upper and lower heat conduction plates, and the refrigerant flows in the refrigerant channel to effectively take away the heat of the chip, so as to avoid overheating and damage of the core and ensure stable operation of the chip. At the same time, the lower flange formed by folding the lower heat conduction plate upward closes the port of the inlet and outlet liquid channel, and the lower flange is provided with an installation port for installing the inlet and outlet liquid pipe, which greatly simplifies the connection of the inlet and outlet liquid pipe and ensures the connection effect between the inlet and outlet liquid pipe and the cooler body. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1This is a three-dimensional structural schematic diagram of a refrigerant type chip cooler according to an embodiment of the present invention;

[0019] Figure 2 yes Figure 1 Schematic diagram of the separation structure of the chip cooler;

[0020] Figure 3 is a schematic diagram of the three-dimensional structure of the second embodiment of the chip cooler;

[0021] Figure 4 It is a schematic diagram of the separation structure of the third embodiment of the chip cooler.

[0022] The following reference numerals are marked on the drawings in conjunction with the drawings:

[0023] 100. Cooler body; 1. Upper heat conduction plate; 11. Inlet and outlet liquid slots; 111. Transition surface; 112. Connecting port; 12. Connecting channel; 13. Upper flange; 2. Lower heat conduction plate; 21. Lower flange; 211. Mounting port; 22. Bump; 3. Matching plate; 31. Matching channel; 32. Matching slot; 200. Inlet and outlet liquid pipe connection. DETAILED DESCRIPTION

[0024] A specific implementation of the present invention is described in detail below in conjunction with the accompanying drawings, but it should be understood that the protection scope of the present invention is not limited by the specific implementation.

[0025] The present invention provides a refrigerant type chip cooler such as Figure 1 ,to Figure 4 As shown, it is used for heat dissipation of the chip, and is cooled by being connected in series with the refrigerant pipeline and directly applied on the surface of the chip. For example, it is used for cooling on a variable frequency air-conditioning chip. It includes a cooler body 100, and two inlet and outlet liquid pipes 200 connected to the cooler body 100; wherein, the cooler body 100 has a refrigerant channel, and the two inlet and outlet liquid pipes 200 are respectively installed on the inlet and outlet of the refrigerant channel, and are connected to the refrigerant pipeline in the air conditioner through the inlet and outlet liquid pipes 200, so that the refrigerant channel in the cooler body 100 can receive the refrigerant in the refrigerant pipeline of the air conditioner and guide the refrigerant to flow in the refrigerant channel in the cooler body 100, so that the heat of the air-conditioning chip can be quickly taken away, thereby ensuring that the air-conditioning chip is always in a lower temperature range, and avoiding overheating and burning of the air-conditioning chip.

[0026] Specifically, the cooler body 100 comprises at least an upper heat conducting plate 1 and a lower heat conducting plate 2, wherein the lower surface of the lower heat conducting plate 2 is a flat end surface, and is plane-fitted on the air-conditioning chip; the upper heat conducting plate 1 is a stamping part or a rolled part, and the lower surface of the upper heat conducting plate 1 is sealingly fitted on the upper surface of the lower heat conducting plate 2, and the plate body of the upper heat conducting plate 1 is extruded at its outer edge with two liquid inlet and outlet grooves 11 which are recessed from the lower surface to the upper surface and connect the inside and outside of the plate body, and the plate body of the upper heat conducting plate 1 has a connecting groove 12 which is recessed from the lower surface to the upper surface formed between the two liquid inlet and outlet grooves 11, so that a refrigerant channel is formed in the internal structure of the cooler body 100, specifically, the connecting channel on the upper heat conducting plate 1 is matched with the plate surface of the lower heat conducting plate 2 to form a refrigerant channel, and the two liquid inlet and outlet grooves 11 on the upper heat conducting plate 1 and the lower The plate surfaces of the heat conducting plate 2 cooperate to form inlet and outlet liquid channels for the refrigerant to enter and exit the refrigerant channels respectively; the outer edge of the lower heat conducting plate 2 is provided with an upwardly folded lower flange 21 at the inlet and outlet liquid groove 11 corresponding to the upper heat conducting plate 1, and the edge of the upper heat conducting plate 1 is sealed with the lower flange 21 of the lower heat conducting plate 2, and the lower flange 21 is provided with a mounting port 211 connected thereto corresponding to the inlet and outlet liquid channel, and the inlet and outlet liquid connecting pipe 200 is inserted into the mounting port 211 of the lower flange 21, thereby greatly simplifying the installation structure of the cooler body 100 and the inlet and outlet liquid connecting pipe 200, effectively improving the connection effect between the two and reducing the manufacturing cost; preferably, the upper heat conducting plate 1 is provided with a sealing lip extending outward at the edge of the inlet and outlet liquid groove 11, and the contact area is effectively increased and the sealing effect is improved through the cooperation of the sealing lip and the lower flange 21.

[0027] Furthermore, the lower heat conducting plate 2 is provided with lower flanges 21 arranged continuously or at intervals along its outer edge, and the lower flanges 21 cooperate to form an inlay, and the upper heat conducting plate 1 is embedded in the inlay formed by the lower heat conducting plate 2, so that the positioning and cooperation between the upper heat conducting plate 1 and the lower heat conducting plate 2 can be achieved, and the connection between the two is simplified; preferably, the upper heat conducting plate 1 is provided with upper flanges 13 arranged continuously or at intervals along its outer edge, and the sealing lip is a part of the upper flange 13.

[0028] Furthermore, a convex hump 22 structure formed by the lower surface being recessed toward the upper surface is provided on the plate surface of the lower heat conducting plate 2 corresponding to the connecting groove 12 and / or the liquid inlet and outlet groove 11 of the upper heat conducting plate 1. The convex hump 22 structure can effectively improve the pressure bearing capacity of the lower heat conducting plate 2, avoid deformation of the lower heat conducting plate 2, and ensure stable operation of the chip.

[0029] Furthermore, the depression depth of the inlet and outlet liquid grooves 11 on the upper heat conduction plate 1 is greater than the depression depth of the connecting channel 12, and the connection between the two has a transition surface 111 that is inclined or arc-shaped, which can greatly improve the drainage effect and the pressure-bearing effect of the inlet and outlet liquid channels; further preferably, the connecting channel 12 is a multi-channel structure or is arranged in a serpentine shape.

[0030] like Figure 1 and Figure 3 By comparison, it can be seen that the two liquid inlet and outlet slots 11 on the upper heat conducting plate 1 can be selectively arranged on the same side or on different sides.

[0031] like Figure 2 and Figure 4 By comparison, it can be seen that in some specific implementation schemes, in order to reduce the flow resistance and pressure drop inside the chip cooler, thereby ensuring the stable operation of the chip cooler, a refrigerant expansion cavity is also expanded above the upper heat conducting plate 1; Figure 3 As shown, specifically, the cooler body 100 also includes at least one matching plate 3 stacked above the upper heat conducting plate 1. In the embodiment, the matching plate 3 is one piece, so that the matching plate 3 and the upper heat conducting plate 1 are sealed and matched to form a refrigerant expansion chamber connected to the refrigerant channel. Preferably, the plate body of the matching plate 3 is provided with a matching groove 31 and a matching groove 32 formed by the upper surface being recessed from the upper surface corresponding to the connecting groove 12 and the inlet and outlet groove 11 of the upper heat conducting plate 1. The matching groove 32 cooperates with the connecting groove 12 to form a refrigerant expansion chamber, and the upper heat conducting plate 1 is provided with a connecting port 112 that passes through the plate body corresponding to the inlet and outlet groove 11. For the convenience of manufacturing and molding, the matching plate 3 and the upper heat conducting plate 1 can adopt the same structure; similarly, two or more matching plates 3 can be stacked above the upper heat conducting plate 1, so that the matching plate 3 located between the plate bodies is provided with a connecting port 112 that passes through the plate body corresponding to the matching groove 32.

[0032] Compared with the prior art, the present invention has a simple structure, is easy to manufacture, and is suitable for mass production. The device forms a refrigerant channel by combining the upper and lower heat conduction plates, and the refrigerant flows in the refrigerant channel to effectively take away the heat of the chip, so as to avoid overheating and damage to the core and ensure stable operation of the chip. At the same time, the lower flange formed by folding the lower heat conduction plate upward closes the port of the inlet and outlet liquid channel, and the lower flange is provided with an installation port for installing the inlet and outlet liquid pipe, which greatly simplifies the connection of the inlet and outlet liquid pipe and ensures the connection effect between the inlet and outlet liquid pipe and the cooler body.

[0033] The above disclosure is only an embodiment of the present invention, but the present invention is not limited thereto, and any changes that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A refrigerant chip cooler, used for being installed on a chip to cool the chip, characterized in that: The cooler comprises a main body, wherein the main body comprises an upper heat conducting plate and a lower heat conducting plate, wherein the lower heat conducting plate is attached to the chip; The upper heat conducting plate is a stamped part, and the plate body of the upper heat conducting plate is formed with two liquid inlet and outlet slots at its outer edge, which are recessed from the lower surface to the upper surface and connect the inside and outside of the plate body; the plate surface of the upper heat conducting plate is formed with a connecting channel which is recessed from the lower surface to the upper surface and connects the two liquid inlet and outlet slots; The recessed depth of the inlet and outlet grooves on the upper heat conducting plate is greater than the recessed depth of the connecting channel, and the connection between the two has a transition surface that is inclined or arc-shaped; The outer edge of the lower heat conducting plate is provided with a lower flange folded upward to cover the liquid inlet and outlet slot at least at the position corresponding to the liquid inlet and outlet slot, and the lower flange is provided with a mounting opening communicated with the liquid inlet and outlet slot; The upper heat conducting plate is sealed and attached to the lower heat conducting plate so that the connecting groove on the upper heat conducting plate cooperates with the plate surface of the lower heat conducting plate to form a refrigerant channel for the flow of refrigerant, and the two inlet and outlet liquid grooves of the upper heat conducting plate cooperate with the plate surface of the lower heat conducting plate to form two inlet and outlet liquid channels.

2. A refrigerant type chip cooler according to claim 1, characterized in that: The upper heat conducting plate is at least extended to form a sealing lip at the edge of the opening corresponding to the liquid inlet and outlet grooves.

3. A refrigerant type chip cooler according to claim 1 or 2, characterized in that: The lower heat conducting plate is provided with lower flanges arranged continuously or at intervals along its outer edge, and the lower flanges at the corresponding outer edges of the lower heat conducting plate cooperate to form an inlay, and the upper heat conducting plate is embedded in the inlay formed by the lower heat conducting plate.

4. A refrigerant type chip cooler according to claim 2, characterized in that: The upper heat conducting plate is provided with upper flanges which are arranged continuously or at intervals along its outer edge, and the sealing lip is a part of the upper flanges.

5. The refrigerant type chip cooler according to claim 1, characterized in that: The cooler body also includes at least one matching plate stacked on the upper heat conducting plate, and a refrigerant expansion cavity connected to the refrigerant channel is formed by sealing between adjacent matching plates and the upper heat conducting plate or between two adjacent matching plates.

6. A refrigerant type chip cooler according to claim 5, characterized in that: The plate body of the matching plate is formed with matching grooves and matching grooves which are recessed from the lower surface to the upper surface corresponding to the connecting grooves and the liquid inlet and outlet grooves, and the upper heat conducting plate is provided with a connecting opening which penetrates the plate body corresponding to the liquid inlet and outlet grooves.

7. The refrigerant chip cooler according to claim 1, characterized in that: A convex structure formed by the lower surface being concave toward the upper surface is formed on the plate surface of the lower heat conducting plate at a position corresponding to the connecting groove and / or the liquid inlet and outlet groove.

8. The refrigerant chip cooler according to claim 1, characterized in that: The two liquid inlet and outlet slots on the upper heat conducting plate are arranged on the same side or on different sides.

9. The refrigerant chip cooler according to claim 1, characterized in that: The connecting channels on the upper heat conducting plate are of a multi-channel structure or arranged in a meandering serpentine shape.

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