Electrical connection assembly and preparation method thereof and semiconductor device

Abstract

The present invention provides an electrical connection component, a preparation method thereof and a semiconductor device. The electrical connection component includes a conductor line and a plurality of metal wires formed on the conductor line, the length direction of the plurality of metal wires is perpendicular to the length direction of the conductor line, and the plurality of metal wires are arranged in parallel and spaced apart; wherein the portions of the two ends of the conductor line extending out of the metal wire are respectively a first extension portion and a second extension portion, and the length E1 of the first extension portion and the length E2 of the second extension portion are determined according to the length L of the conductor line, the calculated number n of the metal wires, and the minimum spacing S of the adjacent metal wires. m , the minimum width W of the metal wire m and the minimum extension length E of the end of the conductor line m In this way, complete and accurate dimensional data of the conductor wire and the metal wire can be obtained, and according to these dimensional data, the conductor wire and the metal wire with high dimensional accuracy can be prepared, especially, the dimensional accuracy of the length E1 of the first extension part and the length E2 of the second extension part is reliable, thereby improving the yield rate of the device.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to an electrical connection component and a preparation method thereof, and a semiconductor device. Background Art

[0002] At present, with the rapid development of semiconductor technology, nanometer-level circuit design has become the current mainstream technology. In nanometer-level circuit design, the requirements for design errors are extremely strict. If there is an error of one nanometer, it will have a significant impact on the product.

[0003] For example, in nanoscale circuit design, it is very important that metal wires can be evenly spaced on the conductor wire. Currently, in the design, first, the distance between two adjacent metal wires is the minimum spacing (min-spacing), and then the length of the metal wires extending on both sides of the conductor wire is calculated (E1 and E2), and both E1 and E2 are greater than the minimum extension length (min-extention). However, in the calculation process, because the maximum accuracy of each value is 1nm, and the actual values ​​may produce errors less than 1nm, such as 0.5nm errors, these errors will be randomly discarded or carried by EDA tools (chip design tools), and the probability of discarding or carrying is uncertain and uncontrollable. Therefore, the existing design method is extremely difficult to form high-precision conductor wires and metal wire electrical connection components.

[0004] Therefore, for nanoscale circuit design, an electrical connection component and its preparation method are designed to ensure high dimensional accuracy of conductor wires and metal wires, make (|E1-E2| as small as possible, and improve the yield rate of the device. This is a technical problem that urgently needs to be solved. Summary of the invention

[0005] The purpose of the present invention includes providing an electrical connection component and a preparation method thereof and a semiconductor device, which can make the dimensional accuracy of conductor wires and metal wires higher and improve the yield rate of the device.

[0006] The embodiments of the present invention can be implemented as follows:

[0007] In a first aspect, an embodiment of the present invention provides an electrical connection component, the electrical connection component comprising a conductor line and a plurality of metal wires formed on the conductor line, the length direction of the plurality of metal wires being perpendicular to the length direction of the conductor line, and the plurality of metal wires being arranged in parallel and spaced apart; wherein the portions of the metal wires extending out of the two ends of the conductor line are respectively a first extension portion and a second extension portion, and the length E1 of the first extension portion and the length E2 of the second extension portion are determined according to the length L of the conductor line, the calculated number n of the metal wires, and the minimum spacing S between adjacent metal wires. m , the minimum width W of the metal wire mand a minimal extension length E at the end of the conductor line m is determined.

[0008] In an alternative embodiment, the calculation formula for the calculated number n of metal wires is:

[0009] n = floor((L - E m * 2 - W m ) / (S m + W m )) + 1;

[0010] where floor is a function that takes the largest integer not greater than the independent variable.

[0011] In an alternative embodiment, when the condition E1 + E2 = M, where M is an even number, the calculation formulas for E1 and E2 are:

[0012] E1 = E2 = (L - (n - 1) * (W m + S m ) - W m ) / 2.

[0013] In an alternative embodiment, when the condition E1 + E2 = M, E1 > E2, and M is an odd number, the calculation formula for E1 is:

[0014] E1 = (L + 1 - (n - 1) * (W m + S m ) - W m ) / 2;

[0015] The calculation formula for E2 is:

[0016] E2 = (L - 1 - (n - 1) * (W m + S m ) - W m ) / 2.

[0017] In an alternative embodiment, when the condition E1 + E2 = M, E1 < E2, and M is an odd number, the calculation formula for E1 is:

[0018] E1 = (L - 1 - (n - 1) * (W m + S m ) - W m ) / 2;

[0019] The calculation formula for E2 is:

[0020] E2 = (L + 1 - (n - 1) * (W m + S m ) - W m ) / 2.

[0021] In a second aspect, an embodiment of the present invention provides a semiconductor device, the semiconductor device comprising the electrical connection component of any one of the aforementioned implementation modes.

[0022] In a third aspect, an embodiment of the present invention provides a method for preparing an electrical connection assembly, the method comprising the following steps: obtaining the length L of the conductor wire, the minimum spacing S of the metal wire, m , the minimum width W of the metal wire m and the minimum extension length E of the end of the conductor line m ; According to L, S m , W m and E m , calculate the number of metal wires n; according to L, S m , W m 、E m and n, and calculate the length E1 of the first extension portion and the length E2 of the second extension portion of the conductor line.

[0023] In an optional embodiment, according to L, S m , W m and E m , the number of metal wires n is calculated including:

[0024] The calculation formula for the number of metal wires n is:

[0025] n=floor((LE m *2-W m ) / (S m +W m ))+1;

[0026] Here, floor is a function that takes the largest integer not greater than the independent variable.

[0027] In an optional embodiment, according to L, S m , W m 、E m and n, calculating the length E1 of the first extension portion and the length E2 of the second extension portion of the conductor line comprises:

[0028] When E1+E2=M, and M is an even number, the calculation formula of E1 and E2 is:

[0029] E1=E2=(L-(n-1)*(W m +S m )-W m ) / 2.

[0030] In an optional embodiment, according to L, S m , W m 、E mFor L and n, calculating the length E1 of the first extension part and the length E2 of the second extension part of the conductor line includes:

[0031] When the conditions E1 + E2 = M and E1 > E2 are satisfied, where M is an odd number, the calculation formula for E1 is:

[0032] E1 = (L + 1 - (n - 1) * (W m + S m ) - W m ) / 2;

[0033] The calculation formula for E2 is:

[0034] E2 = (L - 1 - (n - 1) * (W m + S m ) - W m ) / 2.

[0035] In an alternative embodiment, for L, S m , W m , E m and n, calculating the length E1 of the first extension part and the length E2 of the second extension part of the conductor line includes:

[0036] When the conditions E1 + E2 = M and E1 < E2 are satisfied, where M is an odd number, the calculation formula for E1 is:

[0037] E1 = (L - 1 - (n - 1) * (W m + S m ) - W m ) / 2;

[0038] The calculation formula for E2 is:

[0039] E2 = (L + 1 - (n - 1) * (W m + S m ) - W m ) / 2.

[0040] The beneficial effects of the electrical connection component, its preparation method, and the semiconductor device provided by the embodiments of the present invention include: First, according to the design requirements of the device, the length L of the conductor line, the calculated number n of the metal lines, the minimum spacing S m between adjacent metal lines, the minimum width W m of the metal lines, and the minimum extension length E m of the end of the conductor line can be determined. Then, according to L, S m , W m , E mand n, calculate the length E1 of the first extension part of the conductor wire and the length E2 of the second extension part, so that the complete and accurate size data of the conductor wire and the metal wire can be obtained, and according to these size data, the conductor wire and the metal wire with high size accuracy can be prepared. However, the prior art lacks the technical concept provided by the embodiment of the present invention: first determine L, S m , W m 、E m And n, then calculate E1 and E2, obtain complete and accurate dimensional data of the conductor wire and the metal wire, and form an electrical connection component according to the dimensional data, which can make the dimensional accuracy of the conductor wire and the metal wire higher. In particular, the dimensional accuracy of the length E1 of the first extension part and the length E2 of the second extension part of the conductor wire is reliable, and (|E1-E2|) is made as small as possible, thereby improving the yield rate of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0042] Figure 1 A schematic structural diagram of an electrical connection assembly provided in a first embodiment of the present invention;

[0043] Figure 2 A schematic structural diagram of an electrical connection assembly provided in a second embodiment of the present invention;

[0044] Figure 3 A schematic structural diagram of an electrical connection assembly provided in a third embodiment of the present invention;

[0045] Figure 4 A flow chart of a method for preparing an electrical connection assembly provided in accordance with a fourth embodiment of the present invention.

[0046] Icons: 100 - electrical connection component; 200 - conductor wire; 210 - first extension portion; 220 - second extension portion; 300 - metal wire. DETAILED DESCRIPTION

[0047] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0048] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0049] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0050] In the description of the present invention, it should be noted that if the terms "upper" and "lower" appear to indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the product of the invention is usually placed when used. This is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0051] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0052] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0053] In the prior art, regarding the arrangement of metal wires on the conductor wire, the distance requirement between two adjacent metal wires can only be met first, and then the position of the metal wires on the conductor wire is randomly arranged, resulting in unreliable dimensional accuracy of the extension lengths reserved at both ends of the conductor wire. In this regard, this embodiment provides an electrical connection assembly that can solve the above technical problems.

[0054] First embodiment

[0055] Please refer to Figure 1 The electrical connection component 100 provided in this embodiment includes a conductor line 200 and a plurality of metal wires 300 formed on the conductor line 200. The plurality of metal wires 300 are arranged in parallel and spaced apart. The plurality of metal wires 300 are perpendicular to the conductor line 200. The middle position of each metal wire 300 coincides with the conductor line 200, and the middle lines of all metal wires 300 coincide.

[0056] According to the design requirements, the length L of the conductor line 200 and the minimum spacing S between adjacent metal lines 300 can be predetermined. m , the minimum width W of the metal line 300 m and the minimum extension length E of the end of the conductor line 200 m .

[0057] According to L, S m , W m and E m , the number of metal wires 300 n can be calculated. In this embodiment, the calculation formula for the number of metal wires 300 n is:

[0058] n=floor((LE m *2-W m ) / (S m +W m ))+1;

[0059] Here, floor is a function that takes the largest integer not greater than the independent variable.

[0060] Based on the calculation formula of the number n of metal lines 300, in (LE m *2-W m ) / (S m +W m ) is not an integer, then the largest integer not greater than the independent variable is taken, for example, (LE m *2-W m ) / (S m +W m ) is equal to 3.2, then floor((LE m *2-W m ) / (S m +W m )) is 3, and n is 4. In this way, the random rounding or rounding operation of the EDA tool in the prior art can be avoided, so that the obtained size data is more accurate and reliable.

[0061] According to L, S m , W m 、E m and n, the length E1 of the first extension portion 210 and the length E2 of the second extension portion 220 of the conductor line 200, which extend out of the metal line 300 at both ends, can be calculated. The length E1 of the first extension portion 210 here represents Figure 1 The length of the upper end of the conductor wire 200 extending out of the metal wire 300, and the length E2 of the second extension portion 220 are represented by Figure 1 The length of the lower end of the middle conductor 200 extending from the metal wire 300. This embodiment provides the following three methods to calculate the length E1 of the first extension portion 210 and the length E2 of the second extension portion 220.

[0062] Method 1: When the condition E1+E2=M is ​​met and M is an even number, the calculation formula of E1 and E2 is:

[0063] E1=E2=(L-(n-1)*(W m +S m) - W m ) / 2。

[0064] Method 2: When the conditions E1 + E2 = M, E1 > E2, and M is odd are satisfied, the calculation formula for E1 is:

[0065] E1 = (L + 1 - (n - 1) * (W m + S m ) - W m ) / 2;

[0066] The calculation formula for E2 is:

[0067] E2 = (L - 1 - (n - 1) * (W m + S m ) - W m ) / 2。

[0068] Method 3: When the conditions E1 + E2 = M, E1 < E2, and M is odd are satisfied, the calculation formula for E1 is:

[0069] E1 = (L - 1 - (n - 1) * (W m + S m ) - W m ) / 2;

[0070] The calculation formula for E2 is:

[0071] E2 = (L + 1 - (n - 1) * (W m + S m ) - W m ) / 2。

[0072] For example, in this embodiment, the length L of the conductor line 200 is 480 nm, the minimum spacing S between adjacent metal lines 300 m is 65 nm, the minimum width W of the metal line 300 m is 40 nm, and the minimum extension length E at the end of the conductor line 200 m is 10 nm. It can be obtained that:

[0073] n = floor((L - E m * 2 - W m ) / (S m + W m )) + 1

[0074] n = floor((480 - 10 * 2 - 40) / (65 + 40)) + 1

[0075] n = floor(4) + 1

[0076] n = 5

[0077] Method 1: When the condition E1 + E2 = M is satisfied and M is an even number:

[0078] E1 = E2 = (L - (n - 1) * (W m + S m ) - W m ) / 2

[0079] E1 = E2 = (480 - (5 - 1) * (40 + 65) - 40) / 2

[0080] E1 = E2 = 10nm

[0081] Method 2: When the conditions E1 + E2 = M and E1 > E2 are satisfied and M is an odd number, the length L of the conductor line 200 takes the value of 481nm:

[0082] E1 = (L + 1 - (n - 1) * (W m + S m ) - W m ) / 2

[0083] E1 = (481 + 1 - (5 - 1) * (40 + 65) - 40) / 2

[0084] E1 = 11nm;

[0085] E2 = (L - 1 - (n - 1) * (W m + S m ) - W m ) / 2

[0086] E2 = (481 - 1 - (5 - 1) * (40 + 65) - 40) / 2

[0087] E2 = 10nm;

[0088] In Method 2, it is equivalent to the length L of the conductor line 200 increasing upward by 1nm compared to Method 1, and the value of E1 increases by 1nm.

[0089] Method 3: When the conditions E1 + E2 = M and E1 < E2 are satisfied and M is an odd number, the length L of the conductor line 200 takes the value of 481nm:

[0090] E1 = (L - 1 - (n - 1) * (W m + S m ) - W m ) / 2

[0091] E1 = (481 - 1 - (5 - 1) * (40 + 65) - 40) / 2

[0092] E1 = 10nm;

[0093] E2=(L+1-(n-1)*(W m +S m )-W m ) / 2

[0094] E2=(481+1-(5-1)*(40+65)-40) / 2

[0095] E2 = 11 nm;

[0096] In the third method, the length L of the conductor line 200 is increased by 1 nm relative to that in the first method, and the value of E2 is increased by 1 nm.

[0097] It can be seen that in the first method, the metal wires 300 are evenly spaced, the length E1 of the first extension portion 210 of the conductor wire 200 and the length E2 of the second extension portion 220 are equal, and the various dimensional data meet the design requirements. In the second and third methods, the metal wires 300 are evenly spaced, the length E1 of the first extension portion 210 of the conductor wire 200 and the length E2 of the second extension portion 220 differ by only 1 nm, and the various dimensional data meet the design requirements. In this way, any of the above three methods can be used to obtain complete and accurate dimensional data of the conductor wire 200 and the metal wire 300, and the electrical connection component 100 is formed according to the dimensional data, which can make the dimensional accuracy of the conductor wire 200 and the metal wire 300 higher, especially, the dimensional accuracy of the length E1 of the first extension portion 210 of the conductor wire 200 and the length E2 of the second extension portion 220 is reliable, and (|E1-E2|) is made as small as possible, thereby improving the yield rate of the device.

[0098] Second embodiment

[0099] See also Figure 2 This embodiment provides an electrical connection component 100, which is similar in structure to the electrical connection component 100 provided in the first embodiment, except that the arrangement of the metal wire 300 is different.

[0100] The electrical connection component 100 of this embodiment includes a conductor line 200 and a plurality of metal wires 300 formed on the conductor line 200. The plurality of metal wires 300 are arranged in parallel and spaced apart. The plurality of metal wires 300 are perpendicular to the conductor line 200. The end of each metal wire 300 overlaps with the conductor line 200, and the middle lines of all the metal wires 300 overlap.

[0101] Similarly, according to design requirements, the length L of the conductor line 200 and the minimum spacing S between adjacent metal lines 300 can be predetermined. m , the minimum width W of the metal line 300 m and the minimum extension length E of the end of the conductor line 200 m According to L, S m , W mand E m , the number of metal wires 300 calculated n can be calculated. Then according to L, S m , W m 、E m By using the length E1 of the first extension portion 210 and the length E2 of the second extension portion 220 of the conductor wire 200 extending out of the metal wire 300 respectively, n can be calculated.

[0102] Third embodiment

[0103] See also Figure 3 This embodiment provides an electrical connection component 100, which is similar in structure to the electrical connection component 100 provided in the first embodiment, except that the arrangement of the metal wire 300 is different.

[0104] The electrical connection component 100 of this embodiment includes a conductor line 200 and a plurality of metal wires 300 formed on the conductor line 200. The plurality of metal wires 300 are arranged in parallel and spaced apart. The plurality of metal wires 300 are perpendicular to the conductor line 200. The end of each metal wire 300 overlaps with the conductor line 200, and the middle lines of two adjacent metal wires 300 are arranged in parallel and spaced apart. That is, the two adjacent metal wires 300 are located on opposite sides of the conductor line 200.

[0105] Similarly, according to design requirements, the length L of the conductor line 200 and the minimum spacing S between adjacent metal lines 300 can be predetermined. m , the minimum width W of the metal line 300 m and the minimum extension length E of the end of the conductor line 200 m According to L, S m , W m and E m , the number of metal wires 300 calculated n can be calculated. Then according to L, S m , W m 、E m By using the length E1 of the first extension portion 210 and the length E2 of the second extension portion 220 of the conductor wire 200 extending out of the metal wire 300 respectively, n can be calculated.

[0106] Fourth embodiment

[0107] See also Figure 4 This embodiment provides a method for preparing any one of the electrical connection components 100 in the first embodiment to the third embodiment, and the method includes the following steps:

[0108] S41: Obtain the length L of the conductor line 200 and the minimum spacing S of the metal line 300 m , the minimum width W of the metal line 300 m and the minimum extension length E of the end of the conductor line 200 m.

[0109] According to the design requirements, the length L of the conductor line 200 and the minimum spacing S between adjacent metal lines 300 can be predetermined. m , the minimum width W of the metal line 300 m and the minimum extension length E of the end of the conductor line 200 m .

[0110] For example, in this embodiment, the length L of the conductor line 200 is 480 nm, and the minimum spacing S between adjacent metal lines 300 is m The value is 65nm, and the minimum width W of the metal line 300 is m The minimum extension length E of the end of the conductor line 200 is 40 nm. m The value is 10nm.

[0111] S42: According to L, S m , W m and E m , calculate the calculation number n of the metal wire 300.

[0112] In this embodiment, the calculation formula for the number n of the metal wires 300 is:

[0113] n=floor((LE m *2-W m ) / (S m +W m ))+1;

[0114] Here, floor is a function that takes the largest integer not greater than the independent variable.

[0115] Based on the calculation formula of the number n of metal lines 300, in (LE m *2-W m ) / (S m +W m ) is not an integer, then the largest integer not greater than the independent variable is taken, for example, (LE m *2-W m ) / (S m +W m ) is equal to 3.2, then floor((LE m *2-W m ) / (S m +W m )) is 3, and n is 4. In this way, the random rounding or rounding operation of the EDA tool in the prior art can be avoided, so that the obtained size data is more accurate and reliable.

[0116] Based on the values ​​of various dimension data in S41, we can get:

[0117] n=floor((LE m *2-W m ) / (S m +W m ))+1

[0118] n=floor((480-10*2-40) / (65+40))+1

[0119] n=floor(4)+1

[0120] n=5

[0121] S43: According to L, S m , W m 、E m and n, calculate the length E1 of the first extension portion 210 and the length E2 of the second extension portion 220 of the conductor wire 200 extending out of the metal wire 300 respectively.

[0122] Here, the length E1 of the first extension portion 210 represents Figure 1 The length of the upper end of the conductor wire 200 extending out of the metal wire 300, and the length E2 of the second extension portion 220 are represented by Figure 1 The length of the lower end of the middle conductor 200 extending from the metal wire 300. This embodiment provides the following three methods to calculate the length E1 of the first extension portion 210 and the length E2 of the second extension portion 220.

[0123] Method 1: When the condition E1+E2=M is ​​met and M is an even number, the calculation formula of E1 and E2 is:

[0124] E1=E2=(L-(n-1)*(W m +S m )-W m ) / 2.

[0125] Based on the values ​​of the various dimension data in S41 and S42, we can get:

[0126] E1=E2=(L-(n-1)*(W m +S m )-W m ) / 2

[0127] E1=E2=(480-(5-1)*(40+65)-40) / 2

[0128] E1=E2=10nm

[0129] Method 2: When the conditions E1+E2=M, E1>E2 are met, and M is an odd number, the calculation formula of E1 is:

[0130] E1 = (L + 1 - (n - 1) * (W m + S m ) - W m ) / 2;

[0131] The calculation formula for E2 is:

[0132] E2 = (L - 1 - (n - 1) * (W m + S m ) - W m ) / 2.

[0133] Based on the values of each dimension data in S41 and S42, it can be obtained that:

[0134] When the conditions E1 + E2 = M and E1 > E2 are satisfied, and M is an odd number, the value of the length L of the conductor line 200 is 481 nm:

[0135] E1 = (L + 1 - (n - 1) * (W m + S m ) - W m ) / 2

[0136] E1 = (481 + 1 - (5 - 1) * (40 + 65) - 40) / 2

[0137] E1 = 11 nm;

[0138] E2 = (L - 1 - (n - 1) * (W m + S m ) - W m ) / 2

[0139] E2 = (481 - 1 - (5 - 1) * (40 + 65) - 40) / 2

[0140] E2 = 10 nm;

[0141] In Method 2, it is equivalent to that the length L of the conductor line 200 increases upward by 1 nm relative to Method 1, and the value of E1 increases by 1 nm.

[0142] Method 3: When the conditions E1 + E2 = M and E1 < E2 are satisfied, and M is an odd number, the calculation formula for E1 is:

[0143] E1 = (L - 1 - (n - 1) * (W m + S m ) - W m ) / 2;

[0144] The calculation formula for E2 is:

[0145] E2 = (L + 1 - (n - 1) * (W m + S m ) - Wm ) / 2。

[0146] Based on the values of each dimension data in S41 and S42, it can be obtained that:

[0147] When the conditions E1 + E2 = M and E1 < E2 are satisfied, and M is an odd number, the length L of the conductor line 200 takes the value of 481 nm:

[0148] E1 = (L - 1 - (n - 1) * (W m + S m ) - W m ) / 2

[0149] E1 = (481 - 1 - (5 - 1) * (40 + 65) - 40) / 2

[0150] E1 = 10 nm;

[0151] E2 = (L + 1 - (n - 1) * (W m + S m ) - W m ) / 2

[0152] E2 = (481 + 1 - (5 - 1) * (40 + 65) - 40) / 2

[0153] E2 = 11 nm;

[0154] In the third method, it is equivalent to that the length L of the conductor line 200 increases downward by 1 nm relative to the first method, and the value of E2 increases by 1 nm.

[0155] It can be seen that in the first method, the intervals between the metal lines 300 are uniform, the length E1 of the first extension 210 of the conductor line 200 is equal to the length E2 of the second extension 220, and all dimension data meet the design requirements. In the second and third methods, the intervals between the metal lines 300 are uniform, and the lengths E1 of the first extension 210 and E2 of the second extension 220 of the conductor line 200 only differ by 1 nm, and all dimension data meet the design requirements. In this way, any one of the above three methods can obtain the complete and accurate dimension data of the conductor line 200 and the metal line 300, and form the electrical connection component 100 according to the dimension data, which can make the dimension accuracy of the conductor line 200 and the metal line 300 higher. In particular, the dimension accuracy of the length E1 of the first extension 210 and the length E2 of the second extension 220 of the conductor line 200 is reliable, and (|E1 - E2|) is made as small as possible, improving the yield rate of the device.

[0156] Fifth Embodiment

[0157] The present embodiment provides a semiconductor device, which includes any one of the electrical connection components 100 in the first to third embodiments. The semiconductor device here may include a fin-type multi-gate transistor (also known as: FinFET device), which may be a dual-gate device, a tri-gate device, a bulk device, a silicon-on-insulator (SOI) device, or other configurations. With the benefit of various aspects of the present invention, a person of ordinary skill in the art may recognize other examples of semiconductor devices. For example, some embodiments described herein may also be applied to a full-ring gate (GAA) device, an omega gate (gate) device, or a Pi gate (II gate) device.

[0158] This embodiment also provides a method for preparing a semiconductor device, which includes the method for preparing the electrical connection assembly 100 provided in the fourth embodiment. The method for preparing a semiconductor device of this embodiment can be used to prepare the various types of semiconductor devices mentioned above. It should be understood that the preparation method provided in this embodiment includes steps with the characteristics of a complementary metal oxide semiconductor (CMOS) technology process flow. Additional steps can be implemented before, after, or during the preparation method.

[0159] The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. An electrical connection assembly, characterized in that: The electrical connection component includes: A conductor line (200); A plurality of metal lines (300) formed on the conductor line (200), the plurality of metal lines (300) being perpendicular to the conductor line (200), and the plurality of metal lines (300) being arranged in parallel at intervals; The two ends of the conductor line (200) that extend out of the metal line (300) are respectively the first extension part (210) and the second extension part (220), and the length E1 of the first extension part (210) and the length E2 of the second extension part (220) are calculated according to the length L of the conductor line (200), the calculated number n of the metal lines (300), and the minimum spacing S between adjacent metal lines (300). m , the minimum width W of the metal line (300) m and the minimum extension length E of the end of the conductor line (200) m Sure; The calculation formula for the calculated number n of the metal lines (300) is: n=floor((L-E m *2-W m ) / (S m +W m ))+1; where floor is a function that takes the largest integer not greater than the independent variable; When the condition E1 + E2 = M, and M is an even number, the calculation formulas for E1 and E2 are: <h2 style=";text-align:left;direction:ltr">E1 = E2 = (L - (n - 1) * (W<h2 style=";text-align:left;direction:ltr"> m <h2 style=";text-align:left;direction:ltr"> +S<h2 style=";text-align:left;direction:ltr"> m <h2 style=";text-align:left;direction:ltr"> )-W<h2 style=";text-align:left;direction:ltr"> m <h2 style=";text-align:left;direction:ltr"> ) / 2; When the condition E1 + E2 = M, E1 > E2, and M is an odd number, the calculation formula for E1 is: E1=(L+1-(n-1)*(W m +S m )-IN m ) / 2; The calculation formula for E2 is: <h2 style=";text-align:left;direction:ltr">E2 = (L-1-(n-1)*(W<h2 style=";text-align:left;direction:ltr"> m <h2 style=";text-align:left;direction:ltr"> +S<h2 style=";text-align:left;direction:ltr"> m <h2 style=";text-align:left;direction:ltr"> )-W<h2 style=";text-align:left;direction:ltr"> m <h2 style=";text-align:left;direction:ltr"> ) / 2; When the condition E1 + E2 = M, E1 < E2, and M is an odd number, the calculation formula for E1 is: E1=(L-1-(n-1)*(W m +S m )-IN m ) / 2; The calculation formula for E2 is: <h2 style=";text-align:left;direction:ltr">E2 = (L+1-(n-1)*(W<h2 style=";text-align:left;direction:ltr"> m <h2 style=";text-align:left;direction:ltr"> +S<h2 style=";text-align:left;direction:ltr"> m <h2 style=";text-align:left;direction:ltr"> )-W<h2 style=";text-align:left;direction:ltr"> m <h2 style=";text-align:left;direction:ltr"> ) / 2.

2. A semiconductor device, characterized in that: The semiconductor device includes the electrical connection component described in claim 1.

3. A method for preparing an electrical connection assembly, characterized in that: The method includes the following steps: Obtain the length L of the conductor line (200) and the minimum spacing S of the metal line (300) m , the minimum width W of the metal line (300) m and the minimum extension length E of the end of the conductor line (200) m ; According to L, S m , W m and E m , calculate the calculation number n of the metal wire (300); According to L, S m , W m 、E m and n, calculating the length E1 of the first extension portion (210) and the length E2 of the second extension portion (220) of the conductor line (200); According to L, S m , W m and E m , calculating the number n of metal wires (300) includes: The calculation formula for the calculated number n of the metal lines (300) is: n=floor((L-E m *2-W m ) / (S m +W m ))+1; where floor is a function that takes the largest integer not greater than the independent variable; According to L, S m , W m 、E m and n, calculating the length E1 of the first extension portion (210) and the length E2 of the second extension portion (220) of the conductor line (200) comprises: When the condition E1 + E2 = M, and M is an even number, the calculation formulas for E1 and E2 are: <h2 style=";text-align:left;direction:ltr">E1 = E2 = (L - (n - 1) * (W<h2 style=";text-align:left;direction:ltr"> m <h2 style=";text-align:left;direction:ltr"> +S<h2 style=";text-align:left;direction:ltr"> m <h2 style=";text-align:left;direction:ltr"> )-W<h2 style=";text-align:left;direction:ltr"> m <h2 style=";text-align:left;direction:ltr"> ) / 2; When the condition E1 + E2 = M, M is an odd number, and E1 > E2, the calculation formula for E1 is: E1=(L+1-(n-1)*(W m +S m )-IN m ) / 2; The calculation formula for E2 is: <h2 style=";text-align:left;direction:ltr">E2 = (L-1-(n-1)*(W<h2 style=";text-align:left;direction:ltr"> m <h2 style=";text-align:left;direction:ltr"> +S<h2 style=";text-align:left;direction:ltr"> m <h2 style=";text-align:left;direction:ltr"> )-W<h2 style=";text-align:left;direction:ltr"> m <h2 style=";text-align:left;direction:ltr"> ) / 2; Or, when the condition E1 + E2 = M, E1 < E2, and M is an odd number, the calculation formula for E1 is: E1=(L-1-(n-1)*(W m +S m )-IN m ) / 2; The calculation formula for E2 is: <h2 style=";text-align:left;direction:ltr">E2 = (L+1-(n-1)*(W<h2 style=";text-align:left;direction:ltr"> m <h2 style=";text-align:left;direction:ltr"> +S<h2 style=";text-align:left;direction:ltr"> m <h2 style=";text-align:left;direction:ltr"> )-W<h2 style=";text-align:left;direction:ltr"> m <h2 style=";text-align:left;direction:ltr"> ) / 2.

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