Die bonder with turnover mechanism

Abstract

The invention relates to the technical field of die bonders, in particular to a die bonder with a turnover mechanism, which comprises a chip feeding mechanism, a dispensing mechanism, a product feeding mechanism and a chip feeding mechanism. Wherein the chip feeding mechanism is used for providing chips to be processed; the dispensing mechanism is used for dispensing the chips; the product feeding mechanism is used for storing a to-be-processed chip and a dispensed chip; the chip feeding mechanism comprises a driving module and an overturning module arranged on the driving module, the overturning module is at least provided with two adsorption parts, the overturning module is used for driving the adsorption parts to overturn, and the adsorption parts are used for adsorbing chips. And the driving module is used for driving the overturning module to move between the product feeding mechanism and the dispensing mechanism. The device has the effect of improving the production efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of a die bonding machine, and in particular to a die bonding machine with a flipping mechanism. Background Art

[0002] At present, in the field of semiconductor chip manufacturing, the requirements for chip processing accuracy and efficiency are getting higher and higher. As an important process, the technical level and degree of automation of dual-chip die bonding directly affect the quality and production efficiency of the product. The die bonding machine, also known as the chip mounter, is a key equipment in the semiconductor packaging process. It is mainly used to accurately place the cut chips on the predetermined substrate and fix the chips with adhesives. This process is crucial to ensure the electrical connection, mechanical stability and subsequent packaging process of semiconductor devices.

[0003] The main functions of the die bonder include chip picking, alignment, placement and fixing. During operation, the die bonder uses a high-precision visual system to identify and locate the chip and substrate, and then uses a robotic arm to accurately place the chip at the predetermined position on the substrate. Subsequently, the glue is applied to the substrate through a dispensing mechanism and the chip is attached to it. Some die bonders also have the function of heating or UV curing to ensure that the adhesive cures quickly and improve production efficiency.

[0004] In the related art, a robot arm is usually used in conjunction with a visual system to align and transfer the chip, and then a glue dispensing mechanism is used to fix the chip. However, this solution is limited in production efficiency by the movement speed of the robot arm and the processing speed of the visual system, resulting in reduced production efficiency.

[0005] Therefore, there is an urgent need for a die bonding machine with a flipping mechanism. Summary of the invention

[0006] In order to improve production efficiency, the present application provides a die bonding machine with a flipping mechanism.

[0007] The present application provides a die bonding machine with a flipping mechanism, which adopts the following technical solution: A die bonding machine with a flipping mechanism, comprising: A chip loading mechanism, used to provide chips to be processed; A glue dispensing mechanism, used for dispensing glue on the chip; Product feeding mechanism, used to store chips to be processed and chips after dispensing; The chip feeding mechanism includes a driving module and a flipping module arranged on the driving module, the flipping module is provided with at least two adsorption parts, the flipping module is used to drive the adsorption parts to flip, the adsorption parts are used to adsorb chips, and the driving module is used to drive the flipping module to move between the product feeding mechanism and the dispensing mechanism.

[0008] By adopting the above technical solution, when it is necessary to fix the chip, the chip loading mechanism is first used to transport a chip to be processed to a position close to the dispensing mechanism, and at the same time, an adsorbent is used to adsorb the chip to be processed on the product feeding mechanism, and then the driving module is started. The driving module drives the adsorbent to move through the flip module to transport the chip adsorbed on the adsorbent to the dispensing mechanism, so that the dispensing mechanism can dispense glue on the chip, and at this time, the chip loading mechanism places another chip to be processed on the chip after dispensing, so that the two chips are bonded together. Then, the flip module works, so that an adsorbent removes the bonded chip from the dispensing mechanism, and another adsorbent transports the chip to be processed to the dispensing mechanism, thereby reducing the pause time during the dispensing process, which is conducive to improving production efficiency. And when the adsorbent removes the bonded chip from the dispensing mechanism, the driving module can drive the chip to move through the flip module and the adsorbent to place the chip after dispensing on the product feeding mechanism, so as to facilitate the completion of the chip solidification operation.

[0009] Optionally, the driving module includes a Y-axis driving component and a Z-axis driving component, one end of the Y-axis driving component extends above the dispensing mechanism, the Z-axis driving component is arranged on the Y-axis driving component, and the flip module is arranged on the Z-axis driving component. The Y-axis driving component is used to drive the Z-axis driving component to move between the product feeding mechanism and the dispensing mechanism, and the Z-axis driving component is used to drive the flip module to move up and down.

[0010] By adopting the above technical solution, when the chip needs to be transferred, the Z-axis driving component is first started, and the Z-axis driving component drives the flip module to move up and down, so that the flip module drives the adsorption component to move, so that the chip on the dispensing mechanism or the product feeding mechanism can be removed by the adsorption component, and then the Y-axis driving component is started, and the Y-axis driving component drives the Z-axis driving component to move between the product feeding mechanism and the dispensing mechanism, and the Z-axis driving component drives the flip module and the adsorption component to move, so as to facilitate the transfer of the chips stored on the product feeding mechanism to the dispensing mechanism, and facilitate the transfer of the chips that have been glued on the dispensing mechanism to the product feeding mechanism.

[0011] Optionally, the flip module includes a flip driving component and a supporting component, the flip driving component is arranged on the Z-axis driving component, the supporting component is connected to the output end of the flip driving component, and two adsorption components are provided, and the two adsorption components are respectively arranged on the supporting component.

[0012] By adopting the above technical solution, the flipping driving member can drive the supporting member to rotate, and the supporting member can drive the two adsorption members to rotate to realize the flipping of the two adsorption members. Therefore, during the dispensing process, an adsorption member can be used to remove the bonded chip from the dispensing mechanism, and another adsorption member can be used to transport the chip to be processed to the dispensing mechanism, which reduces the pause time in the dispensing process to a certain extent, thereby helping to improve production efficiency.

[0013] Optionally, the angle between the two adsorption members is 90 degrees.

[0014] By adopting the above technical solution, the angle between the two adsorbents is 90 degrees. On the one hand, it makes it less likely for the two adsorbents to interfere with each other during the process of storing and accessing chips. On the other hand, it makes the flipping path of the two adsorbents more direct and efficient, reducing unnecessary movement to a certain extent, which is beneficial to improving the efficiency of the adsorbents in storing and accessing chips, and then beneficial to improving overall production efficiency.

[0015] Optionally, the product feeding mechanism includes a support platform and a plurality of material trays arranged on the support platform, and the plurality of material trays are parallel to each other and inclined in a direction close to the dispensing mechanism.

[0016] By adopting the above technical solution, the setting of several material trays can provide storage locations for chips, and the inclined setting of the material trays can reduce the possibility of the positions of the two chips being offset due to gravity when the glue is not cured, which is beneficial to improving the product yield.

[0017] Optionally, the inclination angle of the material tray is 45 degrees.

[0018] Optionally, the glue dispensing mechanism includes a glue dispensing module, a glue supply module and a clamping module, and the glue dispensing module, the glue supply module and the clamping module are distributed in sequence along the direction close to the driving module. The clamping module is used to clamp the chip, and the glue dispensing module is used to apply glue from the glue supply module on the chip clamped by the clamping module.

[0019] By adopting the above technical solution, when it is necessary to dispense glue on the chip, the clamping claw module can clamp the chip on the adsorption component and drive the chip to a position close to the dispensing module, so that the dispensing module can dispense glue from the glue supply module on the chip.

[0020] Optionally, the glue supply module includes a glue storage table, a driving member and a glue scraper member. The glue storage table is provided with an annular groove in which glue is stored. The driving member is arranged on the glue storage table. The glue scraper member is slidably inserted in the annular groove and connected to the driving member. The driving member is used to drive the glue scraper member to move in the annular groove.

[0021] By adopting the above technical solution, the driving member can drive the scraper member to move in the annular groove, so as to use the scraper member to drive the glue to flow in the annular groove, which is beneficial to reduce the possibility of glue condensation in the annular groove, and then facilitate the glue dispensing module to take glue from the annular groove.

[0022] Optionally, the clamping jaw module includes a rotating driving member and an adsorption clamping jaw arranged on the rotating driving member, the rotating driving member is arranged between the product feeding mechanism and the glue supply module, the rotating driving member is used to drive the adsorption clamping jaw to rotate, and the adsorption clamping jaw is used to clamp the chip.

[0023] By adopting the above technical solution, the adsorption clamp can adsorb the chip, and the rotating drive can drive the adsorption clamp to rotate accurately to a specified position, which is beneficial to improving the speed and consistency of chip placement.

[0024] Optionally, it includes a frame, and the chip loading mechanism, the glue dispensing mechanism, the product feeding mechanism, and the chip feeding mechanism are respectively arranged on the frame.

[0025] By adopting the above technical solution, the chip loading mechanism, the glue dispensing mechanism, the product feeding mechanism and the chip feeding mechanism are integrated on the frame, which is beneficial to improving the assembly efficiency of the overall equipment and facilitating smoother collaboration between the various mechanisms.

[0026] In summary, the present application includes at least one of the following beneficial technical effects: 1. Through the cooperation of the chip loading mechanism, the dispensing mechanism, the product feeding mechanism, the driving module, the flip module and the adsorbent, during the dispensing process, one adsorbent can remove the bonded chip from the dispensing mechanism, and the other adsorbent can transport the chip to be processed to the dispensing mechanism, thereby reducing the pause time during the dispensing process, which is conducive to improving production efficiency; 2. By tilting the tray, the possibility of the two chips shifting due to gravity when the glue is not cured is reduced to a certain extent, which is beneficial to improving the product yield; 3. Through the mutual cooperation of the glue storage table, the driving part and the scraper, the driving part can drive the scraper to move in the annular groove, so that the scraper can drive the glue to flow in the annular groove, which is beneficial to reduce the possibility of glue condensation in the annular groove, and then facilitate the glue dispensing module to take glue from the annular groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall structure of a die bonding machine with a flipping mechanism in an embodiment of the present application.

[0028] Figure 2It is a partial structural schematic diagram of a die bonding machine with a flipping mechanism in an embodiment of the present application.

[0029] Figure 3 yes Figure 1 A partial enlarged view of point A in the middle.

[0030] Description of reference numerals: 1. Rack; 11. Visual element; 2. Chip loading mechanism; 21. Crystal ring module; 22. Ejector module; 23. Swing arm module; 24. Calibration module; 25. Moving module; 3. Glue dispensing mechanism; 31. Glue dispensing module; 311. Glue dispensing drive; 312. Glue dispensing needle; 32. Glue supply module; 321. Glue storage table; 3211. Ring groove; 322. Drive; 323. Glue scraper; 33. Clamp module; 331. Rotary drive; 332. Adsorption clamp; 4. Product feeding mechanism; 41. Support table; 42. Material tray; 5. Chip feeding mechanism; 51. Drive module; 511. Y-axis drive; 512. Z-axis drive; 52. Flip module; 521. Flip drive; 522. Support; 523. Adsorption. DETAILED DESCRIPTION

[0031] The following is combined with Figure 1-3 This application is described in further detail.

[0032] The embodiment of the present application discloses a die bonding machine with a flipping mechanism.

[0033] It should be noted that, in the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0034] Reference Figure 1 The die bonder with a flip mechanism comprises a frame 1, a chip loading mechanism 2, a glue dispensing mechanism 3, a product feeding mechanism 4 and a chip feeding mechanism 5. The chip loading mechanism 2, the glue dispensing mechanism 3, the product feeding mechanism 4 and the chip feeding mechanism 5 are respectively installed on the frame 1, and the chip loading mechanism 2 is used to transport the chips to be processed, the glue dispensing mechanism 3 is used to dispense glue on the chips, the product feeding mechanism 4 is used to store the chips, and the chip feeding mechanism 5 is used to transport the chips between the product feeding mechanism 4 and the glue dispensing mechanism 3.

[0035] When the chip needs to be bonded, the chip loading mechanism 2 transports the chip to be processed to a position close to the glue dispensing mechanism 3, and the chip feeding mechanism 5 transports the chip on the product feeding mechanism 4 to the glue dispensing mechanism 3, so that the glue dispensing mechanism 3 can glue the chip. After the glue is dispensed, the chip loading mechanism 2 can cover another chip on the glued chip, so that the two chips are bonded together. Then, the chip feeding mechanism 5 can transport the bonded chips to the product feeding mechanism 4 for temporary storage, and after the glue solidifies, the bonding operation can be completed.

[0036] Reference Figure 1 The chip loading mechanism 2 includes a crystal ring module 21, a pin module 22, a swing arm module 23, a calibration module 24 and a moving module 25. The crystal ring module 21, the pin module 22, the swing arm module 23 and the moving module 25 are respectively installed on the frame 1, the crystal ring module 21 is used for transferring and positioning the crystal ring, the pin module 22 is located at the lower side of the crystal ring module 21, and the pin module 22 is used for lifting the chip.

[0037] An XY-axis calibration platform is provided on the frame 1, and the calibration module 24 is installed on the XY-axis calibration platform, and the XY-axis calibration platform is used to drive the calibration module 24 to approach or move away from the moving module 25, and the calibration module 24 is used to calibrate the angle of the chip. In other embodiments, the XY-axis calibration platform may not be provided.

[0038] The swing arm module 23 is disposed between the crystal ring module 21 and the calibration module 24 , and is used to transfer the chip lifted by the ejector pin module 22 to the calibration module 24 , so that the calibration module 24 can calibrate the angle of the chip.

[0039] When the chip calibration is completed, the XY axis calibration platform drives the calibration module 24 to approach the moving module 25 so that the moving module 25 can remove the chip from the calibration module 24 and transfer the chip to the dispensing mechanism 3 .

[0040] It should be noted that the specific structures and working principles of the crystal ring module 21, the ejector module 22, the swing arm module 23, the calibration module 24, the moving module 25 and the XY axis calibration table are conventional technical means for those skilled in the art, and therefore will not be elaborated in detail in the embodiments of the present application.

[0041] Reference Figure 1 The dispensing mechanism 3 includes a dispensing module 31, a glue supply module 32 and a clamping module 33. The dispensing module 31, the glue supply module 32 and the clamping module 33 are sequentially distributed on the frame 1, and the clamping module 33 is arranged close to the product feeding mechanism 4.

[0042] The clamping jaw module 33 includes a rotating driving member 331 and an adsorption clamping jaw 332 mounted on the rotating driving member 331. The rotating driving member 331 is mounted on the frame 1 and is located between the product feeding mechanism 4 and the glue supplying module 32. In this embodiment, the rotating driving member 331 is a rotating motor, so that the rotating driving member 331 is used to drive the adsorption clamping jaw 332 to rotate, so that the adsorption clamping jaw 332 is close to the product feeding mechanism 4 or the glue supplying module 32.

[0043] Reference Figure 1 and Figure 2 The glue supply module 32 includes a glue storage platform 321, a driving member 322 and a glue scraping member 323. The glue storage platform 321 is installed on the frame 1 and is located between the rotating driving member 331 and the glue dispensing module 31, and an annular groove 3211 is provided on the glue storage platform 321, and glue is stored in the annular groove 3211.

[0044] The driving member 322 is fixedly connected to the glue storage platform 321, and the scraper member 323 is slidably inserted in the annular groove 3211 and fixedly connected to the driving member 322. In this embodiment, the driving member 322 is a motor, so that the driving member 322 can be used to drive the scraper member 323 to move in the annular groove 3211, so that the scraper member 323 drives the glue to flow in the annular groove 3211, which is conducive to reducing the possibility of glue condensation in the annular groove 3211.

[0045] Reference Figure 1 The glue dispensing module 31 includes a glue dispensing driving component 311 and a glue dispensing needle 312 installed on the glue dispensing driving component 311. The glue dispensing driving component 311 can drive the glue dispensing needle 312 to move, so that the glue dispensing needle 312 is inserted into the annular groove 3211, and the glue dispensing needle 312 dispenses glue on the chip clamped by the adsorption clamp 332.

[0046] When the chip is clamped on the adsorption clamp 332, the rotary drive member 331 drives the adsorption clamp 332 to rotate, so that the adsorption clamp 332 drives the chip to move to a position close to the glue storage platform 321. At this time, the glue dispensing drive member 311 works to drive the glue dispensing needle 312 to first insert into the annular groove 3211, so that glue is attached to the glue dispensing needle 312, and then drives the glue dispensing needle 312 to move toward the adsorption clamp 332, so that the glue dispensing needle 312 can dispense glue on the chip.

[0047] In this embodiment, two visual elements 11 are installed on the frame 1. One visual element 11 is set close to the calibration module 24 to assist the calibration module 24 in calibrating the angle of the chip. The other visual element 11 is set close to the dispensing drive 311 to monitor the operation of the dispensing module 31.

[0048] Reference Figure 1The product feeding mechanism 4 includes a support platform 41 and a material tray 42. The support platform 41 is mounted on the frame 1, and the material tray 42 is mounted on the support platform 41, and the material tray 42 is tilted toward the direction of the adsorption clamp 332. In other embodiments, a plurality of material trays 42 may be provided, and the plurality of material trays 42 are arranged parallel to each other.

[0049] In this embodiment, the inclination angle of the tray 42 is 45 degrees, so that when two chips are bonded together and placed on the tray 42, the two chips are not easily offset under the action of gravity due to uncured glue, which is beneficial to improving the product yield.

[0050] Reference Figure 1 The chip feeding mechanism 5 includes a driving module 51 and a flipping module 52. The driving module 51 is installed on the frame 1 and is located beside the support platform 41, and the driving module 51 can drive the flipping module 52 to move between the material tray 42 and the adsorption clamp 332.

[0051] The driving module 51 includes a Y-axis driving member 511 and a Z-axis driving member 512. One end of the Y-axis driving member 511 extends to the top of the adsorption clamp 332, and the Z-axis driving member 512 is slidably connected to the Y-axis driving member 511, so that the Y-axis driving member 511 can drive the Z-axis driving member 512 to move between the material tray 42 and the adsorption clamp 332. The flip module 52 is installed on the Z-axis driving member 512, so that the Z-axis driving member 512 can be used to drive the flip module 52 to move up and down.

[0052] Reference Figure 1 and Figure 3 The flip module 52 includes a flip driving member 521 and a support member 522. The flip driving member 521 is mounted on the Z-axis driving member 512, and the support member 522 is fixedly connected to the output end of the flip driving member 521. In this embodiment, the flip driving member 521 is a motor, so that the flip driving member 521 is used to drive the support member 522 to flip.

[0053] At least two adsorption members 523 are mounted on the support member 522, and the adsorption members 523 are used to adsorb the chip. In this embodiment, two adsorption members 523 are provided.

[0054] When it is necessary to transfer the chip on the tray 42 to the adsorption clamp 332, first start the Y-axis driving member 511 and the Z-axis driving member 512 to move the flip driving member 521 to a position close to the tray 42, and then use an adsorption member 523 to remove the chip to be processed stored on the tray 42. At this time, no chip is adsorbed on the other adsorption member 523. Next, the Y-axis driving member 511 and the Z-axis driving member 512 drive the flip driving member 521 to move to a position close to the adsorption clamp 332, and use the adsorption member 523 without adsorbing the chip to remove the chip on the adsorption clamp 332, and then start the flip driving member 521 to drive the two adsorption members 523 to flip through the support member 522, so that the other adsorption member 523 delivers the chip to be processed to the adsorption clamp 332, and the adsorption clamp 332 clamps the chip to be processed, thereby completing the transfer of the chip.

[0055] Reference Figure 3 In this embodiment, the support member 522 is L-shaped, and the angle between the two adsorbents 523 is 90 degrees, so that on the one hand, the two adsorbents 523 are not easy to interfere with each other in the process of accessing the chip, and on the other hand, the flipping path of the two adsorbents 523 is more direct and efficient, which reduces unnecessary movement to a certain extent, is beneficial to improving the efficiency of the adsorbents 523 in accessing the chip, and then is beneficial to improving the overall production efficiency.

[0056] The implementation principle of a die bonding machine with a flipping mechanism in the embodiment of the present application is as follows: when two chips need to be bonded, the ejector module 22 lifts the chip, and the swing arm module 23 transfers the chip lifted by the ejector module 22 to the calibration module 24. After the calibration module 24 calibrates the angle of the chip, the moving module 25 removes the chip from the calibration module 24 and transfers it to a position close to the adsorption clamp 332. At the same time, the Y-axis drive 511 and the Z-axis drive 512 work to drive the flipping drive 521 to move first to a position close to the material tray 42, and then to a position close to the adsorption clamp 332. In this process, an adsorption member 523 removes the chip to be processed stored on the material tray 42 and transfers the chip to be processed to the adsorption clamp 332, so that the adsorption clamp 332 can clamp the chip.

[0057] Next, the rotary drive 331 drives the adsorption clamp 332 to rotate, so that the adsorption clamp 332 drives the chip to move to a position close to the glue storage platform 321. At this time, the glue dispensing drive 311 works to drive the glue dispensing needle 312 to dispense glue on the chip. Then, the mobile module 25 covers another chip on the glue-dispensed chip, so that the two chips are bonded together.

[0058] Finally, the rotating driving member 331 drives the adsorption clamp 332 to rotate to a position close to the tray 42, and one adsorption member 523 removes the two bonded chips from the adsorption clamp 332, and the other adsorption member 523 transfers the new chip to be processed to the adsorption clamp 332. Then, the Y-axis driving member 511 and the Z-axis driving member 512 move the flip driving member 521 to a position close to the tray 42, so that the adsorption member 523 places the two bonded chips on the tray 42, thereby completing the die bonding operation of the two chips.

[0059] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A die bonding machine with a flipping mechanism, characterized in that: include: A chip loading mechanism (2) is used to provide chips to be processed; A glue dispensing mechanism (3), used for dispensing glue on the chip; A product feeding mechanism (4) for storing chips to be processed and chips after glue dispensing; The chip feeding mechanism (5) comprises a driving module (51) and a flipping module (52) arranged on the driving module (51), wherein the flipping module (52) is provided with at least two adsorption components (523), the flipping module (52) is used to drive the adsorption components (523) to flip, the adsorption components (523) are used to adsorb chips, and the driving module (51) is used to drive the flipping module (52) to move between the product feeding mechanism (4) and the glue dispensing mechanism (3).

2. The die bonding machine with a flipping mechanism according to claim 1, characterized in that: The driving module (51) comprises a Y-axis driving component (511) and a Z-axis driving component (512), one end of the Y-axis driving component (511) extends to the top of the glue dispensing mechanism (3), the Z-axis driving component (512) is arranged on the Y-axis driving component (511), and the flip module (52) is arranged on the Z-axis driving component (512), the Y-axis driving component (511) is used to drive the Z-axis driving component (512) to move between the product feeding mechanism (4) and the glue dispensing mechanism (3), and the Z-axis driving component (512) is used to drive the flip module (52) to move up and down.

3. The die bonding machine with a flipping mechanism according to claim 2, characterized in that: The flip module (52) comprises a flip driving component (521) and a support component (522); the flip driving component (521) is arranged on the Z-axis driving component (512); the support component (522) is connected to the output end of the flip driving component (521); two adsorption components (523) are arranged, and the two adsorption components (523) are respectively arranged on the support component (522).

4. The die bonding machine with a flipping mechanism according to claim 3, characterized in that: The angle between the two adsorption members (523) is 90 degrees.

5. The die bonding machine with a flipping mechanism according to claim 1, characterized in that: The product feeding mechanism (4) comprises a support platform (41) and a plurality of material trays (42) arranged on the support platform (41); the plurality of material trays (42) are parallel to each other and are arranged inclined in a direction close to the glue dispensing mechanism (3).

6. The die bonding machine with a flipping mechanism according to claim 5, characterized in that: The inclination angle of the material tray (42) is 45 degrees.

7. The die bonder with a flipping mechanism according to claim 1, characterized in that: The glue dispensing mechanism (3) comprises a glue dispensing module (31), a glue supply module (32) and a clamping claw module (33); the glue dispensing module (31), the glue supply module (32) and the clamping claw module (33) are sequentially distributed along a direction close to the driving module (51); the clamping claw module (33) is used for clamping a chip; and the glue dispensing module (31) is used for applying glue from the glue supply module (32) onto the chip clamped by the clamping claw module (33).

8. The die bonder with a flipping mechanism according to claim 7, characterized in that: The glue supply module (32) comprises a glue storage platform (321), a driving member (322) and a glue scraping member (323); the glue storage platform (321) is provided with an annular groove (3211), glue is stored in the annular groove (3211), the driving member (322) is arranged on the glue storage platform (321), the glue scraping member (323) is slidably inserted in the annular groove (3211) and connected to the driving member (322); the driving member (322) is used to drive the glue scraping member (323) to move in the annular groove (3211).

9. The die bonder with a flipping mechanism according to claim 7, characterized in that: The clamping jaw module (33) comprises a rotating driving member (331) and an adsorption clamping jaw (332) arranged on the rotating driving member (331); the rotating driving member (331) is arranged between the product feeding mechanism (4) and the glue supply module (32); the rotating driving member (331) is used to drive the adsorption clamping jaw (332) to rotate; and the adsorption clamping jaw (332) is used to clamp a chip.

10. The die bonder with a flipping mechanism according to claim 1, characterized in that: It comprises a frame (1), wherein the chip loading mechanism (2), the glue dispensing mechanism (3), the product feeding mechanism (4), and the chip feeding mechanism (5) are respectively arranged on the frame (1).

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