Nano multi-layer composite anti-scratch film on gold product surface and preparation method thereof

Abstract

The present invention discloses a nano multi-layer composite anti-scratch film on the surface of a gold product, which is characterized in that: on the surface of the gold-plated layer of the gold product or gold-plated product, a gold transition layer, a nano multi-layer structure composed of at least one group of nano multi-layer composite protective film units, a Si transition layer, and an AF anti-fingerprint film on the outermost surface are sequentially covered from the inside to the outside, and each group of nano multi-layer composite protective film units is composed of a nano transparent medium layer and a nano gold layer covering it. The present invention also relates to a method for preparing the film. The nano multi-layer composite anti-scratch film on the surface of a gold product prepared by the method of the present invention well solves the problem of the inability of the gold-plated layer on gold, gold ornaments or stainless steel, brass, etc. to resist scratches.

Description

Technical Field

[0001] The present invention relates to a surface ion plating protective film of a gold product (or a gold-plated layer of a gold-plated product), in particular to a nano multi-layer composite anti-scratch film on the surface of the gold product. The present invention also relates to a preparation method of the film. Background Art

[0002] Various gold and rose gold jewelry have always been loved by people, but gold or gold-plated jewelry is relatively soft. When it is worn, it is easy to have bumps and scratches on the surface due to collision and friction, which affects its dazzling and beautiful beauty. For a long time, people have been trying to improve the scratch resistance of gold. There are two ways: one is alloying, adding various alloy elements to Au, including precious metals and light and heavy rare earths, but the effect is not ideal, either the hardness is not improved much, or the original color tone is changed; the second is to coat the surface with a transparent protective film, mostly dielectric films, including SiO2, Al2O3, etc. Some people try to use a single layer of transparent dielectric layer, but if the film is too thin, it is not wear-resistant, and if the film is too thick, interference colors will be produced. Some people use radio frequency sputtering to plate SiO2, and find that the deposition speed is too slow to keep up with the normal production rhythm of ion plating. These problems have not been solved for a long time. The base of pure gold jewelry is too soft, lacks strong support for the top transparent dielectric layer, and is more easily scratched. After the imitation gold (TiN) or imitation rose gold (TiCN) layer is ion plated on the surface of the stainless steel substrate, the products plated with real gold or real rose gold, such as watches, eyeglass frames, mobile phone shells, etc., although the stainless steel substrate is slightly harder, the single soft and thin gold layer on the supported surface also has the problem of not being resistant to scratches. Therefore, the problem of not being resistant to scratches on gold products or gold-plated layers on stainless steel and brass needs to be solved urgently. Summary of the invention

[0003] The first technical problem to be solved by the present invention is to provide a nano multi-layer composite anti-scratch film on the surface of a gold product or on the gold-plated layer (water electroplating or ion plating) on ​​the surface of stainless steel or brass.

[0004] The second technical problem to be solved by the present invention is to provide a method for preparing a nano multi-layer composite anti-scratch film on the surface of a gold product.

[0005] The nano multi-layer composite anti-scratch film on the surface of gold products prepared by the method of the present invention well solves the problem of the inability to resist scratches of the gold-plated layer on gold ornaments or stainless steel, brass and the like.

[0006] To solve the above-mentioned first technical problem, the technical solution adopted by the present invention is as follows:

[0007] A nano multi-layer composite anti-scratch film on the surface of a gold product, characterized in that: on the surface of the gold-plated layer of the gold product or gold-plated product, a gold transition layer, a nano multi-layer structure composed of at least one group of nano multi-layer composite protective film units, a Si transition layer, and an AF anti-fingerprint film as the outermost layer are sequentially covered from the inside to the outside, and each group of nano multi-layer composite protective film units is composed of a nano transparent medium layer and a nano gold layer covering it.

[0008] On the basis of the above, the present invention can also have various preferred forms:

[0009] The thickness of the nano transparent medium layer of the nano multi-layer composite protective film is 20-300nm, and the thickness of the nano gold layer is 50-500nm.

[0010] The nano transparent medium layer is an oxide film or a nitride film. The oxides include aluminum oxide, titanium oxide, niobium oxide, silicon oxide, zinc oxide and yttrium oxide. The nitrides include titanium nitride and zirconium nitride in addition to silicon nitride.

[0011] The material of the nano-gold layer is the same as the gold component of the substrate, including pure gold, various K golds, various rose golds and various gold alloys, and also platinum and platinum alloys.

[0012] The Si transition layer has a thickness of 5-20 nm, and the AF anti-fingerprint layer has a thickness of 20-30 nm.

[0013] The present invention can also be applied to the gold-plated layer on the surface of stainless steel or brass by water electroplating or ion plating. In this case, the material of the nano-gold layer is the same as the composition of the gold-plated layer on the gold-plated product.

[0014] The present invention can also be applied to the imitation gold (TiN) or imitation rose gold (TiCN or TiAlN) coating on the surface of stainless steel or brass by ion plating. In this case, the nano multi-layer composite anti-scratch film directly replaces the traditional gold plating layer and rose gold layer. The composition of the nano gold film or rose gold film in this case is specified separately.

[0015] The present invention can also be applied to silver ornaments: a silver transition layer is first plated at the connection with the substrate, the nano transparent medium layer is selected as described above, and the color layer can be made of silver or silver alloy with the same composition as the substrate. If gold or gold alloy is selected, it becomes a gold ornament with a silver substrate.

[0016] To solve the above second technical problem, the technical solution adopted by the present invention is as follows:

[0017] The following is an example of a multilayer composite anti-scratch film with nano-Al2O3 / nano-gold as a unit to illustrate the preparation method. The nano-Al2O3 represents that the nano-transparent medium layer mentioned above is an oxide film or a nitride film, and the oxide includes aluminum oxide, titanium oxide, niobium oxide, silicon oxide, zinc oxide and yttrium oxide, etc., and the nitride includes titanium nitride and zirconium nitride, etc. in addition to silicon nitride. The nano-gold represents the above-mentioned pure gold, various K gold, various rose gold and various gold alloys, platinum and platinum alloys, silver and silver alloys, etc.

[0018] A method for preparing a nano multi-layer composite anti-scratch film on the surface of a gold product, characterized in that it comprises the following steps:

[0019] 1) Furnace vacuuming: The cleaned gold products or gold-plated products are placed on the rotating hanger in the furnace, and the background vacuum is drawn for 3--6x10 -3 Pa;

[0020] If the previous process is to complete stainless steel, brass ion plating or imitation gold (TiN) coating jewelry in this furnace, then stop the titanium target and nitrogen supply, fill with Ar gas to 1-5Pa for 3-10 minutes, stop supplying Ar, and draw the background vacuum to 3-6x10 -3 Pa;

[0021] 2) Glow ion cleaning: fill with Ar gas to 1-3Pa, turn on the pulse bias power supply, -400 to -700V, duty cycle 50-70%, glow cleaning for 3-10 minutes;

[0022] 3) Make transition layer

[0023] For gold products, fill with Ar gas 1-5x10 -1 Pa, bias voltage -50 to -100v, open the cathode arc source of gold 40-70A and DC magnetron sputtering gold target 2-5A at the same time, mixed plating for 0.5-1.5 minutes, turn off the cathode arc source of gold, and continue sputtering the gold target to 50-500nm, then stop plating;

[0024] For stainless steel and brass ion-plated imitation gold (TiN) coating jewelry, fill with Ar gas 1-5x10 -1 Pa, bias voltage -50 to -100v, open the cathode arc of titanium (40-70A) and DC magnetron sputtering gold target (2-5A) at the same time, titanium and gold are mixed plated for 0.5-1.5 minutes, turn off the titanium arc source, and continue to sputter the gold target to 50-500nm, then stop plating;

[0025] 4) Nano-layered first unit

[0026] Plating the first layer: Turn on the special ceramic target power supply (Note: the special ceramic target power supply is purchased from outside) and run the Al2O3 magnetron sputtering twin ceramic target (Al2O3 target, 5-12A), control the film thickness to 20-300nm, and stop plating;

[0027] Plating the second layer: start gold target sputtering (2-5A), control the film thickness to 50-500nm and stop plating.

[0028] 5) Nano-layered second unit

[0029] Plating the first layer: Turn on the dedicated ceramic target power supply, run the magnetron sputtering twin ceramic target (Al2O3 target, 5-12A), control the film thickness to 20-300nm and stop plating;

[0030] Plating the second layer: Open the gold sputtering target (2-5A), control the film thickness to 50-500nm and stop plating;

[0031] 6) Nano-layered third unit to N unit

[0032] Each unit repeats the process operation of the second unit respectively;

[0033] 7) Plating multi-layer final unit

[0034] Plating the first layer: Turn on the dedicated ceramic target power supply, run the magnetron sputtering twin ceramic target (Al2O3 target, 5-12A) to control the film thickness to 20-300nm and stop plating;

[0035] Plating the second layer: Open the gold sputtering target (2-5A), control the film thickness to 50-500nm, the last layer of gold, generally increase the thickness by 10-20%, and stop plating;

[0036] 8) Sputtering Si transition layer: Open Si target, target voltage: 450-550V, target current: 5-15A, control the film thickness to about 5-20nm;

[0037] 9) AF evaporation: Place the AF pellets in a resistance heating crucible, heat them with electricity to evaporate, and deposit them on the Si transition layer to form an AF film with a thickness of about 20-30nm;

[0038] 10) Cool to below 100 degrees and remove from the oven.

[0039] Improved process: In order to reduce the stress mutation caused by the material change between the upper and lower interfaces in the nano multilayer structure of nano transparent medium layer / nano gold layer / nano transparent medium layer / nano gold layer..., in the interface area, the upper and lower film layer materials are mixed and plated to form a mixed plating interface, so as to reduce the interface stress mutation and improve the interface bonding strength.

[0040] The characteristics of the improved process are:

[0041] In the step 3) of forming the transition layer:

[0042] For gold jewelry, the gold cathode arc source and the DC magnetron sputtering gold target are co-plated for 0.5-1.5 minutes, the gold arc source is turned off, and the gold target continues to sputter for 50-500nm. The first minute before the target co-plating of the first layer of the next unit is started in advance;

[0043] For stainless steel and brass ion-plated imitation gold (TiN) coating jewelry, the cathode arc of titanium and the DC magnetron sputtering gold target are mixed for 0.5-1.5 minutes, the titanium arc source is turned off, and the gold target continues to sputter for 50-500nm. The first minute, the target co-plating of the first layer of the next unit is started in advance;

[0044] In the step 4) of plating the nano multilayer first unit:

[0045] Plating the first layer: In the transition layer stage of the previous process, in the last minute of the operation of the gold target, turn on the special ceramic target power supply in advance, and run the magnetron sputtering twin ceramic target (Al2O3 target, 5-12A) to make the ceramic target and the gold target splash together. After the gold target stops plating, the ceramic target continues to run, and the film thickness is controlled to reach 20-300nm. 0.5 minutes before the second layer of gold target is plated in advance and splashed with it.

[0046] Plating the second layer: start gold target sputtering (2-5A), as mentioned above, start the second layer of gold target and ceramic target sputtering for 0.5 minutes in advance, after the ceramic target stops plating, the gold target continues to run, control the film thickness to 50-500nm, and in the last 0.5 minutes, start the first layer of the next unit of sputtering target mixed plating in advance.

[0047] The step 5) of plating the first layer in the second nano-multilayer unit: in the previous process, i.e., plating the second gold layer of the first nano-multilayer unit layer, the magnetron sputtering twin ceramic target (Al2O3 target, 5-12A) is started in advance when the gold target runs for the last 0.5 minutes, so that the ceramic target and the gold target are splashed together. After the gold target stops plating, the ceramic target continues to be coated, and the gold target of the second layer is splashed with the gold target in advance when the film thickness is controlled to reach 20-300nm in the last 0.5 minutes.

[0048] Plating the second layer: As mentioned above, start the rose gold target (2-5A) in advance and sputter with the ceramic target for 0.5 minutes. After the ceramic target stops plating, the rose gold target continues to run to control the film thickness to 50-500nm. In the last 0.5 minutes, start the first layer of the next unit sputtering target for mixed plating in advance.

[0049] In the step 6), in the third to N units of nano-multilayer plating, each unit repeats the process operation of the second unit respectively;

[0050] The step 7) of plating the first layer of the last unit of the nano multilayer: in the previous process, i.e., plating the second gold layer of the Nth unit of the nano multilayer, the ceramic target (Al2O3 target, 5-12A) is opened in advance to mix with the gold target when the gold target runs for the last 0.5 minutes. After the gold target stops plating, the ceramic target continues to be plated, and the gold target of the second layer is opened in advance to mix with it in the last 0.5 minutes when the total thickness of the ceramic film layer is controlled to be 20-300nm.

[0051] Plating the second layer of the last unit: As mentioned above, the gold target (2-5A) is opened in advance and sputtered with the ceramic target for 0.5 minutes. After the ceramic target stops plating, the gold target continues to operate to control the film thickness to 50-500nm. For the last gold layer, the thickness is generally increased by 10-20% before plating.

[0052] The preparation method can be completed in the same dedicated coating equipment.

[0053] The configuration and functions of the special coating equipment include:

[0054] (1) A titanium-gold transition layer is plated on the substrate and a cathode arc source (titanium target) is configured;

[0055] (2) Used for sputtering nano-gold or rose gold layers, equipped with a columnar DC magnetron sputtering source (gold target, rose gold target);

[0056] (3) For sputtering nano-nano transparent dielectric layers, two techniques can be used:

[0057] 1) Adopt new technology: configure columnar ceramic twin magnetron sputtering source and special ceramic target power supply, so as to realize insulating ceramic target (such as Al2O3, etc.), carry out high-efficiency magnetron sputtering ceramic film, have a faster deposition rate, match the sputtering gold rate, and adapt to the production rhythm;

[0058] 2) Use traditional technology: configure a columnar medium-frequency twin magnetron sputtering source to reactively sputter and synthesize oxide or nitride nano-transparent dielectric layers. Select target materials such as aluminum, titanium, niobium, silicon, zirconium, etc. according to the required synthesized compounds, and equip with oxygen and nitrogen reaction gas supply pipes and gas distribution pipes.

[0059] (3) configuring a columnar DC magnetron sputtering source (silicon target) for coating a Si transition layer on the nano-multilayer composite protective film as a transition layer for AF;

[0060] (4) A thermal resistance evaporation device equipped with AF pellets for thermal evaporation of AF plating materials;

[0061] (5) A pulse bias power supply is configured to apply a negative bias voltage during cathode arc and magnetron sputtering deposition to increase the energy of deposited particles;

[0062] (6) If it is required to ion plate imitation gold TiN or imitation rose gold coating on stainless steel or brass jewelry, a columnar twin medium frequency magnetron sputtering source (Ti target) is configured, and N2 and acetylene gas sources are provided.

[0063] The present invention is to plate a group of nano multi-layer composite protective films on the surface of gold or gold ornaments or on the surface of stainless steel or brass with an imitation gold layer (TiN) or an imitation rose gold (TiCN) layer, wherein the component units are a nano transparent medium layer and a nano gold layer, and the units are repeated to form a multi-layer structure. The present invention can not only maintain the color of the original gold layer, but also improve the anti-scratch performance.

[0064] The present invention adopts a special ceramic target power supply to more effectively prepare a nano transparent medium layer, so that the production rhythms of two nano coatings are matched. This preparation technology combination is suitable for mass production and improves production efficiency.

[0065] The present invention can also be applied to silver or silver jewelry.

[0066] Beneficial effects:

[0067] (1) The present invention adopts a nano multilayer structure protective film of nano transparent medium layer / nano gold alloy film of the same substrate material to protect soft gold and gold-plated accessories, which not only improves the anti-scratch performance but also does not change the original color tone, thus solving a problem that has not been solved in the industry for many years.

[0068] (2) The nano multilayer composite protective film of the present invention is suitable for use as an anti-scratch protective film for gold, K gold, and rose gold jewelry. It is also suitable for use as an anti-scratch gold-plated film or rose gold film directly on an ion-plated imitation gold TiN layer or an imitation rose gold TiCN layer on a stainless steel or brass substrate, replacing the traditional ion-plated gold and rose gold layers.

[0069] (3) The present invention adopts a multilayer structure of nano-transparent dielectric layer / nano-gold layer, and utilizes the hardness and wear resistance of the dielectric film to protect the softer gold layer from scratches; utilizes the transparency of the dielectric film to display the original color of gold; and utilizes the nano-multilayer effect to improve the hardness and wear resistance of the membrane stack and extend its service life.

[0070] (4) The present invention realizes the selection and matching of various nano-transparent medium layers and various gold alloy films. The nano-transparent medium layer can be made of oxides, such as aluminum oxide, titanium oxide, niobium oxide, silicon oxide, zinc oxide, yttrium oxide, etc., or nitrides, such as silicon nitride, titanium nitride, zirconium nitride, etc.; the gold layer includes pure gold, various K golds, various grades of rose gold, and various gold alloys, and also includes platinum and platinum alloys, etc. There are many materials to choose from and it is widely used.

[0071] (5) The nano multilayer structure of the present invention can also be used as an anti-scratch protective film on silver jewelry. The nano transparent medium layer can be selected from the aforementioned oxides or nitrides, and the color layer can be selected from silver or silver alloys with the same composition as the matrix. If gold or gold alloys are selected, it becomes a gold jewelry with a silver matrix.

[0072] (6) The present invention adopts a dedicated ceramic target power supply to drive magnetron sputtering twin ceramic target sputtering technology. The insulating ceramic target deposition speed is relatively fast. It is combined with the DC magnetron sputtering gold technology to match the growth speed of the transparent dielectric layer and the gold layer, which is beneficial to industrial production.

[0073] (7) In the upper and lower interlayer regions of all multilayer structures of the present invention, mixed plating of upper and lower layer materials is adopted to reduce stress mutation and help improve bonding strength. BRIEF DESCRIPTION OF THE DRAWINGS

[0074] Figure 1 It is a schematic diagram of the structure of the nano multi-layer composite anti-scratch film on the surface of a gold product of the present invention.

[0075] In the figure: 1-gold product, 2-gold transition layer, 3-nano multilayer composite protective film unit, 3.2-nano transparent medium layer, 3.1-nano gold layer, 4-Si transition layer, 5-AF anti-fingerprint film. DETAILED DESCRIPTION

[0076] The embodiment of the nano multi-layer composite anti-scratch film on the surface of the gold product of the present invention is that the surface of the gold layer of the gold product 1 or the gold-plated product is sequentially covered with a gold transition layer 2, a nano multi-layer structure 3 composed of two groups of nano multi-layer composite protective film units, a Si transition layer 4, and an AF anti-fingerprint film 5 on the outermost layer from the inside to the outside. Each group of nano multi-layer composite protective film units is composed of a nano transparent medium layer 3.2 and a nano gold layer 3.1 covering it.

[0077] Preferably, the thickness of the nano transparent medium layer of the nano multilayer composite protective film is 20-300nm, the thickness of the nano gold layer is 50-500nm, the thickness of the Si transition layer is 5-20nm, and the thickness of the AF anti-fingerprint layer is 20-30nm.

[0078] The nano transparent medium layer is an oxide film or a nitride film, and the oxides include aluminum oxide, titanium oxide, niobium oxide, silicon oxide, zinc oxide, yttrium oxide, etc., and the nitrides include titanium nitride and zirconium nitride, etc. in addition to silicon nitride. The material of the nano gold layer is the same as the gold composition of the substrate, including pure gold, various K golds, various rose golds, and various gold alloys, and also platinum and platinum alloys.

[0079] The preparation method of the nano multi-layer composite anti-scratch film on the surface of a gold product of the present invention is as follows.

[0080] Example 1 Taking nano rose gold / nano Al2O3 multilayer film as an example, a rose gold target and an Al2O3 ceramic target with the same composition as the matrix are selected.

[0081] 1) Furnace vacuuming: The cleaned rose gold jewelry is placed on the rotating hanger in the furnace, and the background vacuum is 3--6x10 -3 Pa; if the previous process is to complete the ion plating of imitation rose gold (TiCN) on stainless steel and brass ornaments in this furnace, then stop the titanium target, stop the supply of nitrogen and acetylene, fill with Ar gas to 5Pa, 7 minutes, stop the supply of Ar, and draw the background vacuum to 4x10 -3 Pa.

[0082] 2) Glow ion cleaning: fill with 2Pa of Ar gas, turn on pulse bias, -600V, duty cycle 50%, glow cleaning for 5 minutes.

[0083] 3) Make transition layer

[0084] For rose gold jewelry, fill with Ar gas 3x10 -1 Pa, bias voltage--80v, turn on the rose gold cathode arc source (50A) and the DC magnetron sputtering rose gold target (3A) at the same time, mix and plate for 1 minute, turn off the rose gold arc source, and continue sputtering the rose gold target. Control the film thickness to 1 minute before 200nm, and start the co-plating of the first layer of the next unit in advance.

[0085] For stainless steel, brass ion-plated imitation rose gold TiCN-plated jewelry, fill with Ar gas 3x10 -1 Pa, bias voltage - 80v, turn on the titanium cathode arc (50A) and the DC magnetron sputtering rose gold target (3A) at the same time, titanium and rose gold are mixed plated for 1 minute, turn off the titanium arc source, and continue to sputter the rose gold target. Control the film thickness to 200nm for 1 minute, and start the target co-plating of the first layer of the next unit in advance.

[0086] 4) Plating the first layer of the first nano-multilayer unit: in the transition link of the previous process, the dedicated ceramic gold target power supply is turned on in advance in the last minute of the rose gold target operation, and the magnetron sputtering twin ceramic target (Al2O3 target, 7A) is operated, and the ceramic target and the rose gold target are mixed. The rose gold target is shut down after the time is up, and the ceramic target continues to sputter. The rose gold target is turned on for co-plating 0.5 minutes before the film thickness is controlled to be 60nm;

[0087] Plating the second layer: Start the rose gold sputtering (3A) in advance when the first ceramic layer is plated for the last 0.5 minutes, and the two targets are mixed for 0.5 minutes. When the time is up, the ceramic target is turned off. The rose gold target continues to sputter, and the film thickness is controlled to reach 100nm 0.5 minutes before, and the target of the first layer of the lower unit is started in advance for co-plating.

[0088] 5) Plating the first layer of the second nano-multilayer unit: In the previous process, the magnetron sputtering twin ceramic target (Al2O3 target, 7A) is started in advance when the rose gold target is running for the last 0.5 minutes, and the ceramic target and the rose gold target are sputtered together. The rose gold target is shut down after the time is up, and the ceramic target continues to sputter. The total film thickness is controlled to reach 60nm 0.5 minutes before the second layer of rose gold target is opened in advance for co-plating;

[0089] Second layer: Start rose gold sputtering (3A) in advance at the last 0.5 minutes of plating the first ceramic layer, and mix the two targets for 0.5 minutes. When the time is up, turn off the ceramic target. Continue sputtering the rose gold target, and control the film thickness to 100nm for 0.5 minutes before starting the target of the first layer of the lower unit for co-plating.

[0090] 6) Nano-layered multilayers from unit 3 to unit 5

[0091] Each unit repeats the process operation of the second unit respectively;

[0092] 7) Plating the first layer of the last sixth unit of nano-multilayer: in the previous process, when the rose gold target is running for the last 0.5 minutes, the ceramic target (Al2O3 target, 7A) is turned on in advance, and the ceramic target and the rose gold target are co-sputtered. The rose gold target is turned off after the time is up, and the ceramic target continues to sputter. The film thickness is controlled to be 60nm 0.5 minutes before the second layer of rose gold is turned on in advance to co-plating with it; Plating the second layer: When the first ceramic layer is plated for the last 0.5 minutes, the rose gold sputtering (3A) is turned on in advance, and the two targets are co-plated for 0.5 minutes, and the ceramic target is turned off when the time is up. The rose gold target continues to sputter, and the total film thickness is controlled to reach 120nm (generally, the last gold layer is 10-20% thicker than the normal thickness), and the plating is stopped.

[0093] 8) Sputtering Si transition layer: Open Si target, target voltage: 500V, target current: 10A, control the film thickness to about 5-20nm.

[0094] 9) AF evaporation: Place the AF pellets in the resistance heating crucible and heat them electrically to evaporate and deposit them on the Si transition layer to form an AF film with a thickness of about 20-30nm.

[0095] 10) Cool to below 100 degrees and remove from the oven.

Claims

1. A method for preparing a nano multi-layer composite anti-scratch film on the surface of a gold product or a gold-plated product, characterized in that: The following steps are involved: 1) Furnace vacuum The cleaned gold products or gold-plated products are placed on the rotating hanger in the furnace and the background vacuum is drawn 3x10 -3 Pa-6x10 -3 Pa; 2) Glow ion cleaning Fill with Ar gas to 1-3Pa, turn on the pulse bias power supply -400 to -700V, duty cycle 50-70%, glow cleaning for 3-10 minutes; 3) Make transition layer Ar gas filling 1x10 -1 Pa-5x10 -1 Pa, bias voltage -50 to -100 V, open the cathode arc source of gold 40-70A and DC magnetron sputtering gold target 2-5A at the same time, mixed plating for 0.5-1.5 minutes, turn off the cathode arc source of gold, and continue sputtering the gold target to 50-500nm, then stop plating; 4) Nano-layered first unit Plating the first layer: Turn on the dedicated ceramic target power supply, run the magnetron sputtering twin Al2O3 ceramic target 5-12A to form a nano transparent dielectric layer, control the film thickness to 20-300nm, and stop plating; Plating the second layer: Sputtering with a gold target for 2-5A to form a nano-gold layer, and stop plating when the film thickness reaches 50-500nm; 5) Nano-layered second unit Plating the first layer: Turn on the dedicated ceramic target power supply, run the magnetron sputtering twin Al2O3 ceramic target 5-12A to form a nano transparent dielectric layer, control the film thickness to 20-300nm, and stop plating; Plating the second layer: Sputtering the gold target 2-5A to form a nano-gold layer, controlling the film thickness to 50-500nm, and then stopping plating; 6) Nano-layered third unit to N unit Each unit repeats the process operation of the second unit respectively; 7) Nano-layered final unit Plating the first layer: Turn on the dedicated ceramic target power supply, run the magnetron sputtering twin Al2O3 ceramic target 5-12A to form a nano transparent dielectric layer, control the film thickness to 20-300nm and stop plating; Plating the second layer: Sputtering the gold target 2-5A to form a nano-gold layer, controlling the film thickness to 50-500nm and the thickness of the nano-gold layer in the unit to increase by 10-20% the thickness of the nano-transparent medium layer, and then stopping the plating; 8) Sputtering Si transition layer: open Si target, target voltage: 450-550V, target current: 5-15A, control film thickness 5-20nm; 9) AF evaporation: Place the AF pellets in a resistance heating crucible, heat them with electricity to evaporate, and deposit them on the Si transition layer to form an AF film with a thickness of 20-30nm; 10) Cool to below 100 degrees and remove from the oven.

2. The method for preparing the nano multi-layer composite anti-scratch film on the surface of a gold product or a gold-plated product according to claim 1, characterized in that: The nano multi-layer composite anti-scratch film on the surface of the gold product or the gold-plated product refers to a gold transition layer, a nano multi-layer composite protective film, a Si transition layer and an outermost AF anti-fingerprint film sequentially covered on the surface of the gold product or the gold-plated product from the inside to the outside.

3. The method for preparing the nano multi-layer composite anti-scratch film on the surface of a gold product or a gold-plated product according to claim 1, characterized in that: The thickness of the nano transparent medium layer is 20nm, the thickness of the nano gold layer is 50nm, the thickness of the Si transition layer is 5nm, and the thickness of the AF film is 20nm.

Images