An intelligent temperature control module

Abstract

The present application relates to the technical field of heat dissipation equipment, and in particular to an intelligent temperature control module. It comprises a silicone layer and a first heat dissipation layer, the first heat dissipation layer is buckled with the silicone layer, a second heat dissipation layer and a refrigeration sheet are arranged between the silicone layer and the first heat dissipation layer, a waterproof layer is arranged inside the first heat dissipation layer, a water absorption layer is arranged at the bottom of the silicone layer, and a phase change layer is arranged between the first heat dissipation layer and the second heat dissipation layer; the structure of the present application has a rapid cooling effect, the bottom has water absorption and waterproof effects, the structure is simple, and it is easy to use.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation equipment, and in particular to an intelligent temperature control module. Background Art

[0002] The commonly used heat dissipation solution is to use thin sheets with good thermal conductivity such as copper and graphite to evenly distribute the heat of components such as chips that need to be cooled to the outer shell. As the power consumption of chips in 5G mobile phones increases, these heat dissipation solutions cannot effectively dissipate heat. The mature radiator structure is "fan + heat pipe + cooling fins".

[0003] Since the chip has very high requirements for sealing performance, introducing a fan inside the chip will inevitably lead to an increase in space, and it will not be able to cool quickly, and it will not have a waterproof effect. Summary of the invention

[0004] In order to improve the problems of rapid cooling and lack of waterproofing, the present application provides an intelligent temperature control module.

[0005] The present application provides an intelligent temperature control module, which adopts the following technical solution: an intelligent temperature control module, comprising a silicone layer and a first heat dissipation layer, wherein the first heat dissipation layer is buckled on the silicone layer, a second heat dissipation layer and a refrigeration sheet are arranged between the silicone layer and the first heat dissipation layer, a waterproof layer is arranged inside the first heat dissipation layer, a water absorption layer is arranged at the bottom of the silicone layer, and a phase change layer is arranged between the first heat dissipation layer and the second heat dissipation layer;

[0006] The first heat dissipation layer is used to dissipate heat for devices that need heat dissipation;

[0007] Waterproof layer, used to prevent water or other liquids from entering the device;

[0008] Phase change layer, used to absorb heat and transform between liquid and solid;

[0009] The second heat dissipation layer is used to enhance heat dissipation;

[0010] Refrigeration sheet, used for cooling after being powered on;

[0011] A silicone layer for encapsulation;

[0012] The water absorbing layer is used to absorb the water produced by the refrigeration plate.

[0013] Preferably, the refrigeration plate is connected to a power source for starting and stopping refrigeration.

[0014] Preferably, the waterproof layer is frame-shaped and installed around the bottom of the first heat dissipation layer.

[0015] Preferably, a groove is provided in the middle of the first heat dissipation layer for placing the phase change layer, and a plurality of strip-shaped holes are provided on the top of the first heat dissipation layer.

[0016] Preferably, the first heat dissipation layer is made of metal, ceramic or graphite heat dissipation material.

[0017] Preferably, the second heat dissipation layer is made of artificial graphite, copper foil graphite, nano copper foil, nano aluminum foil and natural graphite.

[0018] Preferably, the waterproof layer is made of waterproof foam, sealing foam and silicone sealing material.

[0019] Preferably, the refrigeration fin comprises a heat dissipation surface and a refrigeration surface.

[0020] Preferably, the water absorbing layer is bonded with waterproof foam glue around its periphery.

[0021] In summary, the present application includes the following beneficial technical effects: the structure of the present application has a rapid cooling effect, the bottom has water absorption and waterproof functions, the structure is simple, and it is easy to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is an exploded view of the intelligent temperature control module of this application.

[0023] Figure 2 It is a cross-sectional view of the intelligent temperature control module of the present application.

[0024] Figure 3 It is a schematic diagram of the overall structure of the intelligent temperature control module of this application.

[0025] Explanation of the accompanying drawings: 1. first heat dissipation layer; 2. phase change layer; 3. second heat dissipation layer; 4. waterproof layer; 5. heat dissipation surface; 6. cooling surface; 7. silica gel layer; 8. water absorption layer; 10. cooling plate. DETAILED DESCRIPTION

[0026] The following is combined with Figures 1 to 3 This application is described in further detail.

[0027] The present application embodiment discloses an intelligent temperature control module. Figures 1 to 3The intelligent temperature control module includes a silicone layer 7 and a first heat dissipation layer 1, which are used to dissipate heat for devices that need heat dissipation; the first heat dissipation layer 1 is buckled on the silicone layer 7, and the silicone layer 7 is used for encapsulation. A second heat dissipation layer 3 and a refrigeration sheet 10 are arranged between the silicone layer 7 and the first heat dissipation layer 1, and the second heat dissipation layer 3 is used to enhance heat dissipation. A waterproof layer 4 is arranged inside the first heat dissipation layer 1, and the refrigeration sheet 10 is used for cooling after power is connected. The waterproof layer 4 is frame-shaped and installed around the bottom of the first heat dissipation layer 1 to prevent water or other liquids from entering the device; a water absorption layer 8 is arranged at the bottom of the silicone layer 7 to absorb water produced by the refrigeration sheet 10. A phase change layer 2 is arranged between the first heat dissipation layer 1 and the second heat dissipation layer 3 to absorb heat and transform between liquid and solid;

[0028] Reference Figure 1 and Figure 2 The cooling sheet 10 is connected to the power supply for starting and stopping the cooling. The silicone layer 7 has two grooves for placing the power connector.

[0029] Reference Figure 1 and Figure 2 A groove is provided in the middle of the first heat dissipation layer 1 for placing the phase change layer 2 , and a plurality of strip-shaped holes are provided on the top of the first heat dissipation layer 1 .

[0030] Reference Figure 1 and Figure 2 The first heat dissipation layer 1 is made of metal, ceramic, graphite heat dissipation materials. These heat dissipation materials have a fast heat dissipation speed.

[0031] Reference Figure 1 and Figure 2 The second heat dissipation layer 3 is made of artificial graphite, copper foil graphite, nano copper foil, nano aluminum foil and natural graphite.

[0032] Reference Figure 1 and Figure 2 The waterproof layer 4 is made of waterproof foam, sealing foam and silicone sealing material.

[0033] Reference Figure 1 and Figure 2 The cooling sheet 10 includes a heat dissipation surface 5 and a cooling surface 6. The cooling surface 6 is powered on to cool down. Since there is a power supply, it will generate heat after cooling down, so the heat is dissipated to the heat dissipation surface.

[0034] Reference Figure 1 and Figure 2 The water-absorbing layer 8 is bonded with waterproof foam glue around it to play a waterproof role.

[0035] Usage process: Just connect the cooling plate to the power supply, place the positive and negative power connectors on the two grooves of the silicone layer, turn on or off the power, and the intelligent temperature control module can work or stop working. Install the intelligent temperature control module on the chip or other equipment that needs to be cooled, it can quickly cool down, without moisture, without damaging the equipment, and the cooling speed is fast.

[0036] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An intelligent temperature control module, characterized in that: The invention comprises a silicone layer (7) and a first heat dissipation layer (1), wherein the first heat dissipation layer (1) is buckled on the silicone layer (7), a second heat dissipation layer (3) and a refrigeration sheet (10) are arranged between the silicone layer (7) and the first heat dissipation layer (1), a waterproof layer (4) is arranged inside the first heat dissipation layer (1), a water absorption layer (8) is arranged at the bottom of the silicone layer (7), and a phase change layer (2) is arranged between the first heat dissipation layer (1) and the second heat dissipation layer (3); A first heat dissipation layer (1) is used to dissipate heat for a device that needs heat dissipation; A waterproof layer (4), used to prevent water or other liquids from entering the device; A phase change layer (2) for absorbing heat and transforming between liquid and solid; A second heat dissipation layer (3), used to enhance heat dissipation; A cooling plate (10) is used for cooling after being powered on; A silica gel layer (7), used for packaging; A water absorbing layer (8) for absorbing water produced by the refrigeration sheet (10); The refrigeration sheet (10) is connected to a power source and is used to start and stop refrigeration. The waterproof layer (4) is frame-shaped and is installed around the bottom of the first heat dissipation layer (1). A groove is provided in the middle of the first heat dissipation layer (1) for placing the phase change layer (2). A plurality of strip-shaped holes are provided on the top of the first heat dissipation layer (1). Waterproof foam glue is bonded around the water absorption layer.

2. The intelligent temperature control module according to claim 1, characterized in that: The first heat dissipation layer (1) is made of metal, ceramic or graphite heat dissipation materials.

3. The intelligent temperature control module according to claim 1, characterized in that: The second heat dissipation layer (3) is made of artificial graphite, copper foil graphite, nano copper foil, nano aluminum foil and natural graphite.

4. The intelligent temperature control module according to claim 1, characterized in that: The waterproof layer (4) is made of waterproof foam, sealing foam and silica gel sealing material.

5. The intelligent temperature control module according to claim 1, characterized in that: The refrigeration fin (10) comprises a heat dissipation surface (5) and a refrigeration surface (6).

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