Method for cutting brittle material substrates

Abstract

The present invention provides a method for cutting a brittle material substrate, which can appropriately cut a brittle material substrate into single pieces of different sizes. The method comprises: a scribing step, in which a scribing line is formed along a predetermined cutting position on one main surface side of the substrate, the predetermined cutting position being determined around all regions including a region that becomes a small-sized single piece and a region that becomes a large-sized single piece after cutting; and a breaking step, in which a breaking action is performed on all breaking rod abutment positions by pressing a breaking rod into the breaking rod abutment position from the other main surface side of the substrate with a predetermined pressing amount, the breaking rod abutment position at least including the upper position of the scribing line, in the breaking step, (a) the blade tip angle (θ) is set to 50° to 90°, (b) the curvature radius (R) of the front end of the blade tip is set to 100μm to 300μm, (c) the pressing amount is set to 60μm to 100μm, and (d) the breaking rod descending speed is set to 10mm / s to 100mm / s.

Description

Technical Field

[0001] The present invention relates to individualization by cutting a brittle material substrate, and more particularly to a method for obtaining two individual chips of different sizes by scribing and breaking. Background Art

[0002] As a method for singulating (chipping) a brittle material substrate at multiple locations to obtain multiple single pieces (chips), the following method is already known: based on a scratching process that forms a scratch line at each predetermined cutting position on one main surface of the substrate, a breaking rod is abutted from the other main surface side relative to the predetermined cutting position and the breaking rod is further pressed in, thereby performing a breaking process that causes a crack to extend from the scratch line in the direction of the substrate thickness (for example, refer to patent document 1).

[0003] The above method is applied, for example, to the following case: a glass wafer is used as a base substrate, and a device mother substrate formed by forming a predetermined device structure on the base substrate using resin, metal, etc. is cut to obtain a device chip (single chip). That is, the device mother substrate produced by repeatedly arranging a device structure pattern two-dimensionally on a glass wafer is cut by the above-mentioned scribing process and breaking process, thereby obtaining a plurality of device chips.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2016-30364

[0007] In the above-mentioned device mother substrate, a region (large-size region) whose plane size is larger than the region (normal-size region) for the device chip possessed by the device structure, such as TEG, is sometimes formed at one or more locations. Moreover, even in such a case, there is a need to obtain a device chip by appropriately singulating through a scribing process and a disconnection process.

[0008] However, usually, the length of the tip (blade length) of the disconnecting rod used for disconnection processing is greater than the size of the object to be cut, so that cutting can be performed between any two points on the periphery of the object to be cut. Therefore, for example, in the case of a device mother substrate in which a large-size area and a normal-size area are mixed to be cut as described above, depending on the configuration of the two areas, the disconnecting rod may also come into contact with the large-size area that does not need to be cut. In the above situation, the following undesirable conditions may occur: the crack extends to the large-size area, and then the crack extends to other normal-size areas, resulting in cutting at a different location from the original location.

[0009] The following countermeasures are also considered: suppressing the generation of such cracks by improving the cutting sequence, but in addition to the relative movement of the breaking rod and the device mother substrate becoming complicated and productivity deteriorating, the possibility of positional deviation of the cutting part also increases, so it is not preferred. Originally, depending on the configuration relationship between the large-size area and the normal-size area, it is sometimes inevitable that the breaking rod will abut against the large-size area. Summary of the invention

[0010] Problems to be solved by the invention

[0011] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a method capable of appropriately cutting a brittle material substrate into individual pieces of different sizes.

[0012] Solutions to Solve Problems

[0013] In order to solve the above-mentioned problems, the invention of technical solution 1 is a method for cutting a brittle material substrate into a small-sized single piece and a large-sized single piece larger than the small-sized single piece along a predetermined cutting position, and the cutting method of the brittle material substrate is characterized in that it comprises: a scribing process, in which a scribing line is formed along the predetermined cutting position on one main surface side of the brittle material substrate, and the predetermined cutting position is determined around all areas including the area that becomes the small-sized single piece and the area that becomes the large-sized single piece after cutting; and a breaking process, in which the brittle material substrate is cut into the small-sized single piece and the large-sized single piece by pressing the breaking rod into the breaking rod abutment position from the other main surface side of the brittle material substrate with a prescribed pressing amount at all breaking rod abutment positions, and the breaking rod abutment position at least includes a position above the formation position of the scribing line,

[0014] In the breaking process, (a) the tip angle θ of the breaking rod is set to 50°~90°, (b) the curvature radius R of the front end of the tip of the breaking rod is set to 100μm~300μm, (c) the pressing amount is set to 60μm~100μm, and (d) the descending speed of the breaking rod when pressing the breaking rod into the substrate is set to 10mm / s~100mm / s.

[0015] The invention of Technical Solution 2 is based on the cutting method of a brittle material substrate according to Technical Solution 1, and is characterized in that, in the breaking process, after the breaking action for one breaking rod abutment position is completed, the substrate is moved and fed for performing the breaking action on the next breaking rod abutment position only in one direction in which the breaking rod abutment positions are arranged at a prescribed interval.

[0016] The invention of technical solution 3 is a method for cutting a brittle material substrate according to claim 1 or claim 2, characterized in that a pattern consisting of a small-size pattern and a large-size pattern is provided on the brittle material substrate, the small-size pattern is provided in an area which becomes the small-size single piece after cutting, and the large-size pattern is provided in an area which becomes the large-size single piece after cutting, and in the scribing process, the scribing line is formed on the brittle material substrate exposed between the patterns.

[0017] Effects of the Invention

[0018] According to the inventions of claim 1 to claim 3 , the brittle material substrate can be appropriately cut into small-sized individual pieces and large-sized individual pieces.

[0019] In particular, according to the invention of claim 2, a brittle material substrate can be cut into small-sized individual pieces and large-sized individual pieces with excellent versatility and productivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic plan view of the mother substrate 10 .

[0021] Figure 2 The diagram shows a state of a certain local area RE of the mother substrate 10 .

[0022] Figure 3 1 is a diagram schematically showing a state of a scribing process on the mother substrate 10 .

[0023] Figure 4 1 is a diagram schematically showing a state of a breaking process on the mother substrate 10 .

[0024] Figure 5 This is a plan view of a local region RE of the mother substrate 10 used for the breaking process as viewed from the base substrate 1 side.

[0025] Figure 6 It is a plan view showing the state of the local area RE in the middle of the breaking process of the mother substrate 10.

[0026] Figure 7 1 is a plan view showing a local region RE after the mother substrate 10 has been well broken.

[0027] Description of reference numerals:

[0028] 1 Base substrate

[0029] 2 Pattern

[0030] 2a Small size pattern

[0031] 2b Large size pattern

[0032] 10 Motherboard

[0033] 10a Small size singulation area

[0034] 10b Large size monolithic area

[0035] 100 Scratching Device

[0036] 101 Workbench

[0037] 102 Score Wheel

[0038] 102e Tip (of scoring wheel)

[0039] 200 Disconnection device

[0040] 201 Support

[0041] 202 Disconnect rod

[0042] 202e (break rod) tip

[0043] DL Cutting Line

[0044] DT retaining belt

[0045] PF protective film

[0046] Px x Cut off the predetermined position

[0047] Py y cut off the predetermined position

[0048] RG Ring

[0049] SL Score Line

[0050] ST interval DETAILED DESCRIPTION

[0051] <Cut object>

[0052] Figure 1 It is a schematic plan view of the mother substrate 10 to be cut in the present embodiment. Figure 2 It is shown Figure 1 FIG. 1 is a diagram showing a situation of a certain local area RE of the mother substrate 10. Figure 1 In the figure, xyz coordinates of a right-hand system are marked, in which the direction along the orientation plane 10f and the direction perpendicular to the direction are respectively set as the x-axis direction and the y-axis direction, and the direction perpendicular to the main surface is set as the z-axis direction. This coordinate system is also followed in subsequent figures.

[0053] in addition, Figure 2 (a) is a top view (xy top view) of the local area RE. Figure 2 (b) is Figure 2 AA' cross-sectional view (zx cross-sectional view) of (a).

[0054] like Figure 2 As shown, the mother substrate 10 has a structure in which a predetermined pattern 2 is two-dimensionally arranged in one or more layers composed of resin, metal, etc. on one main surface of the base substrate 1. In other words, the mother substrate 10 has the pattern 2 on one main surface side. In addition, the other main surface of the base substrate 1 on which the pattern 2 is not provided also becomes the other main surface of the mother substrate 10.

[0055] The base substrate 1 is a brittle material substrate having a plane size (diameter) of about 20 cm to 30 cm and a thickness of about 0.1 mm to 1.0 mm, and is exemplified by a glass wafer.

[0056] The pattern 2 uses a small-size pattern 2a of a specified size as a basic pattern, and also has a large-size pattern 2b having a larger plane size than the small-size pattern 2a in a portion of the mother substrate 10. The large-size pattern 2b is arranged in a manner surrounded by the small-size pattern 2a at at least one portion of the mother substrate 10. The local area RE illustrates this situation. For example, the small-size pattern 2a is a pattern constituting a specified device structure, and the large-size pattern 2b is a TEG. In the above case, a solder ball can also be formed on the upper surface of the pattern 2.

[0057] Each adjacent pattern 2 is separated from each other, and the base substrate 1 is exposed at the spacing street ST as the gap between the two. In the mother substrate 10, as the spacing street ST, there are a first spacing street ST1 as a gap between the small-sized patterns 2a, a second spacing street ST2 as a gap between the large-sized patterns 2b, and a third spacing street ST3 as a gap between the small-sized pattern 2a and the large-sized pattern 2b.

[0058] It should be noted that in Figure 2 In the figure, for simplicity of illustration, both the small-sized pattern 2a and the large-sized pattern 2b are rectangular shapes when viewed from above, but in fact, the shapes of the two patterns are not limited to this. In this case, the spacing track ST is considered to be the gap between the rectangles circumscribed to each pattern 2.

[0059] When both the small-sized pattern 2a and the large-sized pattern 2b are rectangular in plan view, the short side of the small-sized pattern 2a is about 0.5 mm to 2.0 mm, and the long side is about 0.5 mm to 2.0 mm. In addition, the short side of the large-sized pattern 2b is about 1.0 mm to 4.0 mm, and the long side is about 1.5 mm to 6.0 mm.

[0060] In addition, the width of the first street ST1 is about 30 μm to 100 μm, the width of the second street ST2 is about 20 μm to 200 μm, and the width of the third street ST3 is about 30 μm to 200 μm.

[0061] The mother substrate 10 is cut into individual pieces including the respective patterns 2 along the planned cutting positions predetermined at the streets ST. In other words, the planned cutting positions are provided around the entire region to be cut into individual pieces.

[0062] It should be noted that, in the mother substrate 10, the region that becomes a single piece including the small-size pattern 2a by cutting is called a small-size singulation region 10a, and the region that becomes a single piece including the large-size pattern 2b is called a large-size singulation region 10b. In other words, the cutting of the mother substrate 10 performed in the method of this embodiment is a process of dividing the mother substrate 10 into a plurality of small-size singulation regions 10a and a plurality of large-size singulation regions 10b.

[0063] In more detail, in this embodiment, since the pattern 2 is repeatedly arranged in the x-axis direction and the y-axis direction which are orthogonal to each other, the mother substrate 10 is cut at the x-cutting predetermined position Px along the x-axis direction and the y-cutting predetermined position Py along the y-axis direction. The x-cutting predetermined position Px and the y-cutting predetermined position Py are determined at the center of each of the first and second spacing streets ST1 and ST2.

[0064] In addition, among the x-cutting planned positions Px, the x-cutting planned positions where the large-sized pattern 2b does not exist in the extending direction thereof are referred to as first x-cutting planned positions Px1, and the x-cutting planned positions where the large-sized pattern 2b exists in the extending direction thereof are referred to as second x-cutting planned positions Px2. Similarly, among the y-cutting planned positions Py, the y-cutting planned positions where the large-sized pattern 2b does not exist in the extending direction thereof are referred to as first y-cutting planned positions Py1, and the y-cutting planned positions where the large-sized pattern 2b exists in the extending direction thereof are referred to as second y-cutting planned positions Py2.

[0065] <Overview of Cutting Process>

[0066] Next, the cutting process performed in this embodiment will be described in outline. The cutting process is achieved by performing a scribing process and a subsequent breaking process.

[0067] Figure 3 1 is a diagram schematically showing a state of a scribing process on the mother substrate 10. The scribing process can be performed using a known scribing device 100.

[0068] The scribing device 100 mainly includes a table 101 that can support the lower side of the scribing object in a horizontal posture, and a scribing wheel (cutting wheel) 102 that is a disc-shaped member having a cutting edge 102e at the outer edge. The scribing wheel 102 is held by the scribing device 100 so as to be rotatable in a vertical plane.

[0069] More specifically, the scoring wheel 102 is a disc-shaped member (scratching tool) with a diameter of 2 mm to 3 mm, and has a blade tip 102e in the shape of an isosceles triangle in cross-section on the outer peripheral surface. In addition, at least the blade tip 102e is formed of diamond. In addition, the angle (blade tip angle) α of the blade tip 102e is preferably 100° to 135°.

[0070] When the mother substrate 10 is to be cut, the mother substrate 10 is fixed on the workbench 101 so as to be positioned with one principal surface having the pattern 2 as the upper surface (scribing target surface) and the other principal surface as the mounting surface relative to the workbench 101 .

[0071] In more detail, before the scribing process, the mother substrate 10 is in a state where the other main surface thereof is attached to a retaining tape (e.g., a cutting tape) DT, which is pre-tensioned on a substantially annular ring (e.g., a cutting ring) RG. The ring RG to which the mother substrate 10 is attached to the retaining tape DT in the above manner is mounted and fixed on the workbench 101, thereby mounting and fixing the mother substrate 10 on the workbench 101.

[0072] In addition, Figure 3 , the situation when a certain y-cutting planned position Py is the marking object is shown.

[0073] When the scribing operation is performed along the y-predetermined cutting position Py, the mother substrate 10 is mounted and fixed on the workbench 101 in such a manner that each y-predetermined cutting position Py is parallel to the rotation plane of the scribing wheel 102. And, after positioning each y-predetermined cutting position Py so that the y-predetermined cutting position Py and the rotation plane of the scribing wheel 102 are located in the same vertical plane (a plane perpendicular to the drawing), the scribing wheel 102 is pressed and rolled along the y-predetermined cutting position Py on the mother substrate 10 (strictly speaking, on the base substrate 1 where the spacing street ST is exposed) while applying a predetermined load (referred to as a scribing load). The above-mentioned pressing and rolling is realized, for example, by horizontally moving the workbench 101 relative to the scribing wheel 102 using a driving mechanism not shown in the figure. Thus, a scribing line is formed along the y-predetermined cutting position Py on the base substrate 1 where the spacing street ST is exposed. The scribing line is preferably formed in such a manner that a vertical crack reaches a depth of about 20 to 50% relative to the thickness of the substrate from the surface of the base substrate 1. When the scribing lines are formed in the above manner, the scribing speed (speed at which the scribing wheel 102 is moved relative to the table 101) is preferably 100 mm / s to 300 mm / s.

[0074] In the present embodiment, for all the y-cutting predetermined positions Py separated at a predetermined interval in the x-axis direction, such a scribing operation as a combination of positioning and crimping and rolling of the scribing wheel 102 is sequentially performed from one end side in the x-axis direction. That is, after the scribing operation for one y-cutting predetermined position Py is completed, the mother substrate 10 is moved and fed only in one direction in the x-axis direction for scribing the next y-cutting predetermined position Py (relative movement of the scribing wheel 102 from the y-cutting predetermined position Py after the scribing process is completed to the y-cutting predetermined position Py to be the object of the next scribing process).

[0075] The same method is used when the scribing operation is performed along the x-cutting planned position Px.

[0076] It should be noted that in Figure 2When the second x-cutting predetermined position Px2 and the second y-cutting predetermined position Py2 shown are the objects of scribing, a large-size singulation region 10b (large-size pattern 2b) is sandwiched in the extension direction thereof. Therefore, during the scribing operation, the scribing wheel 102, which is pressed and rolled along the second x-cutting predetermined position Px2 or the second y-cutting predetermined position Py2 determined at the first spacing track ST1, temporarily rises at the moment when it is about to reach or reaches the first y-cutting predetermined position Py1 or the first x-cutting predetermined position Px1 determined at the third spacing track ST3 orthogonal to the second x-cutting predetermined position Px2 or the second y-cutting predetermined position Py2, and moves in the x-axis direction or the y-axis direction above the large-size singulation region 10b, so that no scribing line is formed in the large-size singulation region 10b. And, at the position in front of it where the second x-cutting predetermined position Px2 or the second y-cutting predetermined position Py2 is set, it descends again and presses and rolls along the above-mentioned second x-cutting predetermined position Px2 or the second y-cutting predetermined position Py2.

[0077] The mother substrate 10 after the scribing process at all the planned cutting positions is then subjected to a breaking process. Figure 4 1 is a diagram schematically showing a state of a breaking process on the mother substrate 10. The breaking process can be performed using a known breaking device 200.

[0078] The breaking device 200 mainly comprises a support body 201 and a breaking rod 202. The support body 201 is at least partially made of an elastic body and can support the lower part of the breaking object in a horizontal position. The breaking rod 202 is a plate-like component having a cutting tip 202e with a triangular shape in cross-section vertically downward.

[0079] As the support body 201 , for example, a structure in which a plate-shaped elastic body is placed and fixed on the upper surface of a metal member having a flat upper surface can be adopted.

[0080] The breaking rod 202 is a plate-shaped metal member (for example, made of superhard alloy) provided in a manner that a cutting edge 202e having an isosceles triangle shape in cross-section extends in the length direction of the blade. Figure 4 In the figure, the disconnection rod 202 is shown in such a way that the blade length direction becomes a direction perpendicular to the drawing. In addition, the blade length of the disconnection rod 202 is greater than the plane size of the mother substrate 10 so that the disconnection across the entire blade length direction can be performed by a single disconnection action.

[0081] exist Figure 4 , a situation is shown in which a certain y-scheduled cutting position Py where a scribe line SL is formed by the scribing process is the target of the breaking process.

[0082] The mother substrate 10 after the scribing process is attached to the retaining tape DT which is tensioned on the ring RG for the breaking process. Figure 4 As shown, during the disconnection process, the one main surface side exposed during the scribing process is covered by the protective film PF. The protective film covers the pattern 2 in a manner that its edge portion is attached to the ring RG. The mother substrate 10 after the scribing process is placed and fixed on the support body 201 in a posture with the other main surface side facing upward and the one main surface side facing downward. In other words, it is placed and fixed on the support body 201 together with the ring RG, the retaining tape DT and the protective film PF. That is, the protective film PF is placed and fixed in a manner that it contacts the support body 201.

[0083] Furthermore, when performing the disconnection operation along the y-cutting predetermined position Py, the mother substrate 10 is mounted and fixed on the support body 201 in such a manner that each y-cutting predetermined position Py is parallel to the blade length direction of the disconnection rod 202. Furthermore, after positioning each y-cutting predetermined position Py so that the y-cutting predetermined position Py and the disconnection rod 202 are located in the same vertical plane (a plane perpendicular to the drawing), the disconnection rod 202 is lowered toward the y-cutting predetermined position Py as indicated by the arrow AR1. After the blade tip 202e of the disconnection rod 202 abuts against the retaining tape DT, the disconnection rod 202 is further pressed by a predetermined distance (referred to as the pressing amount) z.

[0084] In this way, when the breaking rod 202 is lowered toward the y-cutting predetermined position Py of the mother substrate 10 with the scribe line SL located below, and is further pressed in with a specified pressing amount, the crack extends from the scribe line SL along the y-cutting predetermined position in the thickness direction (perpendicular to the peripheral surface of the mother substrate 10) to reach the other main surface of the mother substrate 10 which becomes the upper surface, and more specifically reaches the bonded surface of the base substrate 1 relative to the retaining tape DT.

[0085] However, since the blade length of the disconnecting rod 202 is larger than the size of the mother substrate 10, during the disconnecting action, the disconnecting rod 202 sometimes abuts against the large-sized singulation area 10b where no scribe line is formed below and does not need to be cut. In other words, the abutting position of the disconnecting rod 202 sometimes also includes the range of the large-sized singulation area 10b where no scribe line is formed, in addition to at least including the upper part of the formation position of the scribe line. In this embodiment, in such a case, the disconnecting action is performed in a manner that does not produce unnecessary cutting in the large-sized singulation area 10b. The details are described later.

[0086] It should be noted that, in the present embodiment, for all the disconnection rod abutment positions separated at a predetermined interval in the x-axis direction, such a disconnection action with the y-cutting predetermined position Py as a combination of positioning and the descent of the disconnection rod 202 is sequentially performed from one end side in the x-axis direction. That is, after the disconnection action for the disconnection rod abutment position including one y-cutting predetermined position Py is completed, the movement and feeding of the mother substrate 10 for performing the disconnection action on the disconnection rod abutment position including the next y-cutting predetermined position Py is performed only in one direction in the x-axis direction (relative movement of the disconnection rod 202 from the disconnection rod abutment position after the disconnection process is completed to the disconnection rod abutment position that becomes the object of the next disconnection process).

[0087] The same method is used when the cutting process is performed along the x-scheduled cutting position Px.

[0088] The mother substrate 10 after the appropriate disconnection process is held on the retaining tape DT in a state where each small-sized singularization area 10a and the large-sized singularization area 10b are cut between adjacent areas and in contact with each other. The mother substrate 10 in the above state is subjected to an expansion process in which the adjacent areas are separated by stretching the retaining tape DT. Thus, each small-sized singularization area 10a is separated from the large-sized singularization area 10b and each is obtained as a single piece. In the above, the mother substrate 10 is cut into single pieces of the desired size.

[0089] <Details of disconnection processing>

[0090] Figure 5 This is a top view of a local area RE of the mother substrate 10 used for the breaking process after the scribing process is completed, observed from the other main surface side (from the side opposite to the main surface having the pattern 2). Figure 5 Shown from above plumb Figure 4 The posture shown is a state of the mother substrate 10 placed on the support body 201 of the breaking device 200.

[0091] However, in Figure 5 In FIG. 1 , for convenience, the pattern 2 (the small-sized pattern 2 a and the large-sized pattern 2 b ) provided on one main surface side is indicated by a dotted line.

[0092] And, in Figure 5In the figure, the x scribing line SLx formed along the x-cutting predetermined position Px of the surface side by scribing and the y scribing line SLy formed along the y-cutting predetermined position Py are indicated by double-dashed lines. More specifically, in the former, the x scribing line formed along the first x-cutting predetermined position Px1 is referred to as the first x scribing line SLx1, and the x scribing line formed along the second x-cutting predetermined position Px2 is referred to as the second x scribing line SLx2. In addition, in the latter, the y scribing line formed along the first y-cutting predetermined position Py1 is referred to as the first y scribing line SLy1, and the y scribing line formed along the second y-cutting predetermined position Py2 is referred to as the second y scribing line SLy2.

[0093] The first x scribe line SLx1 and the first y scribe line SLy1 are formed in the entire x-axis direction and the y-axis direction, respectively. On the other hand, in each of the second x scribe line SLx2 and the second y scribe line SLy2, the intersection with the first y scribe line SLy1 and the first x scribe line SLx1 orthogonal to them or the position immediately before the intersection with the first y scribe line SLy1 and the first x scribe line SLx1 becomes the terminal portion. Figure 5 In the illustrated local region RE, intersection points I1 to I6 of the first x scribe line SLx1 and the second y scribe line SLy2 and intersection points I7 to I12 of the first y scribe line SLy1 and the second x scribe line SLx2 are shown.

[0094] As described above, during the breaking operation, the breaking rod 202 also contacts the large-sized singulation area 10b where no scribe line is formed below and therefore does not need to be cut. Figure 5 In the figure, the abutment position of the breaking rod 202 without a scribed line below is indicated by the dotted line Lx in the x-axis direction and the dotted line Ly in the y-axis direction. For example, if the formation position of the second x scribed line SLx2 is the object of the breaking process, not only the position above the formation position of the pair of second x scribed lines SLx2 on the left and right sides of the drawing, but also the position of the dotted line Lx between the two becomes the breaking rod abutment position.

[0095] in addition, Figure 6 It shows Figure 5 FIG. 1 is a top view of a local area RE of the mother substrate 10 during the disconnection process. Figure 7 It shows Figure 5 The illustrated diagram is a plan view of a local area RE of the mother substrate 10 after the breaking process has been performed well.

[0096] Specifically, Figure 6The figure shows the situation in the middle of the breaking process when the breaking rod contact position including the formation position of the y score line SLy is the object (in other words, the y cutting predetermined position Py is the object) is sequentially executed from the breaking rod contact position including the y score line SLy located on the left side of the figure. Figure 6 In FIG. 1 , a cutting line DL formed on mother substrate 10 as a result of a crack extending from y scribe line SLy extending to the other main surface is indicated by a thick solid line.

[0097] First, in order to cut the mother substrate 10 at the first y-cutting predetermined position Py1, when the cutting operation is performed with the cutting rod contact position including the formation position of the first y-scribe line SLy1 as the object, it is of course sufficient to form the cutting line DL in the entire y-axis direction. Figure 6 In FIG. 1 , the cutting line DL formed at the first y planned cutting position Py1 in the above-described manner is represented as a (first) cutting line DL1 .

[0098] On the other hand, in order to cut the mother substrate 10 at the second y cutting predetermined position Py2 and perform a breaking action with the breaking rod abutting position including the formation position of the second y scribe line SLy2 as the target, the breaking rod 202 not only abuts against the position where the scribe line is formed below, but also abuts against the position of the dotted line Ly where the scribe line is not formed, and is pressed in by a prescribed pressing amount z in the entire blade length direction.

[0099] Therefore, if Figure 6 As shown in the (second) cutting line DL2, the cutting line DL should be formed only at the formation position of the second y scribe line SLy2, but sometimes the crack from the formation position of the second y scribe line SLy2 extends beyond the position of the intersection I1~I6 with the first x scribe line SLx1 and is generated to the large-size singulation area 10b, thereby forming a cutting line DL that reaches not only the formation position of the second y scribe line SLy2 but also the large-size singulation area 10b. Figure 6 In FIG. 1 , such a cutting line DL is exemplified as a cutting line DL2α.

[0100] It should be noted that even if the cutting line DL2α is formed along the second y scribe line SLy2, that is, along the second y cutting predetermined position Py2 which is also in the direction of the blade length, in the large-size singulation area 10b where no scribe line is formed, it is not necessarily limited to being formed along the blade length direction.

[0101] In the present embodiment, by appropriately determining the conditions for the disconnection processing, the movement feed of the disconnection rod 202 is made to be only in one direction along the x-axis direction and the disconnection is continuously performed along the formation positions of each y scribe line SLy. Thus, the disconnection with the formation position of the first y scribe line SLy1 as the disconnection abutment position is appropriately achieved, and when the disconnection is carried out with the disconnection abutment position including the formation position of the second y scribe line SLy2 as the object, the cutting line is not formed by exceeding the intersection points I1~I6 with the first x scribe line SLx1 that divides the large-size singulation area 10b. In addition, in the case where the movement feed of the breaking rod 202 is only in one direction along the y-axis direction and the breaking is continuously performed along the formation position of the x-scoring line SLx, the breaking is appropriately achieved with the formation position of the first x-scoring line SLx1 as the breaking abutment position, and when the breaking is carried out with the breaking abutment position including the formation position of the second x-scoring line SLx2 as the object, the cutting line will not be formed by exceeding the intersection points I7~I12 with the first y-scoring line SLy1 that divides the large-size singulation area 10b.

[0102] Specifically, disconnection processing is performed under the following conditions:

[0103] (a) Angle of the blade tip 202e (blade tip angle) θ: 50° to 90°;

[0104] (b) the curvature radius R of the front end of the blade tip 202e: 100 μm to 300 μm;

[0105] (c) Indentation amount z: 60 μm to 100 μm;

[0106] (d) The descending speed of the disconnecting rod 202 is 10 mm / s to 100 mm / s.

[0107] By satisfying these conditions (a) to (d), in the mother substrate 10, as Figure 7 As shown, at the first x-cutting predetermined position Px1 and the first y-cutting predetermined position Py1, a first cutting line DL1 is formed along them, and at the second x-cutting predetermined position Px2 and the second y-cutting predetermined position Py2, a second cutting line DL2 is formed along them but not extending relative to the large-size singulation region 10b. This is considered to be because the curvature radius R of the front end of the blade tip 202e is larger than the thickness of the substrate, so that the force of lateral expansion of the substrate becomes larger, and the deformation of the large-size singulation region 10b caused by excessive pressing of the breaking rod 202 can be suppressed.

[0108] Thereafter, by performing the above-mentioned expansion process on the mother substrate 10 on which the first cutting lines DL1 and the second cutting lines DL2 are formed, a single piece including the small-sized pattern 2 a and a single piece including the large-sized pattern 2 b are obtained.

[0109] When the blade tip angle θ and the curvature radius R are smaller than the above-mentioned range, and when the pressing amount z and the descending speed of the breaking rod 202 are greater than the above-mentioned range, the deformation of the large-size singulation area 10b caused by the pressing of the breaking rod 202 is large, resulting in the formation of the second cutting line DL2 to the large-size singulation area 10b, which is not preferred.

[0110] On the other hand, when the blade tip angle θ and the curvature radius R are greater than the above range, and the pressing amount z and the descending speed of the breaking rod 202 are less than the above range, the crack extending from the scribed line does not reach the opposite surface and the cutting is not completed, so it is not preferred.

[0111] As described above, according to this embodiment, by performing a scratching process along the predetermined cutting position and then performing a disconnection process that satisfies conditions (a) to (d), it is possible to appropriately cut a mother substrate composed of a mixture of multiple small-size patterns and multiple large-size patterns into a small-size single piece containing the former and a large-size single piece containing the latter.

[0112] In particular, during the breaking process, it is possible to appropriately suppress the breaking rod from coming into contact with a position where breaking is not necessary and causing unnecessary breaking of a large-sized single piece.

[0113] It should be noted that, depending on the thickness and type of the substrate, the following measures can also be considered: after the scribing process, the disconnection process is performed only around the single pieces of the large-sized singulation area, thereby suppressing the cutting of the large-sized singulation area as described above. However, in addition to the fact that the relative movement of the disconnection rod with respect to the mother substrate becomes complicated, there is also the possibility of poor positioning accuracy, which is inferior to the method of the present embodiment in terms of productivity. In addition, originally, depending on the configuration of the large-sized singulation area in the mother substrate, sometimes there are other large-sized singulation areas on the extension line of the predetermined cutting position set around the large-sized singulation area. In this case, the above-mentioned prior disconnection cannot be performed.

[0114] In contrast, the method of this embodiment performs movement and feeding of the predetermined cutting position in only one direction regardless of the configuration of the large-size area in the mother substrate, and can properly cut at all the predetermined cutting positions, so it can be said to be excellent in versatility and productivity.

Claims

1. A method for cutting a brittle material substrate, which is a method for cutting the brittle material substrate into a small-sized single piece and a large-sized single piece larger than the small-sized single piece along a predetermined cutting position, wherein the method for cutting the brittle material substrate is characterized by: a scribing step, in which a scribing line is formed along the predetermined cutting position on one main surface side of the brittle material substrate, wherein the predetermined cutting position is determined around the entire region including the region that becomes the small-sized single piece and the region that becomes the large-sized single piece after cutting; and A breaking process, in which the brittle material substrate is cut into the small-sized single piece and the large-sized single piece by pressing the breaking rod into the breaking rod abutment position from the other main surface side of the brittle material substrate with a predetermined pressing amount at all the breaking rod abutment positions, wherein the breaking rod abutment positions at least include a position above the formation position of the scribed line, In the breaking process, (a) The tip angle (θ) of the breaking rod is set to 50° to 90°, (b) the curvature radius (R) of the tip of the cutting rod is set to 100 μm to 300 μm, (c) the pressing amount is set to 60 μm to 100 μm, (d) The descending speed of the breaking rod when the breaking rod is pushed into the substrate is set to 10 mm / s to 100 mm / s.

2. The method for cutting a brittle material substrate according to claim 1, characterized in that: In the breaking step, after the breaking action on one breaking rod abutment position is completed, the substrate is moved and fed for performing the breaking action on the next breaking rod abutment position only in one direction in which the breaking rod abutment positions are arranged at a predetermined pitch.

3. The method for cutting a brittle material substrate according to claim 1 or 2, characterized in that: A pattern consisting of a small-size pattern and a large-size pattern is provided on the brittle material substrate, wherein the small-size pattern is provided in a region that becomes the small-size single piece after being cut, and the large-size pattern is provided in a region that becomes the large-size single piece after being cut, In the scribing step, the scribe lines are formed on the brittle material substrate exposed between the patterns.

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