Processing equipment

Abstract

The present invention provides a processing device, which does not need to adjust the positional relationship between the light emitting part and the light receiving part in advance, and can detect the position of the frame unit in the component element where the photoelectric sensor cannot be installed. The processing device has a temporary placement unit, which temporarily places the frame unit, and the frame unit is obtained by supporting the workpiece on the conductive ring-shaped frame with the help of a resin sheet, and is characterized in that the temporary placement unit has: a plurality of conductive supporting parts that support the frame unit; and a detection part, which has a power supply and a conduction detection part, one terminal of the power supply is electrically connected to the first supporting part among the plurality of supporting parts, and the conduction detection part is electrically connected to the second supporting part among the plurality of supporting parts and another terminal of the power supply, and when the frame is supported by the first supporting part and the second supporting part, a conduction circuit including the frame, the first supporting part and the second supporting part, the power supply and the conduction detection part is formed.

Description

Technical Field

[0001] The present invention relates to a processing device for processing a workpiece in a state of a frame unit in which the workpiece is supported on a ring-shaped frame via a resin sheet. Background Art

[0002] The following technology is known: when processing a plate-shaped workpiece such as a semiconductor wafer, a resin package substrate, a glass substrate, or a ceramic substrate, a frame unit is formed by sticking a resin sheet on one surface of an annular metal frame having an opening larger in diameter than the workpiece and on one surface of the workpiece.

[0003] After the frame unit is formed, each workpiece is processed by a processing device. For example, each workpiece is first transported to a box loading table of the processing device while being stored in a box. Then, the frame unit is pulled out while the metal frame is grasped by a first transport unit such as a push-pull arm, thereby pulling the frame unit out of the box to a temporary storage unit such as a guide rail.

[0004] Next, a pair of guide rails clamp the metal frame of the frame unit in a predetermined direction, thereby adjusting the position of the frame unit in the predetermined direction. Then, the frame unit is transported in a state where the metal frame is adsorbed by a second transport unit such as an adsorption arm. In this way, the transport unit and the temporary storage unit transport the frame unit by contacting the metal frame, and thus transport the frame unit without contacting the workpiece.

[0005] In addition, by forming the frame unit, after the workpiece is divided into a plurality of chips, the plurality of chips attached to the resin sheet can be transported collectively, so that the transport of the plurality of chips becomes easy. The workpiece is divided, for example, by a cutting device having a cutting tool, or a sheet expansion device that expands the resin sheet to apply an external force to the workpiece (for example, see Patent Document 1).

[0006] In processing devices such as cutting devices and sheet expanding devices, a frame unit is transported to various positions in the device by a transport unit. In order to understand where the frame unit is located in the processing device, a transmissive or reflective photoelectric sensor is usually installed at each position in the processing device.

[0007] The photoelectric sensor includes, for example, a light emitting unit and a light receiving unit that receives light from the light emitting unit. When a transmissive photoelectric sensor is used, when the frame unit is located between the light emitting unit and the light receiving unit, the light from the light emitting unit is shielded by the frame unit, so the amount of light received by the light receiving unit is reduced. The light receiving unit converts the reduction in the amount of light received into an electrical signal and outputs it to the control unit of the processing device, so that the position of the frame unit is grasped by the control unit.

[0008] Patent Document 1: Japanese Patent Application Publication No. 2018-181921

[0009] However, it is necessary to adjust the positional relationship between the light emitting unit and the light receiving unit in advance in such a way that the amount of light received is appropriately changed by shielding the light through the frame unit. In addition, sometimes, a transmission type or reflection type photoelectric sensor cannot be installed in a component smaller than a push-pull arm or a guide rail in the component elements of the processing device. Summary of the invention

[0010] The present invention has been made in view of the above problem, and an object of the present invention is to provide a processing device that does not require the positional relationship between a light emitting portion and a light receiving portion to be adjusted in advance and that can detect the position of a frame unit even in a component where a photoelectric sensor cannot be installed.

[0011] According to one embodiment of the present invention, a processing device is provided, which comprises: a temporary placement unit, which temporarily places a frame unit, the frame unit being obtained by supporting a workpiece on a conductive ring-shaped frame with the help of a resin sheet; a conveying unit, which conveys the frame unit to the temporary placement unit; and a processing unit, which processes the workpiece of the frame unit, characterized in that the temporary placement unit comprises: a plurality of conductive supporting parts, which support the frame unit; and a detection part, which comprises a power supply and a conduction detection part, one terminal of the power supply is electrically connected to a first supporting part among the plurality of supporting parts, and the conduction detection part is electrically connected to a second supporting part among the plurality of supporting parts and another terminal of the power supply, and when the frame is supported by the first supporting part and the second supporting part, a conduction circuit including the frame, the first supporting part and the second supporting part, the power supply and the conduction detection part is formed.

[0012] Preferably, the plurality of support portions of the temporary storage unit are three or more support pins, and the three or more support pins support the outer peripheral portion of the frame at three or more locations to position the frame unit at a predetermined position.

[0013] Furthermore, it is preferable that the plurality of support parts of the temporary storage unit are a pair of guide rails that support the frame.

[0014] A processing device according to one embodiment of the present invention has a temporary placement unit for temporarily placing a frame unit. The temporary placement unit has a plurality of conductive support parts and a detection part for supporting the conductive frames respectively. The detection part has a power supply having one terminal electrically connected to the first support part and a conduction detection part electrically connected to the second support part and the other terminal of the power supply.

[0015] When the frame is supported by the first and second supporting parts, a conduction circuit is formed by the first and second supporting parts, the frame in contact with each supporting part, the power supply, and the conduction detection part. The conduction detection part detects the presence or absence of conduction, thereby detecting the presence or absence of the frame unit.

[0016] In this way, the presence or absence of the frame unit can be detected by forming a conductive circuit, so a transmissive or reflective photoelectric sensor is not required. Therefore, it is not necessary to adjust the positional relationship between the light-emitting portion and the light-receiving portion in advance as in the case of using a photoelectric sensor. In addition, the conductive circuit can be formed only by connecting wiring to each support portion as a component of the processing device, so the size of the component and the influence of the space restriction inside the processing device can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional diagram of a frame unit.

[0018] Figure 2 This is a top view of the expansion unit etc. provided in the second processing area.

[0019] Figure 3 It is a partial side sectional view of the centering unit.

[0020] Figure 4 This is a top view of the centering unit, etc. when adjusting the position of the frame unit.

[0021] Figure 5 It is a partial side cross-sectional view of a centering unit and the like when a conducting circuit is formed.

[0022] Figure 6 (A) is a partial side sectional view of the expansion unit, etc. Figure 6 (B) is a partial side sectional view of the frame unit placed on the annular workbench.

[0023] Figure 7 (A) is a partial side cross-sectional view of the expansion unit when the wafer is divided, Figure 7 (B) is a partial side cross-sectional view of the expansion unit, etc. when the expansion sheet is heated.

[0024] Figure 8 It is a top view of a pair of guide rails, etc.

[0025] Fig. 9 It is a partial side sectional view of a pair of guide rails, etc.

[0026] Description of symbols

[0027] 2: Sheet expansion device (processing device); 4: Second push-pull arm; 5: Frame unit; 6-1, 6-2: Guide rail (transportation unit); 6a: Horizontal part; 6b: Vertical part; 7: Frame; 8: Centering unit (temporary placement unit); 9: Expanded sheet (resin sheet); 10: Frame; 10a: Opening; 10b: Upper surface; 10c: Lower surface; 11: Wafer (processed object); 11a: Front surface; 11b: Back surface; 12: Piston rod; 13: Predetermined dividing line; 14, 14-1, 14-2, 14-3, 14-4: Frame support pin (supporting part); 14a: Column part; 14b: Disc part; 15: Device; 16a: Power supply; 16b: Resistor; 16c: Conductivity detection part; 17: Chip; 18: Detection part; 20: Extension unit (processing unit); 22: pressing component; 22a: lower surface; 22b: roller; 24: lifting part; 24a: ball screw; 24b: motor; 24c: stopper; 24d: nut part; 26: arm; 28: cylindrical part; 30: annular worktable; 32: columnar part; 34: heater; 40-1, 40-2: guide rail (support part); 40a: horizontal part; 40b: vertical part; 42: first push-pull arm; 46a: power supply; 46b: resistor; 46c: conduction detection part; 48: detection part; 50: ultraviolet irradiation unit (processing unit); 52: ultraviolet rays; A: second processing area; B1: first terminal; B2: second terminal; B3: third terminal; B4: fourth terminal; C: first processing area. DETAILED DESCRIPTION

[0028] An embodiment of one mode of the present invention will be described with reference to the drawings. First, a frame unit 5 will be described. The frame unit 5 is formed by supporting a wafer (workpiece) 11 by an annular frame 7 via an expansion sheet (resin sheet) 9 . Figure 1 1 is a perspective view of a frame unit 5 .

[0029] The frame 7 is made of a metal such as aluminum or stainless steel and has conductivity. The frame 7 has an opening having a diameter larger than that of the wafer 11. The expansion sheet 9 is a sheet made of a stretchable resin and is also called a dicing tape.

[0030] The expansion sheet 9 is a circular sheet having a diameter larger than the opening of the frame 7. The expansion sheet 9 has, for example, a laminated structure of a base material layer and an adhesive layer (paste layer). The base material layer is, for example, formed of a polyolefin (PO) resin. An adhesive layer formed of an adhesive resin such as an ultraviolet (UV) curing resin is formed on the entire or a portion of one surface of the base material layer.

[0031] The wafer 11 is, for example, a disk-shaped silicon wafer. A plurality of predetermined division lines 13 are set in a grid pattern on the front side 11a of the wafer 11. Devices 15 such as IC (Integrated Circuit), LSI (Large Scale Integration), and LED (Light Emitting Diode) are formed in each area divided by the plurality of predetermined division lines 13.

[0032] In addition, a fragile layer (also called a modified layer) is formed inside the wafer 11 along the predetermined splitting line 13 as a splitting starting point. The wafer 11 is arranged approximately in the center of the opening of the frame 7, and the adhesive layer side of the expansion sheet 9 is attached to one surface of the frame 7 and the back surface 11b of the wafer 11.

[0033] One or more frame units 5 are stored in a cassette (not shown) and transported to a sheet expansion device (processing device) 2 (see Figure 2 The sheet expansion device 2 is provided with a cassette mounting table (not shown) movable in the vertical direction (Z-axis direction, height direction) by means of an elevator. The cassette is mounted on the cassette mounting table.

[0034] The 1st processing area (not shown) consisting of a pair of guide rails is provided at the rear side (one side of the Y-axis direction) of the box. In addition, the 1st push-pull arm (not shown) that can enter the box is provided above the 1st processing area.

[0035] On the left side of the first processing area (one side in the X-axis direction), a first temporary storage area (not shown) composed of another pair of guide rails is provided. Between the first temporary storage area and the first processing area, a suction arm (not shown) that can enter both areas is provided. In addition, a second push-pull arm 4 (see FIG. 1 ) for transporting the frame unit 5 is provided above the first temporary storage area. Figure 2 ).

[0036] A second processing area A is provided in front of the second temporary storage area (the other side in the Y-axis direction). An expansion unit (processing unit) 20 (see FIG. 1 ) having a pair of guide rails 6-1 and 6-2 is provided in the second processing area A. Figure 2 ).

[0037] Figure 2 2 is a top view of the expansion unit 20 and the like provided in the second processing area A. Figure 2 In FIG. 1 , only a pair of guide rails 6 - 1 and 6 - 2 are shown as components of the expansion unit 20 .

[0038] Each guide rail 6-1, 6-2 has a substantially flat plate-shaped horizontal portion 6a provided substantially parallel to the first direction (Y-axis direction). In each horizontal portion 6a, a substantially flat plate-shaped vertical portion 6b perpendicular to the horizontal portion 6a is provided on the outer side of the pair of guide rails 6-1, 6-2, which is opposite to the opposing side (inner side).

[0039] In this embodiment, the entirety of each guide rail 6-1, 6-2 is formed of a conductive material such as metal. In addition, the entirety of each guide rail 6-1, 6-2 may not be formed of a conductive material. As long as at least the horizontal portion 6a of each guide rail 6-1, 6-2 is formed of a conductive material, the vertical portion 6b may be formed of a non-conductive material.

[0040] The conductive material portion of each rail 6-1, 6-2 is connected to a control unit described later via wiring, terminals, etc. For example, when the pair of rails 6-1, 6-2 are electrically connected via the frame 7, the control unit can recognize that the frame unit 5 is supported by the pair of rails 6-1, 6-2.

[0041] When the frame unit 5 is supported by the pair of rails 6-1 and 6-2 with the front surface 11a of the wafer 11 facing downward, the other surface side of the frame 7 is supported by each horizontal portion 6a, and the outer periphery of the frame 7 is sandwiched by the pair of vertical portions 6b.

[0042] The position of the frame unit 5 in the second direction is adjusted to a predetermined position by moving the pair of guide rails 6 - 1 and 6 - 2 so as to approach each other along the second direction (X-axis direction).

[0043] The pair of guide rails 6-1 and 6-2 in the second processing area A function as a transport unit, and after adjusting the position of the frame unit 5, the frame unit 5 is transferred (i.e., transported) to the centering unit (temporary placement unit) 8 (see Figure 3 , Figure 4 ).

[0044] Here, refer to Figure 3 and Figure 4 The centering unit 8 will be described. Figure 3 8 is a partial side cross-sectional view of the centering unit 8. Figure 3 In the present invention, some components are represented by symbols or block diagrams.

[0045] The centering unit 8 has a frame 10 made of stainless steel. The frame 10 has a rectangular plate shape with a circular opening 10a formed in the center. Cylinders (not shown) are provided at four corners of the upper surface of the frame 10 .

[0046] One end of a piston rod 12 is inserted into the cylinder tube of each cylinder. A piston (not shown) is provided at one end of the piston rod 12, and the piston is located in the cylinder tube.

[0047] A frame support pin (support portion) 14 is provided at the other end of each piston rod 12 so as to be perpendicular to the upper surface 10b of the frame 10. The frame support pin 14 has an elongated cylindrical portion 14a, and the upper end of the cylindrical portion 14a is fixed to the other end of the piston rod 12.

[0048] Each cylindrical portion 14a is inserted into a through groove (not shown) formed in the frame 10 along the moving direction of the piston rod 12. The through groove penetrates from the upper surface 10b of the frame 10 to the lower surface 10c, and the lower end of the cylindrical portion 14a protrudes downward compared to the lower surface 10c. A disc-shaped disc portion 14b having a larger diameter than the cylindrical portion 14a is fixed to the lower end of the cylindrical portion 14a.

[0049] Each frame support pin 14 is provided at a position inside the movement range of the pair of guide rails 6-1 and 6-2 so as not to interfere with the pair of guide rails 6-1 and 6-2 (see Figure 4 ) In this embodiment, four frame support pins 14 are provided. Figure 4 FIG. 8 is a top view of the centering unit 8 and the like when adjusting the position of the frame unit 5. Figure 4 In the embodiment, the frame 10 is omitted.

[0050] The four cylindrical portions 14a contact the outer periphery of the frame 7 to adjust the horizontal position of the frame unit 5. The outer periphery of the frame unit 5 is supported in the vertical direction by the disk portion 14b.

[0051] In addition, the air cylinder and the frame support pin 14 may be provided at any three locations among the four corners of the frame 10. In addition, the air cylinder and the frame support pin 14 may be provided at five or more locations of the frame 10.

[0052] That is, the frame support pins 14 may be provided at three or more locations of the frame body 10 to support the frame unit 5 by the three or more frame support pins 14. In this case, the outer peripheral portion of the frame unit 5 is supported at three or more locations.

[0053] Each frame support pin 14 is made of metal and therefore has conductivity. Any two of the four frame support pins 14 are electrically connected to each other via wiring or the like.

[0054] like Figure 3As shown, in this embodiment, two frame support pins 14-1 and 14-2 located at the rear side of the frame body 10 are electrically connected via wiring etc. However, the two frame support pins 14 are not limited to 14-1 and 14-2, and any two frame support pins 14 may be electrically connected via wiring etc.

[0055] The frame support pin (first support portion) 14-1 is electrically connected to a first terminal B1 of a wiring board (not shown) provided outside the housing 10. A power source 16a is provided on the wiring board, and the first terminal B1 is connected to one terminal of the power source 16a.

[0056] The frame support pin (second support portion) 14-2 is electrically connected to the second terminal B2 of the wiring substrate (not shown). The wiring substrate is provided with a resistor 16b connected in series and a conduction detection portion 16c including a photocoupler including an LED and a photodiode, and the second terminal B2 is connected to the resistor 16b.

[0057] The resistor 16b is connected to one end of the conduction detection unit 16c (e.g., the anode of the LED constituting the photocoupler), and the other end of the conduction detection unit 16c (e.g., the cathode of the LED constituting the photocoupler) is connected to the other terminal of the power supply 16a. The resistor 16b is used for the purpose of adjusting the voltage applied to the conduction detection unit 16c (e.g., the LED of the photocoupler).

[0058] The power source 16a, the resistor 16b, and the conduction detector 16c constitute a detector 18 for detecting that the frame unit 5 is in the centering unit 8. When the frame unit 5 is supported by the four frame support pins 14, the frame 7 contacts the frame support pins 14.

[0059] Thus, a conduction circuit is formed by the frame 7, the frame support pins 14-1 and 14-2, the power source 16a, the resistor 16b, and the conduction detection unit 16c. When the conduction circuit is formed, the conduction detection unit 16c detects electrical conduction.

[0060] When the conduction detection unit 16c detects electrical conduction, it outputs an electrical signal to a control unit (not shown) of the sheet expansion device 2. Thus, the control unit can recognize that the frame unit 5 is located in the centering unit 8 of the expansion unit 20.

[0061] In addition, the control unit is composed of a computer including a processing device such as a CPU (Central Processing Unit) and a storage device such as a flash memory. The processing device is operated according to software such as a program stored in the storage device, so that the control unit functions as a specific unit in which software and the processing device (hardware resources) cooperate.

[0062] In this embodiment, a wiring board provided with power source 16a, resistor 16b and conduction detection unit 16c is provided outside housing 10. Frame support pin 14 is not provided with a light emitting unit and a light receiving unit constituting a photoelectric sensor, but only connected with wiring.

[0063] It is difficult to set a transmissive or reflective photoelectric sensor on the frame support pin 14, but it is easy to connect the wiring. By connecting the wiring to the frame support pin 14, the detection unit 18 can be configured without being affected by the size of the frame support pin 14. In addition, the detection unit 18 can be configured without being restricted by the space near the centering unit 8.

[0064] When the position of the frame unit 5 is adjusted using the centering unit 8, the frame unit 5 before being processed by the expansion unit 20 is temporarily placed (i.e., temporarily placed) on the centering unit 8. Next, the air cylinder is operated to position the frame unit 5 at a predetermined position while the frame unit 5 is supported by the four frame support pins 14.

[0065] Specifically, the position of the frame unit 5 is adjusted so that the wafer 11 is located directly below the opening 10a and the frame 7 is located directly below the frame body 10. At this time, the above-mentioned conduction circuit is formed. Figure 5 It is a partial side cross-sectional view of the centering unit 8 and the like when a conductive circuit is formed.

[0066] Next, the expansion unit 20 will be described in detail. Figure 6 (A) is a partial side cross-sectional view of the expansion unit 20 etc. The expansion unit 20 includes a pressing member 22 in addition to the pair of guide rails 6 - 1 , 6 - 2 and the centering unit 8 .

[0067] The pressing member 22 has a cylindrical shape. The diameter of the circle of the pressing member 22 is larger than the diameter of the wafer 11 and smaller than the diameter of the opening 10a. The upper part of the pressing member 22 is fixed to a bracket (not shown). A porous plate (not shown) is provided at the lower part of the pressing member 22.

[0068] A suction source such as an ejector (not shown) is connected to the upper surface of the porous plate via a flow path. By operating the suction source, negative pressure is generated on the lower surface of the porous plate, i.e., the lower surface 22a of the pressing member 22. In addition, a plurality of suction ports may be provided on the lower surface 22a instead of the porous plate.

[0069] The lower surface 22a is located below the lower surface of the frame 10. A plurality of rollers 22b are provided on the outer peripheral portion of the lower surface 22a side of the pressing member 22. A lifting unit 24 is provided below the lower surface 22a of the pressing member 22. The lifting unit 24 has a ball screw 24a provided along the height direction of the sheet expanding device 2. A motor 24b is connected to the lower end of the ball screw 24a.

[0070] A disc-shaped stopper 24c is provided at the upper end of the ball screw 24a. A nut portion 24d is provided between the stopper 24c and the motor 24b. The ball screw 24a is rotatably coupled to the nut portion 24d.

[0071] A plurality of arms 26 are fixed radially to the side of the nut portion 24d. Figure 6 In (A), two arms 26 are shown. A cylindrical portion 28 is provided at the outer peripheral end of the arm 26 so as to surround the ball screw 24a. An annular table 30 having a substantially horizontal upper surface for supporting the frame 7 is provided on the upper portion of the cylindrical portion 28.

[0072] A plurality of columnar portions 32 are provided in a region between the cylindrical portion 28 and the ball screw 24a so as to surround the ball screw 24a. The plurality of columnar portions 32 are provided, for example, in the same number as the number of the arms 26, and the lower ends of the columnar portions 32 are fixed to the arms 26.

[0073] Heaters 34 for generating heat are provided on the upper portions of the columnar portions 32. When the frame unit 5 is placed on the annular stage 30, the heaters 34 are located below the region between the wafer 11 and the frame 7.

[0074] Next, the steps of processing the wafer 11 using the expansion unit 20 are described. Figure 2 As described above, the frame unit 5 is transported from the second push-pull arm 4 to the pair of guide rails 6 - 1 and 6 - 2 (first transport step ( S10 )).

[0075] After the first conveying step (S10), the frame unit 5 is supported by the plurality of frame support pins 14, and then the pair of guide rails 6-1 and 6-2 are retracted from the frame unit 5. Figure 4 As shown, the frame unit 5 is transported from the pair of guide rails 6 - 1 and 6 - 2 to the plurality of frame support pins 14 (second transport step ( S20 )).

[0076] After the second conveying step (S20), if using Figure 4 As described above, the position of the frame unit 5 is adjusted by the plurality of frame support pins 14 , and the frame unit 5 is positioned substantially at the center of the opening 10 a (centering step ( S30 )).

[0077] In the centering process (S30), if Figure 5 As described above, a conductive circuit is formed by the detection unit 18 and the frame 7. As a result, the control unit detects that the frame unit 5 is in the expansion unit 20.

[0078] After the centering step ( S30 ), the motor 24 b is operated to rotate the ball screw 24 a , thereby raising the cylindrical portion 28 and the like together with the nut portion 24 d . Thus, the upper surface of the annular table 30 is brought into contact with the other surface of the frame 7 .

[0079] Then, each frame support pin 14 is retracted to the outside, and the frame unit 5 is transported from the plurality of frame support pins 14 to the annular table 30 (third transport step ( S40 )). Figure 6 (B) is a partial side cross-sectional view of the frame unit 5 and the like placed on the annular table 30 .

[0080] After the third conveying step (S40), the motor 24b is operated to further raise the cylindrical portion 28. Specifically, the nut portion 24d is raised until the expansion piece 9 located on one side of the frame 7 contacts the lower surface 10c of the frame body 10, so that the back surface 11b side of the wafer 11 is pressed by the pressing member 22 through the expansion piece 9.

[0081] Thus, the expansion sheet 9 is radially expanded, and the wafer 11 is also subjected to an external force in the radial direction, and the wafer 11 is divided (processed) with the fragile layer formed along the planned dividing line 13 as the dividing starting point. Thus, the wafer 11 is divided into a plurality of chips 17 (dividing step (S50)). Figure 7 (A) is a partial side cross-sectional view of the expansion unit 20 and the like when the wafer 11 is divided.

[0082] After the dividing step ( S50 ), the suction source is operated to suck and hold the expansion piece 9 by the lower surface 22 a of the pressing member 22 . Then, the cylindrical portion 28 is moved downward until one surface of the frame 7 is substantially at the same height as the lower surface 22 a of the pressing member 22 .

[0083] Then, the heater 34 is operated to heat the region between the wafer 11 and the frame 7 (heat shrinking step ( S60 )). Figure 7 (B) is a partial side cross-sectional view of the expansion unit, etc. when the expansion sheet 9 is heated.

[0084] The heat shrinking step (S60) heat shrinks the annular region of the expansion sheet 9 located at the periphery of the plurality of chips 17, thereby removing the slack in the annular region generated in the dividing step (S50). Therefore, the distance between the chips 17 is maintained in the heat shrinking step (S60).

[0085] The frame unit 5 after the heat shrinking process (S60) is turned upside down by a turning device (not shown), and then transported by an adsorption arm (another transport unit) not shown. Specifically, the frame unit 5 is transported by the adsorption arm to a pair of guide rails 40-1, 40-2 (another temporary storage unit) located in the first processing area C set at the rear side of the box.

[0086] Figure 8 This is a top view of a pair of guide rails 40-1, 40-2, etc. The pair of guide rails 40-1, 40-2 is a temporary storage unit that functions as a plurality of support parts. One surface of the frame 7 in the frame unit 5 conveyed to the pair of guide rails 40-1, 40-2 contacts the pair of guide rails 40-1, 40-2.

[0087] The structure and function of the pair of guide rails 40-1 and 40-2 are the same as those of the pair of guide rails 6-1 and 6-2. Each guide rail 40-1 and 40-2 has a horizontal portion 40a and a vertical portion 40b. The horizontal portion 40a corresponds to the horizontal portion 6a, and the vertical portion 40b corresponds to the vertical portion 6b.

[0088] The guide rail (first support portion) 40-1 is connected to a third terminal B3 (see FIG. 1 ) of a wiring substrate (not shown) provided outside the first processing area C via wiring or the like. Fig. 9 )connect. Fig. 9 40 - 1 , 40 - 2 , etc. are partially side-view cross-sectional views. Fig. 9 In the present invention, some components are represented by symbols or block diagrams.

[0089] A power source 46a is provided on the wiring substrate, and the third terminal B3 is connected to one terminal of the power source 46a. In addition, the guide rail (second support portion) 40-2 is connected to the fourth terminal B4 of the wiring substrate (not shown) via wiring or the like. A resistance 46b connected in series and a conduction detection portion 46c such as a photocoupler including an LED and a photodiode are provided on the wiring substrate, and the fourth terminal B4 is connected to the resistance 46b.

[0090] The resistor 46b is connected to one end of the conduction detection unit 46c (e.g., the anode of the LED constituting the photocoupler), and the other end of the conduction detection unit 46c (e.g., the cathode of the LED constituting the photocoupler) is connected to the other terminal of the power supply 46a. The power supply 46a, the resistor 46b, and the conduction detection unit 46c constitute a detection unit 48 that detects whether the frame unit 5 is located between the pair of guide rails 40-1 and 40-2.

[0091] Therefore, when the frame unit 5 is placed on the guide rail 40-1 (first support portion) and the guide rail 40-2 (second support portion), a conduction circuit is formed by the frame 7, the guide rails 40-1, 40-2, the power supply 46a, the resistor 46b, and the conduction detection unit 46c. When the conduction detection unit 46c detects electrical conduction in the conduction circuit, an electrical signal is sent to the control unit. Thus, the control unit can grasp the situation that the frame unit 5 is on the guide rails 40-1, 40-2 of the first processing area C.

[0092] An ultraviolet irradiation unit (processing unit) 50 for irradiating ultraviolet rays 52 upward is provided below the pair of guide rails 40-1 and 40-2. A first push-pull arm 42 for conveying the frame unit 5 irradiated with ultraviolet rays 52 to a cassette is provided above the pair of guide rails 40-1 and 40-2.

[0093] When the wafer 11 is processed by the ultraviolet irradiation unit 50 , first, the frame unit 5 is transported to the pair of guide rails 40 - 1 and 40 - 2 by the suction arm (fourth transport step ( S100 )).

[0094] After the fourth transport step ( S100 ), the pair of guide rails 40 - 1 and 40 - 2 are moved toward each other in the second direction (X-axis direction) to thereby adjust the position of the frame unit 5 to the approximate center of the ultraviolet irradiation unit 50 (centering step ( S110 )).

[0095] After the centering step ( S110 ), the ultraviolet ray 52 is irradiated to the expansion sheet 9 by the ultraviolet ray irradiation unit 50 , thereby curing the adhesive layer of the expansion sheet 9 (ultraviolet ray irradiation step ( S120 )).

[0096] In this way, the adhesive layer is processed by the ultraviolet rays 52, so that the adhesive force of the adhesive layer is reduced. After the ultraviolet irradiation step (S120), the frame unit 5 is transported to the cassette by the first push-pull arm 42 (fifth transport step (S130)).

[0097] In this embodiment, a wiring substrate provided with a power source 46a, a resistor 46b, and a conduction detection unit 46c is provided outside the housing 10. The pair of rails 40-1 and 40-2 are not provided with a light emitting unit and a light receiving unit constituting a photoelectric sensor, but only wiring is connected. By connecting the wiring to the pair of rails 40-1 and 40-2, the detection unit 18 can be formed without being restricted by the space near the pair of rails 40-1 and 40-2.

[0098] In addition, the structure and method of the above-mentioned embodiment can be appropriately changed and implemented as long as they do not deviate from the scope of the purpose of the present invention. For example, the frame unit 5 whose position is adjusted by a pair of guide rails 40-1 and 40-2 can be transported to a rotary cleaning unit (processing unit) for cleaning the wafer 11 by a push-pull arm (not shown).

[0099] Furthermore, a transport unit such as a push-pull arm and a temporary storage unit such as a pair of guide rails may be applied to a processing unit such as a cutting unit having a cutting tool or a laser irradiation unit capable of irradiating a laser beam.

Claims

1. A processing device, comprising: A temporary placement unit temporarily places a frame unit, wherein the frame unit supports the workpiece on a conductive ring-shaped frame via a resin sheet; A transport unit that transports the frame unit to the temporary storage unit; and a processing unit for processing the workpiece of the frame unit, It is characterized in that The temporary storage unit has: a plurality of conductive support portions that support the frame unit; and a detection unit including a power supply and a conduction detection unit, wherein one terminal of the power supply is electrically connected to a first support unit among the plurality of support units, and the conduction detection unit is electrically connected to a second support unit among the plurality of support units and another terminal of the power supply, When the frame is supported by the first supporting portion and the second supporting portion, a conduction circuit including the frame, the first supporting portion, the second supporting portion, the power source, and the conduction detecting portion is formed.

2. The processing device according to claim 1, characterized in that: The plurality of supporting parts of the temporary storage unit are more than three supporting pins. The three or more support pins support the outer peripheral portion of the frame at three or more locations, and position the frame unit at a predetermined position.

3. The processing device according to claim 1, characterized in that: The plurality of supporting parts of the temporary storage unit are a pair of guide rails for supporting the frame.

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