A main particle feeding mechanism and a preparation device for a semiconductor refrigeration chip thermoelectric module

Abstract

The present invention provides a main particle feeding mechanism and a preparation device of a semiconductor refrigeration chip thermoelectric module, comprising a first feeding track, a first outlet is provided at one end of the first feeding track, a first discharging mechanism is provided below the first outlet, the first discharging mechanism comprises a first sieve plate and a first reciprocating rotating power mechanism connected to each other in a transmission manner, the first sieve plate is provided with a first sieve hole, a first baffle is slidably connected to the bottom of the first sieve plate, a first baffle driving mechanism is also connected to the first sieve plate, the first baffle driving mechanism is connected to the first baffle and drives the first baffle to translate. The advantage of the present invention is high efficiency.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor refrigeration chip thermoelectric module processing, and in particular relates to a main particle feeding mechanism and a preparation device for a semiconductor refrigeration chip thermoelectric module. Background Art

[0002] The semiconductor refrigeration chip thermoelectric module is composed of semiconductor P and N particles placed crosswise between two ceramic substrates.

[0003] The Chinese invention patent with publication number CN209947872U discloses a preparation device for a semiconductor refrigeration chip thermoelectric module, including a substrate positioning carrier provided with multiple first substrate positioning areas, an SMT laser steel mesh, a positioning and placing particle driving mechanism, a particle placing and positioning steel sheet, and an overlapping substrate positioning plate provided with second substrate positioning areas corresponding one to one with the first substrate positioning areas. The SMT laser steel mesh is used to print solder paste for the A-plate ceramic substrate arranged on the substrate positioning carrier and the B-plate ceramic substrate arranged on the overlapping substrate positioning plate; the positioning and placing particle driving mechanism can locate the placement position of the particles; when the overlapping substrate positioning plate is buckled with the substrate positioning carrier, the A-plate ceramic substrate and the B-plate ceramic substrate can correspond one to one and fit together.

[0004] The problem with the existing technology is that the positioning and placement of particles requires a lot of manpower costs, and the efficiency and accuracy of manual placement are not high, resulting in low production efficiency of semiconductor refrigeration chip thermoelectric modules.

[0005] Therefore, the prior art needs to be improved. Summary of the invention

[0006] The technical problem to be solved by the present invention is that in the preparation process of the semiconductor refrigeration chip thermoelectric module, there is a problem of low efficiency in manually placing particles.

[0007] In order to achieve the above-mentioned purpose, the specific technical scheme of the present invention is as follows:

[0008] A main particle feeding mechanism comprises a first feeding track, a first outlet is provided at one end of the first feeding track, a first discharging mechanism is provided below the first outlet, the first discharging mechanism comprises a first sieve plate and a first reciprocating rotating power mechanism which are mutually connected in transmission, the first sieve plate is provided with a first sieve hole, a first baffle is slidably connected to the bottom of the first sieve plate, a first baffle driving mechanism is also connected to the first sieve plate, the first baffle driving mechanism is connected to the first baffle and drives the first baffle to translate; wherein, the first feeding track transmits N-pole particles or P-pole particles, the N-pole particles or P-pole particles fall into the first sieve plate from the first outlet, the first reciprocating rotating power mechanism is a rotating cylinder or a servo motor; when the first reciprocating rotating power mechanism reciprocates, the first sieve plate enables the position of the N-pole particles or P-pole particles to correspond to the position of the first sieve hole, and then the first baffle driving mechanism drives the first baffle to slide, the first baffle slides away from directly below the first sieve plate, and the N-pole particles or P-pole particles fall from the first sieve hole to below.

[0009] As a further improvement of the above technical solution, the first discharging mechanism also includes a first material box, a first lifting power component and a first vibration motor; a material receiving opening is provided on the top of the first material box, the left and right sides of the first sieve plate are connected to the first material box, the left and right ends of the first sieve plate are connected to the material receiving opening, and the front and rear of the first sieve plate are connected to the first vibration motor; the first lifting power component is transmission-connected to the first reciprocating rotating power mechanism and drives the first reciprocating rotating power mechanism to move up and down.

[0010] As a further improvement of the above technical solution, it also includes a first camera and a first loading turntable; the first camera is arranged directly above the first sieve plate; the first loading turntable is connected to one end of the first loading track.

[0011] As a further improvement of the above technical solution, the main particle feeding mechanism includes two groups of the first discharging mechanisms, and one end of the first feeding track is provided with two first outlets, which are respectively used to feed the two groups of the first discharging mechanisms.

[0012] A preparation device for a semiconductor refrigeration chip thermoelectric module comprises a machine platform, on which a conveying mechanism, a secondary particle feeding mechanism and the above-mentioned main particle feeding mechanism are provided, the main particle feeding mechanism and the secondary particle feeding mechanism are both arranged beside the conveying mechanism; the secondary particle feeding mechanism comprises a second feeding track, one end of the second feeding track is provided with a second outlet, a second discharge mechanism is provided below the second outlet, the second discharge mechanism comprises a second sieve plate and a second reciprocating rotating power mechanism which are mutually transmission-connected, the second sieve plate is provided with a second sieve hole, the second reciprocating rotating power mechanism is connected to the machine platform, a second baffle is slidably connected to the bottom of the second sieve plate, a second baffle driving mechanism is also connected to the second sieve plate, the second baffle driving mechanism is connected to the second baffle and drives the second baffle to translate.

[0013] As a further improvement of the above technical solution, it also includes a particle mold, the top of the particle mold is provided with more than two grooves, and the conveying mechanism can convey the particle mold to the bottom of the first sieve plate and the bottom of the second sieve plate; the conveying mechanism includes a transfer component, the transfer component is a turntable or a conveyor belt, the transfer component is connected to a positioning platform, the positioning platform is used to connect the particle mold, the positioning platform is provided with a negative pressure hole, the negative pressure hole is connected to a negative pressure tube, and the negative pressure tube is provided with an electromagnetic valve; it also includes a pressure positioning mechanism, the pressure positioning mechanism includes a positioning plate, the bottom of the positioning plate is provided with a positioning protrusion, and also includes a positioning power mechanism, the positioning power mechanism drives the positioning plate to move up and down, and the positioning power mechanism is connected to the machine; the conveying mechanism also includes a manipulator, the manipulator is used to clamp the particle mold and place the particle mold on the positioning platform.

[0014] As a further improvement of the above technical solution, it also includes a particle mold feeding mechanism, which includes a particle mold storage mechanism, a particle mold translation mechanism and a horizontally arranged mounting plate; the mounting plate is connected to the machine, and the mounting plate is arranged on the side of the conveying mechanism; the particle mold storage mechanism includes a vertically arranged particle mold material trough, a particle mold clamping block and a particle mold clamping power mechanism, the bottom of the particle mold material trough is connected to the top of the mounting plate, the particle mold clamping power mechanism is connected to the mounting plate, the front and rear sides of the particle mold material trough are provided with through grooves, the number of the particle mold clamping blocks is two, the two particle mold clamping blocks are respectively arranged in the two through grooves, and the particle The sub-mold clamping power mechanism is transmission-connected to the particle mold clamping block and drives the particle mold clamping blocks to move closer to or away from each other; the particle mold translation mechanism includes a translation cylinder, a lifting motor, a suction cup, a suction cup mounting block and a sliding plate; the translation cylinder is connected to the mounting plate, the translation cylinder is transmission-connected to the suction cup mounting block and drives the suction cup mounting block to move horizontally, the sliding plate is connected to the suction cup mounting block, a translation groove is provided on the mounting plate, the sliding plate is arranged in the translation groove and is slidably connected to the translation groove, the particle mold groove is arranged above the translation groove, the lifting motor is connected to the suction cup mounting block, the lifting motor is connected to the suction cup and drives the suction cup to move up and down.

[0015] As a further improvement of the above technical solution, the particle mold feeding mechanism also includes a particle mold positioning mechanism, which includes a front positioning mechanism and a front positioning block connected to each other, a rear positioning mechanism and a rear positioning block connected to each other, and a right positioning mechanism and a right positioning block connected to each other, the front positioning block, the rear positioning block and the right positioning block are all arranged above the translation groove, the front positioning mechanism, the rear positioning mechanism and the right positioning mechanism are all connected to the mounting plate, the front positioning mechanism can drive the front positioning block to move forward and backward, the rear positioning mechanism can drive the rear positioning block to move forward and backward, and the right positioning mechanism can drive the right positioning block to move left and right.

[0016] As a further improvement of the above technical solution, it also includes a material unloading mechanism, which is arranged next to the conveying mechanism; the material unloading mechanism includes a material unloading clamping mechanism, a material unloading vertical slide rail, and a material unloading transverse slide rail, the material unloading transverse slide rail is connected to the machine platform, the material unloading vertical slide rail is transversely slidably connected to the material unloading transverse slide rail, and the material unloading clamping mechanism is vertically slidably connected to the material unloading vertical slide rail.

[0017] As a further improvement of the above technical solution, it also includes a first particle replenishment mechanism and a second particle replenishment mechanism; the first particle replenishment mechanism includes a first particle replenishment manipulator, a first particle replenishment camera and a first material replenishment box, the first material replenishment box is connected to the machine, and the first material replenishment box is provided with more than two material replenishment holes opening upward, the first particle replenishment camera is connected to the machine and is arranged above the particle mold; the first particle replenishment manipulator includes a first particle replenishment manipulator body and a first material replenishment adsorption mechanism that are connected to each other, the first material replenishment adsorption mechanism is used to adsorb N-pole particles in the first material replenishment box, and the first particle replenishment manipulator body is used to drive the first material replenishment adsorption mechanism to transfer N-pole particles to the particle mold; the second particle replenishment mechanism has the same structure as the first particle replenishment mechanism, and the first particle replenishment mechanism and the second particle replenishment mechanism are both connected to the machine and are both arranged beside the conveying mechanism.

[0018] The beneficial effects of the present invention are as follows: the first feeding track transmits N-pole particles or P-pole particles, the N-pole particles or P-pole particles fall into the first sieve plate from the first outlet, the first reciprocating rotary power mechanism vibrates the first sieve plate so that the position of the N-pole particles or P-pole particles corresponds to the position of the first sieve hole, and then the first baffle driving mechanism drives the first baffle to slide, the first baffle slides away from directly below the first sieve plate, and the N-pole particles or P-pole particles fall below from the first sieve hole. The ceramic substrate of the semiconductor refrigeration chip thermoelectric module can be placed below the first sieve plate, so that the N-pole particles or P-pole particles are placed on the ceramic substrate according to the position of the first sieve hole. The present invention does not require manual placement of N-pole particles and P-pole particles, and has high production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a top view of the main particle feeding mechanism of the present invention;

[0020] Figure 2 is a three-dimensional diagram of a first discharging mechanism of the present invention;

[0021] Figure 3 It is a three-dimensional diagram of some parts of the main particle feeding mechanism of the present invention;

[0022] Figure 4 It is a top view of a device for preparing a semiconductor refrigeration chip thermoelectric module of the present invention;

[0023] Figure 5 is a schematic diagram of a particle mold of the present invention;

[0024] Figure 6 is a three-dimensional diagram of the second discharging mechanism of the present invention;

[0025] Figure 7 It is a three-dimensional diagram of the particle mold feeding mechanism of the present invention;

[0026] Figure 8 is a cross-sectional view of the particle mold feeding mechanism of the present invention;

[0027] Fig. 9 is a three-dimensional diagram of a first particle replenishing mechanism of the present invention;

[0028] Fig.10 Schematic diagram of the pressure positioning mechanism of the present invention.

[0029] In the figure:

[0030] 1- Machine,

[0031] 2-particle mold, 21-grooves,

[0032] 3-Manipulator,

[0033] 4-transmission mechanism, 41-transfer component, 42-positioning platform,

[0034] 5-main particle feeding mechanism, 51-first feeding track, 511-first outlet, 52-first discharging mechanism, 521-first sieve plate, 5211-first sieve hole, 522-first reciprocating rotating power mechanism, 523-first baffle, 524-first baffle driving mechanism, 525-first material box, 526-first lifting power component, 527-first vibration motor, 53-first camera, 54-first feeding turntable,

[0035] 6-second particle feeding mechanism, 61-second feeding track, 611-second outlet, 62-second discharging mechanism, 621-second sieve plate, 6211-second sieve hole, 622-second reciprocating rotation power mechanism, 623-second baffle, 624-second baffle driving mechanism, 625-second material box, 626-second lifting power component, 627-second vibration motor, 63-second camera, 64-second feeding turntable,

[0036] 7-pressure positioning mechanism, 71-positioning plate, 72-positioning protrusion, 73-positioning power mechanism,

[0037] 8-particle mold feeding mechanism, 81-particle mold storage mechanism, 811-particle mold material trough, 812-particle mold clamping block, 813-particle mold clamping power mechanism, 82-particle mold translation mechanism, 821-translation cylinder, 822-lifting motor, 823-suction cup, 824-suction cup mounting block, 825-sliding plate, 83-particle mold positioning mechanism, 831-front positioning mechanism, 832-front positioning block, 833-rear positioning mechanism, 834-rear positioning block, 835-right positioning mechanism, 836-right positioning block, 84-mounting plate,

[0038] 9-feeding mechanism, 91-feeding clamping mechanism, 92-feeding vertical slide rail, 93-feeding horizontal slide rail,

[0039] 10-first particle replenishment mechanism, 101-first particle replenishment manipulator body, 102-first material replenishment adsorption mechanism, 103-first particle replenishment camera, 104-first material replenishment box, 105-material replenishment hole,

[0040] 11- The second particle replenishment mechanism. DETAILED DESCRIPTION

[0041] The present invention is described in detail below in conjunction with specific embodiments.

[0042] like Figure 1-Figure 3 , is an embodiment of the main particle feeding mechanism 5 of the present invention, specifically:

[0043] The main particle feeding mechanism 5 includes a first feeding track 51, a first outlet 511 is provided at one end of the first feeding track 51, a first discharging mechanism 52 is provided below the first outlet 511, the first discharging mechanism 52 includes a first sieve plate 521 and a first reciprocating rotating power mechanism 522 which are connected to each other in a transmission manner, the first sieve plate 521 is provided with a first sieve hole 5211, the first reciprocating rotating power mechanism 522 is connected to the machine 1, a first baffle 523 is slidably connected to the bottom of the first sieve plate 521, a first baffle driving mechanism 524 is also connected to the first sieve plate 521, and the first baffle driving mechanism 524 is connected to the first baffle 523 and drives the first baffle 523 to translate.

[0044] In the present invention, the first feeding track 51 transmits N-pole particles or P-pole particles, and the N-pole particles or P-pole particles fall into the first sieve plate 521 from the first outlet 511. The first reciprocating rotary power mechanism 522 can be a rotary cylinder or a servo motor; when the first reciprocating rotary power mechanism 522 reciprocates, the first sieve plate 521 enables the position of the N-pole particles or P-pole particles to correspond to the position of the first sieve hole 5211, and then the first baffle driving mechanism 524 drives the first baffle 523 to slide, and the first baffle 523 slides away from the bottom of the first sieve plate 521, and the N-pole particles or P-pole particles fall from the first sieve hole 5211 to the bottom. The ceramic substrate or particle mold 2 of the semiconductor refrigeration chip thermoelectric module can be placed under the first sieve plate 521, so that the N-pole particles or P-pole particles are placed on the ceramic substrate according to the position of the first sieve hole 5211 and fall onto the particle mold 2. The present invention does not require manual placement of N-pole particles and P-pole particles, and has high production efficiency.

[0045] In a preferred embodiment, the first discharging mechanism 52 also includes a first material box 525, a first lifting power component 526 and a first vibration motor 527; a material receiving opening is provided on the top of the first material box 525, and the first material box 525 is connected to the left and right sides of the first sieve plate 521, and the left and right ends of the first sieve plate 521 are connected to the material receiving opening, and the front and rear of the first sieve plate 521 are connected to the first vibration motor 527; the first lifting power component 526 is connected to the machine 1, and the first lifting power component 526 is transmission-connected to the first reciprocating rotating power mechanism 522 and drives the first reciprocating rotating power mechanism 522 to move up and down. Since the number of N-pole particles or P-pole particles transported by the first feeding track 51 may be different from the number of the first sieve holes 5211, the material box can receive the excess N-pole particles or P-pole particles that are vibrated out of the first sieve plate 521 when the first sieve plate 521 vibrates, and the N-pole particles or P-pole particles in the material box can be recycled to the first feeding track 51 for reuse. The first vibration motor 527 is used to assist the vibration of the first sieve plate 521 and can prevent the N-pole particles or P-pole particles from falling. In the process of the first lifting power component 526 driving the first reciprocating rotary power mechanism 522 to move up and down, the first sieve plate 521 and the first baffle 523 can move up and down synchronously, and moving the first sieve plate 521 and the first baffle 523 to a higher position can allow the first sieve plate 521 to have enough space to swing and vibrate, and moving the first sieve plate 521 and the first baffle 523 to a lower position can prevent the N-pole particles or P-pole particles from falling into the particle mold 2 due to excessive falling distance and rebounding out of the particle mold 2.

[0046] In this embodiment, the main particle feeding mechanism 5 also includes a first camera 53 and a first feeding turntable 54; the first camera 53 is connected to the machine 1, and the first camera 53 is arranged directly above the first sieve plate 521; the main particle feeding mechanism 5 also includes a first feeding turntable 54, and the first feeding turntable 54 is connected to one end of the first feeding track 51. The first camera 53 is used to capture the image of the first sieve plate 521. By capturing the image of the first sieve plate 521, it is possible to capture whether some of the first sieve holes 5211 are not loaded with N-pole particles or P-pole particles, thereby inferring whether some N-pole particles or P-pole particles are missing in the particle mold 2. The first feeding turntable 54 is used to provide N-pole particles or P-pole particles for the first feeding track 51. During the rotation of the first feeding turntable 54, the N-pole particles or P-pole particles can be continuously transferred from the first feeding turntable 54 to the first feeding track 51. Using the feeding turntable for feeding is a prior art in the art and will not be described in detail here.

[0047] In an optional embodiment, the main particle feeding mechanism 5 includes two groups of first discharging mechanisms 52, and one end of the first feeding track 51 is provided with two first outlets 511, and the two first outlets 511 are respectively used to feed the two groups of first discharging mechanisms 52. The advantage of this embodiment is that the two groups of first discharging mechanisms 52 can work simultaneously, thereby improving production efficiency.

[0048] like Figure 4-Figure 10 , is an embodiment of the device for preparing the semiconductor refrigeration chip thermoelectric module of the present invention, specifically:

[0049] A preparation device for a semiconductor refrigeration chip thermoelectric module comprises a machine 1, on which a conveying mechanism 4, a main particle feeding mechanism 5 and a secondary particle feeding mechanism 6 are arranged, and the main particle feeding mechanism 5 and the secondary particle feeding mechanism 6 are arranged beside the conveying mechanism 4; the secondary particle feeding mechanism 6 comprises a second feeding track 61, one end of the second feeding track 61 is provided with a second outlet 611, and a second discharge mechanism 62 is provided below the second outlet 611, and the second discharge mechanism 62 comprises a second sieve plate 621 and a second reciprocating rotating power mechanism 622 which are mutually transmission-connected, the second sieve plate 621 is provided with a second sieve hole 6211, the second reciprocating rotating power mechanism 622 is connected to the machine 1, and the bottom of the second sieve plate 621 is slidably connected with a second baffle plate 623, and the second sieve plate 621 is also provided with a second reciprocating rotating power mechanism 622. It is connected to a second baffle driving mechanism 624, which is connected to the second baffle 623 and drives the second baffle 623 to translate. In a preferred embodiment, the second discharging mechanism 62 also includes a second material box 625, a second lifting power component 626 and a second vibration motor 627; a material receiving opening is provided on the top of the second material box 625, and the left and right sides of the second sieve plate 621 are connected to the second material box 625, the left and right ends of the second sieve plate 621 are connected to the material receiving opening, and the front and rear of the second sieve plate 621 are connected to the second vibration motor 627; the second lifting power component 626 is connected to the machine platform 1, and the second lifting power component 626 is transmission-connected to the second reciprocating rotating power mechanism 622 and drives the second reciprocating rotating power mechanism 622 to move up and down.

[0050] Furthermore, the preparation device of the semiconductor refrigeration chip thermoelectric module also includes a particle mold 2, and the top of the particle mold 2 is provided with more than two grooves 21, and the conveying mechanism 4 can convey the particle mold 2 to the bottom of the first sieve plate 521 and the bottom of the second sieve plate 621. The grooves 21 on the particle mold 2 are used to load N-pole particles and P-pole particles, and each groove 21 corresponds to an N-pole particle or a P-pole particle. The conveying mechanism 4 includes a transfer component 41, and the transfer component 41 is a turntable or a conveyor belt. The transfer component 41 is connected to a positioning platform 42, and the positioning platform 42 is used to connect the particle mold 2. The positioning platform 42 is provided with a negative pressure hole, and the negative pressure hole is connected to a negative pressure pipe, and the negative pressure pipe is provided with a solenoid valve. The negative pressure pipe is used to connect the negative pressure generating mechanism of the peripheral device. After the particle mold 2 is placed on the positioning platform 42, the solenoid valve is opened, and the particle mold 2 is adsorbed on the positioning platform 42 through the negative pressure hole, so that the particle mold 2 can be temporarily fixed on the positioning platform 42. Furthermore, the preparation device of the semiconductor refrigeration chip thermoelectric module also includes a pressure positioning mechanism 7; the pressure positioning mechanism 7 includes a positioning plate 71, a positioning protrusion 72 is provided at the bottom of the positioning plate 71, and also includes a positioning power mechanism 73, the positioning power mechanism 73 drives the positioning plate 71 to move up and down, and the positioning power mechanism 73 is connected to the machine 1. In the process of the positioning power mechanism 73 driving the positioning plate 71 to move up and down, the positioning protrusion 72 can be downwardly connected with the groove 21 on the particle mold 2, and the particle mold 2 is accurately aligned through the interaction between the positioning protrusion and the positioning groove 21. After the particle mold 2 is accurately aligned, the position of the particle mold 2 is fixed by the negative pressure of the positioning platform 42, and then the positioning plate 71 is lifted upward and reset.

[0051] In the preparation device of the semiconductor refrigeration chip thermoelectric module of the present invention, the main particle loading mechanism 5 and the auxiliary particle loading mechanism 6 are respectively used to provide the particle mold 2 with N-pole particles and P-pole particles arranged in preset positions. When the preparation device of the semiconductor refrigeration chip thermoelectric module of the present invention is working, the conveying mechanism 4 conveys the particle mold 2 to the bottom of the first sieve plate 521; the first loading track 51 transmits the N-pole particles, and the N-pole particles fall into the first sieve plate 521 from the first outlet 511, and the first reciprocating rotating power mechanism 522 vibrates the first sieve plate 521 so that the position of the N-pole particles corresponds to the position of the first sieve hole 5211, and then the first baffle driving mechanism 524 drives the first baffle 523 to slide, and the first baffle 523 slides away from directly below the first sieve plate 521, and the N-pole particles fall from the first sieve hole 5211 to the bottom. ; then, the particle mold 2 containing N-pole particles rotates with the positioning platform 42 to the bottom of the second sieve plate 621, and the second loading track 61 transmits P-pole particles, which fall into the second sieve plate 621 from the second outlet 611, and the second reciprocating rotating power mechanism 622 vibrates the second sieve plate 621 so that the position of the P-pole particles corresponds to the position of the second sieve hole 6211, and then the second baffle driving mechanism 624 drives the second baffle 623 to slide, and the second baffle 623 slides away from directly below the second sieve plate 621, and the P-pole particles fall into the particle mold 2 below from the second sieve hole 6211. The advantage of the present invention is that the first sieve plate 521 and the second sieve plate 621 are used to sieve the N-pole particles and the P-pole particles into the first sieve hole 5211 and the second sieve hole 6211 at specific positions, and then the N-pole particles and the P-pole particles are transferred from the first sieve hole 5211 and the second sieve hole 6211 to the particle mold 2. Therefore, the positions of the N-pole particles and the P-pole particles in the particle mold 2 are specific. Subsequently, a ceramic substrate coated with glue is placed on the particle mold 2, and the N-pole particles and the P-pole particles are adhered to the ceramic substrate, so that the N-pole particles and the P-pole particles can be temporarily fixed on the ceramic substrate. The present invention does not require manual placement of the N-pole particles and the P-pole particles, and has high production efficiency.

[0052] Furthermore, the conveying mechanism 4 further includes a robot 3 , which is used to clamp the particle mold 2 and place the particle mold 2 on the positioning platform 42 .

[0053] In a preferred embodiment, a particle mold feeding mechanism 8 is further included, which includes a particle mold storage mechanism 81, a particle mold translation mechanism 812 and a horizontally arranged mounting plate 84; the mounting plate 84 is connected to the machine platform 1, and the mounting plate 84 is arranged beside the conveying mechanism 4; the particle mold storage mechanism 81 includes a vertically arranged particle mold material groove 811, a particle mold clamping block 812 and a particle mold clamping power mechanism 813, the bottom of the particle mold material groove 811 is connected to the top of the mounting plate 84, the particle mold clamping power mechanism 813 is connected to the mounting plate 84, the front and rear sides of the particle mold material groove 811 are provided with through grooves, the number of the particle mold clamping blocks 812 is two, and the two particle mold clamping blocks 812 are respectively arranged in the two through grooves, and the particle mold clamping power mechanism 81 3 is connected to the particle mold clamping block 812 in a transmission manner and drives the particle mold clamping block 812 to move closer to or away from each other; the particle mold translation mechanism 812 includes a translation cylinder 821, a lifting motor 822, a suction cup 823, a suction cup mounting block 824 and a sliding plate 825; the translation cylinder 821 is connected to the mounting plate 84, the translation cylinder 821 is connected to the suction cup mounting block 824 in a transmission manner and drives the suction cup mounting block 824 to move horizontally, the sliding plate 825 is connected to the suction cup mounting block 824, a translation groove is provided on the mounting plate 84, the sliding plate 825 is arranged in the translation groove and is slidably connected to the translation groove, the particle mold 2 groove is arranged above the translation groove, the lifting motor 822 is connected to the suction cup mounting block 824, the lifting motor 822 is connected to the suction cup 823 and drives the suction cup 823 to move up and down. In the particle mold feeding mechanism 8 of the present embodiment, the particle mold material groove 811 is used to place the vertically stacked particle molds 2. After the particle mold clamping blocks 812 are close to each other, the bottom particle mold 2 is clamped by the particle mold clamping block 812. When the particle mold clamping blocks 812 are away from each other, the particle mold 2 falls downward to a certain height, and the particle mold clamping block 812 clamps again to clamp the second to last particle mold 2 from the bottom to the top. The translation cylinder 821 drives the suction cup mounting block 824 and the sliding plate 825 to move synchronously for a certain distance, and the suction cup 823 can be synchronously moved to the bottom of the particle mold 2 with the suction cup 823 mounting plate 84, and the suction cup 823 is driven to rise by the lifting motor 822, and the suction cup 823 can be close to the lowest particle mold 2. At this time, through the mutual moving away and approaching action of the particle mold clamping block 812, the lowest particle mold 2 is released onto the suction cup 823 and the second to last particle mold 2 from the bottom to the top is clamped by the particle mold clamping block 812, and then the lifting motor 822 drives the suction cup 823 to descend, and the translation cylinder 821 drives the suction cup 823 to translate again, so that the particle mold 2 can be transferred to the outside of the particle mold material tank 811. The sliding plate 825 can assist the particle mold clamping block 812 in supporting the particle mold 2.

[0054] Furthermore, the particle mold feeding mechanism 8 also includes a particle mold positioning mechanism 83, which includes a front positioning mechanism 831 and a front positioning block 832 connected to each other, a rear positioning mechanism 833 and a rear positioning block 834 connected to each other, and a right positioning mechanism 835 and a right positioning block 836 connected to each other, the front positioning block 832, the rear positioning block 834 and the right positioning block 836 are all arranged above the translation slot, the front positioning mechanism 831, the rear positioning mechanism 833 and the right positioning mechanism 835 are all connected to the mounting plate 84, the front positioning mechanism 831 can drive the front positioning block 832 to move forward and backward, the rear positioning mechanism 833 can drive the rear positioning block 834 to move forward and backward, and the right positioning mechanism 835 can drive the right positioning block 836 to move left and right. The advantage of this embodiment is that the position of the particle mold 2 on the suction cup 823 can be adjusted by using the front positioning block 832, the rear positioning block 834 and the right positioning block 836. After the manipulator 3 transfers the particle mold 2 from the suction cup 823 to the positioning platform 42, the placement position of the particle mold 2 is relatively accurate.

[0055] In some embodiments, a material unloading mechanism 9 is further included, and the material unloading mechanism 9 is arranged beside the conveying mechanism 4; the material unloading mechanism 9 includes a material unloading clamping mechanism 91, a material unloading vertical slide rail 92, and a material unloading transverse slide rail 93, the material unloading transverse slide rail 93 is connected to the machine 1, the material unloading vertical slide rail 92 is connected to the material unloading transverse slide rail 93 in a transverse sliding manner, and the material unloading clamping mechanism 91 is connected to the material unloading vertical slide rail 92 in a vertical sliding manner. The material unloading clamping mechanism 91 is used to clamp the particle mold 2 loaded with N-pole particles and P-pole particles on the conveying mechanism 4, and transfer the particle mold 2 to the outside of the conveying mechanism 4.

[0056] In some embodiments, a first particle replenishment mechanism 10 and a second particle replenishment mechanism 11 are further included; the first particle replenishment mechanism 10 includes a first particle replenishment manipulator 3, a first particle replenishment camera 103 and a first material replenishment box 104, the first material replenishment box 104 is connected to the machine 1, and the first material replenishment box 104 is provided with more than two material replenishment holes 105 opening upward, the first particle replenishment camera 103 is connected to the machine 1 and is arranged above the particle mold 2; the first particle replenishment manipulator 3 includes a first particle replenishment manipulator body 101 and a first material replenishment adsorption mechanism 102 that are interconnected, the first material replenishment adsorption mechanism 102 is used to adsorb N-pole particles in the first material replenishment box 104, and the first particle replenishment manipulator body 101 is used to drive the first material replenishment adsorption mechanism 102 to transfer N-pole particles to the particle mold 2; the second particle replenishment mechanism 11 has the same structure as the first particle replenishment mechanism 10, and the first particle replenishment mechanism 10 and the second particle replenishment mechanism 11 are both connected to the machine 1 and are both arranged next to the conveying mechanism 4. The first particle replenishment camera 103 is used to photograph the particle mold 2. When there are indeed N-pole particles in some grooves 21 in the particle mold 2, the first particle replenishment manipulator body 101 drives the first material replenishment adsorption mechanism 102 to move, and the first material replenishment adsorption mechanism 102 transfers the N-pole particles from the first material replenishment box 104 to the particle mold 2. The second particle replenishment mechanism 11 is used to replenish P-pole particles into the particle mold 2.

[0057] In the absence of conflict, the above-mentioned embodiments and features thereof may be combined with each other.

[0058] In the description of the present invention, it is necessary to understand that the terms "length", "up", "down", "top", "bottom", "inside", "outside", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0059] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0060] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0061] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0062] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention, rather than to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the present invention.

Claims

1. A main particle feeding mechanism, characterized in that: It includes a first feeding track, a first outlet is provided at one end of the first feeding track, a first discharging mechanism is provided below the first outlet, the first discharging mechanism includes a first sieve plate and a first reciprocating rotating power mechanism which are mutually connected in transmission, the first sieve plate is provided with a first sieve hole, a first baffle is slidably connected to the bottom of the first sieve plate, the first sieve plate is also connected to a first baffle driving mechanism, the first baffle driving mechanism is connected to the first baffle and drives the first baffle to translate; wherein, the first feeding track transmits N-pole particles or P-pole particles, the N-pole particles or P-pole particles fall into the first sieve plate from the first outlet, and the first reciprocating rotating power mechanism is a rotating cylinder or a servo motor; when the first reciprocating rotating power mechanism reciprocates, the first sieve plate enables the position of the N-pole particles or P-pole particles to correspond to the position of the first sieve hole, and then the first baffle driving mechanism drives the first baffle to slide, the first baffle slides away from directly below the first sieve plate, and the N-pole particles or P-pole particles fall from the first sieve hole to below.

2. The main particle feeding mechanism according to claim 1, characterized in that: The first discharging mechanism also includes a first material box, a first lifting power component and a first vibration motor; a material receiving opening is provided on the top of the first material box, the left and right sides of the first sieve plate are connected to the first material box, the left and right ends of the first sieve plate are connected to the material receiving opening, and the front and rear of the first sieve plate are connected to the first vibration motor; the first lifting power component is transmission-connected to the first reciprocating rotating power mechanism and drives the first reciprocating rotating power mechanism to move up and down.

3. The main particle feeding mechanism according to claim 1, characterized in that: It also includes a first camera and a first loading turntable; the first camera is arranged directly above the first sieve plate; the first loading turntable is connected to one end of the first loading track.

4. The main particle feeding mechanism according to claim 1, characterized in that: The main particle feeding mechanism comprises two groups of the first discharging mechanisms. One end of the first feeding track is provided with two first outlets, and the two first outlets are respectively used to feed the two groups of the first discharging mechanisms.

5. A device for preparing a semiconductor refrigeration chip thermoelectric module, characterized in that: The machine comprises a conveying mechanism, a secondary particle feeding mechanism and a main particle feeding mechanism as claimed in any one of claims 1 to 4, wherein the main particle feeding mechanism and the secondary particle feeding mechanism are both arranged beside the conveying mechanism; The secondary particle feeding mechanism includes a second feeding track, a second outlet is provided at one end of the second feeding track, a second discharging mechanism is provided below the second outlet, the second discharging mechanism includes a second sieve plate and a second reciprocating rotating power mechanism which are transmission-connected to each other, the second sieve plate is provided with second sieve holes, the second reciprocating rotating power mechanism is connected to the machine, a second baffle is slidably connected to the bottom of the second sieve plate, a second baffle driving mechanism is also connected to the second sieve plate, and the second baffle driving mechanism is connected to the second baffle and drives the second baffle to translate.

6. The device for preparing a semiconductor refrigeration chip thermoelectric module according to claim 5, characterized in that: It also includes a particle mold, wherein the top of the particle mold is provided with more than two grooves, and the conveying mechanism can convey the particle mold to below the first sieve plate and below the second sieve plate; The conveying mechanism comprises a transfer component, the transfer component is a turntable or a conveyor belt, the transfer component is connected to a positioning platform, the positioning platform is used to connect the particle mold, the positioning platform is provided with a negative pressure hole, the negative pressure hole is connected to a negative pressure tube, and the negative pressure tube is provided with a solenoid valve; It also includes a pressure positioning mechanism, which includes a positioning plate, a positioning protrusion is provided at the bottom of the positioning plate, and a positioning power mechanism, which drives the positioning plate to move up and down, and the positioning power mechanism is connected to the machine platform; The conveying mechanism further comprises a robot arm, which is used for clamping the particle mold and placing the particle mold on the positioning table.

7. The device for preparing a semiconductor refrigeration chip thermoelectric module according to claim 6, characterized in that: It also includes a particle mold feeding mechanism, which includes a particle mold storage mechanism, a particle mold translation mechanism and a horizontally arranged mounting plate; The mounting plate is connected to the machine platform, and the mounting plate is arranged beside the conveying mechanism; The particle mold storage mechanism comprises a vertically arranged particle mold material trough, a particle mold clamping block and a particle mold clamping power mechanism, the bottom of the particle mold material trough is connected to the top of the mounting plate, the particle mold clamping power mechanism is connected to the mounting plate, the front and rear sides of the particle mold material trough are provided with through grooves, the number of the particle mold clamping blocks is two, the two particle mold clamping blocks are respectively arranged in the two through grooves, the particle mold clamping power mechanism is transmission-connected to the particle mold clamping blocks and drives the particle mold clamping blocks to move closer to or away from each other; The particle mold translation mechanism includes a translation cylinder, a lifting motor, a suction cup, a suction cup mounting block and a sliding plate; the translation cylinder is connected to the mounting plate, the translation cylinder is transmission-connected to the suction cup mounting block and drives the suction cup mounting block to move horizontally, the sliding plate is connected to the suction cup mounting block, a translation groove is provided on the mounting plate, the sliding plate is arranged in the translation groove and is slidingly connected to the translation groove, the particle mold groove is arranged above the translation groove, the lifting motor is connected to the suction cup mounting block, the lifting motor is connected to the suction cup and drives the suction cup to move up and down.

8. The device for preparing a semiconductor refrigeration chip thermoelectric module according to claim 7, characterized in that: The particle mold feeding mechanism also includes a particle mold positioning mechanism, which includes a front positioning mechanism and a front positioning block connected to each other, a rear positioning mechanism and a rear positioning block connected to each other, and a right positioning mechanism and a right positioning block connected to each other, the front positioning block, the rear positioning block and the right positioning block are all arranged above the translation groove, the front positioning mechanism, the rear positioning mechanism and the right positioning mechanism are all connected to the mounting plate, the front positioning mechanism can drive the front positioning block to move forward and backward, the rear positioning mechanism can drive the rear positioning block to move forward and backward, and the right positioning mechanism can drive the right positioning block to move left and right.

9. The device for preparing a semiconductor refrigeration chip thermoelectric module according to claim 5, characterized in that: It also includes a material unloading mechanism, which is arranged beside the conveying mechanism; the material unloading mechanism includes a material unloading clamping mechanism, a material unloading vertical slide rail, and a material unloading transverse slide rail, the material unloading transverse slide rail is connected to the machine platform, the material unloading vertical slide rail is transversely slidably connected to the material unloading transverse slide rail, and the material unloading clamping mechanism is vertically slidably connected to the material unloading vertical slide rail.

10. The device for preparing a semiconductor refrigeration chip thermoelectric module according to claim 6, characterized in that: It also includes a first particle replenishment mechanism and a second particle replenishment mechanism; the first particle replenishment mechanism includes a first particle replenishment manipulator, a first particle replenishment camera and a first material replenishment box, the first material replenishment box is connected to the machine, the first material replenishment box is provided with more than two material replenishment holes opening upward, the first particle replenishment camera is connected to the machine and is arranged above the particle mold; the first particle replenishment manipulator includes a first particle replenishment manipulator body and a first material replenishment adsorption mechanism that are connected to each other, the first material replenishment adsorption mechanism is used to adsorb N-pole particles in the first material replenishment box, and the first particle replenishment manipulator body is used to drive the first material replenishment adsorption mechanism to transfer N-pole particles to the particle mold; the second particle replenishment mechanism has the same structure as the first particle replenishment mechanism, the first particle replenishment mechanism and the second particle replenishment mechanism are both connected to the machine and are both arranged beside the conveying mechanism.

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