Tinning device and tinning method

Abstract

The present invention provides a tinning device and a tinning method, comprising a plurality of carriers and a carrier tray, wherein the carrier has a carrier groove, the bottom of the carrier groove has at least one through hole, the carrier groove is used to accommodate the component to be tinned, and the lead of the component to be tinned passes through the through hole; the carrier tray has a bottom plate, the bottom plate has a plurality of hollow areas, the hollow areas are used to accommodate the carrier, and the carrier is passed through from the front of the bottom plate to the back of the bottom plate, so that the carrier and the lead of the component to be tinned are exposed from the back of the bottom plate; wherein the hardness of the carrier tray is greater than the hardness of the carrier; the high temperature resistance of the carrier is greater than the high temperature resistance of the carrier tray. In other words, the present invention can perform tinning operations on the leads of multiple components to be tinned at the same time, thereby improving the efficiency of tinning.

Description

Technical Field

[0001] The present invention relates to the technical field of tinning, and more particularly to a tinning device and a tinning method. Background Art

[0002] In order to protect the lead part of the electronic product, prevent the lead part from rusting, and improve its solderability, a layer of lead tin is usually applied evenly on the lead part. However, in the prior art, the electronic product is manually equipped with a gasket, and then a tweezers is manually used to pick up an electronic product with a gasket to perform the tinning operation. The process is very backward and the work efficiency is low. Based on this, how to improve the efficiency of tinning has become one of the problems that technicians in this field need to solve urgently. Summary of the invention

[0003] In view of this, the present invention provides a tinning device and a tinning method to improve the efficiency of tinning electronic products.

[0004] To achieve the above object, the present invention provides the following technical solutions:

[0005] A tinning device, comprising:

[0006] A plurality of carriers, each carrier having a carrier groove, the bottom of the carrier groove having at least one through hole, the carrier groove being used to accommodate the components to be tinned, and the leads of the components to be tinned pass through the through hole;

[0007] The carrier tray has a bottom plate, and the bottom plate has a plurality of hollow areas, the hollow areas are used to accommodate the carrier, and the carrier is passed through from the front side of the bottom plate to the back side of the bottom plate, so that the carrier and the leads of the components to be tinned are exposed from the back side of the bottom plate;

[0008] The hardness of the carrying tray is greater than that of the carrying body; and the high temperature resistance of the carrying body is greater than that of the carrying tray.

[0009] Optionally, the material of the carrier is silica gel; the material of the carrier tray is bakelite board or fiberglass board.

[0010] Optionally, the outer side of the carrier has a slot; the slot is used to snap-fit ​​and fix the carrier in the hollow area of ​​the carrier tray, and snap-fit ​​and fix the bottom plate in the slot, so that there is a preset distance between the bottom plate and the bottom of the carrier.

[0011] Optionally, the carrier further has a positioning portion; the positioning portion is used to fix the carrier in the hollow area in a preset direction.

[0012] Optionally, the opening width of the top of the bearing groove is greater than the opening width of the bottom of the bearing groove.

[0013] Optionally, an arc-shaped transition surface is formed between the outer side surface and the bottom surface of the carrier.

[0014] Optionally, the carrying tray further has at least one pair of side walls, and reinforcing ribs are provided between the side walls and the bottom plate.

[0015] Optionally, the top of the side wall has a positioning support portion, and the bottom of the side wall has a positioning groove, and the positioning support portion and the positioning groove are used to achieve support and positioning between the upper and lower loading trays when multiple loading trays are stacked.

[0016] Optionally, the shape of the bearing slot is circular, square or diamond;

[0017] The shape of the hollow area is the same as the shape of the bearing groove of any bearing body.

[0018] A tinning method, applied to any of the above tinning devices, comprising:

[0019] Insert the component to be tinned into the bearing slot of the bearing body, and make the lead of the component to be tinned pass through the through hole;

[0020] Inserting a plurality of carriers into the hollow area of ​​the carrier tray, and passing the carriers through the front side of the base plate to the back side of the base plate, so that the carriers and the leads of the components to be tinned are exposed from the back side of the base plate;

[0021] Place the carrier tray on top of the tin liquid and immerse the exposed leads on the back of the base plate into the tin liquid for tinning.

[0022] Compared with the prior art, the technical solution provided by the present invention has the following advantages:

[0023] The tinning device and tinning method provided by the present invention can insert the component to be tinned into the bearing groove of the carrier, and make the lead of the component to be tinned pass through the through hole at the bottom of the bearing groove, then multiple carriers can be inserted into multiple hollow areas on the bottom plate of the carrier tray, and the carriers can pass through from the front of the bottom plate to the back of the bottom plate, so that the carriers and the leads of the component to be tinned are exposed from the back of the bottom plate, and then the carrier tray can be placed on the top of the tin liquid, and the carrier exposed on the back of the bottom plate and the leads of the component to be tinned are immersed in the tin liquid for tinning. In other words, the tinning device provided by the present invention can perform tinning operations on the leads of multiple components to be tinned at the same time, thereby improving the efficiency of tinning.

[0024] Furthermore, since the high temperature resistance of the carrier is greater than that of the carrier tray, the carrier exposed on the back of the carrier tray and the leads of the parts to be tinned are immersed in the tin liquid for tinning without causing damage to the carrier. Since the hardness of the carrier tray is greater than that of the carrier, the carrier tray will not be deformed by the high temperature of the tin liquid during the tinning process, so that the stability of the tinning device is better, and then the uniformity of the tinning is better, thereby improving the consistency of the parts to be tinned. In addition, the use of the tinning device provided by the present invention for tinning can keep the operator away from the high temperature tin liquid, greatly reducing the risk of the operator being scalded. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0026] Figure 1 A schematic diagram of a top view of a carrier provided by an embodiment of the present invention;

[0027] Figure 2 for Figure 1 The cross-sectional structure diagram of the carrier along the cutting line AA' is shown;

[0028] Figure 3 A bottom view schematic diagram of the structure of a carrier provided by one embodiment of the present invention;

[0029] Figure 4 A schematic diagram of a top view of a load tray provided in one embodiment of the present invention;

[0030] Figure 5 for Figure 4 The cross-sectional structure diagram of the carrying tray along the cutting line BB' is shown;

[0031] Figure 6 A schematic side view of the structure of a load-bearing tray provided in one embodiment of the present invention;

[0032] Figure 7 A schematic diagram of the structure of a component to be tinned after being inserted into a bearing slot according to an embodiment of the present invention;

[0033] Figure 8 A schematic diagram of a combined structure of a carrier and a carrier tray provided in one embodiment of the present invention;

[0034] Fig. 9 A schematic diagram of a top view of a carrier provided in another embodiment of the present invention;

[0035] Fig.10 A bottom view schematic diagram of the structure of a carrier provided by another embodiment of the present invention;

[0036] Fig.11 A schematic diagram of a top view of a load tray provided in another embodiment of the present invention;

[0037] Fig.12 for Fig.11 The cross-sectional structure diagram of the carrying tray along the cutting line BB' is shown;

[0038] Fig.13 A schematic diagram of a top view of a carrier provided in another embodiment of the present invention;

[0039] Fig.14 for Fig.13 The cross-sectional structure diagram of the carrier along the cutting line AA' is shown;

[0040] Fig.15 A bottom view schematic diagram of the structure of a carrier provided by another embodiment of the present invention;

[0041] Fig.16 A schematic diagram of a top view of a load tray provided in another embodiment of the present invention;

[0042] Fig.17 for Fig.16 The cross-sectional structure diagram of the carrying tray along the cutting line BB' is shown;

[0043] Fig.18 A flow chart of a tinning method provided by one embodiment of the present invention. DETAILED DESCRIPTION

[0044] The above is the core idea of ​​the present invention. In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in combination with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] An embodiment of the present invention provides a tinning device, comprising a plurality of carriers 1 and a carrier tray 2 .

[0046] like Figures 1 to 3As shown, the carrier 1 has a bearing groove 10, and the bottom of the bearing groove 10 has at least one through hole 100. The bearing groove 10 is used to accommodate the component to be tinned, and the lead of the component to be tinned passes through the through hole 100. The size of the through hole 100 is set so that the lead can pass through the through hole 100, but the tin liquid splashed at the bottom of the carrier 1 cannot reach the top of the carrier 1 through the through hole 100.

[0047] like Figures 4 to 6 As shown, the carrier tray 2 has a bottom plate 20, and the bottom plate 20 has a plurality of hollow areas 200. Optionally, the plurality of hollow areas 200 are arranged in an array. The hollow areas 200 are used to accommodate the carrier 1, and the carrier 1 is passed through from the front side of the bottom plate 20 to the back side of the bottom plate 20, so that the carrier 1 and the leads of the components to be tinned are exposed from the back side of the bottom plate 20.

[0048] In the embodiment of the present invention, Figure 7 As shown, the component to be tinned 3 is inserted into the bearing groove 10 of the carrier 1, and the lead 30 of the component to be tinned 3 passes through the through hole 100 at the bottom of the bearing groove 10, and then, as shown in FIG. Figure 8 As shown, multiple carriers 1 can be inserted into multiple hollow areas 200 on the bottom plate 20 of the carrier tray 2, and the carriers 1 are passed through from the front side of the bottom plate 20 to the back side of the bottom plate 20, so that the carriers 1 and the leads 30 of the components 3 to be tinned are exposed from the back side of the bottom plate 20, and then the carrier tray 2 can be placed on top of the tin liquid 4, and the carriers 1 and the leads 30 of the components 3 to be tinned exposed on the back side of the bottom plate 20 are immersed in the tin liquid 4 for tinning. In other words, the tinning device provided by the present invention can perform tinning operations on the leads 30 of multiple components 3 to be tinned at the same time, thereby improving the efficiency of tinning.

[0049] It should be noted that, in the embodiments of the present invention, there should be no chamfers or fillets between the through hole 100 and the bottom surface of the carrier 1 to ensure the stability of the tinning of the carrier 1. It should also be noted that, in some embodiments of the present invention, the through hole 100 is a circular through hole, and the diameter of the circular through hole is in the range of (the diameter of the lead 30 inserted into the through hole 100 - 0.2 mm) to the diameter of the lead 30 inserted into the through hole 100, that is, assuming that the diameter of the lead 30 inserted into the through hole 100 is 1 mm, the diameter range of the through hole 100 is 0.8 mm to 1 mm.

[0050] In the embodiment of the present invention, the hardness of the carrying tray 2 is greater than that of the carrying body 1 ; the high temperature resistance of the carrying body 1 is greater than that of the carrying tray 2 .

[0051] Since the high temperature resistance of the carrier 1 is greater than that of the carrier tray 2, the carrier 1 exposed on the back of the carrier tray 2 and the leads 30 of the component 3 to be dipped in the tin liquid 4 will not be damaged. Since the hardness of the carrier tray 2 is greater than that of the carrier 1, the carrier tray 2 will not be deformed due to the high temperature of the tin liquid during the dipping process, so that the stability of the dipping device is better, and then the uniformity of the dipping is better, and the consistency of the component 3 to be dipped is improved.

[0052] In some optional embodiments of the present invention, the material of the carrier 1 is silica gel or the like; the material of the carrier tray 2 is bakelite board or fiberglass board or the like.

[0053] Since silica gel can meet the tinning operation at a temperature of 400°C, the tinning process will not cause damage to the carrier 1. In addition, the external shape of the carrier 1 can be well combined with the carrier tray 2, so assembly and disassembly are very convenient and effortless, and the two will not fall off during use.

[0054] Since bakelite or fiberglass board is relatively hard, it can provide support and layout for the carrier 1, and can also ensure that it does not deform during high-temperature operation. In addition, since bakelite or fiberglass board has a low thermal conductivity, it will not take away too much heat during tinning, which plays a significant role in stabilizing the temperature of the tin surface.

[0055] In addition, in some embodiments of the present invention, Figure 5 and Figure 8 As shown, the carrying tray 2 also has at least one pair of side walls 21, and the side walls 21 have a handle 22. The operator can hold the handle 22 to place the carrying tray 2 above the surface of the tin liquid 4 at a preset distance for tinning. Of course, the present invention is not limited to this. In other embodiments, the carrying tray 2 can be supported by a bracket above the tin liquid 4 container for tinning. In other words, the tinning device provided by the present invention can keep the operator away from the high-temperature tin liquid, greatly reducing the risk of the operator being scalded.

[0056] In some embodiments of the present invention, Figures 1 to 3 As shown, the shape of the carrier 1 or the shape of the carrier slot 10 is a square as an example for illustration, but it is not limited thereto. In other embodiments, such as Figures 9 and 10 As shown, the shape of the carrier 1 or the shape of the carrier groove 10 can also be circular, or, as shown in FIG. Figures 13 to 15 As shown, the shape of the carrier 1 or the shape of the carrier slot 10 can also be a rhombus. Of course, the shape of the carrier 1 or the shape of the carrier slot 10 can also be a triangle, etc., which will not be repeated here.

[0057] It should be noted that the shape of the hollow area 200 on the carrying tray 2 must correspond to the shape of the carrying body 1, that is, the shape of the hollow area 200 is the same as the shape of any carrying body 1 or the shape of the carrying slot 10. Figure 4 As shown, the shape of the hollow area 200 is a square. Of course, the present invention is not limited to this. In another embodiment, as shown in FIG. Fig.11 and Fig.12 As shown, the shape of the hollow area 200 can also be circular, or, as shown in FIG. Fig.16 and Fig.17 As shown, the shape of the hollow area 200 may also be a rhombus. Of course, in other embodiments, the shape of the hollow area 200 may also be a triangle or the like.

[0058] It should also be noted that the shapes of the hollow areas 200 on the same carrying tray 2 can be the same, such as all being square hollow areas, but the present invention is not limited to this. In other embodiments, the shapes of the hollow areas 200 in different areas of the same carrying tray 2 can also be different, such as the shapes of the hollow areas 200 in some areas are square, which can carry Figure 1 The hollow regions 200 of the other regions of the carrier 1 are circular in shape, which can support Fig. 9 The hollow regions 200 of the other regions of the carrier 1 are in the shape of diamonds, which can support Fig.13 The carrier 1 is shown.

[0059] In some embodiments of the present invention, Figure 2 As shown, the outer side of the carrier 1 has a slot 11. It is understandable that the slot 11 is located on the outer side of the carrier 1 and is arranged around the carrier 1. The upper and lower parts of the slot 11 protrude outward, so that the slot 11 is used to snap and fix the carrier 1 in the hollow area 200 of the carrier tray 2, and the bottom plate 20 is snapped and fixed in the slot 11, so that the carrier 1 cannot move up and down, and at the same time, a preset distance is made between the bottom plate 20 and the bottom of the carrier 1, that is, a preset distance is made between the bottom plate 20 and the surface of the tin liquid 4, so as to prevent the tin liquid 4 from contacting the bottom plate 20 and causing it to deform. It should be noted that the distance D1 between the slot 11 and the bottom of the carrier 1 can be preset according to actual conditions, and it should also be noted that the side wall of the carrier slot 10 has a certain thickness L, so that after the carrier 1 is combined with the carrier tray 2, the bottom plate 20 of the carrier tray 2 has a certain hardness to avoid its deformation caused by high temperature.

[0060] In some embodiments of the present invention, Figure 1As shown, the carrier 1 further has a positioning portion 12. Optionally, the positioning portion 12 is located on the side of the top of the carrier slot 10, that is, the top side of the carrier slot 10 has a protrusion protruding outward, and the positioning portion 12 is used to fix the carrier 1 in the hollow area 200 in a preset direction. Figure 4 As shown, one side of the hollow area 200 also has a protrusion 26 extending outward to accommodate the positioning portion 12 so that the carrier 1 is fixed in the hollow area 200 in a preset direction.

[0061] Of course, in other embodiments of the present invention, if the shape of the carrier 1 itself can determine its installation direction, such as Fig.13 As shown, the installation direction can be determined according to the shapes of the through hole 100 and the corners, and the carrier 1 may not have the positioning portion 12.

[0062] In some embodiments of the present invention, Figure 2 As shown, the opening width L2 of the top of the bearing groove 10 is greater than the opening width L1 of the bottom of the bearing groove 10 , so that the operator can smoothly insert the component 3 to be tinned into the bearing groove 10 .

[0063] In some embodiments of the present invention, Figure 2 As shown, there is an arc-shaped transition surface S between the outer side surface and the bottom surface of the carrier 1 to reduce the adhesion phenomenon that occurs when the carrier 1 leaves the tin surface of the high-temperature tin liquid.

[0064] In some embodiments of the present invention, Figure 5 As shown, the carrying tray 2 also has at least one pair of side walls 21 , and reinforcing ribs 23 are provided between the side walls 21 and the bottom plate 20 to ensure that the bottom plate 20 will not be deformed due to long-term high-temperature use.

[0065] In some embodiments of the present invention, Figure 4 and Figure 6 As shown, the side wall 21 has a positioning support portion 24 on the top and a positioning groove 25 on the bottom. The positioning support portion 24 and the positioning groove 25 are used to support and position the upper and lower carrying trays 2 when multiple carrying trays 2 are stacked.

[0066] The embodiment of the present invention further provides a tinning method, which is applied to the tinning device provided in any of the above embodiments. Fig.18 As shown, the tinning method includes:

[0067] S101: inserting the component to be tinned into the bearing slot of the bearing body, and passing the lead of the component to be tinned through the through hole;

[0068] like Figure 7As shown, the component to be tinned 3 is inserted into the bearing groove 10 of the carrier 1, and the lead 30 of the component to be tinned 3 passes through the through hole 100, that is, the lead 30 is inserted into and passes through the through hole 100. It should be noted that the top of the component to be tinned 3 is higher than the top of the bearing groove 10, so that after the tinning is completed, it is easy to take the component to be tinned 3 out of the bearing groove 10.

[0069] S102: inserting a plurality of carriers into the hollow area of ​​the carrier tray, and passing the carriers through the front side of the base plate to the back side of the base plate, so that the carriers and leads of the components to be tinned are exposed from the back side of the base plate;

[0070] like Figure 8 As shown, a plurality of carriers 1 carrying components 3 to be tinned are inserted into the hollow area 200 of the carrier tray 2, and the carriers 1 are passed through from the front side of the base plate 20 to the back side of the base plate 20, so that the carriers 1 and the leads 30 of the components 3 to be tinned are exposed from the back side of the base plate 20.

[0071] S103: Place the carrier tray on the top of the tin liquid, and immerse the exposed leads on the back of the base plate into the tin liquid for tinning.

[0072] Afterwards, if Figure 8 As shown, a carrier tray 2 carrying a plurality of carriers 1 is placed on top of the tin liquid 4, and the leads 30 exposed on the back of the base plate 20 are immersed in the tin liquid 4 for tinning, so that the leads 30 of a plurality of components 3 to be tinned can be tinned at the same time, thereby improving the efficiency of tinning.

[0073] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0074] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A tinning device, characterized in that: include: A plurality of carriers, each of which has a carrier groove, and the bottom of each carrier groove has at least one through hole, wherein the carrier groove is used to accommodate the components to be tinned, and the leads of the components to be tinned pass through the through hole; A carrier tray, the carrier tray having a bottom plate, the bottom plate having a plurality of hollow areas, the plurality of hollow areas being arranged in an array; the hollow areas are used to accommodate a carrier, and the carrier is passed through from the front side of the bottom plate to the back side of the bottom plate, so that the carrier and the leads of the components to be tinned are exposed from the back side of the bottom plate; Wherein, the hardness of the carrying tray is greater than the hardness of the carrying body; and the high temperature resistance of the carrying body is greater than the high temperature resistance of the carrying tray.

2. The tinning device according to claim 1, characterized in that: The material of the carrier is silica gel; the material of the carrier tray is bakelite board or fiberglass board.

3. The tinning device according to claim 1, characterized in that: The outer side of the carrier has a slot; the slot is used to snap and fix the carrier to the hollow area of ​​the carrier tray, and snap and fix the bottom plate in the slot, so that there is a preset distance between the bottom plate and the bottom of the carrier.

4. The tinning device according to claim 1, characterized in that: The carrier also has a positioning portion; the positioning portion is used to fix the carrier in the hollow area toward a preset direction.

5. The tinning device according to claim 1, characterized in that: The opening width of the top of the bearing groove is greater than the opening width of the bottom of the bearing groove.

6. The tinning device according to claim 1, characterized in that: An arc-shaped transition surface is formed between the outer side surface and the bottom surface of the carrier.

7. The tinning device according to claim 1, characterized in that: The carrying tray also has at least one pair of side walls, and reinforcing ribs are provided between the side walls and the bottom plate.

8. The tinning device according to claim 7, characterized in that: The top of the side wall is provided with a positioning support portion, and the bottom of the side wall is provided with a positioning groove. The positioning support portion and the positioning groove are used to achieve support and positioning between upper and lower carrying trays when a plurality of the carrying trays are stacked.

9. The tinning device according to claim 1, characterized in that: The shape of the carrier is round, square or diamond; The shape of the hollow area is the same as the shape of any of the carriers.

10. A tinning method, characterized in that: The tinning device according to any one of claims 1 to 9 is applied, and the method comprises: Insert the component to be tinned into the bearing groove of the bearing body, and make the lead wire of the component to be tinned pass through the through hole; Inserting a plurality of the carriers into the hollow area of ​​the carrier tray, and allowing the carriers to pass through from the front side of the bottom plate to the back side of the bottom plate, so that the carriers and the leads of the components to be tinned are exposed from the back side of the bottom plate; The carrying tray is placed on the top of the tin liquid, and the lead wires exposed on the back side of the bottom plate are immersed in the tin liquid for tinning.

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