Transfer Device and Transfer Method

Abstract

The present invention provides a transfer device and a transfer method for transferring a chip provided on a transfer substrate to a substrate to be transferred. The transfer device includes: a first stage for supporting the substrate to be transferred; a second stage for supporting the transfer substrate such that the transfer substrate faces the substrate to be transferred and is spaced apart from the substrate to be transferred; a laser irradiation unit at least a part of which is spaced apart from the second stage in a direction in which the transfer substrate and the substrate to be transferred face each other to irradiate a laser beam onto the transfer substrate; and a moving unit for supporting the laser irradiation unit and moving the laser irradiation unit in a state where the laser beam is irradiated.

Description

Technical Field

[0001] The present invention relates to a transfer device and a transfer method, and more particularly, to a transfer device and a transfer method capable of improving the accuracy of a transfer process by dropping a chip at an accurate position. Background Art

[0002] Generally, a micro light emitting diode (LED) represents an LED in which the size of one side is equal to or less than 100 μm. Since the micro LED has a small size, the micro LED has a smaller heat generation amount and power consumption amount than a general LED and a larger energy efficiency than a general LED.

[0003] In order to apply the micro LED to a display device, a technique of transferring a chip in which the micro LED is formed to each pixel of a substrate for a display panel has been used. Transfer is a process of irradiating a chip formed on a wafer with a laser beam to drop the chip and transferring the chip to glass below the wafer.

[0004] However, the alignment between the wafer and the glass is a complex process. Therefore, when the transfer process is performed, the alignment between the wafer and the glass may be distorted. As a result, the chip may be transferred to an incorrect position, thereby causing a defect.

[0005] [Patent Document]

[0006] (Patent Document 1) KR 10-2019-0079147 A Summary of the Invention

[0007] The present invention provides a transfer device and a transfer method capable of improving the accuracy of a transfer process by dropping a chip at an accurate position.

[0008] The present invention also provides a transfer device and a transfer method capable of shortening a process time by separately driving a stage for supporting a substrate to be transferred and a stage for supporting a transfer substrate.

[0009] According to an exemplary embodiment, a transfer device for transferring a chip provided on a transfer substrate to a substrate to be transferred (hereinafter, referred to as a transferred substrate) includes: a first stage configured to support the transferred substrate; a second stage configured to support the transfer substrate such that the transfer substrate faces the transferred substrate and is spaced apart from the transferred substrate; a laser irradiation unit at least a part of which is spaced apart from the second stage in a direction in which the transfer substrate and the transferred substrate face each other to irradiate a laser beam onto the transfer substrate; and a moving unit configured to support the laser irradiation unit and move the laser irradiation unit in a state in which the laser beam is irradiated.

[0010] In an exemplary embodiment, the moving unit may include: a path member extending in a direction crossing the direction in which the transfer substrate and the substrate to be transferred face each other; and a moving member connected to the laser irradiation unit and mounted to be linearly movable along the extending direction of the path member.

[0011] In an exemplary embodiment, the transfer device may further include: a first driving unit configured to support the first stage and move the first stage in multiple directions; and a second driving unit configured to support the second stage and move the second stage independently of the first stage in multiple directions.

[0012] In an exemplary embodiment, the laser irradiation unit may include: a laser generator configured to generate a laser beam; an angle adjuster disposed between the laser generator and the second stage to adjust the irradiation direction of the laser beam; a shape adjuster disposed between the laser generator and the angle adjuster to adjust the shape of the laser beam irradiated onto the transfer substrate; and a housing configured to support the laser generator, the angle adjuster, and the shape adjuster and movable by the moving unit.

[0013] In an exemplary embodiment, the shape adjuster may include: a mask member having a plurality of pattern holes; and a selection member configured to support the mask member and move the mask member in multiple directions to select a pattern hole through which the laser beam passes among the plurality of pattern holes.

[0014] In an exemplary embodiment, the mask member may further be provided with alignment holes, and the transfer device may further include: a photographing unit configured to photograph the shape and position of the laser beam passing through the alignment holes, the shape and the position being irradiated onto at least one of the transfer substrate and the substrate to be transferred; and an alignment unit connected to the photographing unit to adjust the alignment state of each of the transfer substrate and the substrate to be transferred according to the irradiated shape and position of the laser beam passing through the alignment holes.

[0015] In an exemplary embodiment, the second stage may be moved into and out of the space between the laser irradiation unit and the first stage, and the alignment unit may adjust the alignment state of the substrate to be transferred and then adjust the alignment state of the transfer substrate.

[0016] In an exemplary embodiment, the area of the transferred substrate may be larger than the area of the transfer substrate, and a part of the laser beam passing through the alignment holes may irradiate the transfer substrate, and another part of the laser beam may irradiate the transferred substrate through the second stage.

[0017] According to another exemplary embodiment, a transfer method includes: supporting a transferred substrate by a first stage; supporting a transfer substrate provided with chips by a second stage and arranging the transfer substrate to face the transferred substrate; while moving a laser irradiation unit configured to irradiate a laser beam, irradiating the laser beam onto the transfer substrate; and transferring the chips to the transferred substrate by dropping the chips provided on the transfer substrate by using the laser beam.

[0018] In an exemplary embodiment, a plurality of the chips may be provided, and the plurality of chips may be arranged in an array type. The irradiating the laser beam while moving the laser irradiation unit may include: generating a laser beam; and linearly moving the laser irradiation unit in one direction.

[0019] In an exemplary embodiment, linearly moving the laser irradiation unit may include appropriately irradiating the laser beam onto the transfer substrate until the time when the laser beam moving in the one direction reaches each of the chips spaced apart from each other in the one direction.

[0020] In an exemplary embodiment, supporting the transferred substrate by the first stage may include: irradiating alignment laser onto the transferred substrate; and adjusting the alignment state of the transferred substrate by moving the first stage according to at least one of the irradiation shape and the irradiation position of the alignment laser. Supporting the transfer substrate attached with the chips by the second stage may include: irradiating the alignment laser onto the transfer substrate attached with the chips; and adjusting the alignment state of the transfer substrate by moving the second stage according to at least one of the irradiation shape and the irradiation position of the alignment laser.

[0021] In an exemplary embodiment, adjusting the alignment state according to the irradiation shape and the irradiation position of the alignment laser may include adjusting the horizontal alignment state of the transfer substrate or the transferred substrate.

[0022] In an exemplary embodiment, marks may be formed in the transfer substrate and the transferred substrate, and adjusting the alignment state according to the irradiation shape and the irradiation position of the alignment laser may include adjusting the planar alignment state of the transfer substrate or the transferred substrate such that the marks are disposed at positions corresponding to the irradiation positions of the alignment laser.

[0023] In an exemplary embodiment, the transfer substrate supporting the chip through the second stage may include moving the second stage to be disposed between the laser irradiation unit and the first stage, and adjusting the alignment state of the substrate to be transferred may be performed before moving the second stage to be disposed between the laser irradiation unit and the first stage.

[0024] In an exemplary embodiment, irradiating the alignment laser may include: generating a plurality of alignment lasers; and irradiating a part of the plurality of alignment lasers onto the transfer substrate and irradiating another part onto the substrate to be transferred through the second stage. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The exemplary embodiments may be understood in more detail by reading the following description in conjunction with the accompanying drawings, in which:

[0026] Figure 1 is a perspective view showing a transfer device according to an exemplary embodiment.

[0027] Figure 2 is a perspective view showing the structure of a first stage and a first driving unit according to an exemplary embodiment.

[0028] Figure 3 is a perspective view showing the structure of a second stage and a second driving unit according to an exemplary embodiment.

[0029] Figure 4 is a cross-sectional view showing the structure of a laser irradiation unit according to an exemplary embodiment.

[0030] Figure 5 is a perspective view showing the structure of a shape adjuster according to an exemplary embodiment.

[0031] Figure 6 is a view showing the structure for adjusting the alignment of a transfer substrate according to an exemplary embodiment.

[0032] Figure 7 is a view showing the structure of a laser irradiation unit and a moving unit according to an exemplary embodiment.

[0033] Figure 8 is a flowchart showing a transfer method according to an exemplary embodiment.

[0034] DESCRIPTION OF SYMBOLS

[0035] 100: Transfer device

[0036] 110: First stage

[0037] 120: Second stage

[0038] 130: Laser irradiation unit

[0039] 131: Laser generator

[0040] 132: Angle adjuster

[0041] 133: Shape adjuster

[0042] 133a: Mask member

[0043] 133b: Selection member

[0044] 134: Housing

[0045] 140: Moving unit

[0046] 141: Path member

[0047] 142: Moving member

[0048] 143: Support member

[0049] 150: First driving unit

[0050] 151: First front - rear guide rail

[0051] 152: First front - rear driving member

[0052] 153: First left - right guide rail

[0053] 154: First left - right driving member

[0054] 155: First vertical driving member

[0055] 160: Second driving unit

[0056] 161: Second front - rear guide rail

[0057] 162: Second front - rear driving member

[0058] 163: Second left - right guide rail

[0059] 180: Shooting unit

[0060] 190: Alignment unit

[0061] G: Substrate to be transferred

[0062] h1: Pattern hole

[0063] h2: Alignment hole

[0064] S110, S120, S130, S140: Processes

[0065] W: Transfer substrate Detailed implementation manner

[0066] In the following, specific embodiments will be described in detail with reference to the accompanying drawings. However, the present invention can be implemented in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this invention will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. In the figures, the same reference numerals always refer to the same elements.

[0067] Figure 1 is a perspective view showing a transfer device according to an exemplary embodiment, Figure 2 is a perspective view showing the structure of a first stage and a first driving unit according to an exemplary embodiment, and Figure 3 is a perspective view showing the structure of a second stage and a second driving unit according to an exemplary embodiment. In the following, a transfer device according to an exemplary embodiment will be described.

[0068] Referring to Figures 1 to 3 , a transfer device according to an exemplary embodiment is a transfer device that transfers a chip attached to a transfer substrate to a substrate to be transferred (hereinafter referred to as a substrate to be transferred). The transfer device 100 includes a first stage 110, a second stage 120, a laser irradiation unit 130, and a moving unit 140.

[0069] Here, the chip may be a micro light-emitting diode (LED). The transfer substrate W may be a wafer on which a plurality of chips are arranged and attached in an array type. The chips may be directly formed on the transfer substrate W, or chips formed on a separate substrate may be attached to the transfer substrate W. Accordingly, the chips may be provided on the transfer substrate W. The substrate to be transferred G may be glass. However, the exemplary embodiments of the present invention are not limited to the materials of each of the transfer substrate W and the substrate to be transferred G. For example, each of the transfer substrate W and the substrate to be transferred G may include various materials.

[0070] The first stage 110 supports the substrate to be transferred G, as Figure 2 shown. For example, the first stage 110 may have a rectangular plate shape. Accordingly, the substrate to be transferred G may be located on the top surface of the first stage 110 and supported by the top surface of the first stage 110.

[0071] In addition, the top surface of the first stage 110 may have an area larger than the bottom surface of the substrate to be transferred G. Accordingly, the entire bottom surface of the substrate to be transferred G may contact the top surface of the first stage 110 and be stably located on the top surface of the first stage 110. However, the exemplary embodiments are not limited to the structure and shape of the first stage 110.

[0072] The second stage 120 supports the transfer substrate W, as Figure 3As shown. The second stage 120 can be spaced upward relative to the first stage 110 to face the first stage 110. Thus, when the transfer substrate W is supported by the second stage 120, the transfer substrate W can be spaced apart from the transfer substrate G located on the first stage 110 in the vertical direction to face the transfer substrate G. Therefore, the top surface of the transfer substrate G can face the bottom surface of the transfer substrate W.

[0073] In addition, the second stage 120 can have a rectangular plate shape. An opening can be defined at the center portion of the second stage 120. The second stage 120 can have an area larger than that of the transfer substrate W, and the opening can have an area smaller than that of the transfer substrate W. Thus, the transfer substrate W can contact the second stage 120 without passing through the opening.

[0074] Here, an adsorber (not shown in the figure) can be provided at the lower portion of the second stage 120. The adsorber can be installed to surround at least a part of the circumference of the opening. The transfer substrate W can be adsorbed to the lower portion of the second stage 120 by the adsorber and supported by the second stage 120, and a part of the top surface of the transfer substrate W can be exposed to the outside through the opening of the second stage 120. Thus, the laser irradiation unit 130 disposed above the second stage 120 can irradiate the top surface of the transfer substrate W with a laser beam through the opening. However, the exemplary embodiments are not limited to the shape of the second stage 120 and the method of supporting the transfer substrate W. For example, the second stage 120 can have various shapes, and the transfer substrate W can be supported by various methods.

[0075] The transfer device 100 can further include a first driving unit 150 and a second driving unit 160. The first stage 110 and the second stage 120 can be moved independently by the first driving unit 150 and the second driving unit 160.

[0076] Referring to Figure 2 , the first driving unit 150 can be connected to the first stage 110. The first driving unit 150 can support the first stage 110 and move the first stage 110 in multiple directions. The first driving unit 150 can include a first front-rear guide rail 151, a first front-rear driving member 152, a first left-right guide rail 153, a first left-right driving member 154, a first vertical driving member 155, and a first rotating member (not shown in the figure).

[0077] The first front-rear guide rail 151 can extend in the front-rear direction. The first front-rear guide rail 151 provides a moving path for the first front-rear driving member 152. The first front-rear guide rails 151 can be provided in pairs, and a pair of first front-rear guide rails 151 can be spaced apart from each other in the left-right direction.

[0078] The first front-back driving member 152 can be installed to be movable on the first front-back guide rail 151. The first front-back driving member 152 can move in the front-back direction along the extending direction of the first front-back guide rail 151. The first front-back driving members 152 can be provided in pairs, and a pair of first front-back driving members 152 can be installed to be movable on the pair of first front-back guide rails 151 respectively. Therefore, the first left-right guide rail 153 can be installed on the pair of first front-back driving members 152 and stably supported by the pair of first front-back driving members 152.

[0079] The first left-right guide rail 153 can extend in the left-right direction crossing the extending direction of the first front-back guide rail 151. The first left-right guide rail 153 provides a moving path for the first left-right driving member 154. The first left-right guide rail 153 can be installed on the first front-back driving member 152 and supported by the first front-back driving member 152. For example, the first left-right guide rail 153 can have an extending length in the left-right direction equal to or greater than the interval length between the first front-back driving members 152. Therefore, both ends of the first left-right guide rail 153 can be supported by the first front-back driving members 152 respectively. When the first front-back driving member 152 moves in the front-back direction, the first left-right guide rail 153 can also move in the front-back direction.

[0080] The first left-right driving member 154 can be installed to be movable on the first left-right guide rail 153. The first left-right driving member 154 can move in the left-right direction along the extending direction of the first left-right guide rail 153. Since the first left-right driving member 154 is supported by the first left-right guide rail 153, when the first left-right guide rail 153 moves in the front-back direction through the first front-back driving member 152, the first left-right driving member 154 can also move in the front-back direction.

[0081] The first vertical driving member 155 can be installed on the first left-right driving member 154. The first vertical driving member 155 can have a lower end connected to the first left-right driving member 154 and an upper end connected to the first stage 110. At least a part of the first vertical driving member 155 can extend or contract in the vertical direction. Therefore, the first stage 110 can move vertically by the operation of the first vertical driving member 155.

[0082] In addition, a plurality of first vertical driving members 155 can be provided. The first vertical driving members 155 can be respectively connected to different parts of the lower portion of the first stage 110. Therefore, when the heights of the first vertical driving members 155 are adjusted differently, the inclination of the first stage 110 can be adjusted.

[0083] Here, since the first vertical driving member 155 is supported by the first left - right driving member 154, when the first left - right driving member 154 moves in the left - right direction, the first vertical driving member 155 and the first stage 110 can also move in the left - right direction. When the first left - right driving member 154 moves in the front - rear direction through the first front - rear driving member 152, the first vertical driving member 155 and the first stage 110 can also move in the front - rear direction. Therefore, the position of the transferred substrate G located on the first stage 110 can be adjusted in multiple directions.

[0084] The first rotating member can be mounted on the first vertical driving member 155. The first rotating member can rotate the first vertical driving member 155. Therefore, when the first rotating member rotates the first vertical driving member 155, the first stage 110 can rotate. Accordingly, the transferred substrate G located on the first stage 110 can also rotate. However, the exemplary embodiments are not limited to the operation structure and connection method of the components of the first driving unit 150. For example, the components of the first driving unit 150 can have various operation structures and various connection methods.

[0085] Referring to Figure 3 , the second driving unit 160 can be connected to the second stage 120. The second driving unit 160 can support the second stage 120 and move the second stage 120 in multiple directions independently of the first stage 110. The second driving unit 160 can include a second front - rear guide rail 161, a second front - rear driving member 162, a second left - right guide rail 163, a second left - right driving member (not shown in the figure), a second vertical driving member (not shown in the figure), and a second rotating member (not shown in the figure).

[0086] The second front - rear guide rail 161 can extend in the front - rear direction. The second front - rear guide rail 161 provides a movement path for the second front - rear driving member 162. A pair of second front - rear guide rails 161 can be provided, and they are spaced apart from each other in the left - right direction. For example, the spacing distance between the pair of second front - rear guide rails 161 can be greater than the spacing distance between the pair of first front - rear guide rails 151. Therefore, the first front - rear guide rails 151 can be provided between the second front - rear guide rails 161.

[0087] Here, the top surface of the second front - rear guide rail 161 can be provided above the top surface of the first front - rear guide rail 151. Therefore, the second stage 120 can be provided above the first stage 110 through the second front - rear guide rail 161. However, the exemplary embodiments are not limited to the structure of the second front - rear guide rail 161. For example, the second front - rear guide rail 161 can have various structures.

[0088] The second front-back driving member 162 can be installed to be movable on the second front-back guide rail 161. The second front-back driving member 162 can move in the front-back direction along the extending direction of the second front-back guide rail 161. A pair of second front-back driving members 162 can be provided and installed to be movable on a pair of second front-back guide rails 161 respectively. Accordingly, the second left-right guide rail 163 can be installed on the pair of second front-back driving members 162 and stably supported by the pair of second front-back driving members 162.

[0089] The second left-right guide rail 163 can extend in the left-right direction intersecting with the extending direction of the second front-back guide rail 161. The second left-right guide rail 163 provides a moving path for the second left-right driving member. The second left-right guide rail 163 can be installed on the second front-back driving member 162 and supported by the second front-back driving member 162. For example, the second left-right guide rail 163 can have an extending distance in the left-right direction equal to or greater than the interval distance between the second front-back driving members 162. Accordingly, both ends of the second left-right guide rail 163 can be supported by the second front-back driving members 162 respectively. Thus, when the second front-back driving member 162 moves in the front-back direction, the second left-right guide rail 163 can also move in the front-back direction.

[0090] In addition, a hole can be defined at the central portion of the second left-right guide rail 163. Accordingly, the transfer substrate W adsorbed to the second stage 120 can directly face the substrate G to be transferred below through the hole defined in the second left-right guide rail 163. However, the exemplary embodiment is not limited to the structure and shape of the second left-right guide rail 163. For example, the second left-right guide rail 163 can have various structures and shapes.

[0091] The second left-right driving member can be installed to be movable on the second left-right guide rail 163. The second left-right driving member can move in the left-right direction along the extending direction of the second left-right guide rail 163. Since the second left-right driving member is supported by the second left-right guide rail 163, when the second left-right guide rail 163 moves in the front-back direction through the second front-back driving member 162, the second left-right driving member can also move in the front-back direction.

[0092] In addition, a hole can be defined at the central portion of the second left-right driving member. Accordingly, the transfer substrate W adsorbed to the second stage 120 can directly face the substrate G to be transferred below through the hole defined in the second left-right driving member. However, the exemplary embodiment is not limited to the structure and shape of the second left-right driving member. For example, the second left-right driving member can have various structures and shapes.

[0093] The second vertical driving member may be installed between the second left - right driving member and the second stage 120. The second vertical driving member may have a lower end connected to the top surface of the second left - right driving member and an upper end connected to the bottom surface of the second stage 120. At least a part of the second vertical driving member may expand or contract in the vertical direction. Accordingly, the second stage 120 may move vertically by the operation of the second vertical driving member.

[0094] In addition, a plurality of second vertical driving members may be provided. The second vertical driving members may be respectively connected to different parts of the lower portion of the second stage 120. Accordingly, when the heights of the second vertical driving members are adjusted differently, the inclination of the second stage 120 may be adjusted.

[0095] Here, since the second vertical driving member is supported by the second left - right driving member, when the second left - right driving member moves in the left - right direction, the second vertical driving member and the second stage 120 may also move in the left - right direction. When the second left - right driving member moves in the front - rear direction by the second front - rear driving member, the second vertical driving member and the second stage 120 may also move in the front - rear direction. Accordingly, the position of the transfer substrate W adsorbed to the second stage 120 may be adjusted in multiple directions.

[0096] The second rotating member may be installed on the second vertical driving member. The second rotating member may rotate the second vertical driving member. Accordingly, when the second rotating member rotates the second vertical driving member, the second stage 120 may rotate. Accordingly, the transfer substrate W adsorbed to the second stage 120 may also rotate. However, the exemplary embodiments are not limited to the operation structure and connection method of the components of the second driving unit 160. For example, the components of the second driving unit 160 may have various operation structures and various connection methods.

[0097] As described above, the first stage 110 and the second stage 120 may be moved independently. Accordingly, when performing an operation of allowing the transfer substrate G to be supported by the first stage 110 and an operation of allowing the transfer substrate W to be supported by the second stage 120, the first stage 110 and the second stage 120 may be moved independently. Accordingly, by shortening the time for transferring the transfer substrate G and the transfer substrate W to the process position, the process efficiency may be improved.

[0098] In addition, since the first stage 110 and the second stage 120 are moved independently, the alignment state between the transfer substrate W and the transfer substrate G may be adjusted independently. Accordingly, when at least one of the transfer substrate W and the transfer substrate G has a defective alignment state, the defective alignment state may be easily adjusted only.

[0099] Figure 4 is a cross - sectional view showing the structure of a laser irradiation unit according to an exemplary embodiment, Figure 5is a perspective view showing the structure of a shape adjuster according to an exemplary embodiment, and Figure 6 is a view showing the structure for adjusting the alignment of a transfer substrate according to an exemplary embodiment. Hereinafter, a laser irradiation unit according to an exemplary embodiment will be described in detail.

[0100] Referring to Figure 4 , at least a part of the laser irradiation unit 130 may be spaced upward from the second stage 120 in a direction in which the transfer substrate G and the transfer substrate W face each other (or, the vertical direction). Accordingly, the position of the laser irradiation unit 130 may be separately adjusted from the first stage 110 or the second stage 120, and the laser irradiation unit 130 may irradiate the transfer substrate W supported by the second stage 120 with a laser beam. The laser irradiation unit 130 includes a laser generator 131, an angle adjuster 132, a shape adjuster 133, and a housing 134.

[0101] The laser generator 131 is configured to generate a laser beam. When the laser generator 131 generates a laser beam, by using an optical device (not shown in the figure), the laser beam may have a line beam shape extending in the left-right direction.

[0102] The angle adjuster 132 may be disposed between the laser generator 131 and the second stage 120. The angle adjuster 132 may be a mirror that reflects the laser beam. That is, the angle adjuster 132 may adjust the irradiation direction of the laser beam. Accordingly, the laser beam moving in the front-rear direction in the housing 134 may be reflected by the angle adjuster 132 and irradiated downward. Accordingly, the laser beam may be irradiated toward the second stage 120 below the laser irradiation unit 130.

[0103] The shape adjuster 133 may be disposed between the laser generator 131 and the angle adjuster 132. Accordingly, the line beam-shaped laser beam moving from the laser generator 131 to the angle adjuster 132 may pass through the shape adjuster 133. Accordingly, the shape of the line beam-shaped laser beam passing through the shape adjuster 133 may be adjusted, and then the laser beam having the adjusted shape may be irradiated onto the transfer substrate W. The shape adjuster 133 may include a mask member 133a and a selection member 133b, as Figure 5 shown.

[0104] The mask member 133a may have a plate shape and include a plurality of pattern holes h1 through which the laser beam passes. A part of the laser beam moving from the laser generator 131 to the mask member 133a may pass through the pattern holes h1 and another part may not pass through the pattern holes h1. Accordingly, the shape of the laser beam irradiated onto the transfer substrate W may have a pattern according to the shape of the pattern holes h1. Accordingly, the line beam-shaped laser beam may be irradiated onto the transfer substrate W in a plurality of dot shapes spaced apart from each other in the left-right direction through the mask member 133a.

[0105] Here, the pattern holes h1 may have different shapes and sizes according to their positions. For example, the pattern holes h1 having the same shape may be spaced apart from each other in the left - right direction to form a line, and the lines including the pattern holes h1 having different shapes or sizes may be spaced apart from each other in the vertical direction. Accordingly, a line - shaped laser beam extending in the left - right direction may pass through one of the lines of the mask member 133a. Therefore, the shape or size of the laser beam irradiated onto the transfer substrate W may be determined according to the shape or size of the pattern holes h1 of the line of the mask member 133a.

[0106] In addition, the mask member 133a may further include alignment holes h2. The alignment holes h2 may be provided in plurality. The pattern holes h1 may be provided at the central portion of the mask member 133a, and the plurality of alignment holes h2 may be provided at the outer portion of the mask member 133a surrounding the central portion. Each of the alignment holes h2 may have a cross shape. Accordingly, the laser beam passing through the alignment holes h2 may become an alignment laser and be displayed as a cross shape on the surface of the transfer substrate W or the substrate G to be transferred. Therefore, the alignment state of the transfer substrate W or the substrate G to be transferred may be adjusted by using the displayed shape or position of the alignment laser as a reference. However, the exemplary embodiments are not limited to the shape of the alignment holes h2. For example, the alignment holes h2 may have various shapes.

[0107] The selection member 133b may support the mask member 133a. The selection member 133b may move the mask member 133a in a plurality of directions to select the line of the mask member 133a through which the laser beam passes among the plurality of pattern holes h1. The selection member 133b may select the pattern holes h1 through which the laser beam passes according to the shape, size, or arrangement method of the chip attached to the transfer substrate W in the left - right direction.

[0108] For example, the selection member 133b may include a front - rear driving body, a left - right driving body, a vertical driving body, and a rotational driving body. Accordingly, the selection member 133b may adjust the vertical direction, the front - rear direction, the left - right direction, and the inclination of the mask member 133a. When the position of the mask member 133a is adjusted, the pattern holes h1 of the line through which the laser beam passes may be selected, and thus the shape or size of the laser beam may be selected.

[0109] The housing 134 has an inner space for accommodating and supporting the laser generator 131, the angle adjuster 132, and the shape adjuster 133 therein. The housing 134 may be connected to the moving unit 140, and the entire housing 134 may be moved by the moving unit 140. Accordingly, when the housing 134 moves, all of the laser generator 131, the angle adjuster 132, and the shape adjuster 133 may also move.

[0110] In addition, the housing 134 may be disposed above the second stage 120. The housing 134 may extend in the front-rear direction. The laser generator 131, the angle adjuster 132, and the shape adjuster 133 may be spaced apart from each other in the front-rear direction in the housing 134. Accordingly, the laser beam generated in the laser generator 131 may move in the front-rear direction in the housing 134.

[0111] Here, an opening may be defined in a part of the housing 134 facing the second stage 120. Accordingly, the laser beam reflected by the angle adjuster 132 may be irradiated toward the second stage 120 through the opening. However, the exemplary embodiments are not limited to the structure and shape of the housing 134. For example, the housing may have various structures and shapes.

[0112] Figure 6 The transfer device 100 in may further include a photographing unit 180 and an alignment unit 190. The operation of adjusting the alignment state between the transfer substrate W and the substrate G to be transferred may be performed by using the photographing unit 180 and the alignment unit 190.

[0113] The photographing unit 180 may be a camera. The photographing unit 180 may be disposed above the second stage 120. Accordingly, the photographing unit 180 may photograph the laser beam irradiated onto the surface of the transfer substrate W or the substrate G to be transferred. In addition, the photographing unit 180 may check the position or shape of the laser beam irradiated onto the transfer substrate W or the substrate G to be transferred.

[0114] The alignment unit 190 is connected to the photographing unit 180. The alignment unit 190 may adjust the alignment state between the transfer substrate W and the substrate G to be transferred according to the position or shape of the laser beam passing through the alignment hole h2 and irradiated onto the transfer substrate W or the substrate G to be transferred.

[0115] For example, in the case of adjusting the alignment state according to the irradiation shape of the alignment laser, the irradiation shape of the alignment laser may be checked. Accordingly, when the alignment laser having a cross shape is distorted in shape, the horizontal state between the transfer substrate W and the substrate G to be transferred may be determined as defective. Accordingly, the horizontal alignment state between the transfer substrate W and the substrate G to be transferred may be adjusted by adjusting the horizontal state of the first stage 110 or the second stage 120 such that the shape of the alignment laser is displayed without being distorted.

[0116] In the case of adjusting the alignment state according to the irradiation position of the alignment laser, the irradiation position of the alignment laser can be checked. In addition, marks corresponding to the shape of the alignment laser can be formed on the transfer substrate W and the substrate G to be transferred. Therefore, when the position of the alignment laser does not correspond to (or does not coincide with) the position of the mark, the alignment state between the transfer substrate W and the substrate G to be transferred in the X-Y plane can be determined as defective. Therefore, the planar alignment state between the transfer substrate W and the substrate G to be transferred can be adjusted by moving the first stage 110 or the second stage 120 in the front-rear direction and the left-right direction so that the mark corresponds to (or coincides with) the irradiation position of the alignment laser.

[0117] Here, the second stage 120 can be moved into or out of the space between the laser irradiation unit 130 and the first stage 110 by the second driving unit 160. When the second stage 120 is disposed between the laser irradiation unit 130 and the first stage 110, the alignment laser may not irradiate the substrate G to be transferred on the first stage 110. Therefore, the alignment unit 190 can adjust the alignment state of the substrate G to be transferred in a state where the second stage 120 is moved out of the space between the laser irradiation unit 130 and the first stage 110, and then adjust the alignment state of the transfer substrate W by moving the second stage 120 to be disposed between the laser irradiation unit 130 and the first stage 110.

[0118] In addition, the substrate G to be transferred may have a larger area than the transfer substrate W. A transmission window (not shown in the figure) can be formed in the second stage 120 so that the alignment laser passes through the transmission window. The transmission window can surround at least a part of the outer circumference of the transfer substrate W. Therefore, a part of the plurality of alignment lasers can irradiate the transfer substrate W, and another part of the plurality of alignment lasers can irradiate the substrate G to be transferred through the second stage 120. Therefore, the alignment states of both the transfer substrate W and the substrate G to be transferred can be adjusted simultaneously.

[0119] Figure 7 is a view showing the structure of a laser irradiation unit and a moving unit according to an exemplary embodiment. Hereinafter, the moving unit according to the exemplary embodiment will be described in detail.

[0120] Referring to Figure 4 and Figure 7 , the moving unit 140 can support the laser irradiation unit 130. The moving unit 140 can adjust the irradiation position of the laser beam by moving the laser irradiation unit 130 in a state where the laser beam is irradiated. Therefore, in a state where the first stage 110 and the second stage 120 are stopped, the transfer substrate W and the substrate G to be transferred can be fixed in appropriate positions, and the moving unit 140 can move the laser irradiation unit 130 to scan the transfer substrate W by using the laser beam. The moving unit 140 includes a path member 141 and a moving member 142.

[0121] The path member 141 can extend in a direction (or the front-rear direction) that intersects with the direction in which the transfer substrate W faces the substrate G to be transferred (or the vertical direction). The path member 141 provides a movement path for the moving member 142. A pair of path members 141 can be provided and are spaced apart from each other in the left-right direction.

[0122] Here, the moving unit 140 can further include a support member 143. The support member 143 can be spaced upward relative to the second stage 120. The path member 141 can be mounted on the support member 143. An opening can be defined in a part of the support member 143 facing the second stage 120. Therefore, the laser beam generated from the laser irradiation unit 130 can be irradiated onto the transfer substrate W through the opening defined in the support member 143.

[0123] The moving member 142 can be connected to the housing 134 of the laser irradiation unit 130 to support the laser irradiation unit 130. The moving member 142 can be mounted on the path member 141 and linearly move in the extending direction (or the front-rear direction) of the path member 141. Therefore, when the moving member 142 moves in the front-rear direction, the laser irradiation unit 130 can also linearly move in the front-rear direction. Therefore, the irradiation position of the laser beam can be adjusted in the front-rear direction by moving the laser irradiation unit 130 instead of adjusting the positions of the first stage 110 and the second stage 120.

[0124] In addition, the moving member 142 can move by being suspended on the path member 141. For example, the moving member 142 can be floated on the path member 141 by an air bearing method or a magnetic levitation method. Therefore, the friction generated when the moving member 142 moves on the path member 141 can be prevented, and the laser irradiation unit 130 can accurately adjust the irradiation position of the laser beam on the transfer substrate W by accurately moving the moving member 142 to a desired position.

[0125] As described above, since the first stage 110 and the second stage 120 are fixed, the transfer process can have improved accuracy compared to the case where the irradiation position of the laser beam is adjusted by moving the stage. That is, since the position of the substrate G to be transferred facing the transfer substrate W changes when the stage is moved, when the chip drops from the transfer substrate W, the chip may drop to a different position deviating from the accurate position. Since the positions of the transfer substrate W and the substrate G to be transferred remain unchanged when the first stage 110 and the second stage 120 are fixed, the chip can accurately drop to the desired position.

[0126] In addition, since the moving unit 140 moves the entire laser irradiation unit 130, even though the irradiation position of the laser beam on the transfer substrate W changes, the same light quantity and focus can be maintained. Therefore, it is possible to prevent the condition of the laser beam irradiated onto the transfer substrate W from varying for each area, and the process precision can be improved.

[0127] Figure 8 is a flowchart showing a transfer method according to an exemplary embodiment. Hereinafter, the transfer method according to the exemplary embodiment will be described.

[0128] The transfer method according to the exemplary embodiment is a method of transferring a chip provided on a transfer substrate to a substrate to be transferred. Referring to Figure 8 , the transfer method includes: process S110 of supporting the substrate to be transferred on a first stage; process S120 of supporting the transfer substrate with the chip attached thereto by a second stage and positioning the transfer substrate to face the substrate to be transferred; process S130 of irradiating the transfer substrate with a laser beam while moving the laser irradiation unit that irradiates the laser beam; and process S140 of transferring the chip to the substrate to be transferred by dropping the chip attached to the transfer substrate using the laser beam.

[0129] Referring to Figures 1 to 7 , first, an operation of adjusting the alignment state of the laser beam irradiated from the laser irradiation unit 130 can be performed. A reference substrate (not shown in the figure) can be prepared under the laser irradiation unit 130. Since the shape and position of the laser beam are checked by irradiating the reference substrate with the laser beam and then the operation of one of the laser generator 131, the shape adjuster 133, and the angle adjuster 132 is controlled, the light quantity and focus of the laser beam can be adjusted.

[0130] Thereafter, the substrate to be transferred G can be supported by the first stage 110. That is, the first stage 110 can be moved to the position where the substrate to be transferred G is moved, and by controlling the operation of the first driving unit 150, the substrate to be transferred G can be positioned on the first stage 110.

[0131] Here, the alignment state of the substrate to be transferred G can be primarily adjusted. For example, it can be visually checked whether the substrate to be transferred G on the first stage 110 is distorted by photographing the edge of the substrate to be transferred G. When it is determined that the position of the substrate to be transferred G is distorted with respect to the accurate position, the position of the substrate to be transferred G on the first stage 110 in the X - Y plane can be adjusted.

[0132] When the substrate to be transferred G is on the first stage 110, the first stage 110 can be moved under the laser irradiation unit 130 (or the process position) by controlling the operation of the first driving unit 150. Therefore, the substrate to be transferred G on the first stage 110 can face the laser irradiation unit 130.

[0133] Here, the alignment state of the transferred substrate G can be secondarily adjusted. For example, the transferred substrate G can be irradiated with alignment laser. In addition, by using the imaging unit 180, according to at least one of the shape and position of the alignment laser irradiated onto the transferred substrate G, by moving the first stage 110, the alignment state of the transferred substrate G can be accurately adjusted.

[0134] In the case of adjusting the alignment state according to the irradiation shape of the alignment laser, the shape of the alignment laser irradiated onto the transferred substrate G can be inspected. Therefore, when the alignment laser having a cross shape is distorted in shape, the horizontal state of the transferred substrate G can be determined as defective.

[0135] Therefore, the horizontal alignment state of the transferred substrate G can be adjusted by adjusting the horizontal state of the first stage 110 so that the shape of the alignment laser is displayed without distortion. Here, when the alignment hole h2 has a cross shape, the horizontal alignment state of the transferred substrate G can be easily inspected. That is, when the inclination of the transferred substrate G is distorted, the distortion of the shape of the alignment laser displayed on the surface of the transferred substrate G can be easily inspected. On the contrary, when the shape of the alignment laser is normally displayed, the normal horizontal state of the transferred substrate G can be easily inspected.

[0136] In the case of adjusting the alignment state according to the irradiation shape of the alignment laser, the position of the alignment laser irradiated onto the transferred substrate G can be inspected. In addition, marks corresponding to the shape of the alignment laser can be formed in the transferred substrate G. Therefore, when the position of the alignment laser does not correspond to (or does not coincide with) the position of the mark, the alignment state of the transfer substrate W in the X-Y plane can be determined as defective. Therefore, the planar alignment state of the transferred substrate G can be adjusted by moving the first stage 110 in the front-rear direction and the left-right direction so that the mark corresponds to (or coincides with) the irradiation position of the alignment laser.

[0137] Thereafter, the transfer substrate W attached with chips can be supported by the second stage 120. That is, the second stage 120 can be moved to the position where the transfer substrate W is moved, and by controlling the operation of the second driving unit 160, the transfer substrate W can be positioned on the second stage 120.

[0138] Here, the alignment state of the transfer substrate W can be primarily adjusted. For example, the transfer substrate W can have a circular shape, and a groove can be formed in the edge of the transfer substrate W. Therefore, by photographing the position of the groove formed in the transfer substrate W, it can be visually inspected whether the groove is provided at the rear end of the transfer substrate W. When the groove is provided at a different position, it can be determined that the position of the transfer substrate W is distorted relative to the accurate position. Therefore, the position of the groove of the transfer substrate W can be adjusted to the accurate position, and then the transfer substrate W can be adsorbed to the lower part of the second stage 120.

[0139] When the transfer substrate W is adsorbed to the second stage 120, the second stage 120 can be moved to be disposed between the laser irradiation unit 130 and the first stage 110. Accordingly, the second stage 120 can be moved to face the first stage 110, and the transfer substrate W can face the substrate G to be transferred.

[0140] Here, after the alignment state of the substrate G to be transferred is adjusted, the second stage 120 can be moved to be disposed between the laser irradiation unit 130 and the first stage 110. Accordingly, the alignment state of the substrate G to be transferred can be adjusted by irradiating the substrate G to be transferred with alignment laser light before the second stage 120 blocks between the laser irradiation unit 130 and the first stage 110.

[0141] When the second stage 120 is fully moved, the alignment state of the transfer substrate W can be secondarily adjusted. For example, the transfer substrate W can be irradiated with alignment laser light. Further, by using the imaging unit 180, the alignment state of the transfer substrate W can be accurately adjusted by moving the second stage 120 according to at least one of the shape and position of the alignment laser light irradiated onto the transfer substrate W.

[0142] In the case of adjusting the alignment state according to the irradiation shape of the alignment laser light, the shape of the alignment laser light irradiated onto the transfer substrate W can be inspected. Accordingly, when the alignment laser light having a cross shape is distorted in shape, the horizontal state of the transfer substrate W can be determined to be defective. Accordingly, the horizontal alignment state of the transfer substrate W can be adjusted by adjusting the horizontal state of the second stage 120 so that the shape of the alignment laser light is not distorted.

[0143] Here, when the alignment hole h2 has a cross shape, the horizontal alignment state of the transfer substrate W can be easily inspected. That is, when the inclination of the transfer substrate W is distorted, it can be easily inspected that the shape of the alignment laser light displayed on the surface of the transfer substrate W is distorted. On the contrary, when the shape of the alignment laser light is normally displayed, it can be easily inspected that the horizontal state of the transfer substrate W is normal.

[0144] In the case of adjusting the alignment state according to the irradiation position of the alignment laser light, the position of the alignment laser light irradiated onto the transfer substrate W can be inspected. Further, marks corresponding to the shape of the alignment laser light can be formed in the transfer substrate W. Accordingly, when the position of the alignment laser light does not correspond to (or does not coincide with) the position of the mark, the alignment state of the transfer substrate W in the X-Y plane can be determined to be defective. Accordingly, the planar alignment state of the transfer substrate W can be adjusted by moving the second stage 120 in the front-rear direction and the left-right direction so that the mark corresponds to (or coincides with) the irradiation position of the alignment laser light.

[0145] As described above, the alignment states of each of the transferred substrate G and the transfer substrate W can be adjusted by using the alignment laser as a reference. Thus, the alignment state between the transfer substrate W and the transferred substrate G can be adjusted.

[0146] In addition, an operation of secondarily adjusting the alignment state between the transfer substrate W and the transferred substrate G can be performed simultaneously. That is, the first stage 110 and the second stage 120 can be moved to be disposed below the laser irradiation unit 130, and then a plurality of alignment lasers can be generated. A part of the plurality of alignment lasers can be irradiated onto the transfer substrate W, and another part of the plurality of alignment lasers can be irradiated onto the transferred substrate G through the transmission window provided in the second stage 120. Thus, the alignment state between the transfer substrate W and the transferred substrate G can be checked by using the alignment lasers irradiated onto each of the transfer substrate W and the transferred substrate G, and then when each alignment state is defective, the alignment state can be adjusted. Therefore, the process time can be shortened by adjusting the alignment states of each of the transferred substrate G and the transfer substrate W simultaneously.

[0147] In addition, in the case of adjusting the alignment states of each of the transferred substrate G and the transfer substrate W simultaneously, the operation of placing the transferred substrate G on the first stage 110 and the operation of adsorbing the transfer substrate W to the second stage 120 can also be performed simultaneously. Therefore, the operation time of placing the substrate on the stage can be shortened.

[0148] Thereafter, the transfer substrate W can be irradiated with a laser beam while moving the laser irradiation unit 130 that irradiates the laser beam. That is, the laser irradiation unit 130 can be moved in a state where the positions of the transfer substrate W and the transferred substrate G are fixed because the first stage 110 and the second stage 120 do not move, so as to scan the transfer substrate W by using the laser beam. Therefore, after the alignment states of each of the transferred substrate G and the transfer substrate W are adjusted, the stages can be not moved to prevent alignment distortion between the transferred substrate G and the transfer substrate W.

[0149] Here, a plurality of chips can be provided and arranged on the transfer substrate W in an array type. When a laser beam having a wire harness shape is introduced into the shape adjuster 133, the shape adjuster 133 can convert the wire harness shape into a shape of a plurality of points spaced apart from each other in the extending direction (or the left - right direction) of the wire harness, and irradiate the transfer substrate W with the laser beam having the shape of a plurality of points. That is, the laser beam can be irradiated corresponding to the positions of the chips spaced apart in the left - right direction. Therefore, when the laser irradiation unit 130 linearly moves in a direction (or the front - back direction) intersecting with the extending direction of the wire harness, all the chips arranged in the array type can be irradiated with the laser beam.

[0150] In addition, the laser generator 131 can appropriately irradiate the transfer substrate W with a laser beam until the time when the laser beam reaches each of the chips spaced apart from each other in the front-rear direction.

[0151] For example, the laser beam can be generated according to a predetermined frequency. Therefore, when the laser beam scans the transfer substrate W, the position where the chips are provided can be irradiated with the laser beam, while the position where no chips are provided can be not irradiated with the laser beam. Therefore, the laser beam can irradiate only the position where the chips are provided.

[0152] In addition, a circuit breaker (not shown in the figure) can be provided on the moving path of the laser beam. Therefore, since the circuit breaker continuously performs the operation of opening and closing the moving path of the laser beam in a state where the laser beam is generated from the laser generator 131, when the laser beam scans the transfer substrate W, the laser beam can irradiate at the position where the chips are provided, and can not irradiate at the position where no chips are provided. Therefore, the laser beam can irradiate only at the position where the chips are provided.

[0153] Here, since the entire laser irradiation unit 130 is moved to irradiate the laser beam, an equal-focus laser beam with the same light quantity can be irradiated to the entire area of the transfer substrate W. Therefore, it is possible to prevent the feature that some chips are not separated from the transfer substrate W due to different light quantities and focusing of the laser beam.

[0154] The laser beam irradiated to the transfer substrate W can cause the chips provided on the transfer substrate W to fall off and transfer the chips to the transfer destination substrate G. That is, the laser beam can apply thermal energy to the adhesion surface between the chip and the transfer substrate W to separate the chip from the transfer substrate W. Therefore, the chip can be separated from the transfer substrate W and fall onto the transfer destination substrate G. Since the alignment state of each of the transfer destination substrate G and the transfer substrate W is adjusted, the chip separated from the transfer substrate W can accurately fall onto the predetermined position of the transfer destination substrate G.

[0155] Here, a thin film layer (not shown in the figure) made of a bonding material can be provided on the top surface of the transfer destination substrate G, so that the transfer destination substrate G and the chip are in contact with each other and electrically connected to each other. For example, the thin film layer made of a bonding material can be an anisotropically conductive film (ACF) layer. The thin film layer made of a bonding material can include a plurality of conductive particles distributed therein and has a predetermined adhesive property. Therefore, the chip separated from the transfer substrate W and falling can adhere to the top surface of the transfer destination substrate G.

[0156] When all the chips set on the transfer substrate W are transferred to the substrate G to be transferred, the substrate G to be transferred can be transported to a place for performing subsequent processes. In the subsequent processes, heat is applied to the attachment surface between the substrate G to be transferred and the chips transferred to the substrate G to be transferred by using a laser beam. Accordingly, the chips and the thin film layer made of the bonding material disposed on the substrate G to be transferred can be attached to each other and electrically connected to each other.

[0157] As described above, when performing the transfer process, in a state where the transfer substrate W and the substrate G to be transferred are fixed, the irradiation position of the laser beam can be precisely adjusted by using the moving unit 140. Accordingly, during the transfer process, it is possible to prevent the positions of the transfer substrate W and the substrate G to be transferred from changing as the first stage 110 or the second stage 120 moves. Accordingly, since the chips accurately fall onto predetermined positions on the substrate G to be transferred, the transfer process can improve the accuracy.

[0158] According to an exemplary embodiment, when performing the transfer process, the irradiation position of the laser beam can be precisely adjusted so that the chips accurately fall at preset positions. Accordingly, the transfer process can have improved accuracy to improve the quality of products manufactured through the process.

[0159] In addition, according to an exemplary embodiment, the stage for supporting the substrate G to be transferred and the stage for supporting the transfer substrate can be driven independently. Accordingly, the time for transporting the substrate G to be transferred and the transfer substrate to a position for performing the transfer process can be shortened to improve the process efficiency.

[0160] Although the preferred embodiments of the present invention have been described in the detailed description of the embodiments, various changes and modifications can be made to the present invention without departing from the scope and spirit of the present invention defined by the appended claims. Accordingly, the scope of the present invention is not defined by the detailed description of the present invention, but by the appended claims, and all differences within the scope will be construed as being included in the present invention.

Claims

1. A transfer device that transfers a chip provided on a transfer substrate to a substrate to be transferred, the transfer device comprising: A first stage configured to support the substrate to be transferred; A second stage configured to support the transfer substrate such that the transfer substrate faces the substrate to be transferred and is spaced apart from the substrate to be transferred; A laser irradiation unit, at least a part of which is spaced apart from the second stage in a direction in which the transfer substrate and the substrate to be transferred face each other, to irradiate a laser beam onto the transfer substrate, and provided with an alignment hole; A moving unit configured to support the laser irradiation unit and move the laser irradiation unit while irradiating the laser beam; An imaging unit configured to image the shape and position of the laser beam passing through the alignment hole, the shape and the position being irradiated onto at least one of the transfer substrate and the substrate to be transferred; And An alignment unit connected to the imaging unit to adjust the alignment state of each of the transfer substrate and the substrate to be transferred according to the irradiated shape and position of the laser beam passing through the alignment hole.

2. The transfer device according to claim 1, wherein the moving unit comprises: A path member extending in a direction intersecting the direction in which the transfer substrate and the substrate to be transferred face each other; And A moving member connected to the laser irradiation unit and mounted to be linearly movable along the extending direction of the path member.

3. The transfer device according to claim 1, further comprising: A first driving unit configured to support the first stage and thereby move the first stage in multiple directions; And A second driving unit configured to support the second stage and thereby move the second stage in multiple directions independently of the first stage.

4. The transfer device according to claim 1, wherein the laser irradiation unit comprises: A laser generator configured to generate a laser beam; An angle adjuster provided between the laser generator and the second stage to adjust the irradiation direction of the laser beam; A shape adjuster provided between the laser generator and the angle adjuster to adjust the shape of the laser beam irradiated onto the transfer substrate; And A housing configured to support the laser generator, the angle adjuster, and the shape adjuster and capable of being moved by the moving unit.

5. The transfer device according to claim 4, wherein the shape adjuster comprises: A mask member having a plurality of pattern holes and the alignment hole; And A selection member configured to support the mask member and move the mask member in multiple directions to select a pattern hole through which the laser beam passes among the plurality of pattern holes.

6. The transfer device according to claim 1, wherein the second stage is moved into and out of a space between the laser irradiation unit and the first stage, and The alignment unit adjusts the alignment state of the substrate to be transferred and then adjusts the alignment state of the transfer substrate.

7. The transfer device according to claim 1, wherein the area of the substrate to be transferred is larger than the area of the transfer substrate, and a part of the laser beam passing through the alignment holes irradiates the transfer substrate, and another part of the laser beam irradiates the substrate to be transferred through the second stage.

8. A transfer method, comprising: supporting a substrate to be transferred by a first stage; supporting a transfer substrate provided with chips by a second stage and arranging the transfer substrate to face the substrate to be transferred; while moving a laser irradiation unit configured to irradiate a laser beam, irradiating the laser beam onto the transfer substrate; and transferring the chips to the substrate to be transferred by dropping the chips provided on the transfer substrate by using the laser beam, wherein supporting the substrate to be transferred by the first stage includes: irradiating alignment laser onto the substrate to be transferred; and adjusting the alignment state of the substrate to be transferred by moving the first stage according to at least one of the irradiation shape and the irradiation position of the alignment laser, and supporting the transfer substrate provided with the chips by the second stage includes: irradiating the alignment laser onto the transfer substrate provided with the chips; and adjusting the alignment state of the transfer substrate by moving the second stage according to at least one of the irradiation shape and the irradiation position of the alignment laser.

9. The transfer method according to claim 8, wherein a plurality of the chips are provided and the plurality of chips are arranged in an array type, and irradiating the laser beam while moving the laser irradiation unit includes: generating a laser beam; and linearly moving the laser irradiation unit in one direction.

10. The transfer method according to claim 9, wherein linearly moving the laser irradiation unit includes appropriately irradiating the laser beam onto the transfer substrate until the time when the laser beam moving in the one direction reaches each of the chips spaced apart from each other in the one direction.

11. The transfer method according to claim 8, wherein adjusting the alignment state according to the irradiation shape and the irradiation position of the alignment laser includes adjusting the horizontal alignment state of the transfer substrate or the substrate to be transferred.

12. The transfer method according to claim 8, wherein marks are formed in the transfer substrate and the substrate to be transferred, and adjusting the alignment state according to the irradiation shape and the irradiation position of the alignment laser includes adjusting the planar alignment state of the transfer substrate or the substrate to be transferred such that the marks are disposed at positions corresponding to the irradiation positions of the alignment laser.

13. The transfer method according to claim 8, wherein supporting the transfer substrate provided with the chips by the second stage includes moving the second stage to be disposed between the laser irradiation unit and the first stage, and adjusting the alignment state of the substrate to be transferred is performed before moving the second stage to be disposed between the laser irradiation unit and the first stage.

14. The transfer method according to claim 8, wherein causing the alignment laser irradiation includes: generating a plurality of alignment lasers; and irradiating a part of the plurality of alignment lasers onto the transfer substrate, and irradiating another part onto the substrate to be transferred through the second stage.

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