Method and structure of electroacoustic component suitable for mounting electroacoustic component on PCB

Abstract

The present invention provides a method and an electroacoustic element structure suitable for mounting an electroacoustic element on a PCB, so as to improve the problem that the electrical characteristics of the conventional electroacoustic element are affected by the high temperature baking effect of a reflow soldering furnace. The method comprises a shell of the electroacoustic element, wherein the shell comprises a shell seat and a base, a plurality of sound generating components are mounted in the shell seat, and at least two conductive terminals are mounted on the base, the base is adhered to the PCB, and the conductive terminals on the base and at least two contacts on the PCB are adhered to each other and electrically connected in a reflow soldering furnace, and then the shell seat and the base are combined, so that the shell seat and the base that have been adhered to the PCB are integrated outside the reflow soldering furnace to form an electroacoustic element adhered to the PCB.

Description

Technical Field

[0001] The present invention relates to the structure and installation technology of electroacoustic components, and in particular to a method suitable for installing electroacoustic components on a PCB and an electroacoustic component structure. Background Art

[0002] The so-called electroacoustic components include piezoelectric buzzers, electromagnetic buzzers, dynamic speakers, etc. Among them, piezoelectric buzzers use the piezoelectric effect of piezoelectric ceramics to drive the vibration membrane to vibrate and then make sounds, electromagnetic buzzers use electromagnetism to drive the metal vibration membrane to vibrate and then make sounds during the process of power on and off, and dynamic speakers use the magnetic field effect generated by the coil being powered to drive the diaphragm to vibrate and then make sounds. Therefore, the electroacoustic components are generally assembled on PCBs and make sounds through the drive of the conductive circuit provided by the circuit layer of the PCB.

[0003] As is known to all, when assembling electronic components such as ICs and electroacoustic components on PCBs, surface mount technology (SMT) is generally used. First, solder paste is printed on the circuit layer surface of the PCB, and then the electronic components are adsorbed and inserted into the PCB with the help of a suction cup on an automatic arm. Subsequently, the electronic components and solder paste inserted into the PCB surface are melt-welded in a reflow oven (e.g., IR oven), so that the electronic components can be firmly adhered to the circuit layer surface of the PCB to conduct the conductive circuits of each electronic component on the PCB.

[0004] For the electroacoustic components in the above-mentioned electronic components, they are usually composed of a housing in which necessary sound components are assembled. The electroacoustic component is, for example, a piezoelectric buzzer, and the sound components that need to be assembled in its housing include a piezoelectric ceramic element, a diaphragm, a circuit board, and conductive terminals. During the soldering process in the above-mentioned reflow soldering furnace, these sound components must withstand a high temperature of about 245°C in the reflow soldering furnace. In such a high temperature environment, in addition to testing the heat resistance of the housing material, it will also affect the electrical characteristics of the sound components such as the piezoelectric buzzer, the diaphragm, and the circuit board.

[0005] Faced with this problem, current industry players can only use materials that can withstand the high temperatures of the reflow oven to make the housing and sound-generating components of the electro-acoustic components. However, this increases the production cost of the electro-acoustic components and urgently needs to be improved. Summary of the invention

[0006] The purpose of the present invention is to minimize the impact of high temperature baking in a reflow oven on the housing of an electroacoustic component and the sound-generating components assembled therein, so as to maintain the electrical characteristics of these components.

[0007] To this end, the present invention provides a method for mounting an electroacoustic component on a PCB, characterized in that the method comprises performing the following steps in sequence:

[0008] (1) Separately constructing a housing of the electroacoustic element, so that the housing includes a housing and a base that are previously independent and can be combined into one, the housing is pre-installed with a plurality of sound-generating components, and the base is pre-installed with at least two conductive terminals;

[0009] (2) bonding the base and the PCB so that the at least two conductive terminals on the base and the at least two contacts on the PCB are bonded to each other and electrically connected in a reflow oven;

[0010] (3) Combining the shell and the base, the shell is integrated with the base adhered to the PCB outside the reflow oven, and the at least two conductive terminals are electrically connected to at least one of the multiple sound-emitting components to form an electroacoustic element adhered to the PCB.

[0011] The method is suitable for installing an electroacoustic element on a PCB, wherein: the electroacoustic element is one of a piezoelectric buzzer, an electromagnetic buzzer, and a dynamic speaker, and at least one of the multiple sound-generating components is a circuit board.

[0012] The method for installing an electroacoustic component on a PCB, wherein: the base is made of heat-resistant plastic, and the shell and the sound-generating component are not made of heat-resistant plastic.

[0013] The present invention also provides an electroacoustic component structure suitable for installation on a PCB, characterized in that it comprises:

[0014] A housing having a chamber formed therein, wherein a plurality of sound generating components are installed in the chamber;

[0015] A base, mounted with at least two conductive terminals, the base is used in a reflow oven, so that the at least two conductive terminals can adhere to each other and be electrically connected with at least two contacts on the PCB in the reflow oven;

[0016] Among them, a connecting portion is formed at one end of the shell seat, and a docking portion for combining with the connecting portion is formed at one end of the base. The shell seat and the base can be integrated into one outside the reflow oven through the mutual combination of the connecting portion and the docking portion, so that the at least two conductive terminals are electrically connected to at least one of the multiple sound-emitting components.

[0017] The electroacoustic component structure suitable for installation on a PCB, wherein: the housing comprises a body and a set of seat covers arranged on the body, and the chamber is formed in the body. In this way, the sound generating component can be installed in the housing more conveniently.

[0018] The electroacoustic component structure suitable for installation on a PCB, wherein: the at least two conductive terminals are respectively bent into a "J" shape and exposed at two opposite end surfaces of the base.

[0019] The electroacoustic component structure suitable for installation on a PCB, wherein: the electroacoustic component is a piezoelectric buzzer.

[0020] The electroacoustic component structure suitable for installation on a PCB, wherein: the multiple sound-generating components installed in the shell seat include a circuit board, the circuit board has at least two circuit terminals for elastically contacting the at least two conductive terminals, and when the shell seat and the base are combined into one outside the reflow oven, the circuit board in the shell seat is electrically connected to the conductive terminals on the base via the circuit terminals.

[0021] The electroacoustic component structure suitable for installation on a PCB, wherein: the electroacoustic component is an electromagnetic buzzer.

[0022] The electroacoustic component structure suitable for installation on a PCB, wherein: the multiple sound-generating components installed in the shell seat include a circuit board, the conductive terminals on the base are bent to form at least two circuit terminals in the form of oblique arms and tilted, and when the shell seat and the base are combined into one outside the reflow oven, the circuit board in the shell seat is electrically connected to the conductive terminals via the tilted circuit terminals on the base.

[0023] The electroacoustic component structure is suitable for installation on a PCB, wherein: the electroacoustic component is a dynamic speaker.

[0024] The electroacoustic component structure suitable for installation on a PCB, wherein: the multiple sound-generating components installed in the shell seat include a printed circuit electrode, the conductive terminal on the base is bent to form at least two circuit terminals in the form of oblique arms and tilted, and when the shell seat and the base are combined into one outside the reflow oven, the printed circuit electrode in the shell seat is electrically connected to the conductive terminal via the tilted circuit terminal on the base.

[0025] The electroacoustic component structure suitable for installation on a PCB, wherein: the base is made of heat-resistant plastic, and the shell and the sound-generating component are not made of heat-resistant plastic.

[0026] According to the above technical means, the overall improved effect of the present invention is: maintaining the electrical characteristics of the electroacoustic components that have been adhesively mounted on the PCB, including the electrical characteristics of components such as the piezoelectric buzzer, the vibration membrane and the circuit board in the electroacoustic components; in addition, the present invention can also avoid the use of heat-resistant materials to make the shell seat (including the seat body and the seat cover), piezoelectric buzzer, the vibration membrane and the circuit board of the electroacoustic component, thereby reducing the production cost of the electroacoustic component.

[0027] The specific implementation details of the above-mentioned technical means and their effectiveness are described in the following embodiments and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a step-by-step procedure diagram of the installation method of the present invention.

[0029] Figure 2a to Figure 2e Execution Figure 1 Schematic diagram of the installation method.

[0030] Figure 3 It is a three-dimensional exploded view of the first structural embodiment of the present invention, illustrating an implementation mode of using a piezoelectric buzzer as an electroacoustic element.

[0031] Figure 4 yes Figure 3 Another perspective exploded view of the center base.

[0032] Figure 5 yes Figure 3 Schematic diagram of the three-dimensional structure after the middle components are assembled.

[0033] Figure 6 yes Figure 5 An enlarged cross-sectional view of .

[0034] Figure 7 It is a cross-sectional view of the second structural embodiment of the present invention, illustrating an implementation mode in which an electromagnetic buzzer is used as an electro-acoustic element.

[0035] Figure 8 It is a cross-sectional view of the third structural embodiment of the present invention, illustrating an implementation mode of using a dynamic speaker as an electro-acoustic element.

[0036] Description of reference numerals: 10, 60, 70 - housing; 11, 61, 71 - housing seat; 11a, 61a, 71a - seat body; 11b, 61b, 71b - seat cover; 111 - chamber; 112 - first opening; 113 - connecting portion; 114 - sound-transmitting hole; 115 - fixing plate; 116 - second opening; 117 - limiting column; 118 - sponge; 12, 62, 72 - base; 12a - outer end surface; 12b - end wall; 12c - inner end surface; 121 - docking portion; 1 22-notch; 20-sound-generating component; 21-piezoelectric buzzer; 22, 22a, 22b-vibration membrane; 23, 23a, 23b-circuit board; 231, 311, 321-circuit terminal; 24-coil; 25-magnetic pole; 26, 261-magnet; 27-printed circuit electrode; 281-biased coil; 282-voice coil; 30, 31, 32-conductive terminal; 40-PCB; 41-contact point; 50-reflow oven; S1 to S3-step description of the embodiment. DETAILED DESCRIPTION

[0037] First, see Figure 1 , illustrating a method for mounting an electroacoustic component on a PCB according to the present invention, comprising sequentially performing the following steps S1 to S3:

[0038] Step S1: Separate and construct the shell of the electro-acoustic component

[0039] See also Figure 2a , which illustrates that the shell 10 of the electroacoustic component is pre-constructed into a shell 11 and a base 12 which can be independently formed in advance and then combined into one. The shell 11 is pre-installed with a plurality of sound components 20 whose electrical characteristics are easily affected by high temperature, and the plurality of sound components 20 include at least a circuit board 23, and the base 12 is pre-installed with at least two conductive terminals 30. The base 12 is made of heat-resistant plastic in practice, and the shell 11 and the sound component 20 are not made of heat-resistant plastic in practice. The heat-resistant plastic refers to plastic that can withstand high-temperature baking of about 245°C in a reflow oven.

[0040] Step S2: Attaching the base to the PCB

[0041] Please refer to Figure 2b and Figure 2c , indicating that solder paste is printed on the contact 41 of the PCB 40, and then the base 12 is picked up by an automatic arm and placed on the PCB 40 (such as Figure 2b ), the conductive terminal 30 on the base 12 is brought into contact with the contact point 41 on the PCB 40, and then the PCB 40 is moved into a reflow oven 50 (as shown in FIG. Figure 2cAs shown in FIG. 1 , the solder paste is melted by baking at a high temperature of about 245° C. in a reflow oven 50 , so that the conductive terminals 30 on the base 12 and the contacts 41 on the PCB 40 can adhere to each other and be electrically connected.

[0042] Step S3: Combine the shell and the base

[0043] Please refer to Figure 2d and Figure 2e , which means that the PCB 40 with the base 12 attached is taken out from the reflow oven 50, so that the PCB 40 with the base 12 attached is away from the high temperature in the reflow oven 50, and can be picked up by the help of an automatic arm at room temperature or room temperature, and the shell 11 is pressed or screwed onto the base 12 attached to the PCB 40 (such as Figure 2d As shown), when the housing 11 and the base 12 are combined into one, the conductive terminals 30 on the base 12 can be pressed and electrically connected with the two circuit terminals 231 on the circuit board 23 in the housing 11, thereby forming an integrated electroacoustic component adhered to the PCB 40 (as shown). Figure 2e In this way, the housing base 11 and the plurality of sound generating components 20 installed in the housing base 11 can be prevented from being disturbed by high temperature in the reflow oven 50.

[0044] In order to implement the above method, please refer to Figures 3 to 6 , discloses the first structural embodiment of the present invention using a piezoelectric buzzer as an electroacoustic element, and explains that the structure of the piezoelectric buzzer includes the above-mentioned housing 11, base 12 and multiple sound generating components 20. Among them:

[0045] A chamber 111 is formed in the housing 11 for mounting the plurality of sound generating components 20, and a connecting portion 113 is formed on the housing wall at one end of the housing 11. In the present embodiment, the sound generating component 20 comprises a piezoelectric buzzer 21 made of a well-known piezoelectric ceramic, a vibration membrane 22, and a circuit board 23, etc.; wherein the vibration membrane 22 is formed in a cone shape that can reciprocate, and the circumferential edge of the vibration membrane 22 is fixed to the wall of the chamber 111, the central basin area of ​​the piezoelectric buzzer 21 is attached to the vibration membrane 22, and the piezoelectric buzzer 21 is electrically connected to the circuit board 23 and then to an external power supply terminal, so as to utilize the piezoelectric effect of the piezoelectric buzzer 21 to drive the vibration membrane 22 to vibrate and generate sound.

[0046] In order to consider the convenience of assembling the sound generating assembly 20 in the housing 11, the housing 11 can be implemented to include a housing 11a and a housing cover 11b arranged on the housing 11a; wherein the chamber 111 is formed in the housing 11a, and the chamber 111 has a fixing plate 115, and the fixing plate 115 can be fixed in the housing 11a by a press-fitting manner, or formed by an integral extension of the wall surface of the chamber 111 of the housing 11a, so as to use the fixing plate 115 in the chamber 111 to fix the circuit board 23; the two ends of the housing 11a respectively form a first opening 112 and a second opening 113; The opening 116, the connecting portion 113 can be singular or plural, and is formed on the base 11a around the first opening 112 in a ring form or in a spaced-apart form; the second opening 116 of the base 11a is connected to the chamber 111, and the base cover 11b is assembled on the second opening 116 in a manner such as a press buckle, and the vibration membrane 23 is arranged between the base 11a and the base cover 11b and is located in the chamber 111; at least one sound-transmitting hole 114 is formed on the base cover 11b, and the sound emitted by the piezoelectric buzzer 21 when it vibrates is transmitted to the outside through the sound-transmitting hole 114.

[0047] In addition, the base 12 is formed in a disc-shaped cover that can cover one end of the housing 11, and one end surface of the base 12 is formed with a docking portion 121 for coupling with the connecting portion 113. The connecting portion 113 and the docking portion 121 can be implemented in a form of relative buckling of a clamping rib and a clamping groove with male and female buckle capabilities, or in a form of relative locking of screw threads.

[0048] When the connecting portion 113 and the docking portion 121 are implemented as Figures 3 to 5 When the male and female buckles are combined with the ribs and slots shown, the automatic arm used to capture the housing 11 only needs to perform the alignment and pressing action to press the housing 11 onto the base 12 of the PCB 40; when the connecting portion 113 and the docking portion 121 are implemented as a combination of relative screw thread locking (the ordinary screw connection technology is used, so it is not shown), the automatic arm used to capture the housing 11 only needs to perform the alignment and rotation action to press the housing 11 onto the base 12 of the PCB 40. In terms of the current control technology of the automatic arm, the above two combination methods can enable the housing 11 to accurately align the conductive terminals 30 and the circuit terminals 231 with the positive and negative polarities when the housing 11 is combined with the base 12, and to achieve a stable electrical connection.

[0049] Furthermore, at least one notch 122 is formed on the docking portion 121. When the housing 11 and the base 12 are integrated, a tool can be used to push the connecting portion 113 through the notch 122, so that the connecting portion 113 and the docking portion 121 are no longer in the combined state, thereby separating the housing 11 from the base 12.

[0050] Furthermore, the base 12 is provided with the two conductive terminals 30, which can be formed by bending a metal sheet into a J-shape, so that each of the conductive terminals 30 can extend from the outer end surface 12a and the end wall 12b of the base 12 to the inner end surface 12c of the base 12 in sequence and be fixed on the base 12 by being buckled, so that both ends of the conductive terminals 30 can be respectively exposed on the two opposite end surfaces (the outer end surface 12a and the inner end surface 12c) of the base 12, so that both ends of the conductive terminals 30 can be respectively electrically connected to the circuit terminals 231 of the circuit board 23 and the contacts 41 on the PCB 40. Accordingly, when the PCB 40 is powered on, an excitation voltage can be output to the piezoelectric buzzer 21 through the circuit board 23 in the piezoelectric buzzer (i.e., the electroacoustic element), so that the buzzer 21 attached to the basin center area of ​​the flexible vibration membrane 22 generates a vibration frequency, thereby emitting a sound.

[0051] The two circuit terminals 231 on the circuit board 23 can be made of elastic elements such as spiral compression springs, and the two circuit terminals 231 have positive and negative polarities. When the housing 11 and the base 12 are combined into one, the two circuit terminals 231 can be in close contact with the two conductive terminals 30 on the base 12 according to the requirements of the positive and negative conductive paths to maintain the electrical connection between the two.

[0052] Please combine and refer to Figure 3 and Figure 6 A limiting column 117 is formed on the seat cover 11b. The limiting column 117 extends from the seat cover 11b to the seat body 11a (that is, the chamber 111) to limit the amplitude of the vibration membrane 22. A sponge 118 is fixed on the fixing plate 115. The sponge 118 can be regarded as an accessory of the sound component 20, and is arranged in the shell 11 together with the sound component 20, thereby avoiding the high temperature of the reflow oven. The piezoelectric buzzer 21 is located between the limiting column 117 and the sponge 118. In this way, the piezoelectric buzzer 21 can maintain the stability of the stable vibration frequency by virtue of the restraint of the sponge 118 and the limiting column 117 when vibrating.

[0053] Please continue reading Figure 7, revealing the second structural embodiment of the present invention using an electromagnetic buzzer as an electro-acoustic element, explaining that the biggest difference between the structure of the electromagnetic buzzer and the first piezoelectric buzzer mentioned above is that the multiple sound-generating components 20 installed in the shell base 61 of the device shell 60 are replaced by a well-known circuit board 23a electrically connecting the coil 24 and the corresponding assembled magnetic poles 25, magnets 26 and vibration membranes 22a, and the two circuit terminals 311 are made of elastic elements other than helical compression springs. Specifically, the two circuit terminals 311 are formed by bending the conductive terminals 30 on the base 12 into an oblique arm tilted shape, so that when the shell base 61 and the base 62 are combined into one, the two circuit terminals 311 can be electrically connected to the positive and negative contacts on the circuit board 23a according to their positive and negative polarity directions. In addition, the internal structure of the housing 61 formed by the base 61a and the base cover 61b is matched accordingly to install the above-mentioned sound-generating component 20, so that the electromagnetic buzzer can use the coil 24 to drive the vibration membrane 22a to vibrate and generate sound through the action between the magnetic pole 25 and the magnet 26 during the power-on and power-off processes. In addition, the rest of the structure and installation method of this embodiment are roughly the same as those of the first embodiment. In particular, this embodiment is completely suitable for applying the above-mentioned method of the present invention to perform the steps of installing electroacoustic components on the PCB.

[0054] Please continue reading Figure 8 , discloses the third structural embodiment of the present invention using a dynamic speaker as an electroacoustic element, and explains that the biggest difference between the structure of the dynamic speaker and the first piezoelectric buzzer mentioned above is that the multiple sound-generating components 20 installed in the shell seat 71 of the device shell 70 are replaced by the well-known printed circuit electrode 27, the electrical connection between the polarization coil 281 and the voice coil 282, and the corresponding assembled magnet 261, the vibration membrane 22b, etc. Among them, the printed circuit electrode 27 is used to replace the circuit board of the first and second embodiments mentioned above, and the two circuit terminals 321 are replaced by the conductive terminals 32 on the base 72 bent into an oblique arm tilted shape, so that when the shell seat 71 and the base 72 are combined into one, the two circuit terminals 321 can be electrically connected to the printed circuit electrode 27. In addition, the internal structure of the housing 71 formed by the base 71a and the base cover 71b will be matched accordingly to install the above-mentioned sound-generating component 20, so that the dynamic speaker can use the printed circuit electrode 27 to excite the polarization coil 281 and the voice coil 282 to generate a magnetic field effect to drive the vibration membrane 22b to vibrate and produce sound. In addition, the rest of the structure and installation method of this embodiment are roughly the same as those of the first embodiment. In particular, this embodiment is completely suitable for applying the above-mentioned method of the present invention to perform the steps of installing electroacoustic components on a PCB.

[0055] The above description is only illustrative rather than restrictive of the present invention. Those skilled in the art will understand that many modifications, changes or equivalents may be made without departing from the spirit and scope defined by the claims, but all will fall within the scope of protection of the present invention.

Claims

1. A method for mounting an electroacoustic component on a PCB, wherein the electroacoustic component is one of a piezoelectric buzzer, an electromagnetic buzzer, and a dynamic speaker, characterized in that: This involves performing the following steps in order: (1) Separately constructing a housing of the electroacoustic element, so that the housing includes a housing and a base that are previously independent and can be combined into one body later, the housing is pre-installed with a plurality of sound generating components, and the base is pre-installed with at least two conductive terminals, a connecting portion is formed on a housing wall at one end of the housing, and a docking portion for combining with the connecting portion is formed on an end surface of the base; (2) bonding the base and the PCB so that the at least two conductive terminals on the base and the at least two contacts on the PCB are bonded to each other and electrically connected in a reflow oven; (3) combining the shell and the base, so that the shell and the base adhered to the PCB are integrated outside the reflow oven, so that the at least two conductive terminals are electrically connected to at least one of the plurality of sound-generating components, thereby forming an electroacoustic element adhered to the PCB; The base is made of heat-resistant plastic, and the shell and the sound-generating component are not made of heat-resistant plastic.

2. The method for mounting an electroacoustic component on a PCB as claimed in claim 1, characterized in that: At least one of the plurality of sound-generating components is a circuit board.

3. An electroacoustic component structure suitable for installation on a PCB, manufactured by the method for installing an electroacoustic component on a PCB according to claim 1, wherein the electroacoustic component is one of a piezoelectric buzzer, an electromagnetic buzzer, and a dynamic speaker, characterized in that: include: A housing having a chamber formed therein, wherein a plurality of sound generating components are installed in the chamber; A base, mounted with at least two conductive terminals, the base is used in a reflow oven, so that the at least two conductive terminals can adhere to each other and be electrically connected with at least two contacts on the PCB in the reflow oven; Among them, the shell seat and the base are constructed separately from a shell, a connecting portion is formed at one end of the shell seat, and a docking portion for combining with the connecting portion is formed at one end of the base. The shell seat and the base can be integrated into one outside the reflow oven through the mutual combination of the connecting portion and the docking portion, so that the at least two conductive terminals are electrically connected to at least one of the multiple sound components; the base is made of heat-resistant plastic, and the shell seat and the sound component are not made of heat-resistant plastic.

4. The electroacoustic component structure suitable for mounting on a PCB as claimed in claim 3, characterized in that: The shell seat comprises a seat body and a set of seat covers arranged on the seat body, and the chamber is formed in the seat body.

5. The electroacoustic component structure suitable for mounting on a PCB as claimed in claim 3, characterized in that: The at least two conductive terminals are bent into a "J" shape and exposed at two opposite end surfaces of the base.

6. The electroacoustic component structure suitable for mounting on a PCB as claimed in claim 3, characterized in that: The electroacoustic element is a piezoelectric buzzer, and the multiple sound-generating components installed in the shell seat include a circuit board having at least two circuit terminals for elastically contacting the at least two conductive terminals. When the shell seat and the base are combined into one outside the reflow oven, the circuit board in the shell seat is electrically connected to the conductive terminals on the base via the circuit terminals.

7. The electroacoustic component structure suitable for mounting on a PCB as claimed in claim 3, characterized in that: The electroacoustic element is an electromagnetic buzzer, and the multiple sound-generating components installed in the shell base include a circuit board. The conductive terminals on the base are bent to form at least two circuit terminals in the form of oblique arms. When the shell base and the base are combined into one outside the reflow oven, the circuit board in the shell base is electrically connected to the conductive terminals via the circuit terminals that are tilted on the base.

8. The electroacoustic component structure suitable for mounting on a PCB as claimed in claim 3, characterized in that: The electroacoustic element is a dynamic speaker, and the multiple sound-emitting components installed in the shell seat include a printed circuit electrode. The conductive terminal on the base is bent to form at least two line terminals in the form of oblique arms. When the shell seat and the base are combined into one outside the reflow oven, the printed circuit electrode in the shell seat is electrically connected to the conductive terminal via the line terminal raised on the base.

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