Semiconductor equipment, display equipment and electronic equipment

Abstract

The present invention provides a semiconductor device having a multilayer structure, in which a first substrate (500) provided with a light-emitting element and a second substrate (100) provided with a light-blocking member at the periphery are stacked on each other. The semiconductor device is configured so that the multilayer structure includes: a first resin (400) formed of a photocurable resin and sealing the space between the first substrate (500) and the second substrate (100) in a pixel region located at the center of the multilayer structure when viewed in a plan view; a second resin (402) sealing the space between the first substrate (500) and the second substrate (100) in a pixel region located at the periphery of the multilayer structure when viewed in a plan view; and a protruding structure (310) provided between the first substrate (500) and the second substrate (100) in a boundary region between the pixel region and the light-blocking region and formed of a transparent or translucent material that transmits light.

Description

Technical Field

[0001] The present disclosure relates to a semiconductor device, a display device, and an electronic device. Background Art

[0002] In recent years, electronic devices that realize AR (augmented reality) and VR (virtual reality), such as viewfinders and head-mounted displays (HMDs), have been actively developed. Electronic devices are carried or attached to the user's body, so it is necessary to further reduce the size of the electronic devices. In addition, a display device that displays a video is mounted on the electronic device, so it is necessary to widen the video display surface of the display unit (display portion) that displays the video while reducing the outer dimensions of the display device.

[0003] One example of a display unit of a display device includes a display unit disclosed in Patent Document 1 described below. Patent Document 1 discloses that when a display unit is manufactured by pasting two substrates together, in order to prevent a second sealant located at the center of the display unit from breaking through a first sealant located at the periphery, a protrusion for reinforcing the first sealant is provided.

[0004] [Citation List]

[0005] [Patent Document]

[0006] Patent Document 1: Japanese Patent Publication No. 2009-146733 Summary of the invention

[0007] [Technical issues]

[0008] Conventionally, although a frame that surrounds the periphery and is opaque to light is generally provided in a display unit, in order to widen a video display surface while reducing the outer dimensions of the display unit, a configuration of a display unit without a frame is studied.

[0009] In addition, in the configuration of the display unit without an outer frame, in order to prevent the image quality of the video displayed in the pixel area from deteriorating, a light-blocking area is provided around the periphery of the video display surface (pixel area) of the display unit. In addition, in the case of adopting this configuration, in the manufacture of the display unit, the photocurable resin can enter the light-blocking area side from the pixel area, and the photocurable resin entering the light-blocking area can be uncured.

[0010] Therefore, in the present disclosure, novel and improved semiconductor devices, display devices, and electronic devices are proposed that can prevent a photocurable resin from being uncured and can also prevent the photocurable resin from entering a light blocking region from a pixel region.

[0011] [Solution to the problem]

[0012] The present disclosure provides a semiconductor device, including: a layered structure, in which a first substrate having a light-emitting element arranged in the layered structure and a second substrate having a light-blocking member arranged at the periphery are stacked on each other, the layered structure including: a first resin including a photocurable resin, which seals a portion between the first substrate and the second substrate in a pixel area located at the center of a plan view of the layered structure; a second resin, which seals a portion between the first substrate and the second substrate in a light-blocking area located at the periphery of the plan view of the layered structure; and a protrusion structure, which is arranged between the first substrate and the second substrate in a boundary area between the pixel area and the light-blocking area, and the protrusion structure includes a transparent or translucent material that transmits light.

[0013] In addition, the present disclosure provides a display device, including: a display part, including a layered structure, in which a first substrate having a light-emitting element arranged in the layered structure and a second substrate having a light-blocking member arranged at the periphery are stacked on each other; and a display control unit, which controls the display part, the layered structure including: a first resin including a photocurable resin, which seals a portion between the first substrate and the second substrate in a pixel area located at the center of a plan view of the layered structure; a second resin, which seals a portion between the first substrate and the second substrate in a light-blocking area located at the periphery in the plan view of the layered structure; and a protrusion structure, which is arranged between the first substrate and the second substrate in a boundary area between the pixel area and the light-blocking area, and the protrusion structure includes a transparent or translucent material that transmits light.

[0014] In addition, the present disclosure provides an electronic device, including: a display part, including a layered structure, in which a first substrate having a light-emitting element arranged in the layered structure and a second substrate having a light-blocking member arranged at the periphery are stacked on each other; and a control unit, which controls the display part, the layered structure including: a first resin including a photocurable resin, which seals a portion between the first substrate and the second substrate in a pixel area located at the center of a plan view of the layered structure; a second resin, which seals a portion between the first substrate and the second substrate in a light-blocking area located at the periphery in a plan view of the layered structure; and a protrusion structure, which is arranged between the first substrate and the second substrate in a boundary area between the pixel area and the light-blocking area, and the protrusion structure includes a transparent or translucent material that transmits light.

[0015] [Advantageous Effects of the Invention]

[0016] As described above, the present disclosure can prevent the photocurable resin from being uncured, and can also prevent the photocurable resin from entering the light blocking area from the pixel area.

[0017] Note that the advantageous effects are not necessarily limited to the above-described effects, and any advantageous effects shown in this specification or other advantageous effects that can be recognized from this specification can be obtained in addition to or instead of the above-described advantageous effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a plan view schematically showing a configuration example of a first display unit 10 of the present disclosure;

[0019] Figure 2 is a cross-sectional view schematically showing a configuration example of a display unit 10 according to a first embodiment of the present disclosure;

[0020] Figure 3 is a cross-sectional view schematically showing a configuration example of a display unit 10a according to a second embodiment of the present disclosure;

[0021] Figure 4 is a cross-sectional view schematically showing a configuration example of a display unit 10 b according to a modification of the second embodiment of the present disclosure;

[0022] Figure 5 is a cross-sectional view schematically showing a configuration example of a display unit 10c according to a third embodiment of the present disclosure;

[0023] Figure 6 is a cross-sectional view schematically showing a configuration example of a display unit 10d according to a modification of the third embodiment of the present disclosure;

[0024] Figure 7 is a cross-sectional view schematically showing a configuration example of a display unit 10 e according to a fourth embodiment of the present disclosure;

[0025] Figure 8 is a cross-sectional view schematically showing a configuration example of a display unit 10f according to a fourth embodiment of the present disclosure;

[0026] Fig. 9 is an external view showing an example of an electronic device to which the display unit 10 according to an embodiment of the present disclosure can be applied;

[0027] Fig.10 is an external view showing another example of an electronic device to which the display unit 10 according to an embodiment of the present disclosure can be applied;

[0028] Fig.11 is an external view showing still another example of an electronic device to which the display unit 10 according to an embodiment of the present disclosure can be applied;

[0029] Fig.12 is a cross-sectional view schematically showing a configuration example of a display unit 90 according to a comparative example. DETAILED DESCRIPTION

[0030] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Note that in this specification and the accompanying drawings, constituent elements having substantially the same functional configuration are given the same reference numerals, and description will not be repeated.

[0031] In addition, in different embodiments of the present specification and the drawings, there are cases where different letters are attached to the same reference numerals to distinguish similar components. However, in the case where similar components do not need to be particularly distinguished, only the same reference numerals are attached.

[0032] In addition, the drawings cited in the following description are drawings for describing the embodiments of the present disclosure and for facilitating the understanding of the description, and the shapes, sizes, ratios, etc. shown in the drawings may be different from those in reality to facilitate the understanding of the description. In addition, the design of the display unit shown in the drawings, the constituent elements included in the display unit, etc. may be appropriately changed with reference to the following description and known technologies. In addition, in the following description, the up-down direction of the layered structure of the display unit corresponds to the relative direction in the case where the display unit is arranged in such a way that the light emitted by the display unit is from bottom to top.

[0033] Furthermore, descriptions of specific lengths and shapes in the following description not only represent values ​​identical to mathematically defined numerical values ​​or geometrically defined shapes, but also include cases of industrially accepted differences in the manufacturing process of the display unit, etc., and include shapes similar to these shapes.

[0034] Furthermore, although an example of a case where an embodiment of the present disclosure is applied to a display unit of a display device that displays a video will be described below, the embodiment of the present disclosure can be applied not only to such a display unit but also to a lighting device that emits light.

[0035] Note that the embodiments will be described in the following order.

[0036] 1. Background technology for the present inventor to create the embodiments of the present disclosure

[0037] 2. First embodiment

[0038] 3. Second embodiment

[0039] 4. Third embodiment

[0040] 5. Fourth embodiment

[0041] 6. Conclusion

[0042] 7. Application Examples

[0043] 8. Supplement

[0044] <<1. Background technology for the present inventor to create the embodiments of the present disclosure>>

[0045] First, before describing the details of the embodiments of the present disclosure, reference will be made to Fig.12 The present inventors describe the background against which they created the embodiments of the present disclosure. Fig.12 is a cross-sectional view schematically showing an example of the configuration of a display unit 90 in a comparative example. Specifically, Fig.12 Corresponding to the display unit 90 along Figure 1 A cross section in the case where the line AA' depicting the plane of the display unit 10 shown in FIG. 1 is cut. Note that the comparative example here represents a display unit 90 studied by the present inventors before creating the embodiment of the present disclosure.

[0046] As described above, electronic devices that implement AR and VR, such as viewfinders and HMDs, have been actively developed in recent years. Electronic devices are carried or attached to the user's body, so it is necessary to further reduce the size of the electronic devices. Therefore, it is necessary to reduce the external dimensions of the display device mounted on the electronic device while widening the video display surface of the display unit.

[0047] Until now, the display unit generally has a light-proof outer frame surrounding the periphery of the display unit. However, in order to reduce the size of the outer shape of the display unit while widening the video display surface, the inventors have focused on the configuration of the display unit without an outer frame.

[0048] By not providing an outer frame, the video display surface can be widened while reducing the outer dimensions of the display unit. However, according to the research of the inventors, it is obvious that there is a situation in which light from the light-emitting element of the display unit or external light entering from the outside of the display unit is reflected by the lower part of the outer frame in the conventional display unit (i.e., an electrode including a metal film arranged at the periphery), so that the image quality of the displayed video is reduced. Therefore, in order to prevent the degradation of the image quality, the inventors came up with the idea of ​​providing a light-blocking area that blocks light at the periphery of the display unit.

[0049] Specifically, Fig.12 As shown, the display unit 90 of the comparative example conceived by the present inventors includes a layered structure including a counter substrate 100 and a mounting substrate 500 stacked on each other. In addition, a portion between the counter substrate 100 and the mounting substrate 500 in the pixel region 12, which is located at the center in the plan view of the display unit 90 and is provided with a plurality of light emitting elements, is sealed by an ultraviolet curable resin 400. At the same time, light is blocked in the light blocking region 30 located at the periphery in the plan view of the display unit 90, and a portion between the counter substrate 100 and the mounting substrate 500 is sealed by a thermosetting resin 402 instead of the ultraviolet curable resin 400.

[0050] In addition, if Fig.12As shown, in the comparative example, a partially light-blocking slit region 20 is provided between the pixel region 12 and the light-blocking region 30. In the comparative example, by providing the slit region 20, light entering through the slit can cure the photocurable resin 400 that enters the light-blocking region 30 side from the pixel region 12. That is, in the comparative example, providing the slit region 20 prevents the photocurable resin 400 from being uncured.

[0051] When the outer dimensions of the display unit 90 are reduced, and thus the viewing angle of the video display surface is reduced (when the area of ​​the video display surface is reduced), it is difficult to provide a slit region 20 having a sufficient width. According to the research of the present inventors, when the width of the slit region 20 is narrowed, it is difficult to cure the photocurable resin 400 that enters the light blocking region 30 side from the pixel region 12, and the photocurable resin 400 may be partially uncured.

[0052] Therefore, in view of the above, the inventors have created a display unit 10 according to an embodiment of the present disclosure, which can prevent the photocurable resin 400 from being uncured, and can also prevent the photocurable resin 400 from entering the light blocking area 30 from the pixel area 12. Specifically, the inventors have thought of providing a protrusion structure 310 (see Figure 2 ), the protrusion structure 310 prevents the photocurable resin 400 from entering the light blocking area 30 from the pixel area 12, and further uses a transparent or translucent material that transmits light to form the protrusion structure 310. This can prevent the photocurable resin 400 from entering the light blocking area 30 from the pixel area 12, and can cure the photocurable resin 400 around the protrusion structure 310, thereby preventing the photocurable resin 400 from being uncured. Hereinafter, the details of the embodiments of the present disclosure will be described in sequence.

[0053] Note, reference Figures 2 to 8 The shape of the protrusion structure 310 described above indicates that the protrusion structure 310 is Figure 1 The cross-sectional shape shown is the shape of the case cut along the line AA' unless otherwise specified.

[0054] <<2. First embodiment>>

[0055] First, refer to Figure 1 and Figure 2 A configuration of a display unit (semiconductor device) 10 according to a first embodiment of the present disclosure is described. Figure 1 is a plan view schematically showing a configuration example of the first display unit 10 according to the present disclosure. In addition, Figure 2 is a cross-sectional view schematically showing an example of the configuration of the display unit 10 according to the present embodiment. Specifically, Figure 2 Corresponding to the display unit 10 along Figure 1 The cross section of the case is shown cut along line AA'.

[0056] like Figure 1 As shown, the display unit 10 according to the present embodiment includes a pixel region 12, which is located at the center of the plan view of the display unit 10 (at a distance from Figure 1 In the case of viewing the display unit 10 from above, a plurality of pixels (light-emitting elements) are provided, and the pixel area 12 is a video display surface for displaying a video. Furthermore, in a plan view of the display unit 10, a light blocking area 30 having a light blocking member provided at the periphery is provided so as to surround the pixel area 12. Furthermore, in the present embodiment, a protrusion structure 310 is provided in a boundary area between the pixel area 12 and the light blocking area 30 so as to surround the pixel area 12 in a plan view of the display unit 10. In addition, in a plan view of the display unit 10, a slit area (slit structure) 20 that partially blocks light is provided between the protrusion structure 310 and the pixel area 12. Note that reference will be made later on. Figure 2 The details of the protrusion structure 310 are described.

[0057] like Figure 2 As shown, the display unit 10 according to the present embodiment includes a layered structure formed by stacking a counter substrate (second substrate) 100 and a mounting substrate (first substrate) 500 on each other. Note that Figure 2 A plurality of light emitting elements disposed on the mounting substrate 500 below the microlens 110 in the pixel region 12 are not shown.

[0058] The opposing substrate 100 is a light-transmitting substrate that transmits light emitted from each light-emitting element (not shown) provided on the mounting substrate 500, and for example, includes a glass substrate or a transparent resin substrate (e.g., polyethylene terephthalate, acrylic resin, polycarbonate, and polyolefin).

[0059] In addition, color filters 104, 204, 304 and 306 are arranged on the surface of the opposing substrate 100 facing the mounting substrate 500. Specifically, a red color filter 104, a green color filter 104 and a blue color filter 104 having a predetermined area corresponding to the light emitting element are arranged and distributed on the surface in the pixel area 12 in a predetermined arrangement. In addition, for example, in the slit area 20, a red color filter 304 and a blue color filter 204 provided with a plurality of slits are stacked on each other. Note that a color filter 204 provided with such a slit is provided to make an adjustment for partially blocking light. In addition, for example, a structure (light blocking member) including a red color filter 304 and a blue color filter 306 stacked on each other is provided in the light blocking area 30 to achieve light blocking. Note that in the present embodiment, the light blocking member of the light blocking area 30 is not limited to a combination of a red color filter 304 and a blue color filter 306, and other combinations can be used. In addition, for example, a material obtained by dispersing a pigment or a dye in a transparent binder such as silicone is used to form the color filters 104 , 204 , 304 , and 306 .

[0060] In addition, if Figure 2 As shown, a microlens 110 having a circular surface protruding toward the mounting substrate 500 is provided on the color filter 104 of the pixel region 12 so as to correspond to the light emitting element. For example, the microlens 110 includes a silicon-containing resin or the like.

[0061] In addition, if Figure 1 and Figure 2 As shown, in the present embodiment, the protrusion structure 310 is arranged to surround the pixel region 12 in a layer in the boundary region of the pixel region 12 and the light blocking region 30. In the manufacture of the display unit 10, the protrusion structure 310 prevents the photocurable resin 400 of the pixel region 12 from entering the thermosetting resin 402 side of the light blocking region 30.

[0062] The protrusion structure 310 includes a transparent or translucent material that transmits light, and for example, preferably, the protrusion structure 310 includes a silicon-containing resin or the like as in the microlens 110 or the like. In the present embodiment, the protrusion structure 310 is formed using a material similar to that of the microlens 110 or the like in the manufacture of the display unit 10. Therefore, the protrusion structure 310 can be formed in the same process as that of the microlens 110 or the like in the manufacture of the display unit 10, and the increase in the number of processes can be reduced. In addition, by forming the protrusion structure 310 using a transparent or translucent material that transmits light, even in the case where the photocurable resin 400 is located below or around the protrusion structure 310, the light transmitted through the protrusion structure 310 can cure the photocurable resin 400.

[0063] Specifically, the protrusion structure 310 is provided on the color filters 304 and 306 stacked on the surface of the counter substrate 100 facing the mounting substrate 500, with a cross section having a shape protruding toward the mounting substrate 500. Note that the electrode 502 is provided on the surface of the mounting substrate 500 facing the counter surface 100 described later. Therefore, in the plan view of the display unit 10, the protrusion structure 310 is preferably provided at a position closer to the pixel region 12 than the electrode 502, or the protrusion structure 310 is preferably provided to face the edge of the electrode 502 on the pixel region 12 side.

[0064] Furthermore, in the present embodiment, the tip portion (edge ​​portion on the driving substrate 500 side) of the protrusion structure 310 can be in contact with the mounting substrate 500, and, for example, the tip portion can be in contact with the electrode 502 on the mounting substrate 500. Preferably, the shape of the tip portion of the protrusion structure 310 is a hemispherical circle in cross section. Forming the tip portion of the protrusion structure 310 into a circle can prevent the tip portion from damaging the mounting substrate 500 side even if the tip portion is in contact with the mounting substrate 500. Note that by forming the protrusion structure 310 using a material similar to that of the microlens 110, a reflow process or the like can be used to easily process the tip portion of the protrusion structure 310 into a lens-like circular shape.

[0065] Furthermore, in the present embodiment, the protrusion structure 310 is preferably provided in such a manner that the tip portion of the protrusion structure 310 is closer to the surface of the mounting substrate 500 on the opposing substrate 100 side than the vertex (the edge portion on the mounting substrate 500 side) of each microlens 110, as shown in FIG. Figure 2 In this embodiment, based on the length of the protrusion structure 310 in the layer direction of the layered structure of the display unit 10 ( Figure 2 The distance between the counter substrate 100 and the mounting substrate 500 is adjusted based on the length of the protrusion structure 310 in the vertical direction, and the distance between the microlens 110 and the mounting substrate 500 is ensured to be appropriate. In the display unit 10, the distance between the microlens 110 and the light emitting element (not shown) provided on the mounting substrate 500 is a parameter that affects the optical characteristics in the display unit 10. Therefore, in the present embodiment, the distance between the counter substrate 100 and the mounting substrate 500 is adjusted based on the length of the protrusion structure 310, and the distance between the microlens 110 and the light emitting element on the mounting substrate 500 is ensured to be appropriate.

[0066] Specifically, in the present embodiment, for example, it is preferable to set the length ( Figure 2The length in the vertical direction of the protrusion structure 310 is set to about 1.5 μm to 2.5 μm, and preferably, the length of the protrusion structure 310 is set to about 3 μm. In addition, in the present embodiment, the thickness of the color filter 306 can be set to about 0.3 μm to 1.0 μm in order to adjust the distance between the counter substrate 100 and the mounting substrate 500.

[0067] Furthermore, as described above, in order to prevent the tip portion of the protrusion structure 310 from damaging the mounting substrate 500, the width ( Figure 2 ) is preferably narrower. However, in the case where the width is narrowed, the strength of the protrusion structure 310 becomes weaker, and the effect of the protrusion structure 310 preventing the photocurable resin 400 from entering the thermosetting resin 402 side of the light blocking area 30 may not be obtained. In addition, in the case where the width of the protrusion structure 310 is narrowed, the amount of photocurable resin 400 surrounding the protrusion structure 310 increases, which also leads to an increased possibility that the photocurable resin 400 is not cured. Therefore, in the present embodiment, it is preferred that the width of the protrusion structure 310 is selected so as to maintain the strength of the protrusion structure 310 at a level that can prevent the photocurable resin 400 from entering while avoiding damage to the mounting substrate 500 side. Specifically, in the present embodiment, for example, it is preferred that the width of the microlens 110 ( Figure 2 The length in the left-right direction of the protrusion structure 310 is set to about several μm, and the width of the protrusion structure 310 is set to about several tens to 100 μm.

[0068] The mounting substrate 500 includes, for example, a single crystal silicon, polycrystalline silicon or amorphous silicon substrate, a glass substrate, a plastic substrate, etc. On the mounting substrate 500, although not shown, a plurality of light emitting elements corresponding to pixels are arranged in a matrix form in the pixel region 12. Note that the plurality of light emitting elements included in the pixel region 12 include a plurality of light emitting elements corresponding to effective pixels for displaying a video, and may further include a plurality of light emitting elements corresponding to virtual pixels not used for displaying a video. Each light emitting element includes, for example, a light emitting layer and a Figure 2 In the embodiment, two electrode layers sandwiching the light-emitting layer in the up-down direction are provided, and the light-emitting element can emit light due to application of an electric field to the light-emitting layer. Note that in this embodiment, the light-emitting layer may be an organic light-emitting layer or may be an inorganic light-emitting layer, and the light-emitting layer is not particularly limited. In addition, in this embodiment, all the light-emitting elements may be formed to have the same structure, or may be formed to have different structures, and the structure is not particularly limited.

[0069] In addition, in this embodiment, wiring (not shown) electrically connecting the light emitting element, transistors (not shown), etc. may be provided on the mounting substrate 500. The transistors may control the driving of the light emitting element to display a desired video on the video display surface of the display unit 10, for example.

[0070] Furthermore, in the present embodiment, the electrode 502 is provided on the mounting substrate 500 so as to face the structure (light blocking member) including the red color filter 304 and the blue color filter 306 stacked on each other, as shown in FIG. Figure 2 The electrode 502 includes a metal material or the like, and is electrically connected to, for example, a transistor or the like provided on the mounting substrate 500 .

[0071] Furthermore, as described above, the display unit 10 according to the present embodiment is formed by laminating the counter substrate 100 and the mounting substrate 500 on each other, and includes the photocurable resin (first resin) 400 and the thermosetting resin (second resin) 402 for sealing the portion between the substrates.

[0072] Specifically, in the pixel region 12 and the slit region 20, the portion between the counter substrate 100 and the mounting substrate 500 is sealed by the photocurable resin 400. In the present embodiment, the photocurable resin 400 is a photocurable resin that is cured by ultraviolet rays or visible light, and examples of the photocurable resin 400 include silicone resin, epoxy resin, and acrylic resin. In the manufacture of the display unit 10, the photocurable resin 400 is cured by ultraviolet rays or visible light that is transmitted through the counter substrate 100, the color filters 104 and 304, and the microlens 110, and the photocurable resin 400 seals the portion between the counter substrate 100 and the mounting substrate 500.

[0073] At the same time, in the light blocking area 30, the portion between the counter substrate 100 and the mounting substrate 500 is sealed by a thermosetting resin 402. In the present embodiment, the thermosetting resin 402 is a thermosetting resin that is cured by applying heat, and examples of the thermosetting resin 402 include acrylic resin, polyurethane resin, epoxy resin, and silicone resin. In the manufacture of the display unit 10, the thermosetting resin 402 is cured by applying heat to the light blocking area 30, and the thermosetting resin 402 seals the portion between the counter substrate 100 and the mounting substrate 500.

[0074] Note that in the present embodiment, the resin used to seal the light blocking area 30 is not limited to a thermosetting resin, and for example, an energy ray curable resin, a light curable resin as described above, or other resins can be used. Examples of energy ray curable resins include acrylic resins, polyurethane resins, epoxy resins, and silicone resins cured by, for example, electron beams, laser beams, ionizing radiation (e.g., X-rays, α-rays, β-rays, and γ-rays), microwaves, and high-frequency energy rays.

[0075] Note that in this embodiment, at least a portion of the surface of the tip portion of the protrusion structure 310 may be Figure 2The photocurable resin 400 shown covers and / or may be covered by the thermosetting resin 402. In this embodiment, even when one or both of the photocurable resin 400 and the thermosetting resin 402 surround the protrusion structure 310, light passing through the protrusion structure 310 and heat applied to the light blocking area 30 may cure the resin.

[0076] As described above, in the present embodiment, light and heat can be applied to cure the photocurable resin 400 and the thermosetting resin 402, respectively, to seal the portion between the counter substrate 100 and the mounting substrate 500 stacked on each other. In the present embodiment, the protrusion structure 310 is provided to prevent the photocurable resin 400 from entering the thermosetting resin 402 side of the light blocking area 30. As a result, the present embodiment can reduce the width of the slit area 20 as a buffer for preventing the photocurable resin 400 from entering the light blocking area 30, while curing the entered photocurable resin 400, and the pixel area 12 can be widened. In addition, in the present embodiment, even in the case where the photocurable resin 400 is located below or around the protrusion structure 310, the light passing through the protrusion structure 310 can cure the photocurable resin 400. That is, the present embodiment can prevent the photocurable resin 400 from being uncured, and can also prevent the photocurable resin 400 from entering the light blocking area 30 from the pixel area 12.

[0077] Note that the display unit 10 according to the present embodiment is not limited to Figure 1 and 2 mode shown. For example, the protrusion structure 310 may be provided on the surface of the mounting substrate 500 on the opposing substrate 100 side, and may have a shape that protrudes from the mounting substrate 500 toward the opposing substrate 100. In this case, it is also preferred that the protrusion structure 310 is provided at a position closer to the pixel area 12 than the electrode 502 in a plan view of the display unit 10. In the case of providing the protrusion structure 310 that protrudes from the mounting substrate 500 toward the opposing substrate 100, the protrusion structure 310 may also prevent the photocurable resin 400 from entering the thermosetting resin 402 side of the light blocking area 30. Furthermore, even in this case, the photocurable resin 400 located above or around the protrusion structure 310 may be cured by light passing through the protrusion structure 310.

[0078] <<3. Second embodiment>>

[0079] In the first embodiment, the protrusion structure 310 is arranged to surround the pixel region 12 by a single layer. However, in the embodiment of the present disclosure, the arrangement of the protrusion structure 310 is not limited to the arrangement in which the protrusion structure 310 is arranged to surround the pixel region 12 by a single layer, and the protrusion structure 310 may be arranged to surround the pixel region 12 by two or three layers. As described above, providing the protrusion structure 310 to surround the pixel region 12 by two or three layers can further prevent the photocurable resin 400 from entering the light blocking region 30 side. In the following, reference will be made to Figure 3 A display unit 10 a according to a second embodiment of the present disclosure is described, which includes three protrusion structures 310 a disposed to surround a pixel region 12 through three layers. Figure 3 is a cross-sectional view schematically showing a configuration example of a display unit 10a according to a second embodiment of the present disclosure, and Figure 3 Corresponding to the display unit 10a along Figure 1 The cross section is shown in the case where the line AA' is cut.

[0080] In this embodiment, three protrusion structures 310a are arranged to surround the pixel region 12 in three layers in the boundary region between the pixel region 12 and the light blocking region 30. Figure 3 In the cross-sectional view of FIG. 1 , three protrusion structures 310 a are arranged in a direction from the pixel region 12 toward the light blocking region 30. Preferably, the protrusion structure 310 a comprises a transparent or translucent material that transmits light, as in the first embodiment, and Figure 3 As shown, the protrusion structure 310 a may be disposed on the color filter 204 , including a plurality of slits disposed on the color filter 304 .

[0081] In the present embodiment, three protrusion structures 310a are also preferably provided at positions closer to the pixel region 12 than the electrode 502 in the plan view of the display unit 10. Alternatively, the protrusion structure 310a positioned closest to the light blocking region 30 may be provided at an edge of the pixel region 12 side facing the electrode 502 on the mounting substrate 500. Furthermore, in the present embodiment, the tip portions of the three protrusion structures 310a may be in contact with the mounting substrate 500.

[0082] In this way, according to the present embodiment, three protrusion structures 310a are provided to surround the pixel region 12 by three layers, and the photocurable resin 400 can be further prevented from entering the light blocking region 30. In addition, in the present embodiment, even in the case where the photocurable resin 400 is located under or around the protrusion structure 310a, the photocurable resin 400 can be cured by light passing through the protrusion structure 310a.

[0083] Note that this embodiment is not limited to Figure 3The three protrusion structures 310a are provided to surround the pixel region 12 by three layers. For example, in the present embodiment, two protrusion structures 310a surrounding the pixel region 12 by two layers may be provided, or a plurality of protrusion structures 310a surrounding the pixel region 12 by four or more layers may be provided. This arrangement is not particularly limited.

[0084] In addition, this embodiment can also be Figure 4 In the following, reference will be made to Figure 4 A modification of the present embodiment is described. Figure 4 is a cross-sectional view schematically showing a configuration example of a display unit 10b according to a modification of the present embodiment, and Figure 4 Corresponding to the display unit 10b along Figure 1 The cross section is shown in the case where the line AA' is cut.

[0085] like Figure 4 As shown, in the present modification, three protrusion structures 310b are provided so that, as in the second embodiment, the pixel region 12 is surrounded by three layers in the boundary region between the pixel region 12 and the light blocking region 30. In addition, in the present modification, three protrusion structures 310b are provided so that the length of the three protrusion structures 310b in the layer direction of the layered structure of the display unit 10 (in Figure 4 The length in the up-down direction of the protrusion structure 310a increases sequentially in the direction from the pixel area 12 to the light blocking area 30. In the present variation, the tip portion of the protrusion structure 310b closest to the light blocking area 30 among the three protrusion structures 310a can contact the mounting substrate 500. In the present variation, the length of the protrusion structure 310b positioned closest to the light blocking area 30 can also be adjusted to adjust the distance between the opposing substrate 100 and the mounting substrate 500, and the distance between the microlens 110 and the light-emitting element (not shown) on the mounting substrate 500 can be ensured to be appropriate.

[0086] In the present variation, providing three protrusion structures 310b can prevent the photocurable resin 400 from entering the light blocking area 30. In addition, in the present variation, the three protrusion structures 310b are provided in such a manner that the lengths of the three protrusion structures 310b in the layer direction of the layered structure of the display unit 10 increase sequentially in the direction from the pixel area 12 to the light blocking area 30. Therefore, even if the tip portion of the protrusion structure 310b contacts the mounting substrate 500, in the present variation, only the tip portion of the protrusion structure 310b closest to the light blocking area 30 can contact the mounting substrate 500, and the area in contact with the mounting substrate 500 can be further reduced. As a result, the present variation can further prevent the tip portion from causing damage to the mounting substrate 500 side.

[0087] Note that this variant is not limited to Figure 4The arrangement of three protrusion structures 310b arranged around the pixel region 12 by three layers is shown. For example, in this variation, two protrusion structures 310b may be arranged around the pixel region 12 in two layers, or a plurality of protrusion structures 310b may be arranged around the pixel region 12 in four or more layers. This arrangement is not particularly limited.

[0088] <<4. Third embodiment>>

[0089] In the first embodiment, a material similar to that of the microlens 110 and the like is used to form the protrusion structure 310. However, in the embodiment of the present disclosure, it is only necessary to use a transparent or translucent material that transmits light to form the protrusion structure 310, and the material is not limited to a material similar to that of the microlens 110. In the embodiment of the present disclosure, for example, a material similar to that of the color filters 104, 204, 304, and 306 and the like may be used to form the protrusion structure 310. In this way, a material similar to that of the color filter 104 and the like may be used to form the protrusion structure 310, so that the protrusion structure 310 is formed in the same process as that of the color filter 104 and the like in the manufacture of the display unit 10, and an increase in the number of processes may be reduced.

[0090] In the following, reference will be made to Figure 5 A display unit 10 c according to a third embodiment of the present disclosure is described, the display unit 10 c including a protrusion structure 310 c including a material similar to that of the color filter 104 and the like. Figure 5 is a cross-sectional view schematically showing a configuration example of a display unit 10c according to a third embodiment of the present disclosure, and Figure 5 Corresponding to the display unit 10c along Figure 1 The cross section is shown in the case where the line AA' is cut.

[0091] As described above, in the display unit 10, the distance between the microlens 110 and the light emitting element (not shown) provided on the mounting substrate 500 is one parameter that affects the optical characteristics in the display unit 10. Therefore, in the manufacture of the display unit 10, it is necessary to accurately adjust the distance between the microlens 110 and the light emitting element, that is, the distance between the microlens 110 and the mounting substrate 500.

[0092] Therefore, in the present embodiment, a material similar to that of the color filter 104 or the like is used to form the protrusion structure 310c in order to more accurately adjust the length ( Figure 5The film thickness of the material of the color filter 104 or the like can be easily adjusted, and the material can also be easily processed. Therefore, the protrusion structure 310 can be formed using a material similar to that of the color filter 104 or the like, so that the length of the protrusion structure 310c can be adjusted more accurately.

[0093] Specifically, Figure 5 As shown, in this embodiment, three color filters 314 are stacked on each other to form a protrusion structure 310c. The three color filters 314 are, for example, color filters 314 of three different colors. However, in this embodiment, the combination of colors of the three color filters 314 is not particularly limited.

[0094] Furthermore, the protrusion structure 310c is provided on the counter substrate 100 and has a columnar shape protruding toward the mounting substrate 500, as in the embodiments so far. Furthermore, although it is preferred that the shape of the tip portion of the protrusion structure 310c is a hemispherical circle, as in the embodiments so far, the tip portion may be flat, as in Figure 5 as shown (specifically, a shape having a surface substantially parallel to the opposite surface of the mounting substrate 500).

[0095] In this way, according to the present embodiment, the color filter 314 that allows easy adjustment of the film thickness and easy processing is used to form the protrusion structure 301c, and the length of the protrusion structure 310c can be adjusted more accurately. In addition, according to the present embodiment, by forming the protrusion structure 310c using a material similar to that of the color filter 104, etc., in the manufacture of the display unit 10c, the protrusion structure 310c can be formed in the same process as the process of the color filter 104, etc., and the increase in the number of processes can be reduced.

[0096] In addition, this embodiment can also be Figure 6 In the following, reference will be made to Figure 6 A modification of the present embodiment is described. Figure 6 is a cross-sectional view schematically showing a configuration example of a display unit 10d according to a modification of the present embodiment, and Figure 6 Corresponding to the display unit 10d along Figure 1 The cross-sectional view is a case where the line AA' is cut.

[0097] like Figure 6 As shown, in this modification, as in the third embodiment, the color filter 314 that allows easy adjustment of the film thickness and easy processing is used to form the protrusion structure 310d. In addition, the microlens 320 is formed on the three color filters 314 stacked on each other to form the protrusion structure 310d including the hemispherical round tip portion in this modification.

[0098] In this modification, the color filter 314 and the microlens 320 that allow easy adjustment of the film thickness and easy processing are combined to form the protrusion structure 310d, and the length of the protrusion structure 310d can be adjusted more accurately. In addition, in this modification, a material similar to that of the color filter 104 and the like can also be used to form the protrusion structure 310d, and in the manufacture of the display unit 10d, the protrusion structure 310d can be formed in the same process as that of the color filter 104 and the like. Therefore, the increase in the number of processes can be reduced.

[0099] <<5. Fourth embodiment>>

[0100] In the description of the first to third embodiments, the tip portion of the protrusion structure 310 has a spherical round or flat shape. However, the shape of the protrusion structure 310 according to the embodiment of the present disclosure is not limited to these shapes. Figure 7 and Figure 8 The shape of the protrusion structure 310 is described in the fourth embodiment of the present disclosure. Figure 7 is a cross-sectional view schematically showing an example of the configuration of a display unit 10e according to the present embodiment, Figure 8 is a cross-sectional view schematically showing an example of the configuration of the display unit 10f according to the present embodiment. Note that Figure 7 and Figure 8 Corresponding to display units 10e and 10f along Figure 1 A cross section of the case cut along line AA' shown in FIG.

[0101] As described above, in the embodiment of the present disclosure, the tip portion of the protruding structure 310 may contact the mounting substrate 500 (including the electrode 502). However, in the embodiment of the present disclosure, even if the tip portion contacts the mounting substrate 500, it is preferable to avoid the tip portion from damaging the mounting substrate 500 side. Therefore, in the embodiment of the present disclosure, preferably, the area where the tip portion of the protruding substrate 310 contacts the surface of the mounting substrate 500 is small.

[0102] Thus, for example, a reflow process or the like is performed to process the tip portion of the protrusion structure 310 into a circular shape similar to the lens in the first embodiment, so that the tip portion and the surface of the mounting substrate 500 are in contact with a thin line to form a line contact. In this way, the contact area can be reduced. This can prevent friction between the tip portion and the mounting substrate 500, thereby preventing the tip portion from damaging the mounting substrate 500 side.

[0103] In addition, if Figure 7 As shown, in the fourth embodiment of the present disclosure, the protrusion structure 310e may have a stepped shape. Specifically, the protrusion structure 310e is provided on the counter substrate 100 and has a stepped shape narrowing toward the mounting substrate 500 in cross section.

[0104] As described above, for the protrusion structure 310, it is necessary to ensure strength for preventing the entry of the photocurable resin 400 while preventing damage on the mounting substrate 500 side. Therefore, in the present embodiment, the tip portion of the protrusion structure 310e may be thinned to reduce the contact area of ​​the tip portion and the mounting substrate 500, and this can prevent damage on the mounting substrate 500 side. In addition, in the present embodiment, the width of the protrusion structure 310e on the counter substrate 100 side may be widened to ensure strength of the protrusion structure 310e, thereby preventing the entry of the photocurable resin 400.

[0105] In addition, if Figure 8 As shown, in the fourth embodiment of the present disclosure, the protrusion structure 310f can be configured in such a way that the portion whose cross section is rectangular on the opposing substrate 100 side and the portion whose cross section is brush head-shaped on the mounting substrate 500 side overlap each other. Because the tip portion of the protrusion structure 310f has a brush head shape, this configuration can also reduce the contact area between the tip portion and the mounting substrate 500, and this can prevent damage to the mounting substrate 500 side. In addition, according to this configuration, the protrusion structure 310f includes a portion whose cross section is rectangular on the opposing substrate 100 side, and the width of the portion of the protrusion structure 310f on the opposing substrate 100 side (in Figure 8 As a result, according to the present configuration, the strength of the protrusion structure 310f for preventing the photocurable resin 400 from entering can be ensured.

[0106] In addition, in the embodiment of the present disclosure, the protrusion structure 310 is not limited to Figures 2 to 8 For example, the protrusion structure 310 may be provided on the opposite substrate 100 and may have a tapered shape that becomes thinner toward the mounting substrate 500 in cross section.

[0107] <<6. Conclusion>>

[0108] In this way, according to an embodiment of the present disclosure, a protrusion structure 310 is provided, which can prevent the photocurable resin 400 from entering the thermosetting resin 402 side of the light blocking area 30. As a result, the present embodiment can reduce the width of the slit area 20, which is a buffer area to prevent the photocurable resin 400 from entering the light blocking area 30, while curing the entered photocurable resin 400, and can widen the pixel area 12. In addition, in the present embodiment, even in the case where the photocurable resin 400 is located below or around the protrusion structure 310, the light passing through the protrusion structure 310 can cure the photocurable resin 400 because the protrusion structure 310 includes a transparent or translucent material that transmits light. That is, the present embodiment can prevent the photocurable resin 400 from being uncured, and can also prevent the photocurable resin 400 from entering the light blocking area 30 from the pixel area 12.

[0109] In addition, the embodiments of the present disclosure may be combined with each other and performed. For example, the second embodiment and the third embodiment may be combined to provide a plurality of protrusion structures 310 including a plurality of color filters 314. In addition, for example, the second embodiment and the fourth embodiment may be combined to provide a plurality of protrusion structures 310 having a stepped cross-section.

[0110] In addition, methods, equipment, and conditions for manufacturing general semiconductor devices (including packaging) can be used to manufacture the display unit 10 according to the present embodiment. For example, a spin coating method, a sputtering method, a CVD (chemical vapor deposition) method, a photolithography method, an etching method, a CMP (chemical mechanical polishing) method, a metal plating method, etc. can be appropriately used to manufacture the counter substrate 100 and the mounting substrate 500 included in the display unit 10 according to the present embodiment. In addition, according to the present embodiment, an existing manufacturing process of a semiconductor device can be used to seal the counter substrate 100 and the mounting substrate 500 included in the display unit 10. That is, the display unit 10 according to the present embodiment can be easily and inexpensively manufactured using an existing manufacturing process of a semiconductor device.

[0111] <<7. Application Examples>>

[0112] Next, we will refer to Figures 9 to 11 An application example of the display unit 10 according to the embodiment of the present disclosure is described. Figures 9 to 11 is an external view showing an example of an electronic device to which the display unit 10 according to an embodiment of the present disclosure can be applied.

[0113] For example, the display unit 10 according to the present embodiment can be applied to a display portion included in an electronic device such as a smart phone. Fig. 9 As shown, the smartphone 900 includes a display portion 901 that displays various types of information and an operation unit 903 including buttons and the like for receiving an operation input from a user. The display portion 901 may be the display unit 10 according to the present embodiment. In addition, for example, a control unit (display control unit) (not shown) is provided inside the smartphone 900, which includes a CPU (central processing unit) and controls various functional units of the smartphone 900, for example, the display portion 901.

[0114] In addition, the display unit 10 according to the present embodiment can be applied to, for example, a display portion of an electronic device (eg, a digital camera). Specifically, as shown in FIG. 1 , an external view of a digital camera 910 viewed from the back (photographer's side) is depicted. Fig.10As shown, the digital camera 910 includes a main unit (camera body) 911, a monitor unit 917 that displays various types of information, and an EVF (Electronic Viewfinder) 919 that displays an image through the lens observed by the user during shooting. Here, the monitor unit 917 and the EVF 919 may be the display unit 10 according to the present embodiment. In addition, for example, a control unit is provided inside the main unit 911, which includes a CPU and controls various functional units of the digital camera 910, for example, the monitor unit 907.

[0115] In addition, for example, the display unit 10 according to the present embodiment can be applied to a display portion of an electronic device (eg, HMD). Fig.11 As shown, the HMD 920 includes a glasses-type display portion 921 that displays various types of information and an ear hook unit 923 that is hung on the user's ear when the user wears the HMD 920. Here, the display portion 921 may be the display unit 10 according to the present embodiment.

[0116] Note that the electronic device to which the display unit 10 according to the present embodiment can be applied is not limited to the above examples. The display unit 10 according to the present embodiment can be applied to the display portion of an electronic device in any field that displays an image based on an image signal input from the outside or an image signal generated internally. Examples of such electronic devices include television equipment, electronic books, PDAs (personal digital assistants), notebook personal computers, video cameras, and game devices.

[0117] <<8.Supplement>>

[0118] Although the preferred embodiments of the present disclosure have been described in detail above with reference to the accompanying drawings, the technical scope of the present disclosure is not limited to these examples. Obviously, a person with ordinary knowledge in the technical field of the present disclosure can make various modifications or variations within the scope of the technical ideas described in the claims, and it should be understood that these modifications and variations obviously belong to the technical scope of the present disclosure.

[0119] In addition, the advantageous effects described in this specification are only explanatory or illustrative, and not restrictive. That is, in addition to or in place of the above-mentioned advantageous effects, according to the description of this specification, other advantageous effects that are obvious to those skilled in the art can be obtained according to the technology disclosed in this disclosure.

[0120] Note that the following configurations also belong to the technical scope of the present disclosure.

[0121] (1) A semiconductor device comprising:

[0122] a layered structure in which a first substrate provided with a light emitting element and a second substrate provided with a light blocking member at the periphery are stacked on each other,

[0123] The hierarchical structure includes:

[0124] a first resin including a photocurable resin, sealing a portion between the first substrate and the second substrate in a pixel region located at the center of a plan view of the layered structure,

[0125] a second resin sealing a portion between the first substrate and the second substrate in a light blocking region located at the periphery in a plan view of the layered structure, and

[0126] The protrusion structure is disposed between the first substrate and the second substrate in a boundary region between the pixel region and the light blocking region, and the protrusion structure includes a transparent or semi-transparent material that transmits light.

[0127] (2) The semiconductor device according to (1), wherein

[0128] The second resin includes a thermosetting resin.

[0129] (3) The semiconductor device according to (1) or (2), wherein:

[0130] A plurality of lenses are disposed on the substrate at the center of the second substrate in a plan view, and

[0131] The protrusion structure includes the same material as that of the lens.

[0132] (4) The semiconductor device according to any one of (1) to (3), wherein

[0133] The light blocking member includes layered color filters, and

[0134] The protrusion structure includes the same material as that of the color filter.

[0135] (5) The semiconductor device according to any one of (1) to (4), wherein

[0136] In a plan view of the layered structure, the protrusion structure is disposed to surround a pixel region.

[0137] (6) The semiconductor device according to (3), wherein

[0138] The protrusion structure is disposed on the second substrate and has a shape protruding toward the first substrate.

[0139] (7) The semiconductor device according to (6), wherein

[0140] The tip portion of the protrusion structure is located closer to the first substrate than the vertex of each lens.

[0141] (8) The semiconductor device according to (6), wherein

[0142] The electrode is provided on the second substrate to be opposite to the light blocking member in the layered structure, and

[0143] In a plan view of the layered structure, the protrusion structure is located closer to the pixel region than the electrode.

[0144] (9) The semiconductor device according to (8), wherein

[0145] The protrusion structure contacts the second substrate.

[0146] (10) The semiconductor device according to (6), wherein

[0147] The electrode is provided on the second substrate to be opposite to the light blocking member in the layered structure, and

[0148] The protrusion structure faces an edge portion of the electrode on the pixel region side.

[0149] (11) The semiconductor device according to (10), wherein

[0150] The protrusion structure contacts the electrode.

[0151] (12) The semiconductor device according to any one of (6) to (11), wherein

[0152] The protrusion structure includes a rounded tip portion.

[0153] (13) The semiconductor device according to (12), wherein:

[0154] At least a portion of the surface of the tip portion is covered with a first resin.

[0155] (14) The semiconductor device according to (12) or (13), wherein:

[0156] At least a portion of the surface of the tip portion is covered with a second resin.

[0157] (15) The semiconductor device according to any one of (1) to (14), wherein

[0158] In a plan view of the layered structure, a slit structure that partially blocks light is provided between the protrusion structure and the pixel region.

[0159] (16) The semiconductor device according to any one of (1) to (15), wherein

[0160] The layered structure includes a plurality of protrusion structures arranged in a direction from the pixel region toward the light blocking region.

[0161] (17) The semiconductor device according to (16), wherein

[0162] Lengths of the plurality of protrusion structures in the layer direction of the layered structure sequentially increase in a direction from the pixel region toward the light blocking region.

[0163] (18) A display device comprising:

[0164] A display section including a layered structure in which a first substrate provided with a light emitting element and a second substrate provided with a light blocking member at the periphery are stacked on each other; and

[0165] A display control unit controls the display portion.

[0166] The hierarchical structure includes:

[0167] a first resin including a photocurable resin, sealing a portion between the first substrate and the second substrate in a pixel region located at a center of a plan view of the layered structure,

[0168] a second resin that seals a portion between the first substrate and the second substrate in a light blocking region located at the periphery in a plan view of the layered structure, and

[0169] The protrusion structure is disposed between the first substrate and the second substrate in a boundary region between the pixel region and the light blocking region, and the protrusion structure includes a transparent or semi-transparent material that transmits light.

[0170] (19) An electronic device comprising:

[0171] A display section including a layered structure in which a first substrate provided with a light emitting element and a second substrate provided with a light blocking member at the periphery are stacked on each other; and

[0172] a control unit for controlling the display portion,

[0173] The hierarchical structure includes:

[0174] a first resin including a photocurable resin, sealing a portion between the first substrate and the second substrate in a pixel region located at the center of a plan view of the layered structure,

[0175] a second resin that seals a portion between the first substrate and the second substrate in a light blocking region located at the periphery in a plan view of the layered structure, and

[0176] The protrusion structure is disposed between the first substrate and the second substrate in a boundary region between the pixel region and the light blocking region, and the protrusion structure includes a transparent or semi-transparent material that transmits light.

[0177] [Explanation of symbols]

[0178] 10, 10a, 10b, 10c, 10d, 10e, 10f, 90: Display unit

[0179] 12: Pixel area

[0180] 20: Slit area

[0181] 30: Light blocking area

[0182] 100: Opposing substrate

[0183] 104, 204, 304, 306, 314: Color filter

[0184] 110, 320: Microlens

[0185] 310, 310a, 310b, 310c, 310d, 310e, 310f: protrusion structure

[0186] 400: Light-curing resin

[0187] 402: Thermosetting resin

[0188] 500: Install the base plate

[0189] 502: Electrode

[0190] 900: Smartphone

[0191] 901, 921: Display part

[0192] 903: Operation unit

[0193] 910: Digital Camera

[0194] 911: Main unit

[0195] 917: Surveillance Unit

[0196] 919: EVF

[0197] 920: HMD

[0198] 923: Ear hook unit.

Claims

1. A semiconductor device comprising: a layered structure in which a first substrate provided with a light emitting element and a second substrate provided with a substrate light shielding member at the periphery are stacked on each other, The hierarchical structure includes: a first resin including a photocurable resin that seals a portion between the first substrate and the second substrate in a pixel region located at a center of a plan view of the layered structure, a second resin that seals a portion between the first substrate and the second substrate in a light blocking region located at the periphery in a plan view of the layered structure, and A protrusion structure is provided between the first substrate and the second substrate in a boundary region between the pixel region and the light blocking region, and the protrusion structure includes a transparent or semi-transparent material that transmits light.

2. The semiconductor device according to claim 1, wherein The second resin includes a thermosetting resin.

3. The semiconductor device according to claim 1, wherein: A plurality of lens substrates are provided at the center of the second substrate in a plan view, and The protrusion structure includes the same material as that of the lens.

4. The semiconductor device according to claim 1, wherein: The light blocking member includes layered color filters, and The protrusion structure includes the same material as that of the color filter.

5. The semiconductor device according to claim 1, wherein In a plan view of the layered structure, the protrusion structure is disposed to surround the pixel region.

6. The semiconductor device according to claim 3, wherein: The protrusion structure is disposed on the second substrate and has a shape protruding toward the first substrate.

7. The semiconductor device according to claim 6, wherein: The tip portion of the protrusion structure is located closer to the first substrate than an apex of each of the lenses.

8. The semiconductor device according to claim 6, wherein: An electrode is provided on the second substrate to be opposite to the light blocking member in the layered structure, and In a plan view of the layered structure, the protrusion structure is located closer to the pixel region than the electrode.

9. The semiconductor device according to claim 8, wherein: The protrusion structure contacts the second substrate.

10. The semiconductor device according to claim 6, wherein An electrode is provided on the second substrate to be opposite to the light blocking member in the layered structure, and The protrusion structure faces an edge portion of the electrode on a pixel region side.

11. The semiconductor device according to claim 10, wherein: The protrusion structure contacts the electrode.

12. The semiconductor device according to claim 6, wherein: The protrusion structure includes a rounded tip portion.

13. The semiconductor device according to claim 12, wherein: At least a portion of a surface of the tip portion is covered with the first resin.

14. The semiconductor device according to claim 12, wherein: At least a portion of the surface of the tip portion is covered with the second resin.

15. The semiconductor device according to claim 1, wherein In a plan view of the layered structure, a slit structure that partially blocks light is provided between the protrusion structure and the pixel region.

16. The semiconductor device according to claim 1, wherein The layered structure includes a plurality of protrusion structures arranged in a direction from the pixel area toward the light blocking area.

17. The semiconductor device according to claim 16, wherein: The lengths of the plurality of protrusion structures in the layer direction of the layered structure sequentially increase in a direction from the pixel region toward the light blocking region.

18. A display device comprising: A display portion including a layered structure in which a first substrate provided with a light emitting element and a second substrate provided with a light blocking member at the periphery are stacked on each other; as well as A display control unit controls the display portion. The hierarchical structure includes: a first resin including a photocurable resin that seals a portion between the first substrate and the second substrate in a pixel region located at a center of a plan view of the layered structure, a second resin that seals a portion between the first substrate and the second substrate in a light blocking region located at the periphery in a plan view of the layered structure, and A protrusion structure is provided between the first substrate and the second substrate in a boundary region between the pixel region and the light blocking region, and the protrusion structure includes a transparent or semi-transparent material that transmits light.

19. An electronic device comprising: A display portion including a layered structure in which a first substrate provided with a light emitting element and a second substrate provided with a light blocking member at the periphery are stacked on each other; as well as a control unit for controlling the display portion, The hierarchical structure includes: a first resin including a photocurable resin that seals a portion between the first substrate and the second substrate in a pixel region located at a center of a plan view of the layered structure, a second resin that seals a portion between the first substrate and the second substrate in a light blocking region located at the periphery in a plan view of the layered structure, and A protrusion structure is provided between the first substrate and the second substrate in a boundary region between the pixel region and the light blocking region, and the protrusion structure includes a transparent or semi-transparent material that transmits light.

Images