Organic light emitting display device and manufacturing method thereof

Abstract

An organic light-emitting display device and a manufacturing method thereof. An organic light-emitting display device is provided. The organic light-emitting display device includes: a transparent substrate member; a touch sensor, the touch sensor including a touch electrode disposed on the transparent substrate member and a touch protection layer covering the touch electrode; a black matrix, the black matrix is ​​disposed below or above the touch sensor and defines a plurality of opening areas; a plurality of color filters, the plurality of color filters are disposed on the same plane as the black matrix and correspond to the plurality of opening areas; a first buffer layer, the first buffer layer is disposed on the touch sensor and the plurality of color filters; a thin film transistor, the thin film transistor is disposed on the first buffer layer; and an organic light-emitting element, disposed on the thin film transistor and corresponding to the plurality of opening areas.

Description

Technical Field

[0001] The present invention relates to an organic light emitting display device, and more particularly, to a bottom emission type organic light emitting display device including a color filter and a touch sensor and a method for manufacturing the same. Background Art

[0002] An organic light emitting display device (OLED) does not require a separate light source, unlike a liquid crystal display device (LCD) including a backlight. Therefore, the organic light emitting display device can be manufactured to be thin and light, has process advantages, and has low power consumption due to low voltage driving. First, the organic light emitting display device includes a self-luminous element and includes a layer formed of an organic thin film, so that the flexibility and elasticity are superior to other display devices, and thus it is advantageously implemented as a flexible display device.

[0003] Generally, an organic light-emitting display device is a display device using an organic light-emitting element, in which electrons and holes from a cathode for injecting electrons and an anode for injecting holes are injected into a light-emitting layer, and excitons formed by coupling the injected electrons and holes drop from an excited state to a ground state to emit light.

[0004] In addition, recently, the organic light-emitting display device is formed into a touch screen integrated display device including a touch screen panel that recognizes a user's touch. Specifically, as electronic devices with a touch input function (such as smart phones or tablet PCs) are widely used, the demand for display devices capable of sensing various touch inputs has increased. However, in many cases, the touch screen panel is attached to the front surface of the display device by an adhesive. In this case, the touch screen panel is separately manufactured to be attached to the front surface of the display panel, thereby increasing the attachment process, which increases the process complexity and cost.

[0005] In addition, generally, an organic light emitting display device includes an anode, a cathode and an organic light emitting layer disposed therebetween. However, a metal material having a high reflectivity is used to form the cathode, so that external light is reflected by the metal material, thereby reducing the reflective visibility and contrast. Therefore, in order to reduce the reflection of external light, a polarizer is provided under the cover member to absorb the external light. The polarizer is a film having a predetermined light transmittance, and absorbs external light and its reflected light to suppress the reduction in contrast. However, the polarizer is an expensive element and has a relatively large thickness, making it unsuitable for thickness reduction. In addition, there is a problem in that the polarizer also partially absorbs the light emitted from the organic light emitting layer, thereby reducing the luminous efficiency. Summary of the invention

[0006] First, the inventors of the present disclosure have invented an organic light-emitting display device, which uses an anti-reflection layer integrating a color filter and a black matrix to replace a polarizer to solve the increased cost and increased thickness of the display device caused by the polarizer. The anti-reflection layer having the above structure is thinner than the polarizer to be applicable to various types of organic light-emitting display devices, such as a curved organic light-emitting display device or a foldable organic light-emitting display device.

[0007] Next, in order to improve the increased cost and increased thickness of the display device when a separate touch screen panel is attached to the display device, the inventors of the present disclosure considered a method of forming a touch sensor in an organic light-emitting display device by directly forming a touch electrode on an encapsulation layer for protecting an organic light-emitting element.

[0008] However, the inventors of the present disclosure recognize that when an anti-reflective layer and a touch sensor integrated with a color filter and a black matrix as described above are formed above an organic light-emitting display element, the performance and durability of the color filter and the touch sensor are insufficient. Specifically, it is desirable to perform the process of forming a color filter and a touch sensor formed of organic materials and inorganic materials at high temperatures. However, the organic light-emitting element located below the color filter and the touch sensor is easily heated, so that when the color filter and the touch sensor are formed by a high-temperature process, the organic light-emitting element may be damaged. Therefore, in order to protect the organic light-emitting element, when the color filter and the touch sensor are formed by a low-temperature process, the organic layer constituting the color filter and the touch sensor is broken or damaged, so that the durability is significantly reduced.

[0009] Therefore, the inventors of the present disclosure have invented an organic light emitting display device having a new structure in which a polarizing plate and a touch sensor are formed in the display device to improve durability and light emitting efficiency while reducing the thickness of the entire display device.

[0010] Accordingly, embodiments of the present disclosure are directed to an organic light emitting display device and a method of manufacturing the same that substantially obviate one or more of the problems due to limitations and disadvantages of the related art.

[0011] One object to be achieved by the present disclosure is to provide an organic light emitting display device in which an anti-reflection layer including a black matrix and a color filter and a touch sensor are formed to improve reflective visibility and enable touch while reducing the overall thickness.

[0012] Another object to be achieved by the present disclosure is to provide an organic light emitting display device in which not only the durability and reliability of an organic light emitting element are improved but also the durability and reliability of an anti-reflection layer and a touch sensor are improved.

[0013] Another object of the present invention is to provide a method for manufacturing an organic light emitting display device, which simplifies the entire process of the organic light emitting display device and reduces the process cost.

[0014] Additional features and aspects will be set forth in the following description and in part will become apparent from the description, or may be learned through the practice of the inventive concepts provided herein. Other features and aspects of the inventive concepts may be realized and obtained through the written description or the contents obtainable from the written description, the claims, and the structures particularly pointed out in the drawings.

[0015] According to one aspect of the present disclosure, an organic light-emitting display device includes: a transparent substrate member; a touch sensor, including a touch electrode arranged on the transparent substrate member and a touch protection layer covering the touch electrode; a black matrix, arranged below or above the touch sensor and defining a plurality of opening areas; a plurality of color filters arranged on the same plane as the black matrix and corresponding to the plurality of opening areas; a first buffer layer, arranged on the touch sensor and the plurality of color filters; a thin film transistor arranged on the first buffer layer; and an organic light-emitting element, arranged on the thin film transistor and corresponding to the plurality of opening areas.

[0016] According to another aspect of the present disclosure, a method for manufacturing an organic light-emitting display device includes: forming a black matrix, a plurality of color filters and a touch sensor on a carrier glass substrate; forming a first buffer layer above the plurality of color filters and the touch sensor; forming a thin film transistor on the first buffer layer; forming a planarization layer to cover the thin film transistor; forming an organic light-emitting element including an anode, an organic light-emitting layer and a cathode on the planarization layer; and forming an encapsulation layer on the organic light-emitting element.

[0017] Additional details of example implementations are included in the detailed description and the accompanying drawings.

[0018] According to the present disclosure, a black matrix and a color filter used as an anti-reflection layer and a touch sensor are formed in a display device to improve reflective visibility, enable touch, and reduce the overall thickness of the organic light emitting display device.

[0019] According to the present invention, not only the durability and reliability of the organic light emitting element can be improved, but also the durability and reliability of the anti-reflection layer and the touch sensor can be improved.

[0020] According to the present disclosure, a method of manufacturing an organic light emitting display device having reduced process steps and reduced process cost may be provided.

[0021] The effects according to the present disclosure are not limited to the contents of the above examples, and more various effects are included in the present specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and other objects, features and other advantages of the present disclosure will be more clearly understood through the following detailed description taken in conjunction with the accompanying drawings, in which:

[0023] Figure 1 is a schematic exploded perspective view for explaining an organic light emitting display device according to an exemplary embodiment of the present disclosure;

[0024] Figure 2 is along Figure 1 A schematic cross-sectional view taken along line II' of ;

[0025] FIG. 3A to FIG. 3F is a cross-sectional view for explaining a method of manufacturing an organic light emitting display device according to an exemplary embodiment of the present disclosure;

[0026] Figure 4 is a schematic cross-sectional view of an organic light emitting display device according to another exemplary embodiment of the present disclosure;

[0027] Figure 5 is a schematic cross-sectional view of an organic light emitting display device according to still another exemplary embodiment of the present disclosure; and

[0028] FIG. 6A to FIG. 6G is a cross-sectional view for explaining a method of manufacturing an organic light emitting display device according to still another exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0029] By referring to the exemplary embodiments described in detail below in conjunction with the accompanying drawings, the advantages and features of the present disclosure and the methods for achieving these advantages and features will become clear. However, the present disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided only as examples so that those skilled in the art can fully understand the disclosure of the present disclosure and the scope of the present disclosure. Therefore, the present disclosure will only be limited by the scope of the appended claims.

[0030] The shapes, sizes, ratios, angles, quantities, etc. shown in the drawings for describing exemplary embodiments of the present disclosure are merely examples, and the present disclosure is not limited thereto. In addition, in the following description of the present disclosure, detailed explanations of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of the present disclosure. Terms such as "including", "having" and "consisting of..." used herein are generally intended to allow the addition of other components unless the term is used together with the term "only". Any reference to the singular may include the plural unless otherwise expressly stated.

[0031] Components are interpreted as including ordinary margins of error even if not expressly stated.

[0032] When terms such as “on,” “above,” “below,” and “beside” are used to describe the positional relationship between two parts, one or more parts are located between the two parts unless the term is used with the term “immediately” or “directly.”

[0033] When an element or layer is referred to as being “on” another element or layer, the other layer or other elements may be directly on the other element or interposed therebetween.

[0034] Although the terms "first", "second", etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, in the technical concept of the present disclosure, the first component to be mentioned below may be the second component.

[0035] Like reference numbers generally refer to like elements throughout the specification.

[0036] The size and thickness of each component shown in the drawings are illustrated for convenience of description, and the present disclosure is not limited to the size and thickness of the illustrated components.

[0037] The features of the various embodiments of the present disclosure may be partially or completely adhered to or combined with each other, and may be interlocked and operated in various ways technically, and the embodiments may be performed independently or in association with each other.

[0038] Hereinafter, a display device according to an exemplary embodiment of the present disclosure will be described in detail with reference to the accompanying drawings.

[0039] Figure 1 is a schematic exploded perspective view for explaining an organic light emitting display device according to an exemplary embodiment of the present disclosure. Figure 2 is along Figure 1 Schematic cross-sectional view taken along line II'.

[0040] Reference Figure 1 and Figure 2 The organic light emitting display device 100 includes a transparent base member, a black matrix BM, a plurality of color filters 120 , a touch sensor 130 , an organic light emitting element 150 , and an encapsulation layer 160 .

[0041] The organic light-emitting display device 100 according to the exemplary embodiment of the present disclosure may be configured as a bottom emission type. That is, the organic light-emitting display device 100 may emit light toward the rear surface of the transparent substrate member. According to the bottom emission type, light emitted from the organic light-emitting element 150 is emitted to the lower portion of the transparent substrate member on which the organic light-emitting element 150 is formed. In the case of the bottom emission type, in order to allow the light emitted from the organic light-emitting element 150 to travel to the lower portion of the transparent substrate member, the anode 152 may be formed of a transparent conductive material, and the cathode 156 may be formed of a metal material having a high reflectivity, which will be described below.

[0042] Reference Figure 1 The transparent substrate member is a substrate that supports and protects several components of the organic light-emitting display device 100. The organic light-emitting display device 100 according to the exemplary embodiment of the present disclosure is a bottom emission type, so that in order to make light travel downward, the transparent substrate member may be formed of an insulating material having transparency. For example, the transparent substrate member may be formed of a glass substrate or a transparent flexible film. In the following, the Figure 1 The transparent base member shown is a glass substrate 110 .

[0043] The glass substrate 110 includes a display area DA and a non-display area NDA. The display area DA is an area where a plurality of pixels are arranged to basically display an image. In the display area DA, a display element that displays an image and various driving elements for driving the display element may be arranged.

[0044] The thickness of the glass substrate 110 may be 30 μm to 200 μm or 50 μm to 100 μm. When the thickness of the glass substrate 110 satisfies the above range, the glass substrate 110 may support components of the organic light-emitting display device 100 and also implement folding or bending of the display device.

[0045] although Figure 2 Although not shown in the figure, in the glass substrate 110, an opening pattern or a concave pattern corresponding to the folding area or the bending area may be formed. Specifically, the glass substrate 110 includes an inner surface facing the organic light-emitting element 150 and an outer surface opposite to the inner surface and serving as the light-emitting surface of the organic light-emitting display device 100. In this case, the opening pattern or the concave pattern may be a groove formed inward from the outer surface to allow the organic light-emitting display device to be folded or bent. The opening pattern or the concave pattern may have a structure in which the opening unit (or the concave unit) and the blocking unit (or the convex unit) are continuously and alternately arranged. Therefore, the opening pattern or the concave pattern may give the glass substrate 110 flexibility.

[0046] The display area DA may include a plurality of pixels. The plurality of pixels are arranged in a matrix, and each of the plurality of pixels includes a plurality of sub-pixels SP. Each sub-pixel SP is an element representing one color and is defined by an area where a plurality of gate lines arranged in a first direction intersect a plurality of data lines arranged in a second direction different from the first direction. Here, the first direction may be Figure 1 The horizontal direction (X-axis direction) of Figure 1 The vertical direction (Y-axis direction) of the pixel is not limited thereto. Each sub-pixel SP includes a light-emitting area that emits light and a non-light-emitting area that does not emit light, but in the specification, only the light-emitting area that emits light is defined as a sub-pixel SP. Each of the plurality of pixels includes a first sub-pixel SP1, a second sub-pixel SP2, and a third sub-pixel SP3. The first sub-pixel SP1 may be a red pixel, the second sub-pixel SP2 may be a green pixel, and the third sub-pixel SP3 may be a blue pixel, but are not limited thereto.

[0047] Each sub-pixel SP may include an organic light emitting element 150 and a driving element. In this case, the driving element may include a switching transistor and a driving transistor. The driving element may be electrically connected to signal lines such as gate lines and data lines, which are connected to a gate driver and a data driver disposed in the non-display area NDA.

[0048] The non-display area NDA is disposed in a surrounding area of ​​the glass substrate 110, and no image is displayed in the non-display area. The non-display area NDA is arranged to surround the display area DA. Various components for driving a plurality of sub-pixels SP disposed in the display area DA may be disposed in the non-display area NDA. For example, a driver IC, a driver circuit, a signal line, and a flexible film that provide signals for driving the plurality of sub-pixels SP may be disposed. In this case, the driver IC may include a gate driver and a data driver. The driver IC and the driver circuit may be disposed in a gate-in-panel (GIP) manner, a chip-on-film (COF) manner, a tape automated bonding (TAB) manner, a tape carrier package (TCP) manner, or a chip-on-glass (COG) manner.

[0049] Reference Figure 2 , a black matrix BM and a plurality of color filters 120 are disposed on the glass substrate 110. The black matrix BM and the plurality of color filters 120 are formed on the same plane and are disposed on the glass substrate 110 to be in direct contact with the glass substrate 110. In the present disclosure, the black matrix BM and the plurality of color filters 120 are integrally formed to serve as an anti-reflection layer.

[0050] The black matrix BM is disposed on the glass substrate 110. In addition, the black matrix BM may be disposed to correspond to the position where the bank 148 is formed. In this case, the black matrix BM is disposed between the plurality of color filters 120 to divide the color filters 121, 122, and 123, respectively. The black matrix BM can suppress the color mixing of the light passing through the respective color filters 121, 122, and 123, and define a plurality of opening areas that allow the light emitted from the organic light emitting element 150 to be emitted to the outside. Each opening area OA1, OA2, OA3 is an area through which the light emitted from the organic light emitting element 150 disposed on the black matrix BM and the plurality of color filters 120 passes. The opening areas OA1, OA2, and OA3 independently represent specific colors through the corresponding organic light emitting elements 150, respectively. In addition, the black matrix BM absorbs external light. Therefore, the reduction in visibility and contrast of the organic light emitting display device 100 caused by external light can be minimized.

[0051] The black matrix BM can be formed by an organic material. The black matrix BM includes a base resin and a black material. The base resin can be one or more selected from cardo-based resins, epoxy-based resins, acrylate-based resins, siloxane-based resins and polyimides, but is not limited thereto. The black material can be a black pigment selected from carbon-based pigments, metal oxide-based pigments and organic pigments. For example, the carbon-based pigment can be carbon black. For example, the metal oxide-based pigment can be titanium black TiNxOy or Cu-Mn-Fe-based black pigment, but is not limited thereto. For example, the organic pigment can be selected from lactam black, perylene black and aniline black, but is not limited thereto. In addition, as a black material, an RGB black pigment including a red pigment, a blue pigment and a green pigment can be used.

[0052] A plurality of color filters 120 are disposed on the glass substrate 110 and are disposed on the same plane as the black matrix BM. The plurality of color filters 120 are disposed to correspond to the plurality of sub-pixels SP. In this case, each of the plurality of color filters 120 is disposed in each of the opening areas OA1, OA2, and OA3 defined by the black matrix BM. Specifically, the plurality of color filters 120 include a first color filter 121 corresponding to the first sub-pixel SP1, a second color filter 122 corresponding to the second sub-pixel SP2, and a third color filter 123 corresponding to the third sub-pixel SP3. The first color filter 121 is disposed in the first opening area OA1 corresponding to the first sub-pixel SP1, the second color filter 122 is disposed in the second opening area OA2 corresponding to the second sub-pixel SP2, and the third color filter 123 is disposed in the third opening area OA3 corresponding to the third sub-pixel SP3. In this case, when the first sub-pixel SP1 is a red sub-pixel, the first color filter 121 is a red color filter. In addition, when the second subpixel SP2 is a green subpixel, the second color filter 122 is a green filter, and when the third subpixel SP3 is a blue subpixel, the third color filter 123 is a blue filter. In this case, the organic light emitting display device 100 has excellent color reproduction performance.

[0053] The first color filter 121, the second color filter 122 and the third color filter 123 independently include a transparent base resin and a color developing material. For example, the transparent base resin can be one selected from polyacrylate, polymethyl methacrylate, polyimide, polyvinyl alcohol, polyethylene, polypropylene, polystyrene and polyethylene terephthalate, but is not limited thereto. The color developing material absorbs light of a specific band and transmits light of other bands. For example, the red color filter includes a red developing material that transmits light in the red band and absorbs light in the green and blue bands. More specifically, the red developing material can be a compound based on polyparaxylene or a compound based on diketopyrrolopyrrole. In addition, the green developing material can be a phthalocyanine-based compound. In addition, the blue developing material can be a copper phthalocyanine-based compound or an anthraquinone-based compound. However, the color developing material is not limited thereto, and any material that transmits light in the red, blue and green bands can be used without restriction.

[0054] The second buffer layer 112 is formed on the black matrix BM and the plurality of color filters 120. The second buffer layer 112 may protect or planarize the black matrix BM and the plurality of color filters 120. Specifically, the second buffer layer 112 suppresses the penetration of moisture or oxygen from the outside to protect the black matrix BM and the plurality of color filters 120. In addition, the second buffer layer 112 may minimize damage to the black matrix BM and the plurality of color filters 120 caused in the process of forming the touch electrode 132 of the touch sensor 130 located thereon.

[0055] The second buffer layer 112 may be formed of an inorganic material having excellent barrier properties. Thus, the penetration of moisture or oxygen may be minimized. For example, the second buffer layer 112 may be formed of an inorganic material such as silicon nitride SiNx, silicon oxide SiOx, or aluminum oxide AlOx, but is not limited thereto.

[0056] In addition, the second buffer layer 112 may be formed of a plurality of layers to planarize the black matrix BM and the plurality of color filters 120 and enhance the adhesion between the plurality of color filters 120 and the touch sensor 130 located thereon. For example, the second buffer layer 112 may include a first layer and a second layer, the first layer being formed of an organic material to planarize the upper portion of the plurality of color filters 120, and the second layer being disposed on the first layer and being formed of the above-mentioned inorganic material to impart barrier properties. For example, the first layer may be formed of a transparent insulating resin such as an acrylic resin, a polyester-based resin, an epoxy resin, or a silicon-based resin, and the second layer may be formed of the above-mentioned inorganic material.

[0057] The touch sensor 130 is disposed on the second buffer layer 112 to give the organic light-emitting display device 100 a touch sensing function. The touch sensor 130 can be directly formed on the second buffer layer 112 without using an adhesive member. Since the touch sensor 130 is directly formed on the second buffer layer 112, the adhesive member attached between the touch sensor 130 and the color filter is omitted, so that the thickness of the organic light-emitting display device 100 can be reduced.

[0058] The touch sensor 130 includes a touch electrode 132 and a touch protection layer 134. The touch electrode 132 may be formed directly on the second buffer layer 112 without using an adhesive member. The touch electrode 132 is an electrode for sensing a touch input, and may be composed of a sensing electrode and a driving electrode, and detects touch coordinates by sensing changes in capacitance between the sensing electrode and the driving electrode. For example, the driving electrode is disposed on the second buffer layer 112, and the sensing electrode is disposed on the same plane as the driving electrode. As another example, a touch insulating layer is disposed on the driving electrode, and a sensing electrode is disposed on the touch insulating layer. The arrangement of the touch electrode 132 is not limited thereto, and may be changed if necessary.

[0059] The touch electrode 132 may be formed of a transparent metal material that can transmit light, such as indium tin oxide ITO or indium zinc oxide IZO. The touch electrode 132 may have various shapes, such as a rectangle, an octagon, a circle, or a diamond.

[0060] The touch protection layer 134 is disposed on the touch electrode 132. The touch protection layer 134 suppresses short circuit or damage of the touch electrode 132 and flattens the upper surface of the touch electrode 132. The touch protection layer 134 may be formed of a transparent insulating resin such as acrylic resin, polyester-based resin, epoxy resin, or silicon-based resin.

[0061] The first buffer layer 114 is disposed on the touch sensor 130. The first buffer layer 114 protects the black matrix BM, the plurality of color filters 120, and the touch sensor 130. In addition, the first buffer layer 114 protects the thin film transistor TFT from, for example, impurities and gases such as alkali ions leaked from the black matrix BM, the plurality of color filters 120, and the touch sensor 130. The first buffer layer 114 may be formed of an inorganic material such as silicon nitride SiNx, silicon oxide SiOx, or aluminum oxide AlOx. The first buffer layer 114 may be formed as a single layer, and may be formed as a multilayer structure if necessary. For example, the first buffer layer 114 may include a multi-buffer and / or an active buffer.

[0062] On the first buffer layer 114, a thin film transistor TFT including a gate electrode G, an active layer ACT, a source electrode S, and a drain electrode D is disposed. Figure 2 In the figure, only a driving thin film transistor among various thin film transistors TFT that may be included in the organic light emitting display device 100 is shown, but other transistors such as a switching thin film transistor may also be provided.

[0063] Furthermore, as an example, it is described Figure 2 The thin film transistor TFT shown has a coplanar structure, but the present disclosure is not limited thereto, and a thin film transistor TFT having an inverse staggered structure may also be used. In addition, the thin film transistor TFT may be implemented as a top-gate thin film transistor in which the gate electrode G is disposed on the active layer ACT, but may also be implemented as a bottom-gate thin film transistor in which the gate electrode G is disposed below the active layer ACT.

[0064] The active layer ACT is disposed on the first buffer layer 114. When the thin film transistor TFT is driven, a channel is formed in the active layer ACT. The active layer ACT may be formed of an oxide semiconductor or amorphous silicon a-Si, polycrystalline silicon poly-Si, or an organic semiconductor, but is not limited thereto.

[0065] The gate insulating layer 144 is disposed on the active layer ACT. The gate insulating layer 144 insulates the active layer ACT from the gate electrode G. The gate insulating layer 144 may be formed as a single layer or multiple layers of silicon nitride SiNx or silicon oxide SiOx. Figure 2 As shown, the gate insulating layer 144 may be patterned to have the same width as the gate electrode G, or formed on the entire glass substrate 110 , but is not limited thereto.

[0066] The gate electrode G is disposed on the gate insulating layer 144. The gate electrode G is disposed on the gate insulating layer 144 so as to overlap with the channel region of the active layer ACT. The gate electrode G may be formed of various metal materials, such as any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy of two or more thereof, or a multilayer thereof, but is not limited thereto.

[0067] The interlayer insulating layer 142 is disposed on the first buffer layer 114 and the gate electrode G. The interlayer insulating layer 142 insulates the gate electrode G from the source electrode S and the drain electrode D. The interlayer insulating layer 142 may be formed as a single layer or multiple layers of silicon nitride SiNx or silicon oxide SiOx. In the interlayer insulating layer 142, contact holes are formed, through which the source electrode S and the drain electrode D are respectively in contact with the source region and the drain region of the active layer ACT.

[0068] The source electrode S and the drain electrode D are disposed on the interlayer insulating layer 142. The source electrode S and the drain electrode D are electrically connected to the active layer ACT through a contact hole formed in the interlayer insulating layer 142. The source electrode S and the drain electrode D may be formed of various metal materials, such as any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy of two or more thereof, or a multilayer thereof, but is not limited thereto.

[0069] Even if not in Figure 2 As shown in FIG. 1 , a passivation layer may be further provided on the thin film transistor TFT to protect the thin film transistor TFT. In the passivation layer, a contact hole exposing the source electrode S or the drain electrode D of the thin film transistor TFT may be formed. The passivation layer may be configured as a single layer or multiple layers of silicon nitride SiNx or silicon oxide SiOx.

[0070] The planarization layer 146 is disposed on the passivation layer to planarize the upper portion of the thin film transistor TFT. In the planarization layer 146, a contact hole exposing the source electrode S or the drain electrode D of the thin film transistor TFT is formed. The planarization layer 146 may be formed of any one of acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene resin, polyphenylene sulfide resin, benzocyclobutene, and photoresist, but is not limited thereto.

[0071] The organic light emitting elements 150 are disposed on the planarization layer 146. The organic light emitting elements 150 include a first organic light emitting element disposed in the first sub-pixel SP1 region, a second organic light emitting element disposed in the second sub-pixel SP2 region, and a third organic light emitting element disposed in the third sub-pixel SP3 region. Each organic light emitting element 150 includes an anode 152, an organic light emitting layer 154, and a cathode 156.

[0072] The anode 152 is disposed on the planarization layer 146. The anode 152 is disposed on the planarization layer 146 to be electrically connected to the source electrode S or the drain electrode D through a contact hole formed in the planarization layer 146. The anode 152 is formed of a conductive material having a high work function to provide holes to the organic light emitting layer 154. The anode 152 may be a transparent conductive layer formed of a transparent conductive oxide TCO. For example, the anode 152 may be formed of one or more transparent conductive oxides selected from, for example, indium tin oxide ITO, indium zinc oxide IZO, indium tin zinc oxide ITZO, tin oxide SnO2, zinc oxide ZnO, indium copper oxide ICO, and aluminum: zinc oxide Al: ZnO, AZO, but is not limited thereto. Since the organic light emitting display device 100 of the exemplary embodiment of the present disclosure is a bottom emission type, the anode 152 may be formed only of a transparent conductive layer. The anode 152 may be formed for each of the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3, respectively.

[0073] The bank 148 is disposed on the anode 152 and the planarization layer 146. The bank 148 may cover the edge of the anode 152 of the organic light emitting element 150 to define a light emitting region. The bank 148 may be formed of an insulating material that insulates the anodes 152 of adjacent sub-pixels SP1, SP2, and SP3 from each other. In addition, the bank 148 may be formed of a black bank having a high light absorption rate to suppress color mixing between adjacent sub-pixels SP1, SP2, and SP3. For example, the bank 148 may be formed of a polyimide resin, an acrylic resin, or a benzocyclobutene resin, but is not limited thereto.

[0074] The cathode 156 is disposed on the anode 152. The cathode 156 may be formed of a metal material having a low work function to smoothly provide electrons to the organic light emitting layer 154. Since the organic light emitting display device 100 of the exemplary embodiment of the present disclosure is a bottom emission type, in order to allow the light emitted from the organic light emitting element 150 to travel to the lower part of the glass substrate 110, the cathode 156 may be formed of a metal material having a high reflectivity. For example, the cathode 156 may be formed of a metal material selected from the following, but not limited thereto: calcium (Ca), barium (Ba), aluminum (Al), silver (Ag), and alloys including one or more thereof.

[0075] refer to Figure 2 Although the cathode 156 is shown not to be patterned but formed as a layer on the anode 152, the cathode 156 may be provided separately for each sub-pixel SP like the anode 152. That is, the cathode 156 is formed as a single layer in the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3.

[0076] The organic light emitting layer 154 is disposed between the anode 152 and the cathode 156. The organic light emitting layer 154 is a layer in which electrons and holes are coupled to emit light. The organic light emitting layer 154 of the first organic light emitting element may be a red organic light emitting layer, the organic light emitting layer 154 of the second organic light emitting element may be a green organic light emitting layer, and the organic light emitting layer 154 of the third organic light emitting element may be a blue organic light emitting layer.

[0077] In order to improve the luminous efficiency of the organic light emitting element 150, a hole injection layer, a hole transport layer, an electron transport layer and an electron injection layer may be further included. For example, the hole injection layer and the hole transport layer may be disposed between the anode 152 and the organic light emitting layer 154, and the electron transport layer and the electron injection layer may be disposed between the organic light emitting layer 154 and the cathode 156. In addition, a hole blocking layer or an electron blocking layer may be disposed to further improve the recombination efficiency of holes and electrons in the organic light emitting layer 154.

[0078] The encapsulation layer 160 is disposed on the organic light emitting element 150. The encapsulation layer 160 may cover the organic light emitting element 150. The encapsulation layer 160 may protect the organic light emitting element 150 from moisture, oxygen, and external impact. The encapsulation layer 160 may be formed into a multilayer structure in which an inorganic layer formed of an inorganic insulating material and an organic layer formed of an organic material are stacked. For example, the encapsulation layer 160 may be composed of at least one organic layer and at least two inorganic layers, and have a multilayer structure in which inorganic layers and organic layers are alternately stacked, but is not limited thereto. For example, the encapsulation layer 160 may have a three-layer structure including a first inorganic layer 162, an organic layer 164, and a second inorganic layer 166. In this case, the first inorganic layer 162 and the second inorganic layer 166 may be independently formed of one or more selected from silicon nitride SiNx, silicon oxide SiOx, aluminum oxide AlOx, and silicon oxynitride SiON, but is not limited thereto. In addition, the organic layer 164 may be formed of one or more selected from epoxy resin, polyimide, polyethylene, and carbon silicon oxide SiOC, but is not limited thereto.

[0079] The cover substrate member 170 may be disposed on the encapsulation layer 160. The cover substrate member 170 protects the organic light emitting element 150 from moisture, oxygen, and impact from the outside together with the encapsulation layer 160. The cover substrate member 170 may be a metal material such as stainless steel (SUS) or a plastic material such as polymethyl methacrylate, polycarbonate, polyvinyl alcohol, acrylonitrile-butadiene-styrene, or polyethylene terephthalate.

[0080] In an organic light-emitting display device according to an exemplary embodiment of the present disclosure, an anti-reflection layer including a black matrix and a color filter is disposed on a glass substrate, and a touch sensor including a touch electrode is formed on the anti-reflection layer. The organic light-emitting display device according to an exemplary embodiment of the present disclosure is a bottom-emitting organic light-emitting display device, in which an organic light-emitting element is disposed on the anti-reflection layer and the touch sensor to emit light toward a glass substrate disposed thereunder. According to the organic light-emitting display device according to an exemplary embodiment of the present disclosure, the anti-reflection layer and the touch sensor are disposed between the glass substrate and the organic light-emitting element. Therefore, the reflection brightness is improved, touch can be achieved, and the overall thickness of the organic light-emitting display device can be reduced. Specifically, the color filter and the touch sensor that require high temperature processing are disposed below so as to be formed before the organic light-emitting element that is susceptible to high temperature, thereby significantly improving the durability and reliability of the organic light-emitting display device.

[0081] Below, we will refer to FIG. 3A to FIG. 3F A method of manufacturing an organic light emitting display device according to an exemplary embodiment of the present disclosure is described.

[0082] Figures 3A to 3F is a cross-sectional view for explaining a method of manufacturing an organic light emitting display device according to an exemplary embodiment of the present disclosure.

[0083] Reference Figure 3A , prepare a carrier glass substrate 110'. The carrier glass substrate 110' is used as an auxiliary substrate that supports components disposed on an upper portion during a process of the organic light-emitting display device. The carrier glass substrate 110' has low reactivity to processes such as etching or heat treatment of semiconductor materials and metal materials. The thickness of the carrier glass substrate 110' may be selected within a range having a rigidity that does not cause deformation due to a load and having a weight that is easy to carry during the manufacturing process. For example, the thickness of the carrier glass substrate 110' may be 400 μm to 800 μm or 500 μm to 650 μm.

[0084] The black matrix BM is formed on the carrier glass substrate 110 ′. The black matrix BM may be formed where wiring lines and driving elements (eg, thin film transistors TFT subsequently disposed thereon) are formed. The black matrix BM divides the first opening area OA1 , the second opening area OA2 , and the third opening area OA3 .

[0085] A plurality of color filters 120 are formed on a carrier glass substrate 110' on which a black matrix BM is formed. The plurality of color filters 120 may be set to have a color determined for each sub-pixel. For example, a first color filter 121 is formed by applying an organic material including a red pigment in a first opening area OA1 corresponding to a first sub-pixel SP1 and performing light processing. In addition, a second color filter 122 is formed by applying an organic material including a green pigment in a second opening area OA2 corresponding to a second sub-pixel SP2 and performing light processing. In addition, a third color filter 123 is formed by applying an organic material including a blue pigment in a third opening area OA3 corresponding to a third sub-pixel SP3 and performing light processing. Although in Figure 3A , it is shown that the first color filter 121, the second color filter 122, and the third color filter 123 are formed to be spaced apart from each other, but two adjacent color filters may be formed on the black matrix BM to overlap each other.

[0086] The second buffer layer 112 is formed on the entire surface of the carrier glass substrate 110' on which the black matrix BM and the plurality of color filters 120 are completed. The second buffer layer 112 may be formed of an inorganic material such as silicon nitride SiNx, silicon oxide SiOx, or aluminum oxide AlOx, and is deposited by a chemical vapor deposition (CVD) process or a plasma enhanced chemical vapor deposition (PECVD) process, but is not limited thereto.

[0087] In addition, before forming the second buffer layer 112 , an organic layer that planarizes top surfaces of the black matrix BM and the plurality of color filters 120 may be formed.

[0088] Reference Figure 3B , the touch sensor 130 is formed on the second buffer layer 112 .

[0089] After the conductive layer is deposited on the second buffer layer 112, the touch electrode 132 can be patterned by an etching process and a photolithography process using a photomask. Specifically, the touch electrode 132 can be composed of a sensing electrode and a driving electrode. For example, after the first conductive layer is deposited on the second buffer layer 112, a plurality of driving electrodes, a plurality of sensing electrodes, and a connecting electrode connecting the plurality of driving electrodes are formed by a photolithography process and an etching process. A touch insulating layer having contact holes is formed on the plurality of driving electrodes, the plurality of sensing electrodes, and the connecting electrode. A bridging electrode is formed on the touch insulating layer so that the plurality of sensing electrodes are electrically connected through the contact holes. As described above, in the touch electrode 132, the driving electrode and the sensing electrode are formed on the same plane on the second buffer layer 112. However, as another example, the touch insulating layer is disposed on the driving electrode, and the sensing electrode is disposed on the touch insulating layer. The touch electrode 132 can be formed in various ways according to the structure of the touch sensor 130. In addition, the touch electrode 132 can be formed by a physical vapor deposition method such as a sputtering method.

[0090] The touch electrode 132 may be formed of a transparent metal material that transmits light, such as indium tin oxide ITO or indium zinc oxide IZO. In order to impart high transparency and low impedance characteristics, the touch electrode 132 may be formed at a high temperature.

[0091] The touch protection layer 134 is disposed on the touch electrode 132. For example, a transparent insulating resin such as acrylic resin, polyester-based resin, or silicon-based resin is laminated on the entire upper surface of the touch electrode 132.

[0092] Reference Figure 3C , the first buffer layer 114 is formed on the entire surface of the touch sensor 130. The first buffer layer 114 may be formed of an inorganic material such as silicon nitride SiNx, silicon oxide SiOx, or aluminum oxide AlOx, and deposited by a chemical vapor deposition (CVD) process or a plasma enhanced chemical vapor deposition (PECVD) process, but is not limited thereto.

[0093] A thin film transistor TFT is formed on the first buffer layer 114 .

[0094] First, an active layer ACT is disposed on the first buffer layer 114. In this case, the active layer ACT may be formed by a mask process. For example, the active layer ACT may be located in a designated area by a deposition process using a mask in which an area to be patterned is opened. Alternatively, after a semiconductor material is deposited on the entire surface of the first buffer layer 114, the active layer ACT may be formed by a photoresist dopant and a patterned mask, through exposure, development, etching, and photosensitive resin removal processes.

[0095] The gate insulating layer 144 and the gate electrode G are formed by continuously depositing an insulating material and a gate metal material on the active layer ACT. Next, an interlayer insulating layer 142 is formed on the entire upper surface of the first buffer layer 114 on which the active layer ACT and the gate electrode G are formed. A contact hole is formed in the interlayer insulating layer 142 to expose the top surface of the active layer ACT. A metal material is applied and patterned on the interlayer insulating layer 142 to form a source electrode S and a drain electrode D to contact the active layer ACT through the contact hole.

[0096] Reference Figure 3D , a planarization layer 146 is formed on the entire upper surface of the carrier glass substrate 110 ′ on which the thin film transistor TFT is formed. In this case, a contact hole is formed in the planarization layer 146 to expose the source electrode S.

[0097] The organic light emitting element 150 is formed on the planarization layer 146. First, the anode 152 is formed to be electrically connected to the source electrode S disposed thereunder through a contact hole formed in the planarization layer 146. The anode 152 may be patterned by a mask process so as to be formed for each sub-pixel.

[0098] The bank 148 is formed on the planarization layer 146. In this case, the bank 148 may be formed to cover the edge of the anode 152 to divide the light emitting area (sub-pixel). In this case, the bank 148 may be patterned by a mask process. After the bank 148 is formed, the organic light emitting layer 154, the cathode 156, and the encapsulation layer 160 are sequentially formed.

[0099] Reference Figure 3E , etching the carrier glass substrate 110'. The thickness of the carrier glass substrate 110' is reduced by the etching process, so that the carrier glass substrate 110' is used as a glass substrate 110 for protecting a light emitting surface of an organic light emitting display device, wherein light emitted from an organic light emitting display element is emitted to the outside through the light emitting surface. Figure 3A , the carrier glass substrate 110' is used to support components during the manufacturing process of the organic light-emitting display device. The carrier glass substrate 110' has a thickness sufficient to withstand the conditions and environment of the manufacturing process. However, in order to perform the function of a protective base member that protects the light-emitting surface of the organic light-emitting display device, the carrier glass substrate 110' needs to meet sufficient transmittance. In addition, since the lower surface of the carrier glass substrate 110' is damaged during the manufacturing process, it is necessary to improve the surface characteristics. Therefore, the surface of the carrier glass substrate 110' is etched to reduce the thickness and make the outer surface uniform. The thickness of the glass substrate 110 formed by etching the carrier glass substrate 110' can be 30μm to 200μm.

[0100] Despite Figure 3E Although not shown in the figure, after performing the process of etching the carrier glass substrate 110' to uniformize the thickness and the surface, a process of forming an opening pattern or a concave pattern in a region corresponding to the folding region or the bending region of the organic light-emitting display device may be further added. For example, after forming a mask on the outer surface of the glass substrate 110 having a reduced thickness, a plurality of grooves formed by being recessed inward from the outer surface of the glass substrate 110 may be formed by an etching process.

[0101] Reference Figure 3F , a cover base member 170 is formed on the encapsulation layer 160 .

[0102] According to the method for manufacturing an organic light-emitting display device according to an exemplary embodiment of the present disclosure, a bottom-emission type organic light-emitting display device having a structure in which an anti-reflection layer including a black matrix and a color filter, a touch sensor including a touch electrode, and an organic light-emitting element are sequentially stacked on a glass substrate is manufactured. By doing so, a thin organic light-emitting display device having an anti-reflection function and a touch sensing function can be manufactured.

[0103] In addition, the manufacturing method of the organic light-emitting display device according to the exemplary embodiment of the present disclosure includes a process of forming a black matrix, a color filter and a touch sensor on a glass substrate before the organic light-emitting element. In order to form the above-mentioned black matrix, color filter and touch sensor in the top-emitting organic light-emitting display device, after the organic light-emitting element is first formed, it is necessary to form an encapsulation layer, a black matrix, a color filter and a touch sensor above the organic light-emitting element 150. However, the materials constituting the organic light-emitting element are very susceptible to high temperatures. Therefore, when the black matrix, color filter and touch sensor that require high temperature treatment are formed by subsequent treatment of the organic light-emitting element, damage to the organic light-emitting element is inevitable. Specifically, in order to make the touch sensor located above the organic light-emitting element, the touch electrode constituting the touch sensor is advantageously formed of a transparent metal material that is transparent and has excellent transmittance, such as indium tin oxide ITO or indium zinc oxide IZO. Therefore, according to the manufacturing method of the organic light-emitting display device according to the exemplary embodiment of the present disclosure, a black matrix, a color filter and a touch sensor that require high temperature treatment are formed before the organic light-emitting element, and a bottom-emitting organic light-emitting display device is manufactured. Therefore, an organic light emitting display device having significantly improved durability and reliability may be provided.

[0104] In addition, recently, in order to realize a flexible organic light-emitting display device, a flexible material such as polyimide is used as a base member. However, flexible materials such as polyimide are susceptible to external physical impact. In addition, in order to realize a base member with a flexible material having flexibility, a process of applying and processing the flexible material on a carrier substrate formed of glass is first performed. Thereafter, after forming the organic light-emitting element, finally, a laser lift-off (LLO) process for peeling off the base member formed of the flexible material from the carrier substrate needs to be additionally performed. In addition, in the laser lift-off process, there is a problem that the base member is broken or a peeling failure occurs, so that the base member is torn off together with the carrier substrate.

[0105] Therefore, the inventors of the present disclosure have invented a method for protecting the light-emitting surface of an organic light-emitting display device by using a carrier glass substrate as a protective substrate element. According to the manufacturing method of the organic light-emitting display device of the exemplary embodiment of the present disclosure, after the black matrix, the color filter and the organic light-emitting element are sequentially formed on the carrier glass substrate, a process of etching the outer surface of the carrier glass substrate is performed. Therefore, a bottom-emitting organic light-emitting display device can be provided, wherein the carrier glass substrate is used as a substrate member for supporting the organic light-emitting display device, and is also used as a protective substrate member for protecting the light-emitting surface of the organic light-emitting display device. In addition, the thickness and pattern of the carrier glass substrate are adjusted in the process of etching the carrier glass substrate to provide a bendable or foldable display device. By doing so, the process of forming a separate substrate member on the carrier substrate and the process of removing the substrate member from the carrier substrate are not necessary, so that the entire process is more simplified and the cost is also reduced.

[0106] Figure 4 is a schematic cross-sectional view of an organic light emitting display device according to another exemplary embodiment of the present disclosure. Figure 2 Compared with the organic light emitting display device 100 shown in FIG. Figure 4 Except for the positions of the black matrix BM, the plurality of color filters 220 and the touch sensor 230 of the organic light emitting display device 200 shown, other structures are substantially the same. Therefore, redundant description will be omitted.

[0107] Reference Figure 4 , the touch sensor 230 is disposed on the glass substrate 110. The touch sensor 230 may be directly formed on the glass substrate 110 without using a separate adhesive member. Specifically, the touch electrode of the touch sensor 230 may be directly formed on the glass substrate 110. Thereafter, a touch protection layer 234 may be formed on the touch electrode 232. The method of forming the touch sensor 230 on the glass substrate 110 is similar to that of the method of referring to Figure 3B The described method is substantially the same, except that the touch electrode 232 is first formed on the glass substrate 110 instead of the second buffer layer 212. Therefore, redundant description will be omitted.

[0108] Next, a black matrix BM and a plurality of color filters 220 are disposed on the touch sensor 230. The black matrix BM and the plurality of color filters 220 are formed on the same plane and are disposed on the touch protection layer of the touch sensor 230 to be in direct contact with the touch protection layer. The method of forming the black matrix BM and the plurality of color filters 220 on the touch sensor 230 is similar to that of the method of forming the black matrix BM and the plurality of color filters 220 on the touch sensor 230. Figure 3A The described method is substantially the same except that the black matrix BM and the plurality of color filters 120 are first formed on the touch sensor 230 instead of the glass substrate 110. Therefore, redundant description will be omitted.

[0109] The second buffer layer 212 is formed on the black matrix BM and the plurality of color filters 220. The second buffer layer 212 may protect or planarize the black matrix BM and the plurality of color filters 220. Figure 4 In the organic light emitting display device 200 shown in FIG. Figure 2 The second buffer layer 112 of the illustrated organic light emitting display device 100 is substantially the same, except that the second buffer layer 212 is disposed between the black matrix BM and the plurality of color filters 220 and the first buffer layer 214 .

[0110] The first buffer layer 214 is disposed on the second buffer layer 212. The second buffer layer 212 is disposed between the first buffer layer 214 and the thin film transistor TFT to protect the black matrix BM, the plurality of color filters 220, and the touch sensor 230 located thereunder. In addition, the second buffer layer 212 protects the thin film transistor TFT from impurities and gases leaked from the black matrix BM, the plurality of color filters 220, and the touch sensor 230. Figure 4 In the organic light emitting display device 200 shown in FIG. Figure 2 The first buffer layer 114 of the illustrated organic light emitting display device 100 is substantially the same, except that the first buffer layer 214 is disposed in contact with the second buffer layer 212 .

[0111] In addition, in an organic light-emitting display device according to another exemplary embodiment of the present disclosure, the second buffer layer 212 may be omitted. When the second buffer layer 212 is omitted, the first buffer layer 214 is disposed between the black matrix BM and the plurality of color filters 220 and the thin film transistor TFT to further perform the function of protecting or flattening the black matrix BM and the plurality of color filters 220.

[0112] The organic light-emitting display device 200 according to another exemplary embodiment of the present disclosure has the following structural features: the touch sensor 230 is disposed on the glass substrate 110 to be in direct contact with the glass substrate 110, and the black matrix BM and the plurality of color filters 220 are disposed on the touch sensor 230 to be closer to the organic light-emitting element 150. The touch sensor 230 is formed directly on the glass substrate 110, so that the user's touch input can be sensed more accurately. In addition, the black matrix and the plurality of color filters 220 are disposed between the touch sensor 230 and the organic light-emitting element 150, so that the distance between the touch sensor 230 and the organic light-emitting element 150 is increased. By doing so, the parasitic capacitance caused between the touch electrode of the touch sensor 230 and the organic light-emitting element 150 and the electrodes and wiring formed around it can be minimized, which leads to an improvement in touch sensitivity.

[0113] and Figure 2 Compared with the organic light emitting display device 100 shown in FIG. Figure 4In the organic light emitting display device 200 shown, the black matrix BM is disposed on the touch sensor 230 to be closer to the organic light emitting element 150. By doing so, the angle of light emitted downward from the organic light emitting element 150 can be widened. That is, the organic light emitting display device according to another exemplary embodiment of the present disclosure can provide a bottom emission type display device with a wide viewing angle.

[0114] Figure 5 is a schematic cross-sectional view of an organic light emitting display device according to another exemplary embodiment of the present disclosure. Figure 2 Compared with the organic light emitting display device 100 shown in FIG. Figure 5 The organic light emitting display device 300 shown in the figure uses a transparent flexible film 390 and a transparent protective film 380 instead of a glass substrate, and other components are substantially the same, and therefore, redundant description will be omitted.

[0115] Reference Figure 5 The organic light emitting display device 300 includes a transparent protective film 380 , a transparent flexible film 390 , a black matrix BM, a plurality of color filters 120 , a touch sensor 130 , an organic light emitting element 150 , and an encapsulation layer 160 .

[0116] The transparent flexible film 390 is a substrate that supports and protects several components of the organic light-emitting display device 300. The organic light-emitting display device 300 according to the exemplary embodiment of the present disclosure is a bottom emission type, so in order to guide light downward, the transparent flexible film 390 may be formed of an insulating polymer material having transparency. For example, the transparent flexible film 390 may be selected from polyimide, polyethersulfone, polyethylene terephthalate, and polycarbonate.

[0117] The transparent protective film 380 is disposed below the transparent flexible film 390. The transparent protective film 380 supports the transparent flexible film 390 and protects the light emitting surface of the organic light emitting display device 300. The transparent protective film 380 may be formed of an insulating polymer material having transparency to allow light to travel downward. For example, the transparent protective film 380 may be formed of a thin plastic film composed of a combination of polyimide, polyethersulfone, polyethylene terephthalate, polycarbonate, and other suitable polymers.

[0118] The organic light emitting display device 300 according to another exemplary embodiment of the present disclosure includes a transparent protective film 380 and a transparent flexible film 390 that are transparent and flexible, instead of the glass substrate 110. Therefore, various designs with a smaller radius of curvature may be realized.

[0119] Figures 6A to 6G is a cross-sectional view for explaining a method for manufacturing an organic light-emitting display device according to another exemplary embodiment of the present disclosure. Figures 3A to 3FCompared with the method for manufacturing an organic light emitting display device shown in Figures 6A to 6G Except for the use of the transparent flexible film 390 and the transparent protective film 380 and the resulting processes in the method for manufacturing the organic light emitting display device shown in , the other structures are substantially the same. Therefore, redundant description will be omitted.

[0120] Reference Fig. 6A , the transparent flexible film 390 is formed on the carrier glass substrate 310'. In this case, the carrier glass substrate 310' is substantially the same as Figure 3A The same as described in , so redundant description will be omitted.

[0121] Specifically, after coating the transparent polymer material on the carrier glass substrate 310', a film is formed. For example, the transparent polymer material may be selected from polyimide, polyethersulfone, polyethylene terephthalate, and polycarbonate. The transparent polymer material is coated on the carrier glass substrate 310' using a spin coating method, a roll coating method, or a slit coating method, and then a film is formed to form the transparent flexible film 390.

[0122] In addition, in order to easily separate the carrier glass substrate 310' and the transparent flexible film 390 (which will be referred to below), Fig. 6F ), before coating the transparent polymer material on the carrier glass substrate 310', a sacrificial layer may be first formed on the carrier glass substrate 310'.

[0123] Reference Figure 6B , a black matrix BM and a plurality of color filters 120 are formed on the transparent flexible film 390. The method of forming the black matrix BM and the plurality of color filters 120 is similar to Figure 3A The method described in is basically the same, except that the black matrix and the plurality of color filters are formed on the transparent flexible film 390 instead of the carrier glass substrate 310'. Therefore, redundant description will be omitted. Next, the second buffer layer 112 is formed on the entire surface of the carrier glass substrate 310' on which the black matrix BM and the plurality of color filters 120 are completed.

[0124] Reference Figure 6C The touch sensor 130 is formed on the second buffer layer 112. The method of forming the touch sensor 130 on the second buffer layer 112 is substantially the same as that Figure 3B The method is the same as described in , so redundant description will be omitted.

[0125] Reference Fig.6D , a first buffer layer 114 is formed on the entire surface of the touch sensor 130, and a thin film transistor TFT is formed on the first buffer layer 114. The method of forming the first buffer layer 114 and the thin film transistor TFT is substantially the same as that of Figure 3C The method is the same as described in , so redundant description will be omitted.

[0126] Reference Fig. 6E A planarization layer 146 is formed on the entire upper surface of the carrier glass substrate 310' on which the thin film transistor TFT is formed, and an organic light emitting element 150 and an encapsulation layer 160 are formed on the planarization layer 146. The method of forming the planarization layer 146, the organic light emitting element 150 and the encapsulation layer 160 is substantially the same as that of Figure 3D The method is the same as described in , so redundant description will be omitted.

[0127] Reference Fig. 6F , peeling off the carrier glass substrate 310'. For example, the carrier glass substrate 310' and the transparent flexible film 390 may be separated by a laser lift-off (LLO) process. Specifically, a sacrificial layer formed of amorphous silicon is disposed between the carrier glass substrate 310' and the transparent flexible film 390, and laser light is irradiated onto the carrier glass substrate 310'. The laser light irradiated onto the carrier glass substrate 310' causes a reaction of a-Si:H, and the carrier glass substrate 310' and the transparent flexible film 390 may be separated from each other by hydrogen H generated in the reaction.

[0128] Reference Figure 6G , a transparent protection film 380 is formed under the transparent flexible film 390 , and a cover substrate member 170 is formed over the encapsulation layer 160 .

[0129] Exemplary embodiments of the present disclosure may also be described as follows:

[0130] According to one aspect of the present invention, an organic light-emitting display device is provided. The organic light-emitting display device includes: a transparent substrate member; a touch sensor, the touch sensor including a touch electrode disposed above the transparent substrate member and a touch protection layer covering the touch electrode; a black matrix, the black matrix is ​​disposed below or above the touch sensor and defines a plurality of opening areas; a plurality of color filters, the plurality of color filters are disposed on the same plane as the black matrix and correspond to the plurality of opening areas; a first buffer layer, the first buffer layer is disposed above the touch sensor and the upper one of the plurality of color filters; a thin film transistor, the thin film transistor is disposed above the first buffer layer; and an organic light-emitting element, disposed above the thin film transistor and corresponding to the plurality of opening areas.

[0131] The first buffer layer may be a single layer or a multilayer selected from the group consisting of silicon nitride SiNx, silicon oxide SiOx, and aluminum oxide AlOx.

[0132] The black matrix and the plurality of color filters may be disposed under the touch sensor, the first buffer layer may be disposed on the touch sensor, and a second buffer layer disposed between the plurality of color filters and the touch sensor to planarize upper portions of the plurality of color filters may be further provided.

[0133] The touch electrode may be disposed on the second buffer layer to directly contact the second buffer layer.

[0134] The black matrix and the plurality of color filters may be disposed on the touch sensor, a second buffer layer disposed on the plurality of color filters to planarize upper portions of the plurality of color filters may be further provided, and the first buffer layer may be disposed between the second buffer layer and the thin film transistor.

[0135] The black matrix may be disposed on the touch protection layer to be in direct contact with the touch protection layer.

[0136] The organic light emitting display device further includes an encapsulation layer disposed on the organic light emitting element and a cover substrate member disposed on the encapsulation layer.

[0137] The transparent base member may be a glass substrate.

[0138] The glass substrate may have a thickness of 30 μm to 200 μm.

[0139] The glass substrate may include an inner surface facing the organic light emitting element and an outer surface opposite to the inner surface, and the glass substrate may include an opening pattern or a concave pattern formed inward from the outer surface to allow the organic light emitting display device to be foldable or bendable.

[0140] Any one of the black matrix and the touch electrode may be disposed on the glass substrate to be in direct contact with the glass substrate.

[0141] The transparent base member may be a transparent flexible film formed of polyimide, and a transparent protective film attached to a lower portion of the transparent flexible film may be further provided.

[0142] The organic light emitting display device may be a bottom emission type in which light emitted from the organic light emitting element is emitted to the transparent base member.

[0143] According to another aspect of the present disclosure, a method for manufacturing an organic light-emitting display device is provided. The manufacturing method includes: forming a black matrix, a plurality of color filters, and a touch sensor on a carrier glass substrate, forming a first buffer layer on the plurality of color filters and the touch sensor, forming a thin film transistor on the first buffer layer, forming a planarization layer covering the thin film transistor, forming an organic light-emitting element including an anode, an organic light-emitting layer, and a cathode on the planarization layer, and forming an encapsulation layer on the organic light-emitting element.

[0144] The formation of the black matrix, multiple color filters and touch sensors may include forming the black matrix on the carrier glass substrate to define multiple opening areas, forming the multiple color filters to fill the multiple opening areas, forming a second buffer layer on the entire upper surface of the multiple color filters, forming touch electrodes on the second buffer layer, and forming a touch protection layer covering the entire upper surface of the touch electrodes.

[0145] The formation of the black matrix, multiple color filters and touch sensors may include forming touch electrodes on the carrier glass substrate and forming a touch protection layer covering the entire upper surface of the touch electrodes, forming the black matrix on the touch protection layer to define multiple opening areas, forming the multiple color filters to fill the multiple opening areas, and forming a second buffer layer on the entire upper surface of the multiple color filters.

[0146] The manufacturing method may further include forming an encapsulation layer on the organic light emitting element, and etching a lower surface of the carrier glass substrate to reduce a thickness of the carrier glass substrate after forming the encapsulation layer.

[0147] After etching by etching the lower surface of the carrier glass substrate, the thickness of the carrier glass substrate may be reduced from 400 μm to 800 μm to 30 μm to 200 μm.

[0148] The manufacturing method may further include forming an opening pattern or a concave pattern formed to be recessed inwardly from a lower surface of the carrier glass substrate.

[0149] The manufacturing method may further include forming a transparent flexible film by coating polyimide on the carrier glass substrate, peeling off the carrier glass substrate after forming the encapsulation layer, and placing a transparent protective film on a lower surface of the transparent flexible film.

[0150] Although the exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and can be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all aspects and do not limit the present disclosure. The scope of protection of the present disclosure should be interpreted based on the attached claims, and all technical concepts within their equivalent scope should be interpreted as included within the scope of the present disclosure.

[0151] CROSS-REFERENCE TO RELATED APPLICATIONS

[0152] This application claims the priority of Korean Patent Application No. 10-2019-0176211 filed on December 27, 2019, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.

Claims

1. An organic light-emitting display device, comprising: a transparent base member; A touch sensor, the touch sensor comprising a touch electrode disposed above the transparent base member and a touch protection layer covering the touch electrode; a black matrix, the black matrix being disposed below the touch sensor and defining a plurality of opening areas; a plurality of color filters, the plurality of color filters being arranged on the same plane as the black matrix and corresponding to the plurality of opening areas; a first buffer layer, the first buffer layer being disposed above the touch sensor; a thin film transistor, wherein the thin film transistor is disposed above the first buffer layer; An organic light emitting element, the organic light emitting element being disposed above the thin film transistor and corresponding to the plurality of opening areas; as well as A second buffer layer is disposed between the plurality of color filters and the touch sensor to planarize upper portions of the plurality of color filters.

2. The organic light emitting display device according to claim 1, wherein: The first buffer layer is a single layer or a multilayer selected from the group consisting of silicon nitride SiNx, silicon oxide SiOx, and aluminum oxide AlOx.

3. The organic light emitting display device according to claim 1, wherein: The second buffer layer is formed of an inorganic material having a barrier property.

4. The organic light emitting display device according to claim 1, wherein: The touch electrode is disposed on the second buffer layer to directly contact the second buffer layer.

5. An organic light-emitting display device, comprising: a transparent base member; A touch sensor, the touch sensor comprising a touch electrode disposed above the transparent base member and a touch protection layer covering the touch electrode; a black matrix, the black matrix being disposed on the touch sensor to directly contact the touch protection layer and define a plurality of opening areas; a plurality of color filters, the plurality of color filters being arranged on the same plane as the black matrix and corresponding to the plurality of opening areas; a first buffer layer disposed above the plurality of color filters; a thin film transistor, wherein the thin film transistor is disposed above the first buffer layer; as well as An organic light emitting element is disposed above the thin film transistor and corresponds to the plurality of opening areas.

6. The organic light emitting display device according to claim 5, wherein: A second buffer layer is provided on the plurality of color filters to planarize upper portions of the plurality of color filters, and The first buffer layer is disposed between the second buffer layer and the thin film transistor.

7. The organic light emitting display device according to claim 1 or 5, further comprising: An encapsulation layer disposed on the organic light emitting element; and A cover substrate member is disposed on the encapsulation layer.

8. The organic light emitting display device according to claim 1 or 5, wherein: The transparent base member is a glass substrate.

9. The organic light emitting display device according to claim 8, wherein: The glass substrate has a thickness of 30 μm to 200 μm.

10. The organic light emitting display device according to claim 9, wherein: The glass substrate includes an inner surface facing the organic light emitting element and an outer surface opposite to the inner surface, and the glass substrate includes an opening pattern or a concave pattern formed inward from the outer surface to allow the organic light emitting display device to be foldable or bendable.

11. The organic light emitting display device according to claim 8, wherein: Any one of the black matrix and the touch electrode is disposed on the glass substrate to be in direct contact with the glass substrate.

12. The organic light emitting display device according to claim 1 or 5, wherein: The transparent base member is a transparent flexible film formed of polyimide, and a transparent protective film attached to a lower portion of the transparent flexible film is also provided.

13. The organic light emitting display device according to claim 1 or 5, wherein: The organic light emitting display device is a bottom emission type in which light emitted from the organic light emitting element is emitted to the transparent base member.

14. A method for manufacturing an organic light emitting display device, the method comprising the following steps: forming a black matrix, a plurality of color filters, and a touch sensor over a carrier glass substrate, wherein the touch sensor is located over the black matrix and the plurality of color filters; forming a first buffer layer above the touch sensor; forming a thin film transistor on the first buffer layer; forming a planarization layer covering the thin film transistor; forming an organic light emitting element including an anode, an organic light emitting layer and a cathode on the planarization layer; forming an encapsulation layer above the organic light emitting element; forming a second buffer layer on the entire upper surface of the plurality of color filters; as well as A touch electrode is formed on the second buffer layer, and a touch protection layer is formed to cover the entire upper surface of the touch electrode.

15. The manufacturing method according to claim 14, wherein: The forming of the black matrix, the plurality of color filters, and the touch sensor includes: forming the black matrix on the carrier glass substrate to define a plurality of opening areas; and The plurality of color filters are formed to fill the plurality of opening regions.

16. A method for manufacturing an organic light emitting display device, the method comprising the following steps: forming a black matrix, a plurality of color filters, and a touch sensor over a carrier glass substrate, the black matrix being disposed on the touch sensor including the touch electrode and the touch protection layer to be in direct contact with the touch protection layer; forming a first buffer layer over the plurality of color filters; forming a thin film transistor on the first buffer layer; forming a planarization layer covering the thin film transistor; forming an organic light emitting element including an anode, an organic light emitting layer and a cathode on the planarization layer; as well as An encapsulation layer is formed above the organic light emitting element.

17. The manufacturing method according to claim 16, wherein: The forming of the black matrix, the plurality of color filters, and the touch sensor includes: forming the touch electrode on the carrier glass substrate and forming the touch protection layer covering the entire upper surface of the touch electrode; forming the black matrix on the touch protection layer to define a plurality of opening areas; and The plurality of color filters are formed to fill the plurality of opening regions.

18. The manufacturing method according to claim 14 or 16, further comprising: forming an encapsulation layer on the organic light emitting element; as well as A lower surface of the carrier glass substrate is etched after forming the encapsulation layer to reduce a thickness of the carrier glass substrate.

19. The manufacturing method according to claim 18, wherein: After etching by etching the lower surface of the carrier glass substrate, the thickness of the carrier glass substrate is reduced from 400 μm to 800 μm to 30 μm to 200 μm.

20. The manufacturing method according to claim 18, further comprising: An opening pattern or a concave pattern is formed, the opening pattern or the concave pattern being formed to be recessed inwardly from a lower surface of the carrier glass substrate.

21. The manufacturing method according to claim 14 or 16, further comprising: forming a transparent flexible film by coating polyimide on the carrier glass substrate; peeling off the carrier glass substrate after forming the encapsulation layer; as well as A transparent protective film is placed on the lower surface of the transparent flexible film.

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