A PCB board functional test fixture and test method

Abstract

The invention discloses a PCB function test fixture and a test method. The test tool is arranged in a lower base, an upper base is arranged on the lower base, a lower platform is arranged on the upper base, a conductive column is arranged on the lower platform, and the lower end of the conductive column passes through the upper base and is electrically connected to the test tool through a connecting line. A bearing platform is arranged above the upper platform, and a through hole for the conductive column to penetrate is arranged on the bearing platform, and the upper end of the conductive column is inserted into the corresponding through hole. An upper platform is arranged above the bearing platform, and a pressing driving mechanism for driving the upper platform is arranged on the upper base. During the test, the PCB board to be tested can be placed on the bearing platform, and the upper platform is driven downward by the pressing driving mechanism to press the bearing platform and drive the bearing platform downward, so that the contact solder joints on the lower surface of the PCB board to be tested are in contact with the conductive column, and the circuit of the PCB board to be tested and the test tool are connected, so as to facilitate the centralized testing of various functions of the PCB board to be tested, simplify the test process of the PCB board, and improve the test efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB testing, and in particular to a PCB board function testing fixture and a testing method. Background Art

[0002] Integrated circuit boards are made using semiconductor manufacturing technology, with many transistors, resistors, capacitors and other components manufactured on a smaller single-crystal silicon wafer, and the components are combined into a complete electronic circuit using multi-layer wiring or tunnel wiring methods.

[0003] The test of integrated circuit boards is also very complicated. The design of the test plan is different according to the different functions implemented inside the integrated circuit board. The usual practice is to connect the integrated circuit board with a set of accompanying test tools (a combination of functional electronic devices controlled by the integrated circuit board), and then send control instructions to each accompanying test tool in turn through the integrated circuit board, and then check whether the integrated circuit board receives correct feedback information and whether the accompanying test tools are operating normally to determine whether the functions on the integrated circuit board are normal. Each test requires the integrated circuit board to be tested to be reconnected to the accompanying test tools one by one, and then test different functional control circuits one by one. The test has many steps, takes a long time, and is inefficient. Summary of the invention

[0004] The main purpose of the present invention is to provide a PCB board functional test fixture, which aims to solve the low efficiency of integrated circuit board testing in the prior art, simplify multiple test results, and save test time.

[0005] To achieve the above-mentioned purpose, the PCB board functional test fixture proposed in the present invention comprises a lower base, an upper base arranged on the lower base, and a lower platform, a bearing platform and an upper platform on the upper base are sequentially stacked at intervals;

[0006] At least one group of accompanying measuring tools is arranged in the lower base, and a conductive column corresponding to each group of accompanying measuring tools is arranged on the lower platform, and the lower end of the conductive column passes through the upper base and is electrically connected to the accompanying measuring tools through a connecting line;

[0007] The carrying platform is movably arranged above the lower platform, and is provided with through holes for the conductive pillars to penetrate, and the upper ends of the conductive pillars are inserted into the corresponding through holes; the PCB board to be tested is placed on the carrying platform, and the back of the PCB board to be tested is provided with contact solder joints corresponding to the through holes;

[0008] The lower platform and the PCB board to be tested are provided with an indicator light for displaying the working status of the accompanying test tool;

[0009] The upper platform is located above the carrying platform, and a pressing driving mechanism for driving the upper platform to move up and down is provided on the upper base; when the pressing driving mechanism drives the upper platform to move downward, the lower platform contacts the carrying platform and drives the carrying platform to move downward, so that the contact solder joints of the PCB board to be tested placed on the carrying platform contact the conductive columns, thereby connecting the circuit of the PCB board to be tested and the accompanying test tool.

[0010] Optionally, the pressing drive mechanism includes a pressing handle, a linkage body and a vertical rod arranged in an L shape; a fixed seat is arranged on the upper base, and the lower end of the fixed seat has a guide sleeve; the short side end of the pressing handle is pivoted to the upper end of the fixed seat, and its corner portion is pivoted to the upper end of the linkage body, the lower end of the linkage body is pivoted to the upper end of the vertical rod, and the lower end of the vertical rod passes through the guide sleeve and is connected to the upper platform.

[0011] Optionally, a spring switch is provided on the upper platform, and the lower end of the spring switch passes through the upper platform and is arranged opposite to the upper surface of the PCB board to be tested; a power button is arranged at a position corresponding to the upper surface of the PCB board to be tested and the lower end of the spring switch.

[0012] Optionally, a plurality of buffer columns are provided on the lower surface of the upper platform.

[0013] Optionally, the diameter of the lower end of the buffer column gradually decreases.

[0014] Optionally, the support platform is provided with placement pits for accommodating the PCB board to be tested, and one side of each placement pit is provided with a concave pit connected thereto.

[0015] Optionally, there is at least one positioning protrusion in the placement pit, and a positioning hole corresponding to the positioning protrusion is provided on the PCB board to be tested.

[0016] Optionally, a plurality of evenly distributed guide posts are provided on the lower surface of the support platform, a buffer sleeve corresponding to the guide posts is provided on the upper base, and the lower end of the guide post passes through the corresponding buffer sleeve.

[0017] Optionally, the lower base has a containing cavity, and the accompanying test tool is placed in the containing cavity; the upper base covers the cavity opening of the containing cavity, and a side wall of the upper base is rotatably connected to a side wall of the containing cavity.

[0018] The present invention also provides a functional testing method for a PCB board, which comprises the following steps:

[0019] Place the PCB to be tested in the above-mentioned PCB function test fixture, and connect it with the accompanying test tool;

[0020] When the power is turned on, it detects whether the PCB board to be tested is in the test environment. If it is in the test environment, the test firmware burned in the main control IC of the PCB board to be tested is triggered to perform the test work;

[0021] During the test, the main control IC of the PCB to be tested lights up the indicator lights according to the signals returned by the accompanying test tools when they are working, so that the tester can judge whether the function of the PCB to be tested is normal according to the status of each indicator light.

[0022] The technical solution of the present invention arranges the test tools in the lower base, leads the connection welding points of each test tool to the through hole of the carrier platform through the conductive column, and then realizes the contact electrical connection between the PCB board to be tested and the test tools by pressing, which can replace the wiring welding between the PCB board to be tested and the test tools, greatly simplifies the connection process between the PCB board to be tested and the test tools, saves test time, and improves test efficiency.

[0023] At the same time, according to the test needs, multiple groups of connecting solder joints of the accompanying test tools can be led out to the carrier platform, and multiple PCB boards to be tested can be connected to their corresponding accompanying test tools at the same time through one pressing, which greatly shortens the connection steps between the PCB boards to be tested and the accompanying test tools, and further improves the test efficiency.

[0024] Moreover, by setting an indicator light for displaying the working status of the accompanying test equipment, the results of various functional tests are reflected in a simple and easy-to-see form through the indicator light, etc., which is convenient for testers to directly judge the quality of the PCB board to be tested, reduce the probability of test errors, and ensure test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0026] Figure 1 This is a schematic diagram of the structure of an embodiment of a PCB board function test fixture of the present invention before testing;

[0027] Figure 2 This is a schematic diagram of the structure of an embodiment of a PCB board function test fixture of the present invention during testing;

[0028] Figure 3 It is a front schematic diagram of an embodiment of a PCB board function test fixture of the present invention;

[0029] Figure 4This is a structural schematic diagram of the upper platform in an embodiment of a PCB board function test fixture of the present invention;

[0030] Figure 5 This is a structural schematic diagram of the upper platform from another perspective in one embodiment of the PCB board function test fixture of the present invention;

[0031] Figure 6 This is a structural schematic diagram of a carrier platform in an embodiment of a PCB board function test fixture of the present invention;

[0032] Figure 7 This is a structural schematic diagram of the lower platform in an embodiment of a PCB board function test fixture of the present invention;

[0033] Figure 8 This is a schematic diagram of the structure inside the lower base in one embodiment of the PCB board function test fixture of the present invention;

[0034] Fig. 9 The figure is a schematic diagram of the structure of a PCB board of a smart toy product.

[0035] Description of Figure Numbers:

[0036] 100-lower base, 100a-accommodating cavity, 110-second indicator light, 120-lock buckle;

[0037] 200-upper base, 210-sliding column, 220-fixed seat, 220a-guide sleeve;

[0038] 300-lower platform, 310-first conductive column;

[0039] 400-carrying platform, 400a-placing pit, 400b-through hole, 400c-pit, 410-guide column, 420-positioning protrusion;

[0040] 500-upper platform, 510-spring switch, 510a-lower end of the spring switch, 520-buffer column, 530-second conductive column, 530a-lower end of the second conductive column, 540-sliding sleeve;

[0041] 600-pressing driving mechanism, 610-pressing handle, 620-linkage body, 630-vertical rod;

[0042] 700-fixed board, 710-color sensor, 711-color block, 720-infrared sensor, 730-test PCB board;

[0043] 800- PCB board, 810- first indicator light, 820- power button.

[0044] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0047] In addition, the descriptions of "first", "second", etc. in the present invention are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0048] The present invention provides a PCB board function test fixture.

[0049] Reference Figure 1 , 4 and 6-8, Figure 1 This is a schematic diagram of the structure of an embodiment of a PCB board functional test fixture of the present invention before testing. Figure 4 This is a schematic diagram of the structure of the upper platform in an embodiment of the PCB board function test fixture of the present invention. Figure 6 This is a schematic diagram of the structure of the carrier platform in one embodiment of the PCB board function test fixture of the present invention. Figure 7 This is a structural schematic diagram of the lower platform in an embodiment of the PCB board function test fixture of the present invention. Figure 8 This is a schematic diagram of the structure inside the lower base in one embodiment of the PCB board function test fixture of the present invention.

[0050] like Figure 1 , 4 As shown in FIGS. 6-8 , in an embodiment of the present invention, the PCB board functional test fixture includes a lower base 100 , an upper base 200 , a lower platform 300 , a supporting platform 400 and an upper platform 500 .

[0051] The lower base 100 has a receiving cavity 100a, in which at least one group of accompanying test tools is arranged. The upper base 200 covers the cavity opening of the receiving cavity 100a, and the lower stage 300 is arranged on the upper base 200. The lower stage 300 is provided with a first conductive column 310 corresponding to each group of accompanying test tools, and the lower end of the first conductive column 310 passes through the upper base 200 and is electrically connected to the accompanying test tools through a connecting line.

[0052] The carrier 400 is movably arranged above the lower platform 300, and is provided with a through hole 400b for the first conductive column 310 to penetrate, and the upper end of the first conductive column 310 is inserted into the corresponding through hole 400b. The PCB to be tested is placed on the carrier 400, and the back of the PCB to be tested is provided with a contact solder joint corresponding to the through hole 400b.

[0053] The upper stage 500 is located above the carrier 400, and a pressing driving mechanism 600 for driving the upper stage 500 to move up and down is disposed on the upper base 200. When the pressing driving mechanism 600 drives the upper stage 500 to move downward, the lower stage 300 contacts the carrier 400 and drives the carrier 400 to move downward, so that the contact solder joints of the PCB to be tested placed on the carrier 400 contact the first conductive pillars 310, and the circuits of the PCB to be tested and the accompanying test tool are connected.

[0054] Indicator lights for displaying the working status of the accompanying test tool are also arranged on the lower stage 300 and the PCB board to be tested.

[0055] During the test, the PCB to be tested can be placed on the carrier 400, and the upper platform 500 is driven downward by the pressing driving mechanism 600 to apply pressure to the carrier 400 and drive the carrier 400 to move downward, so that the contact solder joints on the lower surface of the PCB to be tested are in contact with the first conductive pillars 310, and the circuits of the PCB to be tested and the accompanying test equipment are quickly connected, so as to facilitate the subsequent centralized testing of various functions of the PCB to be tested.

[0056] In this embodiment, the accompanying test tools are arranged in the lower base 100, and the connection solder joints of each accompanying test tool are led out to the through hole 400 b of the carrier 400 through the first conductive column 310, and then the contact electrical connection between the PCB board to be tested and the accompanying test tool is achieved by pressing, which can replace the wiring welding between the PCB board to be tested and the accompanying test tool, greatly simplifying the connection process between the PCB board to be tested and the accompanying test tool, saving test time, and improving test efficiency.

[0057] At the same time, according to the test needs, multiple groups of connecting solder joints of the accompanying test tools can be led out to the carrier 400, and multiple PCB boards to be tested can be connected to their corresponding accompanying test tools at the same time through one pressing, which greatly shortens the connection steps between the PCB boards to be tested and the accompanying test tools, and further improves the test efficiency.

[0058] Moreover, by setting an indicator light for displaying the working status of the accompanying test equipment, the results of various functional tests are reflected in a simple and easy-to-see form through the indicator light, etc., which is convenient for testers to directly judge the quality of the PCB board to be tested, reduce the probability of test errors, and ensure test efficiency.

[0059] Specifically, in this embodiment, the pressing driving mechanism 600 includes an L-shaped pressing handle 610, a linkage body 620 and a vertical rod 630. A fixing seat 220 is provided at the front upper portion of the upper base 200, and a vertical guide sleeve 220a is provided at the lower end of the fixing seat 220. The short side end of the pressing handle 610 is pivotally connected to the upper end of the fixing seat 220, and the corner portion thereof is pivotally connected to the upper end of the linkage body 620. The lower end of the linkage body 620 is pivotally connected to the upper end of the vertical rod 630, and the lower end of the vertical rod 630 passes through the guide sleeve 220a and is connected to the upper platform 500.

[0060] like Figure 1-2 As shown, during the test, the pressing handle 610 can be turned counterclockwise to drive the vertical rod 630 to move downward along the sliding sleeve with the help of the linkage body 620, so as to drive the upper platform 500 to move toward the supporting platform 400 and apply pressure, thereby driving the supporting platform 400 to move downward relative to the lower platform 300, so that the connection solder joints on the back of the PCB board to be tested on the supporting platform 400 contact with the first conductive pillars 310 on the lower platform 300, thereby connecting the circuit between the PCB board to be tested and the accompanying test tool.

[0061] Alternatively, if Figure 3-4 As shown, in this embodiment, two vertically arranged sliding columns 210 are provided on the upper base 200, and two sliding sleeves 540 are provided on the upper platform 500, and the two sliding sleeves 540 are respectively slidably sleeved on the two sliding columns 210. Thus, the sliding stability of the upper platform 500 is improved.

[0062] like Figure 4-5As shown, in this embodiment, a second conductive column 530 is further provided on the upper platform 500, and the upper end of the second conductive column 530 is connected to an external power supply through a connecting line, and the lower end thereof passes through the upper platform 500 and extends downward. A connecting solder joint corresponding to the second conductive column 530 is provided on the front of the PCB board to be tested. Thus, when the upper platform 500 is pressed onto the carrier 400, the lower end 530a of the second conductive column can be brought into contact with the connecting solder joint on the front of the PCB board to be tested, so that the PCB board to be tested is connected to the power supply. When the upper platform 500 is lifted up, the PCB board to be tested can be quickly disconnected from the power supply, thereby facilitating the rapid replacement of the PCB board to be tested.

[0063] A spring switch 510 is also provided on the upper stage 500, and the lower end 510a of the spring switch passes through the upper stage 500 and is arranged opposite to the upper surface of the PCB to be tested. A power button 820 is provided at a position on the upper surface of the PCB to be tested corresponding to the lower end 510a of the spring switch. After the upper stage 500 presses the connection solder joint on the back of the PCB to be tested and the first conductive column 310 together, the power button 820 can be closed / opened by pressing the spring switch 510, thereby controlling the circuit on / off of the PCB to be tested and the accompanying test tool, thereby controlling the functional test process of the PCB to be tested.

[0064] Optionally, in this embodiment, a plurality of buffer columns 520 are provided on the lower surface of the upper platform 500, and the buffer columns 520 are made of a flexible material with elasticity, such as silica gel. When the upper platform 500 is pressed on the carrier 400, the lower end of the buffer column 520 presses against the edges of the PCB board to be tested, so that the PCB board to be tested is closely attached to the carrier 400, ensuring that the contact solder joints on the back of the PCB board to be tested are effectively in contact with the first conductive column 310. At the same time, the buffer column 520 can also absorb the impact kinetic energy of the contact between the upper platform 500 and the PCB board to be tested, so as to prevent the upper platform 500 from crushing the PCB board to be tested.

[0065] In this embodiment, the lower end of the buffer column 520 is configured to be a cone with a gradually decreasing end surface area to reduce the contact area between the buffer column 520 and the PCB board to be tested, increase the pressure applied by the buffer column 520 on the PCB board to be tested, and make the PCB board to be tested more stably fixed on the supporting platform 400 during testing.

[0066] like Figure 6 As shown, in this embodiment, a placement pit 400a having a size nearly consistent with the PCB board to be tested is provided on the carrier 400, so as to facilitate the placement and fixing of the PCB board to be tested placed on the carrier 400. Through holes 400b are distributed in the placement pit 400a, corresponding to the connection solder joints on the back of the PCB board to be tested.

[0067] It should be noted that the number of the placement pits 400a can be set as needed to adapt to different intensities of testing work and ensure test efficiency. In this embodiment, the number of the placement pits 400a is set to four. Correspondingly, the accompanying test tools in the accommodating cavity 100a of the lower base 100 are also set to four groups, and the connection solder joints of each group of accompanying test tools are led out to the through holes 400b in the placement pits 400a through the connecting wires and the first conductive pillars 310, so as to form a contact electrical connection with the PCB board to be tested through the first conductive pillars 310 during the test.

[0068] In this embodiment, a concave pit 400c communicating with each placement pit 400a is provided on one side thereof to facilitate placement and removal of the PCB board to be tested.

[0069] In this embodiment, two positioning protrusions 420 are provided in each placement pit 400a, and the PCB to be tested is provided with positioning holes corresponding to the positioning protrusions 420. Thus, the engagement between the two positioning protrusions 420 and the two positioning holes prevents the PCB to be tested from being placed in the wrong direction.

[0070] In this embodiment, guide posts 410 are respectively arranged at the four corners of the lower surface of the carrier 400, and a buffer sleeve corresponding to the guide posts 410 is arranged on the upper base 200, and the lower end of the guide post 410 passes through the corresponding buffer sleeve. The cooperation between the guide post 410 and the buffer sleeve can guide the up and down movement of the carrier 400, so that the carrier 400 moves smoothly. At the same time, the buffer sleeve can also smooth the movement trend of the carrier 400 moving downward, and prevent the upper end of the first conductive post 310 from colliding with the back of the PCB board to be tested and damaging the PCB board to be tested.

[0071] Optionally, in this embodiment, a hinge structure is provided on the rear side wall of the upper base 200 and the rear side wall of the lower base 100, and the upper base 200 and the lower base 100 can be rotatably connected through the hinge structure. Thus, the upper base 200 can be rotated to open the accommodating cavity 100a of the lower base 100, thereby facilitating the replacement and installation of the accompanying test tool.

[0072] Alternatively, if Figure 1 As shown, in this embodiment, lock buckles 120 are provided at the front of the side walls on both sides of the lower base 100, and buckle plates corresponding to the lock buckles 120 are provided on the upper base 200. Thus, the upper base 200 can be buckled on the lower base 100 through the cooperation between the lock buckles 120 and the buckle plates to close the cavity opening of the accommodating cavity 100a of the lower base 100.

[0073] Based on the above-mentioned PCB board function test fixture, an embodiment of the present invention also provides a PCB board function test method, which includes the following steps:

[0074] Step S1, placing the PCB board to be tested in a PCB board function test fixture, so that it is connected to each accompanying test tool.

[0075] Step S2, turning on the power supply, detecting whether the PCB board to be tested is in the test environment, if it is in the test environment, triggering the test firmware burned in the main control IC of the PCB board to be tested to perform the test work.

[0076] Among them, the accompanying test tools are customized according to the actual test needs, so that multiple accompanying test tools can simulate a specific environment, that is, the test environment. Within 3 seconds after the power is turned on, the main control IC of the PCB board to be tested detects the specific signals fed back by the accompanying test tools, and judges whether the current PCB board to be tested is in the test environment based on these specific signals. If it is in the test environment, the test firmware burned in the main control IC of the PCB board to be tested is directly triggered to perform the test work.

[0077] Step S3, during the test, the main control IC of the PCB to be tested lights up the indicator lights according to the signals returned by the accompanying testing tools when they are working, so that the tester can judge whether the function of the PCB to be tested is normal according to the status of each indicator light.

[0078] To facilitate understanding, the test fixture and test method are further explained below with examples.

[0079] like Fig. 9 As shown, it is a PCB board 800 of a smart toy product. The PCB board 800 is used as the PCB board to be tested. The PCB board 800 has Bluetooth communication function, color recognition function, obstacle sensing function, and motor control function, wherein the motor control function is composed of a main control IC and three motor drive ICs, which can control the operation of three different motors.

[0080] In this embodiment, two RGB lamp beads are arranged on the PCB board 800 as the first indicator light 810, which is used to display whether the three functions of the Bluetooth communication function, the color recognition function, and the obstacle sensing function are normal.

[0081] Three second indicator lights 110 are provided on the upper base 200, and both ends of the three second indicator lights 110 are connected to the first conductive posts corresponding to the connection welding points of the control motors through connecting wires, thereby replacing the three motors with the three second indicator lights 110. Compared with the driving motors, the indicator lights can make the test results more intuitive and improve the test efficiency.

[0082] like Figure 8As shown, before the test, 4 groups of accompanying test tools are set in the accommodating cavity 100a of the lower base 100, and each group of accompanying test tools includes a fixing plate 700, a color sensor 710 and two infrared sensors 720 arranged opposite to each other. A red color block 711 is arranged opposite to the sensing side of the color sensor 710. The sensing sides of the two infrared sensors 720 are arranged opposite to each other, so that the two infrared sensors 720 can sense each other. Then, the interfaces of each group of accompanying test tools are guided to the first conductive pillars 310 corresponding to each other through the connecting wires, and then the upper base 200 is covered on the lower base 100, and the accompanying test tools are enclosed in the accommodating cavity 100a.

[0083] In addition, for the Bluetooth communication function, a test PCB board 730 is also disposed in the accommodation cavity of the lower base 100 . The test PCB board 730 will continuously transmit a Bluetooth signal with a frequency of 2.4G during the test process.

[0084] The test method is as follows:

[0085] Step 1: Place the PCB board 800 into a test fixture and press the fixture, and connect the circuits between the PCB board 800 and its corresponding accompanying test tool and the second indicator light 110 disposed on the upper base 200 .

[0086] Step 2, press the spring switch 510 to power the PCB board 800, detect whether the PCB board 800 is in the test environment, and if it is in the test environment, trigger the test firmware burned in the main control IC of the PCB board 800 to perform the test work. Among them, detecting whether the PCB board 800 is in the test environment specifically includes the following steps:

[0087] Step 21, detect whether the Bluetooth IC on the PCB board 800 can scan the 2.4GHz frequency signal. Since the test fixture is provided with a companion test PCB board 730, it always transmits a 2.4G frequency Bluetooth signal. When the Bluetooth IC on the PCB board 800 scans the signal, it indicates that the Bluetooth test function on the PCB board 800 is normal.

[0088] Step 22, detect whether the color detected by the color sensor 710 is red. Since a red color block 711 is fixed in front of the color sensor 710, after the power is turned on, the color sensor 710 emits white light to the color block and receives the light reflected by the color block 711 to identify the color of the color block 711 and send a color signal to the PCB board 800. Therefore, it can be judged that the color recognition function is normal according to whether the color sensor 710 detects red.

[0089] Step S23, detect whether the value detected by the infrared sensor 720 is the set value. Since the two infrared sensors 720 are relatively set on the fixed plate 700, the distance between them is fixed and known, and the distance is taken as the set value. After powering on, the two infrared sensors 720 detect the distance value relative to each other. When the distance values ​​detected by the two infrared sensors 720 are both the set values, it can be explained that the obstacle sensing function of the PCB board 800 is achieved.

[0090] The above steps S21-S23 are performed simultaneously and completed within 3 seconds of powering on. When the main control IC on the PCB board 800 detects that the Bluetooth IC can scan the Bluetooth signal with a frequency of 2.4G, the color sensor 710 detects red, and the two infrared sensors 720 detect that the distance values ​​are both the set values, the test firmware burned in the main control IC of the PCB board 800 is directly triggered to execute the test work.

[0091] The above three conditions, namely, "the Bluetooth IC can scan the Bluetooth signal with 2.4G frequency", "the color sensor 710 detects red", and "the two infrared sensors 720 detect that the distance values ​​are both set values", constitute a special environment. This special environment is used as a test environment. Under normal use, the finished PCB board 800 basically will not meet these three conditions at the same time, and will not easily trigger the test firmware operation.

[0092] In addition, in this embodiment, the test firmware and the official firmware are integrated together, so that the firmware only needs to be burned once to achieve the effect of being applicable to both testing and normal use of the finished product, and there is no need to burn the test firmware and then burn the official firmware, which improves production efficiency and saves labor costs. In order to avoid the test firmware from being started during the use of the finished product and interfering with normal use, a specific test environment is set to limit the operation of the test firmware to avoid such problems.

[0093] Step 3: When the test firmware executes the test, the main control IC of the PCB board 800 lights up the indicator lights according to the signals returned by the accompanying test tools, so that the tester can judge whether the function of the PCB board 800 is normal according to the status of each indicator light. Specifically, the steps are as follows:

[0094] Step 31, when the main control IC receives the signals fed back by the Bluetooth IC, the color sensor, and the infrared sensor, the main control IC sends a lighting signal to the two RGB lamps to light up the two RGB lamps and emit white light. Since the triggering test firmware to perform the test work requires the Bluetooth communication function, color recognition function, and obstacle sensing function of the PCB board 800 to be normal before it can be triggered, therefore, after the triggering test firmware to perform the test work, the main control IC can directly send a lighting signal to the two RGB lamps to light up the two RGB lamps and emit white light for the test personnel to judge.

[0095] Step 32, the main control IC sends a control signal to the three motor driver ICs of the motor driver IC, so that the motor driver IC outputs a voltage difference to the connection soldering points at both ends of the motor, so as to light up the second indicator lights 110 connected to the connection soldering points at both ends of the motor. When the three second indicator lights 110 light up, it indicates that the motor control function of the PCB board 800 is normal.

[0096] During the test, the tester can directly observe the lighting status of the three first indicator lights 810 and the two second indicator lights 110. If all five indicator lights are on, it means that the function of the PCB board 800 is good, otherwise it can be considered that the function of the PCB board 800 is bad.

[0097] After testing one PCB board 800, another spring switch 510 is pressed again to determine whether the currently tested PCB board 800 is good or not based on the lighting conditions of the three first indicator lights 810 and the two second indicator lights 110. This process is repeated until the testing of four PCB boards 800 is completed, and then a new PCB board 800 is taken out and put in for testing.

[0098] The test fixture and test method provided by the present invention only need to put the PCB board 800 into the test fixture to quickly connect all the test circuits, greatly reducing the number of personnel involved. During the test, it is only necessary to press the spring switch to test in sequence, and the quality of the PCB board 800 can be judged by observing the status of the indicator light. The test time for each PCB board 800 is only 5 seconds, and the time for fully testing four PCB boards 800 is only 40 seconds. The test steps are simple and efficient, which can greatly improve the test efficiency of the PCB board 800 and reduce a lot of costs for mass production of PCB boards 800.

[0099] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A functional testing method for a PCB board, characterized in that: The PCB board function test fixture is used to achieve this, and the test fixture includes a lower base, an upper base arranged on the lower base, and a lower platform, a bearing platform and an upper platform on the upper base are sequentially stacked at intervals; At least one group of accompanying measuring tools is arranged in the lower base, and a conductive column corresponding to each group of accompanying measuring tools is arranged on the lower platform, and the lower end of the conductive column passes through the upper base and is electrically connected to the accompanying measuring tools through a connecting line; The carrying platform is movably arranged above the lower platform, and is provided with through holes for the conductive pillars to penetrate, and the upper ends of the conductive pillars are inserted into the corresponding through holes; the PCB board to be tested is placed on the carrying platform, and the back of the PCB board to be tested is provided with contact solder joints corresponding to the through holes; The lower platform and the PCB board to be tested are provided with an indicator light for displaying the working status of the accompanying test tool; The upper platform is located above the carrying platform, and a pressing driving mechanism for driving the upper platform to move up and down is provided on the upper base; when the pressing driving mechanism drives the upper platform to move downward, the lower platform contacts the carrying platform and drives the carrying platform to move downward, so that the contact solder joints of the PCB board to be tested placed on the carrying platform contact the conductive pillars, connecting the circuit of the PCB board to be tested and the accompanying test tool; Among them, the official firmware and the test firmware in the main control IC of the PCB board to be tested are integrated together and burned into the main control IC at one time; The test method includes the following steps: Place the PCB to be tested in the test fixture and connect it to the accompanying test equipment; When the power is turned on, it detects whether the PCB board to be tested is in the test environment. If it is in the test environment, the test firmware burned in the main control IC of the PCB board to be tested is triggered to perform the test work; During the test, the main control IC of the PCB to be tested lights up the indicators according to the signals returned by the accompanying test tools, so that the tester can judge whether the function of the PCB to be tested is normal according to the status of each indicator. Multiple test tools can simulate the corresponding test environment. Within 3 seconds after the power is turned on, the main control IC of the PCB board to be tested detects the specific signals fed back by the test tools, and judges whether the current PCB board to be tested is in the test environment based on these specific signals; if it is in the test environment, it directly triggers the test firmware burned in the main control IC of the PCB board to be tested to execute the test work.

2. The functional testing method of a PCB board as claimed in claim 1, characterized in that: The pressing drive mechanism includes a pressing handle, a linkage body and a vertical rod arranged in an L shape; a fixed seat is arranged on the upper base, and a guide sleeve is provided at the lower end of the fixed seat; the short side end of the pressing handle is pivotally connected to the upper end of the fixed seat, and its corner portion is pivotally connected to the upper end of the linkage body, the lower end of the linkage body is pivotally connected to the upper end of the vertical rod, and the lower end of the vertical rod passes through the guide sleeve and is connected to the upper platform.

3. The functional testing method of a PCB board as claimed in claim 1, characterized in that: A spring switch is arranged on the upper platform, and the lower end of the spring switch passes through the upper platform and is arranged opposite to the upper surface of the PCB to be tested; a power button is arranged at a position corresponding to the upper surface of the PCB to be tested and the lower end of the spring switch.

4. The functional testing method of a PCB board as claimed in claim 3, characterized in that: A plurality of buffer columns are arranged on the lower surface of the upper platform.

5. The functional testing method of a PCB board as claimed in claim 4, characterized in that: The diameter of the lower end of the buffer column gradually decreases.

6. The functional testing method of a PCB board as claimed in claim 1, characterized in that: The support platform is provided with placement pits for accommodating the PCB board to be tested, and one side of each placement pit is provided with a concave pit connected thereto.

7. The functional testing method of a PCB board as claimed in claim 6, characterized in that: There is at least one positioning protrusion in the placement pit, and a positioning hole corresponding to the positioning protrusion is provided on the PCB board to be tested.

8. The functional testing method of a PCB board as claimed in claim 1, characterized in that: The lower surface of the bearing platform is provided with a plurality of evenly distributed guide columns, the upper base is provided with a buffer sleeve corresponding to the guide column, and the lower end of the guide column passes through the corresponding buffer sleeve.

9. The functional testing method of a PCB board according to any one of claims 1 to 8, characterized in that: The lower base has a containing cavity, and the accompanying measuring tool is placed in the containing cavity; the upper base covers the cavity opening of the containing cavity, and a side wall of the upper base is rotatably connected to a side wall of the containing cavity.

Images