Floating cooling unit

Abstract

The present invention provides a floating heat dissipation unit, comprising an upper plate and a lower plate, wherein the lower plate covers the upper plate and defines a chamber together, wherein the chamber is filled with a working fluid, wherein the upper plate and the lower plate each have a front section, a rear section and a middle section located between the front section and the rear section, and the plate thickness of the front section and the rear section of either or both of the upper plate and the lower plate is greater than the plate thickness of the middle section, so that the middle section forms a floating flexure section that can be floated and adjusted, so as to provide the floating heat dissipation unit with the effect of floatingly adjusting the height difference when connected.

Description

Technical Field

[0001] The invention relates to a floating heat dissipation unit, in particular to a floating heat dissipation unit which can adjust the height difference and avoid structural deformation when the floating heat dissipation unit is connected. Background Art

[0002] The so-called heat pipe is a hollow metal tube with an appropriate amount of working fluid filled in the cavity of the tube. The heat dissipation principle of the heat pipe is based on the two-phase change of the working fluid, that is, the working fluid will first absorb heat and vaporize at the heat source corresponding to an evaporation section at one end of the tube, and then change from liquid to gas, and diffuse and transfer heat in the tube through an insulation section to a condensation section at the other end of the tube to achieve the purpose of remote heat transfer.

[0003] Conventional heat pipes are usually combined with a heat dissipation unit (such as a snap-on fin assembly or an aluminum extruded fin assembly or a heat sink) to form a heat dissipation module, which is installed in an electronic device (such as a computer, server or communication chassis, mobile phone or handheld device) to dissipate heat from the heat source on the motherboard.

[0004] However, the packaging structure of each heat source on the electronic device board has a height difference (inconsistent height), so that each heat source has a height difference, so that the evaporation section of each heat pipe that contacts the heat source is overlapped or combined with the radiator to form a height difference, but the combination of this height difference will cause the heat transfer efficiency of the heat pipe to decrease or become inoperable; the reason is that the tube body of the heat pipe is made of metal plates of the same thickness, so the thickness of the evaporation section, the insulation section and the condensation section of the heat pipe are consistent; when there is a height difference requirement to adjust the height difference between the evaporation section and the condensation section, due to the characteristics of the metal material and the uniform thickness of the plate, if the insulation section is bent or folded to meet the height difference requirement, the bridging force between the evaporation section and the condensation section of the heat pipe will cause the insulation section (transmission section) to be squeezed inward or pulled outward and deformed, thereby causing the heat transfer and heat dissipation efficiency of the heat pipe to be poor, or even failure. Summary of the invention

[0005] An object of the present invention is to provide a floating heat dissipation unit that can provide a floating heat dissipation unit with the effect of floating adjustment of height difference when connected, and can avoid the floating heat dissipation unit from structural deformation or disability caused by the bridging force generated by the height difference connection.

[0006] Another object of the present invention is to provide a floating heat dissipation unit in which the thickness of a middle section of an upper plate and / or a lower plate is thinner than the thickness of the front section and the rear section, so that the middle section forms a floating flexure section that can be floated and adjusted, so that the two ends of the floating heat dissipation unit can correspond to the heating elements and various types of heat dissipation units for assembly and alignment and adjustment of the height difference.

[0007] To achieve the above-mentioned purpose, the present invention provides a floating heat dissipation unit, including an upper plate and a lower plate, the lower plate covering the upper plate and jointly defining a chamber, the chamber being filled with a working fluid, the upper plate and the lower plate each having a front section, a rear section and a middle section located between the front section and the rear section, the plate thickness of the front section and the rear section of either or both of the upper plate and the lower plate is greater than the plate thickness of the middle section, so that the middle section forms a floating flexure section and can be floated and adjusted.

[0008] The chamber is provided with a capillary structure, which is formed on the inner side of the lower plate or the upper and lower plates. The plate thickness of the front section and the rear section is greater than or equal to 0.5 mm, and the plate thickness of one of the upper and lower plates located at the middle section is equal to 0.08 mm and less than 0.5 mm.

[0009] The middle section is provided with a reinforcing rib, which connects the front section and the middle section, or connects the middle section and the rear section, or connects the front section through the middle section and extends to the rear section, and the thickness of the front section and the rear section are the same or different. In addition, the upper plate can be composed of a front section, a middle section and a rear section, and the thickness of the front section and the rear section is greater than the thickness of the middle section.

[0010] The lower plate is composed of a front plate, a middle plate and a rear plate. The thickness of the front plate and the rear plate of the lower plate is greater than the thickness of the middle plate of the lower plate.

[0011] The upper plate and the lower plate are made of metal material, and the metal material is aluminum material, stainless steel material, copper material, titanium material or alloy material.

[0012] The floating heat dissipation unit can be a temperature equalizing plate, a heat plate, a flat heat pipe, or a device with two-phase flow.

[0013] Therefore, through the design of the floating heat sink of the present invention, the floating heat sink can be provided with the effect of floating adjustment of height difference when connected, and the problem of structural deformation caused by the bridging force generated when the floating heat sink is connected due to the height difference can be avoided. In addition, the present invention can also be used for heat sources with different height differences on the motherboards of various electronic devices (such as servers, computers or communication boxes), so that the two ends of the floating heat sink can be effectively connected with the corresponding heating elements and different or same types of heat sinks. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1A It is a combined three-dimensional schematic diagram of an embodiment of the present invention.

[0015] Figure 1B It is a combined stereoscopic schematic diagram of some other embodiments of the present invention.

[0016] Figure 2 It is a schematic cross-sectional view of an embodiment of the present invention.

[0017] Explanation of the reference numerals: floating heat dissipation unit 1; upper plate 11; upper plate body 111; lower plate 12; lower plate body 121; chamber 13; evaporation zone 131; transmission zone 132; condensation zone 133; working fluid 14; front section 151; rear section 152; middle section 153; reinforcing ribs 1531; gap 1532; capillary structure 18. DETAILED DESCRIPTION

[0018] The above-mentioned objects and the structural and functional characteristics of the present invention will be described based on the preferred embodiments shown in the accompanying drawings.

[0019] The present invention provides a floating heat dissipation unit, see Figure 1A , Figure 2 In this embodiment, the floating heat dissipation unit 1 is described as a flat plate heat pipe, but it is not limited to this. In specific implementation, the floating heat dissipation unit 1 can also be selected as a temperature equalizing plate or a hot plate. The floating heat dissipation unit 1 includes an upper plate 11 and a lower plate 12 covering the upper cover. The upper plate 11 and the lower plate 12 are made of metal or non-metal material. The metal material is aluminum, stainless steel, copper, titanium or alloy. The non-metal material can be plastic, ceramic or stone.

[0020] The upper plate 11 and the lower plate 12 each have a front section 151, a rear section 152 and a middle section 153 located between the front section 151 and the rear section 152. Both sides of the middle section 153 are respectively connected to the front section 151 and the rear section 152. The plate thickness of the front section 151 and the rear section 152 is greater than or equal to 0.5 mm, and the plate thickness of the middle section 153 is equal to 0.08 mm and less than 0.5 mm. In this embodiment, the floating heat dissipation unit 1 is a flat plate heat pipe, and the plate thickness of the upper plate 11 and the lower plate 12 is preferably selected as 0.2 mm for the front section 151 and the rear section 152, and 0.08 mm for the middle section 153, but it is not limited thereto. In a specific implementation, the floating heat dissipation unit 1 is a temperature equalizing plate or a heat plate, and the thickness of the upper plate 11 and the lower plate 12 is preferably selected to be 0.5 mm for the front section 151 and the rear section 152 and 0.08 mm for the middle section 153 .

[0021] The plate thickness of the front section 151 and the rear section 152 of any one or both of the upper plate 11 and the lower plate 12 is greater than the plate thickness of the middle section 153, so that the middle section 153 can form a floating flexure section and can float to adjust the height difference, that is, the floating flexure section can be flexed or bent, so that the position of this section can float and adjust the height difference according to the height difference of the front section 151 and the rear section 152; in this embodiment, the plate thickness of each front section 151 and the rear section 152 of the upper plate 11 and the lower plate 12 is the same, and the plate thickness of each front section 151 and the rear section 152 of the upper plate 11 and the lower plate 12 is greater than the plate thickness of the middle section 153, that is, the plate thickness (such as 0.2mm) of each front section 151 of the upper plate 11 and the lower plate 12 is the same as The thickness of each rear section 152 (e.g., 0.2 mm) and the thickness of each middle section 153 of the upper plate 11 and the lower plate 12 (e.g., 0.08 mm) are smaller than the thickness of each front section 151 and the rear section 152. Therefore, the thickness of each middle section 153 of the upper plate 11 and the lower plate 12 is thinner than the thickness of each front section 151 and the rear section 152, so that the floating flexure section formed by each middle section 153 of the upper plate 11 and the lower plate 12 provides the floating heat dissipation unit 1 with the function of floatingly adjusting the height difference of the two ends by flexing (or bending) up, down, left, or right when the two ends are connected, and can be used for the effect of appropriately floatingly adjusting up, down, and / or left, right when there is a height difference between two components (e.g., electronic components and heat dissipation units). The number of the floating heat dissipation units 1 of the present invention (e.g., more than two floating heat dissipation units 1) can be matched and attached in advance according to the number of heat sources (e.g., more than two heat sources) that need to dissipate heat.

[0022] In one possible embodiment, the plate thickness of the front section 151 and the rear section 152 of the upper plate 11 are different, and the plate thickness of the front section 151 and the rear section 152 of the upper plate 11 (or the lower plate 12) (such as 0.15mm) is greater than the plate thickness of the middle section 153 (such as 0.09mm), and the plate thickness of the front section 151, the rear section 152 and the middle section 153 of the lower plate 12 (or the upper plate 11) are all the same, so the middle section 153 of the lower plate 12 does not form a floating flexure section, and the floating flexure section is only formed by the plate thickness of the middle section 153 of the upper plate 11 being thinner than the respective front section 151 and the rear section 152, so that the floating heat dissipation unit 1 can have a unilateral slight floating adjustment effect.

[0023] In some other embodiments, see Figure 1BThe middle section 153 of the upper plate 11 (or the lower plate 12) is provided with a reinforcing rib 1531, and the reinforcing rib 1531 respectively connects the front section 151 and the middle section 153, or connects the middle section 153 and the rear section 152, or connects the front section 151 and extends through the middle section 153 to the rear section 152. The reinforcing rib 1531 is used to enhance the structural strength of the middle section 153 and also has a supporting function. In this alternative implementation, a free end of the reinforcing rib 1531 is not connected to the rear section 152 and a gap 1532 is defined between them. The gap 1532 is used to provide space for the middle section 153 to slightly float and adjust the height difference.

[0024] In addition, the lower plate 12 and the upper plate 11 jointly define a chamber 13 for gas-liquid phase change, the chamber 13 is filled with a working fluid (such as pure water), and a capillary structure 18 is provided in the chamber 13. The capillary structure 18 can be a sintered powder body, a groove, a grid body, a fiber, a strip body or any combination of the foregoing. The capillary structure 18 can be selectively formed on the inner side of the lower plate 12 or the upper and lower plates 11, 12, and the outer side of the front section 151 of the lower plate 12 is in contact with a heat source. The floating heat dissipation unit 1 is a flat heat pipe having a chamber 13 in which an evaporation zone 131, a transmission zone 132 and a condensation zone 133 are sequentially divided. The evaporation zone 131 and the condensation zone 133 are respectively located at the front section 151 and the rear section 152 of the floating heat dissipation unit 1. The transmission zone 132 is located at the middle section 153 of the floating heat dissipation unit 1 and is also located between the evaporation zone 131 and the condensation zone 133.

[0025] Furthermore, in the actual implementation of the present invention, the floating heat dissipation unit 1 can be assembled with heat dissipation units of different or same types on a motherboard in an electronic device (not shown) with multiple heat sources (such as a central processing unit and a graphic display), and when there is a need to adjust the height difference between the front section 151 and the rear section 152 of the floating heat dissipation unit 1 during assembly, the floating flexure section (i.e., the middle section 153) can be flexed or bent up, down, left, or right to adjust the height difference between the front section 151 and the rear section 152 in a floating manner, so as to effectively reduce the bridging force of the front section 151 and the rear section 152 of each floating heat dissipation unit 1 due to the different heights, thereby avoiding the problem of structural deformation of the floating heat dissipation unit 1. In addition, by virtue of the floating flexure section having a floating function, each floating heat dissipation unit 1 of the present invention can be adjusted in a floating manner, and can be applied to heat dissipation units of various types and with different height holes.

[0026] Therefore, through the design of the floating heat dissipation unit 1 of the present invention, the floating heat dissipation unit 1 can be provided with the function of floatingly adjusting the height difference when connected, and avoid the existing heat pipe from being squeezed inward or pulled outward due to the bridging force generated when connected with a high ground difference, causing structural deformation, thereby causing the heat transfer and heat dissipation efficiency of the heat pipe to be poor, or even failure.

[0027] In addition, the present invention can also be used in heating elements (such as single chips or other heating electronic elements) with different height differences on the motherboards of various electronic devices (such as servers, computers or communication chassis), so that the height difference generated by assembling the two ends of the floating heat dissipation unit 1 (i.e., the front section 151 and the rear section 152) on the corresponding heating elements and the heat sink can be adjusted by floating through the floating flexure section (i.e., the middle section 153) of the present invention to effectively allow the two ends of the floating heat dissipation unit 1 to be respectively connected to the corresponding heat source and different or same type of heat dissipation units.

[0028] In an alternative embodiment, the upper plate 11 and the lower plate 12 of the floating heat dissipation unit 1 are each composed of a front section 151, a middle section 153 and a rear section 152 (such as a front section plate, a middle section plate and a rear section plate), and the plate thickness of the front section plate and the rear section plate of the upper plate 11 is greater than the plate thickness of the middle section plate of the upper plate 11, and the plate thickness of the front section plate and the rear section plate of the lower plate 12 is greater than the plate thickness of the middle section plate of the lower plate 12.

Claims

1. A floating heat dissipation unit, characterized in that: include: Once on the board; and A lower plate, covering the upper plate and defining a chamber together, the chamber is filled with a working fluid, the upper plate and the lower plate each have a front section, a rear section and a middle section located between the front section and the rear section, the plate thickness of the front section and the rear section of the upper plate and / or the lower plate is greater than the plate thickness of the middle section, so that the middle section forms a floating flexure section and can be floated and adjusted, and the floating flexure section is floated and adjusted in a manner of upward, downward or leftward or rightward flexure or bending to adjust the height difference between the front section and the rear section; A capillary structure is provided in the chamber, and the capillary structure is formed on the inner side of the lower plate or the upper plate and the lower plate. The capillary structure is a sintered powder body, a groove, a grid body, a fiber, a strip body or any combination of the foregoing, and the floating heat dissipation unit is a temperature equalizing plate or a hot plate or a flat heat pipe. When the floating heat dissipation unit is a flat heat pipe, the chamber of the flat heat pipe is sequentially divided into an evaporation zone, a transmission zone and a condensation zone. The evaporation zone and the condensation zone are respectively located at the front section and the rear section of the floating heat dissipation unit, and the transmission zone is located in the middle section of the floating heat dissipation unit, and is also located between the evaporation zone and the condensation zone.

2. The floating heat dissipation unit according to claim 1, characterized in that: The plate thickness of the front section and the rear section is greater than or equal to 0.5 mm, and the plate thickness of the upper plate or the lower plate located at the middle section is equal to 0.08 mm and less than 0.5 mm.

3. The floating heat dissipation unit according to claim 1, characterized in that: The middle section is provided with a reinforcing rib, which connects the front section and the middle section, or the middle section and the rear section, or the reinforcing rib connects the front section and extends through the middle section to the rear section, and the plate thickness of the front section and the rear section are the same or different.

4. The floating heat dissipation unit according to claim 1, characterized in that: The upper plate is composed of a front plate body, a middle plate body and a rear plate body, and the plate thickness of the front plate body and the rear plate body is greater than the plate thickness of the middle plate body.

5. The floating heat dissipation unit according to claim 4, characterized in that: The lower plate is composed of a front plate body, a middle plate body and a rear plate body. The plate thickness of the front plate body and the rear plate body of the lower plate is greater than the plate thickness of the middle plate body of the lower plate.

6. The floating heat dissipation unit according to claim 1, characterized in that: The upper plate and the lower plate are made of metal material, and the metal material is aluminum material, copper material, titanium material or alloy material.

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