Laser processing equipment for ceramic substrates for circuit boards

By designing a laser processing equipment including positioning push rods, vacuum bosses and height sensors, the problems of low automation and inaccurate positioning of the market equipment are solved, and efficient and stable laser processing of ceramic substrates is achieved.

CN113210841BActive Publication Date: 2025-03-21DONGGUAN DALI LASER TECH CO LTD
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Patent Information

Application Number
CN202110627664.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-06-05
Publication Date
2025-03-21
Estimated Expiration
2041-06-05

AI Technical Summary

Technical Problem

The laser processing equipment on the market has low automation, requiring more manpower, reducing efficiency; and inaccurate positioning, the ceramic substrate is prone to position deviation due to vibration, affecting the processing quality.

Method used

A laser processing equipment including a body, a control panel, a positioning mechanism, a loading and unloading mechanism, an X-axis assembly, a Y-axis assembly, a Z-axis assembly, a vision detector and a laser generator are designed. Through the coordination of the positioning push rod and the vacuum boss, the accurate positioning and stable fixation of the ceramic substrate is achieved; the height sensor and optical fiber components are used to ensure the stability and accuracy of the loading and unloading process.

Benefits of technology

The degree of automation of laser processing equipment is improved, manpower intervention is reduced, and processing efficiency and quality is improved. Through vacuum fixation and the use of height sensors, the problem of position deviation of ceramic substrates is avoided, ensuring the stability and accuracy of processing.

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Patent Text Reader

Abstract

The present invention proposes a laser processing device for a ceramic substrate for a circuit board. By setting the two ends of a positioning push rod to respectively abut against the first forward push assembly and the second forward push assembly, the positioning push rod can push the ceramic substrate smoothly into the predetermined position of the fixture plate in one step under the push of the positioning cylinder, thereby eliminating unnecessary steps. By setting a vacuum boss, the ceramic substrate can be tightly attached to the fixture plate under the action of the air pressure difference, thereby avoiding the position displacement of the ceramic substrate due to vibration. By setting the first optical fiber assembly and the second optical fiber assembly to be aligned at the same height, the loading height and unloading height of the loading and unloading assemblies can be ensured to be consistent, thereby ensuring the stability of the loading and unloading process. By setting a height sensor, it is possible to accurately detect whether the ceramic substrates placed at the processing station are overlapping or tilted, and issue an alarm in time to remind the staff to clear the obstacles and ensure the normal processing.
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Description

Technical Field

[0001] The present invention relates to the technical field of ceramic substrate processing, and in particular to a laser processing device for a ceramic substrate used in a circuit board. Background Art

[0002] Ceramic substrate refers to a composite substrate formed by directly bonding copper foil to the surface of a ceramic substrate at high temperature. Ceramic substrates have the characteristics of good insulation performance, high thermal conductivity, strong current carrying capacity and high adhesion strength, and can be etched into various patterns according to actual needs. Therefore, ceramic substrates are widely used in various industries, including the communications industry, home appliance industry, computer industry and electronic component industry.

[0003] Laser processing refers to cutting, welding, surface treatment or drilling of processed materials by using the characteristics of the interaction between laser beam and matter. Laser processing has the characteristics of high efficiency, good quality, no pollution and high accuracy. Therefore, laser processing is widely used in automobile, electronics, electrical appliances, aviation, metallurgy, machinery manufacturing and other industries.

[0004] Since ceramic substrates are thin and light and fragile, laser equipment is usually used to process ceramics. However, the laser processing equipment on the market has a low degree of automation and requires a lot of manpower, which reduces the efficiency of laser processing. In addition, the positioning of laser processing equipment on the market is inaccurate, and the ceramic substrate is prone to positional displacement due to vibration during processing, thus affecting the quality of laser processing. Summary of the invention

[0005] Based on this, an embodiment of the present invention provides a laser processing device for ceramic substrates for circuit boards, aiming to solve the problem that the laser processing equipment on the market has a low degree of automation and requires a lot of manpower, which reduces the efficiency of laser processing; moreover, the laser processing equipment on the market has inaccurate positioning, and the ceramic substrate is prone to position displacement due to vibration during the processing, thereby affecting the quality of laser processing.

[0006] To achieve the above objectives, on the one hand, the embodiments of the present invention propose the following technical solutions:

[0007] A laser processing device for a ceramic substrate for a circuit board, used for processing the ceramic substrate, comprises a machine body, a control panel, a positioning mechanism, a loading and unloading mechanism, an X-axis assembly, a Y-axis assembly, a Z-axis assembly, a visual detector and a laser generator; the machine body comprises a machine base and a casing arranged on the machine base; the control panel is arranged on the outside of the casing; the loading and unloading mechanism, the X-axis assembly and the Z-axis assembly are all arranged on the top of the machine base; the Y-axis assembly is arranged on the X-axis assembly; the positioning mechanism is arranged on the Y-axis assembly; the visual detector and the laser generator are arranged adjacent to each other on the Z-axis assembly;

[0008] The X-axis assembly, the Y-axis assembly, the positioning mechanism and the Z-axis assembly are arranged from bottom to top; the loading and unloading mechanism is arranged on one side of the Y-axis assembly; the visual detector and the laser generator are both arranged opposite to the positioning mechanism; the positioning mechanism, the loading and unloading mechanism, the X-axis assembly, the Y-axis assembly, the Z-axis assembly, the visual detector and the laser generator are all communicatively connected with the control panel.

[0009] In the present invention, the control panel controls the positioning mechanism, the loading and unloading mechanism, the X-axis assembly, the Y-axis assembly, the Z-axis assembly, the visual detector and the laser generator to cooperate with each other to complete the processing of the ceramic substrate. First, the loading and unloading mechanism places the ceramic substrate to be processed on the positioning mechanism, and then the positioning mechanism fixes the ceramic substrate to be processed; at this time, the positioning mechanism is in the initial position; through the linkage between the X-axis assembly, the Y-axis assembly and the Z-axis assembly, the ceramic substrate to be processed is transported to the processing station, at which time the visual detector detects the ceramic substrate, and the laser generator starts to perform laser processing on the ceramic substrate to be processed; after the processing is completed, the positioning mechanism is transported back to the initial station through the linkage between the X-axis assembly, the Y-axis assembly and the Z-axis assembly; finally, the loading and unloading mechanism unloads and temporarily stores the processed ceramic substrate.

[0010] Further, the positioning mechanism includes a positioning substrate, a vacuum boss, a jig plate, a positioning cylinder assembly, a first forward pushing assembly and a second forward pushing assembly; the positioning substrate is arranged on the Y-axis assembly; the vacuum boss, the positioning cylinder assembly, the first forward pushing assembly and the second forward pushing assembly are all arranged on the positioning substrate; the jig plate is arranged on the top of the vacuum boss; the first forward pushing assembly and the second forward pushing assembly are respectively arranged on the adjacent two sides of the vacuum boss; one end of the first forward pushing assembly is arranged opposite to the first side surface of the jig plate, and the other end is arranged against the output end of the positioning cylinder assembly; one end of the second forward pushing assembly is arranged opposite to the second side surface of the jig plate, and the other end is arranged against the output end of the positioning cylinder assembly.

[0011] Furthermore, the positioning cylinder assembly includes a cylinder fixing plate, a positioning cylinder, a cylinder connecting plate, a positioning push rod and a cylinder protective cover; the cylinder fixing plate is arranged on the positioning base plate; the positioning cylinder is arranged on the cylinder fixing plate; one end of the cylinder connecting plate is connected to the output end of the positioning cylinder, and the other end is connected to the positioning push rod; one end of the positioning push rod is vertically abutted against the first forward push assembly, and the other end is vertically abutted against the second forward push assembly; the cylinder protective cover is arranged on the cylinder fixing plate after covering the positioning cylinder.

[0012] Furthermore, the positioning push rod includes a first connection part, a second connection part and a third connection part which are connected in sequence; the angle formed between the first connection part and the second connection part is equal to the angle formed between the third connection part and the second connection part; the first connection part is perpendicularly against the first forward push component; the second connection part is connected to the cylinder connection plate; the third connection part is perpendicularly against the second forward push component. In the present invention, the second connection part is arranged perpendicularly to the movement direction of the positioning cylinder, so as to ensure that under the push of the positioning cylinder, the distance that the first connection part pushes the first forward push component is equal to the distance that the third connection part pushes the second forward push component, so that the first forward push component and the second forward push component can move synchronously, thereby pushing the ceramic substrate to a predetermined position quickly and accurately.

[0013] Furthermore, the first forward pushing assembly includes a first bracket, a first cylinder, a first pushing block, a first bearing, a first spring, a first retaining spring, a first protective shell and a first sliding pin; the first bracket is arranged on the positioning substrate; one end of the first cylinder is connected to the first pushing block through the first sliding pin, and the other end passes through the first spring and the first retaining spring in sequence; the first bearing is arranged at an end of the first cylinder away from the first pushing block; the first bearing is arranged tangentially to the side of the first connecting part; one end of the first spring is abutted against a side of the first bracket close to the first bearing, and the other end is abutted against the first retaining spring; the first protective shell is arranged on the first bracket after covering the first pushing block; a second spring is also arranged between the first cylinder and the first pushing block.

[0014] Further, the first cylinder is provided with a first sliding through hole and a first mounting hole for mounting the first pushing block at one end close to the first pushing block; the first cylinder is provided with a first journal for mounting the first retaining spring, a first step for limiting, and a second step for mounting the first bearing at one end away from the first pushing block;

[0015] A first connecting hole is arranged at one end of the first push block close to the first cylinder; and the first sliding pin passes through the first connecting hole and is slidably arranged on the first sliding through hole.

[0016] Furthermore, the second forward pushing assembly includes a second bracket, a second cylinder, a second pushing block, a second bearing, a third spring, a second retaining spring and a second protective shell; the second bracket is arranged on the positioning substrate; one end of the second cylinder is connected to the second pushing block, and the other end passes through the third spring and the second retaining spring in sequence; the second bearing is arranged at an end of the second cylinder away from the second pushing block; the second bearing is arranged tangentially to the side of the third connecting part; one end of the third spring is abutted against a side of the second bracket close to the second bearing, and the other end is abutted against the second retaining spring; the second protective shell is arranged on the second bracket after covering the second pushing block; a fourth spring is also arranged between the second cylinder and the second pushing block.

[0017] Further, the second cylinder is provided with a second sliding through hole and a second mounting hole for mounting the second pushing block at one end close to the second pushing block; the second cylinder is provided with a second journal for mounting the second retaining spring, a third step for limiting, and a fourth step for mounting the second bearing at one end away from the second pushing block;

[0018] A second connecting hole is arranged at one end of the second push block close to the second cylinder; and the second sliding pin passes through the second connecting hole and is slidably arranged on the second sliding through hole.

[0019] Furthermore, a third through hole and a plurality of positioning columns are provided at the geometric center of the jig plate; the positioning columns are provided at right angles along two adjacent sides of the third through hole; the jig plate is also provided with a first guide groove and a second guide groove which are independent of each other; the first guide groove is adapted to the first push block; and the second guide groove is adapted to the second push block.

[0020] Furthermore, the vacuum boss includes a vacuum support and a sliding block detachably arranged at the bottom of the vacuum support; the sliding block is provided with a recess; the recess is used to receive and promptly remove waste generated during the processing of the ceramic substrate.

[0021] Furthermore, a fourth through hole connected to the third through hole is provided on the top of the vacuum support; a fifth through hole connected to the vacuum generating device is provided on the side of the vacuum support. Under the action of the vacuum generating device, the inner cavity of the vacuum boss forms a vacuum. Since the external air pressure is greater than the internal air pressure of the vacuum boss, under the action of the external air pressure, the ceramic substrate can be firmly attached to the jig plate, which is beneficial to the further processing of the ceramic substrate.

[0022] Further, the loading and unloading mechanism comprises a convex substrate, a loading and unloading assembly, and a first material rack assembly and a second material rack assembly arranged at both ends of the convex substrate; the convex substrate is arranged on the top of the machine base; the loading and unloading assembly is arranged in the middle of the convex substrate; a material stop assembly is also arranged on the side of the first material rack assembly;

[0023] The first rack assembly includes a first KK module, a first supporting assembly, a first frame, and a first optical fiber assembly arranged on the top of the first frame; the first KK module is arranged at one end of the convex substrate away from the second rack assembly; the output end of the first KK module is connected to the first supporting assembly; the first frame is arranged on the top of the first KK module;

[0024] The second rack assembly includes a second KK module, a second supporting assembly, a second frame, and a second optical fiber assembly arranged on the top of the second frame; the second KK module is arranged at one end of the convex substrate away from the first rack assembly; the output end of the second KK module is connected to the second supporting assembly; the second frame is arranged on the top of the second KK module;

[0025] The first optical fiber component and the second optical fiber component are arranged at the same height.

[0026] Furthermore, the loading and unloading assembly includes a rotating cylinder, a lifting cylinder, a right-angle plate, a height sensor, a first suction cup assembly and a second suction cup assembly; the rotating cylinder is arranged in the middle of the convex substrate; the output end of the rotating cylinder is connected to the lifting cylinder; the output end of the lifting cylinder is connected to the right-angle plate; one end of the right-angle plate is connected to the first suction cup assembly, and the other end is connected to the second suction cup assembly; the height sensor is arranged at one end of the right-angle plate close to the first suction cup assembly.

[0027] Further, the first suction cup assembly includes a first suction cup bracket and a plurality of first suction nozzles arranged on the first suction cup bracket; the first suction cup bracket is arranged at one end of the right-angle plate away from the second suction cup assembly;

[0028] The second suction cup assembly includes a second suction cup bracket and a plurality of second suction nozzles arranged on the second suction cup bracket; the second suction cup bracket is arranged at one end of the right-angle plate away from the first suction cup assembly.

[0029] In the present invention, the single rotation angle of the rotary cylinder is preset to 90 degrees, so as to cooperate with the rotation of the right-angle plate to drive the first suction cup assembly and the second suction cup assembly to load and unload materials.

[0030] Before the loading and unloading mechanism is turned on, the first suction cup assembly is in the initial position (when the first suction cup assembly is directly above the first supporting assembly), and the second suction cup assembly is in the initial position; when the Y-axis assembly transfers the positioning mechanism to directly below the second suction cup assembly, the loading and unloading assembly starts to work; at this time, the first suction cup assembly absorbs the unprocessed ceramic substrate on the first supporting assembly, and the second suction cup assembly absorbs the processed ceramic substrate on the positioning mechanism, and then the lifting cylinder moves to drive the right-angle plate to rise; when the lifting cylinder moves to the maximum displacement The rotary cylinder rotates 90 degrees counterclockwise, and then the lifting cylinder resets; at this time, the first suction cup assembly places the unprocessed ceramic substrate on the processing station, and the second suction cup assembly places the processed ceramic substrate on the second supporting assembly; then the height sensor detects the thickness of the ceramic substrate placed on the processing station to prevent the ceramic substrates from overlapping or tilted, so as to ensure the normal processing; when the height sensor detection is completed, the lifting cylinder drives the right-angle plate to rise again, and then the rotary cylinder resets, the lifting cylinder resets, and each component returns to its initial position.

[0031] Further, the first frame includes a first plate, a first column, a second column and a third column; the first plate is arranged on the top of the first KK module; the first column is arranged on the first corner of the first plate; the second column is arranged on the second corner of the first plate; the third column is arranged on the third corner of the first plate;

[0032] The second frame includes a second plate, a fourth column and a fifth column; the second plate is arranged on the top of the second KK module; the fourth column is arranged on the first corner of the second plate; the fifth column is arranged on the second corner of the second plate;

[0033] The first column, the second column, the third column, the fourth column and the fifth column are arranged with the same length.

[0034] In the present invention, the first column, the second column and the third column cooperate to play a limiting role, which is convenient for manual placement of the ceramic substrate and the first suction cup assembly to grab the unprocessed ceramic substrate; the fourth column and the fifth column cooperate to play a limiting role, which is convenient for the second suction cup assembly to place the processed ceramic substrate; the first column, the second column, the third column, the fourth column and the fifth column can adopt aluminum columns with right angles to further enhance the limiting effect on the ceramic substrate, so as to improve the accuracy of the loading and unloading assembly in grabbing and placing the ceramic substrate.

[0035] Furthermore, the first optical fiber assembly includes a first grating and a second grating arranged opposite to the first grating; the first grating is arranged on the top of the first column; and the second grating is arranged on the top of the second column.

[0036] In the present invention, a first light path is formed between the first grating and the second grating; when the first suction cup assembly takes away the unprocessed ceramic substrate placed on the first supporting assembly, the first light path is opened. At this time, the first KK module drives the first supporting assembly to rise until the ceramic substrate blocks the first light path again, thereby realizing the automatic rise of the ceramic substrate and facilitating the loading and unloading assembly to take the material.

[0037] Furthermore, the second optical fiber assembly includes a third grating and a fourth grating arranged opposite to the third grating; the third grating is arranged on the top of the fourth column; and the fourth grating is arranged on the top of the fifth column.

[0038] In the present invention, a second optical path is formed between the third grating and the fourth grating; when the second suction cup assembly places the processed ceramic substrate on the second supporting assembly, the second optical path is disconnected. At this time, the second KK module drives the second supporting assembly to descend until the second optical path is open again, so that the second suction cup assembly can stack the processed ceramic substrates layer by layer and temporarily store them on the second supporting assembly.

[0039] Furthermore, the material blocking assembly includes a material blocking fixing plate, a material blocking bearing, and a blocking bar detachably arranged on the material blocking fixing plate; the material blocking fixing plate is arranged on the side of the third column; the material blocking bearing is arranged at one end of the blocking bar away from the material blocking fixing plate. One end of the blocking bar is fixed to the material blocking fixing plate by a screw, and the direction of the blocking bar can be manually adjusted to better play a limiting role, thereby preventing the first suction cup assembly from moving out of position when grasping the ceramic substrate. At the same time, the material blocking bearing can also prevent the first suction cup assembly from being damaged or broken during the process of grasping the ceramic substrate.

[0040] Furthermore, the first supporting assembly includes a first connecting plate and a first supporting plate; one end of the first connecting plate is connected to the output end of the first KK module, and the other end passes through the first flat plate and is connected to the first supporting plate.

[0041] Furthermore, the second supporting assembly includes a second connecting plate and a second supporting plate; one end of the second connecting plate is connected to the output end of the second KK module, and the other end passes through the second flat plate and is connected to the second supporting plate.

[0042] Furthermore, the Y-axis assembly includes a Y-axis base and a Y-axis moving component; the Y-axis base is arranged on the X-axis assembly; one end of the Y-axis moving component is arranged on the Y-axis base, and the other end is connected to the positioning mechanism.

[0043] Furthermore, the X-axis assembly includes an X-axis base and an X-axis moving component; the X-axis base is arranged on the top of the base; one end of the X-axis moving component is arranged on the X-axis base, and the other end is connected to the Y-axis base.

[0044] Furthermore, the Z-axis assembly includes a Z-axis base, a Z-axis electric cylinder and a Z-axis connecting plate; the Z-axis base is arranged on the top of the machine base; the Z-axis electric cylinder is arranged on the Z-axis base; one side of the Z-axis connecting plate is connected to the output end of the Z-axis electric cylinder, and the other end is connected to the laser generator.

[0045] In the present invention, in order to ensure accurate positioning and processing of the ceramic substrate, the Y-axis moving component and the X-axis moving component are both controlled by linear motors.

[0046] The present invention proposes a laser processing device for a ceramic substrate for a circuit board. By setting the two ends of a positioning push rod to respectively abut against the first forward push assembly and the second forward push assembly, the positioning push rod can push the ceramic substrate smoothly into the predetermined position of the fixture plate in one step under the push of the positioning cylinder, thereby eliminating unnecessary steps. By setting a vacuum boss, the ceramic substrate can be tightly attached to the fixture plate under the action of the air pressure difference, thereby avoiding the position displacement of the ceramic substrate due to vibration. By setting the first optical fiber assembly and the second optical fiber assembly to be aligned at the same height, the loading height and unloading height of the loading and unloading assemblies can be ensured to be consistent, thereby ensuring the stability of the loading and unloading process. By setting a height sensor, it is possible to accurately detect whether the ceramic substrates placed at the processing station are overlapping or tilted, and issue an alarm in time to remind the staff to clear the obstacles and ensure normal processing. The present invention has a high degree of automation and strong practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0048] Figure 1 A schematic diagram of the three-dimensional structure of a laser processing device for a ceramic substrate for a circuit board according to an embodiment of the present invention;

[0049] Figure 2 for Figure 1 Schematic diagram of the three-dimensional structure after removing the outer shell;

[0050] Figure 3 for Figure 2 Schematic diagram of the three-dimensional structure of the positioning mechanism;

[0051] Figure 4 for Figure 3 A schematic diagram of the three-dimensional structure of the positioning cylinder assembly;

[0052] Figure 5 for Figure 4 Schematic diagram of the three-dimensional structure of the positioning push rod;

[0053] Figure 6 for Figure 3 An exploded view of the first forward push assembly;

[0054] Figure 7 for Figure 6 The first cylindrical stereoscopic structure diagram in FIG.

[0055] Figure 8 for Figure 3 A partial exploded view of

[0056] Fig. 9 for Figure 2 Schematic diagram of the three-dimensional structure of the loading and unloading mechanism;

[0057] Fig.10 for Fig. 9 A schematic diagram of the three-dimensional structure of the first rack assembly;

[0058] Fig.11 for Fig. 9 A schematic diagram of the three-dimensional structure of the second rack assembly;

[0059] Fig.12 for Fig. 9 Schematic diagram of the three-dimensional structure of the loading and unloading components;

[0060] Fig.13 for Figure 2 Schematic diagram of the three-dimensional structure after removing the loading and unloading components.

[0061] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0062] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0063] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, top, bottom...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0064] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0065] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0066] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0067] At present, the laser processing equipment on the market has a low degree of automation and requires a lot of manpower, which reduces the efficiency of laser processing. In addition, the positioning of the laser processing equipment on the market is inaccurate, and the ceramic substrate is easily offset due to vibration during the processing, thereby affecting the quality of laser processing. In order to solve the above technical problems, the present invention proposes a laser processing equipment for ceramic substrates for circuit boards.

[0068] like Figure 1 to Figure 2As shown, a laser processing device for a ceramic substrate A for a circuit board proposed in an embodiment of the present invention is used for processing the ceramic substrate A, and includes a body 1, a control panel 2, a positioning mechanism 3, a loading and unloading mechanism 4, an X-axis assembly 5, a Y-axis assembly 6, a Z-axis assembly 7, a visual detector 8 and a laser generator 9; the body includes a base 11, and a housing 12 arranged on the base 11; the control panel 2 is arranged on the outside of the housing 12; the loading and unloading mechanism 4, the X-axis assembly 5 and the Z-axis assembly 7 are all arranged on the top of the base 11; the Y-axis assembly 6 is arranged on the X-axis assembly 5; the positioning mechanism 3 is arranged on the Y-axis assembly 6; the visual detector 8 and the laser generator 9 are adjacently arranged on the Z-axis assembly 7;

[0069] The X-axis assembly 5, the Y-axis assembly 6, the positioning mechanism 3 and the Z-axis assembly 7 are arranged from bottom to top; the loading and unloading mechanism 4 is arranged on one side of the Y-axis assembly 6; the visual detector 8 and the laser generator 9 are both arranged opposite to the positioning mechanism 3; the positioning mechanism 3, the loading and unloading mechanism 4, the X-axis assembly 5, the Y-axis assembly 6, the Z-axis assembly 7, the visual detector 8 and the laser generator 9 are all communicatively connected with the control panel 2.

[0070] In the embodiment of the present application, the control panel 2 controls the positioning mechanism 3, the loading and unloading mechanism 4, the X-axis assembly 5, the Y-axis assembly 6, the Z-axis assembly 7, the visual detector 8 and the laser generator 9 to cooperate with each other to complete the processing of the ceramic substrate A. First, the loading and unloading mechanism 4 places the ceramic substrate A to be processed on the positioning mechanism 3, and then the positioning mechanism 3 fixes the ceramic substrate A to be processed; at this time, the positioning mechanism 3 is in the initial position; through the linkage between the X-axis assembly 5, the Y-axis assembly 6 and the Z-axis assembly 7, the ceramic substrate A to be processed is transported to the processing station, at this time, the visual detector 8 detects the ceramic substrate A, and the laser generator 9 starts to perform laser processing on the ceramic substrate A to be processed; after the processing is completed, the positioning mechanism 3 is transported back to the initial station through the linkage between the X-axis assembly 5, the Y-axis assembly 6 and the Z-axis assembly 7 again; finally, the loading and unloading mechanism 4 unloads and temporarily stores the processed ceramic substrate A.

[0071] Reference Figure 3In the embodiment of the present application, the positioning mechanism 3 includes a positioning substrate 31, a vacuum boss 32, a fixture plate 33, a positioning cylinder assembly 34, a first forward push assembly 35 and a second forward push assembly 36; the positioning substrate 31 is arranged on the Y-axis assembly 6; the vacuum boss 32, the positioning cylinder assembly 34, the first forward push assembly 35 and the second forward push assembly 36 are all arranged on the positioning substrate 31; the fixture plate 33 is arranged on the top of the vacuum boss 32; the first forward push assembly 35 and the second forward push assembly 36 are respectively arranged on the adjacent two sides of the vacuum boss 32; one end of the first forward push assembly 35 is arranged opposite to the first side surface of the fixture plate 33, and the other end is arranged against the output end of the positioning cylinder assembly 34; one end of the second forward push assembly 36 is arranged opposite to the second side surface of the fixture plate 33, and the other end is arranged against the output end of the positioning cylinder assembly 34.

[0072] Reference Figure 4 In the embodiment of the present application, the positioning cylinder assembly 34 includes a cylinder fixing plate 341, a positioning cylinder 342, a cylinder connecting plate 343, a positioning push rod 344 and a cylinder protective cover 345; the cylinder fixing plate 341 is arranged on the positioning base plate 31; the positioning cylinder 342 is arranged on the cylinder fixing plate 341; one end of the cylinder connecting plate 343 is connected to the output end of the positioning cylinder 342, and the other end is connected to the positioning push rod 344; one end of the positioning push rod 344 is vertically abutted against the first forward push assembly 35, and the other end is vertically abutted against the second forward push assembly 36; the cylinder protective cover 345 is arranged on the cylinder fixing plate 341 after covering the positioning cylinder 342.

[0073] Reference Figure 5 In the embodiment of the present application, the positioning push rod 344 includes a first connection part 3441, a second connection part 3442 and a third connection part 3443 which are connected in sequence; the angle formed between the first connection part 3441 and the second connection part 3442 is equal to the angle formed between the third connection part 3443 and the second connection part 3442; the first connection part 3441 is perpendicularly against the first forward push component 35; the second connection part 3442 is connected to the cylinder connecting plate 343; the third connection part 3443 is perpendicularly against the second forward push component 36. In the embodiment of the present application, the second connection part 3442 is perpendicularly arranged to the movement direction of the positioning cylinder 342, so as to ensure that under the push of the positioning cylinder 342, the distance that the first connection part 3441 pushes the first forward push component 35 is equal to the distance that the third connection part 3443 pushes the second forward push component 36, so that the first forward push component 35 and the second forward push component 36 can move synchronously, thereby pushing the ceramic substrate A to the predetermined position quickly and accurately.

[0074] Reference Figure 6 In the embodiment of the present application, the first forward push component 35 includes a first bracket 351, a first cylinder 352, a first push block 353, a first bearing 354, a first spring 355, a first retaining spring 356, a first protective shell 357 and a first sliding pin 358; the first bracket 351 is arranged on the positioning substrate 31; one end of the first cylinder 352 is connected to the first push block 353 through the first sliding pin 358, and the other end passes through the first spring 355 and the first retaining spring 356 in sequence; the first bearing 354 is arranged at the end of the first cylinder 352 away from the first push block 353; the first bearing 354 is arranged tangentially to the side of the first connecting portion 3441; one end of the first spring 355 is against the side of the first bracket 351 close to the first bearing 354, and the other end is against the first retaining spring 356; the first protective shell 357 is arranged on the first bracket 351 after covering the first push block 353; a second spring 359 is also arranged between the first cylinder 352 and the first push block 353.

[0075] Reference Figure 7 In the embodiment of the present application, a first sliding through hole 3521 and a first mounting hole 3522 for mounting the first pushing block 353 are provided at one end of the first cylinder 352 close to the first pushing block 353; a first journal 3523 for mounting the first retaining spring 353, a first step 3524 for limiting, and a second step 3525 for mounting the first bearing 354 are provided at one end of the first cylinder 352 away from the first pushing block 353;

[0076] A first connecting hole 3531 is provided at one end of the first pushing block 353 close to the first cylinder 352 ; the first sliding pin 358 passes through the first connecting hole 3531 and is slidably disposed on the first sliding through hole 3521 .

[0077] In the embodiment of the present application, the first step 3524 serves as a limit to prevent the positioning push rod 344 from jumping in the vertical direction, thereby ensuring the stability of the first cylinder 352 when being pushed forward.

[0078] In the embodiment of the present application, the second forward pushing component 36 and the first forward pushing component 35 have the same structure, and the second forward pushing component 36 includes a second bracket, a second cylinder, a second pushing block, a second bearing, a third spring, a second retaining spring, a second protective shell and a second sliding pin; the second bracket is arranged on the positioning substrate; one end of the second cylinder is connected to the second pushing block through the second sliding pin, and the other end passes through the third spring and the second retaining spring in sequence; the second bearing is arranged at an end of the second cylinder away from the second pushing block; the second bearing is arranged tangentially to the side of the third connecting part; one end of the third spring is against the side of the second bracket close to the second bearing, and the other end is against the second retaining spring; the second protective shell is arranged on the second bracket after covering the second pushing block; a fourth spring is also arranged between the second cylinder and the second push block.

[0079] Further, the second cylinder is provided with a second sliding through hole and a second mounting hole for mounting the second pushing block at one end close to the second pushing block; the second cylinder is provided with a second journal for mounting the second retaining spring, a third step for limiting, and a fourth step for mounting the second bearing at one end away from the second pushing block;

[0080] A second connecting hole is arranged at one end of the second push block close to the second cylinder; and the second sliding pin passes through the second connecting hole and is slidably arranged on the second sliding through hole.

[0081] In the embodiment of the present application, the third step serves as a limit to prevent the positioning push rod from jumping in the vertical direction, thereby ensuring the stability of the forward pushing of the first cylinder.

[0082] Reference Figure 8 In the embodiment of the present application, a third through hole 331 and a plurality of positioning posts 332 are provided at the geometric center of the jig plate 33; the positioning posts 332 are provided at right angles along two adjacent sides of the third through hole 331; the jig plate 33 is also provided with a first guide groove 333 and a second guide groove 334 which are independent of each other; the first guide groove 333 is adapted to the first push block 353; the second guide groove 334 is adapted to the second push block.

[0083] The vacuum boss 32 includes a vacuum support 321 and a sliding block 322 detachably arranged at the bottom of the vacuum support 321 ; the sliding block 322 is provided with an inner recess 3221 ; the inner recess 3221 is used to receive and promptly remove waste generated during the processing of the ceramic substrate A.

[0084] The top of the vacuum support 321 is provided with a fourth through hole 3211 connected to the third through hole 331; the side of the vacuum support 321 is provided with a fifth through hole 3212 connected to the vacuum generating device. Under the action of the vacuum generating device, the inner cavity of the vacuum boss 321 forms a vacuum. Since the external air pressure is greater than the internal air pressure of the vacuum boss, under the action of the external air pressure, the ceramic substrate A can be firmly attached to the fixture plate 33, which is conducive to the further processing of the ceramic substrate A.

[0085] Reference Figures 9 to 11 In the embodiment of the present application, the loading and unloading mechanism 4 includes a convex substrate 41, a loading and unloading assembly 42, and a first material rack assembly 43 and a second material rack assembly 44 arranged at both ends of the convex substrate 41; the convex substrate 41 is arranged on the top of the machine base 11; the loading and unloading assembly 42 is arranged in the middle of the convex substrate 41; a material stop assembly 45 is also arranged on the side of the first material rack assembly 43;

[0086] The first rack assembly 43 includes a first KK module 431, a first supporting assembly 432, a first frame 433, and a first optical fiber assembly 434 arranged on the top of the first frame 433; the first KK module 431 is arranged at one end of the convex substrate 41 away from the second rack assembly 44; the output end of the first KK module 431 is connected to the first supporting assembly 432; the first frame 433 is arranged on the top of the first KK module 431;

[0087] The second rack assembly 44 includes a second KK module 441, a second supporting assembly 442, a second frame 443, and a second optical fiber assembly 444 arranged on the top of the second frame 443; the second KK module 441 is arranged at an end of the convex substrate 41 away from the first rack assembly 43; the output end of the second KK module 431 is connected to the second supporting assembly 442; the second frame 443 is arranged on the top of the second KK module 441;

[0088] The first optical fiber component 434 and the second optical fiber component 444 are arranged at the same height.

[0089] Reference Fig.12In the embodiment of the present application, the loading and unloading assembly 42 includes a rotating cylinder 421, a lifting cylinder 422, a right-angle plate 423, a height sensor 424, a first suction cup assembly 425 and a second suction cup assembly 426; the rotating cylinder 421 is arranged in the middle of the convex substrate 41; the output end of the rotating cylinder 421 is connected to the lifting cylinder 422; the output end of the lifting cylinder 422 is connected to the right-angle plate 423; one end of the right-angle plate 423 is connected to the first suction cup assembly 425, and the other end is connected to the second suction cup assembly 426; the height sensor 424 is arranged at one end of the right-angle plate 423 close to the first suction cup assembly 425.

[0090] The first suction cup assembly 425 includes a first suction cup bracket 4251 and a plurality of first suction nozzles 4252 disposed on the first suction cup bracket 4251; the first suction cup bracket 4251 is disposed at one end of the right-angle plate 423 away from the second suction cup assembly 426;

[0091] The second suction cup assembly 426 includes a second suction cup bracket 4261 and a plurality of second suction nozzles 4262 disposed on the second suction cup bracket 4261 ; the second suction cup bracket 4261 is disposed at one end of the right-angle plate 423 away from the first suction cup assembly 425 .

[0092] In the embodiment of the present application, the single rotation angle of the rotary cylinder 421 is preset to 90 degrees, so as to cooperate with the rotation of the right-angle plate 423 to drive the first suction cup assembly 425 and the second suction cup assembly 426 to load and unload materials.

[0093] Before the loading and unloading mechanism 4 is turned on, the first suction cup assembly 425 is in the initial position (the first suction cup assembly 425 is directly above the first supporting assembly 432), and the second suction cup assembly 426 is in the initial position; when the Y-axis assembly 6 transfers the positioning mechanism 3 to directly below the second suction cup assembly 426, the loading and unloading assembly 42 starts to work; at this time, the first suction cup assembly 425 absorbs the unprocessed ceramic substrate A on the first supporting assembly 432, and the second suction cup assembly 426 absorbs the processed ceramic substrate A on the positioning mechanism 3, and then the lifting cylinder 422 moves to drive the right-angle plate 423 to rise; when the lifting cylinder 422 moves to the maximum During displacement, the rotating cylinder 421 rotates 90 degrees counterclockwise, and then the lifting cylinder 422 is reset; at this time, the first suction cup assembly 425 places the unprocessed ceramic substrate A on the processing station, and the second suction cup assembly 426 places the processed ceramic substrate A on the second supporting assembly 442; then the height sensor 424 detects the thickness of the ceramic substrate A placed on the processing station to prevent the ceramic substrate A from overlapping or tilting, so as to ensure the normal processing; when the height sensor 424 completes the detection, the lifting cylinder 422 drives the right-angle plate 423 to rise again, and then the rotating cylinder 421 is reset, the lifting cylinder 422 is reset, and each component returns to the initial position.

[0094] Refer again Figure 10 to Figure 11 In the embodiment of the present application, the first frame 433 includes a first plate 4331, a first column 4332, a second column 4333 and a third column 4334; the first plate 4331 is arranged on the top of the first KK module 431; the first column 4332 is arranged on the first corner of the first plate 4331; the second column 4333 is arranged on the second corner of the first plate 4331; the third column 4334 is arranged on the third corner of the first plate 4331;

[0095] The second frame 443 includes a second plate 4431, a fourth column 4432 and a fifth column 4433; the second plate 4431 is arranged on the top of the second KK module 441; the fourth column 4432 is arranged on the first corner of the second plate 4431; the fifth column 4433 is arranged on the second corner of the second plate 4431;

[0096] The first column 4331 , the second column 4332 , the third column 4333 , the fourth column 4432 , and the fifth column 4433 are arranged with the same length.

[0097] In the embodiment of the present application, the first column 4331, the second column 4332 and the third column 4333 cooperate to play a limiting role, which is convenient for manual placement of the ceramic substrate A and the first suction cup assembly 425 to grab the unprocessed ceramic substrate A; the fourth column 4432 and the fifth column 4433 cooperate to play a limiting role, which is convenient for the second suction cup assembly 426 to place the processed ceramic substrate A; the first column 4331, the second column 4332, the third column 4333, the fourth column 4432 and the fifth column 4433 can adopt aluminum columns with right angles to further enhance the limiting effect on the ceramic substrate A, so as to improve the accuracy of the loading and unloading assembly 42 in grabbing and placing the ceramic substrate A.

[0098] The first optical fiber assembly 434 includes a first grating 4341 and a second grating 4342 arranged opposite to the first grating 4341 ; the first grating 4341 is arranged on the top of the first column 4331 ; the second grating 4342 is arranged on the top of the second column 4332 .

[0099] In the embodiment of the present application, a first light path is formed between the first grating 4341 and the second grating 4342; when the first suction cup assembly 425 takes away the unprocessed ceramic substrate A placed on the first supporting assembly 432, the first light path is opened. At this time, the first KK module 431 drives the first supporting assembly 432 to rise until the ceramic substrate A blocks the first light path again, thereby realizing the automatic rise of the ceramic substrate A, which is convenient for the loading and unloading assembly 42 to take materials.

[0100] The second optical fiber assembly 444 includes a third grating 4441 and a fourth grating 4442 arranged opposite to the third grating 4441 ; the third grating 4441 is arranged on the top of the fourth column 4432 ; the fourth grating 4442 is arranged on the top of the fifth column 4433 .

[0101] In the embodiment of the present application, a second optical path is formed between the third grating 4441 and the fourth grating 4442; when the second suction cup assembly 426 places the processed ceramic substrate A on the second supporting assembly 442, the second optical path is disconnected. At this time, the second KK module 441 drives the second supporting assembly 442 to descend until the second optical path is open again, so that the second suction cup assembly 426 can stack the processed ceramic substrates A layer by layer and temporarily store them on the second supporting assembly 442.

[0102] Refer again Fig.10In the embodiment of the present application, the material blocking assembly 45 includes a material blocking fixing plate 451, a material blocking bearing 452, and a blocking bar 453 detachably arranged on the material blocking fixing plate 451; the material blocking fixing plate 451 is arranged on the side of the third column 4333; the material blocking shaft 452 is arranged on the end of the blocking bar 453 away from the material blocking fixing plate 451. One end of the blocking bar 453 is fixed to the material blocking fixing plate 451 by screws, and the direction of the blocking bar 453 can be manually adjusted to better play a limiting role, so as to prevent the first suction cup assembly 425 from moving when grabbing the ceramic substrate A. At the same time, the material blocking bearing 452 can also prevent the first suction cup assembly 425 from being damaged or broken during the process of grabbing the ceramic substrate A.

[0103] Refer again Figure 10 to Figure 11 In the embodiment of the present application, the first supporting assembly 432 includes a first connecting plate 4321 and a first supporting plate 4322; one end of the first connecting plate 4321 is connected to the output end of the first KK module 431, and the other end passes through the first flat plate 4331 and is connected to the first supporting plate 4322.

[0104] The second supporting assembly 442 includes a second connecting plate 4421 and a second supporting plate 4422 ; one end of the second connecting plate 4421 is connected to the output end of the second KK module 441 , and the other end passes through the second flat plate 4431 and is connected to the second supporting plate 4322 .

[0105] Reference Fig.13 In the embodiment of the present application, the Y-axis assembly 6 includes a Y-axis base 61 and a Y-axis moving component 62; the Y-axis base 61 is arranged on the X-axis assembly 5; one end of the Y-axis moving component 62 is arranged on the Y-axis base 61, and the other end is connected to the positioning mechanism 3.

[0106] The X-axis assembly 5 includes an X-axis base 51 and an X-axis moving component 52 ; the X-axis base 51 is disposed on the top of the base 11 ; one end of the X-axis moving component 52 is disposed on the X-axis base 51 , and the other end is connected to the Y-axis base 61 .

[0107] The Z-axis assembly 7 includes a Z-axis base 71, a Z-axis electric cylinder 72 and a Z-axis connecting plate 73; the Z-axis base 71 is arranged on the top of the machine base 11; the Z-axis electric cylinder 72 is arranged on the Z-axis base 71; one side of the Z-axis connecting plate 73 is connected to the output end of the Z-axis electric cylinder 72, and the other end is connected to the laser generator 9.

[0108] In the embodiment of the present application, in order to ensure accurate positioning and processing of the ceramic substrate A, the Y-axis moving component 62 and the X-axis moving component 52 are both controlled by linear motors.

[0109] In the embodiment of the present application, the X-axis assembly 5, the Y-axis assembly 6 and the Z-axis assembly 7 are all provided with rubber sleeves for dust prevention, which can effectively prevent dust or debris generated during the processing from entering the interior of each component, thereby ensuring the normal progress of the processing.

[0110] In an embodiment of the present application, the visual detector 8 can cooperate with the laser generator 9 to realize fixed-point processing of the ceramic substrate A; at the same time, when the machine stops due to a fault, the visual detector 8 can be used to relocate the processing position before the fault after the laser processing equipment is restarted to avoid repeated processing or missed processing.

[0111] In the embodiment of the present application, a power source, an air source, a vacuum generating device, etc. are installed inside the base 11.

[0112] The present invention proposes a laser processing device for a ceramic substrate A for a circuit board. By setting the two ends of a positioning push rod 44 to respectively abut against the first forward push assembly 35 and the second forward push assembly 36, the positioning push rod 44 can be pushed into the predetermined position of the fixture plate 33 in one step under the push of the positioning cylinder 342, thereby eliminating unnecessary steps. By setting a vacuum boss 32, the ceramic substrate A can be tightly attached to the fixture plate 33 under the action of the air pressure difference, thereby avoiding the position displacement of the ceramic substrate A due to vibration. By setting the first optical fiber assembly 434 and the second optical fiber assembly 444 to be aligned at the same height, the loading height and unloading height of the loading and unloading assembly 42 can be ensured to be consistent, thereby ensuring the stability of the loading and unloading process. By setting a height sensor 424, it is possible to accurately detect whether the ceramic substrate A placed at the processing station is overlapped or tilted, and issue an alarm in time to remind the staff to clear the obstacles and ensure the normal processing. The present invention has a high degree of automation and strong practicality.

[0113] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A laser processing device for ceramic substrates for circuit boards, used for loading and unloading ceramic substrates, characterized in that: The machine comprises a machine body, a control panel, a positioning mechanism, a loading and unloading mechanism, an X-axis assembly, a Y-axis assembly, a Z-axis assembly, a visual detector and a laser generator; the machine body comprises a machine base and a casing arranged on the machine base; the control panel is arranged on the outside of the casing; the loading and unloading mechanism, the X-axis assembly and the Z-axis assembly are all arranged on the top of the machine base; the Y-axis assembly is arranged on the X-axis assembly; the positioning mechanism is arranged on the Y-axis assembly; the visual detector and the laser generator are arranged adjacent to each other on the Z-axis assembly; The X-axis assembly, the Y-axis assembly, the positioning mechanism and the Z-axis assembly are arranged from bottom to top; the loading and unloading mechanism is arranged on one side of the Y-axis assembly; the visual detector and the laser generator are arranged opposite to the positioning mechanism; the positioning mechanism, the loading and unloading mechanism, the X-axis assembly, the Y-axis assembly, the Z-axis assembly, the visual detector and the laser generator are all connected to the control panel for communication; The positioning mechanism includes a positioning substrate, a vacuum boss, a fixture plate, a positioning cylinder assembly, a first forward push assembly and a second forward push assembly; the positioning substrate is arranged on the Y-axis assembly; the vacuum boss, the positioning cylinder assembly, the first forward push assembly and the second forward push assembly are all arranged on the positioning substrate; the fixture plate is arranged on the top of the vacuum boss; the first forward push assembly and the second forward push assembly are respectively arranged on the adjacent two sides of the vacuum boss; one end of the first forward push assembly is arranged opposite to the first side surface of the fixture plate, and the other end is arranged against the output end of the positioning cylinder assembly; one end of the second forward push assembly is arranged opposite to the second side surface of the fixture plate, and the other end is arranged against the output end of the positioning cylinder assembly; The positioning cylinder assembly comprises a cylinder fixing plate, a positioning cylinder, a cylinder connecting plate, a positioning push rod and a cylinder protective cover; the cylinder fixing plate is arranged on the positioning base plate; the positioning cylinder is arranged on the cylinder fixing plate; one end of the cylinder connecting plate is connected to the output end of the positioning cylinder, and the other end is connected to the positioning push rod; one end of the positioning push rod is vertically abutted against the first forward push assembly, and the other end is vertically abutted against the second forward push assembly; the cylinder protective cover is arranged on the cylinder fixing plate after covering the positioning cylinder; The positioning push rod includes a first connecting portion, a second connecting portion and a third connecting portion which are connected in sequence; the angle formed between the first connecting portion and the second connecting portion is equal to the angle formed between the third connecting portion and the second connecting portion; the first connecting portion is vertically abutted against the first forward push assembly; the second connecting portion is connected to the cylinder connecting plate; the third connecting portion is vertically abutted against the second forward push assembly; The first forward push assembly includes a first bracket, a first cylinder, a first push block, a first bearing, a first spring, a first retaining spring, a first protective shell and a first sliding pin; the first bracket is arranged on the positioning substrate; one end of the first cylinder is connected to the first push block through the first sliding pin, and the other end passes through the first spring and the first retaining spring in sequence; the first bearing is arranged at an end of the first cylinder away from the first push block; the first bearing is arranged tangentially to the side of the first connecting portion; one end of the first spring is against a side of the first bracket close to the first bearing, and the other end is against the first retaining spring; the first protective shell is arranged on the first bracket after covering the first push block; a second spring is also arranged between the first cylinder and the first push block; A first sliding through hole and a first mounting hole for mounting the first pushing block are provided at one end of the first cylinder close to the first pushing block; a first shaft journal for mounting the first retaining spring, a first step for limiting position, and a second step for mounting the first bearing are provided at one end of the first cylinder away from the first pushing block; A first connecting hole is provided at one end of the first push block close to the first cylinder; the first sliding pin passes through the first connecting hole and is slidably disposed on the first sliding through hole; The second forward pushing assembly includes a second bracket, a second cylinder, a second pushing block, a second bearing, a third spring, a second retaining spring and a second protective shell; the second bracket is arranged on the positioning substrate; one end of the second cylinder is connected to the second pushing block, and the other end passes through the third spring and the second retaining spring in sequence; the second bearing is arranged at an end of the second cylinder away from the second pushing block; the second bearing is arranged tangentially to the side of the third connecting portion; one end of the third spring is against a side of the second bracket close to the second bearing, and the other end is against the second retaining spring; the second protective shell is arranged on the second bracket after covering the second pushing block; a fourth spring is also arranged between the second cylinder and the second pushing block; A second sliding through hole and a second mounting hole for mounting the second pushing block are provided at one end of the second cylinder close to the second pushing block; a second journal for mounting the second retaining spring, a third step for limiting, and a fourth step for mounting the second bearing are provided at one end of the second cylinder away from the second pushing block; A second connecting hole is provided at one end of the second push block close to the second cylinder; a second sliding pin passes through the second connecting hole and is slidably disposed on the second sliding through hole; The Y-axis assembly includes a Y-axis base and a Y-axis moving component; the Y-axis base is arranged on the X-axis assembly.

2. The laser processing equipment for ceramic substrates for circuit boards according to claim 1, characterized in that: A third through hole and a plurality of positioning posts are provided at the geometric center of the jig plate; the positioning posts are provided at right angles along two adjacent sides of the third through hole; the jig plate is also provided with a first guide groove and a second guide groove which are independent of each other; the first guide groove is adapted to the first push block; the second guide groove is adapted to the second push block; The vacuum boss comprises a vacuum support and a sliding block detachably arranged at the bottom of the vacuum support; the sliding block is provided with an inner recess; A fourth through hole communicating with the third through hole is disposed on the top of the vacuum support; a fifth through hole connected with a vacuum generating device is disposed on the side of the vacuum support.

3. The laser processing equipment for ceramic substrate for circuit board according to claim 1, characterized in that: The loading and unloading mechanism comprises a convex substrate, a loading and unloading assembly, and a first material rack assembly and a second material rack assembly arranged at both ends of the convex substrate; the convex substrate is arranged on the top of the machine base; the loading and unloading assembly is arranged in the middle of the convex substrate; a material blocking assembly is also arranged on the side of the first material rack assembly; The first rack assembly includes a first KK module, a first supporting assembly, a first frame, and a first optical fiber assembly arranged on the top of the first frame; the first KK module is arranged at one end of the convex substrate away from the second rack assembly; the output end of the first KK module is connected to the first supporting assembly; the first frame is arranged on the top of the first KK module; The second rack assembly includes a second KK module, a second supporting assembly, a second frame, and a second optical fiber assembly arranged on the top of the second frame; the second KK module is arranged at one end of the convex substrate away from the first rack assembly; the output end of the second KK module is connected to the second supporting assembly; the second frame is arranged on the top of the second KK module; The first optical fiber component and the second optical fiber component are arranged at the same height.

4. The laser processing equipment for ceramic substrate for circuit board according to claim 3, characterized in that: The loading and unloading assembly includes a rotating cylinder, a lifting cylinder, a right-angle plate, a height sensor, a first suction cup assembly and a second suction cup assembly; the rotating cylinder is arranged in the middle of the convex substrate; the output end of the rotating cylinder is connected to the lifting cylinder; the output end of the lifting cylinder is connected to the right-angle plate; one end of the right-angle plate is connected to the first suction cup assembly, and the other end is connected to the second suction cup assembly; the height sensor is arranged at one end of the right-angle plate close to the first suction cup assembly; The first suction cup assembly comprises a first suction cup bracket and a plurality of first suction nozzles arranged on the first suction cup bracket; the first suction cup bracket is arranged at one end of the right-angle plate away from the second suction cup assembly; The second suction cup assembly includes a second suction cup bracket and a plurality of second suction nozzles arranged on the second suction cup bracket; the second suction cup bracket is arranged at one end of the right-angle plate away from the first suction cup assembly.

5. The laser processing equipment for ceramic substrate for circuit board according to claim 4, characterized in that: The first frame includes a first plate, a first column, a second column and a third column; the first plate is arranged on the top of the first KK module; the first column is arranged on the first corner of the first plate; the second column is arranged on the second corner of the first plate; the third column is arranged on the third corner of the first plate; The second frame includes a second plate, a fourth column and a fifth column; the second plate is arranged on the top of the second KK module; the fourth column is arranged on the first corner of the second plate; the fifth column is arranged on the second corner of the second plate; The first column, the second column, the third column, the fourth column and the fifth column are arranged with the same length.

6. The laser processing equipment for ceramic substrate for circuit board according to claim 5, characterized in that: The first optical fiber assembly includes a first grating and a second grating arranged opposite to the first grating; the first grating is arranged on the top of the first column; the second grating is arranged on the top of the second column; The second optical fiber assembly includes a third grating and a fourth grating arranged opposite to the third grating; the third grating is arranged on the top of the fourth column; and the fourth grating is arranged on the top of the fifth column.

7. The laser processing equipment for ceramic substrate for circuit board according to claim 6, characterized in that: The material blocking assembly includes a material blocking fixing plate, a material blocking bearing, and a blocking strip detachably arranged on the material blocking fixing plate; the material blocking fixing plate is arranged on the side of the third column; the material blocking bearing is arranged at one end of the blocking strip away from the material blocking fixing plate; The first supporting assembly includes a first connecting plate and a first supporting plate; one end of the first connecting plate is connected to the output end of the first KK module, and the other end passes through the first flat plate and is connected to the first supporting plate; The second supporting assembly includes a second connecting plate and a second supporting plate; one end of the second connecting plate is connected to the output end of the second KK module, and the other end passes through the second flat plate and is connected to the second supporting plate.

8. The laser processing equipment for ceramic substrate for circuit board according to claim 1, characterized in that: One end of the Y-axis moving component is arranged on the Y-axis base, and the other end is connected to the positioning mechanism; The X-axis assembly includes an X-axis base and an X-axis moving component; the X-axis base is arranged on the top of the base; one end of the X-axis moving component is arranged on the X-axis base, and the other end is connected to the Y-axis base; The Z-axis assembly includes a Z-axis base, a Z-axis electric cylinder and a Z-axis connecting plate; the Z-axis base is arranged on the top of the machine base; the Z-axis electric cylinder is arranged on the Z-axis base; one side of the Z-axis connecting plate is connected to the output end of the Z-axis electric cylinder, and the other end is connected to the laser generator.

Citation Information

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