Automatic tinning equipment

Abstract

The present invention belongs to the technical field of electronic component welding, and in particular, relates to an automatic tinning device, which is used for tinning the conductor part of the electronic component, and includes a first frame and a second frame which are independently arranged, and the second frame is arranged at one end of the first frame, and also includes a transplanting mechanism, a flux box and a tin furnace; the flux box and the tin furnace are arranged on the second frame, and the transplanting mechanism is arranged on the first frame, and is used to clamp the electronic component and pass through the flux and the tin furnace in sequence. Since the transplanting mechanism and the tin furnace are respectively arranged on the first frame and the second frame which are independent of each other; therefore, when the transplanting mechanism moves quickly, it will not cause the vibration or shaking of the second frame; thereby, the tin surface in the tin furnace remains in a static state, and thereby the height of the tinning of the electronic component soldering feet can be accurately controlled to ensure that the electronic component can be welded normally.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic component welding, and in particular relates to automatic tinning equipment. Background Art

[0002] When currently soldering electronic components on a circuit board, the soldering feet of the electronic components need to be tinned first. After tinning, the components are automatically soldered on the circuit board through plug-in soldering equipment. When soldering electronic components on a precision circuit board, the length of the soldering feet of the electronic components and the height of the tin surface are extremely strict. If the tin surface is too low, the soldering will be unstable. If the tin surface is too high, there will be too much solder. There is too much tin connecting other electronic components or connection points on the circuit board, which will cause a short circuit. Therefore, during the tinning process, the depth of the soldering tinning of the electronic components needs to be strictly controlled.

[0003] At present, the tinning of the soldering feet of electronic components is automatically completed by automated equipment. Specifically, the electronic components are clamped by a transfer head, run on several tables to the top of the tin furnace, and then inserted into the tin surface. Then, when the transfer head changes from a moving state to a stationary state, it will cause the machine to vibrate, and then cause the liquid surface of the tin furnace to shake. Therefore, when the soldering of the electronic component is inserted into the tin surface, the shaking tin surface will affect the soldering height. Summary of the invention

[0004] The purpose of the present invention is to provide an automatic tinning device, aiming to solve the problem that the current tinning device causes the tin surface to shake and the tinning depth cannot be controlled during the tinning process.

[0005] To achieve the above-mentioned purpose, an embodiment of the present invention provides an automatic tinning equipment for tinning the conductor part of an electronic component, comprising a first frame and a second frame that are independently arranged, the second frame is arranged at one end of the first frame, and also comprises a transplanting mechanism, a flux box and a tin furnace; the flux box and the tin furnace are arranged on the second frame, and the transplanting mechanism is arranged on the first frame, and is used to clamp the electronic components and pass through the flux and the tin furnace in sequence.

[0006] Furthermore, an installation gap is provided at one end of the first frame, and the second frame is arranged in the gap.

[0007] Furthermore, the transplanting mechanism includes a first translation mechanism, a second translation mechanism, a lifting mechanism and a clamping mechanism; the first translation mechanism is arranged on the first frame, and the second translation mechanism is connected to the moving end of the first translation mechanism; the lifting mechanism is arranged at the moving end of the second translation mechanism; the clamping mechanism is arranged at the lifting end of the lifting mechanism, and is used to clamp the tinned electronic components; the moving directions of the second translation mechanism and the first translation mechanism are perpendicular to each other.

[0008] Further, the first translation mechanism includes two guide rail frames arranged in parallel on both sides of the top surface of the first frame, a first translation seat slidably connected to the two guide rail frames, and a first electric screw assembly arranged on one guide rail frame, the first electric screw assembly is connected to the first translation seat, and is used to drive the first translation seat to translate;

[0009] The second translation mechanism includes two linear guide rails arranged in parallel on the first translation seat; a second translation seat slidably connected to the two linear guide rails, and a second motor screw assembly arranged on the first translation seat, the second motor screw assembly being connected to the second translation seat for driving the second translation seat to translate along the two linear guide rails;

[0010] The lifting mechanism includes at least two guide pillars, a top plate, a lifting seat and a third electric screw assembly; the guide pillars are arranged parallel to each other between the top plate and the second movable seat; the lifting seat is slidably connected to the guide pillars, and the third electric screw assembly is arranged on the top plate and connected to the lifting seat, which is used to drive the lifting seat to slide up and down; extension plates extend from both ends of the lifting seat, and a mounting plate extends downward from the free end of the extension plate, and the mounting plate is located on one side of the first translation seat; the clamping mechanism is arranged between the two mounting plates.

[0011] Furthermore, the transplanting mechanism also includes a turning mechanism, which is arranged at the lifting end of the lifting mechanism. The turning mechanism includes a turning seat, and the clamping mechanism is arranged on the turning seat of the turning mechanism.

[0012] Furthermore, it also includes a liquid level detection probe and an up-and-down moving member; the up-and-down moving member and the clamping mechanism are staggeredly arranged on both sides of the moving end of the lifting mechanism, and the liquid level detection probe is connected to the up-and-down moving member.

[0013] Furthermore, it also includes a tin scraping surface mechanism, which is arranged on the second frame and is used to scrape off the condensed layer of tin liquid in the tin furnace; the tin scraping surface mechanism includes a lifting cylinder, a translation cylinder and a scraper; the lifting cylinder is arranged on the second frame, the translation cylinder is arranged at the lifting end of the lifting cylinder, the scraper is arranged at the telescopic end of the translation cylinder, and the free end of the scraper is provided with a tin scraping portion bent toward the inside of the tin furnace.

[0014] Furthermore, the flux box includes a storage box, a reflux box, a filter tank and a liquid pump; the reflux box is arranged on the second frame, the filter tank is arranged at the bottom end of the second frame, and a filter screen is arranged in the filter tank to divide the filter tank into two cavities; a reflux pipe is arranged at the bottom of the reflux box, and the lower end of the reflux pipe extends into a cavity of the filter tank; the storage box is arranged in the reflux box, and an input pipe connected to the liquid pump is arranged on one side of the storage box, and the input end of the liquid pump is connected to the other cavity pipeline of the filter tank; an overflow port is arranged at the upper end of the side wall of the storage box.

[0015] Furthermore, it also includes an input mechanism and an output mechanism arranged on the first frame, the input mechanism is used to transport the electronic components to be tinned to the clamping position of the clamping end of the transplanting mechanism; the output mechanism is used to receive and transport the tinned electronic components on the transplanting mechanism.

[0016] Furthermore, the input mechanism includes a support seat, a motor, a main drive wheel, a driven wheel, a transmission belt, two guide rails and two positioning carriers; the support seat is arranged on the first frame, the motor is arranged at one end of the support seat, and the driven wheel is arranged at the other end of the support seat; the main drive wheel is arranged on the motor, and the transmission belt connects the main drive wheel and the driven wheel; the two guide rails are arranged in parallel on the support seat and are located on both sides of the transmission belt; the two positioning carriers are respectively slidably connected to a guide rail and locked on one side of the transmission belt, and the transmission belt pulls the two positioning carriers to move in opposite directions along the corresponding guide rails.

[0017] The above one or more technical solutions in the automatic tinning equipment provided by the embodiment of the present invention have at least the following technical effects:

[0018] 1. The electronic components to be tinned are clamped on the transplanting mechanism, and the transplanting mechanism moves on the first frame, so that the electronic components can pass through the flux box and the tin furnace in turn, and then the soldering feet of the electronic components are dipped in flux and tin in turn, and the soldering and tinning are completed. Since the transplanting mechanism and the tin furnace are respectively arranged on the first frame and the second frame which are independent of each other; therefore, when the transplanting mechanism moves quickly, it will not cause the vibration or shaking of the second frame; thereby, the tin surface in the tin furnace remains stationary, and the height of the tinning of the soldering feet of the electronic components can be accurately controlled to ensure that the electronic components can be welded normally. In addition, since the transplanting mechanism and the tin furnace are respectively arranged on the first frame and the second frame which are independent of each other, the speed of the transplanting mechanism movement can be increased, and the efficiency of tinning can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0020] Figure 1 A structural diagram of the automatic tinning equipment provided in an embodiment of the present invention.

[0021] Figure 2 This is a structural diagram of the other side of the automatic tinning equipment provided in an embodiment of the present invention.

[0022] Figure 3 A front view of the automatic tinning equipment provided in an embodiment of the present invention.

[0023] Figure 4 A structural diagram of the transplanting mechanism of the automatic tinning equipment provided in an embodiment of the present invention.

[0024] Figure 5 This is a structural diagram of the other side of the transplanting mechanism of the automatic tinning equipment provided in an embodiment of the present invention.

[0025] Figure 6 This is a structural diagram of the second frame part of the film continuous folding device provided in an embodiment of the present invention.

[0026] Figure 7 for Figure 6 Magnified view of section A.

[0027] Figure 8 A structural diagram of the input mechanism of the film continuous folding device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0028] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0029] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0031] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0032] In one embodiment of the present invention, referring to Figure 1 to Figure 3 , an automatic tinning device, used for tinning the conductor part of an electronic component. It includes a first frame 100 and a second frame 200 which are independently arranged. The second frame 200 is arranged at one end of the first frame 100. The automatic tinning device also includes a transplanting mechanism 300, a flux box 400 and a tin furnace 500. The flux box 400 and the tin furnace 500 are arranged on the second frame 200, and the transplanting mechanism 300 is arranged on the first frame 100, and is used to clamp the electronic components and pass through the flux 400 and the tin furnace 500 in sequence. The electronic components to be tinned are clamped on the transplanting mechanism 300, and the transplanting mechanism 300 moves on the first frame 100, so that the electronic components can pass through the flux box 400 and the tin furnace 500 in sequence, so that the soldering feet of the electronic components are sequentially dipped with flux and tin, and the soldering tinning is completed. Since the transplanting mechanism 300 and the tin furnace 500 are respectively arranged on the first frame 100 and the second frame 200 which are independent of each other, when the transplanting mechanism 300 moves quickly, the second frame 200 will not be vibrated or shaken. Thus, the tin surface in the tin furnace 500 remains stationary, and the height of the tinning of the soldering feet of the electronic components can be accurately controlled to ensure that the electronic components can be soldered normally. In addition, since the transplanting mechanism 300 and the tin furnace 500 are respectively arranged on the first frame 100 and the second frame 200 which are independent of each other, the speed of the transplanting mechanism 300 can be increased, and the efficiency of tinning can be improved.

[0033] Further, refer to Figure 1 to Figure 3 , one end of the first frame 100 is provided with an installation clearance gap, and the second frame 200 is arranged in the clearance gap. In this embodiment, the clearance gap is provided at one end of the first frame 100, so that the second frame 200 can be located at the position of the clearance gap, so that the flux box 400 and the tin furnace 500 can be located within the outline of the first frame 100, so that the transplanting mechanism 300 can move within the outline of the first frame 100 to complete the tinning, and there is no need to extend the transplanting mechanism 300 to extend out of the outline of the first frame 100 to complete the tinning, thereby improving the stability of the movement of the transplanting mechanism 300.

[0034] Further, the transplanting mechanism 300 includes a first translation mechanism 310, a second translation mechanism 320, a lifting mechanism 330 and a clamping mechanism (not shown in the drawings), please refer to Figure 1 to Figure 5 ,. The first translation mechanism 310 is arranged on the first frame 100, and the second translation mechanism 320 is connected to the moving end of the first translation mechanism 310. The lifting mechanism 330 is arranged at the moving end of the second translation mechanism 320. The clamping mechanism is arranged at the lifting end of the lifting mechanism 330, and is used to clamp the electronic components to be dipped in tin. The moving directions of the second translation mechanism 320 and the first translation mechanism 310 are perpendicular to each other. In this embodiment, when the clamping mechanism clamps the electronic components, the electronic components are driven to move toward the tin furnace 500 by the first translation mechanism 310, and the electronic components are driven to move up and down by the lifting mechanism 330, so as to achieve the soldering flux and tinning of the soldering feet of the electronic components. In addition, during the tinning process, the soldering feet of the electronic components can be driven by the first translation mechanism 310 and the second translation mechanism 320 to move along a certain trajectory in the solder, so as to clean the impurities adhered to the soldering feet in the solder liquid, ensure the cleanliness of the soldering feet, and ensure the uniformity of the soldering feet.

[0035] Further, refer to Figure 4 and Figure 5 The first translation mechanism 310 includes two guide rail frames 311 arranged in parallel on both sides of the top surface of the first frame 100, a first translation seat 312 slidably connected to the two guide rail frames 311, and a first electric screw assembly 313 arranged on one guide rail frame 311. The first electric screw assembly 313 is connected to the first translation seat 312 and is used to drive the first translation seat 312 to translate.

[0036] Reference Figure 4 and Figure 5 The second translation mechanism 320 includes two linear guide rails 321 arranged in parallel on the first translation seat 312; a second translation seat 322 slidingly connected to the two linear guide rails 321, and a second motor screw assembly 323 arranged on the first translation seat 312, the second motor screw assembly 323 is connected to the second translation seat 322, and is used to drive the second translation seat 322 to translate along the two linear guide rails 321.

[0037] Reference Figure 4 and Figure 5The lifting mechanism 330 includes at least two guide posts 331, a top plate 332, a lifting seat 333 and a third electric screw assembly 334. The guide posts 331 are arranged parallel to each other between the top plate 332 and the second movable seat 322. The lifting seat 333 is slidably connected to the guide posts 331. The third electric screw assembly 334 is arranged on the top plate 332 and connected to the lifting seat 333, and is used to drive the lifting seat 333 to slide up and down. Extension plates 335 extend from both ends of the lifting seat 333, and a mounting plate 336 extends downward from the free end of the extension plate 335, and the mounting plate 336 is located on one side of the first translation seat 312. The clamping mechanism is arranged between the two mounting plates 336, so that the clamping mechanism can avoid the first translation seat 312 and the second translation seat 322 when lifting and moving, so as to achieve free lifting and picking up of electronic components and complete the soldering of the soldering feet of the electronic components. Specifically, the first electric screw assembly 313 drives the first translation seat 312 to translate along the two guide rails 311, and then drives the clamping mechanism to translate to the electronic component loading station, and translates to above the flux box 400 and the tin furnace 500. The second electric screw assembly 323 drives the second translation seat 322 to translate along the linear guide 321, and under the drive of the first electric screw assembly 313, the electronic components can move along a certain trajectory to achieve the effect of cleaning the solder pins of the electronic components. The third electric screw assembly 334 drives the lifting seat 333 to move up and down, and then drives the clamping mechanism to move up and down, so that the electronic components on the clamping mechanism can complete the tinning action.

[0038] Furthermore, the structure of the clamping mechanism in the present tinning arrangement varies according to the different structures of the electronic components, so the specific structure of the clamping mechanism is not described in this embodiment.

[0039] Furthermore, in order to facilitate the installation of the second electric screw assembly 323 , it is arranged at the bottom end of the first translation seat 312 , and an air avoidance groove is provided on the first translation seat 312 for avoiding the connection between the second electric screw assembly 323 and the second translation seat 322 .

[0040] Furthermore, the first electric screw assembly 313 , the second electric screw assembly 323 and the third electric screw assembly 334 all have the same structure, and all include a servo motor and a ball screw pair.

[0041] Further, refer to Figure 4 and Figure 5, the transplanting mechanism 300 also includes a flipping mechanism 340, which is arranged at the lifting end of the lifting mechanism 330. Specifically, the flipping mechanism 340 includes a flipping seat 341, and the clamping mechanism is arranged on the flipping seat 341 of the flipping mechanism 340. More specifically, the flipping seat 341 is rotatably connected to the two mounting plates 336, and the flipping mechanism 340 also includes a flipping motor 342, which is connected to the flipping seat 341, and the flipping motor 342 drives the flipping seat 341 to flip. In this embodiment, the flipping seat 341 in the flipping mechanism 340 is flipped, thereby driving the clamping mechanism and the clamped electronic component to flip; for the electronic component, both sides are provided with solder pins, and the solder pins on both sides can be tinned. Alternatively, after the electronic component is tinned, the electronic component is flipped on one side to prevent the solder pins with solder from contacting other objects when the clamping mechanism releases the electronic component, causing the solder on the solder pins to fall off, thereby protecting the solder on the solder pins of the electronic component.

[0042] Furthermore, the mounting surface of the flip seat 341 is eccentric to the rotation axis of the flip seat 341. When the clamping mechanism is arranged on the mounting surface of the flip seat 341, the center of the electronic component clamped by the clamping mechanism is close to the rotation axis of the flip seat 341, or coincides with the axis. This makes the flipping amplitude of the electronic component small, so when flipping, the lifting mechanism 330 does not need to be adjusted too much or does not need to be adjusted, so that the electronic component will not cause interference during the flipping process.

[0043] Further, refer to Figure 4 and Figure 5 , the automatic tinning equipment also includes a liquid level detection probe 600 and an up-and-down moving member 610. The up-and-down moving member 610 and the clamping mechanism are staggered and arranged on both sides of the moving end of the lifting mechanism 330, and the liquid level detection probe 600 is connected to the up-and-down moving member 610. Specifically, the up-and-down moving member 610 and the clamping mechanism are relatively arranged on the left and right sides of the lifting seat 333. Since the lower tin surface of the tin furnace 500 changes due to continuous tinning; in order to further improve the accuracy of tinning, a liquid level detection probe 600 is added in this embodiment. Specifically, the liquid level detection probe 600 is driven to move to the top of the tin furnace 500 by the first translation mechanism 310, and the liquid level detection probe 600 is driven to move downward by the lifting mechanism 330. When the liquid level detection probe 600 detects the tin surface, the lifting mechanism 330 stops, and the coordinates of the stop are positioned as the origin coordinates to reach the height of the defined tin surface, thereby ensuring the depth of the component tinning.

[0044] Further, refer to Figure 6 and Figure 7 The automatic tinning equipment also includes a tin scraping surface mechanism 700, which is arranged on the second frame 200 and is used to scrape off the condensed layer of tin liquid in the tin furnace 500, thereby ensuring that the electronic components can be tinned smoothly.

[0045] Specifically, refer to Figure 7 The tin scraping mechanism 700 includes a lifting cylinder 710, a translation cylinder 720 and a scraper 730; the lifting cylinder 710 is arranged on the second frame 200, the translation cylinder 720 is arranged at the lifting end of the lifting cylinder 710, the scraper 730 is arranged at the telescopic end of the translation cylinder 710, and the free end of the scraper is provided with a tin scraping portion 731 bent into the tin furnace 500. In this embodiment, when it is necessary to scrape off the condensed layer on the tin surface of the tin furnace 500, the translation cylinder 720 drives the scraper 730 to move to one end of the tin furnace 500, and then the lifting cylinder 710 drives the scraper 730 to descend, so that the tin scraping portion extends under the tin surface, and the translation cylinder 720 pulls the scraper 730 to translate, thereby scraping off the condensed layer on the liquid surface of the tin furnace 500.

[0046] Further, refer to Figure 7 A connecting seat 721 is provided at the telescopic end of the translation cylinder 720, and a connecting piece 732 is provided at one end of the scraper 730. One end of the connecting piece 732 extends to the top surface of the connecting seat 721. A plurality of bolts 722 slide through the connecting piece 732 and are connected to the connecting seat 721. A compression spring 723 for pressing the connecting piece 732 is sleeved on each locking bolt 722. In this embodiment, in the process of scraping off the condensed layer on the tin surface, when the scraper 730 receives the assist force, the elastic force of the compression spring 723 is overcome, so that the scraper 730 can move upward to achieve the function of avoiding air obstacles.

[0047] Further, refer to Figure 6 The flux box 400 includes a storage box 401, a reflow box 402, a filter tank 403 and a liquid pump (not shown in the drawings). The reflow box 402 is arranged on the second frame 200, the filter tank 403 is arranged at the bottom of the second frame 200, and a filter screen 404 is arranged in the filter tank 403 to divide the filter tank 403 into two cavities. A reflow pipe 405 is arranged at the bottom of the reflow box 402, and the lower end of the reflow pipe 405 extends into a cavity of the filter tank 403. The storage box 401 is arranged in the reflow box 402, and an input pipe 406 connected to the liquid pump is arranged on one side of the storage box 401, and the input end of the liquid pump is connected to the other cavity pipeline of the filter tank 403. An overflow port 407 is arranged at the upper end of the side wall of the storage box 401. In this embodiment, the flux filtered by the filter screen 404 in the filter tank 403 is continuously pumped into the storage box 401 by a liquid pump, and the flux exceeding the overflow port 407 flows into the reflow box 402 through the overflow port 407, thereby making the liquid level in the storage box 401 always consistent, ensuring that the depth of the flux on the solder pins of the electronic components is also consistent. The flux entering the reflow box 402 flows back to the filter tank 403 through the reflow port 405 for filtration and recycling.

[0048] Furthermore, the input pipe 406 is disposed on the side of the storage box 401 , so when the soldering flux is pumped into the storage box 401 , the soldering flux is prevented from splashing and the liquid surface is always kept in a calm state.

[0049] Furthermore, a plurality of support plates are provided in the reflow box 402, and the storage box 401 is supported on the support plates, so that a gap is formed between the storage box 401 and the bottom of the reflow box 402, which is convenient for the reflow of the soldering flux.

[0050] Further, refer to Figure 1 to Figure 3 The automatic tinning equipment further includes an input mechanism 800 and an output mechanism 900 arranged on the first frame 100. The input mechanism 800 is used to transport the electronic components to be tinned to the clamping position of the clamping end of the transfer mechanism 300. The output mechanism 900 is used to receive and transport the tinned electronic components on the transfer mechanism 300. In this way, automatic tinning of automatic loading and unloading can be realized, thereby improving the tinning efficiency.

[0051] Further, refer to Figure 8 The input mechanism 800 includes a support base 801, a motor 802, a main transmission wheel 803, a driven wheel 804, a transmission belt 805, two guide rails 806 and two positioning carriers 807. The support base 801 is arranged on the first frame 100, the motor 802 is arranged at one end of the support base 801, and the driven wheel 804 is arranged at the other end of the support base 801. The main transmission wheel 803 is arranged on the motor 802, and the transmission belt 805 connects the main transmission wheel 803 and the driven wheel 804. The two guide rails 806 are arranged in parallel on the support base 801 and are located on both sides of the transmission belt 805. The two positioning carriers 807 are respectively slidably connected to one guide rail 806 and locked on one side of the transmission belt 805, and the transmission belt 805 pulls the two positioning carriers 807 to move in the opposite direction along the corresponding guide rails 806. In this embodiment, the main transmission wheel 803 is driven to rotate by the motor 802, and under the action of the driven wheel 804, the transmission belt 805 is driven to rotate. Under the rotation of the transmission belt 805, the two positioning carriers 807 can be pulled to move in opposite directions, thereby realizing that one positioning carrier 807 moves from the clamping position to the loading end, and the other positioning carrier 807 moves to the clamping position of the transplanting mechanism 300 after loading from the loading end; thereby achieving rapid exchange and improving efficiency.

[0052] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An automatic tinning device for tinning the conductor part of an electronic component, characterized in that: The invention comprises a first frame and a second frame which are independently arranged, wherein the second frame is arranged at one end of the first frame, and further comprises a transplanting mechanism, a flux box and a tin furnace; the flux box and the tin furnace are arranged on the second frame, and the transplanting mechanism is arranged on the first frame, and is used to clamp the electronic components and pass through the flux and the tin furnace in sequence; the transplanting mechanism comprises a first translation mechanism, a second translation mechanism, a lifting mechanism and a clamping mechanism; the first translation mechanism is arranged on the first frame, and the second translation mechanism is connected to the moving end of the first translation mechanism; the lifting mechanism is arranged at the moving end of the second translation mechanism; the clamping mechanism is arranged at the lifting end of the lifting mechanism, and is used to clamp the electronic components to be dipped in tin; the moving directions of the second translation mechanism and the first translation mechanism are perpendicular to each other; the invention also comprises an input mechanism and an output mechanism which are arranged on the first frame, the input mechanism is used to convey the electronic components to be dipped in tin to the clamping position of the clamping end of the transplanting mechanism; the output mechanism is used to receive and convey the electronic components dipped in tin on the transplanting mechanism.

2. The automatic tinning equipment according to claim 1, characterized in that: One end of the first frame is provided with an installation gap, and the second frame is arranged in the gap.

3. The automatic tinning equipment according to claim 1 is characterized in that: The first translation mechanism comprises two guide rail frames arranged in parallel on both sides of the top surface of the first frame, a first translation seat slidably connected to the two guide rail frames, and a first electric screw assembly arranged on one of the guide rail frames, the first electric screw assembly being connected to the first translation seat for driving the first translation seat to translate; The second translation mechanism comprises two linear guide rails arranged in parallel on the first translation seat; a second translation seat slidably connected to the two linear guide rails, and a second motor screw assembly arranged on the first translation seat, the second motor screw assembly being connected to the second translation seat for driving the second translation seat to translate along the two linear guide rails; The lifting mechanism includes at least two guide posts, a top plate, a lifting seat and a third electric screw assembly; the guide posts are arranged parallel to each other between the top plate and the second translation seat; the lifting seat is slidably connected to the guide posts, and the third electric screw assembly is arranged on the top plate and connected to the lifting seat, and is used to drive the lifting seat to slide up and down; extension plates extend from both ends of the lifting seat, and a mounting plate extends downward from the free end of the extension plate, and the mounting plate is located on one side of the first translation seat; the clamping mechanism is arranged between the two mounting plates.

4. The automatic tinning equipment according to claim 1 or 3, characterized in that: The transplanting mechanism further comprises a turning mechanism, which is arranged at the lifting end of the lifting mechanism. The turning mechanism comprises a turning seat, and the clamping mechanism is arranged on the turning seat of the turning mechanism.

5. The automatic tinning equipment according to claim 1 or 3, characterized in that: It also includes a liquid level detection probe and an up-and-down moving member; the up-and-down moving member and the clamping mechanism are staggeredly arranged on both sides of the moving end of the lifting mechanism, and the liquid level detection probe is connected to the up-and-down moving member.

6. The automatic tinning equipment according to any one of claims 1 to 3, characterized in that: It also includes a tin scraping surface mechanism, which is arranged on the second frame and is used to scrape off the condensed layer of tin liquid in the tin furnace; the tin scraping surface mechanism includes a lifting cylinder, a translation cylinder and a scraper; the lifting cylinder is arranged on the second frame, the translation cylinder is arranged at the lifting end of the lifting cylinder, the scraper is arranged at the telescopic end of the translation cylinder, and the free end of the scraper is provided with a tin scraping portion bent into the tin furnace.

7. The automatic tinning equipment according to any one of claims 1 to 3, characterized in that: The flux box includes a storage box, a reflux box, a filter tank and a liquid pump; the reflux box is arranged on the second frame, the filter tank is arranged at the bottom end of the second frame, and a filter screen is arranged in the filter tank to divide the filter tank into two cavities; a reflux pipe is arranged at the bottom of the reflux box, and the lower end of the reflux pipe extends into a cavity of the filter tank; the storage box is arranged in the reflux box, and an input pipe connected to the liquid pump is arranged on one side of the storage box, and the input end of the liquid pump is connected to the other cavity pipeline of the filter tank; an overflow port is arranged at the upper end of the side wall of the storage box.

8. The automatic tinning equipment according to claim 1, characterized in that: The input mechanism includes a support seat, a motor, a main drive wheel, a driven wheel, a transmission belt, two guide rails and two positioning carriers; the support seat is arranged on the first frame, the motor is arranged at one end of the support seat, and the driven wheel is arranged at the other end of the support seat; the main drive wheel is arranged on the motor, and the transmission belt connects the main drive wheel and the driven wheel; the two guide rails are arranged in parallel on the support seat and are located on both sides of the transmission belt; the two positioning carriers are respectively slidably connected to one guide rail and locked on one side of the transmission belt, and the transmission belt pulls the two positioning carriers to move in opposite directions along the corresponding guide rails.

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