Quantum chip packaging equipment and packaging process thereof

Abstract

The present invention relates to the field of chip packaging technology, and discloses a quantum chip packaging device and a packaging process thereof, including a slide rail, wherein a cross frame is fixedly arranged inside the slide rail for supporting the bottom of a circuit board to be packaged, a support foot is fixedly arranged below the slide rail, a fixed plate is fixedly arranged on the side of the support foot away from the slide rail, a plurality of ammeters are fixedly arranged on the side of the fixed plate close to the slide rail for detecting current, a current transformer is fixedly arranged on one end of the multiple ammeters close to the slide rail for sensing the current in the circuit board to be packaged, a fixed rod is fixedly arranged on one side of each current transformer, a plurality of electric push rods are fixedly arranged on the side of the fixed rod close to the current transformer, and a controller is fixedly arranged on one end of the fixed plate. The invention detects the state of the pins after each welding through the current transformer, selects the faulty chip in time, reduces the effort of later detection, improves production efficiency, purifies the air in the workshop through the exhaust pipe, and is beneficial to the working environment of the staff.

Description

Technical Field

[0001] The present invention relates to the field of chip packaging technology, and in particular to a quantum chip packaging device and a packaging process thereof. Background Art

[0002] Quantum is an important concept in modern physics. That is, if a physical quantity has the smallest indivisible basic unit, then this physical quantity is quantized, and the smallest unit is called quantum. The basic idea of ​​quantum communication was mainly proposed by Bennett et al. in the 1980s and 1990s, mainly including quantum key distribution and quantum state stealth transmission. The realization of quantum communication is based on quantum state transmission. In order to facilitate transmission, existing quantum communication experiments generally use photons as quantum state carriers, and its manifestation is photon state transmission. The encoding space of quantum information is mainly based on light polarization. Quantum communication is applied in many fields, especially in the processing of precision instruments, and is often used with controllers, such as chip packaging technology. Chip packaging is the shell used to install semiconductor integrated circuit chips, which plays the role of placing, fixing, sealing, protecting chips and enhancing electrical and thermal performance. It is also a bridge to communicate the internal world of the chip with the external circuit-the contacts on the chip are connected to the pins of the package shell with wires, and these pins are connected to other devices through wires on the printed circuit board. Therefore, packaging plays an important role in CPUs and other LSI integrated circuits.

[0003] In the existing chip packaging process, the packaged pins and the circuit board are usually welded together, and then each chip pin is checked one by one to see if it is working properly. Chips that fail to work properly during the test must be reworked to check for errors and re-welded, or directly scrapped and recycled. It is time-consuming and laborious to conduct testing after the entire package is completed, and it is also time-consuming to check for errors one by one from the complete chip. In addition, harmful gases will be generated when welding pins and circuit boards, polluting the workshop air and affecting the health of workers.

[0004] Currently, no effective solution has been proposed for the problems in the related technologies. Summary of the invention

[0005] 1. Technical issues to be resolved

[0006] In view of the shortcomings of the prior art, the present invention provides a quantum chip packaging device, which has the advantages of real-time monitoring of chip packaging and air purification, thereby solving the problem of troublesome chip return to the factory for processing and pollution of workshop air.

[0007] (II) Technical solution

[0008] In order to solve the above-mentioned technical problems of the trouble of returning chips to the factory for processing and polluting the air in the workshop, the present invention provides the following technical solutions:

[0009] A quantum chip packaging device comprises a slide rail, wherein a cross frame is fixedly arranged inside the slide rail for supporting a circuit board to be packaged, wherein the cross frame comprises a longitudinal beam and a plurality of cross beams for forming a cross structure, wherein a support foot is fixedly arranged below the slide rail, wherein a fixed plate is fixedly arranged on a side of the support foot away from the slide rail, wherein a plurality of ammeters are fixedly arranged on a side of the fixed plate close to the slide rail for detecting current, wherein a current transformer is fixedly arranged on an end of each ammeter close to the slide rail for sensing current in the circuit board to be packaged, wherein a controller is fixedly arranged on one end of the fixed plate, wherein an electric telescopic rod is arranged on the fixed plate directly below each of the cross structures, wherein a cross slot is provided on the top of the electric telescopic rod for passing through the cross structure and lifting unqualified circuit boards to be packaged, and wherein electrode pens are arranged on both sides of each of the electric telescopic rods for energizing the circuits on the circuit boards to be packaged.

[0010] Preferably, a translation bracket is fixedly provided on one side of the fixed plate, and a first slide groove is provided on the translation bracket near the top of the slide rail. A plurality of translation devices are provided in the first slide groove for translationally moving the circuit board to be packaged in the slide rail.

[0011] Preferably, the translation device includes a first cylinder, a third slide groove is fixedly provided on the top of the first cylinder, a second cylinder is fixedly provided on one side of the third slide groove, a slider is fixedly provided on the top of the second cylinder, and a pointed tip is fixedly provided at one end of the slider away from the third slide groove, which is used to penetrate into the protective layer on the surface of the circuit board to be packaged to drive the circuit board to be packaged to move.

[0012] Preferably, the first cylinder is located in the first slide groove, and the bottom end of the first cylinder is fixed to the surface of the first slide groove by welding, so as to change the height of the third slide groove; the second cylinder is located in the third slide groove, so as to change the position of the slider in the third slide groove; the tip is fixed to the slider by welding.

[0013] Preferably, a second slide groove is fixedly provided on one side of the fixing plate relative to the translation bracket, and a plurality of welding devices are provided in the second slide groove for welding pins on the surface of the circuit board to be packaged in the slide rail.

[0014] Preferably, the welding device includes a first hydraulic cylinder, a second hydraulic cylinder is fixedly provided at one end of the first hydraulic cylinder, a clamping frame is fixedly provided at the top end of the second hydraulic cylinder, an electric soldering iron is fixedly provided in the clamping frame for welding parts on the surface of the circuit board to be packaged, and an air pipe support frame is fixedly provided above the clamping frame, and an exhaust pipe is placed in the support frame for extracting harmful gases generated during the welding process.

[0015] Preferably, the first hydraulic cylinder is located in the second slide groove, the bottom end of the first hydraulic cylinder is fixed to the surface of the second slide groove by welding, and is used to drive the second hydraulic cylinder to move in the direction of the second slide groove, the second hydraulic cylinder is perpendicular to the first hydraulic cylinder, and the second hydraulic cylinder is fixed to the clamping frame by welding, and is used to change the movement of the soldering iron in the direction of the second hydraulic cylinder.

[0016] Preferably, a fixing rod is fixedly provided on one side of each current transformer, and a plurality of electric push rods are fixedly provided on the side of the fixing rod close to the current transformer, each of the electric push rods is located between adjacent current transformers, the fixing rod is made of insulating material to avoid affecting the current transformer, the current transformer is wrapped with an insulating layer to prevent leakage, the electric push rod is fixed to the fixing rod by welding, and is used to push unqualified circuit boards to be packaged out of the slide rail.

[0017] Preferably, a digital tube display screen is fixedly provided at one end of the ammeter close to the fixed plate, which is used to display the current generated in the current transformer, and an alarm and a warning light are fixedly provided at one side of the ammeter close to the translation bracket, which are used to indicate the problem circuit board to be packaged and display the location of the problem circuit board to be packaged respectively;

[0018] A first electric telescopic rod is fixedly arranged below the electrode pen for changing the height of the electrode pen. A second electric telescopic rod is fixedly arranged at the bottom end of the first electric telescopic rod for changing the position of the electrode pen in the direction of the second electric telescopic rod. The first electric telescopic rod and the second electric telescopic rod are perpendicular to each other.

[0019] A quantum chip packaging process, using any of the quantum chip packaging equipment described above for packaging.

[0020] (III) Beneficial effects

[0021] Compared with the prior art, the present invention provides a quantum chip packaging device having the following features:

[0022] Beneficial effects:

[0023] 1. The quantum chip packaging equipment moves the chip circuit board through a translation device, and the welding device welds the chip circuit board and the packaging pins. After the chip circuit board enters the current transformer, the controller controls the first electric telescopic rod and the second electric telescopic rod to move, thereby controlling the position of the electrode pen, so that the front end pin to be detected contacts the electrode pen. After the electrode pen contacts the front end pin to be detected, if the pin welding is abnormal, no current can be generated. The translation device translates the chip circuit board to the central intersection of the cross frame, and the controller controls the electric telescopic rod to rise, so that the center of the cross frame enters the cross slot, so that the chip circuit board is ejected out of the slide rail, and the controller controls the electric push rod to extend, so that The problematic chip circuit board is pushed out of the slide rail for easy reprocessing. If the pin welding is normal, the chip circuit is locally energized to generate current, which makes the current transformer generate current, and then the current value is displayed on the digital tube display screen through the ammeter. At this time, it proves that the connection at the front pin is normal, and the translation device drives the chip circuit board to continue to move, and repeats the above steps through the welding device at the corresponding position, and performs middle pins, rear end pins and overall re-welding in turn. Therefore, through the detection of four weldings, the packaging process of the chip circuit board is monitored in real time, and the problematic chips are selected in time to avoid the trouble of overall inspection and screening errors, saving time and effort and improving the yield rate.

[0024] 2. During the welding process, the quantum chip packaging equipment has an exhaust pipe located directly above the soldering iron. Through the connection between the exhaust pipe and the exhaust pump, harmful gases can be extracted in time, further avoiding the diffusion of harmful gases, protecting the working environment of the workshop, and being beneficial to the health and sustainable development of the staff.

[0025] 3. The quantum chip packaging equipment places the packaged chip circuit board on the slide rail, and the controller controls the first cylinder to descend so that the tip grabs the surface of the chip circuit board. The controller then controls the second cylinder to extend so that the second cylinder pushes the slider and translates the chip circuit board along the extension direction of the second cylinder through the tip. The extremely small contact area of ​​the tip avoids contact with electronic components in the chip circuit board, and regular movement and translation are achieved through the controller, which is beneficial to protecting the chip circuit board, preventing damage to the chip circuit board due to accidental touch, avoiding chip processing failure, and improving the success rate.

[0026] 4. The quantum chip packaging equipment has a forward voltage and a ground wire in the electrode pens on both sides of the electric telescopic rod, which can form a voltage difference, and then energize the circuit on the circuit board to be packaged. Therefore, whether the welding is normal can be judged by whether there is current, and there is no need to set the current value for the controller to judge, so as to avoid setting the current value too large and causing the chip circuit board to be burned.

[0027] 5. The quantum chip packaging equipment controls the alarm and warning light on the side of the corresponding ammeter through the controller, so that the staff can easily determine the location of the faulty chip and then recycle and re-solder it, avoiding the chip circuit board from falling and being completely scrapped when the electric push rod is pushed out of the slide rail, saving resources and costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is one of the three-dimensional structural schematic diagrams of the present invention;

[0029] Figure 2 This is the second schematic diagram of the three-dimensional structure of the present invention;

[0030] Figure 3 This is one of the partial explosion schematic diagrams of the present invention;

[0031] Figure 4 This is the second partial explosion schematic diagram of the present invention;

[0032] Figure 5 It is a schematic diagram of the three-dimensional structure of the translation device of the present invention;

[0033] Figure 6 It is a schematic diagram of the three-dimensional structure of the welding device of the present invention;

[0034] Figure 7 This is a control diagram of the present invention.

[0035] In the figure: 1. slide rail; 2. cross frame; 3. support leg; 4. ammeter; 5. current transformer; 6. fixed plate; 7. controller; 8. translation bracket; 9. first slide slot; 10. translation device; 1001. first cylinder; 1002. third slide slot; 1003. second cylinder; 1004. slider; 1005. tip; 11. second slide slot; 12. welding device; 1201. first hydraulic cylinder; 1202. second hydraulic cylinder; 1203. clamping frame; 1204. electric soldering iron; 1205. support frame; 1206. exhaust pipe; 13. alarm; 14. warning light; 15. electric telescopic rod; 16. cross slot; 17. electrode pen; 18. fixed rod; 19. electric push rod; 20. first electric telescopic rod; 21. second electric telescopic rod; 22. digital tube display screen. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] See also Figure 1-7 A quantum chip packaging device comprises a slide rail 1, a cross frame 2 is fixedly arranged inside the slide rail 1 for supporting the bottom of the circuit board to be packaged, the cross frame 2 comprises a longitudinal beam and a plurality of cross beams for forming a cross structure, a support foot 3 is fixedly arranged below the slide rail 1, a fixed plate 6 is fixedly arranged on the side of the support foot 3 away from the slide rail 1, a plurality of ammeters 4 are fixedly arranged on the side of the fixed plate close to the slide rail 1 for detecting current, a current transformer 5 is fixedly arranged on the end of each ammeter 4 close to the slide rail 1 for sensing the current in the circuit board to be packaged, a fixed rod 18 is fixedly arranged on one side of each current transformer 5, a plurality of electric push rods 19 are fixedly arranged on the side of the fixed rod 18 close to the current transformer 5, a controller 7 is fixedly arranged on one end of the fixed plate 6, a translation bracket 8 is fixedly arranged on one side of the fixed plate 6, and a horizontal A first slide groove 9 is provided at the top of the moving bracket 8 near the slide rail 1, and a plurality of translation devices 10 are arranged in the first slide groove 9 for translating the circuit board to be packaged in the slide rail 1. A second slide groove 11 is fixedly provided on one side of the fixed plate 6 relative to the translation bracket 8, and a plurality of welding devices 12 are arranged in the second slide groove 11 for welding the pins on the surface of the circuit board to be packaged in the slide rail 1. An electric telescopic rod 15 is provided on the fixed plate 6 directly below each cross frame 2, and a cross groove 16 is provided at the top of the electric telescopic rod 15 for passing through the cross structure and holding up unqualified circuit boards to be packaged. Electrode pens 17 are provided on both sides of each electric telescopic rod 15, and the electrode pens 17 on both sides of the electric telescopic rod 15 respectively have a forward voltage and a grounding wire, so that a voltage difference can be formed, thereby energizing the circuit on the circuit board to be packaged.

[0038] Furthermore, the electric push rod 19 is located between two adjacent current transformers 5, and the fixed rod 18 is made of insulating material to avoid affecting the current transformer 5. The current transformer 5 is wrapped with an insulating layer to prevent leakage. The electric push rod 19 and the fixed rod 18 are fixed by welding to push unqualified circuit boards to be packaged out of the slide rail 1.

[0039] Furthermore, a digital tube display screen 22 is fixedly provided on one end of the ammeter 4 close to the fixed plate 6 for displaying the current generated in the current transformer 5, and an alarm 13 and a warning light 14 are fixedly provided on one side of the ammeter 4 close to the translation bracket 8, for respectively indicating the problematic circuit board to be packaged and displaying the location of the problematic circuit board to be packaged.

[0040] Furthermore, the translation device 10 includes a first cylinder 1001, a third slide groove 1002 is fixedly provided at the top of the first cylinder 1001, a second cylinder 1003 is fixedly provided on one side of the third slide groove 1002, a slider 1004 is fixedly provided at the top of the second cylinder 1003, and a pointed tip 1005 is fixedly provided at one end of the slider 1004 away from the third slide groove 1002, which is used to penetrate into the protective layer on the surface of the circuit board to be packaged to drive the circuit board to be packaged to move. The controller 7 controls the first cylinder 1001 to descend, so that the pointed tip 1005 grabs the surface of the chip circuit board, and the controller 7 controls the second cylinder 1003 to extend, so that the second cylinder 1003 pushes the slider 1004, and translates the chip circuit board along the extension direction of the second cylinder 1003 through the pointed tip 1005.

[0041] Furthermore, the first cylinder 1001 is located in the first slide groove 9, and the bottom end of the first cylinder 1001 is fixed to the surface of the first slide groove 9 by welding, which is used to change the height of the third slide groove 1002. The second cylinder 1003 is located in the third slide groove 1002, which is used to change the position of the slider 1004 in the third slide groove 1002, and the pointed head 1005 and the slider 1004 are fixed by welding.

[0042] Further, the welding device 12 includes a first hydraulic cylinder 1201, a second hydraulic cylinder 1202 is fixedly arranged at one end of the first hydraulic cylinder 1201, a clamping frame 1203 is fixedly arranged at the top of the second hydraulic cylinder 1202, an electric soldering iron 1204 is fixedly arranged in the clamping frame 1203, the first hydraulic cylinder 1201 and the second hydraulic cylinder 1202 drive the electric soldering iron 1204 to move under the control of the controller 7, so that the pins on the chip circuit board can be welded, and a trachea support frame 1205 is fixedly arranged above the clamping frame 1203, and an exhaust pipe 1206 is placed in the support frame 1205 for extracting harmful gases generated during the welding process. In addition, in specific applications, the exhaust pipe 1206 should be connected to an exhaust pump so that harmful gases can be extracted, thereby avoiding the diffusion of harmful gases, protecting the workshop working environment, and being beneficial to the health and sustainable development of the staff.

[0043] Further, the first hydraulic cylinder 1201 is located in the second slide groove 11, and the bottom end of the first hydraulic cylinder 1201 is fixed to the surface of the second slide groove 11 by welding, so as to drive the second hydraulic cylinder 1202 to move in the direction of the second slide groove 11, and the second hydraulic cylinder 1202 is perpendicular to the first hydraulic cylinder 1201, and the second hydraulic cylinder 1202 is fixed to the clamping frame 1203 by welding, so as to change the movement of the electric soldering iron 1204 in the direction of the second hydraulic cylinder 1202;

[0044] A first electric telescopic rod 20 is fixedly provided below the electrode pen 17 for changing the height of the electrode pen 17. A second electric telescopic rod 21 is fixedly provided at the bottom end of the first electric telescopic rod 20 for changing the position of the electrode pen 17 in the direction of the second electric telescopic rod 21. The first electric telescopic rod 20 and the second electric telescopic rod 21 are perpendicular to each other.

[0045] A quantum chip packaging process, using a quantum chip packaging device in any of the above embodiments for packaging.

[0046] Working principle: When in use, place the chip circuit board with package on the slide rail 1, the controller 7 controls the first cylinder 1001 to descend, so that the tip 1005 grabs the surface of the chip circuit board, and the controller 7 controls the second cylinder 1003 to extend, so that the second cylinder 1003 pushes the slider 1004, and the chip circuit board is translated along the extension direction of the second cylinder 1003 through the tip 1005. At the same time, the first hydraulic cylinder 1201 and the second hydraulic cylinder 1202 in the welding device 12 drive the electric soldering iron 1204 to move under the control of the controller 7, so that the front end pins on the chip circuit board can be soldered. After welding is completed, the controller 7 continues to control the translation device 10 to drive the chip circuit board to move in the direction of the extension of the second cylinder 1003. After the chip circuit board enters the current transformer 5, the controller 7 controls the first electric telescopic rod 20 and the second electric telescopic rod 21 to move, thereby controlling the position of the electrode pen 17, so that the front end pin to be detected contacts the electrode pen 17. After the electrode pen 17 contacts the front end pin to be detected, if the pin welding is abnormal, no current can be generated. At this time, the controller 7 controls the alarm 13 on the side of the corresponding ammeter 4 to sound and the warning light 14 to light up, so that the staff can easily determine the location of the faulty chip and then proceed. The chip circuit board is recovered and re-welded. The translation device 10 translates the chip circuit board to the central intersection of the cross frame 2. The controller 7 controls the electric telescopic rod 15 to rise, so that the center of the cross frame 2 enters the cross slot 16, so that the chip circuit board is ejected from the slide rail 1. The controller 7 then controls the electric push rod 19 to extend, so as to push the problematic chip circuit board out of the slide rail 1, thereby facilitating reprocessing. If the pin welding is normal, the chip circuit is partially energized to generate current, so that the current transformer 5 generates current, and then the current value is displayed on the digital tube display screen 22 through the ammeter 4. At this time, it proves that the connection at the front pin is normal, and the translation device 10 drives the chip circuit to be electrically connected. The circuit board continues to move, and the above steps are repeated through the welding device 12 at the corresponding position, and the middle pins, rear end pins and overall repair welding are carried out in turn. After each welding is completed, the pins around the chip circuit board are inspected, so that unqualified products can be selected in time, and the corresponding parts can be processed and reprocessed, avoiding the waste of time in rework during the inspection stage. At the same time, during the welding process, the exhaust pipe 1206 is located directly above the electric soldering iron 1204. Through the connection between the exhaust pipe 1206 and the exhaust pump, harmful gases can be extracted in time, further avoiding the spread of harmful gases, protecting the working environment of the workshop, and being beneficial to the health and sustainable development of the staff.

[0047] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A quantum chip packaging device, comprising a slide rail (1), characterized in that: A cross frame (2) is fixedly arranged inside the slide rail (1) for supporting the circuit board to be packaged, the cross frame (2) comprises a longitudinal beam and a plurality of cross beams for forming a cross structure, a support foot (3) is fixedly arranged below the slide rail (1), a fixed plate (6) is fixedly arranged on the side of the support foot (3) away from the slide rail (1), a plurality of ammeters (4) are fixedly arranged on the side of the fixed plate close to the slide rail (1) for detecting current, a current transformer (5) is fixedly arranged on the end of each ammeter (4) close to the slide rail (1) for sensing the current in the circuit board to be packaged, and a controller (7) is fixedly arranged on one end of the fixed plate (6). The fixing plate (6) is provided with an electric telescopic rod (15) located directly below each of the cross structures. A cross slot (16) is provided at the top of the electric telescopic rod (15) for passing through the cross structure and lifting unqualified circuit boards to be packaged. Electrode pens (17) are provided on both sides of each of the electric telescopic rods (15) for energizing the circuits on the circuit boards to be packaged. A translation bracket (8) is fixedly provided on one side of the fixing plate (6). A first slide groove (9) is provided at the top of the slide rail (1). A plurality of translation devices (10) are provided in the first slide groove (9) for translationally moving the circuit boards to be packaged in the slide rail (1). The invention relates to a circuit board to be packaged, wherein a second slide groove (11) is fixedly provided on one side of the fixed plate (6) relative to the translation bracket (8), and a plurality of welding devices (12) are provided in the second slide groove (11) for welding pins on the surface of the circuit board to be packaged in the slide rail (1), and the welding device (12) comprises a first hydraulic cylinder (1201), a second hydraulic cylinder (1202) is fixedly provided at one end of the first hydraulic cylinder (1201), a clamping frame (1203) is fixedly provided at the top end of the second hydraulic cylinder (1202), and an electric soldering iron (1204) is fixedly provided in the clamping frame (1203) for welding parts on the surface of the circuit board to be packaged, each A fixing rod (18) is fixedly provided on one side of the current transformer (5); a plurality of electric push rods (19) are fixedly provided on a side of the fixing rod (18) close to the current transformer (5); each of the electric push rods (19) is located between two adjacent current transformers (5); the fixing rod (18) is made of insulating material to avoid affecting the current transformer (5); a digital tube display screen (22) is fixedly provided on one end of the ammeter (4) close to the fixing plate (6) for displaying the current generated in the current transformer (5); an alarm (13) and a warning light (14) are fixedly provided on a side of the ammeter (4) close to the translation bracket (8).

2. A quantum chip packaging device according to claim 1, characterized in that: The translation device (10) comprises a first cylinder (1001), a third slide groove (1002) is fixedly provided at the top end of the first cylinder (1001), a second cylinder (1003) is fixedly provided on one side of the third slide groove (1002), a slider (1004) is fixedly provided at the top end of the second cylinder (1003), and a pointed tip (1005) is fixedly provided at one end of the slider (1004) away from the third slide groove (1002) for piercing a protective layer on the surface of a circuit board to be packaged to drive the circuit board to be packaged to move.

3. A quantum chip packaging device according to claim 2, characterized in that: The first cylinder (1001) is located in the first slide groove (9), and the bottom end of the first cylinder (1001) is fixed to the surface of the first slide groove (9) by welding, so as to change the height of the third slide groove (1002). The second cylinder (1003) is located in the third slide groove (1002), so as to change the position of the slider (1004) in the third slide groove (1002), and the pointed head (1005) and the slider (1004) are fixed by welding.

4. A quantum chip packaging device according to claim 3, characterized in that: A gas pipe support frame (1205) is fixedly arranged above the clamping frame (1203), and an exhaust pipe (1206) is placed in the support frame (1205) for extracting harmful gases generated during the welding process.

5. A quantum chip packaging device according to claim 4, characterized in that: The first hydraulic cylinder (1201) is located in the second slide groove (11), and the bottom end of the first hydraulic cylinder (1201) is fixed to the surface of the second slide groove (11) by welding, so as to drive the second hydraulic cylinder (1202) to move in the direction of the second slide groove (11). The second hydraulic cylinder (1202) is perpendicular to the first hydraulic cylinder (1201), and the second hydraulic cylinder (1202) is fixed to the clamping frame (1203) by welding, so as to change the movement of the electric soldering iron (1204) in the direction of the second hydraulic cylinder (1202).

6. A quantum chip packaging device according to claim 5, characterized in that: The current transformer (5) is wrapped with an insulating layer to prevent leakage, and the electric push rod (19) is fixed to the fixing rod (18) by welding to push unqualified circuit boards to be packaged out of the slide rail (1).

7. A quantum chip packaging device according to claim 6, characterized in that: A first electric telescopic rod (20) is fixedly arranged below the electrode pen (17) for changing the height of the electrode pen (17); a second electric telescopic rod (21) is fixedly arranged at the bottom end of the first electric telescopic rod (20) for changing the position of the electrode pen (17) in the direction of the second electric telescopic rod (21); the first electric telescopic rod (20) and the second electric telescopic rod (21) are perpendicular to each other.

8. A quantum chip packaging process, characterized in that: The quantum chip packaging device is used for packaging.

Images