Die stocker, method for storing die carrier, and semiconductor die manufacturing system

Abstract

Embodiments of the present disclosure relate to an apparatus, system, and method for storing die carriers and transferring semiconductor dies between die carriers. A die stocker includes a rack housing with an integrated sorting system. The rack housing includes storage units configured to receive and store die carriers having different physical configurations. A transport system transports a first die carrier and a second die carrier between a first plurality of storage units and a first sorter load port, wherein the transport system introduces the first die carrier and the second die carrier into the first sorter. The transport system transports a third die carrier and a fourth die carrier between a second plurality of storage units and a second sorter load port, wherein the transport system introduces the third die carrier and the fourth die carrier into the second sorter. The first die carrier and the second die carrier have a first physical configuration, and the third die carrier and the fourth die carrier have a second physical configuration different from the first physical configuration.

Description

Technical Field

[0001] Embodiments of the present invention relate to a die stocker, a method for storing a die carrier, and a semiconductor die manufacturing system. Background Art

[0002] Semiconductor manufacturing processes, such as very-large-scale integration (VLSI), create integrated circuits by forming a network of transistors and other circuit components on a single chip, often called a die. Several dies may be formed on a single wafer, or the dies may be processed individually after being cut from the wafer. Due to the number of circuit components included in modern integrated circuits, the manufacturing process has become increasingly complex. The dies (whether formed as part of a wafer or cut from a wafer) are transported to various different processing chambers, processing tools, and fabrication rooms to undergo a series of processing operations. Summary of the invention

[0003] An embodiment of the present invention provides a die stocker, comprising: a rack housing and a sorting system. The rack housing comprises: a first plurality of storage units, a second plurality of storage units, a loading port, and a transportation system. The first plurality of storage units are configured to receive and store a first die carrier and a second die carrier having a first physical configuration. The second plurality of storage units are configured to receive and store a third die carrier and a fourth die carrier having a second physical configuration, wherein the first physical configuration of the first die carrier and the second die carrier is different from the second physical configuration of the third die carrier and the fourth die carrier. The loading port, through which the first die carrier, the second die carrier, the third die carrier, and the fourth die carrier are introduced into the interior of the rack housing. The transportation system is used to transport the first die carrier and the second die carrier between the loading port and the first plurality of storage units in the rack housing, and to transport the third die carrier and the fourth die carrier between the loading port and the second plurality of storage units in the rack housing. The sorting system comprises: a first sorter and a second sorter. The first sorter receives the first die carrier and the second die carrier from the transport system of the rack housing and transfers the first semiconductor die between the first die carrier and the second die carrier. The second sorter receives the third die carrier and the fourth die carrier from the transport system of the rack housing and transfers the second semiconductor die between the third die carrier and the fourth die carrier.

[0004] An embodiment of the present invention provides a method for storing a first die carrier and a second die carrier having a first physical configuration and a third die carrier and a fourth die carrier having a second physical configuration different from the first physical configuration, the method comprising: receiving first data indicating that the first die carrier and the second die carrier are to be stored by a die stocker; based on the first data, controlling the operation of a transport system to transport the first die carrier and the second die carrier between a loading port and a first storage unit of a rack housing, the first die carrier and the second die carrier being introduced into the rack housing of the die stocker through the loading port, the first storage unit being configured to receive and store the first die carrier and the second die carrier; receiving second data indicating that the third die carrier and the fourth die carrier are to be stored by the die stocker; based on the second data, controlling the operation of the transport system to transport the third die carrier and the fourth die carrier between the loading port and the second storage unit of the die stocker, the third die carrier and the fourth die carrier The semiconductor die carrier is introduced into the rack housing through the loading port, and the second storage unit is configured to receive and store the third die carrier and the fourth die carrier; in response to receiving an instruction to transfer the first semiconductor die from the first die carrier to the second die carrier, the transportation system is controlled to transport the first die carrier and the second die carrier from the first storage unit to the first sorter loading port of the rack housing, and the first die carrier and the second die carrier are delivered to the first sorter that transfers the first semiconductor die between the first die carrier and the second die carrier through the first sorter loading port; and in response to receiving an instruction to transfer the second semiconductor die from the third die carrier to the fourth die carrier, the transportation system is controlled to transport the third die carrier and the fourth die carrier from the second storage unit to the second sorter loading port of the rack housing, and the third die carrier and the fourth die carrier are delivered to the second sorter that transfers the second semiconductor die between the third die carrier and the fourth die carrier through the second sorter loading port.

[0005] An embodiment of the present invention provides a semiconductor die manufacturing system, comprising: a tray box, a boat tray, a rack housing, an overhead elevator conveying system, a first sorter, and a second sorter. The tray box stores a first tray and a second tray, the second tray is stacked on top of the first tray and supported by the first tray in the tray box. The boat tray stores a first boat and a second boat, the first boat is supported in the boat tray box by a first flange, and the second boat is supported in the boat tray box by a second flange, vertically located above the first boat and spaced apart from the first boat in the boat tray box. The rack housing comprises: a plurality of storage units, receiving and storing tray boxes and boat trays; a loading port, through which the tray box and the boat tray are introduced into the interior of the rack housing; and a transport system, for transporting the tray box and the boat tray in the rack housing between the loading port and the storage unit. The overhead elevator conveying system delivers the tray box and the boat tray to the loading port of the rack housing. The first sorter receives the tray box and transmits the first tray or the second tray between the tray boxes. The second sorter receives the boat magazines and transfers the first boat or the second boat between the boat magazines. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] When read in conjunction with the accompanying drawings, the various aspects of the present disclosure are best understood from the following detailed description. It should be noted that, in accordance with standard practice in the industry, various features are not drawn to scale. In fact, the size of the various features may be arbitrarily increased or reduced for clarity of discussion.

[0007] Figure 1 A manufacturing system including a die stocker (including integrated sorter functionality) and an overhead lift transport system is shown in accordance with some embodiments.

[0008] Figure 2 is a top view of a die stocker with integrated sorter functionality according to some embodiments.

[0009] Figure 2A For along Figure 2 A cross-sectional view of the loading port of the rack housing taken along line 2A-2A in FIG.

[0010] Figure 3 is a perspective view of a pallet cassette and a coupler cooperating with a head of the pallet cassette according to some embodiments.

[0011] Figure 4 is a bottom view of a tray cassette including a base cooperating with a set of tapered surfaces of a guide to maintain the tray cassette in place while coupled to a sorter according to some embodiments.

[0012] Figure 5is a perspective view of a boat magazine and a coupler cooperating with a head of the boat magazine according to some embodiments.

[0013] Figure 6 is a bottom view of a boat including a kinematic coupling base cooperating with a kinematic coupling interface of a guide to maintain the boat in place while coupled to a sorter according to some embodiments.

[0014] Figure 7 is a top view of a tray supporting a plurality of semiconductor dies according to some embodiments.

[0015] Figure 8 is a top view of a boat supporting a plurality of semiconductor dies in accordance with some embodiments.

[0016] Fig. 9A is a perspective view of a guide for a sorter including a kinematic coupling interface according to some embodiments.

[0017] Fig. 9B is a side view of a motion coupling interface cooperating with a boat supported by a guide according to some embodiments.

[0018] Fig. 10A is a top view of a guide for a sorter according to some embodiments, the guide including a tapered guide pin interface.

[0019] Fig. 10B A side view of a base of a die carrier positioned for transfer of the die carrier through a tapered guide pin interface according to some embodiments.

[0020] Fig.11 A flow chart schematically depicts a method of controlling transfer of semiconductor dies between die carriers in accordance with some embodiments.

[0021] Fig.12 An example computer-readable medium is shown which may include processor-executable instructions configured to embody one or more of the provisions set forth herein in accordance with some embodiments.

[0022] Fig.13 An example computing environment is shown in accordance with some embodiments in which one or more of the provisions set forth herein may be implemented. DETAILED DESCRIPTION

[0023] The following disclosure provides many different embodiments or examples for implementing the different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are only examples and are not intended to be limiting. For example, in the following description, a first feature is formed on or on a second feature, which may include an embodiment in which the first feature is formed in direct contact with the second feature, and may also include an embodiment in which an additional feature may be formed between the first feature and the second feature, so that the first feature and the second feature may not be in direct contact. In addition, the present disclosure may repeat figure numerals and / or letters in various examples. This repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments or configurations discussed.

[0024] Additionally, for ease of description, spatially relative terms, such as "under," "beneath," "lower," "over," "upper," and the like, may be used herein to describe the relationship of one element or feature to another element or feature as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein should likewise be interpreted accordingly.

[0025] During electronic circuit manufacturing, more time is required to complete complex processing operations than simple processing operations, resulting in bottlenecks in performing complex processing operations. The progression of semiconductor die through the manufacturing process is also interrupted intentionally (e.g., when an insufficient number of process tools are available, etc.) and unintentionally (e.g., due to unexpected problems that arise during manufacturing, etc.). As a result, a backlog of semiconductor die accumulates at various points during the manufacturing process. In some embodiments, to prevent the introduction of contaminants into stationary integrated circuits, for example, semiconductor die are stored as "workpieces in process" in a controlled environment within a rack enclosure of a die stocker between processing operations.

[0026] Complex manufacturing systems employ multiple different die carriers having different physical configurations to carry semiconductor die between processing equipment at different locations within a manufacturing process. Some embodiments of different die carriers include, but are not limited to, tray cassettes and boat magazines. An example of a difference between a tray cassette and a boat magazine is that the base portions of the die carriers are different. In some embodiments, one of the die carriers includes a base portion that cooperates with a kinematic coupling guide provided to a first die sorter, and the other die carrier includes a base portion that cooperates with a tapered guide provided to a second die sorter.

[0027] Another example of the difference between the die carriers is the structure of each die carrier supporting the tray and boat that carry the semiconductor die. According to some embodiments, the trays are stacked in the interior of the tray box so that the first tray is vertically arranged above the second lower tray and rests on the top of the second lower tray. In some embodiments, the boat box includes one or more flanges that vertically support the first boat alone above the second lower boat and are spaced apart from the second lower boat. In other words, in some embodiments, the lower tray in the tray box supports the weight of the tray resting on the top of the lower tray, while the lower boat contained by the boat box does not support the boat vertically arranged above the lower boat. In fact, in some embodiments, the boats are vertically spaced apart from each other in the library.

[0028] In order to accommodate different die carriers and prevent contaminants from being introduced into stationary semiconductor dies between manufacturing processes, for example, in some embodiments, a die stocker, method, and system include a rack housing for receiving and temporarily storing a plurality of different die carriers containing semiconductor dies. The die stocker includes a plurality of different storage units. According to some embodiments, at least a first storage unit is configured to receive and support a first die carrier, and at least a second storage unit is configured to receive and support a second die carrier having a different physical configuration from the first die carrier.

[0029] According to some embodiments, an integrated sorting system gives the rack housing a die transfer functionality for transporting semiconductor dies between two die carriers. In some embodiments, the sorting system includes a separate sorter integrated as part of the rack housing for different physical configurations of the die carriers stored by the rack housing. For example, according to some embodiments, a first sorter is set to the rack housing to transfer semiconductor dies between a plurality of tray boxes. For example, according to some embodiments, a second sorter is set to the rack housing to transfer semiconductor dies between a plurality of boat boxes. In some embodiments, by integrating the sorting system as part of the rack housing of the die stocker, the semiconductor dies are transferred between the die carriers by the sorting system without being transported to a separate independent sorter by a transport device external to at least one of the die stocker or the rack system.

[0030] Refer to the figures, Figure 1A manufacturing system including a die stocker 100 (including integrated sorter functionality) and an overhead elevator transport system 102 is shown according to some embodiments. In some embodiments, the overhead elevator transport system 102 includes one or more transport vehicles 104 that travel along a track 106. In some embodiments, the track 106 is suspended from and extends along a ceiling or other overhead structure of a manufacturing facility in which semiconductor dies are processed. In some embodiments, the transport vehicle 104 cooperates with a die carrier 108 to carry or otherwise transport the die carrier 108 between various workstations and processing machines.

[0031] In some embodiments, the track 106 defines a path for the transport vehicle 104 to travel in the direction of arrow 107 from a starting point for removing the die carrier 108 to a destination for depositing the die carrier 108. According to some embodiments, the transport vehicle 104 includes a motor drive that drives wheels, gears or other drive components to move the transport vehicle 104 along the track 106. According to some embodiments, the transport vehicle 104 lacks drive components, and instead the transport vehicle 104 includes a latching link that couples the transport vehicle 104 to a drive system provided to or in the track 106. For example, the drive system provided to or in the track 106 includes, but is not limited to, a drive chain that cooperates with a drive gear to move the drive chain along the track 106. In some embodiments, a hook provided to the transport vehicle 104 can engage the drive chain so that the transport vehicle 104 moves along the track 106 together with the chain.

[0032] According to some embodiments, the drive system provided to the track 106 includes an array of electromagnets that generate a magnetic field when energized by an electric current. In some embodiments, fixed magnets provided to the transport vehicle 104 are repelled away from the generated magnetic field, causing the transport vehicle 104 to travel along the track 106. The above examples of drive systems for moving the transport vehicle 104 along the track 106 are only some examples and are not an exhaustive list of suitable drive systems.

[0033] In some embodiments, the transport vehicle 104 comprises a lift 110 configured to change the height of the die carrier 108 being transported in the direction of arrow 114. In some embodiments, the lift 110 comprises a connector that cooperates with a head 112 provided to the die carrier 108 to couple the die carrier 108 to the transport vehicle 104. According to some embodiments, the lift 110 comprises a motor-driven winch that unwinds a cable or cables to lower the die carrier 108 and winds cables to raise the die carrier 108 toward the transport vehicle 104.

[0034] In some embodiments, to deliver a die carrier 108 to the die stocker 100, the transport vehicle 104 travels along the track 106 to a shelf 202 ( Figure 2 ), the die carriers 108 are to be introduced into the rack housing 116 of the die stocker 100 through the load port 204. In some embodiments utilizing a winch elevator 110 having one or more cables, for example, the elevator 110 is activated to unwind the cables, thereby lowering the die carriers 108 onto the shelf 202 of the load port 204.

[0035] Some embodiments of the die stocker 100 include a rack housing 116 for storing die carriers 108 having a plurality of different physical configurations. In some embodiments, the rack housing 116 includes at least one or more first storage units 206 ( Figure 2 ), the first storage unit 206 is configured to receive and store one or more first die carriers having a first physical configuration. According to some embodiments, the first storage unit 206 is configured to receive and store the die carriers 108 in the form of a tray box 300, hereinafter referred to as Figure 3 and Figure 4 According to some embodiments, the first storage unit 206 is configured to receive and store die carriers 108 in the form of boats 500, hereinafter referred to as Figure 5 and Figure 6 In some embodiments, the first storage unit 206 is configured specifically for one of the tray cassette 300 or the boat cassette 500 and is incompatible with another type of die carrier 108 .

[0036] Some embodiments of the rack housing 116 include at least one or more second storage units 208 ( Figure 2 ), the second storage unit 208 is configured to receive and store one or more second die carriers having a second physical configuration. The first physical configuration of the first die carrier is different from the second physical configuration of the second die carrier. For example, the first die carrier can be a tray box 300, which has a different physical configuration than the boat box 500 as the second die carrier.

[0037] Figure 3 300 according to some embodiments. In some embodiments, the tray box 300 is configured to receive a plurality of trays 700, examples of which are shown in FIG. Figure 7 In some embodiments, in the tray box 300, the tray 700 at the bottom of the stack is provided with a set of flanges 308 ( Figure 3 and Figure 4) and the set of flanges 308 extend inwardly into an aperture 310 defined by the side surfaces 312 and the top surface 304 of the tray box 300. In some embodiments, a second tray included in the stack is vertically placed on top of the tray 700 at the bottom of the stack and supported by the tray 700 at the bottom of the stack. In some embodiments, an additional tray 700 included in the stack is similarly supported on top of the second tray, thereby resting on top of the second tray. In some embodiments, the trays 700 included in the stack supported within the tray box 300 are arranged in vertical alignment, but are not spaced apart from the immediately underlying tray 700. In fact, in some embodiments, the trays 700 in the stack rest on and are supported by the underlying tray 700.

[0038] Figure 5 FIG. 5 is a perspective view of a boat magazine 500 according to some embodiments. In some embodiments, the boat magazine 500 is configured to receive a plurality of boats 800, examples of which are shown in FIG. Figure 8 In some embodiments, in the boat tray 500, the lateral edge 802 ( Figure 8 ) are received in holes 502 formed in lateral sidewalls 504 of the boat magazine 500. According to some embodiments, the holes 502 extend longitudinally along a substantial extent of the sidewalls 504, and opposing pairs of holes 502 are formed at a plurality of different vertical heights along the sidewalls 504. In some embodiments, since the boats 800 are received in separate sets of holes 502 at different vertical heights within the boat magazine 500, one boat 800 in the boat magazine 500 does not support the weight of a second boat 800 in the boat magazine 500. In fact, in some embodiments, a plurality of boat magazines 500 are independently supported by flanges 501 defining the bottom perimeters of the holes 502 formed in the sidewalls 504. Thus, in some embodiments, the boats 800 in the boat magazine 500 are vertically arranged above each other and spaced apart from each other within the boat magazine 500. Thus, in some embodiments, boats 800 that are immediately adjacent to each other are stored without contacting each other.

[0039] For the sake of brevity and clarity, from now on, the tray box 300 is used as an example of a first die carrier having a first physical configuration, and the boat cassette 500 is used as an example of a second die carrier having a second different physical configuration. The die carrier including the tray box 300 and the boat cassette 500 is generally referred to as the die carrier 108 in this article. However, it should be understood that the present disclosure is not so limited. The die carrier 108 having a physical configuration different from the tray box 300 and the boat cassette 500 is also covered by the term first die carrier and second die carrier and the general reference to the die carrier 108.

[0040] In some embodiments, for example, the first storage unit 206 is arranged in an array of rows and columns, for example, or any other defined arrangement. Similarly, in some embodiments, for example, the second storage unit 208 is arranged in an array of rows and columns, for example, or any other defined arrangement. In some embodiments, for example, arranging the first storage unit 206 and the second storage unit 208 in an array allows mapping and determining the location of each individual unit included in at least one of the first storage unit 206 or the second storage unit 208 using addresses that specify rows and columns that intersect at the individual units.

[0041] The first storage unit 206 and the second storage unit 208 are Figure 2 108 as a block including storage cells for receiving and storing cells of a die carrier 108 having one physical configuration. However, some embodiments of the rack housing 116 include the first storage cells 206 and the second storage cells 208 in an alternating or random arrangement. Therefore, it is not necessary to arrange the first storage cells 206 and the second storage cells 208 into separate distinct groups.

[0042] According to some embodiments, the first storage unit 206 and the second storage unit 208 are arranged in the aisle 118 ( Figure 1 ). In some embodiments, the transport system 120 is disposed in the aisle 118 for transporting the tray box 300 between the load port 204 and the first storage unit 206 within the rack housing 116. According to some embodiments, the transport system 120 transports the boat 500 between the load port 204 and the second storage unit 208 within the rack housing.

[0043] In some embodiments, arranging the first storage unit 206 and the second storage unit 208 on opposite sides of the aisle 118 allows the transport system 120 to access and transport the tray boxes 300 and the boat boxes 500 stored by the first storage unit 206 and the second storage unit 208 on both sides of the aisle 118, respectively. According to some embodiments, the first storage unit 206 and the second storage unit 208 are arranged on a single side of the aisle 118 or in a non-linear arrangement.

[0044] Some embodiments of the transport system 120 include a connector 302 ( Figure 3 and Figure 5 ) arms 122. In some embodiments, cooperation between the connector 302 and the head 112 couples the die carrier 108 to the transport system 120 for delivery to one of the first storage units 206 or one of the second storage units 208, depending on the physical configuration of the die carrier 108. For example, Figure 3As shown in FIG. 3 , the head 112 of the tray box 300 protrudes in an upward direction, generally away from the top surface 304 of the tray box 300. According to some embodiments, and as shown in FIG. Figure 3 , the coupler 302 includes a fork having spaced apart tines 306. In some embodiments, the position of the adjustment arm 122 is such that the tines 306 extend into the space between the head 112 and the top surface 304 of the tray box 300, thereby allowing the transport system 120 to remove the tray box 300 from the shelf 202 of the load port 204.

[0045] Some embodiments of the transport system 120 include a track 210, Figure 2 As shown in dashed lines in FIG. 2 , the arm 122 of the transport system 120 can travel along the track 210 to access at least one of the first storage unit 206 or the second storage unit 208. In some embodiments, the arm drive 124 ( Figure 1 ) is operable to move the arm 122 along the length of the track 210. According to some embodiments, the arm drive 124 includes a stepper motor disposed at the base of the arm 122. In some embodiments, the stepper motor is operable to rotate the drive shaft a defined number of rotations to move the arm 122 a known distance along the track 210. In some embodiments, the arm drive 124 includes an electromagnetic drive system, a hydraulic actuator, a pneumatic actuator, or the like to move the arm 122 a known distance along the track 210.

[0046] refer to Figure 2 and Figure 2AIn some embodiments, the load port 204 includes a frame 205 defining an aperture through which the die carrier 108 is introduced into the interior of the rack housing 116. According to some embodiments, a door 207 closes the aperture defined by the frame 205 to interfere with the entry of potential contaminants into the rack housing 116. Some embodiments of the shelf 202 support a first load port guide 211 and a second load port guide 215. In some embodiments, the first load port guide 211 and the second load port guide 215 are configured to cooperate with portions of the die carrier 108 delivered to the load port 204 by the overhead lift conveyor system 102. Similar to the first guide 220, the second guide 222, the third guide 226, or the fourth guide 228, some embodiments of the first load port guide 211 and the second load port guide 215 maintain the die carrier 108 in a defined position relative to the load port 204. In some embodiments, maintaining the die carrier 108 delivered to the load port 204 in a defined position allows the transport system 120 to position the die carrier 108 and cooperate with the die carrier 108 to transport the die carrier 108 between the load port 204 and the first storage unit 206 or the second storage unit 208, as described herein. In some embodiments, the first load port guide 211 and the second load port guide 215 are independently selected to include the kinematic coupling interface 902 ( Fig. 9A and Fig. 9B ) or tapered guide interface 1004 ( Fig. 10A ). According to some embodiments, the configuration of the first load port guide 211 is different from the configuration of the second load port guide 215 to cooperate with a die carrier 108 different from the second load port guide 215. According to some embodiments, the coupler 302 disposed adjacent the distal end of the arm 122 cooperates with the head 112 of the die carrier 108 deposited onto the shelf 202 to couple the die carrier 108 to the transport system 120. In some embodiments, the transport system 120 is operable to transport the die carrier 108 between the shelf and one of the first storage units 206 or one of the second storage units 208, depending on the physical configuration of the die carrier 108.

[0047] According to some embodiments, the die stocker 100 includes a sorting system 126, such as Figure 1 and Figure 2. Some embodiments of the sorting system 126 include a first sorter 212 and a second sorter 214. In some embodiments, the first sorter load port 216 extends between the interior of the rack housing 116 and the first sorter 212, thereby defining an aperture through which the die carriers 108 are delivered to the first sorter 212 by the transport system 120. In some embodiments, the transport system 120 delivers the die carriers 108 to the first sorter 212 through the first sorter load port 216. Thus, a plurality of die carriers 108 are delivered to the first sorter 212 by the transport system 120, which also transports the die carriers 108 between the load port 204 and the first storage unit 206 and the second storage unit 208, thereby integrating the sorting function as part of the rack housing 116 and allowing semiconductor dies to be transferred between the die carriers 108 at the rack housing 116, as described herein. In some embodiments, a separate transport device external to the rack housing 116 is not required to transport the die carriers 108 to a separate sorting system for removal from the rack housing 116 .

[0048] Some embodiments of the sorting system 126 include a second sorter load port 218 extending between the interior of the rack housing 116 and the second sorter 214. In some embodiments, the second sorter load port 218 includes a frame defining an aperture through which the die carriers 108 can be delivered to the second sorter 214 by the transport system 120. In some embodiments, the second sorter load port 218 enables a plurality of die carriers 108 to be delivered to the second sorter 214 by the transport system 120, which transports the die carriers 108 between the load port 204 and the first storage unit 206 and the second storage unit 208, thereby integrating the sorting functionality as part of the rack housing 116. In some embodiments, a separate transport device external to the rack housing 116 is not required to transport the die carriers 108 to a separate sorting system removed from the rack housing 116.

[0049] like Figure 2As shown in , some embodiments of the first sorter 212 include a first guide 220 and a second guide 222 disposed adjacent to the first sorter load port 216. In some embodiments, the first guide 220 and the second guide 222 cooperate with portions of the die carrier 108 delivered to the first sorter 212 by the transport system 120 to maintain the die carrier 108 in a defined position relative to the first sorter 212. For example, in some embodiments, cooperation between the first guide 220 and the first tray cassette and between the second guide 222 and the second tray cassette maintains the orientation of the first tray cassette and the second tray cassette relative to the first sorter 212 so that the conveyor 224 of the first sorter 212 can transfer one or more semiconductor dies between the tray cassettes 300 delivered to the first sorter 212.

[0050] Similar to the first sorter 212, in some embodiments, the second sorter 214 includes a third guide 226 and a fourth guide 228 disposed adjacent to the second sorter load port 218. In some embodiments, the third guide 226 and the fourth guide 228 cooperate with portions of the die carrier 108 delivered to the second sorter 214 via the second sorter load port 218 by the transport system 120 to maintain the die carrier 108 in a defined position relative to the second sorter 214. For example, in some embodiments, cooperation between the third guide 226 and the first boat and between the fourth guide 228 and the second boat maintains the orientation of the first boat and the second boat relative to the second sorter 214 so that the conveyor 230 can transfer one or more semiconductor dies between the boats 500 delivered to the second sorter 214.

[0051] According to some embodiments, the first guide 220, the second guide 222, the third guide 226, and the fourth guide 228 each include an interface that cooperates with a base of a die carrier 108 to establish a position of the die carrier suitable for transferring one or more semiconductor dies, as described below. Some embodiments of the first guide 220 and the second guide 222 include the same interface, the first guide 220 and the second guide 222 are specifically configured for receiving the same die carrier 108, such as a tray box 300 or a boat 500. Some embodiments of the third guide 226 and the fourth guide 228 include the same interface, the third guide 226 and the fourth guide 228 are specifically configured for receiving the same die carrier 108, such as a tray box 300 or a boat 500. In some embodiments, the interface of the first guide 220 and the second guide 222 is different from the interface of the third guide 226 and the fourth guide 228.

[0052] In some embodiments, the interface of at least one of the first guide 220, the second guide 222, the third guide 226, or the fourth guide 228 includes a motion coupling interface 902. For example, Fig. 9A A perspective view of an embodiment of a guide 900 showing a first guide 220 and a second guide 222 including a kinematic coupling interface 902 according to some embodiments is shown. In some embodiments, the guide 900 includes a plate 912 on which the die carrier 108 is to rest and the kinematic coupling interface 902. The kinematic coupling interface 902 includes a plurality of locating pins, such as a first locating pin 904, a second locating pin 906, and a third locating pin 908 that protrude outwardly from a top surface 910 of the plate 912 in an upward direction.

[0053] For example, an embodiment of the first locating pin 904 includes a cylindrical base area 914 protruding upward from the top surface 910, and a tapered area 916 extending upward from the cylindrical base area 914. The tapered area 916 forms a vertex 918 to give the first locating pin 904 a cross-section forming an inverted V shape. The second locating pin 906 and the third locating pin 908 of this embodiment have a similar physical configuration. For example, the second locating pin 906 and the third locating pin 908 include a cylindrical base area 920 protruding upward from the top surface 910, and a tapered area 922 extending upward from the cylindrical base area 920. The tapered area 922 forms a vertex 924, which gives the second locating pin 906 and the third locating pin 908 a cross-section forming an inverted V shape. However, the first locating pin 904, the second locating pin 906, and the third locating pin 908 may have different physical configurations and shapes without departing from the scope of the present disclosure.

[0054] like Fig. 9B As shown, for example, the kinematic coupling interface 902 and the kinematic coupling base 600 ( Figure 6 ) cooperate to establish a defined position of the die carrier 108 relative to the sorter provided with the kinematic coupling interface 902. Figure 6 An exemplary bottom view of an embodiment of a boat 500 including a kinematic coupling base 600 cooperating with a kinematic coupling interface 902 is shown. In some embodiments, the kinematic coupling base 600 includes a first recess 602, a second recess 604, and a third recess 606.

[0055] An example of the first recess 602 includes two inwardly protruding angled surfaces 608, 610 that extend in an upward direction toward the interior of the boat magazine 500, thereby forming a peak 612 where the angled surfaces 608, 610 intersect. Some embodiments of the peak 612 extend longitudinally in a direction parallel to the longitudinal axis or longest axis of the boat magazine 500. Embodiments of the second recess 604 and the third recess 606 each include an inwardly protruding angled surface 614, 616 that extend in an upward direction toward the interior of the boat magazine 500, thereby forming a peak 618 where the angled surfaces 614, 616 intersect. The peak 618 extends in a direction that is not parallel to the longitudinal axis of the boat magazine 500. For example, the peak 618 is oriented at an angle between fifteen (15°) and seventy-five (75°) degrees relative to the longitudinal axis of the boat 500 .

[0056] In some embodiments, the size and orientation of the first locating pin 904, the second locating pin 906, and the third locating pin 908 are complementary to the size and orientation of the first recess 602, the second recess 604, and the third recess 606, respectively. The cooperation between the kinematic coupling interface 902 and the kinematic coupling base 600 constrains the boat 500 to the appropriate position on the guide 900 relative to the corresponding sorter, thereby providing precision and certainty in the orientation of the boat 500 mounted on the sorter. For example, as Fig. 9B As shown in FIG. 1 , the first recess 602 receives a portion of the tapered region 916 of the first locating pin 904. The second recess 604 receives a portion of the tapered region 922 of the second locating pin 906, and the third recess 606 receives a portion of the tapered region 922 of the third locating pin 908 (not shown). Fig. 9B The cooperation between the inverted V-shape of the locating pins 904, 906, 908 and the inclined surfaces 608, 610, 614, 616 of the respective recesses 602, 604, 606 restricts at least two degrees of freedom of movement of the boat 500 relative to the sorter, thereby establishing a defined position of the boat 500 on the sorter for transfer of semiconductor dies.

[0057] According to some embodiments, the interface of at least one of the first guide 220, the second guide 222, the third guide 226, or the fourth guide 228 comprises a tapered guide interface 1004 ( Fig. 10A and Fig. 10B ). For example, Fig. 10AA top view of a guide 1000 showing a third guide 226 and a fourth guide 228 is shown according to some embodiments. In some embodiments, the guide 1000 includes a tray box 300 (by Fig. 10A The dotted line in FIG. 4 indicates that the base 400 is shown in FIG. Fig. 10B 100 and a tapered guide interface 1004. In some embodiments, the tapered guide interface 1004 includes a set of tapered surfaces 1006 that, when contacted by the base 400 of the tray cassette 300, push the tray cassette 300 into a desired orientation on the guide 1000 to establish a defined position of the tray cassette 300 relative to the corresponding sorter.

[0058] According to some embodiments, the tray box 300 includes a base 400 having a different physical configuration than the kinematic coupling base 600 described above. For example, Figure 4 According to some embodiments Figure 3 31. The base 400 of the tray box 300 is formed adjacent the bottom of the side surface 312. In some embodiments, the base 400 does not include the first recess 602, the second recess 604, or the third recess 606 of the kinematic coupling base 600. In fact, in some embodiments, the base 400 is a rectangular base having four corners 402 defining a rectangular footprint.

[0059] According to some embodiments, the base 400 includes a plurality of brackets 1012. Each of the brackets 1012 includes an inclined portion 1014 that projects outwardly, generally away from the interior of the tray box 300. Fig. 10A ) is arranged on the side of the base 400. For example, the inclined portion 1014 set to a given corner 1016 extends along the area of ​​the base 400 to form a right angle at the given corner 1016.

[0060] for Fig. 10B In the embodiment of the guide 1000 shown in FIG. 1 , the tapered surface 1006 is formed as a conical protrusion 1008 protruding upward from a cylindrical region 1018 that extends upward away from the top surface 1010 of the plate 1002. The plurality of conical protrusions 1008 are arranged to engage the inclined portions 1014 of the brackets 1012 provided to the four corners 402 of the base 400 when the tray box 300 is properly positioned. The conical protrusions 1008 of some embodiments are arranged to cooperate with the plurality of corners 1016 of the die carrier 108, such as Fig. 10A , or arranged to cooperate with the inclined portion 1014 of the bracket 1012, as shown in Fig. 10B. As the die carrier 108 is lowered into position on the guide 1000, portions of the die carrier 108 (e.g., corners 1016 or angled portions 1014 of the brackets 1012) slide along the tapered surfaces 1006, thereby establishing a defined position of the die carrier 108 on the guide 1000 for transfer of semiconductor dies as described below. The cooperation between the portions of the die carrier 108 and the tapered surfaces 1006 of the tapered protrusions 1008 disposed around the opposing surfaces of the die carrier 108 positions the die carrier 108 predictably on the guide 1000.

[0061] According to some embodiments, the conveyor 224 of the first sorter 212 includes a shuttle 232. Figure 2 When the shuttle 232 is at position A in the sorter, the shuttle 232 retrieves one or more semiconductor dies from the supply tray box 300 mounted at an orientation defined relative to the sorter by the first guide 220. In some embodiments, for example, once one or more semiconductor dies have been retrieved from the supply tray box 300, the shuttle 232 travels from position A to position B and continues to position C along the shuttle track 234 by operation of a stepper motor or other actuator.

[0062] In some embodiments, at position C, the shuttle 232 is disposed adjacent to the recipient tray cassette 300 mounted on the second guide 222. In some embodiments, the second guide 222 maintains the recipient tray cassette 300 in an orientation suitable for receiving one or more semiconductor dies transferred from the supplier tray cassette 300 mounted on the first guide 220. In some embodiments, the shuttle 232 delivers the one or more semiconductor dies retrieved from the supplier tray cassette 300 to the recipient tray cassette 300.

[0063] In some embodiments, the second sorter 214 is similar in construction and operation to the first sorter 212. In some embodiments, the conveyor 230 includes a shuttle 236 that, when in Figure 2 226, the shuttle 236 retrieves one or more semiconductor dies from the supply ark tray 500 mounted on the third guide 226. In some embodiments, for example, once one or more semiconductor dies have been retrieved from the supply ark tray 500, the shuttle 236 travels from position X to position Y and continues to position Z along the shuttle track 238 by operation of a stepper motor or other actuator.

[0064] In some embodiments, at position C, the shuttle 236 is disposed adjacent to the accept ark cartridge 500 mounted on the fourth guide 228. The fourth guide 228 maintains the accept ark cartridge 500 in an orientation suitable for receiving one or more semiconductor dies transferred from the supply ark cartridge 500 mounted on the third guide 226. In some embodiments, the shuttle 236 delivers one or more semiconductor dies retrieved from the supply ark cartridge 500 to the accept ark cartridge 500.

[0065] According to some embodiments, a single semiconductor die is transferred between die carriers 108. However, for other embodiments, multiple semiconductor dies are transferred in one transfer operation. Figure 7 A top view of a tray 700 supporting a plurality of semiconductor die 702 is shown in accordance with some embodiments. In some embodiments, the tray box 300 stores a plurality of trays 700 stacked on top of each other, as described above, and a protective cover 704 is provided to protect the semiconductor die 702 from physical damage and debris. In some embodiments, for example, the protective cover 704 is removed to reveal one or more of the semiconductor die 702, for example, arranged in Figure 7 700. In some embodiments, tray 700 includes a frame 706 that defines a plurality of pockets 708 that individually support a plurality of semiconductor die 702.

[0066] According to some embodiments, the tray 700 is marked with a computer readable code. A two-dimensional barcode 710 is Figure 7 710 is shown as an example of a computer readable code, but the present disclosure is not so limited. Other computer readable codes such as radio-frequency identification (RFID) tags and other such data storage technologies are also included within the scope of the present disclosure. However, for the sake of brevity and clarity, bar code 710 is shown and described for illustrative purposes.

[0067] Some embodiments of barcode 710 store or reference information related to semiconductor die 702 carried by tray 700. For example, barcode 710 stores or references information identifying the progress made in the manufacturing process, one or more previous processes completed, one or more future processes to be completed, a serial number, a lot number, the type of circuit being manufactured, the application for which the semiconductor die is to be mounted, the customer, any other information related to the manufacturing process, or any combination thereof.

[0068] Figure 8A top view of a boat 800 including a frame 804 defining a plurality of receptacles 806 that individually support different semiconductor dies 808 is shown in accordance with some embodiments. In some embodiments, the semiconductor dies 808 are not covered by a protective cover because the boat 800 is individually supported in the holes 502 of the boat magazine 500, rather than resting on an underlying boat.

[0069] According to some embodiments, the boat 800 is marked with a computer readable code, similar to the tray 700 discussed above. For example, a bar code 810, such as a two-dimensional bar code 810, is marked on the Figure 8 810 is shown as an example of a computer readable code, but again the present disclosure is not so limited. Other computer readable codes such as RFID tags and other such data storage technologies are also included in the scope of the present disclosure. However, for the sake of brevity and clarity, bar code 810 is shown and described for illustrative purposes.

[0070] Similar to the barcode 710 described above, some embodiments of the barcode 810 store or reference information related to the semiconductor die 808 carried by the boat 800. For example, the barcode 810 stores or references information identifying the progress made in the manufacturing process, the position of the corresponding semiconductor die after transfer between die carriers 108, one or more previous processes completed, one or more future processes to be completed, a serial number, a lot number, the type of circuit being manufactured, the application to which the semiconductor die is to be mounted, the customer, any other information related to the manufacturing process, or any combination thereof.

[0071] Reference again Figure 1 , some embodiments of the sorting system 126 include a scanner 132. In some embodiments, the scanner 132 is operable to interrogate a computer readable code accompanying a transmitted semiconductor die, as described herein. For example, in some embodiments, to interrogate an RFID tag, the scanner 132 includes a signal generator that generates an excitation signal to energize an antenna provided to the RFID tag. In some embodiments, the scanner 132 includes a receiver that detects a wireless signal transmitted by the antenna of the RFID tag in response to being energized by the excitation signal.

[0072] According to some embodiments, the scanner 132 is configured as a barcode reader, such as Figure 1. In some embodiments, for example, the barcode reader includes an optical image capture device 134, such as a complementary metal oxide semiconductor (CMOS) or a charge-coupled device (CCD) sensor. In some embodiments, the optical image capture device 134 optically captures an image of a barcode (e.g., barcode 710 or barcode 810) during a process of transferring semiconductor dies between die carriers 108.

[0073] In some embodiments, in response to interrogating the computer readable code, the scanner 132 transmits a signal to a control circuit 136 in communication with the scanner 132. In some embodiments, the control circuit 136 modifies a record maintained in the database 138 as a result of the interrogation of the computer readable code by the scanner 132. In some embodiments, the modified record indicates that the corresponding semiconductor die has been transferred between die carriers 108 or other states related to the manufacturing process.

[0074] In some embodiments, after one or more semiconductor dies have been retrieved from the supplier pallet cassette 300, the transport system 120 returns the supplier pallet cassette 300 to one of the first storage unit 206 or the second storage unit 208. In some embodiments, after one or more semiconductor dies have been delivered to the recipient pallet cassette 300, the transport system 120 returns the recipient pallet cassette 300 to one of the first storage unit 206 or the second storage unit 208. In some embodiments, from the first storage unit 206 or the second storage unit 208, the transport system 120 is controlled to return the recipient pallet cassette 300 to the load port 204, from which the overhead lift conveyor system 102 receives the recipient pallet cassette 300 and transports the recipient pallet cassette 300 to a subsequent processing location.

[0075] In some embodiments, after one or more semiconductor dies have been retrieved from the donor ark cassette 500, the transport system 120 returns the donor ark cassette 500 to one of the first storage unit 206 or the second storage unit 208. In some embodiments, after one or more semiconductor dies have been delivered to the recipient ark cassette 500, the transport system 120 returns the recipient ark cassette 500 to one of the first storage unit 206 or the second storage unit 208. In some embodiments, from the first storage unit 206 or the second storage unit 208, the transport system 120 is controlled to return the recipient ark cassette 500 to the load port 204, from which the overhead lift transfer system 102 receives the recipient ark cassette 500 and transports the recipient ark cassette 500 to a subsequent processing location.

[0076] A method of storing and transferring semiconductor dies between die carriers according to some embodiments is schematically depicted in Fig.11 . In some embodiments, first data indicating that the first die carrier and the second die carrier are to be stored by the die stocker 100 is received at action 1102. In some embodiments, the first data is received over a communication network that connects the control circuit 136 to a remote terminal. According to some embodiments, the first data is received as part of an automatic transmission in response to the occurrence of an event during a manufacturing process. For example, according to some embodiments, the first die carrier and the second die carrier are delivered by an overhead lift conveyor system 102 so that the first data is received. In some embodiments, the first data identifies the first die carrier and the second die carrier to allow the control circuit to determine whether to transport the first die carrier and the second die carrier to the first storage unit 206 or the second storage unit 208 according to some embodiments.

[0077] In some embodiments, based on the received first data, Fig.11 At action 1104 in the process, the control circuit 136 controls the operation of the transport system 120 to transport the first die carrier and the second die carrier between the load port 204 through which the first die carrier and the second die carrier are introduced into the die stocker 100 and the first storage unit 206 of the die stocker 100. For example, based on the first data, the control circuit 136 may determine that the first die carrier and the second die carrier are tray boxes 300 and are therefore to be transported and stored in the first storage unit 206, which is configured to receive and store tray boxes 300. From now on, the process is described with the understanding that the first die carrier and the second die carrier are tray boxes 300.

[0078] In some embodiments, second data indicating that the third die carrier and the fourth die carrier are to be stored by the die stocker 100 is received by the control circuit 136 at action 1106. According to some embodiments, the third die carrier and the fourth die carrier are boats 500 having a different physical configuration than the tray box 300 transported and stored in the first storage unit 206. From now on, the process is described with the understanding that the third die carrier and the fourth die carrier are boats 500.

[0079] In some embodiments, based on the second data, at action 1108, operation of the transport system 120 is controlled to transport the boat 500 between the load port 204 through which the boat 500 is introduced into the die stocker 100 and a second storage unit 208 of the die stocker 100 configured to receive and store the boat 500. According to some embodiments, the first storage unit 206 that receives and stores the tray box 300 is incompatible with the boat 500.

[0080] In some embodiments, an instruction is then received by the control circuit 136 indicating that a first semiconductor die or tray of semiconductor dies is to be transferred from one of the tray cassettes 300 to another tray cassette 300. In some embodiments, in response to receiving this instruction, at action 1110, the transport system 120 is controlled by the control circuit 136 to transport the tray cassette 300 in question from the first storage unit 206 to the first sorter load port 216 of the die stocker 100, through which the tray cassette is delivered to the first sorter 212 that transfers the first semiconductor die or tray of semiconductor dies between the tray cassettes 300. In some embodiments, the tray cassette 300 is introduced by the transport system 120 to the first guide 220 and the second guide 222 of the first sorter 212. In some embodiments, the base 400 of the tray cassette 300 engages the interface of the first guide 220 and the second guide 222.

[0081] In some embodiments, another instruction is received by the control circuit 136 indicating that a second semiconductor die or boat of semiconductor dies is to be transferred from one of the cassette boats 500 to the other cassette boat 500. In some embodiments, in response to receiving this instruction, at action 1112, the transport system 120 is controlled by the control circuit 136 to transport the cassette boat 500 in question from the second storage unit 208 to the second sorter load port 218 of the die stocker 100, through which the cassette boat 500 is delivered to the second sorter 214 that transfers the second semiconductor die or boat of semiconductor dies between the cassette boats 500. In some embodiments, the cassette boat 500 is introduced by the transport system 120 to the third guide 226 and the fourth guide 228 of the second sorter 214, and the kinematic coupling base 600 of the cassette boat 500 engages the interface of the third guide 226 and the fourth guide 228.

[0082] Yet another embodiment relates to a computer-readable medium comprising processor-executable instructions configured to implement one or more of the techniques presented herein. Fig.121200, wherein an exemplary computer-readable medium is shown, where an embodiment 1200 includes a computer-readable medium 1208 (e.g., a CD-R, DVD-R, a flash drive, a platter of a hard drive, etc.) having computer-readable data 1206 encoded thereon. This computer-readable data 1206, in turn, includes a set of processor-executable computer instructions 1204 configured to operate according to one or more of the principles set forth herein. In some embodiments 1200, the processor-executable computer instructions 1204 are configured to perform a method 1202, such as at least some of the methods described above. In some embodiments, the processor-executable computer instructions 1204 are configured to implement a system, such as at least some of the systems described above. One skilled in the art may envision many such computer-readable media configured to operate according to the techniques presented herein.

[0083] Fig.13 The following discussion provides a brief, general description of a suitable computing environment for implementing embodiments of one or more of the provisions set forth herein. Fig.13 The operating environment is only one example of a suitable operating environment and is not intended to imply any limitation as to the scope of use or functionality of the operating environment. Exemplary computing devices include, but are not limited to, personal computers, server computers, handheld or laptop computer devices, mobile devices (such as mobile phones, personal digital assistants (PDAs), media players, and the like), multiprocessor systems, consumer electronic devices, minicomputers, mainframe computers, distributed computing environments including any of the above systems or devices, and the like.

[0084] Although not required, embodiments are described in the general context of "computer-readable instructions" executed by one or more computing devices. Computer-readable instructions may be distributed via computer-readable media (discussed below). Computer-readable instructions may be implemented as program modules, such as functions, objects, application programming interfaces (APIs), data structures, and the like, that perform specific tasks or implement specific abstract data types. In general, the functionality of computer-readable instructions may be combined or distributed as desired in various environments.

[0085] Fig.13An example of a system 1300 is depicted that includes a computing device 1312 configured to implement some embodiments provided herein. In some configurations, the computing device 1312 includes at least one processing unit 1316 and a memory 1318. Depending on the exact configuration and type of the computing device, the memory 1318 may be volatile (e.g., RAM), non-volatile (e.g., ROM, flash memory, etc.), or some combination of the two. This configuration is Fig.13 As shown by dashed line 1314.

[0086] In some embodiments, computing device 1312 may include additional features and / or functionality. For example, computing device 1312 may also include additional storage (e.g., removable and / or non-removable), including but not limited to magnetic storage, optical storage, and the like. This additional storage may be stored in a separate computer or other storage medium. Fig.13 1318 is shown by storage device 1320. In some embodiments, computer readable instructions implementing one or more embodiments provided herein may be in storage device 1320. Storage device 1320 may also store other computer readable instructions for implementing operating systems, applications, and the like. For example, computer readable instructions may be loaded into memory 1318 for execution by processing unit 1316.

[0087] The term "computer-readable medium" as used herein includes computer storage media. Computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer-readable instructions or other data. Memory 1318 and memory 1320 are examples of computer storage media. Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, Digital Versatile Disk (DVD) or other optical storage devices, cassettes, magnetic tape, magnetic disk storage devices or other magnetic storage devices, or any other medium that can be used to store the desired information and can be accessed by computing device 1312. Any such computer storage media may be part of computing device 1312.

[0088] The computing device 1312 may also include a communication connection 1326 that allows the computing device 1312 to communicate with other devices. The communication connection 1326 may include, but is not limited to, a modem, a network interface card (NIC), an integrated network interface, a radio frequency transmitter / receiver, an infrared port, a USB connection, or other interfaces for connecting the computing device 1312 to other computing devices. The communication connection 1326 may include a wired connection or a wireless connection. The communication connection 1326 may transmit and / or receive communication media.

[0089] The term "computer-readable medium" may include communication media. Communication media typically embodies computer-readable instructions or other data in a "modulated data signal" such as a carrier wave or other transport mechanism, and includes any information delivery media. The term "modulated data signal" may include a signal that has one or more of its characteristics set or changed in such a manner as to encode information in the signal.

[0090] The computing device 1312 may include an input device 1324, such as a keyboard, a mouse, a pen, a voice input device, a touch input device, an infrared camera, a video input device, and / or any other input device. An output device 1322, such as one or more displays, speakers, a printer, and / or any other output device, may also be included in the computing device 1312. The input device 1324 and the output device 1322 may be connected to the computing device 1312 via a wired connection, a wireless connection, or any combination thereof. In some embodiments, an input device or an output device from another computing device may be used as an input device 1324 or an output device 1322 of the computing device 1312.

[0091] The components of computing device 1312 may be connected via various internal connections (e.g., buses). Such internal connections may include Peripheral Component Interconnect (PCI) (e.g., PCI Express), Universal Serial Bus (USB), Firewire (IEEE 1394), optical bus structures, and the like. In some embodiments, the components of computing device 1312 may be connected via a network. For example, memory 1318 may be composed of multiple physical memory units located at different physical locations connected via a network.

[0092] Those skilled in the art will recognize that storage devices for storing computer-readable instructions can be distributed across a network. For example, a computing device 1330 accessible via network 1328 can store computer-readable instructions to implement one or more embodiments provided herein. Computing device 1312 can access computing device 1330 and download a portion or all of the computer-readable instructions for execution. Alternatively, computing device 1312 can download multiple computer-readable instructions as needed, or some instructions can be executed at computing device 1312 and some instructions can be executed at computing device 1330.

[0093] In some embodiments, integrating the first sorter 212 and the second sorter 214 into the rack housing 116 allows for die transfer functionality to be performed at the rack housing 116 without transporting the die carriers 108 involved in die transfer to an external sorting system. In some embodiments, the transport system 120 that transports the die carriers 108 between the load port 204 and the first storage unit 206 and the second storage unit 208 also transports the die carriers 108 between the first storage unit 206 and the second storage unit 208 and the first sorter 212 and the second sorter 214. Thus, in some embodiments, die carriers 108 having different configurations can be stored and delivered to the first sorter 212 and the second sorter 214. In some embodiments, the die carriers 108 are also kept within the controlled environment of the rack housing 116, thereby avoiding possible exposure to external contaminants. In some embodiments, the die carrier 108 is transferred between the load port 204, the first storage unit 206 and the second storage unit 208, and the first sorter 212 and the second sorter 214 via the common transport system 120, thereby eliminating the need for a separate conveying system to deliver the die carrier 108 from the rack housing 116 to a separate independent sorter outside the rack system.

[0094] According to some embodiments, a die stocker is provided. The die stocker comprises: a rack housing, comprising: a first plurality of storage units configured to receive and store a first die carrier and a second die carrier having a first physical configuration. The rack housing further comprises: a second plurality of storage units configured to receive and store a third die carrier and a fourth die carrier having a second physical configuration. The first physical configuration of the first die carrier and the second die carrier is different from the second physical configuration of the third die carrier and the fourth die carrier. The rack housing further comprises: a loading port, through which the first die carrier, the second die carrier, the third die carrier and the fourth die carrier are introduced into the interior of the housing. The rack housing further comprises: a transport system for transporting the first die carrier and the second die carrier between the loading port and the first plurality of storage units within the rack housing, and for transporting the third die carrier and the fourth die carrier between the loading port and the second plurality of storage units within the rack housing. The die stocker further includes: a sorting system including: a first sorter receiving the first die carrier and the second die carrier from the transport system of the rack housing and transferring a first semiconductor die between the first die carrier and the second die carrier. The sorting system further includes: a second sorter receiving the third die carrier and the fourth die carrier from the transport system of the rack housing and transferring a second semiconductor die between the third die carrier and the fourth die carrier.

[0095] According to some embodiments, the first plurality of storage units are incompatible with the third die carrier and the fourth die carrier, thereby preventing the first plurality of storage units from receiving and storing the third die carrier and the fourth die carrier. According to some embodiments, the first die carrier and the second die carrier each include a tray box, the tray box including a first tray and a second tray, the second tray being vertically arranged above the first tray and supported by the first tray within the tray box. According to some embodiments, the third die carrier and the fourth die carrier each include a boat cassette, the boat cassette including a first boat supported by a first flange of the boat cassette, and a second boat vertically supported by a second flange of the boat cassette above the first boat and spaced apart from the first boat within the boat cassette. According to some embodiments, the load port includes a shelf, and at least one of the first die carrier, the second die carrier, the third die carrier, or the fourth die carrier is stored on the shelf by an overhead lift conveyor system for introduction into the interior of the rack housing. According to some embodiments, the transport system includes a coupler that cooperates with a head disposed to at least one of the first die carrier, the second die carrier, the third die carrier, or the fourth die carrier to couple the at least one of the first die carrier, the second die carrier, the third die carrier, or the fourth die carrier to the transport system, and the head cooperates with the overhead lift conveying system to couple the at least one of the first die carrier, the second die carrier, the third die carrier, or the fourth die carrier to the overhead lift conveying system. According to some embodiments, the first sorter includes: a first guide to maintain the position of the first die carrier on the first sorter; and a second guide to maintain the position of the second die carrier on the first sorter. According to some embodiments, the first guide comprises a first kinematic coupling interface, the first kinematic coupling interface cooperates with a kinematic coupling base of the first die carrier to establish a defined position of the first die carrier relative to the first sorter; and the second guide comprises a second kinematic coupling interface, the second kinematic coupling interface cooperates with a kinematic coupling base of the second die carrier to establish a defined position of the second die carrier relative to the first sorter. According to some embodiments, the second sorter comprises: a third guide to maintain the position of the third die carrier on the second sorter; and a fourth guide to maintain the position of the third die carrier on the second sorter, the third guide and the fourth guide being different from the first guide and the second guide.According to some embodiments, the third guide comprises a first set of tapered surfaces, the first set of tapered surfaces cooperating with a base portion of the third die carrier to establish a defined position of the third die carrier relative to the second sorter; and the fourth guide comprises a second set of tapered surfaces, the second set of tapered surfaces cooperating with a base portion of the fourth die carrier to establish a defined position of the fourth die carrier relative to the second sorter. According to some embodiments, the die stocker further comprises: a first sorter loading port extending between the rack housing and the first sorter, wherein the first die carrier and the second die carrier are introduced into the first sorter through the first sorter loading port; and a second sorter loading port extending between the rack housing and the second sorter, wherein the third die carrier and the fourth die carrier are introduced into the second sorter through the second sorter loading port. According to some embodiments, the first sorter includes a first conveyor that transports the first semiconductor die between the first die carrier received by the first sorter and the second die carrier received by the first sorter, and the second sorter includes a second conveyor that transports the second semiconductor die between the third die carrier received by the second sorter and the fourth die carrier received by the second sorter. According to some embodiments, the die stocker further includes: a scanner that interrogates a computer readable code associated with the first die carrier to identify the first semiconductor die to be transferred between the first die carrier and the second die carrier; and a control circuit that modifies a record maintained in a database as a result of the interrogation of the computer readable code by the scanner to indicate that the first semiconductor die has been transferred from the first die carrier to the second die carrier. According to some embodiments, the scanner includes a barcode reader that includes an optical image capture device that is positioned relative to the first sorter to detect a barcode applied to a die support contained within the first die carrier.

[0096] According to some embodiments, a method of storing a first die carrier and a second die carrier having a first physical configuration and a third die carrier and a fourth die carrier having a second physical configuration different from the first physical configuration is provided. The method includes receiving first data indicating that the first die carrier and the second die carrier are to be stored by a die stocker. The method also includes controlling the operation of a transport system to transport the first die carrier and the second die carrier between a load port and a first storage unit of a rack housing, the first die carrier and the second die carrier being introduced into the rack housing of the die stocker through the load port, based on the first data, the first storage unit being configured to receive and store the first die carrier and the second die carrier. The method further includes: receiving second data indicating that the third die carrier and the fourth die carrier are to be stored by the die stocker; and based on the second data, controlling the operation of the transport system to transport the third die carrier and the fourth die carrier between the load port and a second storage unit of the die stocker, the third die carrier and the fourth die carrier being introduced into the rack housing through the load port, the second storage unit being configured to receive and store the third die carrier and the fourth die carrier. The method further includes, in response to receiving an instruction to transfer a first semiconductor die from the first die carrier to the second die carrier, controlling the transport system to transport the first die carrier and the second die carrier from the first storage unit to a first sorter load port of the rack housing, the first die carrier and the second die carrier being delivered to a first sorter that transfers the first semiconductor die between the first die carrier and the second die carrier through the first sorter load port. The method further includes, in response to receiving an instruction to transfer a second semiconductor die from the third die carrier to the fourth die carrier, controlling the transport system to transport the third die carrier and the fourth die carrier from the second storage unit to a second sorter load port of the rack housing, the third die carrier and the fourth die carrier being delivered to a second sorter that transfers the second semiconductor die between the third die carrier and the fourth die carrier through the second sorter load port.

[0097] According to some embodiments, controlling the operation of the transport system to transport the first die carrier and the second die carrier between the load port and the first storage unit includes: connecting an arm of the transport system to transport heads of the first die carrier and the second die carrier, wherein the transport heads of the first die carrier and the second die carrier are engaged by an overhead transport system, the overhead transport system delivers the first die carrier and the second die carrier to the load port of the rack housing; and transporting the first die carrier and the second die carrier to the first storage unit by the transport heads. According to some embodiments, controlling the transport system to transport the first die carrier and the second die carrier from the first storage unit to a first sorter load port includes: engaging a first guide provided to the first sorter with a base portion of the first die carrier to maintain a position of the first die carrier on the first sorter; and engaging a second guide provided to the first sorter with a base portion of the second die carrier to maintain a position of the second die carrier on the first sorter. According to some embodiments, the method further includes querying a computer readable code associated with the first die carrier to identify the first semiconductor die to be transferred between the first die carrier and the second die carrier; and modifying a record maintained in a database as a result of querying the computer readable code to indicate that the first semiconductor die has been transferred from the first die carrier to the second die carrier.

[0098] According to some embodiments, a semiconductor die manufacturing system is provided. The semiconductor die manufacturing system includes: a tray box storing a first tray and a second tray, the second tray being stacked on top of the first tray and supported by the first tray in the tray box. The semiconductor die manufacturing system also includes: a boat box storing a first boat and a second boat, the first boat being supported in the boat box by a first flange, and the second boat being supported in the boat box by a second flange, being vertically located above the first boat and being spaced apart from the first boat in the boat box. The semiconductor die manufacturing system also includes: a rack housing including: a plurality of storage units receiving and storing the tray box and the boat box; a loading port through which the tray box and the boat box are introduced into the interior of the rack housing, and a transport system for transporting the tray box and the boat box in the rack housing between the loading port and the storage unit. The semiconductor die manufacturing system further includes: an overhead elevator transfer system that delivers the tray box and the boat cassette to the load port of the rack housing; and a first sorter that receives the tray box and transfers the first tray or the second tray between the tray boxes. The semiconductor die manufacturing system further includes: a second sorter that receives the boat cassette and transfers the first boat or the second boat between the boat cassettes.

[0099] According to some embodiments, the semiconductor die manufacturing system further includes: a scanner interrogating a computer readable code associated with the tray box or the boat box to identify semiconductor dies to be transferred between the tray boxes or between the boat boxes; and a control circuit modifying a record maintained in a database as a result of the scanner interrogating the computer readable code to indicate that the semiconductor die has been transferred between the tray boxes or between the boat boxes.

[0100] The foregoing summarizes the features of several embodiments so that those of ordinary skill in the art can better understand the various aspects of the present disclosure. Those of ordinary skill in the art will appreciate that they can easily use the present disclosure as a basis for designing or modifying other processes and structures for implementing the same purposes and / or obtaining the same advantages of the embodiments introduced herein. Those of ordinary skill in the art will also recognize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and those of ordinary skill in the art may make various changes, substitutions, and modifications herein without departing from the spirit and scope of the present disclosure.

[0101] Although the subject matter has been described in language specific to structural features or methodological acts, it should be understood that the subject matter in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as example forms of implementing at least some of the claims.

[0102] Various operations of the embodiments are provided herein. The order of describing some or all of the operations should not be interpreted as implying that these operations must depend on the order. Alternative orders with the benefits of this specification will be recognized. In addition, it should be understood that not all operations must be present in each embodiment provided herein. In addition, it should be understood that not all operations must be present in some embodiments.

[0103] It should be understood that, for example, for simplicity and ease of understanding, the layers, features, elements, etc. depicted herein are shown with specific dimensions (e.g., structural dimensions or orientations) relative to each other, and in some embodiments, the same actual dimensions are substantially different from the dimensions shown herein. In addition, there are various techniques for forming the layers, regions, features, elements, etc. mentioned herein, such as at least one of etching techniques, planarization techniques, implantation techniques, doping techniques, spin coating techniques, sputtering techniques, growth techniques, or deposition techniques such as chemical vapor deposition (CVD).

[0104] In addition, "exemplary" is used herein to mean serving as an example, situation, explanation, etc., and is not necessarily advantageous. As used in this application, "or" is intended to mean an inclusive "or" rather than an exclusive "or". In addition, unless otherwise specified or known from the context to be directed to the singular form, as used in this application and the appended claims, "a / an" is generally interpreted as meaning "one or more". In addition, at least one of A and B and / or the like generally means A or B or both A and B. In addition, with respect to the use of "include", "having / has / with" or its variants, such terms are intended to be inclusive in a manner similar to the term "comprise". In addition, unless otherwise specified, "first", "second" or the like are not intended to imply time, space, order, etc. On the contrary, such terms are only used as identifiers, names, etc. for features, elements, items, etc. For example, the first element and the second element generally correspond to element A and element B or two different or two identical elements or the same element.

[0105] In addition, although the present disclosure has been illustrated and described with respect to one or more embodiments, those skilled in the art will appreciate equivalent changes and modifications after reading and understanding this specification and the accompanying drawings. The present disclosure includes all such modifications and changes, and is limited only by the scope of the appended claims. In particular, for the various functions performed by the components described above, unless otherwise indicated, the terms used to describe such components are intended to correspond to any component that performs the specified function (e.g., functionally equivalent) of the described components, even if the structure is not equivalent to the disclosed structure. In addition, although a specific feature of the present disclosure may have been disclosed with respect to only one of several embodiments, this feature may be combined with one or more other features of other embodiments, such as may be desirable and advantageous for any given or specific application.

Claims

1. A tube core stocker, characterized in that: include: The rack housing comprises: a first plurality of storage cells configured to receive and store a first die carrier and a second die carrier having a first physical configuration, a second plurality of storage units configured to receive and store a third die carrier and a fourth die carrier having a second physical configuration, wherein the first physical configuration of the first die carrier and the second die carrier is different from the second physical configuration of the third die carrier and the fourth die carrier, a loading port through which the first die carrier, the second die carrier, the third die carrier, and the fourth die carrier are introduced into the interior of the housing, and a transport system for transporting the first die carrier and the second die carrier within the rack housing between the load port and the first plurality of storage units, and for transporting the third die carrier and the fourth die carrier within the rack housing between the load port and the second plurality of storage units; and Sorting system, including: a first sorter that receives the first die carrier and the second die carrier from the transport system of the rack housing and transfers first semiconductor dies between the first die carrier and the second die carrier, and a second sorter receiving the third die carrier and the fourth die carrier from the transport system of the rack housing and transferring second semiconductor dies between the third die carrier and the fourth die carrier, The first plurality of storage units are incompatible with the third die carrier and the fourth die carrier, thereby preventing the first plurality of storage units from receiving and storing the third die carrier and the fourth die carrier.

2. The die stocker according to claim 1, characterized in that: The first die carrier and the second die carrier each include a tray box including a first tray and a second tray, the second tray being arranged vertically above the first tray and supported by the first tray within the tray box.

3. The die stocker according to claim 1, characterized in that: The third die carrier and the fourth die carrier each include a boat cassette including a first boat supported by a first flange of the boat cassette, and a second boat vertically supported by a second flange of the boat cassette above the first boat and spaced apart from the first boat within the boat cassette.

4. The die stocker according to claim 1, characterized in that The load port includes a shelf on which at least one of the first die carrier, the second die carrier, the third die carrier, or the fourth die carrier is stored by an overhead lift transport system for introduction into the interior of the rack housing.

5. The die stocker according to claim 4, characterized in that: The transport system includes a coupler that cooperates with a header disposed to the at least one of the first die carrier, the second die carrier, the third die carrier, or the fourth die carrier to couple the at least one of the first die carrier, the second die carrier, the third die carrier, or the fourth die carrier to the transport system, and The head cooperates with the overhead lift transport system to couple the at least one of the first die carrier, the second die carrier, the third die carrier, or the fourth die carrier to the overhead lift transport system.

6. The die stocker according to claim 1, characterized in that The first sorter comprises: a first guide to maintain the position of the first die carrier on the first sorter; and A second guide maintains the position of the second die carrier on the first sorter.

7. The die stocker according to claim 6, characterized in that: the first guide comprises a first kinematic coupling interface cooperating with a kinematic coupling base of the first die carrier to establish a defined position of the first die carrier relative to the first sorter; and The second guide includes a second kinematic coupling interface that cooperates with a kinematic coupling base of the second die carrier to establish a defined position of the second die carrier relative to the first sorter.

8. The die stocker according to claim 6, characterized in that The second sorter comprises: a third guide to maintain the position of the third die carrier on the second sorter; and A fourth guide maintains the position of the third die carrier on the second sorter, the third guide and the fourth guide being different from the first guide and the second guide.

9. The die stocker according to claim 8, characterized in that: the third guide comprising a first set of tapered surfaces that cooperate with a base portion of the third die carrier to establish a defined position of the third die carrier relative to the second sorter; and The fourth guide includes a second set of tapered surfaces that cooperate with a base portion of the fourth die carrier to establish a defined position of the fourth die carrier relative to the second sorter.

10. The die stocker according to claim 1, characterized in that include: a first sorter load port extending between the housing housing and the first sorter, wherein the first die carrier and the second die carrier are introduced into the first sorter through the first sorter load port; as well as A second sorter load port extends between the chassis housing and the second sorter, wherein the third die carrier and the fourth die carrier are introduced into the second sorter through the second sorter load port.

11. The die stocker according to claim 1, characterized in that: The first sorter includes a first conveyor that transports the first semiconductor die between the first die carrier received by the first sorter and the second die carrier received by the first sorter, and The second sorter includes a second conveyor that transports the second semiconductor dies between the third die carrier received by the second sorter and the fourth die carrier received by the second sorter.

12. The die stocker according to claim 1, characterized in that include: a scanner that interrogates a computer readable code associated with the first die carrier to identify the first semiconductor die to be transferred between the first die carrier and the second die carrier; as well as Control circuitry modifies a record maintained in a database as a result of interrogation of the computer readable code by the scanner to indicate that the first semiconductor die has been transferred from the first die carrier to the second die carrier.

13. The die stocker according to claim 12, characterized in that The scanner includes a barcode reader including an optical image capture device positioned relative to the first sorter to detect a barcode applied to a die support included in the first die carrier.

14. A method of storing a first die carrier and a second die carrier having a first physical configuration and a third die carrier and a fourth die carrier having a second physical configuration different from the first physical configuration, characterized in that: The method comprises: receiving first data indicating that the first die carrier and the second die carrier are to be stored by a die stocker; Based on the first data, controlling the operation of a transport system to transport the first die carrier and the second die carrier between a load port and a first storage unit of a rack housing, the first die carrier and the second die carrier being introduced into the rack housing of the die stocker through the load port, the first storage unit being configured to receive and store the first die carrier and the second die carrier; receiving second data indicating that the third die carrier and the fourth die carrier are to be stored by the die stocker; based on the second data, controlling the operation of the transport system to transport the third die carrier and the fourth die carrier between the load port and a second storage unit of the die stocker, the third die carrier and the fourth die carrier being introduced into the rack housing through the load port, the second storage unit being configured to receive and store the third die carrier and the fourth die carrier; in response to receiving an instruction to transfer a first semiconductor die from the first die carrier to the second die carrier, controlling the transport system to transport the first die carrier and the second die carrier from the first storage unit to a first sorter load port of the rack housing, the first die carrier and the second die carrier being delivered through the first sorter load port to a first sorter that transfers the first semiconductor die between the first die carrier and the second die carrier; and In response to receiving an instruction to transfer the second semiconductor die from the third die carrier to the fourth die carrier, the transport system is controlled to transport the third die carrier and the fourth die carrier from the second storage unit to a second sorter loading port of the rack housing, and the third die carrier and the fourth die carrier are delivered to a second sorter that transfers the second semiconductor die between the third die carrier and the fourth die carrier through the second sorter loading port.

15. The method of storing the first die carrier, the second die carrier, the third die carrier and the fourth die carrier according to claim 14, characterized in that: Controlling operation of the transport system to transport the first die carrier and the second die carrier between the load port and a first storage unit includes: connecting an arm of the transport system to transport heads of the first die carrier and the second die carrier, wherein the transport heads of the first die carrier and the second die carrier are engaged by an overhead transport system that delivers the first die carrier and the second die carrier to the loadport of the rack housing; and The first die carrier and the second die carrier are transported to the first storage unit by the transport head.

16. The method of storing the first die carrier, the second die carrier, the third die carrier and the fourth die carrier according to claim 14, characterized in that: Controlling the transport system to transport the first die carrier and the second die carrier from the first storage unit to a first sorter load port includes: engaging a first guide provided to the first sorter with a base portion of the first die carrier to maintain a position of the first die carrier on the first sorter; and A second guide provided to the first sorter is engaged with a base portion of the second die carrier to maintain a position of the second die carrier on the first sorter.

17. The method of storing the first die carrier, the second die carrier, the third die carrier, and the fourth die carrier according to claim 14, characterized in that: include: interrogating computer readable code associated with the first die carrier to identify the first semiconductor die to be transferred between the first die carrier and the second die carrier; as well as A record maintained in a database as a result of querying the computer readable code is modified to indicate that the first semiconductor die has been transferred from the first die carrier to the second die carrier.

18. A semiconductor die manufacturing system, characterized in that: include: a tray box storing a first tray and a second tray, the second tray being stacked on top of the first tray and supported by the first tray within the tray box; a boat magazine storing a first boat and a second boat, the first boat being supported by a first flange in the boat magazine, and the second boat being supported by a second flange in the boat magazine, being vertically located above the first boat and being spaced apart from the first boat in the boat magazine; A rack housing, comprising: a plurality of storage units for receiving and storing the tray boxes and the boat boxes; a loading port through which the tray boxes and the boat boxes are introduced into the interior of the rack housing; and a transport system for transporting the tray boxes and the boat boxes within the rack housing between the loading port and the storage units; an overhead lift transfer system to deliver the tray boxes and the boat magazines to the load ports of the rack housing; a first sorter receiving the tray box and transferring the first tray or the second tray between the tray boxes; and The second sorter receives the boat magazines and transfers the first boat or the second boat between the boat magazines.

19. The semiconductor die manufacturing system according to claim 18, characterized in that: include: a scanner that interrogates a computer-readable code associated with the cassettes or the boats to identify semiconductor dies to be transferred between the cassettes or between the boats; as well as Control circuitry modifies a record maintained in a database as a result of interrogation of the computer readable code by the scanner to indicate that the semiconductor die has been transferred between the tray magazines or between the boat cassettes.

Images