A temperature adjustment method, device and system

Abstract

The present application discloses a temperature control method, device and system, the method comprising: determining a first cooling power corresponding to the heating element according to a first power consumption corresponding to the heating element and a first ambient temperature; determining a first input current and a first enabled number corresponding to the heat sink according to the first cooling power and the first ambient temperature; wherein the cooling efficiency of the heat sink is the highest under the first input current; controlling the first enabled number of heat sinks to cool the heating element under the first input current. The application of the temperature control method provided in the embodiments of the present application can reduce the energy consumption applied in the temperature control process.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a temperature adjustment method, device and system. Background Art

[0002] Edge computing devices perform resource-intensive processes or analyses at or near the data source. They are devices that process data from a large number of devices or software on-site. When the ambient temperature is higher or lower than the operating temperature of the component, the component temperature needs to be maintained within its normal operating range by cooling or heating. Traditional heat dissipation methods require a series of components such as semiconductor coolers (TECs) and electric heaters. As edge computing devices have higher and higher requirements for wide temperature ranges, the energy consumption of semiconductor coolers (TECs) has become increasingly prominent, placing a burden on the overall system energy consumption. Summary of the invention

[0003] The embodiments of the present application provide a temperature regulation method, device and system, which can reduce the burden of temperature regulation on the energy consumption of the overall system.

[0004] On the one hand, the present application provides a temperature regulation method, which includes: determining a first cooling power corresponding to the heat generating element according to a first power consumption corresponding to the heat generating element and a first ambient temperature; determining a first input current and a first enabled number corresponding to the heat dissipation element according to the first cooling power and the first ambient temperature; wherein the cooling efficiency of the heat dissipation element is the highest under the first input current; and controlling the first enabled number of heat dissipation elements to cool the heat generating element under the first input current.

[0005] In one possible implementation manner, determining the first input current and the first enabled quantity corresponding to the heat sink according to the first cooling power and the first ambient temperature includes: determining a first temperature difference between hot and cold surfaces of the heat sink according to a first target temperature corresponding to the heat sink and the first ambient temperature; determining the first input current according to the first temperature difference between hot and cold surfaces and the first ambient temperature; and determining the first enabled quantity according to the first input current and the first cooling power.

[0006] In one possible implementation, determining the first input current based on the first temperature difference between the hot and cold surfaces and the first ambient temperature includes: determining heat sink efficiency information corresponding to the first temperature difference between the hot and cold surfaces and the first ambient temperature; and determining the first input current corresponding to the heat sink based on the heat sink efficiency information.

[0007] In one possible implementation, the method also includes: when a first heating temperature corresponding to the heat generating component exceeds a safety temperature threshold, determining a second enabling quantity and a second input current corresponding to the heat dissipating component; and controlling the heat dissipating components of the second enabling quantity to cool the heat generating component under the second input current.

[0008] In one possible implementation manner, determining the second enabled quantity and the second input current corresponding to the heat sink includes: determining a second power consumption and a second ambient temperature corresponding to the heat generating element; determining a second cooling power corresponding to the heat generating element based on the second power consumption and the second ambient temperature; determining a second enabled quantity and a second input current corresponding to the heat sink based on the second cooling power and the second ambient temperature.

[0009] In one possible implementation, the method also includes: when a first heating temperature corresponding to the heat generating component exceeds an operating temperature threshold, determining a third input current corresponding to the heat sink according to the first enabled number; and controlling the first enabled number of heat sinks to cool the heat generating component under the third input current.

[0010] In one possible implementation manner, determining a third input current corresponding to the heat sink according to the first enabled quantity includes: obtaining a third ambient temperature, determining a third cold and hot surface temperature difference corresponding to the heat sink according to the third ambient temperature and the first heating temperature; determining the third input current according to the third ambient temperature and the third cold and hot surface temperature difference; and controlling the heat sink corresponding to the first enabled quantity to cool the heat sink under the third input current.

[0011] In one possible implementation manner, the heat generating element is a central processing unit; and the heat dissipating element is a semiconductor cooling sheet.

[0012] On the other hand, the present application provides a temperature regulation device, which includes: a determination module, used to determine a first cooling power corresponding to the heat generating element according to a first power consumption corresponding to the heat generating element and a first ambient temperature; the determination module is also used to determine a first input current and a first enabled number corresponding to the heat dissipation element according to the first cooling power and the first ambient temperature; wherein the cooling efficiency of the heat dissipation element is the highest under the first input current; and a control module, used to control the first enabled number of heat dissipation elements to cool the heat generating element under the first input current.

[0013] In one embodiment, the determination module includes: a first determination submodule, used to determine the first temperature difference between the hot and cold surfaces of the heat generating element according to the first target temperature corresponding to the heat generating element and the first ambient temperature; a second determination submodule, used to determine the first input current according to the first temperature difference between the hot and cold surfaces and the first ambient temperature; and a third determination submodule, used to determine the first enabling quantity according to the first input current and the first cooling power.

[0014] In one possible implementation, the second determining submodule includes: determining heat sink efficiency information corresponding to the first cold and hot surface temperature difference and the first ambient temperature; and determining a first input current corresponding to the heat sink according to the heat sink efficiency information.

[0015] In one possible implementation, the determination module is also used to determine a second enabled number and a second input current corresponding to the heat sink when a first heating temperature corresponding to the heat sink exceeds a safety temperature threshold; the control module is also used to control the second enabled number of heat sinks to cool the heat sink under the second input current.

[0016] In one possible implementation, the determination module includes: determining a second power consumption and a second ambient temperature corresponding to the heat generating component; determining a second cooling power corresponding to the heat generating component based on the second power consumption and the second ambient temperature; and determining a second enabled quantity and a second input current corresponding to the heat dissipation component based on the second cooling power and the second ambient temperature.

[0017] In one possible implementation, the determination module is also used to determine a third input current corresponding to the heat sink according to the first enabled number when the first heating temperature corresponding to the heat sink exceeds an operating temperature threshold; the control module is also used to control the first enabled number of heat sinks to cool the heat sink under the third input current.

[0018] In one possible implementation, the determination module includes: obtaining a third ambient temperature, determining a third hot and cold surface temperature difference corresponding to the heat generating component according to the third ambient temperature and the first heating temperature; determining the third input current according to the third ambient temperature and the third hot and cold surface temperature difference; and controlling the heat sink corresponding to the first enabling quantity to cool the heat generating component under the third input current.

[0019] On the other hand, the present application provides a temperature control system, which includes: a controller, a heating element and a heat dissipation element; the controller adjusts the temperature of the heat dissipation element according to any of the temperature control methods described above, so as to cool the heating element through the heat dissipation element.

[0020] The temperature control method, device and system provided in the embodiments of the present application determine the first input current and the first enabled number of the heat sink through the first cooling power and the first ambient temperature, and control the first enabled number of heat sinks to cool the heating element under the first input current. The heat sink can cool the heating element with the highest cooling efficiency under the first input current, thereby reducing the energy consumption required for temperature control while meeting the temperature control requirements, thereby reducing the burden of temperature control on the overall system energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present application will become readily understood. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, wherein:

[0022] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0023] Figure 1 This is a schematic diagram of a temperature adjustment method according to an embodiment of the present application;

[0024] Figure 2 This is a schematic diagram of a temperature adjustment method according to another embodiment of the present application;

[0025] Figure 3a This is a graph showing the current and cooling efficiency of a temperature adjustment method according to an embodiment of the present application;

[0026] Figure 3b This is a graph showing the current and cooling efficiency of a temperature adjustment method according to another embodiment of the present application;

[0027] Figure 3c This is a current and cooling efficiency curve diagram of a temperature adjustment method according to another embodiment of the present application;

[0028] Figure 3d This is a current and cooling efficiency curve diagram of a temperature adjustment method according to another embodiment of the present application;

[0029] Figure 4a A current and cooling power curve diagram of a temperature adjustment method according to an embodiment of the present application;

[0030] Figure 4b This is a current and cooling power curve diagram of a temperature adjustment method according to another embodiment of the present application;

[0031] Figure 5 This is a schematic diagram of a temperature adjustment method according to another embodiment of the present application;

[0032] Figure 6This is a schematic diagram of a temperature adjustment method according to another embodiment of the present application;

[0033] Figure 7 This is a schematic diagram of the system structure of a temperature adjustment system according to another embodiment of the present application;

[0034] Figure 8 This is another embodiment of the present application, an efficiency parameter control diagram of a temperature adjustment system;

[0035] Fig. 9 This is a schematic diagram of an implementation module of a temperature adjustment device according to an embodiment of the present application. DETAILED DESCRIPTION

[0036] In order to make the purpose, features, and advantages of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0037] Figure 1 The present invention is a schematic diagram of a temperature control method according to an embodiment of the present invention.

[0038] See also Figure 1 On the one hand, an embodiment of the present application provides a temperature regulation method, the method comprising: operation 101, determining a first cooling power corresponding to the heating element according to a first power consumption corresponding to the heating element and a first ambient temperature; operation 102, determining a first input current and a first enabled number corresponding to the heat sink according to the first cooling power and the first ambient temperature; wherein the cooling efficiency of the heat sink is the highest under the first input current; operation 103, controlling the first enabled number of heat sinks to perform cooling treatment on the heat sink under the first input current.

[0039] The temperature regulation method provided in the embodiment of the present application controls a first enabled number of heat sinks to cool the heat generating element at the highest cooling efficiency under a first input current, thereby reducing the total energy consumption required by the heat sinks during the temperature regulation of the heat generating element while meeting the temperature regulation requirements of the heat generating element, thereby reducing the burden of temperature regulation on the overall system energy consumption.

[0040] In operation 101 of the present method, the heating element is usually an electronic component, and the heating element can be especially an electronic component with high heat dissipation requirements, such as an electronic component of an edge computing device, such as a CPU, etc. The first power consumption is the real-time power consumption when the heating element is running, and the first power consumption can be obtained by monitoring the power consumption monitoring device. The first ambient temperature is the ambient temperature around the heating element, and the first ambient temperature can be obtained by monitoring the corresponding temperature monitoring device. When the first power consumption and the first ambient temperature are monitored and obtained, the first cooling power required by the heating element can be determined. In one case, the first cooling power of the heating element can be determined based on the first power consumption of the heating element. Among them, the first cooling power is also the cooling power that the heat sink needs to output, so that the heat sink provides the first cooling power to adjust the temperature of the heating element, so that the heating element can operate at a suitable temperature.

[0041] In operation 102 of the present method, the specific value of the first cooling power is related to the input current of the heat sink. By adjusting the input current of the heat sink, the input power of the heat sink can be adjusted, thereby achieving the purpose of adjusting the cooling power of the heat sink. Generally, the higher the input current, the higher the cooling power. It should be understood that the cooling power of the heat sink corresponds to the cooling efficiency. The cooling efficiency refers to the ratio of the input power corresponding to the heat sink that can be converted into the cooling power. The cooling power of the heat sink is obtained by multiplying the input power corresponding to the heat sink by the cooling efficiency. For example, if the corresponding input power of the heat sink is 40W and the cooling power is 20W, the cooling efficiency is 20 / 40=50%. In the case where the specific model of the heat sink is known, the cooling efficiency of the heat sink is related to the first ambient temperature, that is, the cooling efficiency of the heat sink is different at different first ambient temperatures, and the first input current corresponding to the highest cooling efficiency of the heat sink can be determined by the first ambient temperature. In this case, if the cooling power corresponding to a single heat sink does not meet the first cooling power, the first enabled number of heat sinks can be adjusted to enable the first enabled number of heat sinks to meet the first cooling power requirement. Among them, the first enabled number refers to the number of heat sinks in operation. For example: the first cooling power corresponding to the heating element is 50W, the first input current of a single heat sink at the highest cooling efficiency is 1A, and at an input current of 1A, the cooling power of a single heat sink is 10W, then the number of heat sinks that need to be enabled is 50 / 10=5.

[0042] In operation 103, when the first enabled number and the first input current corresponding to the heat sink are determined, the heat sinks of the first enabled number can be controlled to operate at the first input current so that the heat sinks cool the heating element to achieve the purpose of temperature regulation of the heating element. Since the heat sink is cooled under the condition of the highest cooling efficiency, the present method has a higher cooling efficiency when cooling the element compared to the input current of other values, thereby reducing the overall energy consumption in the temperature regulation process. For example, assuming that the first cooling power corresponding to the heating element is 30W, when only one heat sink is used for heat dissipation, the cooling power corresponding to the heat sink is satisfied by adjusting the input current. However, usually, after exceeding the first input current corresponding to the highest cooling efficiency, the higher the input current, the lower the cooling efficiency, which will cause waste of system energy consumption. According to the present method, the heat sinks of the required number cool the heating element according to the highest cooling efficiency, which can avoid waste of system energy consumption. Further, the present method can use heat sinks of various models, thereby further reducing waste of system energy consumption. For example, assuming that at a certain ambient temperature, the first cooling power corresponding to the heating element is 30W, the cooling power of the first type of heat sink is 25W under the condition of the highest cooling efficiency, and the cooling power of the second type of heat sink is 5W under the condition of the highest cooling efficiency, the heating element can also be cooled by running a first type of heat sink and a second type of heat sink. It is understandable that the cooling powers corresponding to the first type and the second type at the highest cooling efficiency are different.

[0043] It should be added that the temperature regulation referred to in this method includes both heating treatment and cooling treatment. The heating treatment and cooling treatment are carried out in the same manner and will not be elaborated below. This method can use the same manner to heat the heating element to achieve the purpose of temperature regulation.

[0044] Figure 2 This is a schematic diagram of the implementation flow of a temperature adjustment method according to another embodiment of the present application.

[0045] See also Figure 2 In one embodiment, operation 102, determining a first input current and a first enabled quantity corresponding to the heat sink according to a first cooling power and a first ambient temperature, includes: operation 1021, determining a first temperature difference between hot and cold surfaces of the heat sink according to a first target temperature corresponding to the heat sink and a first ambient temperature; operation 1022, determining a first input current according to the first temperature difference between hot and cold surfaces and the first ambient temperature; determining a first enabled quantity according to the first input current and the first cooling power.

[0046] In operation 1021 of the method, the first target temperature refers to the preset target temperature when the heating element is in operation. The first ambient temperature and the first target temperature can be used to determine the first hot and cold surface temperature difference of the heat sink. The difference between the first target temperature and the first ambient temperature is the first hot and cold surface temperature difference. The first hot and cold surface temperature difference corresponds to the temperature of the heat dissipation area and the temperature of the heat absorption area of ​​the heat sink during the heat dissipation process. The first hot and cold surface temperature difference is the real-time hot and cold surface temperature difference of the heat sink determined by the first target temperature and the first ambient temperature.

[0047] In operation 1022 of the method, when the type and model of the heat sink are known, the current and cooling efficiency curve representing the input power and input current of the heat sink is constant under the same first cold and hot surface temperature difference. The input current is adjusted according to the current and cooling efficiency curve, so that the first input current of the heat sink can be determined as the current value corresponding to the highest cooling efficiency of the heat sink. At this time, the energy efficiency of the entire system will be the optimal level under the current working conditions. The first enabled number of the heat sink can be determined by calculating the cooling power corresponding to the first input current and the first cooling power. The heat sink corresponding to the first enabled number is controlled to cool the heating element under the first input current.

[0048] In one embodiment, operation 1022, determining a first input current according to a first temperature difference between hot and cold surfaces and a first ambient temperature, includes: first, determining heat sink efficiency information corresponding to the first temperature difference between hot and cold surfaces and the first ambient temperature; and then, determining a first input current corresponding to the heat sink according to the heat sink efficiency information.

[0049] Specifically, the first input current can be determined based on the efficiency information corresponding to the heat sink, and the efficiency information is specifically a current and cooling efficiency curve. Usually, the horizontal and vertical coordinates of the current and cooling efficiency curve are current values, and the vertical coordinate is cooling efficiency (COP, Coefficient Of Performance). When the first heating temperature of the heating element and the first hot and cold surface temperature difference of the heat sink are fixed values, the corresponding current and cooling efficiency curve is also fixed, and the current and cooling efficiency curve can be searched to determine the first input current corresponding to the heat sink at the first target temperature and the first hot and cold surface temperature difference.

[0050] In one implementation, the current and cooling efficiency curves can be found at Figure 3a and 3b .exist Figure 3aIn the figure, the current and cooling efficiency curves corresponding to a certain type of heat sink under different hot and cold surface temperature differences are shown. The heat sink corresponding to the figure is a certain type of semiconductor refrigeration chip (TEC). When the hot surface temperature is 80°C, the efficiency curves of this type of semiconductor refrigeration chip (TEC) under different hot and cold surface temperature differences are shown. In the figure, the horizontal axis I (Amps) is used to represent the current, and the vertical axis COP is used to represent the cooling efficiency. The curve corresponding to DT=60 is the heat sink efficiency curve when the hot and cold surface temperature difference of the heat sink is 60°C. It can be seen that in this case, the cooling efficiency COP of the semiconductor refrigeration chip (TEC) is less than 40%. Assuming that the cooling power of the semiconductor refrigeration chip (TEC) is Qc is 35W, the corresponding input power P=Qc / COP=87.5W. It can be further known that the heat dissipation of its hot surface is Qh=P+Qc=122.5W. Among them, the hot surface temperature is the ambient temperature.

[0051] Based on this, the present application can adjust the input current according to the TEC current and cooling efficiency curve. The TEC input current can be intelligently adjusted to the current value corresponding to the highest point of cooling efficiency on the current and cooling efficiency curve under the current TEC hot and cold surface temperature difference and hot surface temperature, thereby ensuring that the system energy efficiency is always at the optimal level.

[0052] See also Figure 3c For a certain model of TEC, when the heating element is at a certain hot surface temperature and the temperature difference between the hot and cold surfaces of TEC is constant, the TEC efficiency curve with current is known. At this time, the input current can be adjusted according to the current and cooling efficiency curve corresponding to the TEC, so that the input current of the TEC is the current value corresponding to the highest TEC efficiency in this state, and the energy efficiency of the entire system will be the optimal level under the current working conditions.

[0053] To facilitate further understanding of the above implementation, a specific implementation scenario is provided below for illustration.

[0054] See also Figure 3c and Figure 4a In this specific implementation scenario, the heat sink is a semiconductor refrigeration chip (TEC), and the heat generating element is a central processing unit (CPU). Multiple TECs are connected to the CPU to cool the CPU.

[0055] When the CPU is running, the temperature sensor can monitor the first heating temperature of the CPU and the first ambient temperature of the CPU's surroundings, and the corresponding first cooling power can be determined according to the power consumption of the CPU. Assume that the required first cooling power is 36W, the first target temperature is 70°C, the first hot surface temperature of the CPU is 80°C, and the corresponding TEC first hot and cold surface temperature difference is 10°C. Obtain the current and cooling efficiency curves corresponding to the first hot surface temperature of 80°C and the first hot and cold surface temperature difference of 10°C. According to the current and cooling efficiency curves, when the first hot surface temperature is 80°C and the first hot and cold surface temperature difference is 10°C, when the input current is 1A (the corresponding value in the figure is point B), the cooling efficiency of TEC is the highest (the corresponding value in the figure is COP B ), determine that the first input current is 1A. Then, through the current and cooling power curve, determine that when the first input current is 1A, the corresponding cooling power is 12W (the corresponding value in the figure is Q B ), according to the first cooling power of 36W, the number of TECs to be controlled for cooling is 36 / 12=3. Then, a current of 1A is input to the three TECs, so that they perform temperature regulation on the CPU under the input current of 1A.

[0056] Another specific implementation scenario is provided below for additional explanation.

[0057] See also Figure 3d and Figure 4b In this implementation scenario, when the hot surface temperature is 80°C and the temperature difference between the hot and cold surfaces is 50°C, it is assumed that the required cooling power is 30W.

[0058] If a TEC is started in the initial state, with input current IC = 5.5A, Q C To meet the 30w requirement, COP C =0.3, the corresponding input power is 30 / 0.3=100w.

[0059] If the optimal input current is determined to be I according to the current and cooling efficiency curve D =3.5A, the corresponding Q D For 15W, two TECs need to be activated, and the corresponding COP D At this time, COPC=0.5, and the corresponding input power is 2×(15 / 0.5)=60W.

[0060] It can be seen that the method of determining the optimal input current using the current and cooling efficiency curve can save the system 100-60=40W of energy consumption.

[0061] Figure 5 The present invention is a flowchart of a temperature adjustment method according to another embodiment of the present invention.

[0062] See also Figure 5 In one embodiment, the method further includes: operation 501, when the first heating temperature corresponding to the heating element exceeds the safety temperature threshold, determining the second enabling quantity and the second input current corresponding to the heat sink; operation 502, controlling the second enabling quantity of heat sinks to cool the heating element under the second input current.

[0063] It can be understood that the first heating temperature is the real-time temperature when the heating element is running, which can also be monitored and obtained by the corresponding temperature monitoring device. During the operation of the heating element, the power consumption, heating temperature and ambient temperature corresponding to the heating element will change according to different operating scenarios. Therefore, it is necessary to monitor the power consumption, heating temperature and ambient temperature corresponding to the heating element in real time to adjust the input current and enable quantity of the heat sink in real time to ensure that the heat sink performs temperature regulation on the heating element in the optimal working mode.

[0064] Specifically, in operation 501, the method monitors the first heating temperature of the heating element in real time through the temperature monitoring device, and determines whether the first heating temperature exceeds the safety temperature threshold. The safety temperature threshold can be the maximum temperature limit of the operation of the heating element, that is, when the first heating temperature of the heating element exceeds the safety temperature threshold, the heating element will not be able to operate normally. When it is determined that the first heating temperature exceeds the safety temperature threshold, it is necessary to redetermine the hot surface temperature corresponding to the heating element and the cold and hot surface temperature difference corresponding to the heat sink according to the operation mode provided in operation 102, redetermine the corresponding current and cooling efficiency curve, and determine the corresponding second input current according to the current and cooling efficiency curve, and redetermine the second enabled number according to the corresponding current and cooling power curve. In operation 502, the heat sinks of the second enabled number are controlled to cool the heating element under the second input current, thereby achieving rapid, efficient and low-energy cooling of the heating element to avoid the heating element from being unable to operate.

[0065] It is understandable that the safety temperature threshold is usually a higher temperature value, and the cooling power required to adjust the temperature is higher. If the number of enabled heat sinks is not adjusted, the cooling power of heat sinks with a fixed number of enabled heat sinks can only be increased by increasing the input current. This method is not conducive to reducing energy consumption and the improvement of cooling power is also relatively limited. Therefore, when the heating element exceeds the safety temperature threshold, the method redetermines the corresponding efficiency information to redetermine the corresponding second enabled number and second input current, so as to effectively adjust the temperature of the heating element while meeting the low energy consumption requirement.

[0066] In one embodiment, operation 501, determining a second enabled quantity and a second input current corresponding to the heat sink, includes: first, determining a second power consumption and a second ambient temperature corresponding to the heat sink; then, determining a second cooling power corresponding to the heat sink based on the second power consumption and the second ambient temperature; and then, determining a second enabled quantity and a second input current corresponding to the heat sink based on the second cooling power and the second ambient temperature.

[0067] In operation 501, the second power consumption is also the real-time power consumption of the monitored heating element, which is different from the first power consumption only in expression for easy distinction. Specifically, the second power consumption is the real-time power consumption of the heating element with different values ​​monitored at different times from the first power consumption. The second ambient temperature is the monitored real-time ambient temperature, which is monitored and obtained in the same way as the first ambient temperature indicated by operation 101. The second ambient temperature in operation 501 is the real-time ambient temperature corresponding to the time when the second power consumption is monitored, and the first ambient temperature in operation 101 is the real-time ambient temperature corresponding to the time when the first power consumption is monitored. It is understandable that the value of the second ambient temperature may be the same as the value of the first ambient temperature indicated by operation 101, or it may be different from the value of the first ambient temperature indicated by operation 101.

[0068] Then, referring to operation 101, a second cooling power corresponding to the heating element is determined according to the second power consumption and the second ambient temperature. It is understandable that when the first power consumption is different from the second power consumption, the second cooling power and the first cooling power usually vary.

[0069] Referring to operation 102, the second enabled number and the second input current corresponding to the heat sink can be determined according to the second cooling power and the second ambient temperature. Specifically, the second temperature difference between the hot and cold surfaces can be determined according to the first target temperature and the second ambient temperature, and the corresponding current and cooling efficiency curve can be determined according to the first target temperature and the second temperature difference between the hot and cold surfaces. The optimal input current is determined from the current and cooling efficiency curve, and the cooling power corresponding to a single heat sink is determined from the current and cooling power curve according to the optimal input current. The enabled number of heat sinks that need to be controlled for temperature regulation can be obtained by calculating the cooling power required by the heating element and the cooling power provided by a single heat sink. It can be supplemented that the first target temperature can be adjusted according to actual conditions.

[0070] Finally, the heat sinks corresponding to the enabled number are controlled to adjust the temperature of the heating element according to the optimal input current.

[0071] Figure 6 The present invention is a flowchart of a temperature regulation method according to another embodiment of the present invention.

[0072] See also Figure 6In one embodiment, the method further includes: operation 601, when the first heating temperature corresponding to the heating element exceeds the operating temperature threshold, determining the third input current corresponding to the heat sink according to the first enabled number; operation 602, controlling the first enabled number of heat sinks to cool the heating element under the third input current.

[0073] It should be noted that the method may first perform operations 501 and 502, and then perform operations 601 and 602. The operating temperature threshold can be used to characterize the temperature range of normal operation of the heating element or the temperature range of operation of the heating element in the optimal state. That is, the heating element has a better operating effect when operating below the operating temperature threshold. It should be supplemented that the operating temperature threshold is usually less than the safety temperature threshold. When the safety temperature threshold is not exceeded, the heating temperature of the heating element is usually relatively stable, and the temperature fluctuation is less during the real-time temperature monitoring process. At this time, the real-time hot and cold surface temperature difference can be determined according to the real-time heating temperature corresponding to the heating element and the real-time ambient temperature, and then the optimal input current is determined from the corresponding current and cooling efficiency curve according to the real-time heating temperature and the real-time hot and cold surface temperature difference, and the input current of the heat sink is adjusted according to the optimal input current, so that the heat sink always cools the heating element at the highest cooling efficiency.

[0074] In one embodiment, operation 601, determining a third input current corresponding to the heat sink according to the first enabled quantity, includes: first, obtaining a third ambient temperature, and determining a third cold and hot surface temperature difference corresponding to the heat sink according to the third ambient temperature and the first target temperature; then, determining a third input current according to the third ambient temperature and the third cold and hot surface temperature difference; and then, controlling the heat sink corresponding to the first enabled quantity to cool the heat sink under the third input current.

[0075] Specifically, in operation 601, the temperature around the heating element is first monitored by a monitoring device to determine a third ambient temperature. Similarly, the third ambient temperature is the real-time ambient temperature of the temperature around the heating element. It is monitored and obtained in the same way as the first ambient temperature and the second ambient temperature, and has the same nature. It is renamed only for the convenience of distinction. Its value may be the same as or different from the first ambient temperature and the second ambient temperature. Specifically, the third ambient temperature, the first ambient temperature, and the second ambient temperature may be temperatures monitored and obtained at different time points.

[0076] The third hot and cold surface temperature difference corresponding to the heating element is determined according to the third ambient temperature and the first target temperature, and the third input current is determined according to the third ambient temperature and the third hot and cold surface temperature difference in the same manner as the above-mentioned operations 501 and 502, and also in the same manner as operations 101 and 102.

[0077] Figure 7This is a schematic diagram of the system structure of a temperature control system according to yet another embodiment of the present application.

[0078] See also Figure 7 To facilitate further understanding of the above-mentioned embodiments, a temperature regulation system is provided below, which includes: a controller 701, a heating element 702 and a heat sink 703; the controller 701 regulates the temperature of the heat sink 703 according to any of the above-mentioned temperature regulation methods, so as to cool the heating element 702 through the heat sink 703.

[0079] Specifically, the heating element 702 is a central processing unit, and the heat dissipation element 703 is a semiconductor cooling sheet.

[0080] In this embodiment, when the heating element 702 is a central processing unit, the controller 701 can be the central processing unit, and the controller 701 and the heating element 702 can be the same module. The semiconductor cooling plates are connected to the central processing unit to cool the central processing unit and are controlled by the central processing unit; the central processing unit is connected to a temperature sensor to determine the heating temperature of the central processing unit and the ambient temperature around the central processing unit, and the power consumption of the central processing unit is determined through power consumption monitoring.

[0081] The controller 701 may also be independent of the central processing unit, and the controller 701 and the heating element 702 may be different modules, and the semiconductor cooling sheet is connected to the central processing unit to cool the central processing unit. The controller 701 determines the heating temperature of the central processing unit and the ambient temperature around the central processing unit through a temperature sensor, and determines the power consumption of the central processing unit through power consumption monitoring.

[0082] First, when the CPU starts running, the controller 701 controls a preset number of semiconductor cooling chips to perform temperature regulation with a preset current. The power consumption corresponding to the CPU, the heating temperature corresponding to the CPU, and the ambient temperature around the CPU are determined through power consumption monitoring and temperature monitoring, and the cooling power required by the CPU is determined through the power consumption of the CPU.

[0083] Then, the temperature difference between the hot and cold surfaces of the semiconductor refrigeration chip is determined according to the heating temperature corresponding to the CPU and the ambient temperature around the CPU, and the optimal input current is determined in the current and cooling efficiency curve according to the temperature difference between the hot and cold surfaces of the semiconductor refrigeration chip and the heating temperature of the CPU. The cooling power of a single semiconductor refrigeration chip under the optimal input current is determined according to the current and cooling power curve.

[0084] Then, the cooling power required by the CPU is divided by the cooling power of a single semiconductor cooling chip to determine the corresponding enabled number of semiconductor cooling chips, and the semiconductor cooling chips corresponding to the enabled number are controlled to operate according to the optimal input current to cool the CPU.

[0085] Afterwards, during the operation of the central processing unit, the power consumption, heating temperature and ambient temperature corresponding to the central processing unit are monitored in real time.

[0086] If the temperature of the CPU is detected to exceed the safety temperature threshold, the corresponding optimal input current and enabled quantity are re-determined based on the power consumption, heating temperature and ambient temperature obtained by monitoring. The corresponding enabled number of semiconductor cooling chips are controlled to operate according to the optimal input current to cool the CPU.

[0087] If the temperature of the CPU is detected to exceed the operating temperature threshold, the corresponding optimal input current and enabled quantity are re-determined based on the monitored heating temperature and ambient temperature. The corresponding enabled number of semiconductor cooling chips are controlled to operate according to the optimal input current to cool the CPU. Real-time temperature control of the CPU is achieved.

[0088] A design scenario of a temperature control system is also provided below.

[0089] Figure 8 This is another embodiment of the present application and an efficiency parameter control diagram of a temperature control system.

[0090] See also Figure 8 First, based on the maximum cooling capacity and temperature difference range of the temperature control system, the TEC size and maximum number required by the system are designed. According to the current and cooling power curves and current and cooling efficiency curves of this model of TEC under different working conditions (hot surface temperature and temperature difference), a reference table of the number of TECs required to be started in different cooling capacities and temperature difference ranges is developed. The TEC maximum efficiency parameter control table is defined as shown in the following table:

[0091] △T Q I 1 △T1 Q1 I1 2 △T2 Q2 I2 3 △T3 Q3 I3 4 △T4 Q4 I4

[0092] Combination Figure 8 As shown in the table above, during system operation, the number of TECs that need to be started is determined based on the current system operating conditions.

[0093] After the system is started, the CPU temperature, power consumption and external ambient temperature are monitored in real time to determine whether the current temperature meets the CPU temperature target value. If not, the required TEC hot and cold surface temperature difference is confirmed to determine the number of TECs to be started. Then, according to the TEC maximum efficiency parameter control table, the current TEC input current is adjusted to the corresponding current of the maximum efficiency point.

[0094] Fig. 9 This is a schematic diagram of an implementation module of a temperature adjustment device according to an embodiment of the present application.

[0095] See also Fig. 9 On the other hand, an embodiment of the present application provides a temperature regulation device, which includes: a determination module 801, which is used to determine a first cooling power corresponding to the heating element according to a first power consumption corresponding to the heating element and a first ambient temperature; the determination module 801 is also used to determine a first input current and a first enabled number corresponding to the heat sink according to the first cooling power and the first ambient temperature; wherein the cooling efficiency of the heat sink is the highest under the first input current; and a control module 802, which is used to control the first enabled number of heat sinks to perform cooling treatment on the heat sink under the first input current.

[0096] In one embodiment, the determination module 801 includes: a first determination submodule 8011, used to determine a first temperature difference between hot and cold surfaces of the heating element according to a first heating temperature corresponding to the heating element and a first ambient temperature; a second determination submodule 8012, used to determine a first input current according to the first temperature difference between hot and cold surfaces and the first ambient temperature; and a third determination submodule 8013, used to determine a first enabled quantity according to the first input current and a first cooling power.

[0097] In one embodiment, the second determining submodule 8012 includes: determining heat sink efficiency information corresponding to the first cold and hot surface temperature difference and the first ambient temperature; and determining a first input current corresponding to the heat sink according to the heat sink efficiency information.

[0098] In one possible implementation, the determination module 801 is also used to determine the second enabled number and the second input current corresponding to the heat sink when the first heating temperature corresponding to the heat sink exceeds the safety temperature threshold; the control module 802 is also used to control the second enabled number of heat sinks to cool the heat sink under the second input current.

[0099] In one embodiment, the determination module 801 includes: determining a second power consumption and a second ambient temperature corresponding to the heat generating element; determining a second cooling power corresponding to the heat generating element based on the second power consumption and the second ambient temperature; and determining a second enabled number and a second input current corresponding to the heat dissipating element based on the second cooling power and the second ambient temperature.

[0100] In one possible implementation, the determination module 801 is also used to determine the third input current corresponding to the heat sink according to the first enabled number when the first heating temperature corresponding to the heat sink exceeds the operating temperature threshold; the control module 802 is also used to control the first enabled number of heat sinks to cool the heat sink under the third input current.

[0101] In one possible implementation, the determination module 801 includes: obtaining a third ambient temperature, determining a third hot and cold surface temperature difference corresponding to the heating element according to the third ambient temperature and the first heating temperature; determining a third input current according to the third ambient temperature and the third hot and cold surface temperature difference; and controlling the heat sink corresponding to the first enabled quantity to cool the heating element under the third input current.

[0102] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0103] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0104] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A temperature regulation method, the method comprising: Determine a first cooling power corresponding to the heating element according to a first power consumption corresponding to the heating element and a first ambient temperature; Determining a first input current corresponding to the heat sink according to the first ambient temperature; wherein the cooling efficiency of the heat sink is the highest under the first input current; Determining a first enabled quantity corresponding to the heat sink according to the first cooling power and the first input current; The first enabled number of heat sinks are controlled to cool the heat generating element under the first input current.

2. The method according to claim 1, wherein determining a first input current corresponding to a heat sink according to the first ambient temperature comprises: Determining a first cold and hot surface temperature difference of the heating element according to a first target temperature corresponding to the heating element and the first ambient temperature; The first input current is determined according to the first cold and hot surface temperature difference and the first ambient temperature.

3. The method according to claim 2, determining the first input current according to the first cold and hot surface temperature difference and the first ambient temperature, comprising: Determine heat sink efficiency information corresponding to the first cold and hot surface temperature difference and the first ambient temperature; A first input current corresponding to the heat sink is determined according to the heat sink efficiency information.

4. The method according to claim 1, further comprising: When a first heating temperature corresponding to the heating element exceeds a safety temperature threshold, determining a second enabling quantity and a second input current corresponding to the heat sink; The second enabled number of heat sinks are controlled to cool the heat generating element under the second input current.

5. The method according to claim 4, wherein determining the second enabled number and the second input current corresponding to the heat sink comprises: Determine a second power consumption and a second ambient temperature corresponding to the heating element; determining a second cooling power corresponding to the heating element according to the second power consumption and the second ambient temperature; A second enabled quantity and a second input current corresponding to the heat sink are determined according to the second refrigeration power and the second ambient temperature.

6. The method according to claim 1, further comprising: When a first heating temperature corresponding to the heating element exceeds an operating temperature threshold, determining a third input current corresponding to the heat sink according to the first enabled quantity; The first enabled number of heat sinks are controlled to cool the heat generating element under the third input current.

7. The method according to claim 6, wherein determining a third input current corresponding to the heat sink according to the first enabled quantity comprises: Obtaining a third ambient temperature, and determining a third cold and hot surface temperature difference corresponding to the heating element according to the third ambient temperature and the first heating temperature; Determine the third input current according to the third ambient temperature and the third cold and hot surface temperature difference; The heat sink corresponding to the first enabled quantity is controlled to perform a temperature reduction process on the heat generating element under the third input current.

8. According to the method described in any one of claims 1 to 7, the heat generating element is a central processing unit; and the heat dissipating element is a semiconductor cooling sheet.

9. A temperature regulating device, comprising: a determination module, configured to determine a first cooling power corresponding to the heating element according to a first power consumption corresponding to the heating element and a first ambient temperature; The determination module is further configured to determine a first input current corresponding to the heat sink according to the first ambient temperature; wherein the cooling efficiency of the heat sink is the highest under the first input current; and determine a first enabled quantity corresponding to the heat sink according to the first cooling power and the first input current; The control module is used to control the first enabled number of heat sinks to cool the heat generating element under the first input current.

10. A temperature regulation system, comprising: Controllers, heating elements and heat sinks; The controller adjusts the temperature of the heat sink according to the temperature adjustment method according to any one of claims 1 to 8, so as to cool the heat sink.

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