Substrate detection method and device

By designing a substrate detection device including a polarizer and an image acquisition mechanism, the problems of poor age and insufficient accuracy of substrate detection in the prior art are solved, and a more efficient and accurate detection effect is achieved.

CN113740339BActive Publication Date: 2025-02-28BOE TECHNOLOGY GROUP CO LTD +1
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Patent Information

Application Number
CN202010468507.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-05-28
Publication Date
2025-02-28
Estimated Expiration
2040-08-23

AI Technical Summary

Technical Problem

The existing substrate detection device has problems such as poor aging and insufficient detection accuracy when found defects.

Method used

A substrate detection device is designed, including a first polarizer, a first light source and a first image acquisition mechanism, and an image is captured by incident, reflected and collected by polarizers to form a target image to complete detection.

Benefits of technology

The accuracy and efficiency of substrate detection are improved, and compared with manual inspection and traditional mechanical inspection, defects of substrate can be discovered more quickly and accurately.

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Abstract

The present disclosure relates to the technical field of substrate detection, and in particular to a substrate detection device and method, wherein the substrate detection device comprises a first polarizer, a first light source, and a first image acquisition mechanism. The first light source is used to provide light incident on the first polarizer from a first direction; the first image acquisition mechanism is used to receive light passing through the first polarizer from a second direction and form a first target image; and the first direction and the second direction are opposite.
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Description

Technical Field

[0001] The present disclosure relates to the technical field of substrate detection, and in particular, to a substrate detection device and method. Background Art

[0002] In the field of OLED display and other manufacturing, in order to effectively prevent and minimize the occurrence of unqualified products, it is necessary to control the substrate. Among them, substrate size measurement and appearance defect detection are the two most common detection methods.

[0003] In the prior art, substrate inspection generally uses manual extraction or feedback of preset position movement and motor torque value through a mechanical positioning mechanism to indirectly obtain physical information such as length, thickness, and size of the product. However, the above two inspection methods have the problems of poor timeliness in discovering defects and insufficient inspection accuracy.

[0004] Therefore, it is necessary to design a new substrate detection device and method.

[0005] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0006] The purpose of the present disclosure is to provide a substrate detection device and method, thereby overcoming the problems of poor timeliness in detecting defects and insufficient detection accuracy of substrate detection devices in the prior art, at least to a certain extent.

[0007] Other features and advantages of the present disclosure will become apparent from the following detailed description, or may be learned in part by the practice of the present disclosure.

[0008] According to a first aspect of the present disclosure, there is provided a substrate detection device, comprising:

[0009] A first polarizer;

[0010] A first light source, used to provide light incident on the first polarizer from a first direction;

[0011] A first image acquisition mechanism, wherein the first image acquisition mechanism is capable of receiving light transmitted through the first polarizer from a second direction and forming a first target image;

[0012] The first direction and the second direction are opposite.

[0013] In an exemplary embodiment of the present disclosure, the substrate detection device further includes:

[0014] A second polarizer is arranged coaxially with the first polarizer and is arranged on a side of the first polarizer away from the first image acquisition mechanism; and has the same polarization angle as the first polarizer;

[0015] The second light source is used to provide light incident on the second polarizer from a second direction.

[0016] In an exemplary embodiment of the present disclosure, the device further includes:

[0017] A second polarizer is arranged coaxially with the first polarizer and is arranged on a side of the first polarizer away from the first image acquisition mechanism;

[0018] A second light source, used to provide light incident on the second polarizer from a second direction;

[0019] A second image acquisition mechanism 5 is configured to receive light that passes through the second polarizer from a first direction;

[0020] Wherein, at least one of the first polarizer and the second polarizer comprises a polarization angle adjustment device.

[0021] In an exemplary embodiment of the present disclosure, the first light source includes:

[0022] A first array light source, used to provide light perpendicular to the first direction;

[0023] A first right-angle prism, comprising a first right-angle surface and a second right-angle surface, wherein the first right-angle surface is parallel to the first polarizer, and the second right-angle surface is parallel to the first direction, and the first right-angle prism is arranged between the first polarizer and the first image acquisition mechanism, and is used for converting light perpendicular to the first direction into light incident on the first polarizer from the first direction;

[0024] The second light source comprises:

[0025] A second array light source, used to provide light perpendicular to the second direction;

[0026] The second right-angle prism includes a third right-angle surface and a fourth right-angle surface, wherein the third right-angle surface is parallel to the second polarizer, and the fourth right-angle surface is parallel to the second direction. The second right-angle prism is arranged between the second polarizer and the second image acquisition mechanism 5, and is used for converting light perpendicular to the second direction into light incident on the second polarizer from the second direction.

[0027] In an exemplary embodiment of the present disclosure, the substrate detection device further includes:

[0028] A light diffuser, comprising a first light diffuser and a second light diffuser, wherein the first light diffuser is disposed between the first array light source and the first right-angle prism, and the second light diffuser is disposed between the second array light source and the second right-angle prism;

[0029] The light absorbing plate comprises a first light absorbing plate and a second light absorbing plate, wherein the first light absorbing plate is arranged on a side of the first right-angle prism away from the first array light source, and the second light absorbing plate is arranged on a side of the second right-angle prism away from the second array light source.

[0030] In an exemplary embodiment of the present disclosure, the substrate detection device further includes:

[0031] A second polarizer is arranged coaxially with the first polarizer and is arranged on a side of the first polarizer away from the first image acquisition mechanism, and has the same polarization angle as the first polarizer;

[0032] The second image acquisition mechanism 5 is configured to receive light that passes through the first polarizer from a first direction.

[0033] In an exemplary embodiment of the present disclosure, the substrate detection device further includes:

[0034] A transmission mechanism, used for fixing the substrate, and enabling the substrate to pass through the light entrance of the first image acquisition mechanism at a preset speed;

[0035] A control device is used to control the start and stop of the transmission mechanism and the first image acquisition mechanism according to the position of the substrate and the light entrance.

[0036] In an exemplary embodiment of the present disclosure, the substrate detection device further includes a processor, and the processor is used to:

[0037] Acquire a reference grayscale matrix based on a standard substrate;

[0038] Acquire a grayscale matrix to be tested according to the first target image;

[0039] Determine a detection threshold, and determine a detection function according to the grayscale matrix to be tested and the reference grayscale matrix;

[0040] Whether the substrate has defects is determined according to the detection function and the detection threshold.

[0041] According to one aspect of the present disclosure, there is provided a substrate detection method, comprising:

[0042] Providing polarized light incident from a first direction and passing through a first polarizer;

[0043] Collecting the polarized light reflected by the first surface to be measured of the substrate and transmitted through the first polarizer from a second direction, and generating a first target image;

[0044] The first direction is opposite to the second direction.

[0045] In an exemplary embodiment of the present disclosure, the method further includes:

[0046] Acquire a reference grayscale matrix based on a standard substrate;

[0047] Acquire a grayscale matrix to be tested according to the first target image;

[0048] Determine a first detection threshold, and determine a first detection function according to the grayscale matrix to be tested and the reference grayscale matrix;

[0049] It is determined whether the first surface to be tested of the substrate has defects according to the first detection function and a first detection threshold.

[0050] In an exemplary embodiment of the present disclosure, the substrate moves from a first detection point to a second detection point at a preset speed, and acquiring a grayscale matrix to be detected according to the first target image includes:

[0051] determining a distance between the first detection point and a second detection point;

[0052] Determining a sampling frame rate when acquiring the first target image;

[0053] The grayscale matrix to be tested is determined according to the first target image, the distance, the preset speed and the sampling frame rate.

[0054] In an exemplary embodiment of the present disclosure, the method further includes:

[0055] determining a single pixel ratio based on the standard substrate and the reference grayscale matrix;

[0056] The substrate size is detected according to the grayscale matrix to be measured and the single pixel ratio.

[0057] In an exemplary embodiment of the present disclosure, the method further includes:

[0058] Providing polarized light incident from a second direction and passing through a second polarizer;

[0059] The polarized light reflected by the second surface to be measured of the substrate and transmitted through the second polarizer from the first direction is collected to generate a second target image.

[0060] In an exemplary embodiment of the present disclosure, the method further includes:

[0061] Determine a second detection threshold, and determine a second detection function according to the grayscale matrix to be tested and the reference grayscale matrix;

[0062] Whether a second surface to be tested of the substrate has defects is determined according to the second detection function and the second detection threshold.

[0063] According to one aspect of the present disclosure, there is provided a substrate detection method, comprising:

[0064] Providing polarized light incident from a second direction and passing through a second polarizer;

[0065] Collecting the polarized light that passes through the second polarizer, the substrate, and the first polarizer in sequence from the second direction, and generating a third target image;

[0066] Wherein, the polarization angles of the first polarizer and the second polarizer are the same; or

[0067] Providing polarized light incident from a first direction and passing through a first polarizer;

[0068] Collecting the polarized light that passes through the second polarizer, the substrate, and the first polarizer in sequence from the first direction, and generating a fourth target image;

[0069] Wherein, the polarization angles of the first polarizer and the second polarizer are the same.

[0070] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects:

[0071] In a substrate detection device provided by an embodiment of the present disclosure, a first light source provides light incident on the first polarizer from a first direction, and a first image acquisition mechanism can receive light passing through the first polarizer from a second direction opposite to the first direction, and form a first target image to complete the detection of the substrate. Compared with the prior art, on the one hand, using the first image acquisition mechanism to obtain the first target image of the substrate to complete the detection of the substrate can obtain higher detection accuracy than manual detection; on the other hand, light is incident on the first polarizer from a first direction, and at the same time, the first image acquisition mechanism can receive light passing through the first polarizer from a second direction opposite to the first direction to realize image acquisition, and coaxial light is used to pass through the polarizer to improve the accuracy and contrast of image acquisition, which can improve the accuracy of substrate detection.

[0072] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0073] The drawings herein are incorporated into the specification and constitute a part of the specification, showing embodiments consistent with the present disclosure, and together with the specification, are used to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0074] Figure 1 The structure diagram of the substrate detection device in the first exemplary embodiment of the present disclosure is schematically shown;

[0075] Figure 2 The structure diagram of the substrate detection device in the third exemplary embodiment of the present disclosure is schematically shown;

[0076] Figure 3 Schematically showing the optical principle of the substrate detection device in the exemplary embodiment of the present disclosure;

[0077] Figure 4 A flow chart schematically illustrates a substrate detection method in an exemplary embodiment of the present disclosure;

[0078] Figure 5 The following schematically shows the imaging optical path diagram of the image acquisition mechanism in the exemplary embodiment of the present disclosure;

[0079] Figure 6 A schematic diagram schematically illustrates a method of measuring the length of a substrate using a substrate detection device in an exemplary embodiment of the present disclosure;

[0080] Figure 7 A schematic diagram schematically shows a method of measuring the width of a substrate using a substrate detection device in an exemplary embodiment of the present disclosure;

[0081] Figure 8 A flow chart schematically illustrates a method of detecting a substrate according to a captured image in an exemplary embodiment of the present disclosure;

[0082] Fig. 9 A schematic diagram schematically shows a method of measuring whether there are defects on the surface of a substrate according to an exemplary embodiment of the present disclosure;

[0083] Fig.10 A schematic diagram schematically illustrates a first target image in an exemplary embodiment of the present disclosure;

[0084] Fig.11 A schematic diagram schematically showing a substrate image obtained in the related art;

[0085] Fig.12 Schematically showing a flow chart of detecting the size of a substrate in an exemplary embodiment of the present disclosure;

[0086] Fig.13Schematically showing the grayscale effect of dimension measurement simulation in an exemplary embodiment of the present disclosure;

[0087] Fig.14 The flowchart of detecting internal defects of a substrate in an exemplary embodiment of the present disclosure is schematically shown. DETAILED DESCRIPTION

[0088] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be more comprehensive and complete and to fully convey the concepts of the example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0089] In addition, the accompanying drawings are only schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the figures represent the same or similar parts, and their repeated description will be omitted. Some of the block diagrams shown in the accompanying drawings are functional entities and do not necessarily correspond to physically or logically independent entities. These functional entities can be implemented in software form, or implemented in one or more hardware modules or integrated circuits, or implemented in different networks and / or processor devices and / or microcontroller devices.

[0090] In the related art, the measurement of substrates is generally done by manual sampling. In addition, mechanical measurement can also be used. The principle is to indirectly obtain physical information such as the length, thickness, and size of the product through the preset position movement of the mechanical positioning mechanism and the feedback of the motor torque value, but this type of measurement method has poor accuracy.

[0091] Alternatively, an inspection process is set up in the manufacturing process of the substrate to timely detect and reduce the large number of defective products. The above inspection process is still essentially a manual sampling inspection. The commonly used method is: using tools such as micrometers, eyepieces, microscopes, etc., to extract products in proportion from the production site for offline visual inspection, dimensional measurement, and qualification judgment. However, this method of relying on manual sampling to detect substrates has a lot of defects, such as poor timeliness in discovering defects and a large lag; when defective products are discovered, the number of defective products is large, causing large losses, etc. Secondly, once the detection ratio of unqualified substrates exceeds the set value, the entire batch will be scrapped or the entire batch will be inspected and sampled one by one, which will also cause large losses. Then, for visual inspection by personnel, limit samples are generally used for calibration; however, there may still be deviations in the judgment results between personnel, resulting in inconsistent measurement results. Finally, with the increase in continuous working time and work intensity, the false detection rate of substrate detection will increase further. At the same time, manual inspection will increase labor costs.

[0092] In this exemplary embodiment, based on the above-mentioned shortcomings, reference is made to Figure 1 As shown, firstly, a substrate detection device is provided, which may include a first polarizer 3, a first light source 1, and a first image acquisition mechanism 2. The first light source 1 is used to provide light incident on the first polarizer 3 from a first direction; the first image acquisition mechanism 2 is used to receive light passing through the first polarizer 3 from a second direction and form a first target image; and the first direction is opposite to the second direction.

[0093] According to the substrate detection device provided in this exemplary embodiment, compared with the prior art, on the one hand, the first image acquisition mechanism 2 is used to acquire the first target image of the substrate 9 to complete the detection of the substrate 9, which can obtain higher detection accuracy than manual detection; on the other hand, the light is incident on the first polarizer 3 from a first direction, and at the same time, the first image acquisition mechanism 2 can receive the light passing through the first polarizer 3 from a second direction opposite to the first direction to realize image acquisition, and the coaxial light is used to pass through the polarizer to improve the accuracy and contrast of image acquisition, which can improve the accuracy of substrate 9 detection.

[0094] In the first exemplary embodiment of the present disclosure, the substrate 9 may be a raw material for manufacturing a display device, or a semi-finished product obtained by subjecting the raw material to certain processing, which is not specifically limited in this exemplary embodiment.

[0095] In this example embodiment, the first polarizer 3 can be arranged coaxially with the light entrance of the first image acquisition mechanism 2, so that the first image acquisition mechanism 2 can collect light passing through the first polarizer 3 from the second direction and form a first target image.

[0096] In this example implementation, refer to Figure 1 As shown, the first light source 1 is used to provide light incident on the first polarizer 3 from a first direction. The first light source 1 may include a first array light source 12 and a first right-angle prism 11. The first array light source 12 is used to provide light perpendicular to the first direction. The first light source 1 may be an LED array light source. LED chips with different wavelength ranges and different arrangement numbers may be selected according to different detection requirements to provide light with different wavelengths and different intensities for the detection system.

[0097] In this exemplary embodiment, the first right angle prism 11 is used to convert the light perpendicular to the first direction into the light incident on the first polarizer 3 in the first direction. The first right angle prism 11 may include a first right angle surface, a second right angle surface and a first inclined surface, wherein the first right angle surface may be arranged in parallel with the first polarizer 3, and the second right angle surface is parallel to the first direction. The light provided by the first array light source 12 is incident on the first right angle prism 11 from the first inclined surface, reflected by the first inclined surface and passes through the first polarizer 3 from the first direction. When used, the substrate 9 is arranged parallel to the first polarizer 3 on the side of the first polarizer 3 away from the first image acquisition mechanism 2, and the light passing through the first polarizer 3 from the first direction becomes polarized light. After being reflected by the substrate 9, the polarization angle of the polarized light does not change, and can pass through the first polarizer 3 again, and then be received by the first image acquisition mechanism 2 through the first right angle prism 11, and form a first target image about the substrate 9.

[0098] In this example embodiment, depending on the wavelength of the light source, the first right-angle prism 11 can be made of optical glass (K9) prism, quartz glass prism and other materials. Its function is to change the propagation direction of the light emitted by the first light source 1. In this example embodiment, the material of the first right-angle prism is not specifically limited.

[0099] In an example embodiment of the present disclosure, the first image acquisition mechanism 2 may include a first image acquisition device 21 and a first imaging lens 22, wherein the first image acquisition device 21 may be a line array charge coupled device (LCCD), a surface array charge coupled device (CCD), or a complementary metal oxide semiconductor (CMOS), which is not specifically limited in this example embodiment.

[0100] In this example implementation, the first imaging lens 22 is connected to the first image collector 21, and the first imaging lens 22 can be arranged with the first image collector 21 through a central axis. The specific connection can be a snap connection, a bolt connection, etc., which is not specifically limited in this example implementation.

[0101] In this example embodiment, the first imaging lens 22 is used to image the surface of the substrate 9 or an area within a preset size range of the substrate 9. The preset size range can be customized according to the detection requirements and is not specifically limited in this example embodiment. The first imaging lens 22 completes the imaging of the surface of the substrate 9 or an area within a preset size range of the substrate 9 and obtains the first target image via the first image collector 21.

[0102] In this example embodiment, the substrate detection device disclosed herein may further include a transmission mechanism and a control device. The transmission mechanism may be used to fix the above-mentioned substrate 9 so that the above-mentioned substrate 9 can pass through the light entrance of the first image acquisition mechanism 2 at a preset speed. The control device is connected to the transmission mechanism and the first image acquisition mechanism 2, and is used to control the start and stop of the transmission mechanism and the first image acquisition mechanism 2 according to the positional relationship between the substrate 9 and the light entrance.

[0103] In this exemplary embodiment, the substrate 9 may be fixed to the transmission mechanism by bonding, or by other means such as snaps, bolts, etc., which is not specifically limited in this exemplary embodiment.

[0104] In this example embodiment, the transmission structure can be a conveyor belt, and the driving device of the conveyor belt is connected to the above-mentioned controller. The controller controls the start and stop of the transmission belt by controlling the driving device. It should be noted that the transmission mechanism only needs to enable the substrate 9 to pass through the light entrance of the first image acquisition mechanism 2 at a preset speed. In this example embodiment, the specific structure of the transmission mechanism is not limited.

[0105] In this exemplary embodiment, when the movement direction of the substrate 9 is close to the first image acquisition mechanism 2, when the distance between the edge of the substrate 9 and the light entrance of the first image acquisition mechanism 2 is less than or equal to the preset distance, the controller turns on the first image acquisition mechanism 2 for image acquisition, and when the movement direction of the substrate 9 is away from the first image acquisition mechanism 2, when the distance between the edge of the substrate 9 and the light entrance of the first image acquisition mechanism 2 is greater than or equal to the preset distance, the controller turns off the first image acquisition mechanism 2 and the above-mentioned driving device at the same time. Image acquisition of the substrate 9 is completed.

[0106] In this example implementation, the preset speed can be customized according to the detection requirements, and is not specifically limited in this example implementation. The preset distance can be adjusted according to the detection requirements and the preset speed, and is not specifically limited in this example real-time mode.

[0107] In a second exemplary embodiment of the present disclosure, referring to Figure 2As shown, the substrate 9 detection device disclosed in the present invention may also include a second polarizer 6 and a second light source 4. The second polarizer 6 is arranged coaxially with the first polarizer 3. The second polarizer 6 is arranged on the side of the first polarizer 3 away from the first image acquisition mechanism 2, and has the same polarization angle as the first polarizer 3. The second light source 4 can provide light incident on the second polarizer 6 from a second direction.

[0108] In this example implementation, refer to Figure 2 As shown, the second light source 4 is used to provide light incident on the second polarizer 6 from a second direction. The second light source 4 may include a second array light source 41 and a second right-angle prism 42. The second array light source 41 is used to provide light perpendicular to the second direction. The second light source 4 may be an LED array light source. LED chips with different wavelength ranges and different arrangement numbers may be selected according to different detection requirements to provide light with different wavelengths and different intensities for the detection system.

[0109] The second right-angle prism 42 is used to convert the light perpendicular to the second direction into the light incident on the second polarizer 6 in the second direction. The second right-angle prism 42 may include a third right-angle surface, a fourth right-angle surface and a second inclined surface, wherein the third right-angle surface may be arranged in parallel with the second polarizer 6, and the fourth right-angle surface is parallel to the second direction. The light provided by the second array light source 41 enters the second right-angle prism 42 from the inclined surface, is reflected by the second inclined surface and is emitted from the second direction to the second polarizer, and passes through the second polarizer 6. When used, the substrate 9 is arranged parallel to the second polarizer 6 on the side of the second polarizer 6 away from the first image acquisition mechanism 2. The light passing through the second polarizer 6 becomes polarized light. The polarized light passes through the substrate 9, and the polarization angle of the polarized light does not change. It can pass through the second polarizer 6, and then through the first right-angle prism 11, and is received by the first image acquisition mechanism 2, and forms a third target image about the substrate 9.

[0110] In the real-time mode of this example, depending on the wavelength of the light source, the second right-angle prism 42 can be made of optical glass (K9) prism, quartz glass prism and other materials, and its function is to change the propagation direction of the light emitted by the second light source 4.

[0111] In another exemplary embodiment of the present disclosure, the second light source 4 only includes the second array light source 41, which is disposed on a side of the second polarizer 6 away from the first polarizer 3, and a light outlet of the second array light source 41 is parallel to the second direction.

[0112] In this exemplary embodiment, the first light source 1 is turned off, and the second light source 4 provides light, which can be used to detect whether there are defects inside the substrate 9. In this exemplary embodiment, the polarization angles of the first polarizer 3 and the second polarizer 6 are the same, so that the second light source 4 can provide parallel light that passes through the second polarizer 6, the substrate 9 and the first polarizer 3, and the first image acquisition mechanism 2 performs image acquisition to complete the detection of defects inside the substrate 9.

[0113] In this exemplary embodiment, the substrate 9 detection device disclosed herein may further include a transmission mechanism and a control device. The specific structures of the transmission mechanism and the control device have been described in detail above, and therefore, they will not be repeated here.

[0114] In the third exemplary embodiment of the present disclosure, referring to Figure 2 and Figure 3 As shown, the substrate 9 detection device disclosed in the present invention may further include a second polarizer 6, a second light source 4, and a second image acquisition mechanism 5, wherein the second light source 4 includes a second array light source 41 and a second prism. The second polarizer 6, the second array light source 41 and the second prism have been described in detail above, so they will not be repeated here.

[0115] In this exemplary embodiment, the second image acquisition mechanism 5 is disposed on a side of the second polarizer 6 away from the first polarizer 3 , and is used to receive light that passes through the second polarizer 6 from a first direction.

[0116] In this example embodiment, the second image acquisition mechanism 5 may include a second image acquisition device 51 and a second imaging lens 52, wherein the second image acquisition device 51 may be a line array charge coupled device (LCCD), a surface array charge coupled device (CCD), or a complementary metal oxide semiconductor (CMOS), which is not specifically limited in this example embodiment.

[0117] In this example implementation, the second imaging lens 52 can be arranged with the image collector 51 through the central axis. The specific connection between the second imaging lens 52 and the above-mentioned second image collector 51 can be a snap connection, a bolt connection, etc., which is not specifically limited in this example implementation.

[0118] In this example embodiment, the second imaging lens 52 is used to image the surface of the substrate 9 or an area within a preset range of the substrate 9. The preset range can be customized according to the detection requirements and is not specifically limited in this example embodiment.

[0119] In this exemplary embodiment, at least one of the first polarizer 3 and the second polarizer 6 includes a polarization angle adjustment device 31, which can adjust the polarization angle of the polarizer. In this exemplary embodiment, the polarization angles of the first polarizer 3 and the second polarizer 6 can be adjusted by the polarization angle adjustment device 31 so that the polarization angles of the first polarizer 3 and the second polarizer 6 are perpendicular to each other. For example, the polarization angle of the first polarizer 3 is adjusted to 45 degrees, and the polarization angle of the second polarizer 6 is adjusted to 135 degrees, so that the light provided by the first light source 1 cannot be transmitted to the second image acquisition mechanism 5 through the second polarizer 6, and the light provided by the second light source 4 cannot be transmitted to the first image acquisition mechanism 2 through the second polarizer. The substrate detection device of this exemplary embodiment can detect both the front and back surfaces of the substrate 9 at the same time, which can improve the detection efficiency.

[0120] In this example implementation, if Figure 1 , 2 As shown, the substrate 9 detection device may further include a light homogenizing plate 7 and a light absorbing plate 8. The light homogenizing plate 7 may include a first light homogenizing plate 71 and a second light homogenizing plate 72. The first light homogenizing plate 71 may be arranged between the first array light source 12 and the first right-angle prism 11, and the second light homogenizing plate 72 may be arranged between the second array light source 41 and the second right-angle prism 42. The light homogenizing plate 7 may make the spatial distribution of the light emitted by the first array light source 12 and the second entire array of light sources more uniform.

[0121] In this exemplary embodiment, the light absorbing plate 8 includes a first light absorbing plate 81 and a second light absorbing plate 82. The first light absorbing plate 81 can be disposed on a side of the first rectangular prism 11 away from the first array light source 12, and the second light absorbing plate 82 can be disposed on a side of the second rectangular prism 42 away from the second array light source 41. The light absorbing plate 8 can be used to absorb useless light waves to avoid interference with the detection device.

[0122] In this exemplary embodiment, the substrate 9 detection device disclosed herein may further include a transmission mechanism and a control device. The specific structures of the transmission mechanism and the control device have been described in detail above, and therefore, they will not be repeated here.

[0123] In the fourth exemplary embodiment of the present disclosure, the substrate 9 detection device of the present disclosure may further include a second polarizer 6 and a second image acquisition mechanism 5. The specific structures of the second polarizer 6 and the second image acquisition mechanism 5 have been described in detail above, so they will not be repeated here.

[0124] In this exemplary embodiment, the first image acquisition mechanism 2 does not work, and the second image acquisition mechanism 5 completes the image acquisition, thereby completing the detection of internal defects of the substrate 9 .

[0125] In this exemplary embodiment, the substrate detection device of the present disclosure may further include a transmission mechanism and a control device. The specific structures of the transmission mechanism and the control device have been described in detail above, so they will not be repeated here.

[0126] In this example embodiment, the substrate 9 detection device may further include a processor for processing the first target image to obtain a detected defect. The processor may be used to perform the following process: obtaining a reference grayscale matrix based on a standard substrate 9; obtaining a grayscale matrix to be tested based on the first target image; determining a detection threshold, and determining a detection function based on the grayscale matrix to be tested and the reference grayscale matrix; judging whether the substrate 9 has a defect based on the detection function and the detection threshold. For a specific description of the process performed by the processor, please refer to the specific description in the substrate detection method described below.

[0127] The present disclosure also provides a method for detecting a substrate 9, referring to Figure 4 As shown, the substrate 9 detection method in this exemplary embodiment may include the following steps:

[0128] Step S410, providing polarized light incident from a first direction and passing through a first polarizer;

[0129] Step S420, collecting the polarized light reflected by the surface to be measured of the substrate and passing through the first polarizer from a second direction, and generating a first target image; wherein the first direction is opposite to the second direction.

[0130] Hereinafter, each step of the substrate detection method in this exemplary embodiment will be described in more detail with reference to the accompanying drawings and embodiments.

[0131] Step S410, providing polarized light incident from a first direction and passing through a first polarizer.

[0132] In an exemplary embodiment of the present disclosure, the first light source 1 provides a first light, which becomes polarized light after passing through the first polarizer 3 . The polarized light is obtained after the light is incident from a first direction and passes through the first polarizer 3 .

[0133] Step S420 , collecting the polarized light reflected by the surface to be measured of the substrate and transmitted through the first polarizer from a second direction, and generating a first target image.

[0134] In an exemplary embodiment of the present disclosure, the polarized light irradiates the substrate 9 and is reflected by the substrate 9 , passes through the first polarizer 3 again, and is captured by the first image capture mechanism 2 to form a first target image.

[0135] In an exemplary embodiment of the present disclosure, referring to Figure 5As shown, when the above substrate 9 detection device is used for detection for the first time, the working distance WD (Work Distance) of the imaging lens of the measurement system can be initially adjusted before detection. That is, the surface of the substrate 9 can be clearly imaged on the photosensitive surface of the image collector through the imaging lens. Secondly, a suitable fixing method can also be selected to fix the above substrate 9 on the above transmission mechanism. The specific fixing method has been described in detail when describing the above substrate detection device, so it will not be repeated here.

[0136] In this exemplary embodiment, the initial data of the substrate measured manually can be first obtained, and the first detection point and the second detection point can be determined according to the initial data. Figure 6 As shown, the initial data of the length L0 and width W0 of the substrate 9 are manually measured. According to the manually measured size L0 of the substrate 9, the axis center of the first image acquisition mechanism 2 in the substrate detection device can be set as the 0 point, and the first detection point A can be set:

[0137] -L0 / 2-2000(um)

[0138] The second detection point B:

[0139] L0 / 2+2000(um)

[0140] Similarly, refer to Figure 7 As shown, the axis center of the first image acquisition mechanism 2 of the substrate 9 detection device is set as point 0, and the first detection point A is set in the main control program as: -W0 / 2-2000 (um)

[0141] The second detection point B is:

[0142] W0 / 2+2000(um)

[0143] In this exemplary embodiment, the standard substrate 9 may be used to replace the substrate to be tested 9. Under the same WD condition, the actual size corresponding to a single pixel value in the scanned image may be calculated, and the pixel ratio may be defined as:

[0144] R1 = Standard card size / number of pixels

[0145] In this example implementation, the settings of the first detection point and the second detection point can be customized according to needs and are not specifically limited in this example implementation.

[0146] Reference Figure 8 As shown, the substrate detection method of the present disclosure may also include the following steps S810 to S840, which are described in detail below:

[0147] In step S810 , a reference grayscale matrix is ​​obtained according to a standard substrate.

[0148] In this exemplary embodiment, a standard substrate 9 can be selected and installed on the substrate detection device. The preset speed of the transmission mechanism is controlled to be V3 to drive the standard substrate 9 from the first detection point A to the second detection point B, and the distance S3 between AB is determined at the same time, then:

[0149] S3=L0 / 2+2000(um)-[-L0 / 2-2000(um)]=L0+4000(um)

[0150] In this exemplary embodiment, the moving time t3 of the standard substrate 9 from the first detection point A to the second detection point B can be calculated according to the distance between AB and the above-mentioned preset speed, specifically:

[0151]

[0152] In this example implementation, the resolution and sampling frame rate of the image acquisition mechanism 22 can be determined. Specifically, the first image acquisition mechanism 2 with a resolution of P is used, and the scanning sampling is performed at a sampling frame rate (Frame rate) F3. The number of image (one-dimensional image) frames sampled per second is f3, and then the number of frames of the acquired image is calculated according to the sampling frame rate, which is specifically:

[0153]

[0154] At the same time, the first image acquisition mechanism 2 can be connected to a computer to store the acquired image data.

[0155] In this example embodiment, when the standard substrate 9 reaches position A, the first image acquisition mechanism is controlled to start working. When the standard substrate 9 reaches position B, the controller controls the first image acquisition mechanism 2 to stop working, the image storage ends, and a standard image is obtained.

[0156] In this example implementation, the standard image may be defined as I3, and the resolution of the standard image may be calculated. Specifically, its vertical resolution may be:

[0157]

[0158] Its lateral resolution can be:

[0159] R y =P

[0160] In this example implementation, after the standard image is stored, the stored standard image may be grayed to generate a reference gray matrix of the scanned image:

[0161]

[0162] Among them, Rx and Ry are the number of rows and columns of elements in the reference gray matrix respectively; g(R x R y ) is the grayscale value of the element in the x-th row and y-th column in the grayscale matrix. It is stored as a reference grayscale matrix of the sample standard substrate 9.

[0163] In step S820, a grayscale matrix to be tested is obtained according to the first target image.

[0164] In an exemplary embodiment of the present disclosure, the substrate 9 to be tested can be mounted on the above-mentioned transmission mechanism, and the grayscale matrix to be tested corresponding to the first target image of the surface of the substrate 9 to be tested can be obtained in the same way as the reference grayscale matrix:

[0165]

[0166] in, It is the grayscale value of the element in the Rx row and Ry column in the matrix.

[0167] In this example implementation, the matrix corresponding to each scanned image is Rx*Ry. However, in the actual measurement process, due to factors such as slight mechanical vibration, target image matching is required to reduce misjudgment. As a preferred method, a matrix of size M×N can be intercepted from the grayscale matrix corresponding to the reference image as the first reference matrix Then, starting from the mth row and nth column, intercept the M×N scanned image and convert it into the grayscale matrix to be tested. (1≤M+m≤Rx, 1≤N+n≤Ry); define the matching function:

[0168]

[0169] Expand the above matching function to get:

[0170]

[0171] In the above formula, the third term actually means the total energy of the first reference matrix; the first term is the grayscale matrix to be tested corresponding to the scanned image intercepted at the mth row and nth column. The second term is the correlation between the scanned image and the reference image as m and n change. The more they match, the larger the value (closer to 1). Define the first correlation function:

[0172]

[0173] In this real-time mode, when R(m,n) is close to or equal to 1, it means that the images are basically matched. If they are not matched, the image is intercepted from the mth row and nth column of the original image grayscale matrix again, and the M×N scanned image is converted into a matrix to be tested (1≤M+m≤Rx, 1≤N+n≤Ry), and the above process is repeated until the result matches.

[0174] In step S830, a first detection threshold is determined, and a first detection function is determined according to the grayscale matrix to be tested and the reference grayscale matrix.

[0175] In an exemplary implementation of the present disclosure, the single pixel absolute error may be defined first, which may be:

[0176]

[0177] in,

[0178] In this example implementation, a first detection threshold K1 may be determined, and a first detection function may be determined according to the grayscale matrix and the reference grayscale matrix. The first detection function may be:

[0179]

[0180] In this example implementation, the value of the first detection threshold K1 can be adjusted according to the actual detection effect to prevent over-detection and missed detection. In this example implementation, the specific value of the detection threshold is not limited.

[0181] In step S840, it is determined whether there is a defect on the first surface to be tested of the substrate 9 according to the detection function and the detection threshold.

[0182] In an exemplary embodiment of the present disclosure, when When the substrate 9 to be tested has defects, it can be determined that there are defects on the surface of the substrate 9 to be tested.

[0183] In this exemplary embodiment, when the system detects that there are defects on the surface of the substrate 9 to be tested, the server may sound an alarm to prompt the personnel to confirm. If it is manually determined that there are defects on any surface of the substrate to be tested, the product may need NG / Rework processing; if it is manually determined that there are no defects, the substrate 9 to be tested flows into the next device normally, and the system will wait for the next substrate 9 to be tested to enter and perform defect measurement.

[0184] In another exemplary embodiment of the present disclosure, the substrate 9 detection device may further include obtaining polarized light incident from a second direction and passing through a second polarizer 6; collecting the polarized light reflected by the surface to be tested of the substrate 9 and passing through the second polarizer 6 from a first direction, and generating a second target image. The second target image is processed as described above for the first target image to obtain a grayscale matrix to be tested corresponding to the second target image, and a second detection function is determined based on the grayscale matrix to be tested and a reference grayscale matrix; and judging whether the second surface to be tested of the substrate 9 has a defect based on the second detection function and a detection threshold.

[0185] Specifically, in this example implementation, the single pixel absolute error may be first defined, which may be:

[0186]

[0187] in,

[0188] The second detection threshold K2 can be determined, and the second detection function can be determined according to the gray matrix and the reference gray matrix. The second detection function can be:

[0189]

[0190] In this example implementation, the value of the second detection threshold K2 can be adjusted according to the actual detection effect to prevent over-detection and missed detection. In this example implementation, the specific value of the second detection threshold is not limited.

[0191] In this exemplary embodiment, the first surface to be tested of the substrate may be the upper surface of the substrate, and the second surface to be tested of the substrate may be the lower surface of the substrate. Specifically, when defect detection is performed on both sides of the substrate at the same time, reference is made to Fig. 9 As shown, step S910 can be executed first to determine whether it is the first startup, that is, whether it is the first time to detect the substrate. If this detection is the first time to detect the substrate, step S911, step S912, step S913, step S914, step S915 and step S916 can be executed first; the specific process of the first detection has been introduced in detail above, and can refer to step S810 and step S830; it will not be repeated here.

[0192] In this example implementation, if it is not the first detection, steps S920, S930, S940, and S950 can be first executed to mount the substrate to be detected on the transmission mechanism so that the substrate to be detected moves from the first detection point to the second detection point. When the substrate moves to the first detection point, the controller can control the first image acquisition mechanism and the second image acquisition mechanism 5 to start working. When the substrate to be detected reaches the second detection point, the controller can control the first image acquisition mechanism and the second image acquisition mechanism 5 to stop working and complete the acquisition of the first target image and the second target image. The first detection point and the second detection point can be used to obtain more appropriate images, which can complete accurate detection of the substrate without increasing the computing power of the server.

[0193] In this example implementation, the specific description of step S950, step S960 and step S961 can refer to the above step S820, which will not be repeated here. After determining that the correlation function is close to the target value, step S962 and step S964 are executed, wherein E % The specific methods for obtaining E3, K1, and K2 have been described in detail above and will not be repeated here.

[0194] In this example implementation, When the system alarms, step S966 can be executed, and it is determined that there are defects on the upper surface of the substrate. Step S970 is executed to manually determine whether the substrate has defects. If there are defects, step S990 is executed. If it is determined that there are no defects, step S980 is executed to determine that there are no defects on the upper surface of the substrate.

[0195] In this example implementation, When it is less than K1, step S964 is executed to determine the size of E3 and K2. When E3 is greater than K2, step S968 is executed, the system alarms, and determines that there are defects on the lower surface of the substrate, and step S970 is executed to manually determine whether the substrate has defects. If there are defects, step S990 is executed. If it is determined that there are no defects, step S980 is executed to determine that there are no defects on the upper surface of the substrate. When E3 is less than or equal to K2, step S980 is directly executed to determine that there are no defects on the upper surface of the substrate.

[0196] Reference Fig.10 and Fig.11 As shown, the substrate 9 detection method disclosed in the present invention can more effectively detect defects on the surface of the substrate 9, and can accurately determine whether the defects are located on the upper surface or the lower surface; in addition, the bending amount of the upper and lower edges is measured; the detection advantages for transparent and translucent products such as CG glass and thin film materials are particularly prominent.

[0197] In an exemplary embodiment of the present disclosure, the size of the substrate can also be detected, referring to Fig.12 As shown, first, step S1210 can be executed to determine whether the detection of the substrate is the first detection. If it is the first detection, steps S1211, S1212, S1213, S1214 and S1215 can be executed first. Specifically, referring to Figure 5 As shown, when the above substrate 9 detection device is used for the first time for detection, the working distance WD (Work Distance) of the imaging lens of the measurement system needs to be initially adjusted before detection. That is, it is required that the surface of the substrate 9 can be clearly imaged on the photosensitive surface of the image collector through the imaging lens. Secondly, select a suitable fixing method to fix the above substrate 9 to be tested and fix it on the driving device. Figure 6 As shown, the initial data of the length L0 and width W0 of the substrate 9 are manually measured. According to the manually measured size L0 of the substrate 9, the axis center of the first image acquisition mechanism 2 of the substrate detection device is taken as the 0 point, and the first detection point A is set in the main control program:

[0198] -L0 / 2-2000(um)

[0199] The second detection point B:

[0200] L0 / 2+2000(um)

[0201] Similarly, refer to Figure 7 As shown, the axis center of the first image acquisition mechanism 2 of the substrate 9 detection device is set as point 0, and the first detection point A is set in the main control program as: -W0 / 2-2000 (um)

[0202] The second detection point B is:

[0203] W0 / 2+2000(um)

[0204] In this exemplary embodiment, a standard substrate 9 may be used instead of the substrate to be tested 9. Under the same WD condition, the actual size corresponding to a single pixel value in the scanned image is calculated, and the pixel ratio is defined as:

[0205] R1 = Standard card size / number of pixels

[0206] In this example implementation, the definitions of the first detection point and the second detection point can be customized according to needs and are not specifically limited in this example implementation.

[0207] The substrate 9 detection method disclosed in the present invention can also detect the size of the substrate 9 to be tested. Specifically, in this exemplary embodiment, firstly, step S1220, step S1230 and step S1240 are performed. Specifically, the substrate 9 to be tested is installed on the above-mentioned substrate 9 detection device. The preset speed of the above-mentioned transmission mechanism is controlled to be V1 to drive the standard substrate 9 to move from the first detection point A to the second detection point B, and the distance S1 between AB is determined. When the substrate reaches the first detection point, the first image acquisition mechanism is controlled to work, and when the substrate to be tested reaches the second detection point, the first image detection mechanism is controlled to stop working. The distance S1 between AB can be specifically:

[0208] S % =L0 / 2+2000(um)-[-L0 / 2-2000(um)]=L0+4000(um)

[0209] In this exemplary embodiment, the moving time t1 of the standard substrate 9 from the first detection point A to the second detection point B can be calculated according to the distance between AB and the above-mentioned preset speed, specifically:

[0210]

[0211] In this example implementation, the resolution and sampling frame rate of the image acquisition mechanism 22 can be determined. Specifically, the first image acquisition mechanism 2 with a resolution of P is used, and scanning and sampling are performed at a sampling frame rate (Frame rate) F3, and scanning and sampling are performed at a sampling frame rate (Frame rate) F1. The number of frames of the image sampled per second is f1, then:

[0212]

[0213] At the same time, the first image acquisition mechanism 2 can be connected to a computer to store the acquired image data.

[0214] When the standard substrate 9 reaches position B, the controller controls the first image acquisition mechanism 2 to stop working and obtains a size measurement image. In this exemplary embodiment, the size measurement image can be the first target image, that is, the size of the substrate to be measured can be detected while detecting whether the substrate to be measured has defects.

[0215] In this example implementation, the size measurement image may be defined as I1, and its longitudinal resolution is:

[0216]

[0217] Its lateral resolution is:

[0218] R y =P

[0219] In this exemplary embodiment, after the storage is completed, steps S1250, S1260, and S1270 can be executed. Specifically, the detection operation module in the computer grayscales the stored dimensional measurement image to generate a dimensional measurement grayscale matrix of the scanned image:

[0220]

[0221] where x and y are the number of rows and columns of the elements in the grayscale matrix respectively; G 1 (x, y) is the grayscale value of the element in the x-th row and y-th column of the dimensional measurement grayscale matrix.

[0222] In this exemplary embodiment, as shown in Fig.13 the dimensional measurement grayscale matrix G 1 xy can be divided into two major parts, namely the background region 1301 and the target region 1302. Due to the introduction of the polarizer, the background region will appear black. Setting the first polarizer can significantly improve the image contrast.

[0223] In this exemplary embodiment, after completing the matrixization of the stored measurement image, steps S1260, S1270, S1280, and S1290 can also be executed. Specifically, the average grayscale values of the background region and the target region 1302 in the grayscale matrix can be set as g1 and g2, then the grayscale threshold can be set as g3, and here g1 < g3 < g2. The grayscale threshold only needs to meet the above conditions and is not specifically limited in this exemplary embodiment. Then, the dimensional measurement grayscale matrix can be segmented according to the grayscale threshold. Let the segmented grayscale sub-matrix be m rows (horizontally) and n columns (vertically, where 1 < m < x, 1 < n < y), then the actual size of the substrate to be measured is:

[0224] L % = n × R %

[0225] where R1 is the single-pixel ratio determined according to the standard substrate before automatic measurement.

[0226] In this exemplary embodiment, in order to avoid obvious deviations or errors in the detection results, the target value can be defined as T1:

[0227]

[0228] Set a specific confidence value such as 99%. If T1 ≤ 99%, the measurement result is not credible, and the grayscale matrix region of the substrate to be measured is returned for re-identification and segmentation.

[0229] If T1≥99%, the measurement result of the substrate to be tested is reliable. If the width measurement function is enabled at this time, the transmission mechanism that fixes the substrate to be tested rotates 90°, and the width W1 of the substrate to be tested is measured according to the same steps. Repeating this process can realize the automatic detection of the substrate.

[0230] The present disclosure also proposes a substrate detection method, which may include providing polarized light incident from a second direction and passing through a second polarizer 6; collecting the polarized light that passes through the second polarizer 6, the substrate 9 and the first polarizer 3 in sequence from the second direction, and generating a third target image; wherein the polarization angles of the first polarizer 3 and the second polarizer 6 are the same.

[0231] Specifically, in this example embodiment, light is provided by the second light source 4 in the above-mentioned substrate 9 detection device, the first light source 1 does not work, and the light passes through the polarized light of the second polarizer 6. The above-mentioned polarized light passes through the above-mentioned substrate 9 and the first polarizer 3 and is collected by the first image collector 21 to obtain a third target image.

[0232] In this exemplary embodiment, the third target image may be processed similarly to the first target image to detect whether there is a defect inside the substrate 9 .

[0233] Specifically, in this exemplary embodiment, referring to Fig.14 As shown, step S1410 can be first performed to determine whether the detection of the substrate is the first detection. If it is the first detection, steps S1411, S1412, S1413, S1414, S1215 and S1416 can be first performed. Specifically, a standard substrate 9 can be selected and installed on the substrate 9 detection device. The preset speed of the transmission mechanism is controlled to be V3 to drive the standard substrate 9 to move from the first detection point A to the second detection point B, and the distance S4 between AB is determined, then:

[0234] s P =L0 / 2+2000(um)-[-L0 / 2-2000(um)]=L0+4000(um) The standard substrate 9 moves from the first detection point A to the second detection point B. The moving time t3 is:

[0235]

[0236] At the same time, the second image acquisition mechanism 5 with a resolution of P is used to perform scanning sampling at a sampling frame rate (Frame rate) F3, and the number of image (one-dimensional image) frames sampled per second is f3, then:

[0237]

[0238] The second image acquisition mechanism 5 is connected to a computer to store the acquired image data.

[0239] When the standard substrate 9 reaches position B, the controller controls the second image acquisition mechanism 5 to stop working, the image storage ends, and a standard image is obtained.

[0240] In this example implementation, the standard image may be defined as I4, and its vertical resolution is:

[0241]

[0242] Its lateral resolution is:

[0243] R y =P

[0244] After storage, the detection operation module in the computer grayscales the stored standard image to generate a reference grayscale matrix of the scanned image:

[0245]

[0246] Wherein, Rx and Ry are the number of rows and columns of the elements in the grayscale matrix respectively; g(RxRy) is the grayscale value of the element in the xth row and yth column in the grayscale matrix.

[0247] In an exemplary embodiment of the present disclosure, after completing the above steps, step S1420, step S1430, step S1440, step S1450 and step S1460 can be executed. Specifically, the substrate 9 to be measured can be installed on the above transmission mechanism, and the preset speed of the above transmission mechanism is controlled to be V1 to drive the substrate 9 to be measured to move from the first detection point A to the second detection point B. When the substrate reaches the first detection point, the first image acquisition mechanism is controlled to work, and when the substrate to be measured reaches the second detection point, the first image detection mechanism is controlled to stop working.

[0248] The grayscale matrix to be measured corresponding to the third target image of the surface of the substrate 9 to be measured is obtained in the same way as the reference grayscale matrix:

[0249]

[0250] in, It is the grayscale value of the element in the Rx row and Ry column in the matrix.

[0251] In this example implementation, the matrix corresponding to each scanned image is Rx*Ry. However, in the actual measurement process, due to factors such as slight mechanical vibration, target image matching is required to reduce misjudgment. As a preferred method, the following method is adopted here, that is, firstly, a matrix of size M*N is intercepted from the gray matrix corresponding to the reference image as the third reference matrix Then, starting from the mth row and nth column, intercept the M*N scanned image and convert it into the grayscale matrix to be tested. (1≤M+m≤Rx, 1≤N+n≤Ry); define the matching function:

[0252]

[0253] Expand it to:

[0254]

[0255] In the above formula, the third term actually means the total energy of the third reference matrix; the first term is the grayscale matrix to be tested corresponding to the scanned image intercepted at the mth row and nth column. The second term is the correlation between the scanned image and the reference image as m and n change; the more they match, the larger the value (closer to 1). Define the correlation function:

[0256]

[0257] In this example implementation, after the correlation function is obtained, step S1462, step S1464, step S1466, step S1470, step S1480 and step S1490 are performed. Specifically, in step S1462, it is determined whether the correlation function is close to the target. When R(m,n) is close to or equal to 1, it indicates that the intercepted image matches. If it does not match, the M×N scanned image is intercepted again from the mth row and nth column in the gray matrix of the original image, and converted into a matrix to be tested (1≤M+m≤Rx, 1≤N+n≤Ry), and the above process is repeated until the result matches.

[0258] In an exemplary implementation of the present disclosure, the single pixel absolute error is defined as:

[0259]

[0260] in,

[0261] In this example implementation, in step S1464, a third detection threshold K3 may be determined, and a third detection function may be determined according to the grayscale matrix and the reference grayscale matrix. The third detection function may be:

[0262]

[0263] In this example implementation, the value of the third detection threshold K3 can be adjusted according to the actual detection effect to prevent over-detection and under-detection. In this example implementation, the specific value of the third detection threshold is not limited.

[0264] In an exemplary embodiment of the present disclosure, when When the substrate 9 to be tested has defects inside, it can be determined that there are defects inside the substrate 9 to be tested.

[0265] In this example implementation, when the system detects that there are internal defects on the surface of the substrate 9 to be tested, the server may sound an alarm to prompt the personnel to confirm. If the substrate to be tested is manually determined to have defects, the product may need NG / Rework processing; if it is manually determined that there are no defects, the substrate 9 to be tested flows into the next device normally, and the system will wait for the next substrate 9 to be tested to enter and perform defect measurement.

[0266] In another example embodiment of the present disclosure, polarized light incident from a first direction and passing through a first polarizer 3 may be provided; the polarized light passing through a second polarizer 6, the substrate 9 and the first polarizer 3 in sequence from the first direction is collected, and a fourth target image is generated; wherein the polarization angles of the first polarizer 3 and the second polarizer 6 are the same.

[0267] Specifically, in this example embodiment, the first light source in the above-mentioned substrate 9 detection device provides light, the second light source 4 does not work, the light passes through the polarized light of the first polarizer 3, and the above-mentioned polarized light passes through the above-mentioned substrate 9 and the second polarizer 6 and is collected by the second image collector 51 to obtain a fourth target image.

[0268] In this exemplary embodiment, the fourth target image may be processed as the third target image to detect whether there are defects inside the substrate 9. The specific process may refer to the processing of the third target image, which will not be repeated here.

[0269] In addition, the above-mentioned figures are only schematic illustrations of the processes included in the method according to the exemplary embodiments of the present disclosure, and are not intended to be limiting. It is easy to understand that the processes shown in the above-mentioned figures do not indicate or limit the time sequence of these processes. In addition, it is also easy to understand that these processes can be performed synchronously or asynchronously, for example, in multiple modules.

[0270] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. The present disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary technical means in the art that are not disclosed in the present disclosure. The description and examples are to be considered merely exemplary, and the true scope and spirit of the present disclosure are indicated by the claims.

[0271] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

[0272] The terms "about" and "approximately" used in this specification generally mean within 20%, preferably within 10%, and more preferably within 5% of a given value or range. The numbers given here are approximate numbers, which means that in the absence of specific instructions, the meanings of "about", "approximately", "roughly" and "approximately" can still be implied.

[0273] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of the illustration to another component, these terms are used in this specification only for convenience, such as the orientation of the examples described in the drawings. It is understood that if the device of the illustration is turned over so that it is upside down, the component described as being "upper" will become the component "lower". Other relative terms, such as "high", "low", "top", "bottom", "front", "back", "left", "right", etc., also have similar meanings. When a structure is "on" other structures, it may mean that the structure is formed integrally on the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.

[0274] In this specification, the terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "comprising", "including" and "having" are used to express an open-ended inclusion and mean that additional elements / components / etc. may exist in addition to the listed elements / components / etc.; the terms "first", "second" and "third" etc. are used only as labels and are not intended to limit the quantity of their objects.

[0275] It should be understood that the present invention is not limited in its application to the detailed structure and arrangement of the components proposed in this specification. The present invention can have other embodiments and can be implemented and executed in a variety of ways. The aforementioned variations and modifications fall within the scope of the present invention. It should be understood that the present invention disclosed and defined in this specification extends to all alternative combinations of two or more individual features mentioned or evident in the text and / or the drawings. All these different combinations constitute multiple alternative aspects of the present invention. The embodiments described in this specification illustrate the best mode known for implementing the present invention and will enable those skilled in the art to utilize the present invention.

Claims

1. A substrate detection device, characterized in that: include: A first polarizer; A first light source, used to provide light incident on the first polarizer from a first direction; A first image acquisition mechanism, wherein the first image acquisition mechanism is capable of receiving light transmitted through the first polarizer from a second direction and forming a first target image; the first direction is opposite to the second direction; A second polarizer is arranged coaxially with the first polarizer and is arranged on a side of the first polarizer away from the first image acquisition mechanism; Wherein, the second polarizer has the same polarization angle as the first polarizer, and the substrate detection device further includes a second light source for providing light incident on the second polarizer from a second direction; or, The substrate detection device further includes a second light source and a second image acquisition mechanism, wherein the second light source is used to provide light incident on the second polarizer from a second direction, and the second image acquisition mechanism is configured to receive light passing through the second polarizer from a first direction; at least one of the first polarizer and the second polarizer includes a polarization angle adjustment device; or, The second polarizer has the same polarization angle as the first polarizer. The substrate detection device further includes a second image acquisition mechanism, which is configured to receive light that passes through the first polarizer from a first direction.

2. The substrate detection device according to claim 1, characterized in that: When the substrate detection device includes the second light source and the second image acquisition mechanism; and at least one of the first polarizer and the second polarizer includes a polarization angle adjustment device; the first light source includes: A first array light source, used to provide light perpendicular to the first direction; A first right-angle prism, comprising a first right-angle surface and a second right-angle surface, wherein the first right-angle surface is parallel to the first polarizer, and the second right-angle surface is parallel to the first direction, and the first right-angle prism is arranged between the first polarizer and the first image acquisition mechanism, and is used for converting light perpendicular to the first direction into light incident on the first polarizer from the first direction; The second light source comprises: A second array light source, used to provide light perpendicular to the second direction; The second right-angle prism includes a third right-angle face and a fourth right-angle face, wherein the third right-angle face is parallel to the second polarizer, and the fourth right-angle face is parallel to the second direction. The second right-angle prism is arranged between the second polarizer and the second image acquisition mechanism, and is used for converting light perpendicular to the second direction into light incident on the second polarizer from the second direction.

3. The substrate detection device according to claim 2, characterized in that: The substrate detection device also includes: A light diffuser, comprising a first light diffuser and a second light diffuser, wherein the first light diffuser is disposed between the first array light source and the first right-angle prism, and the second light diffuser is disposed between the second array light source and the second right-angle prism; The light absorbing plate comprises a first light absorbing plate and a second light absorbing plate, wherein the first light absorbing plate is arranged on a side of the first right-angle prism away from the first array light source, and the second light absorbing plate is arranged on a side of the second right-angle prism away from the second array light source.

4. The substrate detection device according to claim 1, characterized in that: The substrate detection device also includes: A transmission mechanism, used for fixing the substrate, and enabling the substrate to pass through the light entrance of the first image acquisition mechanism at a preset speed; A control device is used to control the start and stop of the transmission mechanism and the first image acquisition mechanism according to the position of the substrate and the light entrance.

5. The substrate detection device according to claim 1, characterized in that: The substrate detection device further includes a processor, and the processor is used for: Acquire a reference grayscale matrix based on a standard substrate; Acquire a grayscale matrix to be tested according to the first target image; Determine a detection threshold, and determine a detection function according to the grayscale matrix to be tested and the reference grayscale matrix; Whether the substrate has defects is determined according to the detection function and the detection threshold.

6. A substrate detection method, characterized in that: The detection is performed using a substrate detection device, the substrate detection device comprising: A first polarizer; A first light source, used to provide light incident on the first polarizer from a first direction; A first image acquisition mechanism, wherein the first image acquisition mechanism is capable of receiving light transmitted through the first polarizer from a second direction and forming a first target image; The first direction is opposite to the second direction; The substrate detection method comprises: Providing polarized light incident from a first direction and passing through a first polarizer; Collecting the polarized light reflected by the first surface to be measured of the substrate and transmitted through the first polarizer from a second direction, and generating a first target image; wherein the first direction is opposite to the second direction; The method further comprises: Acquire a reference grayscale matrix based on a standard substrate; Acquire a grayscale matrix to be tested according to the first target image; Determine a first detection threshold, and determine a first detection function according to the grayscale matrix to be tested and the reference grayscale matrix; It is determined whether the first surface to be tested of the substrate has defects according to the first detection function and a first detection threshold.

7. The method according to claim 6, characterized in that The substrate moves from a first detection point to a second detection point at a preset speed, and acquiring a grayscale matrix to be detected according to the first target image comprises: determining a distance between the first detection point and a second detection point; Determining a sampling frame rate when acquiring the first target image; The grayscale matrix to be tested is determined according to the first target image, the distance, the preset speed and the sampling frame rate.

8. The method according to claim 6, characterized in that The method further comprises: determining a single pixel ratio based on the standard substrate and the reference grayscale matrix; The substrate size is detected according to the grayscale matrix to be measured and the single pixel ratio.

9. The method according to claim 6, characterized in that The substrate detection device further includes: a second polarizer, which is arranged coaxially with the first polarizer and is arranged on a side of the first polarizer away from the first image acquisition mechanism; a second light source, which is used to provide light incident on the second polarizer from a second direction; a second image acquisition mechanism, which is configured to receive light passing through the second polarizer from the first direction; at least one of the first polarizer and the second polarizer includes a polarization angle adjustment device; The method further comprises: Providing polarized light incident from a second direction and passing through a second polarizer; The polarized light reflected by the second surface to be measured of the substrate and transmitted through the second polarizer from the first direction is collected to generate a second target image.

10. The method according to claim 9, characterized in that The method further comprises: Determine a second detection threshold, and determine a second detection function according to the grayscale matrix to be tested and the reference grayscale matrix; Whether a second surface to be tested of the substrate has defects is determined according to the second detection function and the second detection threshold.

11. A substrate detection method, characterized in that: The detection is performed using a substrate detection device, the substrate detection device comprising: A first polarizer; A first light source, used to provide light incident on the first polarizer from a first direction; A first image acquisition mechanism, wherein the first image acquisition mechanism is capable of receiving light transmitted through the first polarizer from a second direction and forming a first target image; the first direction is opposite to the second direction; A second polarizer is arranged coaxially with the first polarizer and is arranged on a side of the first polarizer away from the first image acquisition mechanism; A second light source, used for providing light incident on the second polarizer from a second direction; wherein the polarization angles of the first polarizer and the second polarizer are the same; The substrate detection method comprises: Providing polarized light incident from a second direction and passing through a second polarizer; Collecting the polarized light that passes through the second polarizer, the substrate, and the first polarizer in sequence from the second direction, and generating a third target image; Alternatively, the substrate detection device comprises: A first polarizer; A first light source, used to provide light incident on the first polarizer from a first direction; A first image acquisition mechanism, wherein the first image acquisition mechanism is capable of receiving light transmitted through the first polarizer from a second direction and forming a first target image; the first direction is opposite to the second direction; A second polarizer is arranged coaxially with the first polarizer and is arranged on a side of the first polarizer away from the first image acquisition mechanism; a second image acquisition mechanism, the second image acquisition mechanism being configured to receive light transmitted through the first polarizer from a first direction; The substrate detection method comprises: Providing polarized light incident from a first direction and passing through a first polarizer; Collecting the polarized light that passes through the second polarizer, the substrate, and the first polarizer in sequence from the first direction, and generating a fourth target image; Wherein, the polarization angles of the first polarizer and the second polarizer are the same.

Citation Information

Patent Citations

  • Silicon substrate inspection device and inspection method

    JP2013036888A