Spray cooling device

Abstract

The present disclosure relates to the technical field of heat dissipation equipment. The spray cooling heat dissipation device comprises a heat conductive member, on which a plurality of pores are arranged. The heat conductive member is arranged on the outer surface of the rear shell of an electronic device and is used to conduct the heat of the electronic device to the heat conductive member; an atomizing component and a nozzle, one end of the nozzle extends into the pores, and the other end is connected to the atomizing component and is used to spray water into the pores. The device can effectively increase the heat dissipation efficiency of the entire device through the atomizing component, the nozzle, the heat conductive member and the pores arranged on the heat conductive member. An ultrasonic atomizing device with a small volume and controllable atomization degree is used to generate tiny droplets, which are evenly sprayed on the surface of the pores by a plurality of nozzles, greatly increasing the surface area contacted by the droplets, and achieving the effect of quickly reducing the temperature of the electronic device. This method has high heat dissipation efficiency, simple structure, and universal applicability. The entire device is an external heat dissipation device for the electronic device, and the sprayed water mist and evaporated gas will not affect the internal structure of the electronic device.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat dissipation equipment, and in particular to a spray cooling heat dissipation device. Background Art

[0002] In the future, the high integration of smart terminals is an inevitable trend. The performance of terminal products will continue to improve. The increase in chip integration will lead to increased power consumption and higher user experience requirements, which will put higher requirements on the heat dissipation of equipment. Traditional natural heat dissipation can no longer meet the requirements of equipment use, which has spawned a series of active cooling technologies.

[0003] At present, high-power intelligent terminals such as mobile phones and tablets mainly use internal passive two-phase liquid cooling and external natural cooling. Some devices that use internal active air cooling will reduce the effective use rate of internal space. Therefore, external active cooling devices have become an important means to improve heat dissipation, such as external air-cooled radiators, external semiconductor radiators, external water-cooled radiators, etc. However, the air-cooled radiators currently used have poor heat dissipation effects, and the heat exchange efficiency is greatly affected by the environment; the semiconductor radiators currently used, the fin forced air cooling heat dissipation mode limits the heat dissipation limit of the semiconductor cooling plate hot surface, and due to fan noise and size limitations, the heat dissipation effect is more limited. At the same time, due to the limitations of manual operation comfort and uneven distribution of heat sources in mobile phones, the heat source and the cold end cannot be directly attached; the water-cooled radiators currently used have a large heat dissipation volume and are not suitable for mobile and portable use. The water-cooled heat dissipation effect is limited under high power consumption, and usually can only circulate water above room temperature. Summary of the invention

[0004] In order to solve the technical problems that the above-mentioned radiator has general heat dissipation effect, is large in size and inconvenient to use, cannot distribute heat at multiple points of the heat source location, and affects the user's operation of the equipment when in use, the present disclosure provides a spray cooling heat dissipation device.

[0005] The present disclosure provides a spray cooling heat dissipation device, comprising a heat conductive member, on which a plurality of pores are arranged, and the heat conductive member is arranged on the outer surface of the rear shell of the electronic device, and is used to conduct heat of the electronic device to the heat conductive member;

[0006] An atomizing assembly and a spray pipe, one end of the spray pipe extends into the pore, and the other end is connected to the atomizing assembly for spraying water into the pore.

[0007] Optionally, a semiconductor refrigeration assembly is arranged between the heat conductor and the rear shell, and the semiconductor refrigeration assembly includes a first semiconductor refrigeration sheet and a second semiconductor refrigeration sheet. The first semiconductor refrigeration sheet is arranged in the middle position of the rear shell, and the second semiconductor refrigeration sheet is arranged at a position on the rear shell corresponding to the PCB.

[0008] Optionally, a heat pipe is further included, wherein the evaporation section of the heat pipe is connected to the hot end of the second semiconductor refrigeration plate, and the condensation section of the heat pipe is arranged between the hot end of the first semiconductor refrigeration plate and the heat conductive member.

[0009] Optionally, a heat sink is provided between the evaporation section of the heat pipe and the second semiconductor refrigeration sheet.

[0010] Optionally, a heat dissipation base is provided between the heat conductive member and the rear shell, and the heat dissipation base is arranged in close contact with the heat conductive member.

[0011] Optionally, the heat dissipation base is arranged between the first semiconductor refrigeration plate and the heat conductive member, and a groove matching with the condensing section of the heat pipe is provided on the heat dissipation base, and the condensing section of the heat pipe is embedded in the groove.

[0012] Optionally, it also includes a cover and a heat conductive sheet group, wherein the heat conductive sheet group is arranged between the heat conductive component and the rear shell, and the cover is buckled on the heat conductive sheet group to form a accommodating cavity together with the heat conductive sheet group, and the heat conductive component, the atomization component, the nozzle, the semiconductor refrigeration component, the heat pipe, the heat sink and the heat dissipation base are all arranged in the accommodating cavity.

[0013] Optionally, the heat dissipation base and the heat sink are both fixedly connected to the heat conducting plate group.

[0014] Optionally, the cover includes a back plate and a fan shell, the back plate is provided with a vent, the vent is arranged opposite to the heat conductor, an insulating pad is arranged between the back plate and the heat conductive plate group, the fan shell is arranged at the vent, a fan is arranged in the fan shell, an air inlet and an air outlet are provided on the fan shell, and a fan is arranged in the fan shell.

[0015] Optionally, it also includes a PLC, a hygrometer and a smoke sensor, the PLC is electrically connected to the atomization assembly, the hygrometer and the smoke sensor are both arranged at the air outlet, and the hygrometer and the smoke sensor are both electrically connected to the PLC.

[0016] Optionally, a clamp for clamping the electronic device is provided on the cover, and the clamp is connected to the cover via an elastic member.

[0017] Optionally, the surface of the heat conducting element is a super hydrophobic surface.

[0018] Optionally, the heat conducting member is foam metal.

[0019] Optionally, the atomization assembly includes a water tank and an atomization component, the water tank is filled with water, the nozzle is provided with a spray hole, and the nozzle is connected to the water tank through the atomization component.

[0020] Compared with the prior art, the technical solution provided by the embodiments of the present disclosure has the following advantages:

[0021] The spray cooling heat dissipation device provided by the present invention can effectively increase the heat dissipation efficiency of the entire device through the atomization component, the nozzle, the heat conductive member and the pores arranged on the heat conductive member. An ultrasonic atomization device with a small volume and controllable atomization degree is used to generate tiny droplets, which are evenly sprayed on the surface of the pores by multiple nozzles, greatly increasing the surface area contacted by the droplets, and can achieve the effect of quickly reducing the temperature of the electronic device. This method has high heat dissipation efficiency, simple structure, and universal applicability. The entire device is an external heat dissipation device for the electronic device, and the sprayed water mist and evaporated gas will not affect the internal structure of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0024] Figure 1 A cross-sectional view of the spray cooling heat dissipation device according to an embodiment of the present disclosure;

[0025] Figure 2 It is a structural schematic diagram of the spray cooling heat dissipation device according to an embodiment of the present disclosure;

[0026] Figure 3 It is a schematic diagram of the structure of the heat-conducting member in the spray cooling and heat-dissipating device according to an embodiment of the present disclosure;

[0027] Figure 4 It is a structural schematic diagram of a clamp in the spray cooling and heat dissipation device according to an embodiment of the present disclosure;

[0028] Figure 5 It is a structural schematic diagram of a cover in the spray cooling and heat dissipation device according to an embodiment of the present disclosure;

[0029] Figure 6 It is a schematic diagram of the structure of the heat pipe and the semiconductor refrigeration component in the spray cooling heat dissipation device according to the embodiment of the present disclosure;

[0030] Figure 7 It is a schematic diagram of the structure of the atomizing assembly in the spray cooling and heat dissipation device described in the embodiment of the present disclosure.

[0031] Among them, 1. heat conducting part; 21. water tank; 22. atomizing part; 23. nozzle; 24. air vent; 25. water filling cap; 26. water level detector; 31. first semiconductor cooling plate; 32. second semiconductor cooling plate; 4. heat pipe; 5. heat sink; 6. heat dissipation base; 7. back plate; 81. thermal pad; 82. graphite thermal conductive plate; 83. high thermal conductivity metal plate; 9. fan housing; 10. fan; 11. clamp; 12. thermal insulation pad. DETAILED DESCRIPTION

[0032] In order to more clearly understand the above-mentioned objectives, features and advantages of the present disclosure, the scheme of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0033] In the following description, many specific details are set forth to facilitate a full understanding of the present disclosure, but the present disclosure may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present disclosure, rather than all of the embodiments.

[0034] The inevitable trend of highly integrated smart terminals in the future, the continuous improvement of the performance of terminal products, the increase in power consumption caused by the increase in chip integration, the improvement in user experience requirements, etc. have put forward higher requirements on the heat dissipation of equipment. Traditional natural heat dissipation can no longer meet the requirements of equipment use, and has spawned a series of active cooling technologies.

[0035] The existing technology mainly adopts internal passive two-phase liquid cooling and external natural cooling heat dissipation methods. Some devices that use internal active air cooling will compress the effective utilization rate of the internal space. Therefore, external active cooling and heat dissipation devices have become an important means to improve heat dissipation, such as external air-cooled radiators, external semiconductor radiators, external water-cooled radiators, etc. However, the air-cooled radiators currently used have poor heat dissipation effects, and the heat exchange efficiency is greatly affected by the environment; the semiconductor radiators currently used, the fin forced air cooling heat dissipation mode limits the heat dissipation limit of the hot surface of the semiconductor refrigeration plate, and due to fan noise and size limitations, the heat dissipation effect is more limited. At the same time, due to the limitations of manual operation comfort and the uneven distribution of heat sources in mobile phones, the heat source and the cold end cannot be directly attached; the water-cooled radiators currently used have a large heat dissipation volume and are not suitable for mobile and portable use. The water-cooled heat dissipation effect is limited under high power consumption, and usually can only circulate to provide water above room temperature.

[0036] Based on this, this embodiment provides a spray cooling heat dissipation device, which can effectively increase the heat dissipation efficiency of the entire device through the atomization component, nozzle, heat conductor and pores set on the heat conductor. It uses an ultrasonic atomization device with a small volume and controllable atomization degree to generate tiny droplets, and multiple nozzles are evenly sprayed on the surface of the pores, which greatly increases the surface area of ​​the droplets in contact, and can achieve the effect of quickly reducing the temperature of the electronic device. This method has high heat dissipation efficiency, simple structure, and universal applicability. The entire device is an external heat dissipation device for electronic equipment, and the sprayed water mist and evaporated gas will not affect the internal structure of the electronic equipment. The following is a detailed description of it through specific embodiments:

[0037] Reference Figures 1 to 7 As shown, a spray cooling heat dissipation device provided in this embodiment includes a heat conductive member 1, on which a plurality of pores are arranged. The heat conductive member 1 is arranged on the outer surface of the rear shell of the electronic device, and is used to conduct the heat of the electronic device to the heat conductive member 1; an atomizing component and a nozzle 23, one end of the nozzle 23 extends into the pore, and the other end is connected to the atomizing component, and is used to spray water into the pore, wherein a plurality of nozzles 23 are arranged, and each nozzle 23 is provided with a plurality of multi-directional nozzles. Through the atomizing component, the nozzle 23, the heat conductive member 1 and the pores arranged on the heat conductive member 1, the heat dissipation efficiency of the entire device can be effectively increased, and an ultrasonic atomizing device with a small volume and controllable atomization degree is used to generate tiny droplets, and multiple nozzles 23 are used to evenly spray them on the surface of the pores, which greatly increases the surface area contacted by the droplets, and can achieve the effect of quickly reducing the temperature of the electronic device. This method has high heat dissipation efficiency, simple structure, and universality. The entire device is an external heat dissipation device for the electronic device, and the sprayed water mist and evaporated gas will not affect the internal structure of the electronic device.

[0038] Reference Figure 1 and Figure 7 As shown, the solid arrow is the gas flow direction, and the dotted arrow is the water mist flow direction.

[0039] Reference Figure 2 and Figure 6As shown, preferably, a semiconductor refrigeration assembly is arranged between the heat conducting member 1 and the rear shell, and the semiconductor refrigeration assembly includes a first semiconductor refrigeration sheet 31 and a second semiconductor refrigeration sheet 32. The first semiconductor refrigeration sheet 31 is arranged in the middle position of the rear shell, corresponding to the heat conducting member 1, and the heat conducting member 1 is used to dissipate heat therefrom. The second semiconductor refrigeration sheet 32 ​​is arranged at a position on the rear shell corresponding to the PCB. The size of the first semiconductor refrigeration sheet 31 is the largest, and the corresponding cooling capacity is also the largest; the number of the second semiconductor refrigeration sheets 32 can be set according to the distribution of the heat source and the size of the back plate 7, and its size is often smaller, and the cooling capacity is correspondingly smaller. Through the setting of the semiconductor refrigeration assembly, the heat dissipation efficiency of the entire device can be effectively improved. At the same time, the semiconductor refrigeration assemblies are respectively distributed in the middle position of the rear shell and the position corresponding to the PCB, so that the distributed heat dissipation work can be accurately performed on the heat source area of ​​the electronic device, and the heat dissipation effect is better. The hot and cold ends of the first semiconductor refrigeration sheet 31 and the hot and cold ends of the second semiconductor refrigeration sheet 32 ​​are coated with thermal interface materials, such as thermal grease, thermal paste, liquid metal, etc.

[0040] Reference Figure 2 , Figure 3 and Figure 6 As shown, the spray cooling heat dissipation device also includes a heat pipe 4, the evaporation section of the heat pipe 4 is connected to the hot end of the second semiconductor refrigeration plate 32, and the condensation section of the heat pipe 4 is arranged between the hot end of the first semiconductor refrigeration plate 31 and the heat conductor 1. The first semiconductor refrigeration plate 31 and the second semiconductor refrigeration plate 32 are connected together by the heat pipe 4, so that the entire semiconductor refrigeration assembly shares the heat conductor 1 and the atomization assembly for heat dissipation. The design of such a shared heat dissipation end can reduce the size of the device, greatly reduce the thickness of the second semiconductor refrigeration plate 32, facilitate user manual operation, and can achieve the purpose of rapid heat conduction and reduced cold loss.

[0041] Continue to refer to Figure 2 , Figure 3 and Figure 6 As shown, a heat sink 5 is arranged between the evaporation section of the heat pipe 4 and the second semiconductor refrigeration plate 32. The heat sink 5 is welded to the heat pipe 4, and can also be fixed to the heat pipe 4 using other methods. The heat sink 5 can increase the contact area between the evaporation section of the heat pipe 4 and the hot end of the second semiconductor refrigeration plate 32, increase the equivalent heat exchange area of ​​the heat pipe 4, and enhance the heat exchange capacity between the second semiconductor refrigeration plate 32 and the heat pipe 4, while also being able to press and fix the second semiconductor refrigeration plate 32.

[0042] Continue to refer to Figure 2 , Figure 3 and Figure 6As shown, a heat dissipation base 6 is arranged between the heat conductive member 1 and the rear shell, and the heat dissipation base 6 is arranged in close contact with the heat conductive member 1. The heat dissipation base 6 and the heat conductive member 1 are welded into one body, or fixed together by other means such as bolts. The heat dissipation base 6 is arranged between the first semiconductor refrigeration plate 31 and the heat conductive member 1. A groove matching the condensation section of the heat pipe 4 is arranged on the heat dissipation base 6, and the condensation section of the heat pipe 4 is embedded in the groove. The setting of the heat dissipation base 6 can provide a fixed base for the heat conductive member 1, the semiconductor refrigeration component and the heat pipe 4, and connect the entire structure together. At the same time, the contact setting of the heat dissipation base 6 with the heat conductive member 1, the semiconductor refrigeration component and the heat pipe 4 can improve the heat exchange efficiency and further accelerate the heat dissipation. In order to fully dissipate heat, the hot end of the first semiconductor refrigeration plate 31 is directly attached to the heat dissipation base 6.

[0043] Reference Figure 1 , Figure 2 and Figure 5 As shown, in a specific implementation, the spray cooling heat dissipation device also includes a cover and a heat conductive sheet group, the heat conductive sheet group is arranged between the heat conductive member 1 and the rear shell, the cover is buckled on the heat conductive sheet group and together with the heat conductive sheet group to form a receiving cavity, the heat conductive member 1, the atomizing component, the nozzle 23, the semiconductor refrigeration component, the heat pipe 4, the heat sink 5 and the heat dissipation base 6 are all arranged in the receiving cavity, it should be noted that the heat conductive sheet group includes a thermal pad 81, a graphite heat conductive sheet 82 and a high thermal conductivity metal sheet 83 arranged in sequence from the rear shell to the heat conductive member 1, and the arrangement of the heat conductive sheet group can further improve the heat dissipation from the rear shell to the heat conductive member 1. The thermal conductivity between the heat conducting parts 1 is improved, wherein the thermal pad 81 has a certain degree of softness to adapt to different concave and convex surfaces and reduce the contact thermal resistance. The thermal conductive sheet group can improve the thermal conductivity and temperature uniformity in the horizontal direction. The front and back sides of the graphite thermal conductive sheet 82 have adhesive for fixing with the thermal pad 81 and the high thermal conductivity metal sheet 83. Its thermal conductivity is dozens or even hundreds of times that of ordinary metals. The high thermal conductivity metal sheet 83 can be made of aluminum, copper, etc., and a groove and fixing hole for a semiconductor refrigeration component are reserved above it; it is used for thermal insulation to reduce the cold loss of the high thermal conductivity metal sheet 83.

[0044] Continue to refer to Figure 2 , Figure 3 and Figure 6 As shown, the heat dissipation base 6 and the heat sink 5 are both fixedly connected to the high thermal conductivity metal sheet 83. The heat dissipation base 6 and the heat sink 5 can be installed on the high thermal conductivity metal sheet 83 by bolting, riveting, clamping or other methods. The heat dissipation base 6 is provided with a pressing groove that cooperates with the first semiconductor refrigeration sheet 31, and the first semiconductor refrigeration sheet 31 is directly pressed into the pressing groove, so that the whole structure is more stable and reliable, and it is not easy for internal parts to loosen, thereby causing damage.

[0045] Reference Figure 1 , Figure 2 and Figure 5As shown, the cover includes a back plate 7 and a fan housing 9, a vent is provided on the back plate 7, the vent is arranged opposite to the heat conducting member 1, a thermal insulation pad 12 is filled in the gap between the back plate 7 and the high thermal conductivity metal sheet 83, and adhesive is attached to both sides of the thermal insulation pad 12 for fixing with the back plate 7, the fan housing 9 is arranged at the vent, and a fan 10 is arranged in the fan housing 9, an air inlet and an air outlet are provided on the fan housing 9, and a fan 10 is arranged in the fan housing 9, wherein a charging port for charging the fan 10 is also provided on the back plate 7, and the thermal insulation pad 12 is provided at the back plate 7. It can prevent the electronic equipment from being affected by the heat derived from the heat conductive sheet group when operating. At the same time, the back plate 7 can also achieve the effect of efficient temperature equalization, so that the coldness of the semiconductor refrigeration component can be transferred to both sides to meet the heat dissipation requirements of different heating areas. At the same time, the fan 10 can increase the evaporation rate of the water mist on the heat conductive part 1, and the flowing air can also directly take away the heat by contacting the surface of the heat conductive part 1 without water droplets attached. The setting of the air inlet and the air outlet can effectively guide the airflow generated by the fan 10, so as to achieve a better heat dissipation effect.

[0046] It should be noted that it also includes a PLC, a hygrometer and a smoke sensor. The PLC is electrically connected to the atomization component. The hygrometer and the smoke sensor are both arranged at the air outlet. The hygrometer and the smoke sensor are both electrically connected to the PLC. The relative humidity of the air can be measured by the hygrometer, and the concentration of the water mist can be measured by the smoke sensor. Therefore, by combining the information of the two, the water content inside the heat conductor 1 can be detected in time, so that the spray amount can always match the water mist amount required by the heat conductor 1 by adjusting the power of the atomization component 22. Among them, the hygrometer can be a dry-bulb thermometer or other device that can measure relative humidity.

[0047] Reference Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, in this embodiment, it is more preferred that a clamp 11 for clamping the electronic device is provided on the cover, and the clamp 11 is connected to the cover through an elastic member. The provision of the clamp 11 can make the device more universal and can be clamped on electronic devices of different sizes for heat dissipation.

[0048] Among them, the surface of the heat conductor 1 is a superhydrophobic surface. Through superhydrophobic treatment, the contact angle of droplets on the surface of the heat conductor 1 can be increased, and the probability of droplets coalescing or spreading to form a liquid film can be reduced, which is equivalent to increasing the surface area of ​​liquid evaporation, thereby improving the heat exchange efficiency of evaporative cooling.

[0049] In specific implementation, the heat conductor 1 is foamed metal, which is formed by foaming a high thermal conductivity metal substrate and has many interconnected holes inside. Common ones are aluminum or copper. The larger the porosity, the larger the corresponding heat transfer specific surface area, which is much larger than conventional heat dissipation fins. At the same time, due to the enhanced disturbance effect of complex pores on the fluid, the corresponding heat transfer performance is improved. The thermal conductivity of the foamed metal and its own pores can very efficiently complete the entire heat conduction and heat dissipation work. It should be noted that the porosity of the foamed metal is about 80% to 90%.

[0050] Reference Figure 2 and Figure 7 As shown, the atomizing assembly includes a water tank 21, an atomizing element 22, an air vent 24, a water filling cap 25, and a water level detector 26. The water tank 21 is filled with water, a spray hole is arranged on the nozzle 23, the nozzle 23 is connected to the water tank 21 through the atomizing element 22, and the air vent 24 is arranged on the top of the water tank 21, which is used to balance the pressure inside and outside the water tank 21 to ensure that the liquid can be continuously supplied to the atomizing element 22 to generate atomized steam. A sealing ring is arranged at the connection between the water tank 21 and the atomizing element 22 to prevent leakage. The number of atomizing elements 22 can be installed according to demand. At the same time, the water filling cap 25 is arranged on the top of the water tank 21 to facilitate the work of adding and pouring water. At the same time, the water level detector 26 is arranged on the side wall of the water tank 21. When the water amount in the water tank 21 is insufficient, the operator is reminded to add water in time to prevent the atomizing assembly from failing to work.

[0051] The specific implementation method and implementation principle are the same as those in the above embodiment, and can bring the same or similar technical effects, which will not be described one by one here. For details, please refer to the description of the above spray cooling and heat dissipation device embodiment.

[0052] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0053] The above description is only a specific embodiment of the present disclosure, so that those skilled in the art can understand or implement the present disclosure. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to the embodiments described herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A spray cooling heat dissipation device, characterized in that: include A heat conducting member (1), wherein a plurality of pores are provided on the heat conducting member (1), and the heat conducting member (1) is arranged on the outer surface of a rear shell of an electronic device and is used to conduct heat of the electronic device to the heat conducting member (1); An atomizing assembly and a spray pipe (23), the atomizing assembly comprising a water tank (21) and an atomizing element (22), the water tank (21) being filled with water, the spray pipe (23) being provided with a spray hole, the spray pipe (23) being connected to the water tank (21) via the atomizing element (22), one end of the spray pipe (23) extending into the hole, and the other end being connected to the atomizing assembly for spraying water mist into the hole; A semiconductor refrigeration assembly is arranged between the heat conducting member (1) and the rear shell, the semiconductor refrigeration assembly comprising a first semiconductor refrigeration sheet (31) and a second semiconductor refrigeration sheet (32), the first semiconductor refrigeration sheet (31) being arranged at a middle position of the rear shell, and the second semiconductor refrigeration sheet (32) being arranged at a position on the rear shell corresponding to the PCB; It also comprises a heat pipe (4), wherein the evaporation section of the heat pipe (4) is connected to the hot end of the second semiconductor refrigeration sheet (32), and the condensation section of the heat pipe (4) is arranged between the hot end of the first semiconductor refrigeration sheet (31) and the heat conducting element (1); A heat sink (5) is provided between the evaporation section of the heat pipe (4) and the second semiconductor refrigeration sheet (32).

2. The spray cooling heat dissipation device according to claim 1, characterized in that: A heat dissipation base (6) is provided between the heat conducting member (1) and the rear shell, and the heat dissipation base (6) is arranged in close contact with the heat conducting member (1).

3. The spray cooling heat dissipation device according to claim 2, characterized in that: The heat dissipation base (6) is arranged between the first semiconductor refrigeration sheet (31) and the heat conducting member (1), and a groove matching the condensation section of the heat pipe (4) is provided on the heat dissipation base (6), and the condensation section of the heat pipe (4) is embedded in the groove.

4. The spray cooling heat dissipation device according to claim 3, characterized in that: It also includes a cover and a heat conducting sheet group, wherein the heat conducting sheet group is arranged between the heat conducting element (1) and the rear shell, and the cover is buckled on the heat conducting sheet group to form a receiving cavity together with the heat conducting sheet group, and the heat conducting element (1), the atomizing assembly, the nozzle (23), the semiconductor refrigeration assembly, the heat pipe (4), the heat sink (5) and the heat dissipation base (6) are all arranged in the receiving cavity.

5. The spray cooling heat dissipation device according to claim 4, characterized in that: The heat dissipation base (6) and the heat sink (5) are both fixedly connected to the heat conducting sheet assembly.

6. The spray cooling heat dissipation device according to claim 4, characterized in that: The cover comprises a back plate (7) and a fan housing (9); a vent is provided on the back plate (7), the vent is arranged opposite to the heat conducting member (1); a heat insulating pad (12) is arranged between the back plate (7) and the heat conducting sheet group; the fan housing (9) is arranged at the vent, a fan (10) is arranged in the fan housing (9), and an air inlet and an air outlet are provided on the fan housing (9).

7. The spray cooling heat dissipation device according to claim 6, characterized in that: It also includes a PLC, a hygrometer and a smoke sensor. The PLC is electrically connected to the atomization component. The hygrometer and the smoke sensor are both arranged at the air outlet. The hygrometer and the smoke sensor are both electrically connected to the PLC.

8. The spray cooling heat dissipation device according to claim 4, characterized in that: The cover is provided with a clamp (11) for clamping the electronic device, and the clamp (11) is connected to the cover via an elastic member.

9. The spray cooling heat dissipation device according to claim 1, characterized in that: The surface of the heat conducting element (1) is a super hydrophobic surface.

10. The spray cooling heat dissipation device according to claim 1, characterized in that: The heat conducting element (1) is foam metal.

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