Spring contact and socket with built-in spring contact

Abstract

The present invention relates to a socket with a thin structure, which can improve the problem of reduced durability of the contact itself, has excellent electrical characteristics and can extend the service life when processing high-speed signals, and a spring contact suitable for the socket. The socket of the present invention comprises: a plurality of spring contacts (100), which have an upper contact pin (110), a lower contact pin (120) cross-assembled with the upper contact pin and capable of linear operation with each other, and a coil spring (130) elastically supporting the upper contact pin (110) and the lower contact pin (120); a lower diaphragm (310) formed with a plurality of first through holes (311) for penetrating and arranging each of the spring contacts (100); an intermediate plate (320) provided on the upper part of the lower diaphragm (310) and formed with a second through hole at a position corresponding to the first through hole (311); and an upper diaphragm (330) provided on the upper part of the intermediate plate (320) and formed with a third through hole at a position corresponding to the second through hole.

Description

Technical Field

[0001] The present invention relates to a spring contact and a socket with a built-in spring contact, and more specifically, to a spring contact for electrically connecting a plurality of terminals (leads) provided on an IC to pads (PAD) of a PCB one-to-one for testing a semiconductor device (IC) or for electrically connecting terminals (leads) of an IC such as a CPU to a PCB inside an electronic product such as a personal computer (PC) or a mobile phone, and a socket with the built-in spring contact. Background Art

[0002] Generally, the spring contact serves to electrically connect the terminals of the PCB and the IC, and is a core component of a socket for testing the IC.

[0003] Figures 1 to 3 shows a prior art spring contact, Figure 4 and Figure 5 A socket with spring contacts built into it is shown.

[0004] Figure 1 (a) and (b) are respectively a three-dimensional structure diagram and an exploded three-dimensional structure diagram of a spring contact in the prior art, wherein the spring contact is composed of an upper contact pin 10, a lower contact pin 20 cross-assembled with the upper contact pin 10 in the length direction, and a spring 30 inserted between the upper contact pin 10 and the lower contact pin 20 to elastically support the upper contact pin 10 and the lower contact pin 20.

[0005] Figure 2 (a) and (b) are respectively a plan view and a cross-sectional view of the upper contact pin of the prior art, wherein the upper contact pin 10 comprises a contact portion 11 protruding from the upper end, a pair of fixing protrusions 12 protruding from the left and right, a main body 13 provided with a movable groove 13a recessed in the length direction, a pair of elastic portions 14 extending symmetrically from the main body 13, and a locking protrusion 15 provided at the front end of each elastic portion 14. In addition, the lower contact pin has the same shape as the upper contact pin.

[0006] Figure 3 (a) and (b) are schematic diagrams showing working examples of spring contacts in the prior art, respectively. The left and right sides of (a) show the states before and after the spring is compressed, respectively. The left and right sides of (b) show the positions of the upper contact pin and the lower contact pin before and after the spring is compressed from a planar perspective.

[0007] See also Figure 3, the spring 30 is inserted into the upper contact pin 10 and the lower contact pin 20 to assemble the elastic parts 14 and 24 to intersect each other perpendicularly in the length direction. Specifically, the locking protrusion 15 of the upper contact pin 10 is inserted into the floating groove 23a of the lower contact pin 20, and the locking protrusion 25 of the lower contact part 20 is inserted into the floating groove 13a of the upper contact pin 10. Therefore, when an external force is applied to the length direction of the spring contact, the upper contact pin 10 and the lower contact pin 20 are compressed by a certain length S during the movement of each locking protrusion 15 and 25 along the floating groove 13a and 23a.

[0008] See also Figure 3 (b), the maximum displacement (Smax) between the upper contact pin 10 and the lower contact pin 20 depends on the position where the locking protrusions 15, 25 of the upper contact pin 10 and the lower contact pin 20 are supported by the front ends of the relative movable grooves 13a, 23a in the state before the spring is compressed (the left side in the figure), and the position where the end portions 13b, 23b of the main body portions 13, 23 of the upper contact pin 10 and the lower contact pin 20 are connected in the state of spring compression (the right side in the figure).

[0009] Figure 4 This is a plane diagram of a socket in the prior art. Figure 5 for Figure 4 The cross-sectional structure diagram of the BB line.

[0010] See also Figure 4 and Figure 5 The socket of the prior art is composed of an upper side plate 40 and a lower side plate 50 assembled with the upper side plate 40 , and the spring contact 1 is fixed between the upper side plate 40 and the lower side plate 50 .

[0011] The upper plate 40 and the lower plate 50 are respectively formed with receiving holes 41, 51 for fixing the spring contact 1. The spring contact 1 is located in the receiving holes 41, 51 between the upper plate 40 and the lower plate 50, so that the upper tip and the lower tip protrude from the outside of each receiving hole 41, 51 to electrically connect the terminal of the IC and the pad of the PCB.

[0012] The upper and lower plates of the socket of the prior art are made of synthetic resin. In particular, the upper plate 40 is provided with a flange portion 42 protruding from the upper plate 40 to form a first receiving hole 41 in order to receive the spring contact 1 of a predetermined height.

[0013] Therefore, when such a thin plate having a flange portion with a first receiving hole is made by synthetic resin injection molding, the processing cost is high and the thickness of the plate is limited to 1.0 mm or less, so it is difficult to manufacture a high-speed test socket that processes high-speed signals of 40 GHz or higher.

[0014] In addition, other prior art includes a rubber type socket, which is composed of an insulating body obtained by curing insulating silicone to have elasticity, and a conductive silicone portion formed to vertically penetrate the insulating body corresponding to the terminal of the device.

[0015] Regarding rubber-type sockets, a silicone mixture of insulating silicone and conductive powder mixed in a specified ratio is placed in a mold and a strong magnetic field is formed at the position where the conductive silicone part is to be formed. The conductive powder of the silicone mixture gathers at the position where the magnetic field is formed, and finally the molten silicone mixture is solidified to form a conductive silicone part with a certain arrangement on the insulating body.

[0016] This type of rubber-type socket has a slower elastic induction speed than pin-type contacts (spring contacts), and loses elasticity during repeated tests, which significantly reduces the service life. Therefore, the cost is increased due to the low number of uses and frequent replacement. In addition, due to the characteristic that the elasticity persistence decreases over time, the elastic rebound force becomes zero or significantly decreases during long-term (more than one week) continuous compression tests, causing short circuits, so it is difficult to use for long-term testing.

[0017] Furthermore, the rubber-type socket has a problem that its elastic characteristics are greatly affected by temperature changes, and has a defect that the uniformity of the resistance characteristics of individual conductive silicone parts decreases.

[0018] Prior art literature

[0019] Patent Literature

[0020] Korean Patent Publication No. 10-2011-0051668 (Publication Date: 2011.05.18) Summary of the invention

[0021] Problems to be solved by the invention

[0022] The present invention is used to improve the problems of the prior art and can improve the problem of reduced durability of the contact itself. It has excellent electrical characteristics and can extend the service life when processing high-speed signals. It has a thin-structured socket and a spring contact suitable for it.

[0023] Means used to solve problems

[0024] According to one aspect of the present invention, a socket includes: a plurality of spring contacts, which include an upper contact pin, a lower contact pin cross-assembled with the upper contact pin and capable of linear operation with each other, and a coil spring elastically supporting the upper contact pin and the lower contact pin; a lower diaphragm plate, which is formed with a plurality of first through holes for penetrating and configuring each of the spring contacts; an intermediate plate, which is arranged on the upper part of the lower diaphragm plate and has a second through hole formed at a position corresponding to the first through hole; and an upper diaphragm plate, which is arranged on the upper part of the intermediate plate and has a third through hole formed at a position corresponding to the second through hole.

[0025] Furthermore, according to another aspect of the present invention, a spring contact comprises an upper contact pin, a lower contact pin cross-assembled with the upper contact pin, and a coil spring elastically supporting the upper contact pin and the lower contact pin, wherein the spring contact is characterized in that the upper contact pin and the lower contact pin are plate-shaped contact pins having the same shape and satisfying the following conditions: length L1>width w1>thickness t1, wherein:

[0026] The contact pin comprises: a main body portion, whose opposing surfaces are respectively formed with grooves recessed in the length direction, each of the grooves is configured to form an opening at one end portion and a hook locking platform formed with a step difference at the other end portion; a pair of shoulder protrusions, which are protruded and formed at the left and right side ends of the main body portion and support the coil spring; a first tip contact portion, which is extended and formed at the upper end of the main body portion; a pair of elastic portions, which are extended and formed symmetrically along the length direction of the main body portion, respectively having guide surfaces protruding inwardly at the ends of each elastic portion and facing each other; and a second tip contact portion, which is protruded and formed at the front end of each elastic portion, and a chamfered inclined surface with an inclination is formed at the lower end corner of the main body portion adjacent to the elastic portions, and the first tip contact portion and the second tip contact portion respectively include an edge line (edge ​​line) formed by connecting two different curved surfaces or contact surfaces with an inclination line), at the portion where the groove is formed, the thickness t2 of the main body is less than or equal to the width w3 between the guide surfaces, the width w3 between the guide surfaces is less than the thickness t1 of the main body, the length L3 of the elastic portion including the second tip contact portion is formed to be greater than the length L2 from the first tip contact portion to the lower end of the main body, the two elastic portions of the upper contact pin and the two elastic portions of the lower contact pin are cross-assembled so that the guide surface of the upper contact pin contacts along the groove of the lower contact pin, and the guide surface of the lower contact pin contacts along the groove of the upper contact pin, and when the coil spring is compressed, the overall length of the spring contact is equal to the height L1 of one contact pin.

[0027] Effects of the Invention

[0028] The socket according to the present invention comprises: a plurality of spring contacts, which include upper contact pins and lower contact pins which are cross-assembled and elastically supported by each other so as to be linearly operable; and a plurality of plate units into which the spring contacts are inserted through the configuration. Preferably, a portion of the plate units is made of an elastomer, thereby being easily manufactured into a thin structure with a relatively thin thickness. Therefore, the electrical characteristics are excellent when processing high-speed signals and the service life can be extended.

[0029] Furthermore, the spring contact according to the present invention cross-assembles a pair of contact pins having the same shape so that they are elastically supported by each other and can thus perform linear motion. The spring contact can be manufactured with an overall length of less than 1.0 mm, minimizing resistance to be suitable for equipment that inspects high-speed signals. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 (a) and (b) are respectively a three-dimensional structure diagram and an exploded three-dimensional structure diagram of a spring contact in the prior art.

[0031] Figure 2 (a) and (b) are respectively a plan view of the upper contact pin of the prior art and a cross-sectional view along line AA.

[0032] Figure 3 (a) and (b) are diagrams showing working examples of a spring contact according to the prior art.

[0033] Figure 4 The figure is a plan view of a socket according to the prior art.

[0034] Figure 5 for Figure 4 The cross-sectional structure diagram of the BB line.

[0035] Figure 6 It is an exploded perspective view of a spring contact according to an embodiment of the present invention.

[0036] Figure 7 (a) and (b) are respectively plan and side views of the upper contact pin of an embodiment of the present invention.

[0037] Figure 8 (a), (b), and (c) are diagrams showing the extended state of the spring contact according to the embodiment of the present invention.

[0038] Fig. 9 (a), (b), and (c) are diagrams showing the compressed state of the spring contact according to the embodiment of the present invention.

[0039] Fig.10 (a), (b), and (c) are diagrams showing a spring contact according to another embodiment of the present invention.

[0040] Fig.11 (a) and (b) are the side view and rear view of a BGA type device (IC), respectively.

[0041] Fig.12 This is a plan view of the socket according to an embodiment of the present invention.

[0042] Fig.13 and Fig.14 It is a cross-sectional view of a socket according to an embodiment of the present invention.

[0043] Fig.15 (a) and (b) are the side view and rear view of a composite device (IC) that is a mixture of BGA type and LGA type, respectively.

[0044] Fig.16 This is a plan view of a socket according to another embodiment of the present invention.

[0045] Fig.17 This is a cross-sectional view of a socket according to another embodiment of the present invention. DETAILED DESCRIPTION

[0046] First, the terms or words used in this specification and claims shall not be interpreted limited to the meanings in ordinary dictionaries, but shall be interpreted as meanings and concepts consistent with the technical ideas of the present invention based on the principle that the inventor can appropriately define the concepts of the terms in order to explain his invention in the best way.

[0047] The embodiments described in this specification and the configuration shown in the drawings are merely an optimal embodiment of the present invention and do not represent all technical concepts of the present invention. Therefore, it should be understood that there may be various equivalents and modifications that can replace these at the time of this application.

[0048] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0049] Figure 6 This is an exploded three-dimensional diagram of the spring contact of an embodiment of the present invention. The spring contact 100 of this embodiment includes an upper contact pin 110, a lower contact pin 120 cross-assembled with the upper contact pin 110, and a spring 130 elastically supporting the upper contact pin 110 and the lower contact pin 120.

[0050] In particular, the upper contact pin 110 and the lower contact pin 120 of the present invention are provided by the same contact pins having the same size and shape, and the two contact pins 110 and 120 assembled crosswise in the length direction are divided into the upper part and the lower part according to the assembly position. Therefore, in the following description, the upper contact pin 110 is centered.

[0051] The spring 130 is a coil-type compression spring that resists compression force and is disposed between the upper contact pin 110 and the lower contact pin 120 . When compressed in the longitudinal direction of the upper contact pin 110 and the lower contact pin 120 , the spring 130 provides a restoring force for restoring the original position.

[0052] Figure 7 (a) and (b) are respectively plan and side views of the upper contact pin of an embodiment of the present invention.

[0053] See also Figure 7 The upper contact pin 110 of this embodiment is a contact pin of a plate-like structure with a predetermined length L1, width w1 and thickness t1. Specifically, the upper contact pin 110 includes: a body portion 112, whose opposing surfaces are respectively formed with grooves 111 recessed along the length direction; shoulder protrusions 113, which are vertically protruded at the left and right side ends of the body portion 112; a pair of first tip contact portions 114, which are symmetrically extended and formed on both sides of the upper end of the body portion 112 across the groove 111; a pair of elastic portions 115, which are symmetrically extended along the length direction of the body portion 112; a second tip contact portion 116, which is formed at the front end of each elastic portion 115; and a guide surface 117, which protrudes inward at each end of the elastic portion 115 and faces each other.

[0054] The opposite surfaces of the main body 112 are provided with a groove 111 formed along the central axis in the length direction with a certain width and depth. The upper end of the groove 111 is open to the upper end of the main body 112, and the lower end has a hook locking platform 111a with a step difference. The main body 112 has a certain thickness t1 as a whole, and the main body 112 has a thinner thickness t2 (t2 <t1)。

[0055] The main body 112 is provided with a pair of shoulder protrusions 113 extending and protruding toward the left and right side ends, and the shoulder protrusions 113 support the spring. In addition, the maximum width of the upper contact pin 110 depends on the width w1 between the two shoulder protrusions 113.

[0056] The first tip contact portion 114 is formed integrally and symmetrically at the upper end of the body portion 112. Preferably, the first tip contact portion 114 includes an edge line formed by connecting two different contact surfaces. In this embodiment, the first contact surfaces 114a and 114b composed of two curved surfaces in the first tip contact portion 114 are connected to form an upper edge line. In this case, the contact surface can be a curved surface with a certain curvature or an inclined surface with a certain inclination. This first tip contact portion 114 contacts the terminal line of the IC.

[0057] The elastic parts 115 are symmetrically arranged on both sides of the main body part 112 in the length direction with a certain width w2 therebetween. The ends of the elastic parts 115 each have a guiding surface 117 that protrudes inward and faces each other. The inflection point end 117a extending from the end of the elastic part 115 to the guiding surface 117 functions as a hook that restricts the up-and-down movement between the two contact pins.

[0058] Therefore, the width w3 between the guiding surfaces 117 of the elastic parts 115 is smaller than the width w2 between the two elastic parts 115 (w3 < w2). Preferably, the width w3 between the two guiding surfaces 115 is greater than or equal to the thickness t2 of the groove 111 part of the main body part 112 (t2 ≤ w3). And the width w2 between the two elastic parts 115 is greater than or equal to the thickness t1 of the main body part 112 (t1 ≤ w2).

[0059] After the upper contact pin and the lower contact pin are assembled, the guiding surface 117 of the upper contact pin is inserted into the groove of the lower contact pin, and the guiding surface of the lower contact pin is inserted into the groove 111 of the upper contact pin. The contact of each guiding surface with the bottom surface of the groove serves to conduct electricity between the upper contact pin and the lower contact pin.

[0060] An inclined chamfered surface 112a is formed at the lower end corner of the main body part 112 adjacent to the two elastic parts 115. The chamfered surface 112a can facilitate the assembly between the elastic parts 115 when assembling the two contact pins.

[0061] The second tip contact part 116 is vertically extended and formed at the front end of each elastic part 115. Preferably, the second tip contact part 116 includes an edge line formed by the junction of two different contact surfaces. This embodiment shows that the upper edge line is formed by the junction of the second contact surfaces 116a and 116b composed of two curved surfaces in the second tip contact part 116. At this time, the contact surface can be a curved surface with a certain curvature or an inclined surface with a certain inclination. This second tip contact part 116 contacts the terminal wire of the IC.

[0062] Preferably, compared with the length L2 from the first tip contact part 114 to the lower end of the main body part 112, the length L3 of the elastic part 115 including the second tip contact part 116 is longer (L2 < L3).

[0063] Figure 8 Figures (a), (b), and (c) show the extended states of the spring contact of the embodiment of the present invention. Figure (a) is a three-dimensional configuration diagram, and Figures (b) and (c) are cross-sectional configuration diagrams in mutually perpendicular directions.

[0064] See Figure 8The upper contact pin 110 and the lower contact pin 120 are assembled along the length direction so that the elastic parts 115 and 125 cross each other, and the spring 130 is supported by the shoulder protrusions 113 and 123 of the upper contact pin 110 and the lower contact pin 120, thereby keeping the upper contact pin 110 and the lower contact pin 120 in an extended state.

[0065] In the above-mentioned extended state, the first tip contact portion 116 of the upper contact pin 110 of the spring contact 100 is in a state of being exposed to the upper end of the spring 130, and the second tip contact portion 126 of the lower contact pin 210 is located inside the spring 130. On the contrary, the first tip contact portion 126 of the lower contact pin 120 is in a state of being exposed to the lower end of the spring 130, and the second tip contact portion 116 of the upper contact pin 110 is located inside the spring 130.

[0066] Fig. 9 (a), (b), and (c) are diagrams showing the compressed state of the spring contact of an embodiment of the present invention, (a) is a three-dimensional structure diagram, and (b) and (c) are cross-sectional structure diagrams at right angles to each other. Fig. 9 The upper end of the spring contact in (b) and (c) is a ball terminal of the IC shown from a planar perspective, showing the contact portion between the tip contact portion and the ball terminal.

[0067] See also Fig. 9 In the compressed state, the overall height L1 of the spring contact 100 is equal to the height L1 of one contact pin (see Figure 7 ), at this time, the first tip contact portion 114 of the upper contact pin 110 which is the upper end portion of the spring contact 100 and the second tip contact portion 126 of the lower contact pin 120 contact the ball terminal 1 of the IC at four locations (114A)(126A) at right angles to each other.

[0068] Likewise, the lower end of the spring contact 100 is also in the same manner, and the second tip contact portion 116 of the upper contact pin 110 and the first tip contact portion 124 of the lower contact pin 120 are in contact with the terminal (not shown) of the PCB at the same time.

[0069] As described above, in the compressed state, the spring contact 100 of the present invention makes electrical contact with the tip contact portion of the ball terminal 1 at four locations, thereby shortening the length L1 of the designed spring contact and minimizing the resistance.

[0070] Fig.10 (a), (b), and (c) are views showing a spring contact according to another embodiment of the present invention, wherein (a) is a cross-sectional view, (b) is a plan view of an upper contact pin, and (c) is a cross-sectional view taken along line DD. Fig.10The upper end of the spring contact in (a) is a land type terminal 2 of an IC shown from a planar perspective, showing the contact portion between the tip contact portion and the terminal.

[0071] See also Fig.10 The spring contact 200 of this embodiment includes an upper contact pin 210, a lower contact pin 220 cross-assembled with the upper contact pin 210, and a spring 230 elastically supporting the upper contact pin 210 and the lower contact pin 120. The upper contact pin 210 and the lower contact pin 220 are provided by a common contact pin, which is the same as the above embodiment.

[0072] The upper contact pin 210 includes a main body portion 212 having a groove 211 formed on the opposing surfaces, a shoulder protrusion 213 extending and protruding from the left and right side ends of the main body portion 212, a pair of elastic portions 215 extending symmetrically in the length direction of the main body portion 112, and a second tip contact portion 216 and a guide surface 217 respectively arranged at the ends of the elastic portion 215. This is the same as the above-mentioned embodiment. In particular, the upper contact pin 210 of this embodiment has a first tip contact portion 214 extending on the center axis.

[0073] The first tip contact portion 214 includes an edgeline formed by contact of two contact surfaces with different inclinations, and the contact surface can be provided by a curved surface. In addition, the height k from the shoulder protrusion 213 to the first tip contact portion 214 can be determined in consideration of the height of the IC terminal.

[0074] The spring contact 200 of this embodiment constructed as above has an overall height that is the same as the height of a contact pin when compressed. At this time, the first tip contact portion 214 of the upper contact pin 210 serving as the upper end portion of the spring contact 200 and the second tip contact portion 226 of the lower contact pin 220 are in contact with the terminal 2 of the IC at three locations, 214A and 226A, at the same time.

[0075] As described above, the first tip contact portion of the upper contact pin 210 may include one ridge line or more than two ridge lines according to the terminal of the IC.

[0076] Fig.11 (a) and (b) are the side view and rear view of a BGA type device (IC), respectively. Fig.12 This is a plan view of a BGA type device test socket according to an embodiment of the present invention. Fig.13 for Fig.12 The cross-sectional structure diagram of the EE line.

[0077] See also Fig.12 and Fig.13The socket 300 of this embodiment includes: a spring contact 100, which has an upper contact pin, a lower contact pin cross-assembled with the upper contact pin, and a spring elastically supporting the upper contact pin and the lower contact pin; a lower membrane plate 310, which is formed with a plurality of first through holes 311 for penetrating the spring contacts 100; an intermediate plate 320, which is arranged on the upper part of the lower membrane plate 310 and has a second through hole formed at a position corresponding to the first through hole 311; and an upper membrane plate 330, which is arranged on the upper part of the intermediate plate 320 and has a third through hole formed at a position corresponding to the second through hole.

[0078] In this embodiment, the spring contact 100 may be provided by the spring contacts exemplified above, and two or more spring contacts may be used according to the terminals of the IC.

[0079] The lower film 310 , the middle film 320 , and the upper film 330 are integrally formed to have a certain thickness, and through holes are formed in a certain pattern. The spring contacts 100 are inserted into the through holes to contact the terminals of the IC.

[0080] The upper surface of the lower membrane 310 may further include a reinforcing plate 350, and the reinforcing plate 350 may be provided with a socket assembly hole 351 and a guide hole 352 for guiding the socket to a correct position. The reinforcing plate 350 may be provided by metal (SUS) or resin.

[0081] A first adjustment plate 361 is provided on the lower surface of the lower diaphragm 310 so as to be height-adjustable, and a second adjustment plate 362 for adjusting the height may also be provided on the upper surface of the upper diaphragm 330 .

[0082] Preferably, the middle plate 320 is provided by an elastomer such as silicone. The middle plate made of elastomer can be made by injecting liquid resin into another mold and curing it, so it is easier to manufacture than the conventional injection molding of synthetic resin.

[0083] Fig.14 This is a cross-sectional view of the socket according to the embodiment of the present invention, showing a state where IC 3 is mounted.

[0084] See also Fig.14 , IC3 is arranged at the upper part of the socket 300, at this time, each spring contact 100 in the socket 300 contacts the ball terminal 1 and is compressed, and the first tip contact portion 114 of the upper contact pin 110 and the second tip contact portion 126 of the lower contact pin 120 contact the ball terminal 1 of the IC at the same time. In addition, the second tip contact portion 116 of the upper contact pin 110 and the first tip contact portion 124 of the lower contact pin 120 also contact the terminal (not shown) of the PCB at the same time, and at this time, the height L1 of the spring contact 100 is the same as the height of one contact pin (see Fig. 9 ).

[0085] Fig.15 (a) and (b) are the side view and rear view of a composite device (IC) that is a mixture of BGA type and LGA type, respectively. Fig.16 FIG. 1 is a plan view of a socket suitable for testing a composite device according to another embodiment of the present invention. Fig.17 for Fig.16 The cross-sectional structure diagram of the FF line.

[0086] See also Fig.16 and Fig.17 The socket 400 of this embodiment includes a lower membrane plate 410, a middle plate 420 and an upper membrane plate 430. A reinforcing plate of the lower membrane plate 410 can be added. The main structure of the adjustment plate for adjusting the height is substantially the same as that of the above embodiment, so it is not repeated here.

[0087] The socket 400 of the present embodiment is characterized in that it includes different kinds of spring contacts 100 and 200 according to the type of terminals of the composite device.

[0088] The ball type terminals 4a and the land type terminals 4b of the composite device 4 have different heights d1 and d2. Accordingly, the socket 400 has first spring contacts 100 and second spring contacts 200 having different heights according to the types of the terminals.

[0089] In this embodiment, a first spring contact 100 (see FIG. 1 ) having a pair of first tip contact portions 114 is provided at the position of the ball-shaped terminal 4a. Figures 6 to 9 ), at the position of the land type terminal 4b, a second spring contact 200 having an upper contact pin and a first tip contact portion 214 is provided (see Fig.10 ).

[0090] As described above, the spring contact of the present invention has a high degree of design freedom in the height or shape of the first tip contact portion at the upper end of the contact pin. Therefore, in order to compensate for the height difference (d1-d2) caused by the terminal type when the socket 400 carries the IC, it may include different types of first spring contacts 100 and second spring contacts 200 with a height difference d3.

[0091] As described above, although the present invention has been described through limited embodiments and drawings, the present invention is not limited thereto, and ordinary technicians in the technical field to which the present invention belongs can make various modifications and variations within the equivalent scope of the technical concept of the present invention and the attached claims.

[0092] Description of Reference Numerals

[0093] 100, 200: Spring contact 110, 210: Upper contact pin

[0094] 111, 211: groove 112, 212: body

[0095] 113, 213: shoulder protrusions 114, 214: first tip contact portions

[0096] 115, 215: elastic portion 116, 216: second tip contact portion

[0097] 117, 217: guide surface 120, 220: lower contact pin

[0098] 130, 230: Spring 300, 400: Socket

[0099] 310, 410: lower membrane plate 320, 420: middle plate

[0100] 330, 430: Upper membrane plate

Claims

1. A socket, characterized in that: include: A plurality of spring contacts, comprising an upper contact pin, a lower contact pin cross-assembled with the upper contact pin and capable of linear operation with each other, and a coil spring elastically supporting the upper contact pin and the lower contact pin; A lower diaphragm plate, which is formed with a plurality of first through holes for penetrating and arranging the spring contacts; an intermediate plate disposed on an upper portion of the lower membrane plate and having a second through hole formed at a position corresponding to the first through hole; and an upper membrane plate, which is disposed on the upper portion of the middle plate and has a third through hole formed at a position corresponding to the second through hole; The middle plate is an elastic body with elasticity; The spring contact is inserted into the second through hole and the third through hole.

2. The socket according to claim 1, characterized in that: The spring contacts have different heights corresponding to the terminals of the device.

3. The socket according to claim 1, characterized in that: The lower diaphragm or the upper diaphragm further has an adjusting plate for adjusting the height.

4. The socket according to claim 1, characterized in that: A reinforcing plate is also provided at the edge of the lower membrane plate.

5. The socket according to claim 4, characterized in that: The lower membrane plate and the reinforcing plate are respectively formed with socket assembly holes formed therethrough.

6. The socket according to claim 4, characterized in that: The lower membrane plate and the reinforcing plate are respectively formed with guide holes formed therethrough to guide the assembly position.

7. A spring contact, comprising an upper contact pin, a lower contact pin cross-assembled with the upper contact pin, and a coil spring elastically supporting the upper contact pin and the lower contact pin, wherein the spring contact is characterized in that: The upper contact pin and the lower contact pin are plate-shaped contact pins having the same shape and satisfying the following conditions: length L1>width w1>thickness t1. The upper contact pin and the lower contact pin respectively include: The main body has grooves formed on its opposite surfaces along the length direction, each of the grooves is configured to have an opening formed at one end and a hook locking platform formed with a step at the other end; a pair of shoulder bosses, which are formed protrudingly at the left and right side ends of the body and support the coil spring; A first tip contact portion extending from the upper end of the body portion; A pair of elastic parts extending symmetrically along the length direction of the main body, each having a guide surface protruding inwardly at the end of each elastic part and facing each other; as well as A second tip contact portion protrudes from the front end of each of the elastic portions, A chamfered inclined surface with an inclination is formed at the lower end corner of the main body portion adjacent to the elastic portion, and the first tip contact portion and the second tip contact portion respectively include an edge line formed by connecting two different curved surfaces or contact surfaces with an inclination. At the portion where the groove is formed, the thickness t2 of the body portion is less than or equal to the width w3 between the guide surfaces, the width w3 between the guide surfaces is smaller than the thickness t1 of the body portion, and the length L3 of the elastic portion including the second tip contact portion is formed to be greater than the length L2 from the first tip contact portion to the lower end of the body portion, The two elastic parts of the upper contact pin and the two elastic parts of the lower contact pin are cross-assembled with each other, so that the guide surface of the upper contact pin contacts along the groove of the lower contact pin, and the guide surface of the lower contact pin contacts along the groove of the upper contact pin, and when the coil spring is compressed, the overall length of the spring contact is equal to the height L1 of one contact pin; The width w2 between the two elastic portions is greater than or equal to the thickness t1 of the main body portion.

8. The spring contact according to claim 7, characterized in that: Two or more of the first tip contact portions of the upper contact pin and the lower contact pin are provided.

9. The spring contact according to claim 7, characterized in that: A width w1 between the pair of shoulder bosses is greater than an outer diameter of the coil spring.

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