Optical image stabilization device, electronic device

Abstract

The present invention provides an optical anti-shake device and electronic device that use a mobile image sensor chip for motion compensation. The optical anti-shake device that uses a mobile image sensor chip for motion compensation includes an image sensor chip, a carrier, an elastic conductive member, a lower substrate, and a shape memory alloy drive component. The image sensor chip is fixedly arranged on the carrier, and the carrier is connected to the elastic conductive member and coupled with the capacitive member to achieve electrical conduction and signal transmission with the external circuit of the lower substrate; the image sensor chip moves in the X and Y directions and rotates in the plane under the drive of the shape memory alloy drive component to perform motion compensation. The optical anti-shake device and electronic device provided by the present invention have a simple structure and a simple manufacturing process, which can improve product yield, reduce manufacturing costs, increase reliability, and improve image quality.

Description

Technical Field

[0001] The present invention relates to the field of image imaging technology, and in particular to an optical anti-shake device and an electronic device that use a mobile image sensor chip to perform motion compensation. Background Art

[0002] When a handheld portable smart device is used to take photos, the physiological tremor of the human body is unavoidable and cannot be overcome through training. As a result, the handheld portable smart device will inevitably shake along with the human body when taking photos, resulting in a decrease in image quality. The most obvious manifestation is that the image obtained is blurry and unclear.

[0003] Existing handheld portable smart devices use a lens assembly that can move in the XY axis direction in the camera module to compensate for the physiological tremor of the human body and obtain high-quality images. However, with the advancement of technology and the increasing pursuit of images by consumers, the camera module of existing handheld portable smart devices has become larger and heavier due to the increase in the size of the image sensor. The traditional method of moving the lens in the XY axis direction for compensation has become increasingly difficult to push the heavy lens. Moreover, the angle that can be compensated by the method of moving the lens in the XY axis direction for compensation can no longer meet customers' demand for image quality.

[0004] In the prior art, the optical image stabilization method provided by the movable photosensitive element has a complex structure and is mostly applied to SLR digital cameras, and there are few cases of mass production in handheld portable smart devices. Summary of the invention

[0005] The purpose of the present invention is to provide an optical image stabilization device that uses a mobile image sensor chip for motion compensation, so as to solve the technical problem that in the traditional technology, the lens is required to move and compensate in the XY axis direction, but the lens is heavy and difficult to push, and has a large size, which makes it difficult to meet the compensation requirements at certain angles and is insufficient to meet the higher image quality requirements.

[0006] In order to solve the above technical problems, the present invention provides an optical image stabilization device using a mobile image sensor chip for motion compensation, comprising:

[0007] An image sensor chip, a carrier, an elastic conductive member, a lower substrate and a shape memory alloy driving assembly, wherein the image sensor chip is fixedly arranged on the carrier, and the carrier realizes electrical conduction and signal transmission with an external circuit of the lower substrate by way of connection with the elastic conductive member and capacitive coupling;

[0008] The image sensor chip is driven by the shape memory alloy driving component to move in the X and Y directions and rotate in a plane to perform motion compensation.

[0009] Preferably, the carrier board is further provided with: a capacitor unit and / or a resistor unit and / or an inductor unit and / or an auxiliary chip, and a circuit wiring unit;

[0010] The circuit wiring unit is suitable for realizing electrical connection between the image sensor chip and the capacitor unit and / or the resistor unit and / or the inductor unit and / or the auxiliary chip.

[0011] Preferably, the shape memory alloy driving component is adapted to deform when powered on, so as to drive the image sensor chip to move in the X and Y directions and rotate in a plane, so as to perform motion compensation;

[0012] The elastic conductive member is suitable for driving the image sensor chip to return to its original position through a rebound force when the shape memory alloy driving component is powered off, and the elastic conductive member is also suitable for transmitting a power signal and a control signal of the image sensor.

[0013] Preferably, the elastic conductive member is a plurality of groups of L-shaped metal wires, a first end of the L-shaped metal wire is connected to a corner of one side of the carrier, and a second end is connected to the lower substrate on a non-corresponding side of the carrier.

[0014] Preferably, the shape memory alloy driving component comprises: a shape memory alloy wire, one end of which is electrically connected to the carrier board, and the other end of which is electrically connected to the lower substrate below the image sensor chip so as to be electrically connected to an external circuit; there are at least two shape memory alloy wires.

[0015] Preferably, the shape memory alloy wire is suitable for being arranged on two sides or four sides of the image sensor chip.

[0016] Preferably, the carrier board is further provided with: a resistance unit, a capacitance unit and a circuit wiring unit;

[0017] The circuit wiring unit is adapted to provide a conductive path between the pins of the image sensor chip and the elastic conductive member so as to be electrically connected to the circuit on the lower substrate;

[0018] The resistance unit and the capacitance unit are connected to the circuit wiring unit.

[0019] Preferably, an upper plate unit is further provided on the circuit wiring unit, and a lower plate unit is further provided on the lower substrate. The upper plate unit and the lower plate unit correspond to each other, and transmit the high-speed image data signal of the image sensor chip by AC coupling.

[0020] Preferably, the upper electrode plate unit is a metal electrode plate arranged on the lower surface of the carrier plate, and the metal electrode plates are evenly distributed on four sides of the carrier plate.

[0021] Preferably, the capacitor unit is arranged around the chip.

[0022] Preferably, the capacitor unit includes a plurality of capacitors arranged in a strip shape and disposed on both sides of the chip.

[0023] Preferably, the image sensor chip is electrically connected to the carrier board through metal wire bonding or flip chip bonding.

[0024] Preferably, an external fixing frame is further provided, which is suitable for limiting the movement of the image sensor chip within a certain space; the external fixing frame is provided on the lower substrate.

[0025] Preferably, the displacement of the image sensor chip is fed back through a change in resistance of the shape memory alloy wire after power is supplied.

[0026] Compared with the prior art, the optical image stabilization device of the present invention using a mobile image sensor chip for motion compensation has the following beneficial effects:

[0027] In the optical image stabilization device using a mobile image sensor chip for motion compensation provided by the technical solution of the present invention, an image sensor chip is used for motion compensation, and the image sensor chip is electrically connected to an external circuit by metal bonding and / or flip-chip bonding. Therefore, the structure is simple, the manufacturing process is also simple, the product yield can be increased, the manufacturing cost can be reduced, the reliability can be increased, and the image quality can be improved.

[0028] Furthermore, in the technical solution provided by the present invention, the image sensor chip is arranged on and electrically connected to the carrier, and the connection ports between the image sensor chip and the external circuit are simplified by merging the circuits in the carrier, thereby reducing the circuits between the carrier and the lower substrate, so as to reduce the movement resistance of the carrier (including the image sensor chip) and increase the flexibility of the carrier's movement.

[0029] Furthermore, in the technical solution provided by the present invention, an elastic conductor constructed of metal (thick) wires is used between the carrier and the lower substrate to achieve electrical connection and elastic contact, which simplifies the overall structure and increases the flexibility of the carrier's movement.

[0030] Furthermore, in the technical solution provided by the present invention, the capacitor formed by the electrodes corresponding to the lower surface of the carrier and the upper surface of the lower substrate transmits the image signal in an AC coupling manner, so that the overall structure is simple and the flexibility of the carrier movement is increased.

[0031] Furthermore, in the technical solution provided by the present invention, a shape memory alloy wire is used to provide a driving force, and an elastic flexure portion is used to provide a restoring force, and the structure is light and simple, the volume is small, and the cost is low.

[0032] Furthermore, in the technical solution provided by the present invention, the change in resistance value of the shape memory alloy wire during deformation can reflect the displacement of the chip, and there is no need to set a Hall feedback loop to feedback the displacement. The structure is simple, the volume is small, and the cost is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 to Figure 2 It is a schematic structural diagram of an optical image stabilization device that uses a mobile image sensor chip to perform motion compensation in an embodiment provided by the present invention. DETAILED DESCRIPTION

[0034] Many specific details are set forth in the following description to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the present invention, so the present invention is not limited to the specific implementation disclosed below.

[0035] Secondly, the present invention is described in detail using schematic diagrams. When describing the embodiments of the present invention in detail, for the convenience of explanation, the schematic diagrams are only examples and should not limit the scope of protection of the present invention.

[0036] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the optical image stabilization device using a mobile image sensor chip for motion compensation of the present invention is described in detail below with reference to the accompanying drawings.

[0037] The technical solution of the present invention provides an optical image stabilization device, which utilizes an image sensor chip to translate on the XY axis and rotate around the optical axis of the chip to achieve the purpose of optical image stabilization compensation.

[0038] Specifically, the following combination Figure 1 to Figure 2 The implementation method of this case is specifically described.

[0039] Specifically, this embodiment provides an optical image stabilization device that uses a mobile image sensor chip to perform motion compensation, including:

[0040] The image sensor chip 111, the carrier 100 carrying the image sensor chip 111, and the lower substrate 200, wherein the carrier is electrically connected and transmits signals with the external circuit of the lower substrate by means of elastic conductive parts and capacitive coupling. A shape memory alloy driving component 300 and a rebound component are also arranged between the carrier 100 and the lower substrate 200. The image sensor chip 111 and the carrier 100 move in the X and Y directions and rotate in the plane under the drive of the shape memory alloy driving component 300 to perform motion compensation.

[0041] Furthermore, in this embodiment, an external fixing frame 500 is also provided. The external fixing frame 500 is provided on the lower substrate 200 and is suitable for limiting the movement of the image sensor chip 111 within a certain space.

[0042] Specifically, the image sensor chip 111 is fixedly disposed on the carrier 100 , and the carrier 100 is connected to the lower substrate 200 through the elastic conductive member 340 and capacitive coupling, so that the image sensor chip 111 is electrically connected and transmits signals with an external circuit (not shown).

[0043] Specifically, in this embodiment, the carrier board 100 is further provided with: a capacitor unit and / or a resistor unit and / or an inductor unit and / or an auxiliary chip, and a circuit wiring unit;

[0044] The circuit wiring unit is suitable for realizing the electrical connection between the image sensor chip and the capacitor unit and / or resistor unit and / or inductor unit and / or auxiliary chip; in the present embodiment, the circuit wiring unit on the carrier 100 merges the pins of the image sensor chip 111 through lines, thereby simplifying the external circuit of the chip and reducing the connection points between the carrier 100 and the circuit on the lower substrate 200.

[0045] An upper plate unit is also provided on the circuit wiring unit, and a lower plate unit is also provided on the lower substrate 200 . The upper plate unit and the lower plate unit correspond to each other and transmit the high-speed image data signal of the image sensor chip by AC coupling.

[0046] The upper electrode unit is a metal electrode disposed on the lower surface of the carrier 100 , and the metal electrode is evenly distributed on the lower surface of the carrier 100 .

[0047] The carrier 100 is then electrically connected to the lower substrate 200 by using an elastic conductive member 340. This design reduces the number of gold wires between the carrier 100 and the lower substrate 200, thereby reducing the motion resistance of the carrier 100 carrying the image sensor chip 111 in motion compensation required for anti-shake, thereby increasing flexibility.

[0048] Specifically, in this embodiment, the capacitor unit 330 is disposed around the chip. Preferably, the capacitor unit 330 includes a plurality of capacitors arranged in a strip shape and disposed on both sides of the image sensor chip 111 .

[0049] Specifically, in this embodiment, the image sensor chip 111 is electrically connected to the carrier 100 by flip chip bonding or metal wire bonding.

[0050] Combination Figure 2 Specifically, in this embodiment, the shape memory alloy driving component 300 includes: a shape memory alloy wire 301, one end of the shape memory alloy wire 301 is electrically connected to the carrier 100, and the other end is electrically connected to the lower substrate 200 below the image sensor chip 111, so as to be electrically connected to the external circuit; there are at least two shape memory alloy wires 301, which are distributed on two opposite sides of the carrier 100 to maintain the balance of the movement of the carrier. Preferably, there are four shape memory alloy wires 301, which are evenly distributed on the four sides of the carrier 100.

[0051] The shape memory alloy driving component 300 is adapted to deform when powered on, so as to drive the image sensor chip 111 to move in the X and Y directions and to rotate in a plane, so as to perform motion compensation.

[0052] In addition, continue to refer to Figure 1 As shown, in this embodiment, the carrier board 100 is further provided with: an elastic conductive member 340;

[0053] The elastic conductive member is suitable for driving the image sensor chip 111 to return to its original position through a rebound force when the shape memory alloy driving assembly 300 is powered off, and the elastic conductive member is also suitable for transmitting power signals and control signals of the image sensor.

[0054] Specifically, in this embodiment, the elastic conductive member 340 has at least one bending portion, which half surrounds the image sensor chip.

[0055] Specifically, the elastic conductive member 340 is a plurality of groups of L-shaped metal wires, a first end of the L-shaped metal wire is connected to a corner of one side of the carrier 100 , and a second end is connected to the lower substrate 200 on a non-corresponding side of the carrier 100 .

[0056] At least two elastic conductive members are arranged in sequence in the same direction and manner, with two adjacent elastic cantilevers connected end to end.

[0057] Furthermore, the two mounting ends of the elastic conductive member 340 are not in a horizontal plane, so that the elastic conductive member has an elastic pre-pressure in the -Z direction in the Z-axis direction, so that the carrier can be relatively stably located on the lower substrate.

[0058] Specifically, in this embodiment, the shape memory alloy wire 301 is suitable for being arranged around the image sensor chip 111 , corresponding to the elastic conductive member.

[0059] Specifically, the rebound force of the elastic conductive component is in the opposite direction to the traction force generated by the contraction of the shape memory alloy wire 301 when power is supplied. Thus, when the shape memory alloy wire 301 is powered off and restored to its original state, the rebound force provided by the elastic conductive component can quickly drive the carrier to return to its original position, thereby ensuring that the position of the image sensor chip 111 is quickly restored to its original position.

[0060] Furthermore, in the technical solution provided by the present invention, the shape memory alloy wire 301 and the elastic conductive member are arranged between the carrier 100 and the lower substrate 200 in cooperation with each other, ensuring that the carrier 100 can drive the image sensor chip 111 to move to complete the anti-shake position compensation function through the shape memory alloy wire 301 when the power is on, and can also drive the image sensor chip 111 to return to its original position more quickly under the action of the rebound force of the elastic conductive member when the power is off.

[0061] Furthermore, the shape memory alloy wire 301 and the elastic conductive member are both slender components, which are arranged on both sides or around the carrier 100 in cooperation with each other, and do not occupy too much space of the entire optical image stabilization device that uses a mobile image sensor chip for motion compensation, thereby saving the overall volume of the optical image stabilization device that uses a mobile image sensor chip for motion compensation.

[0062] Specifically, in this embodiment, the displacement of the image sensor chip is fed back through the change in resistance of the shape memory alloy wire after power is applied. Thus, in the technical solution provided by the present invention, the displacement of the image sensor chip 111 can be reflected through the resistance value of the shape memory alloy wire, and there is no need to set a Hall feedback loop to feed back the displacement, which has a simple structure, a small size, and a low cost.

[0063] In addition, an embodiment provided by the present invention also includes an electronic device, including the optical image stabilization device that uses a mobile image sensor chip to perform motion compensation as described above.

[0064] Although the present invention has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art may make possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. An optical image stabilization device using a mobile image sensor chip for motion compensation, characterized in that: include: An image sensor chip, a carrier, an elastic conductive member, a lower substrate and a shape memory alloy driving assembly, wherein the image sensor chip is fixedly arranged on the carrier, the carrier realizes electrical conduction and signal transmission with an external circuit of the lower substrate by way of connection with the elastic conductive member and capacitive coupling, the elastic conductive member is suitable for transmitting power supply signals and control signals of the image sensor, and transmits image signals by way of AC coupling through capacitors formed by electrodes corresponding to the lower surface of the carrier and the upper surface of the lower substrate; The image sensor chip is driven by the shape memory alloy driving component to move in the X and Y directions and rotate in a plane to perform motion compensation.

2. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1, characterized in that: The carrier board is also provided with: a capacitor unit and / or a resistor unit and / or an inductor unit and / or an auxiliary chip, and a circuit wiring unit; The circuit wiring unit is suitable for realizing electrical connection between the image sensor chip and the capacitor unit and / or the resistor unit and / or the inductor unit and / or the auxiliary chip.

3. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1, characterized in that: The shape memory alloy driving component is suitable for deforming when powered on to drive the image sensor chip to move in the X and Y directions and rotate in a plane to perform motion compensation; The elastic conductive member is suitable for driving the image sensor chip to return to its original position through a rebound force when the shape memory alloy driving component is powered off.

4. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 2, characterized in that: The elastic conductive member has at least one bending portion, which half surrounds the image sensor chip.

5. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1, characterized in that: The elastic conductive member is a plurality of groups of L-shaped metal wires, wherein a first end of the L-shaped metal wire is connected to a corner of one side of the carrier, and a second end is connected to a lower substrate on a non-corresponding side of the carrier.

6. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 2, characterized in that: The shape memory alloy driving component includes: a shape memory alloy wire, one end of which is electrically connected to the carrier board, and the other end of which is electrically connected to the lower substrate below the image sensor chip to be electrically connected to an external circuit; there are at least two shape memory alloy wires.

7. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 6, characterized in that: The shape memory alloy wire is suitable for being arranged on two sides or four sides of the image sensor chip.

8. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1, characterized in that: The carrier board is also provided with: a resistance unit, a capacitance unit and a circuit wiring unit; The circuit wiring unit is adapted to provide a conductive path between the pins of the image sensor chip and the elastic conductive member so as to be electrically connected to the circuit on the lower substrate; The resistance unit and the capacitance unit are connected to the circuit wiring unit.

9. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 8, characterized in that: An upper plate unit is also arranged on the circuit wiring unit, and a lower plate unit is also arranged on the lower substrate. The upper plate unit and the lower plate unit correspond to each other and transmit the high-speed image data signal of the image sensor chip by AC coupling.

10. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 9, characterized in that: The upper electrode plate unit is a metal electrode plate arranged on the lower surface of the carrier plate, and the metal electrode plates are evenly distributed on four sides of the carrier plate.

11. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 8, characterized in that: The capacitor unit is arranged around the image sensor chip.

12. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 11, characterized in that: The capacitor unit includes a plurality of capacitors arranged in a strip shape and disposed on both sides of the image sensor chip.

13. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1, characterized in that: The image sensor chip is electrically connected to the carrier board by metal wire bonding or flip-chip bonding.

14. The optical image stabilization device for motion compensation using a mobile image sensor chip according to claim 1, characterized in that: An external fixing frame is also provided, which is suitable for limiting the movement of the image sensor chip within a certain space; the external fixing frame is provided on the lower substrate.

15. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 6, characterized in that: The displacement of the image sensor chip is fed back through the change in resistance of the shape memory alloy wire after power is supplied.

16. An electronic device, characterized in that: The invention comprises an optical image stabilization device for performing motion compensation using a mobile image sensor chip as claimed in claim 1.

Images