A method for manufacturing a PCB with stepped grooves

Abstract

The present invention proposes a method for manufacturing a PCB with a stepped groove, comprising the following steps: S1: manufacturing a blank plate to be milled; S2: etching the first conductive layer in the inner layer; S3: using a depth-controlled milling machine to install a preset parameter milling groove according to the distance from the sensing base plate; S4: manufacturing a conductive stepped groove. The present invention uses the sensing base plate and the sensing component to accurately adjust the depth of the milling cutter by measuring the distance from the sensing base plate, thereby achieving accurate control of the thickness between the dielectric layer and the second conductive layer, and can form stepped grooves of various sizes at one time to meet the packaging requirements during special shapes.

Description

Technical Field

[0001] The invention relates to the field of PCB board processing, and in particular to a method for manufacturing a PCB with stepped grooves. Background Art

[0002] With the accelerated popularization of information technology, the rapid promotion of Internet giants, and the maturity of automobile intelligent technology, the pace of the autonomous driving car industry is bound to accelerate. In order to realize the function of autonomous driving, a large number of control systems will be installed in the car, which requires the size of the PCB as the component carrier to be reduced accordingly. In order to meet the requirements of miniaturization of electronic products, the current method is to bury the components in the PCB or design stepped grooves to embed the components.

[0003] Currently, embedded buffer rubber gaskets are usually used for groove milling. Not only do gaskets need to be placed in advance, but more gaskets need to be placed for step grooves with various size requirements. The placement of gaskets is more complicated and difficult, and the accuracy requirement for gasket placement is also high. At the same time, it also cannot meet the packaging requirements for some devices with special shapes. Summary of the invention

[0004] In order to solve the above problems, the present invention proposes a method for manufacturing a PCB with stepped grooves.

[0005] The main contents of the present invention include:

[0006] A method for manufacturing a PCB with a stepped groove, the PCB comprising a dielectric layer, a first conductive layer arranged on the upper surface of the dielectric layer, and a second conductive layer arranged on the lower surface of the dielectric layer; comprising the following steps:

[0007] S1. After coating and exposure, a blank plate is produced;

[0008] S2. According to the preset position of the stepped groove to be milled, the inner layer is etched in the corresponding area on the first conductive layer;

[0009] S3. The blank obtained in S2 is placed on the sensing bottom plate of the depth control milling machine. The depth control milling machine measures the distance between the sensing bottom plate and the sensing bottom plate through its sensor component, and performs depth control milling on the sub-plate according to the set parameters to obtain a preliminary stepped groove;

[0010] S4. The preliminary step groove is subjected to copper deposition and copper plating to obtain a conductive step groove.

[0011] Preferably, the method further comprises the step of initializing the controlled depth milling machine, including the sub-steps of zeroing the controlled depth milling machine and entering the parameters of the stepped groove to be milled into the controlled depth milling machine.

[0012] Preferably, the depth-controlled milling machine includes a measuring unit, a control unit, a spindle and a milling cutter. The measuring unit and the spindle are connected to the control unit. The milling cutter is installed on the spindle. The measuring unit is used to calculate the distance between the milling cutter and the sensing base plate measured by the sensor assembly. The control unit receives the data collected by the measuring unit and controls the spindle to drive the milling cutter to mill grooves at a set depth.

[0013] Preferably, the sensing bottom plate is an aluminum plate.

[0014] Preferably, the sensing component is a sensor.

[0015] The beneficial effects of the present invention are as follows: the present invention proposes a method for manufacturing a PCB with stepped grooves, by means of a sensing base plate and a sensing component, the depth of the milling cutter is accurately adjusted by measuring the distance from the sensing base plate, thereby achieving precise control of the thickness between the dielectric layer and the second conductive layer, and stepped grooves of various sizes can be formed at one time to meet the packaging requirements during special shapes. DETAILED DESCRIPTION

[0016] The technical solution protected by the present invention will be described in detail below.

[0017] The present invention discloses a method for manufacturing a PCB with stepped grooves, wherein the PCB comprises a dielectric layer, a first conductive layer arranged on the upper surface of the dielectric layer, and a second conductive layer arranged on the lower surface of the dielectric layer. The manufacturing method of the present invention can form stepped grooves that meet the needs of devices with special shapes in one step.

[0018] Specifically, the preparation method provided by the present invention comprises the following steps:

[0019] S1. After coating and exposure, a blank plate is produced; that is, the blank plate is a double-sided board.

[0020] S2. According to the preset position of the stepped groove to be milled, the inner layer etches the corresponding area on the first conductive layer.

[0021] S3. Prepare to start milling grooves. In this step, a depth-controlled milling machine is used for processing. The depth-controlled milling machine includes a measuring unit, a control unit, a spindle and a milling cutter, wherein the measuring unit and the spindle are connected to the control unit, and the milling cutter is installed on the spindle. The measuring unit includes an induction base plate and a sensor component. The induction base plate is used to place the blank plate to be milled. The sensor component is installed on the milling cutter. The distance between the milling cutter and the induction base plate is collected by the sensor component, that is, the required cutting depth is calculated by measuring the distance between the cutting position and the induction base plate. The control unit receives the data collected by the measuring unit and controls the spindle to drive the milling cutter to mill grooves according to the set depth. The use of this method can not only save the complicated process of placing the pad, but also can accurately mill stepped grooves of various sizes as needed.

[0022] Preferably, the sensing bottom plate is an aluminum plate. The sensing component is a plurality of sensors.

[0023] Specifically, the parameters of the step groove to be milled are first input into the control unit, and the depth-controlled milling machine is initialized and zeroed before starting the milling. Subsequently, the blank plate obtained by S2 is placed on the induction base plate of the depth-controlled milling machine. The depth-controlled milling machine measures the distance between the blank plate and the induction base plate through its sensor component, and performs depth-controlled milling on the sub-plate according to the set parameters to obtain a preliminary step groove.

[0024] S4. The preliminary step groove is subjected to copper deposition and copper plating to obtain a conductive step groove.

[0025] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a PCB with a stepped groove, characterized in that: The PCB comprises a dielectric layer, a first conductive layer arranged on the upper surface of the dielectric layer, and a second conductive layer arranged on the lower surface of the dielectric layer; and comprises the following steps: S1. After coating and exposure, a blank plate is produced; S2. According to the preset position of the stepped groove to be milled, the inner layer is etched in the corresponding area on the first conductive layer; S3. The blank obtained in S2 is placed on the induction bottom plate of the depth control milling machine. The depth control milling machine measures the distance between the induction bottom plate and the blank according to the set parameters to obtain a preliminary stepped groove; S4. The preliminary stepped groove is subjected to copper deposition and copper plating to obtain a conductive stepped groove; It also includes the step of initializing the controlled deep milling machine, including: the sub-steps of zeroing the controlled deep milling machine and entering the parameters of the step groove to be milled into the controlled deep milling machine; The depth-controlled milling machine includes a measuring unit, a control unit, a spindle and a milling cutter. The measuring unit and the spindle are connected to the control unit. The milling cutter is installed on the spindle. The measuring unit is used to calculate the distance between the milling cutter and the sensing base plate measured by the sensor component. The control unit receives the data collected by the measuring unit and controls the spindle to drive the milling cutter to mill grooves according to the set depth, thereby forming stepped grooves of various sizes at one time.

2. The method for manufacturing a PCB with a stepped groove according to claim 1, characterized in that: The induction bottom plate is an aluminum plate.

3. The method for manufacturing a PCB with a stepped groove according to claim 1, characterized in that: The sensing component is a sensor.