A detection module and device

Abstract

The present invention discloses a detection module and device, the detection module comprises a first optical signal generating unit, a photoelectric conversion component and a second optical signal generating unit which are arranged in sequence, and the surface of the first optical signal generating unit away from the photoelectric conversion component is configured as an incident surface of X-rays and gamma rays. Thus, X-rays directly enter the first optical signal generating unit from the incident surface of the first optical signal generating unit without passing through the photoelectric conversion component, and no metal components are arranged on the incident surface of the first optical signal generating unit, thus avoiding the attenuation of the energy of X-rays caused by metal components, thereby improving the intensity of the corresponding optical signal generated, thereby improving the imaging quality, and reducing the probability of re-scanning the patient, thus not only reducing the amount of radiation received by the patient, but also reducing the scanning time and improving the scanning efficiency; in addition, it also avoids the situation where serious artifacts are formed in the reconstructed image, and improves the clarity of the reconstructed image.

Description

Technical Field

[0001] The present invention relates to the field of medical scanning technology, and in particular to a detection module and a device. Background Art

[0002] PET / CT (Positron Emission Tomography / Computed Tomography) is a scanning imaging technology that integrates PET and CT. PET / CT effectively combines the advantages of both PET and CT. It can not only accurately locate lesions through CT images, but also obtain lesion metabolic capacity and functional information from PET images, thus achieving the complementarity of functional imaging and anatomical imaging information.

[0003] In order to improve the inspection speed and the accuracy of image fusion, the PET detection device and the CT detection device are integrated together in the prior art. Specifically, Figure 1 As shown, a first photoelectric converter 1121, a first optical signal generator 111, a second optical signal generator 113 and a second photoelectric converter 1123 are sequentially arranged along the incident direction of the ray. When scanning a patient, the X-rays of CT imaging and the gamma rays emitted by the radioactive drugs in the patient enter the first optical signal generator 111 from the surface of the first photoelectric converter 1121, and then the X-rays are processed by the first optical signal generator 111 to generate optical signals, which are then transmitted to the first photoelectric converter 1121, and the first photoelectric converter 1121 converts the optical signals into electrical signals, while the gamma rays pass through the first optical signal generator 111 to reach the second optical signal generator 113, and the second optical signal generator 113 processes the gamma rays to generate optical signals, which are then transmitted to the second photoelectric converter 1123, and the second photoelectric converter 1123 converts the optical signals into electrical signals, and then both electrical signals are transmitted to the data processor for processing and analysis, and finally a fused image is obtained.

[0004] However, the light incident surface of the first photoelectric conversion unit 1121 is provided with a PCB board, and a large number of electronic components made of metal materials are integrated on the PCB board, which can easily cause attenuation of the energy of the X-rays, thereby easily leading to the weakening of the generated light signal, thereby affecting the accuracy of imaging, and even requiring the patient to be re-scanned, which not only exposes the patient to more radiation, but also increases the scanning time and reduces the scanning efficiency; and the uneven distribution of electronic components on the PCB board can also cause serious artifacts in the reconstructed image, resulting in unclear imaging. Summary of the invention

[0005] In view of this, an embodiment of the present invention provides a detection module and a device to solve some or all of the problems existing in the related art.

[0006] In a first aspect, an embodiment of the present invention provides a detection module, comprising a first optical signal generating unit, a photoelectric conversion component, and a second optical signal generating unit, which are arranged in sequence, wherein a surface of the first optical signal generating unit away from the photoelectric conversion component is configured as an incident surface of X-rays and gamma-rays;

[0007] Wherein, the first optical signal generating unit is used to convert the X-rays and part of the gamma rays into a first optical signal;

[0008] The second optical signal generating unit is used to convert the gamma ray into a second optical signal;

[0009] The optoelectronic conversion component is used to convert the first optical signal into a first electrical signal, and the second optical signal is used to convert the second optical signal into a second electrical signal.

[0010] Optionally, the photoelectric conversion component comprises a first photoelectric conversion unit, a circuit board and a second photoelectric conversion unit which are arranged in sequence, and the circuit board is electrically connected to the second photoelectric conversion unit and the first photoelectric conversion unit respectively;

[0011] The second photoelectric conversion unit is connected to the second optical signal generating unit, and the first photoelectric conversion unit is connected to the first optical signal generating unit.

[0012] Optionally, the second photoelectric conversion part includes a plurality of second photoelectric conversion units arranged at intervals, and the signal transmission port of the circuit board is provided with a first connection part, and the first connection part passes through the gaps between the first photoelectric conversion units.

[0013] Optionally, the second optical signal generating unit includes a second crystal array composed of a plurality of second crystal pixels, and a first light reflecting unit is provided between two adjacent second crystal pixels;

[0014] The first light reflecting portion is provided with a corresponding signal transmission portion at a position corresponding to each first connecting portion, and each first connecting portion is electrically connected to an end of the corresponding signal transmission portion close to the first connecting portion.

[0015] Optionally, the number of the second photoelectric conversion units is the same as the number of the second crystal pixels and corresponds one to one.

[0016] Optionally, the number of the second photoelectric conversion units and the number of the second crystal pixels are set according to a first preset ratio, and the first preset number of second photoelectric conversion units and the second preset number of second crystal pixels are set correspondingly;

[0017] The ratio of the first preset number to the second preset number is the same as the first preset ratio, and the first preset ratio is less than 1.

[0018] Optionally, the detection module further includes a data processing unit for processing the first electrical signal and the second electrical signal;

[0019] The data processing unit is disposed on a surface of the second optical signal generating unit that is away from the photoelectric conversion component, and one end of each of the signal transmission units that is away from the first connecting unit is electrically connected to the data processing unit.

[0020] Optionally, the signal transmission part is a conductive wire, and both ends of each of the conductive wires extend to the outside of the second crystal array.

[0021] Optionally, the first photoelectric conversion section includes a plurality of first photoelectric conversion units arranged at intervals, the first optical signal generation section includes a first crystal array composed of a plurality of first crystal pixels, and a second light reflecting section is provided between two adjacent first crystal pixels.

[0022] Optionally, the number of the first photoelectric conversion units is the same as the number of the first crystal pixels and corresponds one to one.

[0023] Optionally, the number of the first photoelectric conversion units and the number of the first crystal pixels are set according to a second preset ratio, and a third preset number of first photoelectric conversion units and a fourth preset number of first crystal pixels are set correspondingly;

[0024] The ratio of the third preset number to the fourth preset number is the same as the second preset ratio, and the second preset ratio is less than 1.

[0025] Optionally, the circuit board includes a first sub-circuit board and a second sub-circuit board;

[0026] The first sub-circuit board is electrically connected to the first photoelectric conversion unit, and the second sub-circuit board is electrically connected to the second photoelectric conversion unit;

[0027] The first sub-circuit board and the second sub-circuit board are integrally formed, or a second connecting portion is provided between the first sub-circuit board and the second sub-circuit board, and the first sub-circuit board is connected to the second sub-circuit board through the second connecting portion.

[0028] Optionally, the second connection portion is a plurality of connectors, one end of each connector is connected to the first circuit board, and the other end is connected to the second circuit board;

[0029] A gap is provided between the first circuit boards and the second circuit board, and a first electrical signal processing chip is provided on a surface of the first circuit board close to the second circuit board.

[0030] Optionally, a second electrical signal processing chip is provided on a surface of the second circuit board close to the first circuit board.

[0031] Optionally, when the incident surface of the first optical signal generating unit receives only X-rays, the first photoelectric conversion unit starts to operate and the second photoelectric conversion unit stops operating.

[0032] Optionally, when the incident surface of the first optical signal generating unit receives gamma rays, the first photoelectric conversion unit and the second photoelectric conversion unit start to operate simultaneously.

[0033] In a first aspect, an embodiment of the present invention provides a detection device, comprising a plurality of detection modules according to any of the above-mentioned solutions, wherein the detection modules form a ring structure with a hollow middle portion.

[0034] Optionally, the detection device further includes an X-ray source, wherein the X-ray source is located in the annular structure, and the X-rays emitted by the X-ray source can completely cover a scanning area in the middle of the annular structure.

[0035] Optionally, the X-ray source comprises a cold cathode X-ray tube made of carbon nanotubes.

[0036] According to a detection module and device provided by an embodiment of the present invention, X-rays directly enter the first optical signal generating unit from the incident surface of the first optical signal generating unit without passing through the photoelectric conversion component, and no metal components are arranged on the incident surface of the first optical signal generating unit, thereby avoiding the attenuation of the energy of the X-rays caused by the metal components, thereby improving the intensity of the generated corresponding optical signal, thereby improving the imaging quality, and reducing the probability of re-scanning the patient, which not only reduces the amount of radiation received by the patient, but also reduces the scanning time and improves the scanning efficiency; in addition, it also avoids the formation of serious artifacts in the reconstructed image, thereby improving the clarity of the reconstructed image. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The following drawings of the present invention are used as part of the embodiments of the present invention for understanding the present invention. The embodiments of the present invention are shown in the drawings and the description thereof is used to explain the principle of the present invention.

[0038] In the attached figure:

[0039] Figure 1 It is a structural diagram of a PET / CT detection device in the prior art;

[0040] Figure 2 is an application scenario diagram of a detection device according to an optional embodiment of the present invention;

[0041] Figure 3is a structural diagram of a detection module according to an optional embodiment of the present invention;

[0042] Figure 4 is a structural diagram of a photoelectric conversion component according to an optional embodiment of the present invention;

[0043] Figure 5 for Figure 3 A top view of

[0044] Figure 6 for Figure 3 Bottom view of

[0045] Figure 7 is a structural diagram of a second optical signal generating unit according to an optional embodiment of the present invention;.

[0046] Figure 8 for Figure 7 Bottom view of

[0047] Fig. 9 is a structural diagram of a detection module according to another optional embodiment of the present invention;

[0048] Fig.10 is a structural diagram of a photoelectric conversion component according to another optional embodiment of the present invention;

[0049] Fig.11 This is a simulation diagram of the action depth (deposition depth in the crystal) of 140keV x-rays in the first crystal array;

[0050] Fig.12 A scatter plot of the rays received by the detection module.

[0051] Description of reference numerals:

[0052] 1-detection device, 11-detection module, 111-first optical signal generating part, 1111-first crystal pixel, 112-photoelectric conversion component, 1121-first photoelectric conversion part, 11211-first photoelectric conversion unit, 1122-circuit board, 11221-first sub-circuit board, 11222-second sub-circuit board, 11223-connector, 11224-first electrical signal processing chip, 1123-second photoelectric conversion part, 11231-second photoelectric conversion unit, 11232-first connecting part, 113-second optical signal generating part, 1131-second crystal pixel, 1132-conductive wire, 114-data processing part, 2-X-ray source, 3-scanning object, 4-carrying platform. DETAILED DESCRIPTION

[0053] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present invention. However, it is apparent to those skilled in the art that the present invention can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present invention, some technical features well known in the art are not described.

[0054] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should also be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of the features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0055] Now, exemplary embodiments according to the present invention will be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in a variety of different forms and should not be interpreted as being limited to the embodiments set forth herein. It should be understood that these embodiments are provided to make the disclosure of the present invention thorough and complete, and to fully convey the concept of these exemplary embodiments to those of ordinary skill in the art.

[0056] X-ray computed tomography (CT) technology uses X-ray beams to scan the cross section of the human body. The CT detection device receives the X-rays that pass through the human body. When X-rays pass through the human body, different tissues have different attenuation coefficients or absorption coefficients for X-rays. After computer reconstruction, a cross-sectional image of the human body is obtained.

[0057] The principle of positron emission tomography (PET) technology is that radioactive elements release positrons during decay, and positrons annihilate when encountering electrons, thereby generating a pair of photons with an energy of 511 KeV in the opposite direction, namely gamma rays. After the PET detection device detects the gamma rays, it can obtain the location where the positron and electron annihilation occurs after computer processing. Substances necessary for human metabolism are labeled with isotopes with a shorter half-life. After injection into the human body, the aggregation of the substance in the human body is detected to reflect the metabolic activity, thereby achieving the purpose of diagnosis. By observing the aggregation of metabolites, early cancer and other lesions can be discovered.

[0058] Positron Emission Tomography / Computedtomography (PET / CT) equipment is a combination of PET and CT. PET and CT are designed as one unit and controlled by one workstation. When performing nuclear medicine imaging with a single PET, it has advantages such as early detection and high sensitivity that other diagnostic equipment cannot match. However, due to the limitations of drugs and their principles, its positioning accuracy is not enough. PET and CT are designed as one unit. During scanning, PET imaging and CT imaging are performed simultaneously according to needs, and the two images are fused together to achieve better identification and positioning.

[0059] In order to facilitate understanding of the present application, the composite PET / CT device is first introduced, that is, the detection device provided with the detection device 1 of the present application, and the specific structure is as follows:

[0060] like Figure 2 As shown, the PET / CT device includes but is not limited to an X-ray source 2, a detection device 1, and a carrier 4. The detection device 1 is formed with an opening, and the carrier 4 is used to place a scan object 3 (patient) and can transport the scan object 3 into the detection device 1 through the opening.

[0061] The patient is injected with radioactive drugs before scanning. When scanning the patient, the detection device 1 can simultaneously detect the X-rays attenuated by the scanned object 3 and the gamma rays emitted by the radioactive drugs in the patient's body, and convert the X-rays and gamma rays into corresponding optical signals, and then convert the optical signals into electrical signals, and amplify, denoise and perform analog-to-digital conversion on the electrical signals. Therefore, the PET / CT device is more compact and reduces the cost compared with the device in which the PET detection device and the CT detection device are separately and independently set. And compared with the device in the prior art in which the PET detection device and the CT detection device are separately and independently set, the patient needs to be scanned by PET and CT, that is, the patient is scanned twice. The PET / CT device in this embodiment can detect X-rays and gamma rays by scanning the patient once, thereby reducing the number of scans, reducing the scanning time, and also reducing the radiation time of the patient. In addition, it also avoids the problem of reduced alignment between the CT image and the PET image due to the movement of the patient in the two scans.

[0062] like Figure 2 As shown, the detection device 1 includes a plurality of detection modules. The structure of the detection modules is now described in detail, and the structure of the detection device 1 will be introduced later.

[0063] like Figure 3 and 9As shown, the detection module 11 includes a first optical signal generating unit 111, a photoelectric conversion component 112 and a second optical signal generating unit 113 which are arranged in sequence, and the surface of the first optical signal generating unit 111 away from the photoelectric conversion component 112 is configured as an incident surface of X-rays and gamma rays; wherein the first optical signal generating unit 111 is used to convert X-rays and part of the gamma rays into a first optical signal; the second optical signal generating unit 113 is used to convert gamma rays into a second optical signal; the photoelectric conversion component 112 is used to convert the first optical signal into a first electrical signal, and the second optical signal is used to convert the second optical signal into a second electrical signal.

[0064] In a specific application, the first optical signal generating unit 111 , the photoelectric conversion component 112 and the second optical signal generating unit 113 form an elongated rectangular parallelepiped structure to facilitate the arrangement of the PET / CT detection module.

[0065] The working principle of this embodiment is as follows: the X-rays attenuated by the scanned object 3 and the gamma rays emitted by the radioactive drugs in the patient enter the first optical signal generating unit 111 through the incident surface of the first optical signal generating unit 111, the first optical signal generating unit 111 converts the X-rays and part of the gamma rays into a first optical signal, and then transmits the first optical signal to the photoelectric conversion component 112, the photoelectric conversion component 112 converts the first optical signal into a first electrical signal, and the gamma rays have higher energy, therefore, most of the gamma rays can pass through the first optical signal generating unit 111 and the photoelectric conversion component 112 to reach the second optical signal generating unit 113, the second optical signal generating unit 113 then converts the gamma rays into a second optical signal, and then transmits the second optical signal to the photoelectric conversion component 112, the photoelectric conversion component 112 converts the second optical signal into a second electrical signal, thereby realizing the simultaneous detection of X-rays and gamma rays.

[0066] Among them, a small part of the gamma rays will also be absorbed by the first optical signal generating unit 111 to form a first optical signal, and converted into a first electrical signal by the photoelectric conversion component 112. Then, the first electrical signal obtained by absorbing and converting the gamma rays by the first optical signal generating unit 111 will be identified through a subsequent electronic system or a host computer as an electrical signal of the gamma rays, and thus used as data for PET imaging.

[0067] In this embodiment, X-rays directly enter the first optical signal generating unit 111 from the incident surface of the X-ray signal generating unit without passing through the photoelectric conversion component 112, and no metal components are provided on the incident surface of the first optical signal generating unit 111, thereby avoiding the attenuation of the X-ray energy caused by the metal components, thereby improving the intensity of the generated corresponding optical signal, thereby improving the imaging quality, and reducing the probability of re-scanning the patient, which not only reduces the amount of radiation received by the patient, but also reduces the scanning time and improves the scanning efficiency; in addition, it also avoids the formation of serious artifacts in the reconstructed image, thereby improving the clarity of the reconstructed image.

[0068] Specifically, Figure 4 As shown, the photoelectric conversion component 112 includes a first photoelectric conversion unit 1121, a circuit board 1122 and a second photoelectric conversion unit 1123 which are arranged in sequence, and the circuit board 1122 is electrically connected to the second photoelectric conversion unit 1123 and the first photoelectric conversion unit 1121 respectively; the second photoelectric conversion unit 1123 is connected to the second optical signal generating unit 113, and the first photoelectric conversion unit 1121 is connected to the first optical signal generating unit 111.

[0069] Among them, the first photoelectric conversion unit 1121 is attached to one surface of the circuit board 1122, and the second photoelectric conversion unit 1123 is attached to the other surface of the circuit board 1122. The circuit board 1122 not only plays a role in transmitting the first electrical signal and the second electrical signal, but also plays a role in connecting the first photoelectric conversion unit 1121 and the second photoelectric conversion unit 1123, so that the first photoelectric conversion unit 1121, the circuit board 1122 and the second photoelectric conversion unit 1123 form a whole, so as to facilitate the assembly of the photoelectric conversion component 112 with other components.

[0070] The first photoelectric conversion unit 1121 is coupled to the first optical signal generating unit 111, so that the first optical signal can be transmitted to the first photoelectric conversion unit 1121 via the shortest transmission path to reduce the loss of the first optical signal. Similarly, the second photoelectric conversion unit 1123 is coupled to the second optical signal generating unit 113, so that the second optical signal can be transmitted to the second photoelectric conversion unit 1123 via the shortest path to reduce the loss of the second optical signal. In a specific application, the first optical signal generating unit 111 is attached to the first photoelectric conversion unit 1121 via an optical adhesive (e.g., an adhesive film, a liquid adhesive, or a coupling agent, etc.), and similarly, the second optical signal generating unit 113 is attached to the second photoelectric conversion unit 1123 via an optical adhesive (e.g., an adhesive film, a liquid adhesive, or a coupling agent, etc.).

[0071] As 4, Figure 6 and Fig.10As shown, the second photoelectric conversion part 1123 includes a plurality of second photoelectric conversion units 11231 arranged at intervals, and the signal transmission port of the circuit board 1122 is provided with a first connection part 11232 , and the first connection part 11232 passes through the gaps between the first photoelectric conversion units 11211 .

[0072] The first connection part 11232 can be a structure such as a solder ball, a solder pin, a ball solder gold wire or a metal lead. Of course, the first connection part 11232 can also adopt other structures that can transmit signals, and this application does not strictly limit it.

[0073] The second photoelectric conversion unit 11231 may use a silicon photomultiplier (SiPM), which has the advantages of high gain, high sensitivity, low bias voltage, insensitivity to magnetic fields, and compact structure. Of course, the second photoelectric conversion unit 11231 may also use other photoelectric conversion devices that can convert the light signal of the gamma ray into an electrical signal, and this application does not make strict limitations.

[0074] In this embodiment, the first connection part 11232 passes through the gap formed between each second photoelectric conversion unit 11231, so that the first connection part 11232 is routed inside the photoelectric conversion component 112. Compared with the prior art in which the wiring is routed from the outside of the photoelectric conversion part, the space occupied by the first connection part 11232 is reduced, making the structure more compact, and the external shape of the photoelectric conversion component 112 is not changed, and the external shape of the detection module 11 is not affected. Therefore, when the detection modules 11 are arranged, the detection modules can be arranged closely to avoid the situation in which the detection modules are not arranged closely due to external wiring, thereby reducing the detection sensitivity.

[0075] like Figure 3 , Figure 7 , Figure 8 and Fig. 9 As shown, the second optical signal generating unit 113 includes a second crystal array composed of a plurality of second crystal pixels 1131, and a first light reflecting unit is provided between two adjacent second crystal pixels 1131; the first light reflecting unit is provided with a corresponding signal transmission unit corresponding to the position of each first connecting unit 11232, and each first connecting unit 11232 is electrically connected to an end of the corresponding signal transmission unit close to the first connecting unit 11232.

[0076] The second crystal pixel 1131 may use a scintillation crystal. Specifically, the material of the scintillation crystal may be, but is not limited to, lutetium yttrium silicate (LYSO), gadolinium silicate (GSO), yttrium silicate (YSO), lutetium fine silicate (LFS), bismuth germanate (BGO), lutetium silicate (LSO), barium fluoride (BaF 2), cesium iodide (CsI), sodium iodide (NaI), lanthanum bromide (LaBr 3 ), garnet crystal or more. In a specific application, the thickness of the second crystal pixel 1131 is generally about 20 mm, and the longest does not exceed 50 mm.

[0077] The second crystal array is an array of p rows, q columns and s layers composed of a plurality of second crystal pixels 1131, wherein p, q and s are positive integers greater than or equal to 1, and their specific values ​​can be set by the staff according to actual needs, and are not strictly limited in this application. In the case of using a multi-layer second crystal array, the gamma ray depth of interaction (DOI) information can be more accurately obtained.

[0078] The first light emitting portion may be made of materials such as magnesium oxide, aluminum oxide, titanium dioxide and barium sulfate, and may also be made of an optical adhesive having good light transmission effect and a different refractive index from the second crystal pixel 1131, such as a film, a liquid adhesive or a coupling agent, or may be air.

[0079] When the second crystal pixel 1131 receives the gamma ray, the gamma photon hits the scintillation crystal to generate visible light, i.e., the second light signal. The first reflector can reflect the second light signal projected to the side wall in a second crystal pixel 1131 back into the second crystal pixel 1131, so that the second light signal will not pass through a second crystal pixel 1131 and then enter another second crystal pixel 1131 adjacent to the PET through the first light reflector, effectively avoiding the problem of parallax crosstalk signals caused by the second light signals of adjacent second crystal pixels 1131 interfering with each other, thereby reducing image noise and improving image quality.

[0080] In practical applications, the first light emitting unit uses materials such as magnesium oxide, aluminum oxide, titanium dioxide and barium sulfate, or uses an optical adhesive with good light transmittance and a refractive index different from that of the second crystal pixel 1131. This not only avoids crosstalk of the second light signal, but also enables the second crystal pixels 1131 to be bonded together to form a whole, thereby improving the stability of the structure of the second light signal generating unit 113.

[0081] The signal transmission part can be a conductive filament made of gold, silver, copper, tin or a fine alloy material with excellent conductive properties, or a conductive structure formed by a conductive material electroplated on the side wall of a PET crystal, or a conductive structure formed by a conductive glue applied to the side wall of a PET crystal. The first connection part 11232 and the end of the signal transmission part close to the first connection part 11232 can be connected by welding.

[0082] The signal transmission part is arranged in the first reflective part so that the transmission part is routed in the second optical signal generating part 113. Compared with the prior art in which the signal transmission line is routed from the outside of the second optical signal generating part 113, the space occupied by the signal transmission line is reduced, the structure is more compact, and the external shape of the second optical signal generating part 113 is not changed, and the external shape of the detection module 11 is not affected. When the detection module 11 is arranged, each detection module can be arranged closely to avoid the situation in which the detection module is not arranged closely due to the external routing, thereby reducing the detection sensitivity. In addition, the signal transmission part corresponds to the first connecting part 11232 one by one, which also facilitates the connection operation between the signal transmission part and the first connecting part 11232.

[0083] It is worth noting that when designing the position of the signal transmission part, the distance between two adjacent signal transmission parts must also be considered to ensure that there is a good spacing distance between the two adjacent signal transmission parts, thereby ensuring good electrical isolation.

[0084] In a specific application, the second photoelectric conversion unit 11231 and the second crystal pixel 1131 may adopt a variety of corresponding relationships, as follows:

[0085] The first correspondence: Figure 3 and Fig. 9 As shown, the number of the second photoelectric conversion units 11231 is the same as the number of the second crystal pixels 1131 and corresponds one to one.

[0086] Among them, the size of the end face of the second photoelectric conversion unit 11231 close to the second crystal pixel 1131 is the same as the size of the end face of the second crystal pixel 1131 close to the second photoelectric conversion unit 11231, thereby ensuring that the side wall surface of the second photoelectric conversion unit 11231 is flush with the side wall surface of the second crystal pixel 1131.

[0087] It can be understood that the one-to-one correspondence referred to here means that each second crystal pixel 1131 faces a second photoelectric conversion unit 11231, that is, the second photoelectric conversion unit 11231 can receive most of the second light signals output by the second crystal pixel 1131 facing it.

[0088] In this implementation, in the subsequent data processing process, the position of the second crystal pixel 1131 that emits the second light signal can be determined by the position of the second photoelectric conversion unit 11231, thereby improving the accuracy of positioning and avoiding the use of complex algorithms.

[0089] The second corresponding relationship: the number of second photoelectric conversion units 11231 and the number of second crystal pixels 1131 are set according to a first preset ratio, and the first preset number of second photoelectric conversion units 11231 and the second preset number of second crystal pixels 1131 are set correspondingly; wherein the ratio of the first preset number to the second preset number is the same as the first preset ratio, and the first preset ratio is less than 1.

[0090] In this implementation, the staff sets the first preset ratio so that the second photoelectric conversion unit 11231 and the second crystal pixel 1131 form a many-to-many or one-to-many correspondence relationship, thereby reducing the number of the second photoelectric conversion units 11231 and reducing costs. Exemplarily, the first preset ratio is 2 / 3, that is, every two second photoelectric conversion units 11231 correspond to every three second crystal pixels 1131, that is, every two second photoelectric conversion units 11231 receive the second light signal emitted by every three second crystal pixels 1131, so that when the position of the second crystal pixel 1131 emitting the second signal is determined later, it is necessary to determine the position of the second crystal pixel 1131 emitting the second signal based on the position of the second photoelectric conversion unit 11231 and the intensity of the received second light signal.

[0091] like Figure 4 , Figure 5 and Fig.10 As shown, the first photoelectric conversion unit 1121 includes a plurality of first photoelectric conversion units 11211 arranged at intervals, the first optical signal generation unit 111 includes a first crystal array composed of a plurality of first crystal pixels 1111 , and a second light reflecting unit is provided between two adjacent first crystal pixels 1111 .

[0092] The first photoelectric conversion unit 11211 may be a silicon photomultiplier (SiPM) or an avalanche photodiode (APD). Of course, the second photoelectric conversion unit 11231 may also be other photoelectric conversion devices that can convert the optical signal of the gamma ray into an electrical signal, which is not strictly limited in this application.

[0093] The first crystal pixel 1111 may use a scintillation crystal. Specifically, the material of the scintillation crystal may be, but is not limited to, lutetium yttrium silicate (LYSO), gadolinium silicate (GSO), yttrium silicate (YSO), lutetium fine silicate (LFS), bismuth germanate (BGO), lutetium silicate (LSO), barium fluoride (BaF 2 ), cesium iodide (CsI), sodium iodide (NaI), lanthanum bromide (LaBr 3), garnet crystal or more. In a specific application, the thickness of the first crystal pixel 1111 is generally about 20 mm, and the longest does not exceed 50 mm. In addition, the size of the cross section of the first crystal pixel 1111 can be as small as possible to meet the requirements of higher spatial resolution and accuracy of CT detection images, and the general cross-sectional size is 1 mm*1 mm.

[0094] The first crystal array is an array of p rows, q columns and s layers composed of a plurality of first crystal pixels 1111, wherein p, q and s are positive integers greater than or equal to 1, and their specific values ​​can be set by the staff according to actual needs, and are not strictly limited in this application. In the case of using a multi-layer first crystal array, the X-ray depth of interaction (DOI) information can be more accurately obtained.

[0095] It is understandable that the first crystal pixel 1111 and the second crystal pixel 1131 may be made of the same material or different materials, which is not limited here.

[0096] The first light emitting portion may be made of materials such as magnesium oxide, aluminum oxide, titanium dioxide and barium sulfate, and may also be made of an optical adhesive having good light transmission effect and a different refractive index from the first crystal pixel 1111, such as a film, a liquid adhesive or a coupling agent, or may be air.

[0097] When the first crystal pixel 1111 receives X-rays, X-ray photons and some gamma photons hit the scintillating crystal to generate visible light, i.e., the first light signal. The second reflector can reflect the second light signal projected to the side wall in a first crystal pixel 1111 back into the first crystal pixel 1111, so that the second light signal will not pass through a first crystal pixel 1111 and then enter another first crystal pixel 1131 adjacent to the CT through the first light reflector, effectively avoiding the problem of parallax crosstalk signals caused by mutual interference between the first light signals of adjacent first crystal pixels 1111, thereby reducing image noise and improving image quality.

[0098] In practical applications, the second emitting unit uses materials such as magnesium oxide, aluminum oxide, titanium dioxide and barium sulfate, or uses an optical adhesive with good light transmittance and a refractive index different from that of the first crystal pixel 1111. This not only avoids crosstalk from the second optical signal, but also enables the first crystal pixels 1131 to be bonded together to form a whole, thereby improving the stability of the structure of the first optical signal generating unit 111.

[0099] In a specific application, the first photoelectric conversion unit 11211 and the first crystal pixel 1111 may adopt a correspondence relationship in various forms, as follows:

[0100] The first correspondence: Figure 3 and Fig. 9 As shown, the number of the first photoelectric conversion units 11211 is the same as the number of the first crystal pixels 1111 and corresponds one to one.

[0101] Among them, the size of the end face of the first photoelectric conversion unit 11211 close to the first crystal pixel 1111 is the same as the size of the end face of the first crystal pixel 1111 close to the first photoelectric conversion unit 11211, thereby ensuring that the side wall surface of the first photoelectric conversion unit 11211 is flush with the side wall surface of the first crystal pixel 1111.

[0102] It can be understood that the one-to-one correspondence referred to here means that each first crystal pixel 1111 is facing a first photoelectric conversion unit 11211, that is, the first photoelectric conversion unit 11211 can receive most of the first light signals output by the first crystal pixel 1111 facing it.

[0103] In this implementation, in the subsequent data processing process, the position of the first crystal pixel 1111 that emits the first light signal can be determined by the position of the first photoelectric conversion unit 11211, thereby improving the accuracy of positioning and avoiding the use of complex algorithms.

[0104] The second corresponding relationship: the number of first photoelectric conversion units 11211 and the number of first crystal pixels 1111 are set according to a second preset ratio, and the third preset number of first photoelectric conversion units 11211 and the fourth preset number of first crystal pixels 1111 are set correspondingly; wherein the ratio of the third preset number to the fourth preset number is the same as the second preset ratio, and the second preset ratio is less than 1.

[0105] In this implementation, the staff sets the second preset ratio so that the first photoelectric conversion unit 11211 and the first crystal pixel 1111 form a many-to-many or one-to-many correspondence relationship, thereby reducing the number of the first photoelectric conversion units 11211 and reducing costs. Exemplarily, the second preset ratio is 2 / 3, that is, every two first photoelectric conversion units 11211 correspond to every three first crystal pixels 1111, that is, every two first photoelectric conversion units 11211 receive the first light signal emitted by every three first crystal pixels 1111, so that when the position of the first crystal pixel 1111 that emits the second signal is determined later, it is necessary to determine the position of the first crystal pixel 1111 that emits the second signal based on the position of the first photoelectric conversion unit 11211 and the intensity of the received first light signal.

[0106] like Figure 3 and Fig. 9As shown, the detection module 11 also includes a data processing unit 114 for processing the first electrical signal and the second electrical signal; the data processing unit 114 is arranged on the surface of the second optical signal generating unit 113 away from the photoelectric conversion component 112, and one end of each signal transmission unit away from the first connecting unit 11232 is electrically connected to the data processing unit 114.

[0107] The data processing unit 114 may also adopt a PCB board, on which a processor and related peripheral circuits are arranged. The processor is used to receive the first electrical signal and the second electrical signal transmitted by the first connecting part 11232 and the signal transmission, and then amplify, denoise and perform analog-to-digital conversion on the first electrical signal and the second electrical signal to facilitate subsequent analysis of the processed signal and improve the accuracy of the analysis.

[0108] The first end of the signal transmission part away from the first connection part 11232 is soldered to the data processing part 114, such as by a reflow soldering process. It is worth noting that the soldering temperature between the signal transmission part and the first connection part 11232 is greater than the soldering temperature between the signal transmission part and the data processing part 114, thereby improving the connection stability between the signal transmission part and the first connection part 11232, so as to avoid the temperature when soldering the signal transmission part and the data processing part 114 causing the soldering of the first connection part 11232 of the signal transmission part to melt, resulting in the separation of the photoelectric conversion component 112 and the second optical signal generating part 113.

[0109] Furthermore, gluing and potting are performed between the second photoelectric conversion unit 1123 and the data processing unit 114 , thereby improving the stability of the connection between the second optical signal generation unit 113 and the data processing unit 114 .

[0110] like Figure 7 As shown, the signal transmission portion is a conductive wire 1132 , and both ends of each conductive wire 1132 extend to the outside of the second crystal array.

[0111] The conductive wire 1132 can be made of a metal material with good conductivity, such as gold, silver, copper, etc. Both ends of the conductive wire 1132 extend to the outside of the second crystal array to facilitate welding with the first connecting portion 11232 and the data processing portion 114 .

[0112] like Fig. 9 and Fig.10As shown, the circuit board 1122 includes a first sub-circuit board 11221 and a second sub-circuit board 11222; the first sub-circuit board 11221 is electrically connected to the first photoelectric conversion unit 1121, and the second sub-circuit board 11222 is electrically connected to the second photoelectric conversion unit 1123; the first sub-circuit board 11221 and the second sub-circuit board 11222 are integrally formed, or a second connecting portion is provided between the first sub-circuit board 11221 and the second sub-circuit board 11222, and the first sub-circuit board 11221 is connected to the second sub-circuit board 11222 via the second connecting portion.

[0113] The first sub-circuit board 11221 and the second sub-circuit board 11222 can adopt a PCB circuit board 1122. The first sub-circuit board 11221 and the second sub-circuit board 11222 can be connected in two ways, one of which is that the first sub-circuit board 11221 and the second sub-circuit board 11222 are integrally formed, that is, a double-sided PCB board is formed, so that the first sub-circuit board 11221 and the second sub-circuit board 11222 do not need to be assembled, simplifying the manufacturing process. The other is that the first sub-circuit board 11221 and the second sub-circuit board 11222 are connected through a second connecting portion, wherein the second connecting portion includes but is not limited to adhesive, connector 11223, etc.

[0114] In some possible implementations, the second connecting portion is a plurality of connectors 11223, one end of each connector 11223 is connected to the first circuit board 1122, and the other end is connected to the second circuit board 1122; a gap is provided between the first circuit board 1122 and the second circuit board 1122, and a first electrical signal processing chip 11224 is provided on the surface of the first circuit board 1122 close to the second circuit board 1122.

[0115] The gap between the first circuit board 1122 and the second circuit board 1122 can be used as space for the additional first electrical signal processing chip 11224. The CT processor chip can perform analog-to-digital conversion on the first electrical signal to obtain a corresponding digital signal. The digital signal can be encoded or compressed and can be transmitted in parallel or serially. This can reduce the number of signal channels, that is, reduce the number of first connecting parts 11232, and correspondingly reduce the number of signal transmission parts, thereby simplifying the layout and production difficulty of the wiring.

[0116] Likewise, a second electrical signal processing chip is disposed on a surface of the second circuit board 1122 that is close to the first circuit board 1122 .

[0117] The gap between the first circuit board 1122 and the second circuit board 1122 can also be used as space for an additional second electrical signal processing chip. The PET processor chip can perform analog-to-digital conversion on the second electrical signal to obtain a corresponding digital signal. The digital signal can be encoded or compressed and can be transmitted in parallel or serially. This can reduce the number of signal channels, that is, further reduce the number of first connecting parts 11232, and accordingly, further reduce the number of signal transmission parts, thereby further simplifying the wiring layout and production difficulty.

[0118] In specific applications, the detection module 11 of the present application can not only perform PET and CT detection simultaneously, but also perform CT detection alone or PET detection alone.

[0119] When CT detection is performed alone, that is, when the incident surface of the first optical signal generating unit 111 receives only X-rays, the first photoelectric converter 1121 starts working and the second photoelectric converter 1123 stops working, thereby reducing the power consumption of the detection module and saving energy.

[0120] When PET detection is performed alone or PET and CT detection are performed simultaneously, that is, when the incident surface of the first optical signal generating unit 111 receives gamma rays, the first photoelectric conversion unit 1121 and the second photoelectric conversion unit 1123 start working at the same time. In other words, as long as gamma rays are received at the incident surface of the first optical signal generating unit 111, the first photoelectric conversion unit 1121 and the second photoelectric conversion unit 1123 start working at the same time.

[0121] When PET and CT detection are performed simultaneously, the first photoelectric conversion unit 1121 processes the first light signal, and the PET photoelectric conversion unit processes the second light signal. When PET detection is performed alone, in addition to using the second light signal generating unit 113 and the second photoelectric conversion unit 1123 to detect gamma rays, the CT photoelectric generating unit and the first photoelectric conversion unit 1121 can still be identified as PET events through the ratio of light splitting, thereby improving the utilization rate of the detection module 11.

[0122] In some embodiments, the first crystal array uses LYSO crystals with a cross-sectional size of 1mm*1mm and a thickness of 5mm to form a single-layer crystal array of 15 rows and 15 columns. Correspondingly, the CT optical conversion part uses SiPM with a cross-sectional area of ​​1mm*1mm to form an array of 15 rows and 15 columns. The second crystal array uses LYSO crystals with a cross-sectional area of ​​4mm*4mm and a thickness of 20mm to form an array of 4 rows and 4 columns. Correspondingly, the PET optical conversion part uses SiPM with a cross-sectional area of ​​1mm*1mm to form an array of 4 rows and 4 columns. The first reflective part and the second reflective cloth both use barium sulfate as the reflective material and electrical insulating medium. Then, 140keV (simulating CT x-rays) and 511keV (simulating PET gamma rays) rays are incident vertically respectively. From Fig.11 According to the simulation results of the action depth of 140keV rays in the first crystal array (deposition depth in the crystal), 5mm thick LYSO can intercept almost all 140keV rays and achieve CT detection function.

[0123] Fig.12 is a scatter diagram of the radiation received by the detection module 11, wherein the left side is the gamma-ray response diagram of the first crystal array, and the right side is the gamma-ray response diagram of the second crystal array. Fig.12 The gamma response of each crystal pixel can be obtained. For PET detection, not only can the gamma rays be obtained, but also it can be known whether the gamma rays are received by the first crystal array or the second crystal array, thereby obtaining the action depth information of the gamma rays.

[0124] It can be understood that the photoelectric conversion component 112 in the above embodiment can be a PET / CT photoelectric conversion component; the first optical signal generating unit 111 can be a CT photoelectric conversion unit, the first photoelectric conversion unit 11211 can be a CT photoelectric conversion unit, the first crystal pixel 1111 can be a CT crystal pixel, and the first crystal array is a CT crystal array; the second optical signal generating unit 113 can be a PET photoelectric conversion unit, the second photoelectric conversion unit 11231 can be a PET photoelectric conversion unit, the second crystal pixel 1131 can be a PET crystal pixel, and the second crystal array is a PET crystal array.

[0125] In summary, the detection module 11 completes the detection work in the same structure and satisfies the CT and PET application scenarios respectively.

[0126] On the other hand, Figure 2 As shown, an embodiment of the present invention provides a detection device 1, comprising a plurality of detection modules 11 of any of the above solutions, wherein the detection modules 11 form a ring structure with a hollow middle portion.

[0127] The hollowed-out area in the middle is the area that the support platform 4 can enter. After the support platform 4 carries the patient into the hollowed-out area of ​​the hollow part, the patient is irradiated by the X-ray source 2, and then the detection module 11 is used to perform PET and / or CT detection. The specific detection principle can be adopted by referring to the above embodiment, which will not be repeated here.

[0128] In some preferred implementations, such as Figure 2 As shown, the detection device 1 further includes an X-ray source 2, which is located in the annular structure. The X-rays emitted by the X-ray source 2 can completely cover the scanning area in the middle of the annular structure.

[0129] In a specific application, in order to completely cover the scanning area in the middle of the annular structure, a plurality of X-ray sources 2 are usually used and evenly distributed on the circumference of the annular structure. For example, the number of X-ray sources 2 is three and evenly distributed on the circumference of the annular structure.

[0130] Compared with the prior art in which one X-ray source 2 is rotated to irradiate the scanning area to achieve full coverage of the scanning area, in this implementation, there is no need to rotate the X-ray source 2, which simplifies the detection operation and facilitates use.

[0131] Furthermore, the X-ray source 2 includes a cold cathode X-ray tube made of carbon nanotubes.

[0132] Specifically, the cold cathode X-ray tube can be inserted between the detection modules 11, so that the structure of the detection device 1 is more compact.

[0133] In this embodiment, the cold cathode X-ray tube made of carbon nanotubes has small size, low power consumption, can be formed into an array, and does not require a large peripheral high voltage and heat dissipation auxiliary system. The cold cathode X-ray tube can integrate multiple cathode emission electron beams to form a regional fan-shaped X-ray beam, and through switch control, the beam is controlled to be emitted at different angles to meet different irradiation requirements.

[0134] The present invention has been described by the above embodiments, but it should be understood that the above embodiments are only for the purpose of example and description, and are not intended to limit the present invention to the described embodiments. In addition, it can be understood by those skilled in the art that the present invention is not limited to the above embodiments, and more variations and modifications can be made according to the teachings of the present invention, and these variations and modifications all fall within the scope of the protection claimed by the present invention. The protection scope of the present invention is defined by the attached claims and their equivalents.

Claims

1. A detection module, characterized in that: It includes a first optical signal generating unit, a photoelectric conversion component and a second optical signal generating unit which are arranged in sequence, wherein a surface of the first optical signal generating unit away from the photoelectric conversion component is configured as an incident surface of X-rays and gamma-rays; Wherein, the first optical signal generating unit is used to convert the X-rays and part of the gamma rays into a first optical signal; The second optical signal generating unit is used to convert the gamma ray into a second optical signal; The optoelectronic conversion component is used to convert the first optical signal into a first electrical signal, and convert the second optical signal into a second electrical signal; Wherein, the photoelectric conversion component comprises a first photoelectric conversion unit, a circuit board and a second photoelectric conversion unit which are arranged in sequence, and the circuit board is electrically connected to the second photoelectric conversion unit and the first photoelectric conversion unit respectively; The second photoelectric conversion unit is connected to the second optical signal generating unit, and the first photoelectric conversion unit is connected to the first optical signal generating unit.

2. The detection module according to claim 1, characterized in that: The second photoelectric conversion part includes a plurality of second photoelectric conversion units arranged at intervals, the first photoelectric conversion part includes a plurality of first photoelectric conversion units arranged at intervals, and the signal transmission port of the circuit board is provided with a first connecting part, and the first connecting part passes through the gaps between the first photoelectric conversion units.

3. The detection module according to claim 2, characterized in that: The second optical signal generating unit includes a second crystal array composed of a plurality of second crystal pixels, and a first light reflecting unit is disposed between two adjacent second crystal pixels; The first light reflecting portion is provided with a corresponding signal transmission portion at a position corresponding to each first connecting portion, and each first connecting portion is electrically connected to an end of the corresponding signal transmission portion close to the first connecting portion.

4. The detection module according to claim 3, characterized in that: The number of the second photoelectric conversion units is the same as the number of the second crystal pixels and corresponds one to one.

5. The detection module according to claim 3, characterized in that: The number of the second photoelectric conversion units and the number of the second crystal pixels are set according to a first preset ratio, and the first preset number of second photoelectric conversion units and the second preset number of second crystal pixels are set correspondingly; The ratio of the first preset number to the second preset number is the same as the first preset ratio, and the first preset ratio is less than 1.

6. The detection module according to claim 3, characterized in that: The detection module further includes a data processing unit for processing the first electrical signal and the second electrical signal; The data processing unit is disposed on a surface of the second optical signal generating unit that is away from the photoelectric conversion component, and one end of each of the signal transmission units that is away from the first connecting unit is electrically connected to the data processing unit.

7. The detection module according to claim 6, characterized in that: The signal transmission part is a conductive wire, and both ends of each of the conductive wires extend to the outside of the second crystal array.

8. The detection module according to claim 1, characterized in that: The first photoelectric conversion section includes a plurality of first photoelectric conversion units arranged at intervals, the first optical signal generation section includes a first crystal array composed of a plurality of first crystal pixels, and a second light reflecting section is provided between two adjacent first crystal pixels.

9. The detection module according to claim 8, characterized in that: The number of the first photoelectric conversion units is the same as the number of the first crystal pixels and corresponds one to one.

10. The detection module according to claim 8, characterized in that: The number of the first photoelectric conversion units and the number of the first crystal pixels are set according to a second preset ratio, and the third preset number of first photoelectric conversion units and the fourth preset number of first crystal pixels are set correspondingly; The ratio of the third preset number to the fourth preset number is the same as the second preset ratio, and the second preset ratio is less than 1.

11. The detection module according to claim 1, characterized in that: The circuit board includes a first sub-circuit board and a second sub-circuit board; The first sub-circuit board is electrically connected to the first photoelectric conversion unit, and the second sub-circuit board is electrically connected to the second photoelectric conversion unit; The first sub-circuit board and the second sub-circuit board are integrally formed, or a second connecting portion is provided between the first sub-circuit board and the second sub-circuit board, and the first sub-circuit board is connected to the second sub-circuit board through the second connecting portion.

12. The detection module according to claim 11, characterized in that: The second connection part is a plurality of connectors, one end of each connector is connected to the first sub-circuit board, and the other end is connected to the second sub-circuit board; A gap is provided between the first circuit sub-boards and the second sub-circuit board, and a first electrical signal processing chip is provided on a surface of the first sub-circuit board close to the second sub-circuit board.

13. The detection module according to claim 12, characterized in that: A second electrical signal processing chip is disposed on a surface of the second sub-circuit board close to the first sub-circuit board.

14. The detection module according to claim 1, characterized in that: When the incident surface of the first optical signal generating unit receives only X-rays, the first photoelectric converter starts operating and the second photoelectric converter stops operating.

15. The detection module according to claim 14, characterized in that: When the incident surface of the first optical signal generating unit receives gamma rays, the first photoelectric conversion unit and the second photoelectric conversion unit start operating simultaneously.

16. A detection device, characterized in that: It comprises a plurality of detection modules according to any one of claims 1 to 15, wherein the detection modules are formed into a ring structure with a hollow middle portion.

17. The detection device according to claim 16, characterized in that: The detection device also includes an X-ray source, which is located in the annular structure. The X-rays emitted by the X-ray source can completely cover the scanning area in the middle of the annular structure.

18. The detection device according to claim 17, characterized in that: The X-ray source includes a cold cathode X-ray tube made of carbon nanotubes.

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