processing device

Abstract

The present invention provides a processing device that suppresses adverse effects of processing chips generated in one processing on another processing. When a wafer (100) is processed by a grinding tool (98), a first partition plate (11) and a second partition plate (12) divide a processing chamber (20) into upper and lower sides in a manner that surrounds the grinding tool (98) through a first semicircular recess (111) and a second semicircular recess (121). Therefore, it is possible to protect a polishing pad (93) on the upper side of the processing chamber (20) from the effects of processing chips generated by the leading end of the grinding tool (98) processing the wafer (100) on the lower side of the processing chamber (20). Thus, it is possible to suppress the attachment of processing chips to the polishing pad (93). Therefore, it is possible to suppress scratches on the back surface (102) of the wafer (100) processed by the polishing processing of the polishing pad (93).

Description

Technical Field

[0001] This invention relates to a processing apparatus. Background Technology

[0002] In TSV wafers having through-silicon vias (TSVs) as through electrodes, the back side is planarized by grinding and CMP (chemical mechanical polishing), and the through electrodes exposed on the front side are planarized by CMP. In recent years, the wiring of the through electrodes has been replaced by copper wiring instead of aluminum wiring, thus the through electrodes are planarized by tool-based rotary cutting and CMP. Therefore, as disclosed in Patent Document 1, a processing unit using a single processing apparatus can perform tool-based rotary cutting and CMP, thereby miniaturizing the apparatus and improving productivity.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2016-92281

[0004] In the apparatus described in Patent Document 1, rotary cutting and CMP are performed in the same processing chamber. Therefore, the rotary cutting chips adhere to the lower surface of the polishing pad, and the polished surface of the wafer may be scratched during CMP.

[0005] In addition, when the processing unit is capable of performing grinding and CMP, grinding chips from grinding adhere to the lower surface of the polishing pad, and the polished surface of the wafer may also be scratched during CMP. Summary of the Invention

[0006] Therefore, the object of the present invention is to suppress the adverse effects of machining chips generated during one machining process on another subsequent machining process.

[0007] The processing apparatus of the present invention (the processing apparatus) comprises: a chuck stage that holds a wafer by means of a holding surface; a processing unit having a processing tool for processing the wafer held by the chuck stage; a processing feed unit that feeds the processing unit in a direction perpendicular to the holding surface; and a processing chamber that houses the chuck stage and the processing tool, wherein the processing unit comprises: a first mounting base whose upper surface is connected to the lower end of a spindle extending in the perpendicular direction, and a first processing tool mounted on the lower surface of the first mounting base; and a second mounting base having a larger size than the first... The first mounting base has a larger outer diameter and an inner diameter that is concentric with the first mounting base. A second processing fixture is mounted on the lower surface of the second mounting base. A selection unit moves the first and second mounting bases relative to each other in a vertical direction, thereby selectively bringing either the first or second processing fixture closer to the holding surface. The processing chamber has a separation mechanism that, when the selection unit brings the first processing fixture closer to the holding surface than the second processing fixture and processes the wafer held on the holding surface using the first processing fixture, surrounds the first processing fixture... The work chamber is divided into upper and lower sections to protect the second processing fixture from processing debris generated by the first processing fixture during wafer processing. The dividing mechanism includes: a first dividing plate extending horizontally and having a first semi-circular recess along the outer surface of the first processing fixture; a second dividing plate extending horizontally and having a second semi-circular recess along the outer surface of the first processing fixture and opposite the first semi-circular recess; a first horizontal moving mechanism for moving the first dividing plate horizontally; and a second horizontal moving mechanism for moving the second dividing plate horizontally, allowing the second processing fixture to process the wafer. When the wafer held by the holding surface is processed, the first partition plate and the second partition plate are moved away from the spindle in the horizontal direction, so that the second processing tool can pass between the first semicircular recess and the second semicircular recess. When the wafer held by the holding surface is processed by the first processing tool, the first partition plate and the second partition plate are moved closer to the spindle in the horizontal direction. The second processing tool is protected from the processing chips generated by the first processing tool when the wafer is processed by the first processing tool by the circle formed by connecting the first semicircular recess and the second semicircular recess around the first processing tool.

[0008] In this processing apparatus, the first processing tool can be a rotary cutting tool or a grinding wheel, and the second processing tool can be a grinding pad.

[0009] In this processing apparatus, the first partition plate and the second partition plate may also have water spray outlets that spray water toward the first processing tool.

[0010] In this processing apparatus, when a wafer is processed by the first processing fixture, the first partition plate and the second partition plate divide the processing chamber vertically by surrounding the first processing fixture with the first semi-circular recess and the second semi-circular recess, respectively. Therefore, the second processing fixture, located on the upper side of the processing chamber, can be protected from processing debris generated by the front end of the first processing fixture, located on the lower side of the processing chamber, during wafer processing. This prevents processing debris from adhering to the second processing fixture. Consequently, it prevents the processed surface of the wafer processed by the second processing fixture from being scratched by processing debris. Attached Figure Description

[0011] Figure 1 It is a cross-sectional view showing the structure of the processing device.

[0012] Figure 2 It is a cross-sectional view showing the structure of the processing device.

[0013] Figure 3 This is an explanatory diagram showing the interconnected first and second partition plates.

[0014] Figure 4 It is a cross-sectional view showing the structure of the processing device.

[0015] Figure 5 This is an explanatory diagram showing the first and second partition plates that are far apart from each other.

[0016] Figure 6 This is an explanatory diagram showing the first and second partition plates with water jet outlets.

[0017] Label Explanation

[0018] 1: Processing device; 3: Column; 5: Control unit; 100: Wafer; 101: Front side; 102: Back side; 103: Protective belt; 10: Separating mechanism; 11: First separating plate; 12: Second separating plate; 111: First semi-circular recess; 121: Second semi-circular recess; 13: First horizontal moving mechanism; 14: Second horizontal moving mechanism; 16: Water jet outlet; 20: Processing chamber; 21: Top plate; 22: Side plate; 23: Front plate; 24: Rear plate; 211: Processing tool inlet hole; 30: Holding unit; 31: Chuck worktable; 32: Holding surface; 36: Frame; 33: Support component; 34: Rotating unit; 35: Support column; 37: Cover plate; 39: 60: Air supply source; 40: Y-axis movement unit; 50: Machining feed unit; 70: Machining unit; 71: Spindle unit; 72: Spindle; 73: Spindle motor; 74: Housing; 721: First shaft section; 722: Thrust plate; 723: Second shaft section; 724: Large diameter cylindrical section; 725: Small diameter cylindrical section; 80: Advance / Retreat mechanism; 81: Storage chamber; 82: Piston; 83: Piston rod; 84: Guide section; 85: Regulator; 86: Air source; 90: Annular plate; 91: Annular mounting base; 92: Pressure plate; 93: Grinding pad; 95: Circular plate mounting base; 96: Grinding wheel; 97: Grinding wheel base; 98: Grinding tool. Detailed Implementation

[0019] like Figure 1 As shown, the processing apparatus 1 of this embodiment is an apparatus for grinding and polishing a wafer 100, which is a workpiece, and has a control unit 5 for controlling each component of the processing apparatus 1.

[0020] The wafer 100 is, for example, a circular semiconductor wafer. The front side 101 of the wafer 100 holds multiple devices and is protected by a protective tape 103. The back side 102 of the wafer 100 serves as the surface to be processed, where grinding and polishing processes are performed.

[0021] The processing apparatus 1 has a holding unit 30 for holding the workpiece. The holding unit 30 includes a chuck table 31, a support member 33 for supporting the chuck table 31, and a rotating unit 34 for rotating the chuck table 31.

[0022] The chuck stage 31 has a holding surface 32 for holding the wafer 100 and a frame 36 surrounding the holding surface 32. In this embodiment, the upper surface of the frame 36 is formed to be substantially the same plane as the holding surface 32 and has the same height as the holding surface 32.

[0023] The holding surface 32 of the chuck stage 31 is made of, for example, a porous material and is in communication with an attraction source (not shown), thereby attracting and holding the wafer 100 through the protective strip 103. That is, the chuck stage 31 holds the wafer 100 through the holding surface 32.

[0024] Furthermore, the chuck stage 31 can rotate around a central axis extending in the Z-axis direction through the center of the holding surface 32 while the wafer 100 is held by the holding surface 32 via the rotating unit 34 located below. Therefore, the wafer 100 is held by the holding surface 32 and rotates around the center of the holding surface 32.

[0025] A cover plate 37 is provided around the support member 33. Furthermore, a pleated cover (not shown) that extends and retracts in the Y-axis direction is connected to the +Y and -Y sides of the cover plate 37. A Y-axis direction moving unit 40 is provided below the holding unit 30. The Y-axis direction moving unit 40 moves the holding unit 30 along the Y-axis direction.

[0026] The Y-axis moving unit 40 moves the holding unit 30 and the processing unit 70 relative to each other in the Y-axis direction, which is parallel to the holding surface 32. In this embodiment, the Y-axis moving unit 40 is configured to move the holding unit 30 relative to the processing unit 70 in the Y-axis direction.

[0027] Alternatively, the processing device 1 may replace the Y-axis direction moving unit 40 with a turntable as a horizontal moving unit, which has multiple holding units 30.

[0028] The Y-axis moving unit 40 includes: a Y-axis guide rail 42 parallel to the Y-axis direction; a Y-axis moving worktable 45 sliding on the Y-axis guide rail 42; a Y-axis ball screw 43 parallel to the Y-axis guide rail 42; a Y-axis motor 44 connected to the Y-axis ball screw 43; and a holding table 41 for holding them.

[0029] The Y-axis moving table 45 is slidably mounted on the Y-axis guide rail 42 by means of a sliding member 451. A nut portion 401 is fixed on the lower surface of the Y-axis moving table 45. A Y-axis ball screw 43 is screwed into the nut portion 401. A Y-axis motor 44 is connected to one end of the Y-axis ball screw 43.

[0030] In the Y-axis moving unit 40, the Y-axis motor 44 rotates the Y-axis ball screw 43, thereby moving the Y-axis moving table 45 along the Y-axis guide rail 42 in the Y-axis direction. A support member 33 for the holding unit 30 is mounted on the Y-axis moving table 45 via a support column 35. Therefore, as the Y-axis moving table 45 moves in the Y-axis direction, the holding unit 30, including the chuck table 31, moves in the Y-axis direction.

[0031] In this embodiment, the holding unit 30 moves along the Y-axis between the machining position at the rear (+Y direction side) and the loading / unloading position at the front (-Y direction side) via the Y-axis moving unit 40.

[0032] In addition, such as Figure 1 As shown, a pillar 3 is erected behind the holding unit 30 (on the +Y direction side). A processing unit 70 for processing the wafer 100 and a processing feed unit 50 are provided on the front surface of the pillar 3.

[0033] The machining feed unit 50 is a vertical moving unit that performs machining feed relative to the holding unit 30 and the machining unit 70 in the Z-axis direction (machining feed direction) perpendicular to the holding surface 32. In this embodiment, the machining feed unit 50 is configured to perform machining feed relative to the holding unit 30 in the Z-axis direction perpendicular to the holding surface 32.

[0034] The machining feed unit 50 includes: a Z-axis guide rail 51 parallel to the Z-axis direction; a Z-axis moving table 53 sliding on the Z-axis guide rail 51; a Z-axis ball screw 52 parallel to the Z-axis guide rail 51; a Z-axis motor 54; a Z-axis encoder 55 for detecting the rotation angle of the Z-axis motor 54; a storage unit 57 for storing the detection results of the Z-axis encoder 55; and a support 56 mounted on the front surface (front side) of the Z-axis moving table 53. The support 56 holds the machining unit 70.

[0035] The Z-axis moving table 53 is slidably mounted on the Z-axis guide rail 51 by means of a sliding member 531. A nut portion 501 is fixed to the rear surface (back side) of the Z-axis moving table 53. A Z-axis ball screw 52 is screwed into the nut portion 501. The Z-axis motor 54 is connected to one end of the Z-axis ball screw 52.

[0036] In the machining feed unit 50, the Z-axis motor 54 rotates the Z-axis ball screw 52, ​​thereby moving the Z-axis moving table 53 along the Z-axis guide rail 51 in the Z-axis direction. As a result, the support 56 mounted on the Z-axis moving table 53 and the machining unit 70 held by the support 56 also move together with the Z-axis moving table 53 in the Z-axis direction.

[0037] The machining unit 70 has a spindle unit 71. The spindle unit 71 has: a spindle 72 extending in a direction perpendicular to the holding surface 32; a spindle motor 73 that rotates the spindle 72; and a housing 74 surrounding the spindle 72 and the spindle motor 73.

[0038] The main shaft 72 has a first shaft portion 721 and a second shaft portion 723 with a larger diameter than the first shaft portion 721. A thrust plate 722 is disposed between the first shaft portion 721 and the second shaft portion 723. The main shaft 72 also has a cylindrical large-diameter portion 724 formed below the second shaft portion 723 and a cylindrical small-diameter portion 725 formed below the cylindrical large-diameter portion 724.

[0039] An airflow path 60 is formed inside the housing 74. The airflow path 60 is connected to the air supply source 39. In addition, the airflow path 60 branches into multiple branch paths inside the housing 74. The airflow path 60 communicates with the openings on the upper surface 61, side surface 62 and lower surface 63 of the housing 74.

[0040] Air supplied from air source 39 is ejected from the openings on the upper surface 61, side surface 62 and lower surface 63 of housing 74 through air flow path 60 of housing 74 to the outside of housing 74.

[0041] Air is ejected from the upper surface 61, side surface 62, and lower surface 63 of the housing 74, thereby forming gaps between the housing 74 and the thrust plate 722 of the main shaft 72, between the housing 74 and the second shaft portion 723 of the main shaft 72, and between the housing 74 and the large-diameter cylindrical portion 724 of the main shaft 72. Bearings are thus formed in these gaps to support the main shaft 72 in a non-contact manner, enabling it to rotate.

[0042] The lower end of the small-diameter cylindrical portion 725, which serves as the lower end of the main shaft 72, is connected to the upper surface of the circular plate mounting base 95, which is the first mounting base. In addition, a guide portion 84 is provided between the lower surface of the large-diameter cylindrical portion 724 of the main shaft 72 and the circular plate mounting base 95 to connect the two.

[0043] A grinding wheel 96 is mounted on the lower surface of the circular plate mounting base 95. The grinding wheel 96 has a grinding wheel base 97 and a plurality of generally cuboid grinding tools 98 arranged in a ring at the lower end of the grinding wheel base 97.

[0044] The grinding wheel 98 can be rotated by the spindle motor 73 via the spindle 72, the circular plate mounting base 95 and the grinding wheel base 97.

[0045] Furthermore, a forward / reverse mechanism 80 is provided in the large-diameter cylindrical portion 724 and the small-diameter cylindrical portion 725 of the main shaft 72. The forward / reverse mechanism 80 has a receiving chamber 81 provided in the large-diameter cylindrical portion 724 of the main shaft 72. A piston 82 is housed in the receiving chamber 81.

[0046] Multiple piston rods 83 are connected to the lower part of the piston 82. The multiple piston rods 83 are arranged at equal intervals around the piston 82. Furthermore, in... Figure 1 In the image, only one piston rod 83 is shown.

[0047] An annular plate 90 is connected to the lower end of the piston rod 83. In addition, a through hole 901 is formed on the annular plate 90 for the aforementioned guide portion 84 to pass through.

[0048] An annular mounting base 91, serving as a second mounting base, is connected to the lower surface of the annular plate 90. An annular grinding pad 93, serving as a second processing tool for grinding the workpiece, is mounted on the lower surface of the annular mounting base 91 by means of a pressure plate 92.

[0049] The annular mounting base 91, pressure plate 92 and grinding pad 93 have an inner diameter larger than the outer diameter of the circular mounting base 95 and the grinding wheel 96, forming an annular shape concentric with the circular mounting base 95.

[0050] The grinding pad 93 can rotate about its center axis via the spindle motor 73, using the spindle 72, annular plate 90, annular mounting base 91 and pressure plate 92.

[0051] The grinding pad 93 and the aforementioned grinding tool 98 are examples of processing instruments used to process the wafer 100 held by the chuck stage 31. Furthermore, the grinding tool 98 is an example of a first processing instrument provided on the inner side, and the grinding pad 93 is an example of a second processing instrument provided on the outer side.

[0052] An air source 86 is connected to the storage chamber 81 of the forward / reverse mechanism 80 via an regulator 85. In the forward / reverse mechanism 80, by supplying air from the air source 86 to the storage chamber 81 from above via the regulator 85, a pressing force in the -Z direction can be applied to the piston 82, causing the piston 82 to descend in the Z-axis direction.

[0053] In addition, by supplying air from below to the receiving chamber 81, a pressing force in the +Z direction can be applied to the piston 82, causing the piston 82 to rise in the Z-axis direction.

[0054] As the piston 82 moves up and down in the Z-axis direction, the annular plate 90, connected to the piston 82 by means of the piston rod 83, moves up and down while being guided by the guide part 84. Simultaneously, the grinding pad 93 mounted on the annular plate 90 moves up and down. Thus, the grinding pad 93 and the grinding wheel 98 move back and forth relative to each other along the Z-axis direction.

[0055] In this way, the advance and retraction mechanism 80 moves the circular plate mounting seat 95 and the annular mounting seat 91 relative to each other in the direction perpendicular to the holding surface 32, i.e., the Z-axis direction, thereby functioning as a selection unit to selectively bring the grinding wheel 98 or the grinding pad 93 close to the holding surface 32.

[0056] Furthermore, as described above, the annular mounting base 91, the pressure plate 92, and the grinding pad 93 have an inner diameter larger than the outer diameter of the circular mounting base 95 and the grinding wheel 96. Therefore, the circular mounting base 95 and the grinding wheel 96 are housed inside the annular mounting base 91, the pressure plate 92, and the grinding pad 93 in a non-contact manner, and the grinding pad 93 can move relative to the grinding tool 98 in the vertical direction.

[0057] In addition, such as Figure 1 and Figure 2 (A cross-sectional view of the processing apparatus 1 is shown along the Y-axis.) As shown, the processing apparatus 1 has a processing chamber 20 with a generally housing shape below the processing unit 70. The processing chamber 20 is configured to house the chuck stage 31 of the holding unit 30 that holds the wafer 100, as well as the grinding wheel 98 and the polishing pad 93 that serve as processing tools for the processing unit 70, when processing the wafer 100.

[0058] like Figure 1 and Figure 2 As shown, the machining chamber 20 has an upper plate 21 with a machining tool inlet hole 211. The machining tool inlet hole 211 is provided to allow the grinding wheel 98 and the grinding pad 93, which are machining tools of the machining unit 70, to be introduced into the machining chamber 20. The machining chamber 20 is configured to include the upper plate 21, a side plate 22, a front plate 23 on the -Y side, a rear plate 24 on the +Y side, and a cover plate 37 for the holding unit 30, which serves as a base plate. The front plate 23 is configured to hang down from the upper plate 21 by a length that allows the holding unit 30 to move into the machining chamber 20 along the Y-axis direction.

[0059] In addition, a cylindrical corrugated cover that can connect the upper plate 21 of the machining chamber 20 and the lower surface of the support 56 and seal the machining tool inlet hole 211 is provided to prevent machining chips from being ejected from the machining tool inlet hole 211.

[0060] In addition, such as Figure 1 and Figure 2 As shown, the processing chamber 20 has a partition mechanism 10. When the grinding wheel 98 is brought closer to the holding surface 32 by the advance and retraction mechanism 80 and the wafer 100 held by the holding surface 32 is processed by the grinding wheel 98, the partition mechanism 10 divides the processing chamber 20 vertically around the grinding wheel 98, protecting the grinding pad 93 from the processing chips generated by the grinding wheel 98 processing the wafer 100.

[0061] like Figure 2 As shown, the partitioning mechanism 10 has a first partition plate 11 and a second partition plate 12 that both extend in the horizontal direction.

[0062] exist Figure 3 The processing chamber 20 and the partition mechanism 10 are shown from above. Figure 3As shown, the first partition plate 11 has a first semicircular recess 111 along the outer surface of the grinding tool 98. In addition, the second partition plate has a second semicircular recess 121 along the outer surface of the grinding tool 98 and opposite to the first semicircular recess 111.

[0063] In addition, such as Figure 2 As shown, the partition mechanism 10 has a first horizontal moving mechanism 13 that moves the first partition plate 11 in the horizontal direction along the X-axis and a second horizontal moving mechanism 14 that moves the second partition plate 12 in the horizontal direction along the X-axis.

[0064] These first horizontal moving mechanisms 13 and second horizontal moving mechanisms 14 are mounted on the lower surface of the upper plate 21 in the processing chamber 20.

[0065] like Figure 3 As shown, the first horizontal moving mechanism 13 and the second horizontal moving mechanism 14 each have an arm 201 connected to the first partition plate 11 and the second partition plate 12, and a drive device 200 for moving the arm 201 along the X-axis. In the first horizontal moving mechanism 13 and the second horizontal moving mechanism 14, the arm 201 is moved along the X-axis by the drive device 200, thereby causing the first partition plate 11 and the second horizontal moving mechanism 14 to move horizontally along the X-axis, thus enabling them to approach and connect to each other.

[0066] That is, in the partitioning mechanism 10, the first partition plate 11 and the second partition plate 12 are brought close together and connected by the first horizontal moving mechanism 13 and the second horizontal moving mechanism 14, thereby dividing the machining chamber 20 vertically by the first partition plate 11 and the second partition plate 12 surrounding the grinding tool 98 through the first semi-circular recess 111 and the second semi-circular recess 121. At this time, the first semi-circular recess 111 and the second semi-circular recess 121 are connected to each other, forming a structure that is more than... Figure 3 The small-diameter circle of the polishing pad 93, shown in dashed lines, surrounds the grinding wheel 98. Therefore, the separating mechanism 10 can protect the polishing pad 93 from the processing debris generated by the grinding wheel 98 during the processing of the wafer 100.

[0067] In addition, to facilitate the movement of the first partition plate 11 and the second partition plate 12, a guide rail extending along the X-axis direction may be provided.

[0068] In the processing apparatus 1 with such a structure, when the control unit 5 performs polishing processing on the wafer 100 held on the holding surface 32 by means of the polishing pad 93, as Figure 4 and Figure 5As shown, the first partition plate 11 and the second partition plate 12 are positioned horizontally away from the main shaft 72. This allows the polishing pad 93 to pass between the first semicircular recess 111 of the first partition plate 11 and the second semicircular recess 121 of the second partition plate 12. Furthermore, the control unit 5 controls the advance / retreat mechanism 80 to bring the polishing pad 93 closer to the holding surface 32 than the grinding wheel 98. In this state, the control unit 5 performs polishing processing on the wafer 100 held by the holding surface 32 using the polishing pad 93.

[0069] On the other hand, when the control unit 5 performs grinding processing on the wafer 100 held on the holding surface 32 using the grinding tool 98, such as Figure 2 and Figure 3 The advance / retreat mechanism 80 is controlled as shown to bring the grinding wheel 98 closer to the holding surface 32 than the grinding pad 93. Furthermore, the control unit 5 brings the first partition plate 11 and the second partition plate 12 closer to each other in the horizontal direction to the spindle, and surrounds the grinding wheel 98 with a circle formed by connecting the first semi-circular recess 111 and the second semi-circular recess 121. In this state, the control unit 5 performs grinding processing on the wafer 100 held by the holding surface 32 using the grinding wheel 98.

[0070] As described above, in this embodiment, when the wafer 100 is processed by the grinding wheel 98, the first partition plate 11 and the second partition plate 12 divide the processing chamber 20 vertically by surrounding the grinding wheel 98 with the first semi-circular recess 111 and the second semi-circular recess 121. Therefore, the polishing pad 93 located on the upper side of the processing chamber 20 can be protected from the processing debris generated when the front end (lower surface) of the grinding wheel 98 located on the lower side of the processing chamber 20 processes the wafer 100. This suppresses the adhesion of processing debris to the polishing pad 93. Therefore, it prevents scratches on the back surface 102 of the wafer 100 being polished by the polishing pad 93 due to processing debris.

[0071] In addition, in this embodiment, such as Figure 6 As shown, the upper surfaces of the first partition plate 11 and the second partition plate 12 may have a plurality of water spray outlets 16 for spraying water toward the grinding wheel 98. The water spray outlets 16 are used to spray water onto the grinding wheel 98, which connects the first partition plate 11 and the second partition plate 12, during machining. Figure 6 As shown by the middle arrow, processing water from a water source not shown is sprayed from the side toward the grinding wheel 98.

[0072] In this structure, during the grinding of the grinding wheel 98, processing water is sprayed from the side onto the grinding wheel 98, thereby preventing processing chips generated by the grinding wheel 98 from reaching the polishing pad 93 through the gap between the first partition plate 11 and the second partition plate 12 and the grinding wheel 98. Therefore, the polishing pad 93 can be better protected from the influence of processing chips.

[0073] Alternatively, water spray outlets 16 can be provided on the lower surface or inside of the first partition plate 11 and the second partition plate 12 instead of the upper surface of the first partition plate 11 and the second partition plate 12, so that water can be sprayed toward the grinding wheel 98.

[0074] Alternatively, water spray outlets 16 may be provided on the inner side of the first semicircular recess 111 of the first partition plate 11 and the inner side of the second semicircular recess 121 of the second partition plate 12.

[0075] Furthermore, in this embodiment, the processing apparatus 1 includes a grinding wheel 98 as the inner first processing tool and a polishing pad 93 as the outer second processing tool. The polishing pad 93 can be any polishing pad used for CMP polishing or dry polishing.

[0076] Furthermore, the combination of the first and second processing tools that can be implemented in the processing apparatus 1 is not limited to the combination of the grinding wheel 98 and the polishing pad 93. For example, the processing apparatus 1 may have a rotary cutting tool as the inner first processing tool and a polishing pad 93 as the outer second processing tool. Alternatively, the processing apparatus 1 may have a grinding wheel 98 as the inner first processing tool and a rotary cutting tool or a grinding wheel 98 as the outer second processing tool. Alternatively, the processing apparatus 1 may have a rotary cutting tool as the inner first processing tool and a grinding wheel 98 as the outer second processing tool. Alternatively, the processing apparatus 1 may have a polishing pad 93 as the inner first processing tool and a rotary cutting tool, a grinding wheel 98, or a polishing pad 93 as the outer second processing tool.

Claims

1. A processing apparatus having: a chuck table held by a holding surface against a wafer; a processing unit having a processing tool for processing the wafer held by the chuck table; a processing feed unit for processing feeding the processing unit in a direction perpendicular to the holding surface; and a processing chamber housing the chuck table and the processing tool, wherein the processing unit has: a first mount whose upper surface is connected to a lower end of a spindle extending in the perpendicular direction, and a first processing tool mounted on a lower surface of the first mount; a second mount having an inner diameter larger than an outer diameter of the first mount, in a circular ring shape concentric with the first mount, and a second processing tool mounted on a lower surface of the second mount; and a selection unit relatively moving the first mount and the second mount in the perpendicular direction, thereby selectively bringing the first processing tool or the second processing tool close to the holding surface, the processing chamber has a partition mechanism that, when the first processing tool is brought closer to the holding surface than the second processing tool by the selection unit and the wafer held by the holding surface is processed by the first processing tool, partitions the processing chamber up and down around the first processing tool, and protects the second processing tool from processing chips generated by the first processing tool processing the wafer, the partition mechanism has: a first partition plate extending in a horizontal direction, having a first semicircular recess along an outer side surface of the first processing tool; a second partition plate extending in a horizontal direction, having a second semicircular recess along the outer side surface of the first processing tool and opposite the first semicircular recess, a first horizontal movement mechanism moving the first partition plate in the horizontal direction; and a second horizontal movement mechanism moving the second partition plate in the horizontal direction, when the wafer held by the holding surface is processed by the second processing tool, the first partition plate and the second partition plate are moved away from each other in the horizontal direction away from the spindle, and the second processing tool is allowed to pass between the first semicircular recess and the second semicircular recess, when the wafer held by the holding surface is processed by the first processing tool, the first partition plate and the second partition plate are moved toward each other in the horizontal direction toward the spindle, the second processing tool is protected from processing chips generated by the first processing tool processing the wafer by being surrounded by a circle formed by connecting the first semicircular recess and the second semicircular recess.

2. The processing apparatus according to claim 1, wherein the first processing tool is a spin cutting tool or a grinding tool, and the second processing tool is a polishing pad.

3. The processing apparatus according to claim 1, wherein the first partition plate and the second partition plate further have water ejection ports that eject water toward the first processing tool. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​

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