A heat dissipation structure of a power conversion device and a power conversion device

Abstract

The present invention discloses a heat dissipation structure of a power conversion device and a power conversion device. The heat dissipation structure is used to dissipate heat for a first power device, a second power device and a third power device, and includes a first heat sink and a first fan. The first heat sink includes a body and a first heat dissipation tooth. The body extends along a first direction and is provided with a first mounting groove and a first heat dissipation substrate. The first heat dissipation tooth includes a first tooth and a second tooth. The first tooth includes a front tooth and a rear tooth. The tooth height of the rear tooth is lower than that of the front tooth to form a recessed area. The first power device is at least partially installed in the first mounting groove, the second power device is attached to the first heat dissipation substrate, and the third power device is installed in the recessed area. The heat dissipation structure and the power conversion device of the present invention have a reasonable layout of components, high heat dissipation efficiency, and can improve the heat dissipation efficiency of the rear end of the first heat dissipation tooth, thereby improving the heat dissipation efficiency at the end of the air duct.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a heat dissipation structure of a power conversion device and a power conversion device. Background Art

[0002] Power conversion devices, such as inverters, contain a large number of power devices and generate a lot of heat during operation. Although the prior art has presented a variety of heat dissipation structures to dissipate heat from power devices, it is still difficult to solve the defects of low heat dissipation capacity and efficiency of existing inverters, especially for power devices at the end of the air duct. Summary of the invention

[0003] The purpose of the present invention is to overcome the above-mentioned defects or problems existing in the background technology and to provide a heat dissipation structure of a power conversion device and a power conversion device, which have a reasonable layout, good heat dissipation capacity and can improve the heat dissipation efficiency at the end of the air duct.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] Technical solution 1, a heat dissipation structure of an electric power conversion device, used to dissipate heat for a first power device, a second power device and a third power device, including a first heat sink, which includes a body and a first heat dissipation tooth, the body extends along a first direction and is provided with a first mounting groove and a first heat dissipation substrate extending from the periphery of the groove of the first mounting groove; the first heat dissipation tooth includes a plurality of first teeth and second teeth arranged at intervals along a third direction and protruding from the first heat dissipation substrate along a second direction, the first teeth and the second teeth are respectively located on both sides of the first mounting groove along the third direction, the first teeth are also formed with front teeth and rear teeth along the first direction, the tooth height of the rear teeth is lower than that of the front teeth to form a recessed area; the first direction, the second direction and the third direction are orthogonal to each other; and a first fan, which is arranged near the front teeth of the first teeth and is used to dissipate heat for the first heat sink along the first direction; the first power device is at least partially installed in the first mounting groove, the second power device is attached to the surface of the first heat dissipation substrate away from the first heat dissipation tooth, and the third power device is installed in the recessed area.

[0006] Based on Technical Solution One, Technical Solution Two is also provided, and Technical Solution Two also includes a baffle parallel to the first heat dissipation substrate; the main body is also provided with a first wall protruding from the first heat dissipation substrate along the second direction and a third wall separating the first mounting groove and the first tooth, the first tooth is located between the first wall and the third wall, the first wall and the third wall are respectively provided with a first notch and a second notch corresponding to the recessed area, the two ends of the baffle along the third direction are respectively installed in the first notch and the second notch, and the height of the baffle in the second direction is lower than the height of the tooth top of the front tooth in the second direction; the third power device is fixed on the baffle facing the first heat dissipation substrate.

[0007] Based on technical solution 2, technical solution 3 is also provided. In technical solution 3, the front end of the baffle abuts against the rear end of the front tooth of the first tooth; and a gap is formed between the front end of the third power device and the rear end of the front tooth.

[0008] Based on technical solution three, technical solution four is also provided. In technical solution four, the first heat sink also includes a plurality of second heat dissipating teeth which are arranged at intervals along the third direction and protrude along the second direction from the outer surface of the bottom of the first mounting groove.

[0009] Based on technical solution four, technical solution five is also provided. In technical solution five, the main body is also provided with a second wall protruding from the first heat dissipation substrate along the second direction, the second tooth is located between the first mounting groove and the second wall, the first wall, the second wall and the first heat dissipation substrate also form a first mounting area in front of the first heat dissipation tooth, and the first fan is installed in the first mounting area; the distances between the first tooth and the second tooth and the first fan are both smaller than the distance between the first mounting groove and the first fan.

[0010] Based on technical solution five, technical solution six is ​​also provided. In technical solution six, a first wind guide surface inclined relative to a first direction is provided at a connection point between the first heat dissipation substrate and the front end of the first heat dissipation tooth toward the first fan.

[0011] Technical Solution 7, an electric power conversion device, comprising a shell, which is provided with an air inlet and an air outlet along a first direction; a first heat dissipation structure, which is installed in the shell, as described in any one of Technical Solutions 1 to 6; the first fan is close to the air inlet of the shell; an inverter module, which is installed in the shell and includes the first power device and the second power device; a boost module, which is installed in the shell and is electrically connected to the inverter module; a capacitor module, which is connected in parallel between the inverter module and the boost module and is installed in the shell; and a third power device, which is a discharge resistor connected in parallel with the capacitor module.

[0012] Based on Technical Solution Seven, Technical Solution Eight is also provided. In Technical Solution Eight, the main body of the first radiator is provided with a first wall protruding from the first heat dissipation substrate along the second direction, the first tooth is located between the first wall and the first mounting groove, and the capacitor module is located on the outside of the first wall; the first wall also has an air outlet in front of the first tooth to allow the first fan to supply air to the capacitor module.

[0013] Based on Technical Solution Eight, there is also a Technical Solution Nine, in which a second heat dissipation structure is also included, which is installed in the shell and arranged side by side with the first heat dissipation structure along a third direction, and includes a second radiator and a second fan; the second radiator includes a base, a third heat dissipation tooth and a fourth heat dissipation tooth, the base extends along the first direction and is provided with a second mounting groove, a second heat dissipation substrate extending from the circumference of the groove of the second mounting groove, and a fifth wall and a sixth wall protruding from the second heat dissipation substrate on both sides of the second mounting groove along the second direction, the fifth wall and the sixth wall forming the outer wall of the second radiator; the third heat dissipation tooth includes a plurality of third teeth of the second heat dissipation substrate arranged at intervals along the third direction and protruding along the second direction between the third wall and the second mounting groove, and a plurality of third teeth of the second heat dissipation substrate arranged at intervals along the third direction and along the The fourth tooth of the second heat dissipation substrate protrudes in the second direction between the fourth wall and the second mounting groove; the fourth heat dissipation teeth are arranged at intervals along the third direction and protrude from the outer surface of the bottom of the first mounting groove along the second direction; the fifth wall, the sixth wall and the second heat dissipation substrate also form a second mounting area in front of the third heat dissipation teeth; the second fan is installed in the second mounting area and is used to supply air to the second radiator along the first direction; the boost module includes a fourth power device at least partially located in the second mounting groove and a fifth power device attached to the second heat dissipation substrate; the first mounting groove and the second mounting groove are both filled with insulating heat-conducting material; the second heat dissipation substrate and the front end of the second heat dissipation tooth are connected to a second air guide surface inclined relative to the first direction toward the second fan.

[0014] Based on Technical Solution Nine, there is also a Technical Solution Ten, which also includes a DC filter inductor, an AC filter inductor, a third fan, a fourth fan and four electromagnetic isolation covers; the DC filter inductor, the boost module, the inverter module and the AC filter inductor are electrically connected in sequence; a partition perpendicular to the second direction is provided in the shell, and the partition divides the shell into a first layer area and a second layer area; the AC filter inductor and the DC filter inductor are both installed in the first layer area; the first heat dissipation structure, the second heat dissipation structure and the capacitor module are located in the second layer area; the inverter module also includes a first power board for carrying a second power device, and the first power board is installed between the first heat dissipation substrate and the partition; the first power device has a first connecting column protruding along the second direction, and a first positioning hole adapted to the first connecting column is provided on the first power board corresponding to the first connecting column, and the first The power device is electrically connected to the first power board by plugging the first connecting column into the first positioning hole; the boost module includes a second power board for carrying the fifth power device, and the second power board is installed between the second heat dissipation substrate and the partition; the fourth power device has a second connecting column protruding along the second direction, and a second positioning hole adapted to the second connecting column is provided on the second power board corresponding to the second connecting column, and the fourth power device is electrically connected to the second power board by plugging the second connecting column into the second positioning hole; the third fan is installed between the first heat dissipation substrate and the partition and is used to dissipate heat for the inverter module; the fourth fan is installed between the second heat dissipation substrate and the partition and is used to dissipate heat for the boost module; the four isolation covers are respectively covered on the first power board and the third fan, the second power board and the fourth fan, the DC filter inductor and the AC filter inductor.

[0015] From the above description of the present invention, it can be seen that compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. In the technical solution 1, the first power device is at least partially installed in the first installation groove, and the heat of the first power device can be conducted to the first heat dissipation substrate and then taken away by the first heat dissipation teeth, and can also be conducted to the groove wall and the groove bottom of the first installation groove and taken away by the passing wind flow; the second power device is attached to the surface of the first heat dissipation substrate away from the first heat dissipation teeth, and the heat of the second power device is conducted to the first heat dissipation substrate and then taken away by the first heat dissipation teeth; the tooth height of the rear teeth of the first teeth is lower than that of the front teeth to form a recessed area, and the third power device is installed in the recessed area, and the heat of the third power device can be taken away by the wind flow in the gap between the teeth of the front teeth, and the gap between the teeth of the front teeth is The wind flow in the gap has a reduced wind flow area in the area corresponding to the rear teeth, and the wind flow velocity is accelerated, thereby improving the heat dissipation efficiency of the rear tooth area, and the accelerated wind flow is blocked by the third power device and flows to the first heat dissipation substrate, thereby promoting the heat dissipation of the first heat dissipation substrate, and also promoting the heat dissipation of the second power device. Some of the accelerated wind flow will form turbulence at the front end of the recessed area, and the turbulence passes through the surface of the third power device and takes away the heat of the third power device. It can be seen that by adopting this technical solution, the component layout is reasonable, the heat dissipation efficiency is high, and the heat dissipation efficiency of the rear end of the first heat dissipation tooth can be improved, thereby improving the heat dissipation efficiency at the end of the air duct.

[0017] 2. In the second technical solution, the two ends of the baffle along the third direction are installed in the first notch and the second notch, and the third power device is fixed on the baffle facing the first heat dissipation substrate, so that the installation of the third power device is simple and stable; the setting of the baffle further reduces the wind flow area in the area corresponding to the rear teeth, thereby further accelerating the wind flow rate and improving the heat dissipation efficiency of the rear tooth area; the height of the baffle in the second direction is lower than the height of the tooth top of the front teeth in the second direction, so that the wind flow from the tooth top in the gap between the front teeth flows through the surface of the baffle and takes away the heat on the surface of the baffle, that is, takes away the heat on the surface of the third power device, and at the same time, due to the height difference between the tooth top of the front teeth and the baffle, the wind flow rate is faster; in addition, the setting of the baffle is more conducive to directing the wind flow to the first heat dissipation substrate and the third power device, thereby taking away the heat of the first heat dissipation substrate, the second power device and the third power device.

[0018] 3. In technical solution three, the front end of the baffle abuts against the rear end of the front tooth of the first tooth, and the baffle blocks the wind flow in the gap between the front teeth so that the wind flow flows to the second power device and the first heat dissipation substrate. A gap is formed between the front end of the second power device and the rear end of the front tooth. The wind flow forms turbulence in the gap and the flow rate is accelerated, which is conducive to taking away the heat of the third power device. The turbulence in the gap also flows to the first heat dissipation substrate and takes away the heat of the first heat dissipation substrate, and also takes away the heat of the second power device, so that the heat dissipation efficiency of the first radiator is greatly improved.

[0019] 4. In technical solution 4, the provision of the second heat dissipation teeth is conducive to taking away the heat from the bottom of the first mounting groove, thereby facilitating the heat dissipation of the first power device in the first mounting groove.

[0020] 5. In technical solution five, the first fan is installed in the first installation area, which not only makes the wind flow of the first fan concentrated to the area between the first wall and the second wall, which is more conducive to the heat dissipation of the first power device, the second power device and the third power device, but also makes the first fan and the first radiator assembled together, which is more conducive to maintenance; the distance between the first tooth and the second tooth and the first fan is smaller than the distance between the first installation groove and the first fan, which not only reduces the heat of the first radiator, but also reduces the wind resistance between the first fan and the first installation groove, and makes it easier for the wind flow to flow to the second heat dissipation tooth when flowing to the first installation groove, which is beneficial to the heat dissipation of the first power device in the first installation groove.

[0021] 6. In technical solution six, the setting of the first wind guide surface is conducive to introducing the wind flow of the first fan into the gap between the first heat dissipation teeth, especially guiding the wind flow of the first heat dissipation substrate attached to the first installation area into the gap between the first heat dissipation teeth.

[0022] 7. In technical solution seven, the present invention also provides a power conversion device, which adopts the heat dissipation structure in the above technical solution, has a reasonable component layout, greatly improves the heat dissipation efficiency, and improves the heat dissipation efficiency at the end of the air duct.

[0023] 8. In technical solution eight, the setting of the air outlet is conducive to enabling the first fan to supply air to the capacitor module, thereby improving the heat dissipation efficiency of the capacitor module.

[0024] 9. In technical solution nine, the fourth power device is at least partially installed in the second mounting groove. The heat of the fourth power device can be conducted to the second heat dissipation substrate and then taken away by the third heat dissipation teeth, or it can be conducted to the groove wall and groove bottom of the second mounting groove and taken away by the passing wind flow. The setting of the fourth heat dissipation teeth is conducive to taking away the heat of the groove bottom of the second mounting groove, thereby facilitating the heat dissipation of the fourth power device in the second mounting groove; since the first mounting groove and the second mounting groove are both filled with insulating thermal conductive materials, the insulating thermal conductive materials can not only cushion the first power device and the fourth power device, but also conduct the heat of the first power device and the fourth power device to the groove wall of the first mounting groove and the groove wall of the second mounting groove respectively. , thereby improving the heat dissipation efficiency of the first power device and the fourth power device; the fifth power device is attached to the second heat dissipation substrate, and the heat of the fifth power device is conducted to the second heat dissipation substrate and then taken away by the third heat dissipation teeth; the second fan is installed in the second installation area, so that the wind flow of the second fan is concentrated to the area between the fifth wall and the sixth wall, which is more conducive to the heat dissipation of the fourth power device and the fifth power device, and the second fan and the second heat sink are assembled together, which is more conducive to maintenance; the setting of the second air guide surface is conducive to introducing the wind flow of the second fan into the gap of the second heat dissipation teeth, especially guiding the wind flow of the second heat dissipation substrate attached to the second installation area into the gap of the third heat dissipation teeth.

[0025] 10. In the technical solution 10, the DC filter inductor and the AC filter inductor respectively form the input and output ends of the power conversion device. Placing the DC filter inductor and the AC filter inductor in the first layer area is conducive to the wiring operation of the power conversion device; the setting of the partition also makes the boost module and the inverter module located in the second layer area, that is, the components with large heat generation are concentrated on the first radiator and the second radiator, wherein the first radiator, the first fan, the third fan, the inverter module, the third power device and the electromagnetic isolation cover arranged on the outside of the third fan and the first power board form a module, and the second radiator, the second fan, the fourth fan, the boost module and the electromagnetic isolation cover arranged on the outside of the fourth fan and the second power board form a module. The modular assembly is more conducive to disassembly and maintenance, and the heat flow will not move with each other, and electromagnetic interference is also avoided. ; The capacitor module is located on the outside of the first wall, that is, the capacitor module, the inverter module and the boost module are arranged along the third direction. Since the capacitor module is connected in parallel between the boost module and the inverter module, it is convenient for wiring the capacitor module. The third power device is close to the first wall and is also close to the capacitor module, which is conducive to wiring. The first power device is electrically connected to the first power board by plugging the first connecting column into the first positioning hole, and the fourth power device is electrically connected to the second power board by plugging the second connecting column into the second positioning hole. The first connecting column can not only position the first power board, but also be used as an electrical connection component. The structure is ingenious, cables are eliminated, and the circuit is simpler. The second connecting column can not only position the second power board, but also be used as an electrical connection component. The structure is ingenious, cables are eliminated, and the circuit is simpler. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 is an overall schematic diagram of a power conversion device according to an embodiment of the present invention;

[0028] Figure 2 It is a schematic diagram of a power conversion device according to an embodiment of the present invention after the bottom wall and the side wall of the housing are hidden;

[0029] Figure 3 It is a schematic diagram of a power conversion device according to an embodiment of the present invention after the top wall and the side wall of the housing are hidden;

[0030] Figure 4 is a cross-sectional view of a power conversion device according to an embodiment of the present invention;

[0031] Figure 5A schematic diagram of a first heat dissipation structure, a second heat dissipation structure, a third fan and a fourth fan according to an embodiment of the present invention;

[0032] Figure 6 It is a schematic diagram of a first heat dissipation structure, a third fan and an inverter module according to an embodiment of the present invention;

[0033] Figure 7 is a schematic diagram of a first heat dissipation structure and a third power device according to an embodiment of the present invention;

[0034] Figure 8 is a schematic diagram of a first heat sink according to an embodiment of the present invention;

[0035] Fig. 9 It is a schematic diagram of a second heat dissipation structure, a fourth fan and a boost module according to an embodiment of the present invention;

[0036] Fig.10 FIG. 4 is a schematic diagram of a second heat sink according to an embodiment of the present invention.

[0037] Description of main reference numerals:

[0038] Shell 10; air inlet 11; air outlet 12; partition 13;

[0039] Inverter module 20; first power board 21; first positioning hole 2011; second power device 22; first power device 23; first connecting column 231; boost module 30; second power board 31; second positioning hole 311; fifth power device 32; fourth power device 33; second connecting column 331; capacitor module 40; third power device 50; DC filter inductor 60; AC filter inductor 70; electromagnetic isolation cover 80; first heat dissipation structure 100; first heat sink 110; body 111; first mounting groove 1111; first heat dissipation substrate 1112; first air guide surface 11121; first wall 1113; first notch 11131; air outlet 11132; second wall 1114; first notch 11131; air outlet 11132; second wall 1115; first notch 11132; air outlet 11133; second wall 1116; first notch 11133; air outlet 11133; second wall 1117; first notch 11133; air outlet 11133; second wall 1118; first notch 11133; air outlet 11133; second wall 1119; first notch 11134; air outlet 11135; second wall 1117; first notch 11133; air outlet 11133; second wall 1119; first notch 11134 ... 114; third wall 1115; second notch 11151; fourth wall 1116; first heat dissipation tooth 112; first tooth 1121; front tooth 11211; rear tooth 11212; second tooth 1122; second heat dissipation tooth 113; first fan 120; baffle 130; second heat dissipation structure 200; second radiator 210; base 211; second mounting groove 2111; second heat dissipation substrate 2112; second wind guide surface 21121; fifth wall 2113; sixth wall 2114; third heat dissipation tooth 212; third tooth 2121; fourth tooth 2122; fourth heat dissipation tooth 213; second fan 220; third fan 300; fourth fan 400; fifth fan 500. DETAILED DESCRIPTION

[0040] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are preferred embodiments of the present invention and should not be regarded as excluding other embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] In the claims, description and the above-mentioned drawings of the present invention, unless otherwise clearly defined, the use of terms such as "first", "second" or "third" etc. are for distinguishing different objects rather than for describing a specific order.

[0042] In the claims, specification and the above-mentioned drawings of the present invention, unless otherwise explicitly defined, directional words, such as the terms "center", "lateral", "longitudinal", "horizontal", "vertical", "top", "bottom", "inside", "outside", "up", "down", "front", "back", "left", "right", "clockwise", "counterclockwise", etc., indicating directions or positional relationships are based on the directions and positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the specific protection scope of the present invention.

[0043] In the claims, specification and the above drawings of the present invention, unless otherwise clearly defined, if the term "fixed connection" or "fixed connection" is used, it should be understood in a broad sense, that is, any connection method without a displacement relationship and relative rotation relationship between the two, that is to say, including non-detachable fixed connection, detachable fixed connection, integrated connection and fixed connection through other devices or elements.

[0044] In the claims, description and drawings of the present invention, if the terms "include", "have" and their variations are used, they are intended to mean "including but not limited to".

[0045] See also Figure 1-10 , Figure 1-10 A power conversion device is shown, including a shell 10, an inverter module 20, a boost module 30, a capacitor module 40, a third power device 50, a DC filter inductor 60, an AC filter inductor 70, a first heat dissipation structure 100, a second heat dissipation structure 200, a third fan 300, a fourth fan 400, a fifth fan 500 and an electromagnetic isolation cover 80.

[0046] like Figure 1-4As shown, the shell 10 is roughly a rectangular parallelepiped structure, with its length direction being the first direction, its height direction being the second direction, and its width direction being the third direction, that is, the first direction, the second direction and the third direction are orthogonal to each other. The shell 10 is provided with an air inlet 11 and an air outlet 12 along the first direction. In this embodiment, the end where the air inlet 11 is located is the front end, and the end where the air outlet 12 is located is the rear end. A partition 13 perpendicular to the second direction is provided in the shell 10, and the partition 13 separates the shell 10 into a first layer area and a second layer area. The DC filter inductor 60 and the AC filter inductor 70 are located in the first layer area, and the remaining components are all located in the second layer area. It should be understood that the partition 13 does not completely isolate the first layer area and the second layer area so that the cables between the first layer area and the second layer area can pass. In this embodiment, a gap is formed between the partition 13 and the rear wall of the shell 10 for the cables to pass through.

[0047] The electrical connection relationship of the power conversion device in this embodiment is as follows:

[0048] The DC filter inductor 60 , the boost module 30 , the inverter module 20 and the AC filter inductor 70 are electrically connected in sequence.

[0049] The boost module 30 includes a second power board 31, a fifth power device 32 carried on the second power board 31, and a fourth power device 33 electrically connected to the second power board 31. In the present embodiment, the second power board 31 is mainly a boost PCB board, the fifth power device 32 is mainly a semiconductor switching device, such as an IGBT, and the fourth power device 33 is mainly a boost power inductor.

[0050] The inverter module 20 includes a first power board 21, a second power device 22 carried on the first power board 21, and a first power device 23 electrically connected to the first power board 21. In this embodiment, the first power board 21 is mainly an inverter PCB board, the second power device 22 is mainly a semiconductor switching device, such as IGBT, etc., and the first power device 23 is mainly an inverter power inductor.

[0051] The capacitor module 40 is connected in parallel between the inverter module 20 and the boost module 30 , and the third power device 50 is a discharge resistor connected in parallel with the capacitor module 40 .

[0052] In this embodiment, the first heat dissipation structure 100 is used to dissipate heat for the first power device 23, the second power device 22 and the third power device 50, and the second heat dissipation structure 200 is used to dissipate heat for the fourth power device 33 and the fifth power device 32. The third fan 300 is used to dissipate heat for the inverter module 20, and the fourth fan 400 is used to dissipate heat for the boost module 30.

[0053] The heat dissipation of the first heat dissipation structure 100 and the third fan 300 will be described in detail below.

[0054] The first heat dissipation structure 100 is installed in the housing 10 and located in the second layer area, and includes a first heat sink 110 , a first fan 120 and a baffle 130 .

[0055] like Figure 8 As shown, the first heat sink 110 includes a body 111, a first heat dissipation tooth 112 and a second heat dissipation tooth 113. The body 111 extends along the first direction and is provided with a first mounting groove 1111, a first heat dissipation substrate 1112 extending from the periphery of the groove of the first mounting groove 1111, and a first wall 1113 and a second wall 1114 protruding from the first heat dissipation substrate 1112 along the second direction on both sides of the first mounting groove 1111 along the third direction. The first wall 1113 and the second wall 1114 form the outer wall of the first heat sink 110. The first heat dissipation teeth 112 include first teeth 1121 and second teeth 1122 arranged at intervals along the third direction and protruding from the first heat dissipation substrate 1112 along the second direction, the first teeth 1121 being located between the first wall 1113 and the first mounting groove 1111, and the second teeth 1122 being located between the first mounting groove 1111 and the second wall 1114; the first wall 1113, the second wall 1114 and the first heat dissipation substrate 1112 also form a first mounting area in front of the first heat dissipation teeth 112. The body 111 is further provided with a third wall 1115 separating the first mounting groove 1111 and the first teeth 1121, and a fourth wall 1116 separating the first mounting groove 1111 and the second teeth 1122. The first teeth 1121 include front teeth 11211 near the front end of the housing 10 and rear teeth 11212 near the rear end of the housing 10. The tooth height of the rear teeth 11212 is lower than that of the front teeth 11211 to form a recessed area. In a specific implementation, the length of the front teeth 11211 along the first direction is greater than the length of the rear teeth 11212 along the first direction. The first wall 1113 and the third wall 1115 are respectively provided with a first notch 11131 and a second notch 11151 corresponding to the recessed area. The second heat dissipation teeth 113 are arranged at intervals along the third direction and are convexly provided on the outer surface of the bottom of the first mounting groove 1111 along the second direction. In the first radiator 110, the first heat dissipation substrate 1112 is close to the partition 13, and the first heat dissipation teeth 112 are located on the side away from the partition 13. It should be understood that the first wall 1113, the second wall 1114, the third wall 1115 and the fourth wall 1116 can also be used as heat dissipation teeth.

[0056] The first fan 120 is installed in the first installation area and is used to dissipate heat for the first radiator 110 along the first direction, that is, the front teeth 11211 are close to the first fan 120, and the rear teeth 11212 are away from the first fan 120. In this embodiment, there are two first fans 120 and they are close to the air inlet 11 of the housing 10.

[0057] like Figure 2 , Figure 6 and Figure 8As shown, the baffle 130 is parallel to the first heat dissipation substrate 1112, and its two ends along the third direction are respectively installed in the first notch 11131 and the second notch 11151, and the height of the baffle 130 in the second direction is lower than the height of the tooth top of the front tooth 11211 in the second direction; see Figure 7 The third power device 50 is fixed on the baffle 130 toward the first heat dissipation substrate 1112, that is, the third power device 50 is installed in the recessed area, and the installation of the third power device 50 is simple and stable; the front end of the baffle 130 abuts against the rear end of the front tooth 11211 of the first tooth 1121; a gap is formed between the front end of the third power device 50 and the rear end of the front tooth 11211.

[0058] The first power device 23 is at least partially installed in the first installation groove 1111. In this embodiment, Figure 6 As shown, the magnetic part of the first power device 23 is completely located in the first installation groove 1111. After the first power device 23 is installed, the insulating thermal conductive material is encapsulated in the first installation groove 1111, and then the EMC partition is attached to the epoxy board of the first power device 23 to achieve electromagnetic isolation of the first power device 23. The insulating thermal conductive material can not only cushion the first power device 23, but also conduct the heat of the first power device 23 to the groove wall of the first installation groove 1111, thereby improving the heat dissipation efficiency of the first power device 23. The second power device 22 is attached to the surface of the first heat dissipation substrate 1112 away from the first heat dissipation tooth 112.

[0059] In this embodiment, Figure 8 As shown, the distance between the first tooth 1121 and the second tooth 1122 and the first fan 120 is smaller than the distance between the first mounting groove 1111 and the first fan 120, that is, the distance between the front end of the first heat dissipation tooth 112 and the first fan 120 is smaller than the distance between the front end of the first mounting groove 1111 and the first fan 120. Such a setting not only reduces the heat of the first radiator 110, but also reduces the wind resistance between the first fan 120 and the first mounting groove 1111, and makes it easier for the wind flow to flow to the second heat dissipation tooth 113 when flowing to the first mounting groove 1111, thereby facilitating the heat dissipation of the first power device 23 in the first mounting groove 1111.

[0060] A first air guide surface 11121 inclined relative to a first direction is provided at the connection point between the first heat dissipation substrate 1112 and the front end of the first heat dissipation tooth 112 and facing the first fan 120. The setting of the first air guide surface 11121 is conducive to introducing the wind flow of the first fan 120 into the gaps between the first heat dissipation teeth 112, especially to guiding the wind flow of the first heat dissipation substrate 1112 in the first installation area into the gaps between the first heat dissipation teeth 112.

[0061] The first power board 21 is installed between the first heat dissipation substrate 1112 and the partition 13; Figure 5-6As shown, the first power device 23 has a first connecting column 231 protruding along the second direction, and the first power board 21 is provided with a first positioning hole 2011 adapted to the first connecting column 231 corresponding to the first connecting column 231. The first power device 23 is electrically connected to the first power board 21 by plugging the first connecting column 231 into the first positioning hole 2011. The first connecting column 231 can not only position the first power board 21, but also be used as an electrically connected component. The structure is ingenious, cables are omitted, and the circuit is simpler. In a specific implementation, the first connecting column 231 is arranged on the epoxy board of the first power device 23, and a through hole for the first connecting column 231 to pass through is opened on the EMC partition.

[0062] The third fan 300 is installed between the first heat dissipation substrate 1112 and the partition 13 near the air inlet 11 and is used to dissipate heat for the inverter module 20. Specifically, the third fan 300 is fixed to the front end of the first heat dissipation substrate 1112. The wind flow of the third fan 300 can blow toward the first power board 21, the second power device 22 carried on the first power board 21, and the surface of the first heat dissipation substrate 1112 away from the first heat dissipation tooth 112.

[0063] It can be seen that, by adopting the first heat dissipation structure 100, the heat of the first power device 23 can be conducted to the first heat dissipation substrate 1112 and then taken away by the first heat dissipation teeth 112, or it can be conducted to the groove wall and the groove bottom of the first installation groove 1111 and taken away by the passing wind flow. The provision of the second heat dissipation teeth 113 is conducive to taking away the heat of the groove bottom of the first installation groove 1111; the second power device 22 is attached to the surface of the first heat dissipation substrate 1112 away from the first heat dissipation teeth 112, and the heat of the second power device 22 is conducted to the first heat dissipation substrate 1112 and then taken away by the first heat dissipation teeth 112; the tooth height of the rear teeth 11212 of the first teeth 1121 is lower than that of the front teeth 11211 to form a recessed area, and the third power device 50 is installed in the recessed area, and the heat of the third power device 50 can be taken away by the wind flow in the inter-tooth gap of the front teeth 11211, and the wind flow in the inter-tooth gap of the front teeth 11211 reduces the wind flow area in the area corresponding to the rear teeth 11212, and the wind flow velocity is accelerated, thereby improving the rear teeth The heat dissipation efficiency of the 11212 area is improved, the accelerated wind flow is blocked by the third power device 50 and flows to the first heat dissipation substrate 1112, thereby promoting the heat dissipation of the first heat dissipation substrate 1112, and also promoting the heat dissipation of the second power device 22. Some of the accelerated wind flow will form turbulence at the front end of the recessed area, and the turbulence passes through the surface of the third power device 50 and takes away the heat of the third power device 50; more preferably, the first fan 120 is installed in the first installation area, which not only makes the wind flow of the first fan 120 concentrated to the area between the first wall 1113 and the second wall 1114, thereby being more conducive to the heat dissipation of the first power device 23, the second power device 22 and the third power device 50, but also makes the first fan 120 and the first radiator 110 assembled together, which is more conducive to maintenance; it can be seen that the adoption of this technical solution has a reasonable layout of components, high heat dissipation efficiency, and can improve the heat dissipation efficiency of the rear end of the first heat dissipation tooth 112, thereby improving the heat dissipation efficiency of the end of the air duct.

[0064] More preferably, the setting of the baffle 130 further reduces the wind flow area in the area corresponding to the rear teeth 11212, thereby further accelerating the wind flow velocity and improving the heat dissipation efficiency of the rear teeth 11212 area; the height of the baffle 130 in the second direction is lower than the height of the tooth tops of the front teeth 11211 in the second direction, so that the wind flow from the tooth tops in the inter-tooth gap of the front teeth 11211 flows through the surface of the baffle 130 and takes away the heat on the surface of the baffle 130, that is, takes away the heat from the surface of the third power device 50. At the same time, due to the height difference between the tooth tops of the front teeth 11211 and the baffle 130, the wind flow velocity is faster; in addition, the setting of the baffle 130 is more conducive to directing the wind flow to the first heat dissipation substrate 1112 and the third power device 50, thereby taking away the heat of the first heat dissipation substrate 1112, the third power device 50 and the second power device 22.

[0065] More preferably, the front end of the baffle 130 abuts against the rear end of the front tooth 11211 of the first tooth 1121, and the baffle 130 blocks the wind flow in the gap between the front teeth 11211 so that the wind flow flows toward the third power device 50 and the first heat dissipation substrate 1112. A gap is formed between the front end of the third power device 50 and the rear end of the front teeth 11211, and the wind flow forms turbulence in the gap and the flow rate is accelerated, which is conducive to taking away the heat of the third power device 50. The turbulence in the gap also flows toward the first heat dissipation substrate 1112 and takes away the heat of the first heat dissipation substrate 1112, and also takes away the heat of the second power device 22, so that the heat dissipation efficiency of the first radiator 110 is greatly improved.

[0066] It can be seen that by adopting this technical solution, the component layout is reasonable, the heat dissipation efficiency is high, and the heat dissipation efficiency of the rear end of the first heat dissipation tooth 112 can be improved, thereby improving the heat dissipation efficiency at the end of the air duct.

[0067] The heat dissipation of the second heat dissipation structure 200 and the fourth fan 400 will be described in detail below.

[0068] The second heat dissipation structure 200 is installed in the housing 10 and arranged side by side with the first heat dissipation structure 100 along the third direction, and includes a second radiator 210 and a second fan 220 , that is, the second heat dissipation structure 200 is also located in the second layer area.

[0069] like Fig.10 As shown, the second heat sink 210 includes a base 211, a third heat dissipation tooth 212 and a fourth heat dissipation tooth 213. The base 211 extends along the first direction and is provided with a second mounting groove 2111, a second heat dissipation substrate 2112 extending from the groove circumference of the second mounting groove 2111, and a fifth wall 2113 and a sixth wall 2114 protruding from the second heat dissipation substrate 2112 along the second direction on both sides of the second mounting groove 2111 along the third direction. The fifth wall 2113 and the sixth wall 2114 form the outer wall of the second heat sink 210; the third heat dissipation tooth 212 includes a plurality of heat dissipation teeth 212 arranged at intervals along the third direction and The third teeth 2121 of the second heat dissipation substrate 2112 protrudes along the second direction between the fifth wall 2113 and the second mounting groove 2111, and a plurality of fourth teeth 2122 of the second heat dissipation substrate 2112 are arranged at intervals along the third direction and protrudes along the second direction between the sixth wall 2114 and the second mounting groove 2111; the fourth heat dissipation teeth 213 are arranged at intervals along the third direction and protrudes along the second direction on the outer surface of the bottom of the second mounting groove 2111; the fifth wall 2113, the sixth wall 2114 and the second heat dissipation substrate 2112 also form a second mounting area in front of the third heat dissipation teeth 212. The second heat dissipation substrate 2112 is close to the partition 13, and the third heat dissipation teeth 212 are located on the side away from the partition 13. It should be understood that the fifth wall 2113 and the sixth wall 2114 can also be used as heat dissipation teeth of the second radiator 210.

[0070] like Fig. 9 As shown, the second fan 220 is installed in the second installation area and is used to supply air to the second radiator 210 along the first direction.

[0071] The fourth power device 33 is at least partially located in the second mounting groove 2111. In a specific implementation, Fig. 9 As shown, the magnetic part of the fourth power device 33 is completely located in the second installation groove 2111. After the fourth power device 33 is installed, the insulating thermal conductive material is encapsulated in the second installation groove 2111, and then the EMC partition is attached to the epoxy board of the fourth power device 33 to achieve electromagnetic isolation of the fourth power device 33. The insulating thermal conductive material can not only cushion the vibration of the fourth power device 33, but also conduct the heat of the fourth power device 33 to the groove wall of the second installation groove 2111, thereby improving the heat dissipation efficiency of the fourth power device 33. The fifth power device 32 is attached to the surface of the second heat dissipation substrate 2112 away from the third heat dissipation tooth 212.

[0072] like Fig.10 As shown, the junction between the second heat dissipation substrate 2112 and the front end of the third heat dissipation tooth 212 is provided with a second wind guide surface 21121 inclined relative to the first direction toward the second fan 220. The provision of the second wind guide surface 21121 is conducive to introducing the wind flow of the second fan 220 into the gap of the third heat dissipation tooth 212, especially guiding the wind flow of the second heat dissipation substrate 2112 in the second installation area into the gap of the third heat dissipation tooth 212.

[0073] The second power board 31 of the boost module 30 is installed between the second heat dissipation substrate 2112 and the partition 13; Figure 5 and Fig. 9 As shown, the fourth power device 33 has a second connecting column 331 protruding along the second direction, and a second positioning hole 311 adapted to the second connecting column 331 is provided on the second power board 31 corresponding to the second connecting column 331. The fourth power device 33 is electrically connected to the second power board 31 by plugging the second connecting column 331 into the second positioning hole 311. The second connecting column 331 can not only position the second power board 31, but also be used as an electrical connection component. The structure is ingenious, cables are omitted, and the circuit is simpler. In a specific implementation, the second connecting column 331 is provided on the fourth power device 33, and a through hole for the second connecting column 331 to pass through is provided on the EMC partition.

[0074] The fourth fan 400 is installed between the second heat dissipation substrate 2112 and the partition 13 and is used to dissipate heat for the boost module 30. Specifically, the fourth fan 400 is installed at the front end of the second heat dissipation substrate 2112. The wind flow of the fourth fan 400 can blow toward the second power board 31, the fifth power device 32 carried on the second power board 31 and the second heat dissipation substrate 2112.

[0075] It can be seen that by adopting the second heat dissipation structure 200, the heat of the fourth power device 33 can be conducted to the second heat dissipation substrate 2112 and then taken away by the third heat dissipation teeth 212, or it can be conducted to the groove wall and the groove bottom of the second installation groove 2111 and taken away by the passing wind flow. The setting of the fourth heat dissipation teeth 213 is conducive to taking away the heat of the groove bottom of the second installation groove 2111, thereby facilitating the heat dissipation of the fourth power device 33 in the second installation groove 2111; the fifth power device 32 is attached to the second heat dissipation substrate 2112, and the heat of the fifth power device 32 is conducted to the second heat dissipation substrate 2112 and then taken away by the third heat dissipation teeth 212; the second fan 220 is installed in the second installation area, so that the wind flow of the second fan 220 is concentrated to the area between the fifth wall 2113 and the sixth wall 2114, which is more conducive to the heat dissipation of the fourth power device 33 and the fifth power device 32, and the second fan 220 and the second radiator 210 are assembled together, which is more conducive to maintenance.

[0076] The capacitor module 40 is located in the second layer area and outside the first wall 1113 of the first radiator 110. In this way, the capacitor module 40, the first radiator 110 and the second radiator 210 are arranged in sequence along the third direction. In this embodiment, the capacitor plate of the capacitor module 40 is perpendicular to the second direction, that is, the capacitor of the capacitor module 40 is placed along the second direction. The first wall 1113 is also provided with an air outlet 11132 at the position of the first installation area so that the first fan 120 can supply air to the capacitor module 40, thereby improving the heat dissipation efficiency of the capacitor module 40. In order to further improve the heat dissipation efficiency of the capacitor module 40, the fifth fan 500 is installed in the housing 10 and arranged close to the air inlet 11 to supply air to the capacitor module 40 along the first direction.

[0077] In this embodiment, the surface of the first heat dissipation substrate 1112 facing away from the first heat dissipation teeth 112 and the surface of the second heat dissipation substrate 2112 facing away from the third heat dissipation teeth 212 are substantially flush. Both ends of the first heat sink 110 and both ends of the second heat sink 210 are respectively abutted against the front end and the rear end of the housing 10 to improve the anti-seismic performance. In a specific implementation, the first wall 1113, the second wall 1114, the fifth wall 2113 and the sixth wall 2114 are mainly abutted against the front end and the rear end of the housing.

[0078] like Figure 4As shown, the electromagnetic isolation cover 80 is roughly a U-shaped groove structure, one end of the U-shaped groove is closed and the other end is open. In this embodiment, four isolation covers are respectively set on the first power board 21 and the third fan 300, the second power board 31 and the fourth fan 400, the DC filter inductor 60 and the AC filter inductor 70. Specifically, an electromagnetic isolation cover 80 covers the first power board 21 and the third fan 300 inside and is fixed to the first heat dissipation substrate 1112, and its opening faces the air outlet 12; an electromagnetic isolation cover 80 covers the second power board 31 and the fourth fan 400 inside and is fixed to the second heat dissipation substrate 2112, and its opening faces the air outlet 12; an electromagnetic isolation cover 80 covers the DC filter inductor 60 inside and is fixed to the partition 13, and its opening faces the input port of the housing 10; an electromagnetic isolation cover 80 covers the AC filter inductor 70 inside and is fixed to the partition 13, and its opening faces the output port of the housing 10.

[0079] In this embodiment, the DC filter inductor 60 and the AC filter inductor 70 respectively form the input end and the output end of the power conversion device. Placing the DC filter inductor 60 and the AC filter inductor 70 in the first layer area is conducive to the wiring operation of the power conversion device; the setting of the partition 13 also makes the boost module 30 and the inverter module 20 located in the second layer area, that is, the components with large heat generation are concentrated on the first heat sink 110 and the second heat sink 210, wherein the first heat sink 110, the first fan 120, the third fan 300, the inverter module 20, the third power device 50 and the electromagnetic insulator covered on the outside of the third fan 300 and the first power board 21 The shield 80 forms a module, and the second heat sink 210, the second fan 220, the fourth fan 400, the boost module 30 and the electromagnetic isolation shield 80 arranged outside the fourth fan 400 and the second power board 31 form a module. The modular assembly is more conducive to disassembly and maintenance, and the heat flow will not move mutually, and electromagnetic interference is also avoided; the capacitor module 40 is located on the outside of the first wall 1113. Since the capacitor module 40 is connected in parallel between the boost module 30 and the inverter module 20, it is convenient to connect the capacitor module 40. The third power device 50 is close to the first wall 1113 and is also close to the capacitor module 40, which is conducive to wiring. It can be seen that the power conversion device of this embodiment has convenient wiring operation, is easy to disassemble and maintain, has a reasonable layout of components, greatly improves the heat dissipation efficiency, and improves the heat dissipation efficiency at the end of the air duct.

[0080] The description of the above specification and embodiments is used to explain the protection scope of the present invention, but does not constitute a limitation on the protection scope of the present invention. Through the enlightenment of the present invention or the above embodiments, ordinary technicians in this field can obtain modifications, equivalent substitutions or other improvements to the embodiments of the present invention or part of the technical features thereof through logical analysis, reasoning or limited experiments, which should be included in the protection scope of the present invention.

Claims

1. A heat dissipation structure of a power conversion device, used for dissipating heat for a first power device, a second power device and a third power device, characterized in that: include A first heat sink, comprising a body and first heat dissipation teeth, wherein the body extends along a first direction and is provided with a first mounting groove and a first heat dissipation substrate extending from the periphery of the groove opening of the first mounting groove; the first heat dissipation teeth comprise a plurality of first teeth and second teeth which are arranged at intervals along a third direction and protrude from the first heat dissipation substrate along a second direction, the first teeth and the second teeth are respectively located on both sides of the first mounting groove along the third direction, the first teeth are further formed with front teeth and rear teeth along the first direction, the tooth height of the rear teeth being lower than that of the front teeth to form a recessed area; the first direction, the second direction and the third direction are orthogonal to each other; and a first fan, which is disposed near the front teeth of the first teeth and is used to dissipate heat for the first radiator along a first direction; The first power device is at least partially installed in the first installation groove, the second power device is attached to the surface of the first heat dissipation substrate away from the first heat dissipation tooth, and the third power device is installed in the recessed area.

2. The heat dissipation structure of a power conversion device according to claim 1, characterized in that: Also includes a baffle parallel to the first heat dissipation substrate; The main body is also provided with a first wall protruding from the first heat dissipation substrate along the second direction and a third wall separating the first mounting groove and the first tooth, the first tooth is located between the first wall and the third wall, the first wall and the third wall are respectively provided with a first notch and a second notch corresponding to the recessed area, the two ends of the baffle along the third direction are respectively installed in the first notch and the second notch, and the height of the baffle in the second direction is lower than the height of the tooth top of the front tooth in the second direction; the third power device is fixed on the baffle facing the first heat dissipation substrate.

3. The heat dissipation structure of a power conversion device as claimed in claim 2, characterized in that: The front end of the baffle abuts against the rear end of the front tooth of the first tooth; a gap is formed between the front end of the third power device and the rear end of the front tooth.

4. The heat dissipation structure of a power conversion device as claimed in claim 3, characterized in that: The first heat sink further includes a plurality of second heat dissipation teeth which are arranged at intervals along the third direction and protrude from the outer surface of the bottom of the first installation groove along the second direction.

5. The heat dissipation structure of a power conversion device as claimed in claim 4, characterized in that: The main body is also provided with a second wall protruding from the first heat dissipation substrate along the second direction, the second tooth is located between the first mounting groove and the second wall, the first wall, the second wall and the first heat dissipation substrate also form a first mounting area in front of the first heat dissipation tooth, and the first fan is installed in the first mounting area; the distance between the first tooth and the second tooth and the first fan is smaller than the distance between the first mounting groove and the first fan.

6. The heat dissipation structure of a power conversion device as claimed in claim 5, characterized in that: A first air guiding surface inclined relative to a first direction is provided at a connection point between the first heat dissipation substrate and the front end of the first heat dissipation tooth, facing the first fan.

7. A power conversion device, characterized in that: include A shell having an air inlet and an air outlet along a first direction; A first heat dissipation structure is installed in the housing and is formed by the heat dissipation structure of the power conversion device according to any one of claims 1 to 6; the first fan is located near the air inlet of the housing; an inverter module, which is installed in the housing and includes the first power device and the second power device; A boost module, which is installed in the housing and electrically connected to the inverter module; A capacitor module, which is connected in parallel between the inverter module and the boost module and is installed in the housing; and The third power device is a discharge resistor connected in parallel with the capacitor module.

8. A power conversion device as claimed in claim 7, characterized in that: The main body of the first radiator is provided with a first wall protruding from the first heat dissipation substrate along the second direction, the first tooth is located between the first wall and the first mounting groove, and the capacitor module is located on the outside of the first wall; the first wall also has an air outlet in front of the first tooth to allow the first fan to supply air to the capacitor module.

9. A power conversion device as claimed in claim 8, characterized in that: Also included is a second heat dissipation structure, which is installed in the housing and arranged side by side with the first heat dissipation structure along a third direction, and includes a second radiator and a second fan; The second heat sink comprises a base, a third heat sink tooth and a fourth heat sink tooth, the base extending along the first direction and provided with a second mounting groove, a second heat sink substrate extending from the groove opening periphery of the second mounting groove, and a fifth wall and a sixth wall protruding from the second heat sink substrate along the second direction on both sides of the second mounting groove, the fifth wall and the sixth wall forming the outer wall of the second heat sink; The third heat dissipation teeth include a plurality of third teeth of the second heat dissipation substrate arranged at intervals along the third direction and protruding along the second direction between the third wall and the second mounting groove, and a plurality of fourth teeth of the second heat dissipation substrate arranged at intervals along the third direction and protruding along the second direction between the fourth wall and the second mounting groove; the fourth heat dissipation teeth are arranged at intervals along the third direction and protruding along the second direction on the outer surface of the groove bottom of the first mounting groove; the fifth wall, the sixth wall and the second heat dissipation substrate also form a second mounting area in front of the third heat dissipation teeth; the second fan is installed in the second mounting area and is used to supply air to the second radiator along the first direction; The boost module includes a fourth power device at least partially located in the second mounting groove and a fifth power device attached to the second heat dissipation substrate; the first mounting groove and the second mounting groove are both filled with insulating heat-conducting materials; A second air guiding surface inclined relative to the first direction is provided at a connection point between the second heat dissipation substrate and the front end of the third heat dissipation tooth, facing the second fan.

10. A power conversion device as claimed in claim 9, characterized in that: It also includes a DC filter inductor, an AC filter inductor, a third fan, a fourth fan and four electromagnetic isolation covers; The DC filter inductor, the boost module, the inverter module and the AC filter inductor are electrically connected in sequence; A partition perpendicular to the second direction is provided in the shell, and the partition divides the shell into a first layer area and a second layer area; the AC filter inductor and the DC filter inductor are both installed in the first layer area; the first heat dissipation structure, the second heat dissipation structure and the capacitor module are located in the second layer area; The inverter module also includes a first power board for carrying a second power device, the first power board being installed between the first heat dissipation substrate and the partition; the first power device is provided with a first connecting column protruding along the second direction, and a first positioning hole adapted to the first connecting column is provided on the first power board corresponding to the first connecting column, and the first power device is electrically connected to the first power board by plugging the first connecting column into the first positioning hole; The boost module includes a second power board for carrying a fifth power device, the second power board is installed between a second heat dissipation substrate and a partition; the fourth power device has a second connecting column protruding along a second direction, and a second positioning hole adapted to the second connecting column is provided on the second power board corresponding to the second connecting column, and the fourth power device is electrically connected to the second power board by plugging the second connecting column into the second positioning hole; The third fan is installed between the first heat dissipation substrate and the partition and is used to dissipate heat for the inverter module; The fourth fan is installed between the second heat dissipation substrate and the partition plate and is used to dissipate heat for the boost module; The four isolation covers are respectively arranged on the first power board and the third fan, the second power board and the fourth fan, the DC filter inductor and the AC filter inductor.

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