Laser radar heat dissipation device

Abstract

The present invention discloses a laser radar heat dissipation device, including a shell, a detection device and a heat dissipation structure, wherein a housing cavity is formed inside the shell; the detection device is rotatably arranged in the housing cavity, and there is a gap between the detection device and the inner end surface of the shell; the heat dissipation structure is arranged at the gap in the housing cavity, and one end of the heat dissipation structure is fixedly connected to the detection device, and the other end is matched with the inner end surface gap of the shell to transfer the heat generated by the detection device to the shell. The heat dissipation device provided by the present application can realize the direct conduction of heat from the detection device to the shell, reduce the thermal resistance between the detection device and the shell, and increase the heat dissipation area, thereby improving the heat dissipation efficiency and heat dissipation effect.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component design, and more specifically, to a laser radar heat dissipation device. Background Art

[0002] Various electronic components are arranged inside the laser radar detection device. The design of heat dissipation of electronic components can usually smoothly transfer heat to the detection device body. Although the detection device is rotating, the outer shell of the laser radar is fixed for the sake of sealing. Therefore, heat from the detection device to the outside world needs to pass through air convection between the detector and the outer shell. The thermal resistance of this link is relatively large, which can easily lead to poor heat dissipation effect of the laser radar.

[0003] In summary, how to solve the problem of poor heat dissipation of lidar is an urgent problem to be solved by technical personnel in this field. Summary of the invention

[0004] In view of this, an object of the present invention is to provide a laser radar heat dissipation device, which can improve the heat dissipation effect of the laser radar.

[0005] In order to achieve the above object, the present invention provides the following technical solutions:

[0006] A laser radar heat dissipation device, comprising:

[0007] A housing, the interior of which forms a receiving cavity;

[0008] A detection device is rotatably disposed in the accommodating cavity, and a gap exists between the detection device and the inner end surface of the shell;

[0009] A heat dissipation structure is arranged at the gap in the accommodating cavity, and one end of the heat dissipation structure is fixedly connected to the detection device, and the other end is gap-matched with the inner end surface of the shell to transfer the heat generated by the detection device to the shell.

[0010] Preferably, the outer end surface of the shell is provided with one or more heat dissipation fins for transferring the heat on the shell to the external environment.

[0011] Preferably, the housing comprises an upper housing and a lower housing, the detection device comprises a circuit board and a laser generator, and the upper housing, the circuit board, the laser generator and the lower housing are arranged in sequence.

[0012] Preferably, the heat dissipation structure includes a first heat dissipation structure arranged between the circuit board and the laser generator, and two ends of the first heat dissipation structure are respectively fixedly connected to the circuit board and the laser generator to achieve heat transfer between the laser generator and the circuit board.

[0013] Preferably, the heat dissipation structure also includes a third heat dissipation structure arranged between the circuit board and the upper shell, and one end of the third heat dissipation structure is fixedly connected to the circuit board, and the other end is gap-matched with the inner end surface of the upper shell to transfer the heat on the circuit board to the upper shell.

[0014] Preferably, the inner end surface of the upper shell is provided with an upper shell heat dissipation structure protruding downward, and the upper surface of the third heat dissipation structure is provided with a first heat dissipation groove matching the upper shell heat dissipation structure, the upper shell heat dissipation structure is coupled and plugged with the first heat dissipation groove, and a second gap is present between the two to achieve a clearance fit between the third heat dissipation structure and the inner end surface of the upper shell.

[0015] Preferably, the second gap is filled with a first heat-conducting material for transferring heat from the third heat dissipation structure to the upper shell heat dissipation structure.

[0016] Preferably, a first baffle structure for preventing the first heat-conducting material from overflowing is provided at the upper end of the first heat dissipation groove along the outer circumferential direction.

[0017] Preferably, the heat dissipation structure also includes a fifth heat dissipation structure arranged between the laser generator and the lower shell, and one end of the fifth heat dissipation structure is fixedly connected to the bottom of the laser generator, and the other end is gap-fitted with the inner end surface of the lower shell to transfer the heat generated by the laser generator to the lower shell.

[0018] Preferably, the inner end surface of the lower shell is provided with a second heat dissipation groove matching the fifth heat dissipation structure, the fifth heat dissipation structure is coupled and plugged with the second heat dissipation groove, and a third gap is provided between the two to achieve a clearance fit between the fifth heat dissipation structure and the inner end surface of the lower shell.

[0019] Preferably, the third gap is filled with a second heat-conducting material for transferring heat from the fifth heat dissipation structure to the lower shell.

[0020] Preferably, a second baffle structure for preventing the second heat-conducting material from overflowing is provided at the upper end of the second heat dissipation groove along the outer circumferential direction.

[0021] Preferably, a memory heat-conducting structure extending in the radial direction is provided at the bottom of the fifth heat dissipation structure, and when the memory heat-conducting structure is heated, the memory heat-conducting structure expands outwards.

[0022] Preferably, the upper shell heat dissipation structure includes a third protruding structure and a bottom plate, the bottom plate is arranged at the bottom end of the third protruding structure, and a spring is arranged on the periphery of the third protruding structure, and both ends of the spring are respectively connected to the upper shell and the bottom plate.

[0023] Preferably, there is a fourth gap between the third protruding structure and the bottom plate, and the third protruding structure is a memory heat conductive element.

[0024] The laser radar heat dissipation device provided by the present invention includes a detection device, a shell and a heat dissipation structure. A accommodating cavity is formed inside the shell, the detection device is placed in the accommodating cavity, and there is a gap between the shell and the detection device. The heat dissipation structure is arranged in the gap between the detection device and the shell, and the heat dissipation structure is fixedly connected to the detection device.

[0025] Since the gap between the housing and the detection device is provided with a heat dissipation structure, that is, the gap is filled by the heat dissipation structure, the air content between the housing and the detection device is reduced, the air thermal resistance is reduced, the heat dissipation area is increased, and the heat dissipation effect is further improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0027] Figure 1 This is a schematic diagram of the structure of the laser radar heat dissipation device provided by the present invention;

[0028] Figure 2 A top view of the laser radar heat dissipation device provided by the present invention;

[0029] Figure 3 An exploded diagram of the laser radar heat dissipation device provided by the present invention;

[0030] Figure 4 A schematic diagram of the structure of the upper shell of the laser radar heat dissipation device provided by the present invention;

[0031] Figure 5 A cross-sectional view of the upper shell of the laser radar heat dissipation device provided by the present invention;

[0032] Figure 6 A cross-sectional view of a third heat dissipation structure of the laser radar heat dissipation device provided by the present invention;

[0033] Figure 7 A cross-sectional view of a laser generator and a lower shell of the laser radar heat dissipation device provided by the present invention;

[0034] Figure 8 A schematic diagram of the structure of the heat dissipation fins of the laser radar heat dissipation device according to the second specific embodiment of the present invention;

[0035] Fig. 9This is a schematic structural diagram of the heat dissipation fins of the laser radar heat dissipation device according to the third specific embodiment of the present invention;

[0036] Fig.10 A schematic diagram of the structure of the heat dissipation fins of the laser radar heat dissipation device according to the fourth specific embodiment of the present invention;

[0037] Fig.11 A schematic diagram of the structure of the heat dissipation fins of the laser radar heat dissipation device according to the fifth specific embodiment of the present invention;

[0038] Fig.12 This is a schematic structural diagram of an upper shell of a laser radar heat dissipation device according to a sixth specific embodiment of the present invention;

[0039] Fig.13 A cross-sectional view of an upper shell of a laser radar heat dissipation device according to a sixth specific embodiment of the present invention;

[0040] Fig.14 A schematic diagram of the bottom of a circuit board and a third heat dissipation structure of the laser radar heat dissipation device provided by the present invention;

[0041] Fig.15 This is a top schematic diagram of a circuit board and a first heat dissipation structure of the laser radar heat dissipation device provided by the present invention.

[0042] Figure 1-15 middle:

[0043] 1 is a heat dissipation fin, 2 is an upper shell, 3 is a window, 4 is a lower shell, 5 is a third heat dissipation structure, 6 is a circuit board, 7 is a first heat dissipation structure, 8 is a laser generator, 9 is an upper shell heat dissipation structure, and 10 is a second heat dissipation groove;

[0044] 51 is a first baffle structure;

[0045] 81 is a fifth heat dissipation structure, and 82 is a memory heat conduction structure;

[0046] 91 is a spring, 92 is a third protruding structure, and 93 is a bottom plate;

[0047] 101 is a second baffle structure;

[0048] 111 is a cylinder, 112 is a plate-like structure, 113 is a W-shaped structure, and 114 is a wave-shaped structure. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0050] The core of the present invention is to provide a laser radar heat dissipation device, which can improve the heat dissipation effect of the laser radar.

[0051] Please refer to Figure 1-Figure 13 , Figure 1 It is a schematic diagram of the structure of the laser radar heat dissipation device; Figure 2 It is a top view of the laser radar heat dissipation device; Figure 3 This is an exploded view of the laser radar heat dissipation device; Figure 4 is a schematic diagram of the structure of the upper shell; Figure 5 is a cross-sectional view of the upper shell; Figure 6 is a cross-sectional view of a third heat dissipation structure;

[0052] Figure 7 is a cross-sectional view of the laser generator and the lower shell; Figure 8 It is a structural schematic diagram of the heat dissipation fins of the second specific embodiment; Fig. 9 It is a structural schematic diagram of the heat dissipation fins of the specific embodiment 3; Fig.10 It is a structural schematic diagram of the heat dissipation fins of the fourth specific embodiment; Fig.11 It is a structural schematic diagram of the heat dissipation fins of the specific embodiment 5; Fig.12 It is a structural schematic diagram of the upper shell of the specific embodiment 6; Fig.13 It is a cross-sectional view of the upper shell of the sixth specific embodiment.

[0053] A laser radar heat dissipation device provided in the present application includes a shell, a detection device and a heat dissipation structure, wherein a accommodating cavity is formed inside the shell; the detection device is rotatably arranged in the accommodating cavity, and there is a gap between the detection device and the inner end surface of the shell; the heat dissipation structure is arranged at the gap in the accommodating cavity, and one end of the heat dissipation structure is fixedly connected to the detection device, and the other end is matched with the gap of the inner end surface of the shell to transfer the heat generated by the detection device to the shell.

[0054] Specifically, the laser radar includes a detection device and a shell. The detection device is rotatably arranged in a accommodating cavity formed by the shell. The fixed cover of the shell is arranged on the outside of the detection device. Various electronic components are installed in the detection device. There is a gap between the shell and the detection device, and a heat dissipation structure is provided in the gap. One end of the heat dissipation structure is fixedly connected to the detection device, and the other end of the heat dissipation device is matched with the gap of the inner end surface of the shell.

[0055] By providing a heat dissipation structure in the gap between the detection device and the housing, the amount of air between the detection device and the housing can be reduced, thereby reducing the air thermal resistance, increasing the heat dissipation area of ​​the detection device, and improving the heat dissipation capacity and heat dissipation effect.

[0056] On the basis of the above-mentioned embodiment, one or more heat dissipation fins 1 are provided on the outer end surface of the housing to transfer the heat on the housing to the external environment.

[0057] Specifically, cooling fins 1 are provided on both the upper and lower end surfaces of the shell, and at least two cooling fins 1 are provided on the upper end surface of the shell, and the cooling fins 1 are distributed in a ring around the central axis of the shell. Similarly, the cooling fins 1 are arranged on the lower end surface of the shell in the same manner as on the upper end surface.

[0058] Since heat sink fins 1 are added to the outer shell, the heat of the detection device can be conducted to the heat sink fins 1 through the outer shell, and the heat sink fins 1 dissipate the heat through air convection, thereby increasing the heat exchange area between the outer shell and the outside air, reducing thermal resistance, and thus reducing the overall temperature of the laser radar.

[0059] The heat dissipation fins 1 are arranged as a rectangular parallelepiped distributed in a ring and arranged vertically on the end faces. This can increase the heat exchange area between the outer shell and the outside air while utilizing all-directional natural wind to enhance the natural heat dissipation effect. The channels between the heat dissipation fins 1 provide an unobstructed flow path for the natural wind, allowing the natural wind to take away the heat on the outer shell surface and the heat dissipation fins 1 more quickly, thereby reducing the overall temperature of the lidar and improving the heat dissipation effect.

[0060] Optionally, only the heat dissipation fins 1 on the upper end surface may be distributed in a ring shape, or only the heat dissipation fins 1 on the lower end surface may be distributed in a ring shape, or distributed in other ways.

[0061] Please refer to Figure 8-Figure 11 , the heat dissipation fin 1 may also be a cylinder 111, a plate-like structure 112, a W-shaped structure 113, a wave-shaped structure 114 or other structures. Among them, when the heat dissipation fin 1 is a cylinder 111, as a preferred implementation, the heat dissipation fin 1 is arranged along the circumferential direction, and the spacing between two adjacent heat dissipation fins 1 on the same circumference is equal. In the radial direction, the heat dissipation fins 1 on two adjacent circumferences are staggered to increase the windward area and improve the overall heat dissipation efficiency.

[0062] On the basis of the above embodiment, the housing includes an upper shell 2 and a lower shell 4, the detection device includes a circuit board 6 and a laser generator 8, and the upper shell 2, the circuit board 6, the laser generator 8 and the lower shell 4 are arranged in sequence.

[0063] Specifically, the shell includes an upper shell 2, a lower shell 4 and a window 3. The window 3 is located between the upper shell 2 and the lower shell 4. The three form a accommodating cavity for installing the detection device. The circuit board is arranged close to the upper shell 2, the laser generator is arranged close to the lower shell, and the circuit board is arranged above the laser generator, forming a structure in which the upper shell 2, the circuit board, the laser generator and the lower shell are arranged in sequence.

[0064] On the basis of the above embodiment, the heat dissipation structure includes a first heat dissipation structure 7 arranged between the circuit board 6 and the laser generator 8, and the two ends of the first heat dissipation structure 7 are respectively fixedly connected to the circuit board 6 and the laser generator 8 to realize heat transfer between the laser generator 8 and the circuit board 6.

[0065] Specifically, the first heat dissipation structure 7 is a heat-averaging gasket, which is arranged between the circuit board 6 and the laser generator 8. The upper end surface of the first heat dissipation structure 7 is provided with a groove, and the chip on the lower end surface of the circuit board 6 is fixed in the groove. Since the lower end surface of the circuit board 6 is provided with a chip, a heat-averaging gasket is arranged between the laser generator 8 and the circuit board 6 to prevent the chip from forming a high-temperature point heat source, increase the contact area between the chip and the laser generator 8, thereby reducing the chip temperature and improving the stability of the laser radar operation. At the same time, the heat of the chip is transferred downward to the first heat dissipation structure 7 and then passes through the laser generator 8. The laser generator 8 has a large specific heat and can absorb a large amount of heat under thermal shock to protect the circuit board 6 and avoid overheating of the chip.

[0066] The first heat dissipation structure 7 is a cylindrical sheet structure, so that the first heat dissipation structure 7 can be in full contact with the circuit board 6 and the laser generator 8. Optionally, the first heat dissipation structure 7 can also be other structures.

[0067] Based on the above embodiment, the heat dissipation structure also includes a third heat dissipation structure 5 arranged between the circuit board 6 and the upper shell 2, and one end of the third heat dissipation structure 5 is fixedly connected to the circuit board 6, and the other end is gap-matched with the inner end surface of the upper shell 2 to transfer the heat on the circuit board 6 to the upper shell 2.

[0068] Specifically, a groove is provided on the lower end surface of the third heat dissipation structure 5, and a chip is provided on the upper end surface of the circuit board 6. The chip is fixed in the groove of the third heat dissipation structure 5. The third heat dissipation structure 5 is arranged between the detection device and the upper shell 2, filling part of the gap between the detection device and the upper shell 2.

[0069] By setting the third heat dissipation structure 5, the air content between the detection device and the upper shell 2 can be reduced, thereby reducing the thermal resistance between the detection device and the upper shell 2, improving the heat dissipation performance of the laser radar, and reducing the temperature of the laser radar. In addition, since the upper shell 2 is fixed, the circuit board 6 drives the third heat dissipation structure 5 to rotate, so the clearance between the inner end surface of the third heat dissipation structure 5 and the upper shell 2 can prevent the rotation of the third heat dissipation structure 5 from affecting the upper shell 2.

[0070] On the basis of the above embodiment, the inner end surface of the upper shell 2 is provided with an upper shell heat dissipation structure 9 protruding downward, and the upper surface of the third heat dissipation structure 5 is provided with a first heat dissipation groove matching the upper shell heat dissipation structure 9. The upper shell heat dissipation structure 9 is coupled and plugged with the first heat dissipation groove, and a second gap is present between the two to achieve a clearance fit between the third heat dissipation structure 5 and the inner end surface of the upper shell 2.

[0071] Specifically, the upper shell heat dissipation structure 9 is a downwardly protruding structure arranged on the inner end surface of the upper shell 2, the third heat dissipation structure 5 is arranged above the circuit board 6, and the interior of the third heat dissipation structure 5 is a first heat dissipation groove. The upper shell heat dissipation structure 9 is inserted into the first heat dissipation groove, and there is a second gap between the two.

[0072] By providing the protruding upper shell heat dissipation structure 9 to be plugged into and matched with the first heat dissipation groove, the gap between the circuit board and the upper shell 2 can be further reduced, thereby further reducing the thermal resistance and improving the heat dissipation effect.

[0073] The upper shell heat dissipation structure 9 is made of a high thermal conductivity and elastic material to further improve the heat dissipation effect. Optionally, it can also be made of other materials with similar effects.

[0074] Optionally, the upper shell heat dissipation structure 9 may be an independent component, or may be integrally formed with the upper shell 2 .

[0075] On the basis of the above embodiment, the second gap is filled with a first heat-conducting material to transfer the heat on the third heat dissipation structure 5 to the upper shell heat dissipation structure 9 .

[0076] Specifically, the second gap is filled with a first thermally conductive material with low friction resistance and high thermal conductivity, such as thermal oil, thermal grease, thermal paste or thermal glue, so that heat is directly transferred from the third heat dissipation structure 5 to the upper shell heat dissipation structure 9 through the first thermally conductive material, thereby reducing the air content between the third heat dissipation structure 5 and the upper shell heat dissipation structure 9, realizing direct heat conduction from the detection device to the upper shell 2, further reducing the thermal resistance between the detection device and the outer shell, and improving the heat dissipation performance of the lidar.

[0077] On the basis of the above embodiment, a first baffle structure 51 for preventing the first heat-conducting material from overflowing is provided at the upper end of the first heat dissipation groove along the outer circumferential direction.

[0078] Specifically, a first baffle structure 51 is disposed around the upper end of the third heat dissipation structure 5 to prevent the first heat-conducting material from overflowing during the rotation of the detection device.

[0079] Optionally, the first baffle structure 51 may not be provided.

[0080] On the basis of the above embodiment, the heat dissipation structure also includes a fifth heat dissipation structure 81 arranged between the laser generator 8 and the lower shell 4, and one end of the fifth heat dissipation structure 81 is fixedly connected to the bottom of the laser generator 8, and the other end is gap-matched with the inner end surface of the lower shell 4 to transfer the heat generated by the laser generator 8 to the lower shell 4.

[0081] Specifically, the fifth heat dissipation structure 81 is disposed between the laser generator 8 and the lower shell 4 to fill a portion of the gap between the laser generator 8 and the lower shell 4 .

[0082] By setting the fifth heat dissipation structure 81, the air content between the detection device and the lower shell 4 can be reduced, and the thermal resistance formed only by air conduction can be reduced, thereby improving the heat dissipation performance of the laser radar and reducing the overall temperature of the laser radar. At the same time, since the lower shell 4 is fixed and the laser generator 8 rotates, the gap between the lower shell 4 and the fifth heat dissipation structure 81 is matched to avoid affecting the lower shell 4 when the laser generator 8 rotates.

[0083] On the basis of the above embodiment, the inner end surface of the lower shell 4 is provided with a second heat dissipation groove 10 matching the fifth heat dissipation structure 81, the fifth heat dissipation structure 81 and the second heat dissipation groove 10 are coupled and plugged, and there is a third gap between the two to achieve the clearance fit between the fifth heat dissipation structure 81 and the inner end surface of the lower shell 4.

[0084] Specifically, a second heat dissipation groove 10 is provided inside the lower shell 4, and the fifth heat dissipation structure 81 is a protruding structure provided at the bottom of the laser generator 8. The fifth heat dissipation structure 81 is inserted into the second heat dissipation groove 10, and a third gap exists between the two.

[0085] By plugging and connecting the second heat dissipation groove 10 and the fifth heat dissipation structure 81, the gap can be further filled, and the air content between the detection device and the lower shell 4 can be reduced, thereby reducing the thermal resistance formed only by air conduction, improving the heat dissipation performance of the laser radar, and reducing the overall temperature of the laser radar.

[0086] Optionally, the fifth heat dissipation structure 81 may be an independent component, or may be integrally formed with the laser generator 8 .

[0087] Optionally, the fifth heat dissipation structure 81 may be a cylindrical structure, an inverted truncated cone structure or other types of structures.

[0088] On the basis of the above embodiment, the third gap is filled with a second heat-conducting material to transfer the heat on the fifth heat dissipation structure 81 to the lower shell 4 .

[0089] Specifically, the third gap is filled with a second thermally conductive material with low friction resistance and high thermal conductivity, such as thermal oil, thermal grease, thermal paste or thermal glue, so that heat is directly transferred from the fifth heat dissipation structure 81 to the second heat dissipation groove 10 through the second thermally conductive material, thereby reducing the air content between the second heat dissipation groove 10 and the fifth heat dissipation structure 81, realizing direct heat conduction from the detection device to the lower shell 4, further reducing the thermal resistance between the detection device and the outer shell, and improving the heat dissipation performance of the lidar.

[0090] On the basis of the above embodiment, a second baffle structure 101 for preventing the second heat-conducting material from overflowing is provided at the upper end of the second heat dissipation groove 10 along the outer circumferential direction.

[0091] Specifically, a second baffle structure 101 is disposed around the upper end of the second heat dissipation groove 10, so as to prevent the second heat conductive material from overflowing during the rotation of the detection device.

[0092] Optionally, the second baffle structure 101 may not be provided.

[0093] On the basis of the above embodiment, a memory heat-conducting structure 82 extending in the radial direction is provided at the bottom of the fifth heat dissipation structure 81. When the memory heat-conducting structure 82 is heated, the memory heat-conducting structure 82 expands outwards.

[0094] Specifically, during the use of the laser radar, when the laser generator 8 generates heat, the heat is transferred from the laser generator 8 to the fifth heat dissipation structure 81, and then from the fifth heat dissipation structure 81 to the memory heat-conducting structure 82 below. At this time, the memory heat-conducting structure 82 is heated and expands radially outward, and the heat continues to be transferred downward to the lower shell 4 through the memory heat-conducting structure 82.

[0095] By providing the memory heat-conducting structure 82 , the heat dissipation area of ​​the laser generator 8 can be increased when the laser generator 8 generates heat, thereby further improving the heat dissipation effect.

[0096] Optionally, an elastic structure with a larger diameter may also be directly disposed at the bottom of the fifth heat dissipation structure 81 .

[0097] Please refer to Figure 12-13 In another embodiment, the upper shell heat dissipation structure 9 includes a third protruding structure 92 and a bottom plate 93, the bottom plate 93 is arranged at the bottom end of the third protruding structure 92, and a spring 91 is arranged on the outer periphery of the third protruding structure 92, and the two ends of the spring 91 are respectively connected to the upper shell 2 and the bottom plate 93.

[0098] Specifically, the upper shell heat dissipation structure 9 includes a third protrusion structure 92 and a bottom plate 93 arranged inside the upper shell 2. The bottom plate 93 is arranged below the third protrusion structure 92, and the bottom plate 93 and the upper shell 2 are connected by a spring 91, so that the heat dissipation area can be increased while the elastic force of the spring 91 ensures that the bottom plate 93 is in close contact with the thermal conductive material in the third heat dissipation structure 5, thereby ensuring direct heat conduction between the detection device and the upper shell 2.

[0099] Four springs 91 are evenly arranged in the circumferential direction to ensure that the force on the bottom plate 93 is even. Optionally, two, three or more springs 91 may be arranged, or they may be unevenly arranged.

[0100] On the basis of the above embodiment, a fourth gap exists between the third protruding structure 92 and the bottom plate 93, and the third protruding structure is a memory heat conductive element.

[0101] Specifically, since the third protrusion structure 92 is a memory heat conductive part, when heat is transferred to the upper shell 2 through the detection device, the third protrusion structure 92 will increase downward, thereby filling the fourth gap and contacting the bottom plate 93. At this time, the third protrusion structure 92 applies downward pressure to the bottom plate 93, further ensuring close contact between the bottom plate 93 and the heat conductive material.

[0102] Optionally, the third protruding structure 92 may also be directly connected to the bottom plate 93 .

[0103] It should be noted that the laser radar mentioned in this application may have the functions of laser ranging, laser velocity measurement, laser imaging, atmospheric detection, tracking radar and other laser radars.

[0104] The laser radar heat dissipation device provided in the present application includes a housing, a detection device and a heat dissipation structure. The detection device includes a laser generator 8 and a circuit board 6. The heat generated by the chip on the upper surface of the circuit board 6 passes through the third heat dissipation structure 5, the first heat conductive material, the upper shell heat dissipation structure 9, the upper shell 2 and the heat dissipation fins 1 in sequence. The heat generated by the chip on the lower surface of the circuit board 6 passes through the first heat dissipation structure 7, the laser generator 8, the fifth heat dissipation structure 81, the second heat conductive material, the second heat dissipation groove 10, the lower shell 4 and the heat dissipation fins 1 in sequence, and finally the heat is dissipated through natural wind. The heat dissipation device realizes direct conduction of heat from the detection device to the housing, reduces the thermal resistance between the detection device and the housing, and between the housing and the external environment, and increases the heat dissipation area, thereby improving the heat dissipation efficiency and heat dissipation effect.

[0105] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0106] The above is a detailed introduction to the laser radar heat dissipation device provided by the present invention. This article uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A laser radar heat dissipation device, characterized in that: include: A housing, the interior of which forms a receiving cavity; A detection device is rotatably disposed in the accommodating cavity, and a gap exists between the detection device and the inner end surface of the shell; A heat dissipation structure is arranged at the gap in the accommodating cavity, and one end of the heat dissipation structure is fixedly connected to the detection device, and the other end of the heat dissipation structure is gap-matched with the inner end surface of the shell to transfer the heat generated by the detection device to the shell; The housing comprises an upper housing (2) and a lower housing (4), the detection device comprises a circuit board (6) and a laser generator (8), and the upper housing (2), the circuit board (6), the laser generator (8) and the lower housing (4) are arranged in sequence; The heat dissipation structure comprises a first heat dissipation structure (7) arranged between the circuit board (6) and the laser generator (8), and two ends of the first heat dissipation structure (7) are respectively fixedly connected to the circuit board (6) and the laser generator (8) to achieve heat transfer between the laser generator (8) and the circuit board (6); the upper end surface of the first heat dissipation structure (7) is provided with a groove, and the chip on the lower end surface of the circuit board (6) is fixedly arranged in the groove.

2. The laser radar heat dissipation device according to claim 1, characterized in that: One or more heat dissipation fins (1) are provided on the outer end surface of the shell, which are used to transfer the heat on the shell to the external environment.

3. The laser radar heat dissipation device according to claim 1, characterized in that: The heat dissipation structure further comprises a third heat dissipation structure (5) arranged between the circuit board (6) and the upper shell (2), wherein one end of the third heat dissipation structure (5) is fixedly connected to the circuit board (6), and the other end is clearance-matched with the inner end surface of the upper shell (2) so as to transfer the heat on the circuit board (6) to the upper shell (2).

4. The laser radar heat dissipation device according to claim 3, characterized in that: The inner end surface of the upper shell (2) is provided with an upper shell heat dissipation structure (9) protruding downward, and the upper surface of the third heat dissipation structure (5) is provided with a first heat dissipation groove matching the upper shell heat dissipation structure (9). The upper shell heat dissipation structure (9) is coupled and plugged with the first heat dissipation groove, and a second gap exists between the two, so as to achieve a clearance fit between the third heat dissipation structure (5) and the inner end surface of the upper shell (2).

5. The laser radar heat dissipation device according to claim 4, characterized in that: The second gap is filled with a first heat-conducting material for transferring heat from the third heat dissipation structure (5) to the upper shell heat dissipation structure (9).

6. The laser radar heat dissipation device according to claim 5, characterized in that: A first baffle structure (51) is provided at the upper end of the first heat dissipation groove along the outer circumference thereof for preventing the first heat-conducting material from overflowing.

7. The laser radar heat dissipation device according to claim 1, characterized in that: The heat dissipation structure further comprises a fifth heat dissipation structure (81) arranged between the laser generator (8) and the lower shell (4), wherein one end of the fifth heat dissipation structure (81) is fixedly connected to the bottom of the laser generator (8), and the other end is loosely matched with the inner end surface of the lower shell (4) to transfer the heat generated by the laser generator (8) to the lower shell (4).

8. The laser radar heat dissipation device according to claim 7, characterized in that: The inner end surface of the lower shell (4) is provided with a second heat dissipation groove (10) matching the fifth heat dissipation structure (81); the fifth heat dissipation structure (81) and the second heat dissipation groove (10) are coupled and plugged together, and a third gap is provided between the two to achieve clearance fit between the fifth heat dissipation structure (81) and the inner end surface of the lower shell (4).

9. The laser radar heat dissipation device according to claim 8, characterized in that: The third gap is filled with a second heat-conducting material for transferring heat from the fifth heat dissipation structure (81) to the lower shell (4).

10. The laser radar heat dissipation device according to claim 9, characterized in that: A second baffle structure (101) for preventing the second heat-conducting material from overflowing is provided at the upper end of the second heat dissipation groove (10) along the outer circumferential direction.

11. The laser radar heat dissipation device according to claim 7, characterized in that: A memory heat-conducting structure (82) extending in the radial direction is provided at the bottom of the fifth heat dissipation structure (81); when the memory heat-conducting structure (82) is heated, the memory heat-conducting structure (82) expands outwards.

12. The laser radar heat dissipation device according to any one of claims 4 to 6, characterized in that: The upper shell heat dissipation structure (9) comprises a third protruding structure (92) and a bottom plate (93), wherein the bottom plate (93) is arranged at the bottom end of the third protruding structure (92), and a spring (91) is arranged on the outer periphery of the third protruding structure (92), and the two ends of the spring (91) are respectively connected to the upper shell (2) and the bottom plate (93).

13. The laser radar heat dissipation device according to claim 12, characterized in that: A fourth gap exists between the third protruding structure (92) and the bottom plate (93), and the third protruding structure is a memory heat-conducting element.

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