Touch display device

Abstract

The present invention relates to a touch display device, comprising: a display substrate, a touch substrate located on the light emitting side of the display substrate, and a main circuit board located on the backlight side of the display substrate, the touch substrate comprising a touch area and a first binding area located on one side of the touch area along a first direction, the display substrate comprising a display area corresponding to the touch area, and a second binding area located on one side of the display area along the first direction, the touch display device further comprising: a flexible circuit board, one end of the flexible circuit board is connected to the first binding area, the other end is bent to the backlight side of the display substrate and connected to the main circuit board; a chip-on-cover film, one end of the chip-on-cover film is connected to the second binding area, the other end is bent to the backlight side of the display substrate and connected to the main circuit board; wherein the chip-on-cover film comprises a plurality of sub-chip-on-cover films, the flexible circuit board comprises a plurality of sub-flexible circuit boards, and along a second direction perpendicular to the first direction, the plurality of sub-chip-on-cover films and the plurality of sub-flexible circuit boards are spaced and arranged in an alternating manner.

Description

Technical Field

[0001] The present invention relates to the technical field of display product manufacturing, and in particular to a touch display device. Background Art

[0002] Flexible OLED (Organic Light-Emitting Diode) is the mainstream technology of current display products and has been widely used in electronic products such as mobile phones and watches. However, current OLED NB products often use external solutions. The touch display device includes a display substrate and a touch substrate located on the light-emitting side of the display substrate. The binding area of ​​the display substrate is bound and connected with a COF, and the binding area of ​​the touch substrate is bound and connected with a TFPC. After bending, the TFPC is connected to the side of the main circuit board away from the display substrate, and the TFPC is located on the outside of the COF. In order to avoid interference, the bending radius of the TFPC is large, and the bottom frame of the external product is large. Compared with LCD (Liquid Crystal Display) products, the screen-to-body ratio advantage is not obvious and the competitiveness is insufficient. Summary of the invention

[0003] In order to solve the above technical problems, the present invention provides a touch display device to solve the problem of a large lower frame of a flexible OLED.

[0004] In order to achieve the above-mentioned purpose, the technical solution adopted in the embodiment of the present invention is: a touch display device, comprising: a display substrate, a touch substrate located on the light-emitting side of the display substrate, and a main circuit board located on the backlight side of the display substrate, the touch substrate comprising a touch area and a first binding area located on one side of the touch area along a first direction, the display substrate comprising a display area corresponding to the touch area, and a second binding area located on one side of the display area along the first direction,

[0005] The touch display device further includes:

[0006] A flexible circuit board, one end of which is connected to the first binding area, and the other end of which is bent to the backlight side of the display substrate and connected to the main circuit board;

[0007] A chip-on-chip film, one end of which is connected to the second binding area, and the other end of which is bent to the backlight side of the display substrate and connected to the main circuit board;

[0008] The chip-on-cover film includes a plurality of sub-chip-on-cover films, and the flexible circuit board includes a plurality of sub-flexible circuit boards. Along a second direction perpendicular to the first direction, the plurality of sub-chip-on-cover films and the plurality of sub-flexible circuit boards are spaced and arranged in an alternating manner.

[0009] Optionally, the distance between the sub-chip-on-film and the sub-flexible circuit board adjacent thereto is greater than 10 mm.

[0010] Optionally, a side of the sub-chip-on-film close to the sub-flexible circuit board adjacent thereto is provided with an avoidance recess.

[0011] Optionally, the other end of the flexible circuit board is connected to a first surface of the main circuit board close to the display substrate.

[0012] Optionally, the other end of the flexible circuit board is connected to a side surface of the main circuit board.

[0013] Optionally, the other end of the chip-on-film is connected to a side surface of the main circuit board.

[0014] Optionally, the other end of the COF is connected to a second surface of the main circuit board away from the display substrate.

[0015] Optionally, the other end of the COF is connected to a first surface of the main circuit board close to the display substrate.

[0016] Optionally, the other end of the flexible circuit board is connected to a side surface of the main circuit board, and the other end of the flexible circuit board is connected to an end of the side surface close to the display substrate;

[0017] The chip-on-film is connected to a side surface of the main circuit board, and the other end of the chip-on-film is connected to an end of the side surface close to the display substrate.

[0018] Optionally, the flexible circuit board is connected to the first binding area of ​​the touch control substrate via a connector, and the flexible circuit board is connected to the main circuit board via a connector.

[0019] The beneficial effect of the present invention is that the width of the lower frame is reduced by changing the connection position of the TFPC and the PCB. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram showing the structure of a touch display device in the related art;

[0021] Figure 2 A schematic diagram showing the structure of a touch display device according to an embodiment of the present invention Figure 1 ;

[0022] Figure 3 A schematic diagram showing the structure of a touch display device according to an embodiment of the present invention Figure 2 ;

[0023] Figure 4 A schematic diagram showing the structure of a touch display device according to an embodiment of the present invention Figure 3 ;

[0024] Figure 5 A schematic diagram showing the structure of a touch display device according to an embodiment of the present invention Figure 4 . DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present invention.

[0026] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0027] In the related art, the stacking structure of the touch display device is as follows: Figure 1 As shown, one end of the chip-on-chip film 2 is bound and connected to the binding area of ​​the display substrate 10, and the other end of the chip-on-chip film 2 is bent and connected to the main circuit board 30, one end of the TFPC (flexible circuit board 1) is connected to the touch sensor, and the other end of the TFPC is bent and connected to the main circuit board 30, and the TFPC is connected to the side of the main circuit board 30 away from the display substrate 10, and the TFPC is located on the outside of the chip-on-chip film 2. The width of the outer frame of the touch display device is 7, 7 = 1 + 2 + 3 + 4 + 5 + 6, wherein 1 represents the distance from AA (display area of ​​the display substrate 10) to the edge of the Panel (Panelborder), 2 represents the glue coating width (UV glue coated between the chip-on-chip film 2 and the display substrate 10 to prevent water and oxygen invasion), 3 represents the Bending radius of COF (chip-on-chip film 2), 4 represents the thickness of the chip-on-chip film 2, 5 represents the thickness of TFPC, and 6 represents the Bending radius of TFPC. The lower frame of the external product is larger, which is relatively thinner than that of LCD (Liquid Crystal Display). For products with high-performance integrated circuits (MCUs), the screen-to-body ratio advantage is not obvious and the competitiveness is insufficient; and after the TFPC is connected to the PCB (main circuit board 30), it is easy to fall off due to bending tension, causing problems in signal transmission, and ultimately affecting the normal use of the product.

[0028] refer to Figures 2 to 4 In view of the above problems, the present embodiment provides a touch display device, comprising: a display substrate 10, a touch substrate 20 located on the light emitting side of the display substrate 10, and a main circuit board 30 located on the backlight side of the display substrate 10, wherein the touch substrate 20 includes a touch area and a first direction (reference Figure 2 The display substrate 10 includes a display area corresponding to the touch area, and a second binding area located at one side of the display area along the first direction,

[0029] The touch display device further includes:

[0030] A flexible circuit board 1, one end of the flexible circuit board 1 is connected to the first binding area, and the other end of the flexible circuit board 1 is bent to the backlight side of the display substrate 10 and connected to the main circuit board 30;

[0031] A chip-on-film 2, one end of the chip-on-film 2 is connected to the second binding area, and the other end of the chip-on-film 2 is bent to the backlight side of the display substrate 10 and connected to the main circuit board 30;

[0032] Among them, the flip chip film 2 includes multiple sub-flip chip films 201, and the flexible circuit board 1 includes multiple sub-flexible circuit boards 101. Along a second direction perpendicular to the first direction, the multiple sub-flip chip films 201 and the multiple sub-flexible circuit boards 101 are spaced and arranged in an alternating manner.

[0033] In the related art, the flexible circuit board 1 connected to the touch substrate 20 is bent and located on the outside of the flip chip film 2 connected to the display substrate 10, that is, the flexible circuit board 1 and the flip chip film 2 are arranged in an overlapping manner. In this way, the arrangement of the flip chip film 2 limits the bending radius of the flexible circuit board 1, thereby increasing the width of the lower frame of the touch display device. In this embodiment, the flip chip film 2 is divided into a plurality of sub-flip chip films 201, and the flexible circuit board 1 is divided into a plurality of sub-flexible circuit boards 101, and the plurality of sub-flip chip films 201 and the plurality of sub-flexible circuit boards 101 are spaced and arranged in an interlaced manner, breaking the restriction of the flip chip film 2 on the flexible circuit board 1, and the width of the lower frame is Max (1+2+3+4, 1+2+5+6), referring to Figure 2, that is, the bending area of ​​the flexible circuit board 1 and the bending area of ​​the chip-on-chip film 2 are no longer in an overlapping relationship in the first direction, and the bending radius of the flexible circuit board 1 is no longer limited by the bending radius of the chip-on-chip film 2. According to actual needs (such as circuit distribution), the bending radius of the chip-on-chip film 2 can be larger than the bending radius of the flexible circuit board 1. At this time, the width of the bottom frame of the touch display device is 1+2+3+4, and the bending radius of the chip-on-chip film 2 can be smaller than the bending radius of the flexible circuit board 1. At this time, the width of the bottom frame of the touch display device is 1+2+5+6. Comparison Figure 1 , the width of the lower frame of the touch display device in the related art is 7, which includes the bending radius of the chip-on-chip film 2 and the radius of the flexible circuit board 1, while with the above scheme in this embodiment, the width of the lower frame only includes the bending radius of the chip-on-chip film 2 or the bending radius of the flexible circuit board 1. Obviously, compared with the related art, the flexible circuit board 1 connected to the touch substrate 20 is located on the chip-on-chip film 2 connected to the display substrate 10. The arrangement method can break the restriction of the chip-on-chip film 2 on the flexible circuit board 1, reduce the bending radius of the flexible circuit board 1, and thus reduce the width of the lower frame of the touch display device.

[0034] It should be noted that, in the related art, due to the limitation of the relative position relationship between the chip-covered film 2 and the flexible circuit board 1, along the first direction, the starting bending point of the flexible circuit board 1 (the first bending starting point 11) is located on the side of the starting bending point of the chip-covered film 2 (the second bending starting point 21) away from the first binding area, so that the flexible circuit board 1 has a larger bending radius to avoid interference between the flexible circuit board 1 and the chip-covered film 2 after bending. By adopting the above-mentioned technical scheme of this embodiment, the starting bending point of the flexible circuit board 1 can be moved toward the direction close to the first binding area. For example, the starting bending point of the flexible circuit board 1 is flush with the starting bending point of the chip-covered film 2, and even the starting bending point of the flexible circuit board 1 can be located on the side of the starting bending point of the chip-covered film 2 close to the first binding area, thereby reducing the bending radius of the flexible circuit board 1, thereby reducing the width of the lower frame of the touch display device.

[0035] In this embodiment, for example, the distance between the sub-chip-on-film 201 and the adjacent sub-flexible circuit board 101 is greater than 10 mm.

[0036] A gap is ensured between the sub-COF 201 and the adjacent sub-FPCB 101 to avoid interference between the sub-COF 201 and the sub-FPCB 101 .

[0037] In this embodiment, for example, a side of the sub-chip film 201 close to the sub-flexible circuit board 101 adjacent thereto is provided with an avoidance recess.

[0038] When the length of the main circuit board 30 along the first direction is short, and the number of the sub-flexible circuit boards 101 and the number of the sub-chip films 201 are large, so that the distance between the adjacent sub-chip films 201 and the sub-flexible circuit boards 101 is small, the shape of the sub-chip films 201 needs to be avoided to avoid interference between the adjacent sub-chip films 201 and the sub-flexible circuit boards 101, refer to Figure 5 .

[0039] It should be noted that, in order to avoid interference between the adjacent sub-chip-on-chip film 201 and the sub-flexible circuit board 101, an avoidance structure can be set on the corresponding sub-chip-on-chip film 201, and an avoidance structure can also be set on the corresponding sub-flexible circuit board 101. However, there are many wirings on the sub-flexible circuit board 101. In order to avoid affecting the wiring on the sub-flexible circuit board 101, it is preferred in this embodiment to set an avoidance structure (such as the setting of the avoidance recess) on the corresponding sub-chip-on-chip film 201.

[0040] It should be noted that the chip-on-film includes a first area for connecting to the display substrate, a bending area and a second area for connecting to the main circuit board, the avoidance recess is arranged in the bending area and / or the second area of ​​the chip-on-film, and when the chip-on-film is in a flattened state, the length of the avoidance recess in the first direction is less than or equal to K, and the reference Figure 5 When the length of the avoidance recess in the first direction is equal to K, one end of the avoidance recess starts at the bending starting point of the chip-on-chip film (the second bending starting point 21), and the other end of the avoidance recess coincides with an end of the chip-on-chip film away from the display substrate.

[0041] By adopting the above solution of this embodiment, the connection position of the flexible circuit board 1 to the main circuit board 30 is more flexible, that is, the setting of the bending radius of the flexible circuit board 1 is no longer limited by the COF 2.

[0042] refer to Figure 2 In this embodiment, the other end of the flexible circuit board 1 is connected to the first surface of the main circuit board 30 close to the display substrate 10 .

[0043] Relative to Figure 1 The flexible circuit board 1 is reversely connected to the main circuit board 30, that is, a window is opened on the first surface of the main circuit board 30 close to the display substrate 10, and a window is opened on the front side of the flexible circuit board 1 (the side connected to the display substrate 10 is the back side, and the other side opposite to the back side is the front side) away from the first end of the display substrate 10, thereby avoiding the problem of separation of the main circuit board 30 and the flexible circuit board 1 due to bending tension.

[0044] refer to Figure 3 In this embodiment, the other end of the flexible circuit board 1 is connected to the side of the main circuit board 30 .

[0045] The main circuit board 30 is connected to the display substrate 10 via an adhesive 40. When the adhesive 40 is thin, the flexible circuit board 1 cannot be connected to the first surface of the main circuit board 30, that is, the flexible circuit board 1 cannot be located between the display substrate 10 and the main circuit board 30 after being bent. At this time, the other end of the flexible circuit board 1 can be connected to the side of the main circuit board 30.

[0046] refer to Figure 2 and Figure 3 In this embodiment, the other end of the COF 2 is connected to the side of the main circuit board 30 .

[0047] In this embodiment, the other end of the COF 2 is connected to the second surface of the main circuit board 30 away from the display substrate 10 .

[0048] In this embodiment, the other end of the COF 2 is connected to the first surface of the main circuit board 30 close to the display substrate 10 .

[0049] refer to Figure 3 In this embodiment, the other end of the flexible circuit board 1 is connected to the side of the main circuit board 30, and the other end of the flexible circuit board 1 is connected to one end of the side close to the display substrate 10;

[0050] The COF 2 is connected to a side surface of the main circuit board 30 , and the other end of the COF 2 is connected to an end of the side surface close to the display substrate 10 .

[0051] The flexible circuit board 1 is divided into a plurality of sub-flexible circuit boards 101, and the chip-on-chip film 2 is divided into a plurality of sub-chip-on-chip films 201, and then the plurality of sub-flexible circuit boards 101 and the plurality of sub-chip-on-chip films 201 are spaced and staggered to break the limitation of the relative position relationship between the chip-on-chip film 2 and the flexible circuit board 1, and the connection position between the flexible circuit board 1 and the main circuit board 30 is more flexible, and the connection position between the chip-on-chip film 2 and the main circuit board 30 is also more flexible. With the above scheme, the other end of the flexible circuit board 1 is connected to an end of the side surface close to the display substrate 10, thereby reducing the bending radius of the flexible circuit board 1, the chip-on-chip film 2 is connected to the side surface of the main circuit board 30, and the other end of the chip-on-chip film 2 is connected to an end of the side surface close to the display substrate 10, thereby reducing the bending radius of the chip-on-chip film 2 and reducing the width of the lower frame of the touch display device.

[0052] refer to Figure 3 , the other end of the flexible circuit board 1 is connected to the side of the main circuit board 30, the flexible circuit board 1 is connected to a first position on the side of the main circuit board 30, the flip chip 2 is connected to the side of the main circuit board 30, the flip chip 2 is connected to a second position on the side of the main circuit board 30, the first position corresponds to a plurality of sub-flexible circuit boards 101 including a plurality of first sub-positions, the second position corresponds to a plurality of sub-flip chips 201 including a plurality of second sub-positions, and in the first direction, the plurality of first sub-positions and the plurality of second sub-positions are spaced and staggered.

[0053] In the thickness direction of the main circuit board 30 (i.e., the light emitting direction of the display substrate 10), the first position and the second position are arranged in layers (i.e., the distance between the first position and the display substrate 10 is different from the distance between the second position and the display substrate 10), and in the first direction, the first sub-position is located between two adjacent second sub-positions to avoid interference between the chip-on-film 2 and the flexible circuit board 1.

[0054] In this embodiment, the flexible circuit board 1 is exemplarily connected to the first binding area of ​​the touch control substrate 20 through a connector, and the flexible circuit board 1 is connected to the main circuit board 30 through a connector.

[0055] In this embodiment, the chip-on-film 2 is exemplarily connected to the display substrate 10 by means of a conductive adhesive, and the chip-on-film 2 is connected to the main circuit board 30 by means of a conductive adhesive.

[0056] In this embodiment, one end of the flexible circuit board 1 connected to the touch display substrate 10 is covered with a covering film to protect the connection between the flexible circuit board 1 and the touch display substrate 10 .

[0057] In this embodiment, for example, a CPI (transparent polyimide) layer 60 is disposed on a side of the touch substrate 20 away from the display substrate 10 .

[0058] In this embodiment, for example, a UV adhesive barrier layer is provided between the COF film 2 and the display substrate 10 to prevent water and oxygen from invading.

[0059] In this embodiment, for example, a heat dissipation structure 50 is disposed on the backlight side of the display substrate 10 , and the main circuit board 30 is located on a side of the heat dissipation structure 50 away from the display substrate 10 .

[0060] There are a few points to note:

[0061] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0062] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.

[0063] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0064] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A touch display device, comprising: A display substrate, a touch substrate located on the light-emitting side of the display substrate, and a main circuit board located on the backlight side of the display substrate, wherein the touch substrate includes a touch area and a first binding area located on one side of the touch area along a first direction, and the display substrate includes a display area corresponding to the touch area, and a second binding area located on one side of the display area along the first direction, characterized in that: The touch display device further includes: A flexible circuit board, one end of which is connected to the first binding area, and the other end of which is bent to the backlight side of the display substrate and connected to the main circuit board; A chip-on-chip film, one end of which is connected to the second binding area, and the other end of which is bent to the backlight side of the display substrate and connected to the main circuit board; The chip-on-cover film includes a plurality of sub-chip-on-cover films, and the flexible circuit board includes a plurality of sub-flexible circuit boards, and along a second direction perpendicular to the first direction, the plurality of sub-chip-on-cover films and the plurality of sub-flexible circuit boards are spaced and arranged in an interlaced manner; A side of the sub-chip-on-film close to the sub-flexible circuit board adjacent thereto is provided with an avoidance recess.

2. The touch display device according to claim 1, characterized in that: The distance between the sub-chip-on-film and the sub-flexible circuit board adjacent thereto is greater than 10 mm.

3. The touch display device according to claim 1, characterized in that: The other end of the flexible circuit board is connected to the first surface of the main circuit board close to the display substrate.

4. The touch display device according to claim 1, characterized in that: The other end of the flexible circuit board is connected to the side surface of the main circuit board.

5. The touch display device according to claim 1, 3 or 4, characterized in that: The other end of the chip-on-film is connected to the side surface of the main circuit board.

6. The touch display device according to claim 1, 3 or 4, characterized in that: The other end of the COF is connected to a second surface of the main circuit board away from the display substrate.

7. The touch display device according to claim 1, 3 or 4, characterized in that: The other end of the COF is connected to a first surface of the main circuit board close to the display substrate.

8. The touch display device according to claim 1, characterized in that: The other end of the flexible circuit board is connected to the side of the main circuit board, and the other end of the flexible circuit board is connected to one end of the side close to the display substrate; The chip-on-film is connected to a side surface of the main circuit board, and the other end of the chip-on-film is connected to an end of the side surface close to the display substrate.

9. The touch display device according to claim 1, characterized in that: The flexible circuit board is connected to the first binding area of ​​the touch control substrate through a connector, and the flexible circuit board is connected to the main circuit board through a connector.

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