Touch display device

Abstract

Embodiments of the present disclosure relate to a touch display device. By removing a portion of the second substrate after attaching a second substrate on which a touch pad is arranged to a first substrate on which a display pad is arranged to thereby expose the touch pad to the outside, the display pad and the touch pad can be arranged on the same side of the display panel. Since the touch pad is located higher than the display pad in an area that does not overlap with the display pad, the bonding between the pad and the printed circuit can be easily performed. Since the number of pads that can be arranged increases, a large-area, high-resolution touch display device can be easily realized.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to a touch display device. Background Art

[0002] The growth of the smart society has led to an increased demand for the use of image display devices and various types of display devices such as liquid crystal displays, organic light emitting displays, etc.

[0003] The display device recognizes a touch on a display panel by a user's finger or a pen, and performs input processing based on the recognized touch to thereby provide the user with more diverse functions.

[0004] A display device capable of recognizing a user's touch may include a plurality of touch electrodes embedded in or disposed on a display panel. The display device may recognize a user's touch by providing a touch drive signal to the plurality of touch electrodes disposed on the display panel and detecting a touch sensing signal from the plurality of touch electrodes.

[0005] In order to drive a plurality of touch electrodes disposed on the display panel, a plurality of touch pads need to be disposed on the display panel.

[0006] Since the display panel needs to arrange a plurality of display pads for driving the display thereon, it is difficult to place a plurality of touch pads. Due to the arrangement of the plurality of touch pads, it may also be difficult to reduce the border area of ​​the display panel.

[0007] Therefore, there is a need for a method for efficiently arranging a plurality of touch pads on a display panel while avoiding an increase in a bezel area of ​​the display panel. Summary of the invention

[0008] According to an embodiment, there is provided a method for arranging a plurality of touch pads and a plurality of display pads on a display panel while preventing an increase in a bezel area or a thickness of the display panel.

[0009] According to an embodiment, there is provided a method for realizing a large-area display device capable of touch recognition by increasing the number of touch pads that can be arranged in a predetermined area.

[0010] According to an embodiment, a touch display device is provided, comprising: a first substrate comprising a display area and a non-display area outside the display area; a plurality of first pads arranged in the non-display area on the first substrate; at least one dam located between the plurality of first pads and the display area on the first substrate; a second substrate located on the at least one dam and the first substrate and in an area other than at least a portion of an area overlapping with the at least one dam; a plurality of touch electrodes arranged on a surface of the second substrate; and a plurality of second pads located on the at least one dam and electrically connected to at least one touch electrode among the plurality of touch electrodes.

[0011] The plurality of second pads may be located in a region other than a region overlapping the second substrate.

[0012] Upper surfaces of the plurality of second pads may be located lower than a lower surface of the second substrate.

[0013] The at least one dam may include a first dam located outside the display area and a second dam located outside the first dam and disposed under the plurality of second pads.

[0014] The touch display device may further include a sacrificial layer disposed in a partial region on the lower surface of the second substrate. The sacrificial layer may be located between the display region and the plurality of second pads.

[0015] According to an embodiment, a touch display device is provided, comprising: a first substrate comprising a display area and a non-display area outside the display area; a plurality of first pads arranged in the non-display area on the first substrate; a plurality of second pads located between the plurality of first pads and the display area on the first substrate and located higher than the plurality of first pads; and a second substrate located in an area on the first substrate other than an area where the plurality of second pads are provided and located higher than the plurality of second pads, a plurality of touch electrodes being provided on a surface of the second substrate.

[0016] According to an embodiment, a touch display device is provided, including: a display substrate, which includes a display area and a non-display area located outside the display area; a touch substrate, which is located on the display substrate, and a plurality of touch electrodes are arranged on the surface of the touch substrate; and an insulating layer, which includes a first part arranged in at least a partial area of ​​the lower surface of the touch substrate and a second part connected to the first part, the second part is located outside the touch substrate and has a recessed area, and a plurality of touch pads are located in the recessed area.

[0017] According to an embodiment, a structure is provided in which both a plurality of display pads and a plurality of touch pads can be provided on any one side of a display panel. Therefore, a plurality of pads can be easily arranged on the display panel while preventing the border area of ​​the display panel from increasing.

[0018] According to an embodiment, through a structure in which a plurality of touch pads are located between a display pad and a display area, it is possible to increase the number of touch pads that can be arranged on a display panel and easily implement a touch recognition function of a large-area display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and other objects, features and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0020] Figure 1 is a diagram schematically illustrating a configuration of a touch display device according to an embodiment;

[0021] Figure 2 is a diagram illustrating an example arrangement of touch electrodes included in a touch display device according to an embodiment;

[0022] Figure 3 is a diagram illustrating another example arrangement of touch electrodes included in a touch display device according to an embodiment;

[0023] Figure 4 is a diagram illustrating an example arrangement of display pads and touch pads in a touch display device according to an embodiment;

[0024] Figure 5 is a diagram illustrating an example process of a touch display device according to an embodiment;

[0025] Figure 6 and Figure 7 is a diagram illustrating another example arrangement of display pads and touch pads in a touch display device according to an embodiment;

[0026] Figure 8 is a diagram illustrating another example arrangement of display pads and touch pads in a touch display device according to an embodiment;

[0027] Fig. 9 This is an example of an embodiment according to Figure 8 A diagram of an example process of a touch display device shown;

[0028] Fig.10 is a diagram illustrating another example arrangement of display pads and touch pads in a touch display device according to an embodiment;

[0029] Fig.11 , Fig.12 , Fig.13 and Fig.14 is an example such as Fig.10 Figures showing various exemplary structures of a touch substrate included in a touch display device;

[0030] Fig.15A and Fig. 15B is an example such as Fig.10 A diagram of an example process for a touch display device shown; and

[0031] Fig.16 , Fig.17 , Fig.18 , Fig.19 , Fig. 20 , Fig.21 , Fig. 22 , Fig.23 and Fig.24 is a diagram illustrating an example connection structure between a plurality of pads arranged in a touch display device according to an embodiment and a driving circuit. DETAILED DESCRIPTION

[0032] In the following description of examples or embodiments of the present disclosure, reference will be made to the accompanying drawings, in which specific examples or embodiments that can be implemented are shown by way of illustration, and the same reference numerals and symbols in the accompanying drawings may be used to indicate the same or similar components, even if they are shown in different drawings from each other. In addition, in the following description of examples or embodiments of the present disclosure, when it is determined that the description may make the subject matter in some embodiments of the present disclosure unclear, a detailed description of the well-known functions and components incorporated herein will be omitted. Terms such as "including", "having", "comprising", "consisting of", and "formed by" used herein are generally intended to allow the addition of other components unless the term is used together with the term "only". As used herein, the singular form is intended to include the plural form unless the context clearly indicates otherwise.

[0033] Terms such as "first", "second", "A", "B", "(A)" or "(B)" may be used herein to describe elements of the present disclosure. Each of these terms is not used to limit the nature, sequence, order or quantity of the elements, etc., but is only used to distinguish the corresponding element from other elements.

[0034] When it is mentioned that a first element is “connected or coupled to”, “contacts or overlaps”, etc. a second element, it should be interpreted that not only the first element can be “directly connected or coupled to” or “directly contact or overlaps” the second element, but also a third element can be “interposed” between the first and second elements, or the first and second elements can be “connected or coupled to”, “contacts or overlaps”, etc., each other via a fourth element. Here, the second element can be included in at least one of the two or more elements that are “connected or coupled to”, “contacts or overlaps”, etc., each other.

[0035] When time-related terms such as "after", "following", "next", "before", etc. are used to describe a process or operation of an element or configuration, or a flow or step in an operation, process, or manufacturing method, these terms may be used to describe non-sequential or non-sequential processes or operations unless the terms "directly" or "immediately" are used together.

[0036] Furthermore, when any dimension, relative size, etc. is mentioned, it should be considered that the numerical value or corresponding information (e.g., level, range, etc.) of an element or feature includes a tolerance or error range that may be caused by various factors (e.g., process factors, internal or external impact, noise, etc.), even when no relevant description is specified. In addition, the term "may" fully encompasses all meanings of the term "can".

[0037] Figure 1 is a diagram schematically illustrating a configuration of a touch display device 100 according to an embodiment.

[0038] Reference Figure 1 According to an embodiment, the touch display device 100 may include a display panel 110, the display panel 110 including a display area AA in which a plurality of sub-pixels SP are disposed and a non-display area NA located outside the display area AA and in which a signal line or a driving circuit is disposed. The touch display device 100 may include a gate driving circuit 120, a data driving circuit 130, and a controller 140 to drive the display panel 110.

[0039] The touch display device 100 may further include a Figure 2 and Figure 3 The touch driving circuit 150 is described. Among the components included in the touch display device 100, components for display driving are briefly described, and then components for touch sensing are described below.

[0040] A plurality of gate lines GL and a plurality of data lines DL may be disposed on the display panel 110. The display panel 110 may further include voltage lines for providing various signals or voltages in addition to the gate lines GL and the data lines DL.

[0041] The sub-pixel SP may be located at a position where the gate line GL and the data line DL cross each other. The sub-pixel SP may include several circuit elements. Two or more sub-pixels SP may constitute one pixel.

[0042] The gate driving circuit 120 may be controlled by the controller 140. The gate driving circuit 120 sequentially outputs scan signals to a plurality of gate lines GL disposed on the display panel 110, and may control driving timing of a plurality of sub-pixels SP.

[0043] The gate driving circuit 120 may include one or more gate driver integrated circuits (GDICs).

[0044] The gate driving circuit 120 may be located only on one side of the display panel 110 or on each of two opposite sides according to a driving method. The gate driving circuit 120 may be implemented in the form of a gate in panel (GIP) disposed in a bezel area of ​​the display panel 110.

[0045] The data driving circuit 130 may receive image data from the controller 140 and convert the received image data into an analog data voltage. The data driving circuit 130 may output a data voltage to each data line DL according to the timing of applying a scan signal through the gate line GL, and may control each sub-pixel SP to represent brightness according to the image data.

[0046] The data driving circuit 130 may include one or more source driver integrated circuits (SDICs).

[0047] The data driving circuit 130 may be located on only one side of the display panel 110 or on each of two opposite sides according to a driving method.

[0048] The controller 140 may provide various control signals to the gate driving circuit 120 and the data driving circuit 130 and control operations of the gate driving circuit 120 and the data driving circuit 130 .

[0049] The controller 140 controls the gate driving circuit 120 to output a scan signal according to the timing implemented in each frame. The controller 140 converts image data received from the outside according to the data signal format used by the data driving circuit 130 and outputs the converted image data to the data driving circuit 130.

[0050] The controller 140 may receive various timing signals including a vertical synchronization signal VSYNC, a horizontal synchronization signal HSYNC, an input data enable signal DE, and a clock signal, as well as image data from the outside (eg, a host system).

[0051] The controller 140 may generate a plurality of control signals using various timing signals received from the outside, and output the generated control signals to the gate driving circuit 120 and the data driving circuit 130 .

[0052] As an example, in order to control the gate driving circuit 120 , the controller 140 may output various gate control signals GCS including a gate start pulse GSP, a gate shift clock GSC, and a gate output enable signal GOE.

[0053] The gate start pulse GSP controls the operation start timing of one or more gate driver integrated circuits GDIC constituting the gate driving circuit 120. The gate shift clock GSC is a clock signal commonly input to one or more gate driver integrated circuits GDIC and controls the shift timing of the scan signal. The gate output enable signal GOE specifies timing information about one or more gate driver integrated circuits GDIC.

[0054] In order to control the data driving circuit 130 , the controller 140 may output various data control signals DCS including, for example, a source start pulse SSP, a source sampling clock SSC, and a source output enable signal SOE.

[0055] The source start pulse SSP controls the data sampling start timing of one or more source driver integrated circuits SDIC constituting the data driving circuit 130. The source sampling clock SSC is a clock signal for controlling the sampling timing of data in each source driver integrated circuit (SDIC). The source output enable signal SOE controls the output timing of the data driving circuit 130.

[0056] The touch display device 100 may further include a power management integrated circuit (not shown) that supplies various voltages or currents to, for example, the display panel 110 , the gate driving circuit 120 , and the data driving circuit 130 , or controls various voltages or currents to be supplied.

[0057] In addition to the configuration for display driving, the touch display device 100 may also include a configuration for touch sensing. The configuration for touch sensing may be separated from the configuration for display driving. In some cases, the configuration for display driving may be used for touch sensing, or the configuration for display driving and the configuration for touch sensing may be integrated together.

[0058] Figure 2 is a diagram illustrating an example arrangement of touch electrodes TE included in the touch display device 100 according to an embodiment.

[0059] Reference Figure 2 The touch display device 100 may include a plurality of touch electrodes TE, a plurality of touch lines TL, and a touch driving circuit 150 .

[0060] The plurality of touch electrodes TE may be embedded in the display panel 110 or may be provided on the display panel 110. When the touch electrodes TE are embedded in the display panel 110, the touch electrodes TE may be electrodes provided separately from electrodes for display driving, or may be electrodes for display driving.

[0061] The touch electrode TE may be, for example, a transparent electrode.

[0062] Alternatively, the touch electrode TE may be an opaque electrode. When the touch electrode TE is an opaque electrode, the touch electrode TE may have a mesh shape including a plurality of openings. The openings of the touch electrode TE may be located corresponding to the light emitting region of the sub-pixel SP.

[0063] The plurality of touch lines TL may electrically connect the touch electrodes TE and the touch driving circuit 150 .

[0064] A touch driving signal may be provided to the touch electrode TE through the touch line TL. A touch sensing signal may be detected from the touch electrode TE through the touch line TL.

[0065] Similar to the data driving circuit 130, the touch driving circuit 150 may be provided on a printed circuit (film) bonded to the non-display area NA of the display panel 110. The touch driving circuit 150 may be provided separately from the data driving circuit 130. In some cases, the touch driving circuit 150 may be integrated with the data driving circuit 130.

[0066] The touch driving circuit 150 may provide a touch driving signal or detect a touch sensing signal through the touch line TL.

[0067] The touch driving circuit 150 may drive the touch electrode TE and transmit sensing data to a touch controller (not shown) according to the detected touch sensing signal. The touch controller may determine the presence and coordinates of a touch based on the sensing data.

[0068] Figure 2 The illustrated arrangement structure of the touch electrodes TE is a structure that can perform touch sensing by detecting a change in self-capacitance between a user's finger or pen and the touch electrodes TE due to a user's touch on the display panel 110 .

[0069] In some cases, the touch electrodes TE in the touch display device 100 may be arranged in a structure capable of performing touch sensing by detecting a change in mutual capacitance between the touch electrodes TE due to a user's touch.

[0070] Figure 3 is a diagram illustrating another example arrangement of touch electrodes TE included in the touch display device 100 according to the embodiment.

[0071] Reference Figure 3 , a plurality of X touch electrodes TE_x may be arranged on the display panel 110 . A plurality of Y touch electrodes TE_y may be arranged on the display panel 110 .

[0072] Among the plurality of X touch electrodes TE_x, the X touch electrodes TE_x adjacent to each other in one direction may be connected to each other. Therefore, among the plurality of X touch electrodes TE_x, the X touch electrodes TE_x located in the same row may be electrically connected to each other.

[0073] Among the plurality of Y touch electrodes TE_y, Y touch electrodes TE_y adjacent to each other in a direction crossing a direction in which the X touch electrodes TE_x are connected may be connected to each other. Thus, among the plurality of Y touch electrodes TE_y, Y touch electrodes TE_y located in the same column may be electrically connected to each other.

[0074] A portion connecting two adjacent X touch electrodes TE_x and a portion connecting two adjacent Y touch electrodes TE_y may cross each other. One of the portions connecting the X touch electrodes TE_x and the Y touch electrodes TE_y may be disposed on a layer different from a layer where the touch electrodes TE are arranged.

[0075] A plurality of X touch lines TL_x and a plurality of Y touch lines TL_y may be arranged on the display panel 110 .

[0076] The plurality of X touch lines TL_x may be independently electrically connected to the plurality of X touch electrodes TE_x electrically connected to each other. The plurality of Y touch lines TL_y may be independently electrically connected to the plurality of Y touch electrodes TE_y electrically connected to each other.

[0077] One of the X touch electrode TE_x and the Y touch electrode TE_y may be used as a touch driving electrode, and the other may be used as a touch sensing electrode. Therefore, a signal applied to the X touch electrode TE_x and a signal applied to the Y touch electrode TE_y during a touch sensing period may be different from each other.

[0078] For example, if the X touch electrode TE_x is a touch driving electrode, the touch driving circuit 150 may provide a touch driving signal to the X touch electrode TE_x through the X touch line TL_x. The touch driving circuit 150 may detect a touch sensing signal from the Y touch electrode TE_y serving as a touch sensing electrode through the Y touch line TL_y.

[0079] Alternatively, in some cases, a touch driving signal may be provided to the Y touch electrode TE_y, and a touch sensing signal may be detected from the X touch electrode TE_x.

[0080] The touch driving circuit 150 may detect a change in mutual capacitance between the X touch electrode TE_x and the Y touch electrode TE_y due to a user's touch using different signals applied to the X touch electrode TE_x and the Y touch electrode TE_y.

[0081] The touch controller may sense a user's touch on the display panel 110 based on a change in mutual capacitance detected by the touch driving circuit 150 .

[0082] In this way, the embodiment of the present disclosure may drive the touch electrodes TE and the touch lines TL disposed on the display panel 110 and sense a user's touch on the display panel 110 .

[0083] A plurality of touch pads TP may be provided on the display panel 110 for electrical connection between the touch lines TL and the touch driving circuit 150. Since a plurality of display pads DP for display driving are also provided on the display panel 110, it may not be easy to place the plurality of touch pads TP.

[0084] An embodiment of the present disclosure provides a method for efficiently arranging a plurality of touch pads TP provided because the touch display device 100 includes a touch sensing function.

[0085] Figure 4 is a diagram illustrating an example arrangement of display pads DP and touch pads TP in a touch display device 100 according to an embodiment.

[0086] Reference Figure 4 , the touch display device 100 may include a first substrate 200 and a second substrate 300 .

[0087] The first substrate 200 may be formed of, for example, a transparent material such as glass. Various circuit devices or light emitting elements for display driving may be disposed on the first substrate 200. In the present disclosure, the first substrate 200 may be referred to as a "display substrate."

[0088] The second substrate 300 may be formed of, for example, a transparent material such as glass. A color filter may be provided on the second substrate 300. A touch sensing layer TSL including a touch electrode TE and a touch line TL may be provided on one surface of the second substrate 300. In the present disclosure, the second substrate 300 may be referred to as a "touch substrate".

[0089] The thin film transistor layer 210 and the light emitting element layer 220 may be disposed on the first substrate 200 .

[0090] Circuit elements such as a thin film transistor or a capacitor included in the sub-pixel SP or a driving circuit, or various signal lines may be disposed on the thin film transistor layer 210 .

[0091] Each sub-pixel SP is disposed on the light emitting element layer 220 , and a light emitting element representing brightness depending on a supplied data voltage may be disposed on the light emitting element layer 220 .

[0092] Although the touch display device 100 is an organic light emitting display device as an example in the embodiment of the present disclosure, the pad structure according to the embodiment may also be applied to other display devices other than the organic light emitting display device, for example, a liquid crystal display (LCD) device.

[0093] At least one dam 500 may be disposed outside the light emitting element layer 220 .

[0094] The display area AA of the display panel 110 may be defined by the dam 500. In some cases, the dam 500 may be disposed in a position slightly away from the outer periphery of the display area AA.

[0095] The filling layer 400 may be disposed on the light emitting element layer 220 surrounded by the dam 500 .

[0096] The second substrate 300 may be disposed on the filling layer 400 and the dam 500 .

[0097] A color filter or a touch sensing layer TSL may be disposed on an upper surface or a lower surface of the second substrate 300 .

[0098] For example, the black matrix 310 may be disposed on the lower surface of the second substrate 300. The color filter layer 320 may be disposed on the lower surface of the second substrate 300. The overcoat 330 may be disposed on the black matrix 310 and the color filter layer 320. The overcoat 330 may provide a planarization function.

[0099] The touch sensing layer TSL may be located on or under the color filter.

[0100] After circuit elements and light emitting elements for display driving are disposed on the first substrate 200 , the second substrate 300 having a color filter and a touch sensing layer TSL is placed on the first substrate 200 , so that the touch display device 100 providing a touch sensing function can be easily implemented.

[0101] Pads for electrical connection to a driving circuit may be provided in a peripheral region of the touch display device 100 .

[0102] For example, a plurality of display pads DP may be disposed in the non-display area NA of the first substrate 200. In the present disclosure, the display pads DP may be referred to as 'first pads'.

[0103] The display pad DP may be, for example, a data pad electrically connected to the data driving circuit 130. The display pad DP may be bonded to the first printed circuit 610 on which the data driving circuit 130 is mounted, and may be electrically connected to the data driving circuit 130.

[0104] A plurality of touch pads TP may be disposed in the non-display area NA of the second substrate 300. In the present disclosure, the touch pads TP may be referred to as 'second pads'.

[0105] The touch pad TP may be electrically connected to the touch sensing layer TSL disposed on the lower surface of the second substrate 300. The touch pad TP may be electrically connected to the touch driving circuit 150 mounted on the second printed circuit 620.

[0106] The display pad DP and the touch pad TP may be located on the same side of the display panel 110. Figure 4 Therefore, it is possible to prevent the non-display area NA of the display panel 110 from increasing due to an increase in the number of pads provided on the display panel 110 .

[0107] However, if the thickness of the display panel 110 is reduced, the distance between the first substrate 200 and the second substrate 300 may be very short. Therefore, it may be difficult to dispose the display pad DP and the touch pad TP on the same side of the display panel 110.

[0108] In this case, the touch pad TP may be disposed on the upper surface of the second substrate 300 or may be disposed in a region different from the region where the display pad DP is located.

[0109] Figure 5 is a diagram illustrating an example process of the touch display device 100 according to an embodiment.

[0110] Figure 5 An example process for the touch display device 100 when the touch pad TP is provided in a region different from a region where the display pad DP is provided is illustrated.

[0111] exist Figure 5 In the illustrated example, since the touch sensing layer TSL may be disposed on an upper surface or a lower surface of the second substrate 300 , the touch sensing layer TSL is not illustrated for the sake of convenience.

[0112] The thin film transistor layer 210 and the light emitting element layer 220 may be disposed on the first substrate 200 .

[0113] The display pad DP may be disposed in the non-display area NA of the first substrate 200. The display pad DP may be electrically connected to the display signal line DSL, and may be electrically connected to a signal line or a circuit element in the display area AA through the display signal line DSL.

[0114] The filling layer 400 and the dam 500 may be disposed on the first substrate 200 , and the second substrate 300 on which the color filter and the touch sensing layer TSL are formed may be disposed on the first substrate 200 .

[0115] The touch pad TP may be disposed in the non-display area NA of the second substrate 300. The touch pad TP may be located in an area of ​​the non-display area NA that does not overlap with an area where the display pad DP is disposed, so as not to overlap with the display pad DP. Therefore, among the sides of the display panel 110, the side on which the display pad DP is disposed and the side on which the touch pad TP is disposed may be different from each other.

[0116] After the second substrate 300 is disposed, the first substrate 200 and the second substrate 300 may be cut, and the first printed circuit 610 on which the data driving circuit 130 is mounted may be coupled to the display pad DP.

[0117] In this case, the touch pad TP is located in a different region from the display pad DP and may be electrically connected to the touch driving circuit 150 .

[0118] Therefore, since the second substrate 300 on which the touch sensing layer TSL is formed may have the touch pads TP disposed thereon, but the area where the display pads DP are disposed is different from the area where the touch pads TP are disposed, the non-display area NA of the display panel 110 may increase.

[0119] According to an embodiment, there is provided a method for placing the touch pad TP on the side where the display pad DP is disposed among the sides of the display panel 110 in a structure in which the touch sensing layer TSL and the touch pad TP are formed on the second substrate 300 .

[0120] Figure 6 and Figure 7 is a diagram illustrating another example arrangement of display pads DP and touch pads TP in the touch display device 100 according to an embodiment.

[0121] Reference Figure 6 , the first substrate 200 may include at least one first groove G1 located in the non-display area NA of the display panel 110 , and the second substrate 300 may include at least one second groove G2 located in the non-display area NA of the display panel 110 .

[0122] A region adjacent to the first groove G1 in the non-display area NA of the first substrate 200 may be a first pad area PA1 in which the display pad DP is disposed.

[0123] A region adjacent to the second groove G2 in the non-display area NA of the second substrate 300 may be a second pad area PA2 in which the touch pad TP is disposed.

[0124] When the first substrate 200 and the second substrate 300 overlap each other, the first grooves G1 and the second grooves G2 may be alternately disposed.

[0125] Therefore, when the first substrate 200 and the second substrate 300 overlap each other, the first pad area PA1 and the second pad area PA2 may be alternately disposed.

[0126] When the first substrate 200 and the second substrate 300 are attached together, the first pad area PA1 of the first substrate 200 may overlap the second groove G2 of the second substrate 300. The first groove G1 of the first substrate 200 may overlap the second pad area PA2 of the second substrate 300.

[0127] Since the second substrate 300 is not located on the first pad area PA1, bonding between the display pad DP and the first printed circuit 610 on which the data driving circuit 130 is mounted may be easily performed.

[0128] In addition, since the first substrate 200 is not located on the second pad area PA2, bonding between the touch pad TP and the second printed circuit 620 on which the touch driving circuit 150 is mounted may be easily performed.

[0129] Figure 7 A plan view and a cross-sectional view of the first substrate 200 and the second substrate 300 attached together are illustrated.

[0130] In the structure in which the first substrate 200 and the second substrate 300 are attached together, the second substrate 300 may not be disposed on the display pads DP disposed on the first substrate 200. The first substrate 200 may not be disposed on the touch pads TP disposed on the second substrate 300.

[0131] The display pads DP and the touch pads TP may be arranged on the same side among the sides of the display panel 110 through a structure in which a substrate facing the display pads DP or the touch pads TP is not located on the display pads DP or the touch pads TP.

[0132] Therefore, according to an embodiment, the display pads DP and the touch pads TP may be arranged in the non-display area NA to facilitate bonding while preventing the non-display area NA of the display panel 110 from increasing.

[0133] According to an embodiment, there is provided a method for arranging the display pads DP and the touch pads TP on the same side among the sides of the display panel 110 without forming a plurality of grooves in the first substrate 200 and the second substrate 300 .

[0134] Figure 8is a diagram illustrating another example arrangement of display pads DP and touch pads TP in the touch display device 100 according to an embodiment. Fig. 9 This is an example of an embodiment according to Figure 8 FIG. 1 is a diagram of an example process of the touch display device 100 shown.

[0135] Reference Figure 8 , the thin film transistor layer 210 and the light emitting element layer 220 may be disposed on the first substrate 200 .

[0136] The filling layer 400 and the dam 500 may be located on the first substrate 200 .

[0137] A plurality of display pads DP may be disposed outside the dam 500 in the non-display area NA of the first substrate 200. The display pads DP may electrically connect the display signal line DSL and the data driving circuit 130.

[0138] A color filter and a touch sensing layer TSL may be disposed on one surface of the second substrate 300 .

[0139] Figure 8 An example is illustrated in which the color filter and the touch sensing layer TSL are disposed on the lower surface of the second substrate 300. Figure 8 An example in which the touch sensing layer TSL is formed of two layers including the first touch sensor metal TSM1 and the second touch sensor metal TSM2 is illustrated, but embodiments of the present disclosure are not limited thereto.

[0140] The black matrix 310 and the color filter layer 320 may be disposed on the lower surface of the second substrate 300. The overcoat layer 330 may be disposed on the black matrix 310 and the color filter layer 320.

[0141] The first touch sensor metal TSM1 may be disposed on the overcoat layer 330. The first touch sensor metal TSM1 located in the display area AA may be disposed in a region overlapping the black matrix 310. Therefore, the touch sensing layer TSL may be implemented without affecting image display.

[0142] The first protection layer 340 may be disposed on the first touch sensor metal TSM1 .

[0143] The second touch sensor metal TSM2 may be disposed on the first protection layer 340. The second touch sensor metal TSM2 located in the display area AA may be disposed in a region overlapping the black matrix 310.

[0144] The first touch sensor metal TSM1 and the second touch sensor metal TSM2 may be electrically connected to each other through a contact hole formed in the first protective layer 340 .

[0145] The first touch sensor metal TSM1 and the second touch sensor metal TSM2 may be a part of the touch electrode TE or a part of the touch line TL. In addition, the touch pad TP may be set using the first touch sensor metal TSM1 and the second touch sensor metal TSM2.

[0146] The touch pad TP may be located on the dam 500. The touch pad TP may be located on the overcoat 330 protruding outward from the second substrate 300. The touch pad TP may be located in a region where the second substrate 300 is not disposed.

[0147] When a portion of the outer cover layer 330 disposed on the lower surface of the second substrate 300, which is located in a region overlapping the second substrate 300, is a "first portion" and a portion of the outer cover layer 330 protruding outward from the second substrate 300 is a "second portion", the touch pad TP may be located in a recessed region of the second portion of the outer cover layer 330. The recessed region may be a region in which an upper surface thereof is lower than upper surfaces of other regions in the second portion of the outer cover layer 330, and may have a flat upper surface. For example, the touch pad TP may be filled in the recessed region.

[0148] Since the touch pad TP is located on the overcoat 330 and the second substrate 300 is not located on the touch pad TP, the touch pad TP may be exposed to the outside.

[0149] In addition, since the touch pad TP is located on the dam 500 in the region between the display area AA and the display pad DP, the touch pad TP may be located in a region not overlapping the display pad DP.

[0150] Therefore, even when the touch pad TP is located on the side of the display panel 110 on which the display pad DP is disposed among the sides of the display panel 110, bonding between the touch pad TP and the second printed circuit 620 on which the touch driving circuit 150 is mounted can be easily performed.

[0151] Figure 8 The illustrated arrangement of the touch pads TP may be formed by a process of removing a portion of the second substrate 300 after attaching the first substrate 200 and the second substrate 300 .

[0152] Reference Figure 8 and Fig. 9 , the first substrate 200 and the second substrate 300 are attached together, and a laser lift off (LLO) process may be performed on a portion of the second substrate 300. The region where the LLO process is performed may be a region including a region overlapping the touch pad TP.

[0153] Therefore, the sacrificial layer 700 may be disposed in a region including a region overlapping the touch pad TP on the lower surface of the second substrate 300 .

[0154] After the LLO process, a process of cutting the second substrate 300 may be performed.

[0155] Through the above process, the sacrificial layer 700 may be removed from the touch pad TP. The second substrate 300 may be removed from the touch pad TP. Therefore, the touch pad TP may be located in the recessed region of the overcoat layer 330 and exposed to the outside.

[0156] The sacrificial layer 700 may be disposed in consideration of a process margin. Therefore, after the LLO process and the process of cutting the second substrate 300 , the sacrificial layer 700 may remain in a partial region of the lower surface of the second substrate 300 .

[0157] The sacrificial layer 700 located in a partial region of the lower surface of the second substrate 300 may be exposed to the outside.

[0158] The overcoat layer 330 may be formed using the sacrificial layer 700 disposed on the lower surface of the second substrate 300. Thereafter, the sacrificial layer 700 may be removed.

[0159] Therefore, the thickness of the overcoat layer 330 located in the region overlapping the region where the sacrificial layer 700 is disposed may be smaller than the thickness of the overcoat layer 330 located in the region overlapping the second substrate 300 .

[0160] In addition, the touch pad TP located on the overcoat 330 may be located lower than the lower surface of the second substrate 300 .

[0161] As such, by removing a portion of the second substrate 300 after attaching the first and second substrates 200 and 300 to each other, an easier connection structure of the touch pad TP may be achieved while forming the touch sensing layer TSL on the lower surface of the second substrate 300 .

[0162] In addition, since the touch pad TP exposed by the LLO process needs to be supported by the lower structure, the touch pad TP may be located on the dam 500 .

[0163] Since a portion of the second substrate 300 is removed and the first and second substrates 200 and 300 are attached together to allow the touch pad TP to be located on the dam 500 , the touch pad TP may be exposed to the outside after the LLO process and the bonding process may be stably performed.

[0164] Furthermore, considering the characteristics of the LLO process, by placing the separate dam 500 instead of the dam 500 for sealing under the touch pad TP, the efficiency of the LLO process for the region where the touch pad TP is disposed may be increased.

[0165] Fig.10 is a diagram illustrating another example arrangement of display pads DP and touch pads TP in the touch display device 100 according to an embodiment.

[0166] Reference Fig.10 , the thin film transistor layer 210 and the light emitting element layer 220 may be disposed on the first substrate 200 .

[0167] A black matrix 310 , a color filter layer 320 , an overcoat layer 330 , a first touch sensor metal TSM1 , a first protective layer 340 , a second touch sensor metal TSM2 , and a second protective layer 350 may be disposed on the second substrate 300 .

[0168] The filling layer 400 may be disposed in a region between the first substrate 200 and the second substrate 300 including the display area AA.

[0169] The first dam 510 may be disposed between the first substrate 200 and the second substrate 300 to surround the outer surface of the filling layer 400. The second dam 520 may be located outside the first dam 510 between the first substrate 200 and the second substrate 300.

[0170] The first dam 510 may be, for example, a dam 500 provided to prevent moisture penetration.

[0171] The second dam 520 may be, for example, a dam 500 provided in order to increase efficiency of the LLO process performed on a portion of the second substrate 300 on the touch pad TP.

[0172] Therefore, the second dam 520 may be formed of a material having excellent heat resistance, rigidity, and adhesion compared to the first dam 510 located inside the second dam 520. In addition, the second dam 520 may be a material having a constant transmittance to achieve a process, curable, and capable of managing the width of a line that can be set by a dispensing process.

[0173] Second dam 520 may be disposed to contact an outer surface of first dam 510. In some cases, depending on the nature of the process, at least a portion of second dam 520 may be spaced apart from an outer surface of first dam 510. Thus, a space may exist between first dam 510 and second dam 520.

[0174] The touch pad TP may be located on the second dam 520. The second dam 520 may be disposed in a region wider than a region where the touch pad TP is disposed. The width of the second dam 520 may be greater than the length of the touch pad TP.

[0175] The LLO process may be performed in the region overlapping the second dam 520 .

[0176] The area where a portion of the second substrate 300 is removed may be narrower than the area overlapping the second dam 520. Therefore, the outer periphery of the second substrate 300 adjacent to the touch pad TP may be located on the area overlapping the second dam 520.

[0177] Since the second dam 520 having excellent heat resistance is disposed outside the first dam 510 and the LLO process is performed on the second dam 520 , it is possible to implement an arrangement structure for the touch pad TP and simultaneously improve efficiency and stability of the LLO process.

[0178] In addition, the process of forming the touch pad TP on the lower surface of the second substrate 300 may be performed in various ways.

[0179] Figures 11 to 14 is an example such as Fig.10 FIG. 1 is a diagram showing various example structures of a touch substrate included in the touch display device 100 .

[0180] For example, refer to Fig.11 , as in Fig.10 In the example shown, the color filter layer 320 is disposed on the lower surface of the second substrate 300, and then the touch sensing layer TSL may be formed.

[0181] In this case, the processing for the second substrate 300 can be performed in such a manner that the second substrate 300, the sacrificial layer 700, the black matrix (BM) 310, the color filter layer (CL) 320, the overcoat (OC) 330, the first touch sensor metal TSM1, the first protective layer (PAS1) 340, the second touch sensor metal TSM2 and the second protective layer (PAS2) 350 are sequentially arranged.

[0182] The touch pad TP may be provided by providing an overcoat layer 330 , forming a contact hole in the overcoat layer 330 , and providing a first touch sensor metal TSM1 .

[0183] Alternatively, the touch pad TP may be provided by forming a contact hole in the first protection layer 340 and providing the second touch sensor metal TSM2 after providing the first protection layer 340 .

[0184] As another example, refer to Fig.12 , the touch sensing layer TSL may be disposed on the lower surface of the second substrate 300 , and then the color filter layer 320 may be formed.

[0185] In this case, the processing for the second substrate 300 can be performed in such a manner that the second substrate 300, the sacrificial layer 700, the overcoat layer (OC) 330, the first touch sensor metal TSM1, the first protective layer (PAS1) 340, the second touch sensor metal TSM2, the second protective layer (PAS2) 350, the black matrix (BM) 310 and the color filter layer (CL) 320 are sequentially arranged.

[0186] The touch pad TP can be used as mentioned above Fig.11 The method described is set up in a similar manner.

[0187] As another example, refer to Fig.13 , in a structure in which the touch sensing layer TSL is first disposed on the lower surface of the second substrate 300 , the overcoat layer 330 may be partially disposed.

[0188] like Fig.13 In the illustrated example, the sacrificial layer 700 is disposed on the lower surface of the second substrate 300 , and the overcoat layer 330 may be disposed only in a partial region including a region where the touch pad TP is formed.

[0189] In this case, the processing for the second substrate 300 and the method for arranging the touch pads TP may be similar to the above-mentioned Fig.12 Describe the method to perform.

[0190] As another example, refer to Fig.14 , the overcoat layer 330 may not be disposed on the lower surface of the second substrate 300 .

[0191] In this case, the processing for the second substrate 300 can be performed in such a manner that the second substrate 300, the sacrificial layer 700, the first touch sensor metal TSM1, the first protection layer (PAS1) 340, the second touch sensor metal TSM2, the second protection layer (PAS2) 350, the black matrix (BM) 310 and the color filter layer (CL) 320 are sequentially arranged.

[0192] The touch pad TP may be formed in a process of disposing the first touch sensor metal TSM1 on the second substrate 300. Alternatively, the touch pad TP may be formed in a process of forming a contact hole in the first protection layer 340 and disposing the second touch sensor metal TSM2 after disposing the first protection layer 340.

[0193] The touch pad TP may be located on a portion of the insulating layer disposed on the lower surface of the second substrate 300 in which the first protective layer 340 protrudes outward from the second substrate 300 .

[0194] As in the above-described example, the process of forming the sacrificial layer 700 and the touch pad TP on the lower surface of the second substrate 300 may be performed in various ways. Figures 11 to 14 The described method can be applied even if a dam 500 is provided, such as Figure 8 As in the example shown.

[0195] After the second substrate 300 on which the touch pad TP is formed is attached to the first substrate 200 , a partial LLO process may be performed on the second substrate 300 to expose the touch pad TP to the outside.

[0196] Fig.15A and Fig. 15B is an example such as Fig.10 FIG. 1 is a diagram of an example process of the touch display device 100 shown.

[0197] Reference Fig.15A The filling layer 400, the first dam 510, and the second dam 520 are disposed on the first substrate 200 on which the display pad DP is formed. The second substrate 300 on which the touch pad TP is formed is attached to the first substrate 200.

[0198] After the first substrate 200 and the second substrate 300 are attached together, the LLO process is performed on a partial region of the second substrate 300. A portion of the sacrificial layer 700 located on the touch pad TP may be removed by the LLO process.

[0199] Reference Fig. 15B , after performing the LLO process, a process of cutting the first substrate 200 and the second substrate 300 may be performed.

[0200] The position where the first substrate 200 is cut may be located outside the region where the display pads DP are located on the first substrate 200. The position where the second substrate 300 is cut may be located inside the region where the touch pads TP are located on the second substrate 300.

[0201] As the second substrate 300 is cut, the second substrate 300 located in the region where the LLO process has been performed may be removed.

[0202] Therefore, the touch pad TP located in the region where the sacrificial layer 700 has been removed from the lower surface of the second substrate 300 may be exposed to the outside.

[0203] Since a portion of the second substrate 300 is removed, the second substrate 300 may not be disposed in a region overlapping the display pad DP disposed on the first substrate 200 .

[0204] Since the second substrate 300 is not located on the display pad DP, bonding between the display pad DP and the first printed circuit 610 on which the data driving circuit 130 is mounted may be easily performed.

[0205] Since the touch pad TP is located on the second dam 520, the touch pad TP may be located further inside than the display pad DP located on the first substrate 200. Therefore, the touch pad TP may be located in an area that does not overlap with an area in which the display pad DP is disposed. The touch pad TP may be located higher than the display pad DP.

[0206] Since the touch pad TP is disposed higher than the display pad DP in the region not overlapping the display pad DP and is exposed to the outside, bonding between the touch pad TP and the second printed circuit 620 on which the touch driving circuit 150 is mounted may be easily performed.

[0207] Therefore, according to an embodiment, a structure may be provided in which the display pads DP and the touch pads TP are disposed on the same side among the sides of the display panel 110 and bonding between the pads and a printed circuit mounted with a driving circuit may be easily performed.

[0208] The display pads DP and the touch pads TP may be disposed on the same side among the sides of the display panel 110 , and may be disposed in various structures according to types.

[0209] Figures 16 to 24 is a diagram illustrating an example connection structure between a plurality of pads arranged in the touch display device 100 and a driving circuit according to an embodiment.

[0210] Reference Fig.16 , Fig.16 (a) illustrates a plan view of a region where the display pads DP and the touch pads TP are disposed in the non-display region NA of the display panel 110 . Fig.16 (b) shows an example of a side view of Fig.16 (a) is a cross-sectional view of the structure.

[0211] The display pad DP may be disposed outside the dam 500 on the first substrate 200 .

[0212] The touch pad TP may be located on the dam 500. The touch pad TP may be located in a portion protruding outward from the second substrate 300 of any one of insulating layers such as the overcoat 330, the first protective layer 340, and the second protective layer 350 disposed on the lower surface of the second substrate 300.

[0213] The second substrate 300 may be located in a region other than a region where the display pads DP and the touch pads TP are disposed. Therefore, the display pads DP and the touch pads TP may be disposed to facilitate a bonding process.

[0214] The display pads DP and the touch pads TP may be alternately disposed.

[0215] The first printed circuit 610 on which the data driving circuit 130 is mounted may be electrically connected to the display pads DP on the first substrate 200 and the bonding pads BP of the source printed circuit board 800 .

[0216] The second printed circuit 620 on which the touch driving circuit 150 is mounted may be electrically connected with the touch pads TP on the dam 500 and the bonding pads BP of the source printed circuit board 800 .

[0217] The above structure may be formed by a process of simultaneously bonding the first and second printed circuits 610 and 620 to the bonding pads BP of the source printed circuit board 800 after performing a bonding process between the display pads DP and the first printed circuit 610 and a bonding process between the touch pads TP and the second printed circuit 620 .

[0218] Since the display pad DP and the touch pad TP are located at different heights in a region where the display pad DP and the touch pad TP do not overlap each other, bonding between the pad and the printed circuit may be easily performed.

[0219] In addition, since the touch pad TP is located between the display pad DP and the display area AA, the number of touch pads TP disposed on the display panel 110 may be increased. Therefore, a large-area touch display device 100 may be easily implemented.

[0220] Reference Fig.17 , the touch pad TP may be disposed between the display pad DP and the display area AA.

[0221] Since the touch pad TP is located on the dam 500 and does not impair the bonding process efficiency of the display pad DP, the touch pad TP may be entirely disposed between the display pad DP and the display area AA.

[0222] Therefore, the number of display pads DP and the number of touch pads TP disposed on the display panel 110 may increase.

[0223] In this case, the first printed circuit 610 and the second printed circuit 620 may be formed in an asymmetrical shape.

[0224] As an example, the width of the portion where the first printed circuit 610 is connected to the bonding pad BP may be smaller than the width of the portion where the first printed circuit 610 is connected to the display pad DP. The width of the portion where the second printed circuit 620 is connected to the bonding pad BP may be smaller than the width of the portion where the second printed circuit 620 is connected to the touch pad TP.

[0225] A portion of the first printed circuit 610 and a portion of the second printed circuit 620 may overlap each other.

[0226] Since the number of wirings connecting the driving circuit and the bonding pads BP of the source printed circuit board 800 may be smaller than the number of wirings connecting the driving circuit and the pads provided on the display panel 110, the printed circuits may be arranged as follows. Fig.17 The asymmetric structure shown.

[0227] In addition, since the number of display pads DP and the number of touch pads TP disposed on the display panel 110 increases, a large-area, high-resolution touch display device 100 may be easily implemented.

[0228] Furthermore, in some cases, one of the first printed circuit 610 and the second printed circuit 620 may completely overlap the other printed circuit.

[0229] Reference Fig.18 , the touch pad TP may be disposed between the display pad DP and the display area AA.

[0230] The first printed circuit 610 on which the data driving circuit 130 is mounted may be connected to the display pads DP disposed on the first substrate 200 , and may be connected to the bonding pads BP disposed on the source printed circuit board 800 .

[0231] The second printed circuit 620 on which the touch driving circuit 150 is mounted may be connected with the touch pads TP provided on the dam 500 , and may be connected with the bonding pads BP provided on the source printed circuit board 800 .

[0232] The second printed circuit 620 may be disposed to completely overlap the first printed circuit 610 .

[0233] Therefore, the number of printed circuits that may be disposed on the side of the display panel 110 may increase.

[0234] The data driving circuit 130 and the touch driving circuit 150 may be mounted on the same printed circuit. One printed circuit on which the data driving circuit 130 and the touch driving circuit 150 are mounted may be electrically connected to the display pad PD and the touch pad TP.

[0235] Reference Fig.19, the display pads DP may be disposed on the first substrate 200. The touch pads TP may be located on the dam 500. The display pads DP and the touch pads TP may be alternately disposed along the outer circumference of the display area AA.

[0236] The data driving circuit 130 and the touch driving circuit 150 may be mounted on the integrated printed circuit 630 .

[0237] The integrated printed circuit 630 may be electrically connected to the display pad DP. The integrated printed circuit 630 may be electrically connected to the touch pad TP. The integrated printed circuit 630 may be electrically connected to the bonding pad BP provided on the source printed circuit board 800.

[0238] Since the data driving circuit 130 and the touch driving circuit 150 are mounted on one integrated printed circuit 630, the number of processes for bonding the printed circuit mounted with the driving circuit to the display panel 110 can be reduced. Therefore, it is easier to form an electrical connection between the printed circuit mounted with the driving circuit and the pad provided on the display panel 110.

[0239] In addition, since the data driving circuit 130 and the touch driving circuit 150 are provided on the integrated printed circuit 630 , the data driving circuit 130 and the touch driving circuit 150 may be easily implemented in an integrated form.

[0240] Fig. 20 An example structure is illustrated in which the integrated driving circuit 160 in which the data driving circuit 130 and the touch driving circuit 150 are integrated is mounted on the integrated printed circuit 630 .

[0241] The integrated printed circuit 630 on which the integrated driving circuit 160 is mounted may be electrically connected to the display pads DP and the touch pads TP provided on the display panel 110. The integrated printed circuit 630 may be electrically connected to the bonding pads BP provided on the source printed circuit board 800.

[0242] Since the display pads DP and the touch pads TP are electrically connected to the single integrated printed circuit 630 , electrical connection between the driving circuits and the pads may be easily formed even when the data driving circuit 130 and the touch driving circuit 150 are integrated into the integrated driving circuit 160 .

[0243] In addition, according to an embodiment, by adjusting a structure in which wiring is provided on the integrated printed circuit 630 or implementing the integrated printed circuit 630 in multiple layers, the number of pads connected to the integrated printed circuit 630 may be increased.

[0244] Reference Fig.21, the display pad DP may be disposed on the first substrate 200. The touch pad TP may be disposed on the dam 500. The touch pad TP may be disposed between the display pad DP and the display area AA.

[0245] Since the touch pad TP is disposed between the display pad DP and the display area AA, the number of the touch pads TP disposed on the display panel 110 may increase. The number of the display pads DP disposed on the display panel 110 may also increase.

[0246] In this case, wirings connecting the touch driving circuit 150 and the touch pads TP may be provided in the integrated printed circuit 630 while avoiding the display pads DP.

[0247] Alternatively, the integrated printed circuit 630 may include a plurality of layers. A layer on which wirings electrically connecting the data driving circuit 130 and the display pads DP are disposed and a layer on which wirings electrically connecting the touch driving circuit 150 and the touch pads TP are disposed may be different from each other.

[0248] In this way, as the number of display pads DP and the number of touch pads TP disposed on the display panel 110 increases, a large-area, high-resolution touch display device 100 can be easily implemented.

[0249] By adjusting the positions at which the data driving circuit 130 and the touch driving circuit 150 are mounted on the integrated printed circuit 630 , the width of the integrated printed circuit 630 may be reduced.

[0250] Reference Fig. 22 , the data driving circuit 130 and the touch driving circuit 150 may be mounted on the integrated printed circuit 630. The data driving circuit 130 and the touch driving circuit 150 may be aligned and arranged in a direction crossing the outer periphery of the display panel 110.

[0251] Since the data driving circuit 130 and the touch driving circuit 150 are aligned and arranged, the width of the integrated printed circuit 630 may be reduced.

[0252] although Fig. 22 An example in which the data driving circuit 130 is located adjacent to the display panel 110 is illustrated, but the touch driving circuit 150 may be located adjacent to the display panel 110 in some cases.

[0253] If a large number of pads are not required, the area in which the integrated printed circuit 630 is disposed may be reduced by arranging the data driving circuit 130 and the touch driving circuit 150 on a line crossing the outer periphery of the display panel 110 .

[0254] In this case, if Fig.23As shown, the integrated driving circuit 160 integrating the data driving circuit 130 and the touch driving circuit 150 may be mounted on the integrated printed circuit 630 .

[0255] The bonding pads BP connected to the integrated printed circuit 630 may be disposed in a plurality of rows like the display pads DP and the touch pads TP, but the bonding pads BP may be disposed in a single row in some cases.

[0256] Reference Fig.24 The integrated printed circuit 630 may be electrically connected to the display pads DP and the touch pads TP. The integrated printed circuit 630 may be electrically connected to the bonding pads BP provided on the source printed circuit board 800.

[0257] The bonding pads BP may be disposed in a single row on the source printed circuit board 800 .

[0258] The signal provided from the source printed circuit board 800 to the integrated driving circuit 160 mounted on the integrated printed circuit 630 is a digital signal, and the number of wirings for signal transmission may not be large. Therefore, by arranging the bonding pads BP provided on the source printed circuit board 800 in a single row, the process of bonding the integrated printed circuit 630 to the source printed circuit board 800 can be facilitated.

[0259] The structure in which the bonding pads BP are arranged in a single row can also be applied to Fig.21 The structure shown.

[0260] As described above, since the touch pad TP is located at a different height from the display pad DP in the region not overlapping the display pad DP, the printed circuit bonded to the pad may have various arrangement structures.

[0261] According to the embodiments set forth above, by providing a structure in which the display pads DP and the touch pads TP can be arranged on the same side among the sides of the display panel 110, an increase in the non-display area NA of the display panel 110 can be prevented and easier arrangement of various pads can be allowed.

[0262] According to an embodiment, a structure in which the touch pad TP is exposed to the outside may be formed through a process of removing a portion of the second substrate 300 on which the touch sensing layer TSL is formed.

[0263] Therefore, it is possible to provide a structure in which the touch pad TP is located in a region that does not overlap with a region in which the display pad DP is disposed and is located higher than the display pad DP.

[0264] This structure facilitates bonding between the pads and a printed circuit on which a driving circuit is mounted, and increases the number of pads that can be provided on the display panel 110 , thereby making it possible to easily implement a large-area or high-resolution touch display device 100 .

[0265] The above description is given to enable those skilled in the art to implement and use the technical ideas of the present disclosure, and is provided in the context of specific applications and their requirements. Various modifications, additions and substitutions to the described embodiments will be apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the present disclosure. The above description and accompanying drawings provide examples of the technical ideas of the present disclosure for illustrative purposes only. That is, the disclosed embodiments are intended to illustrate the scope of the technical ideas of the present disclosure. Therefore, the scope of the present disclosure is not limited to the embodiments shown, but conforms to the widest scope consistent with the claims. The scope of protection of the present disclosure should be interpreted based on the attached claims, and all technical ideas within the scope of their equivalents should be interpreted as included within the scope of the present disclosure.

[0266] CROSS-REFERENCE TO RELATED APPLICATIONS

[0267] This application claims priority to Korean Patent Application No. 10-2020-0156642, filed on November 20, 2020, which is hereby incorporated by reference for all purposes as if fully set forth herein.

Claims

1. A touch display device, comprising: a first substrate, the first substrate comprising a display area and a non-display area located outside the display area; a plurality of first pads, the plurality of first pads being arranged in the non-display area on the first substrate; at least one dam, the at least one dam being located between the plurality of first pads and the display area on the first substrate; a second substrate located on the at least one dam and the first substrate and located in a region other than at least a portion of a region overlapping the at least one dam, a plurality of touch electrodes being provided on a surface of the second substrate; as well as A plurality of second pads are located on the at least one dam and are electrically connected to at least one touch electrode among the plurality of touch electrodes.

2. The touch display device according to claim 1, wherein: The plurality of first pads and the plurality of second pads are located on a same side among sides of the non-display area.

3. The touch display device according to claim 1, wherein: The plurality of second pads are located in a region excluding a region overlapping with the second substrate.

4. The touch display device according to claim 1, wherein: Upper surfaces of the plurality of second pads are located lower than a lower surface of the second substrate.

5. The touch display device according to claim 1, wherein: The at least one dam comprises: a first dam, the first dam being located outside the display area; and A second dam is located outside the first dam and is disposed under the plurality of second pads.

6. The touch display device according to claim 5, wherein: A width of the second dam is greater than a length of each of the plurality of second pads.

7. The touch display device according to claim 5, wherein: An outer periphery of the second substrate disposed adjacent to the plurality of second pads is located in a region overlapping the second dam.

8. The touch display device according to claim 5, wherein: At least a portion of the second dam is spaced apart from the first dam.

9. The touch display device according to claim 1, further comprising a filling layer disposed between the first substrate and the second substrate, wherein: The at least one dam is arranged to surround the filling layer. 10 . The touch display device according to claim 1 , further comprising a sacrificial layer disposed in a partial area on the lower surface of the second substrate.

11. The touch display device according to claim 10, wherein: The sacrificial layer is located between the display area and the plurality of second pads.

12. The touch display device according to claim 10, wherein: A portion of the sacrificial layer is exposed to the outside.

13. The touch display device according to claim 1, further comprising an insulating layer, wherein the insulating layer comprises: a first portion disposed in at least a partial area on a lower surface of the second substrate; as well as The second part is connected to the first part, is located outside the second substrate, and has a recessed area, and the plurality of second pads are located in the recessed area.

14. The touch display device according to claim 13, wherein: The second portion has a thickness that is less than a thickness of at least a portion of the first portion.

15. The touch display device according to claim 1, further comprising an insulating layer, a black matrix and a color filter layer disposed on a lower surface of the second substrate, in, The insulating layer has a recessed area, and the plurality of second pads are formed in the recessed area.

16. The touch display device according to claim 15, wherein: The black matrix and the color filter layer are disposed between the lower surface of the second substrate and the insulating layer, and The insulating layer is disposed between the lower surface of the second substrate and the plurality of touch electrodes.

17. The touch display device according to claim 15, wherein: The black matrix and the color filter layer are disposed under the insulating layer and the plurality of touch electrodes.

18. The touch display device according to claim 15, wherein: At least a portion of the plurality of touch electrodes is disposed between a lower surface of the second substrate and the insulating layer.

19. The touch display device according to claim 1, wherein: The plurality of first pads and the plurality of second pads are alternately arranged along an outer circumference of the first substrate.

20. The touch display device according to claim 1, wherein: The plurality of second pads are located between the display area and the plurality of first pads.

21. The touch display device according to claim 1, further comprising: at least one first printed circuit, the at least one first printed circuit being electrically connected to the plurality of first pads; as well as At least one second printed circuit is electrically connected to the plurality of second pads and has a portion overlapping the first printed circuit.

22. A touch display device, comprising: a first substrate, the first substrate comprising a display area and a non-display area located outside the display area; a plurality of first pads, the plurality of first pads being arranged in the non-display area on the first substrate; a plurality of second pads, the plurality of second pads being located between the plurality of first pads and the display area on the first substrate and being located higher than the plurality of first pads; as well as A second substrate is located in an area other than an area where the plurality of second pads are arranged on the first substrate and is located higher than the plurality of second pads, and a plurality of touch electrodes are provided on a surface of the second substrate and are electrically connected to the plurality of second pads.

23. A touch display device, comprising: A display substrate, the display substrate comprising a display area and a non-display area outside the display area; A touch substrate, wherein the touch substrate is located on the display substrate, and a plurality of touch electrodes are arranged on a surface of the touch substrate; as well as an insulating layer, the insulating layer comprising a first portion disposed in at least a portion of a lower surface of the touch substrate and a second portion connected to the first portion, the second portion being located outside the touch substrate and having a recessed area, a plurality of touch pads being located in the recessed area, The plurality of touch pads are electrically connected to at least one touch electrode among the plurality of touch electrodes.

24. The touch display device according to claim 23, wherein: At least a portion of an outer periphery of the insulating layer is located between an outer periphery of the display substrate and an outer periphery of the touch substrate. 25 . The touch display device according to claim 24 , further comprising a plurality of display pads located between an outer periphery of the insulating layer and an outer periphery of the display substrate.

26. A touch display device, comprising: a first substrate, the first substrate comprising a display area and a non-display area located outside the display area; at least one dam, the at least one dam being arranged on the first substrate in the non-display area to define the display area; a second substrate located on the at least one dam and the first substrate and located in a region other than at least a portion of a region overlapping the at least one dam, a plurality of touch electrodes being provided on a surface of the second substrate; as well as A plurality of touch pads are located on the at least one dam and are electrically connected to at least one touch electrode among the plurality of touch electrodes.

27. The touch display device according to claim 26, further comprising a plurality of display pads, wherein the plurality of display pads are arranged in the non-display area on the first substrate, in, The at least one dam is located between the plurality of display pads and the display area.

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