Display panel manufacturing method, display panel and display device

Abstract

The present invention discloses a method for preparing a display panel, a display panel and a display device, wherein the display panel includes a test touch area, the test touch area is located between the edge of the display panel and the peripheral circuit of the display panel, and the test touch area includes a polyimide film layer, a backplane inorganic layer, a buffer base layer, a touch metal layer and a touch insulation layer arranged in sequence, wherein the touch metal layer is provided with a plurality of touch metal wires connected to the peripheral circuit, and the touch metal wires are used to transmit test signals to realize the test of the peripheral circuit or the display panel. The present invention can solve the technical problem that the panel short circuits during laser cutting in the existing display panel.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a method for preparing a display panel, a display panel and a display device. Background Art

[0002] In the production process of display panel (PNL), laser trimming is required to cut the display panel motherboard. In the laser trimming process, the touch panel (TP) leads at the cutting position are all gate lines (Gate).

[0003] like Figure 1 A possible structural diagram of a display panel is shown. Figure 1 The display panel shown includes a polyimide film layer 101 (polyimide, PI), an inorganic layer 102 formed with a plurality of gate wirings 1021 (Gate), a passivation layer 103 and an insulating layer 104. As shown in the figure, the gate wiring Gate is relatively close to the polyimide film layer, usually about 1 micron (um). During the cutting process, polyimide carbides are easily aggregated to form a conductive channel, which in turn causes the gate wiring to short-circuit, thereby causing the panel to short-circuit. Summary of the invention

[0004] The embodiments of the present invention provide a method for manufacturing a display panel, a display panel and a display device, thereby solving the technical problem that a short circuit may occur in the panel during laser cutting in the prior art display panel.

[0005] On the one hand, the present invention provides a display panel through an embodiment of the present invention, wherein the display panel includes a test touch area, wherein the test touch area is located between the edge of the display panel and the peripheral circuit of the display panel, and the test touch area includes a substrate, a backplane inorganic layer, a buffer base layer, a touch metal layer and a touch insulation layer arranged in sequence, wherein the touch metal layer is provided with a plurality of touch metal wires connected to the peripheral circuit, and the touch metal wires are used to transmit test signals to realize the testing of the display panel.

[0006] Optionally, the touch metal wire is provided with an opening.

[0007] Optionally, the openings on two adjacent touch metal wires are arranged in a staggered manner.

[0008] Optionally, the touch metal layer is a multi-layer metal structure.

[0009] Optionally, the touch metal layer is a titanium-aluminum-titanium structure.

[0010] Optionally, the display panel further includes:

[0011] The display area includes a buffer layer, a first metal layer, an insulating layer, a second metal layer and a protective layer which are stacked, wherein the first metal layer and the touch metal layer are the same film layer, and the touch metal layer is used to transmit the test signal to realize the test of the display area.

[0012] Optionally, the peripheral circuit of the display panel is located in the peripheral circuit area of ​​the display panel, and the peripheral circuit area includes a buffer layer, a first metal layer, an insulating layer, a second metal layer and a protective layer that are stacked, wherein the first metal layer and the touch metal layer are the same film layer, and the touch metal layer is used to transmit the test signal to realize the test of the peripheral circuit.

[0013] On the other hand, the present invention provides a display device according to an embodiment of the present invention. The display device includes the display panel as described above.

[0014] On the other hand, the present invention provides a method for manufacturing a display panel according to an embodiment of the present invention, the method comprising:

[0015] sequentially growing a backplane inorganic layer and a buffer base layer on the substrate;

[0016] growing a touch metal layer on the buffer base layer;

[0017] Etching the touch metal layer to obtain a plurality of touch metal lines;

[0018] A touch insulating layer is grown on the plurality of touch metal lines to obtain a test touch area; wherein the test touch area is located between the edge of the display panel and the peripheral circuit of the display panel.

[0019] Optionally, after etching the touch metal layer to obtain a plurality of touch metal lines, the method further includes:

[0020] Punching is performed on each of the touch metal wires to obtain an opening on each of the touch metal wires.

[0021] Optionally, punching each of the touch metal wires includes:

[0022] Each of the touch metal lines is punched using an overlapping punching process, wherein the openings on two adjacent touch metal lines are arranged in a staggered manner.

[0023] Optionally, the method further comprises:

[0024] According to the opening on each of the touch metal lines, the display panel is cut along the edge line of the test touch area to remove the test area of ​​the display panel.

[0025] Optionally, growing a touch metal layer on the buffer base layer includes:

[0026] A multi-layer metal structure is grown on the buffer base layer to serve as the touch metal layer.

[0027] Optionally, growing a multilayer metal structure on the buffer base layer comprises:

[0028] A multilayer metal structure of titanium-aluminum-titanium structure is grown on the buffer substrate layer.

[0029] One or more technical solutions provided in the embodiments of the present invention have at least the following technical effects or advantages: The present invention provides a display panel, the display panel includes a test touch area, the test touch area is located between the edge of the display panel and the peripheral circuit of the display panel, the test touch area includes a substrate, a backplane inorganic layer, a buffer base layer, a touch metal layer and a touch insulation layer arranged in sequence, wherein the touch metal layer is provided with a plurality of touch metal wires connected to the peripheral circuit, and the touch metal wires are used to transmit test signals to implement the test of the peripheral circuit or the display panel. In the above scheme, a test touch area is newly set in the display panel, and the test touch area is located between the edge of the display panel and the peripheral circuit of the display panel, so that the gate wiring in the backplane inorganic layer is replaced by the touch metal layer in the prior art to transmit the test signal, effectively increasing the distance between the substrate (such as the PI layer) and the touch metal layer in the display panel, and reducing the probability / proportion of the panel short circuit caused by the bottom PI carbide aggregation overlapping the touch metal layer during laser cutting, thereby facilitating the improvement of the panel yield. At the same time, the technical problem of short circuit of the panel during laser cutting in the existing display panel is also solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0031] Figure 1 It is a structural schematic diagram of a display panel provided by the prior art.

[0032] Figure 2 It is a plan view schematic diagram of a display panel provided by the prior art.

[0033] Figure 3 It is a schematic diagram of a laser cutting scene provided by the prior art.

[0034] Figure 4 It is a schematic diagram of a panel structure before and after laser cutting provided by the prior art.

[0035] Figure 5 It is a schematic diagram of the structure of a display panel provided by an embodiment of the present invention.

[0036] Figure 6 It is a schematic diagram of the structure of another display panel provided by an embodiment of the present invention.

[0037] Figure 7 It is a structural schematic diagram of a display area provided by an embodiment of the present invention.

[0038] Figure 8 It is a structural schematic diagram of a peripheral circuit area provided by an embodiment of the present invention.

[0039] Fig. 9 It is a structural schematic diagram of a test touch area provided by an embodiment of the present invention.

[0040] Fig.10 Schematic diagram of a touch metal wire provided by an embodiment of the present invention.

[0041] Fig.11 It is a schematic flow chart of a method for preparing a test touch area provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0042] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0043] First of all, the term "and / or" in this article is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0044] In the process of proposing the present invention, the inventors also found that: when the panel is laser cut, the touch panel leads at the cutting position are all gate lines, and the distance between the gate line and the polyimide film layer is relatively close, usually 1.07um. In this way, polyimide carbides are easily aggregated to cause the gate line to short-circuit, thereby causing the panel to short-circuit (TP short), and then causing the flexible multi-layer structure (Flexible Multi-Layer On Cell, FMLOC) module project to be defective, affecting the client quality. Figure 2-Figure 4 This article introduces the specific reasons why short circuits occur in display panels during laser cutting.

[0045] See also Figure 2 A possible plan view of a display panel is shown. Figure 2 In the figure, before laser cutting, the display panel includes a test area, which can also be called a test unit (cell test, ET), a gate wiring area (Gate area in the figure) and a bonding area (FPC On Pad, FOP). Among them, the area marked by the dotted line in the figure is the gate wiring area, which is also the cutting groove during laser cutting, and can also be called a laser cutting (trimming) area.

[0046] See also Figure 3 A schematic diagram of a possible laser cutting scenario is shown in FIG. Figure 3 In the figure, the horizontal line indicates the cutting position when the laser cuts the display panel. When the laser cuts the display panel, if the laser is interrupted, that is, the laser will disappear after being interrupted, the display panel will not be cut continuously. Figure 3 shown.

[0047] Please also see Figure 4 FIG. 1 shows a schematic diagram of a panel structure before and after laser cutting. Figure 4 Before laser cutting, the binding area is not pressed, and the polyimide carbide is freely distributed. The black dots in the figure represent polyimide carbide, and the line segments represent gate traces. When laser cutting is used, after the binding area is pressed, the polyimide carbide will gather to form a conductive channel as shown in the figure, which will cause the trace to short-circuit, thereby causing the display panel to short-circuit, increasing the defective rate of the display panel.

[0048] In order to solve the above problems, the present invention provides a display panel, a display device and a method for manufacturing the same. Figure 5 , is a schematic diagram of the structure of a display panel provided by an embodiment of the present invention. Figure 5 The display panel 5 shown includes: a display area 10, a peripheral circuit area 20, a test touch area 30, and an edge (also referred to as an edge line) 40 of the display panel 5. The display area 10 is used for image display of the display panel 5, and a device for image display such as a pixel array is provided in the display area 10. The shape and size of the display area 10 are not limited in the present invention, and can be set according to the actual needs of the user or the system. The figure shows the display area 10 as a rectangle, but it does not constitute a limitation.

[0049] The peripheral circuit area 20 includes one or more peripheral circuits, and the peripheral circuit is a circuit arranged around the display area 10. For example, the peripheral circuit area 20 shown in the figure can be a circuit area arranged on the four sides of the display area 10. The peripheral circuit includes but is not limited to a driving circuit for driving the display panel 5 to work, a control circuit for controlling the display of the display area 10, etc.

[0050] The test touch area 30 is disposed between the edge line 40 of the display panel 5 and the peripheral circuit. The edge line 40 may be any one or more edge lines of the display panel 5, which is determined by the shape of the display panel 5 and actual needs of the user. For example, the display panel 5 is rectangular as an example, and the test touch area 30 may be disposed between the lower edge line 40 of the display panel 5 and the peripheral circuit. The illustration is only an example, but does not constitute a limitation.

[0051] Please also see Figure 6 , is a schematic diagram of the structure of another display panel provided in an embodiment of the present application. Figure 6 The display panel shown is applied to the FMLOC project. The display panel also includes a display area 10, a peripheral circuit area 20 and a test touch area 30. The specific details can be referred to above. Figure 5 The relevant introduction in the embodiment is not repeated here. Among them, the display area 10 can also be called an active area (AA). The peripheral circuit area 20 can also be called an edge area, which specifically includes one or more peripheral circuits 201 arranged around the display area 10. One end of each peripheral edge 201 is electrically connected to a corresponding device (such as a transistor or other device) in the display area 10, and the other end is connected to a driver integrated circuit (IC). The driver integrated circuit (also referred to as a driver circuit) is also arranged in the peripheral circuit area 20 of the display panel. The test contact area 30 is located between the edge of the display panel and the peripheral circuit area 20 of the display panel. The figure is only an example but does not constitute a limitation. In actual applications, the shape, size and position of the test touch area 30 can be determined according to actual needs, and the present invention does not limit it.

[0052] See also Figure 7 A cross-sectional schematic diagram of a possible display area is shown. Figure 7The display area 10 shown includes a buffer layer 701, a first metal layer 702, an insulating layer 703, a second metal layer 704 and a protective layer 705 which are stacked, wherein the first metal layer 702 and the touch metal layer 34 in the test touch area 30 are the same film layer, and the touch metal layer is used to transmit an external input test signal to implement the test of the display area, which is described in detail below. In practical applications, a substrate, a transistor layer, a pixel layer and an encapsulation layer (EN) are stacked in sequence below the buffer layer 701, which are not shown in the figure. The material of the substrate is not limited in the present invention, for example, it can be a silicon material or a polyimide film material. The transistor layer is a film layer used to prepare the transistor in the display panel. The pixel layer is a film layer used for pixel display in the display panel. The encapsulation layer can be specifically an inorganic layer, and its film layer material includes but is not limited to inorganic materials such as silicon oxide or silicon nitride.

[0053] In practical applications, the present invention can sequentially grow a buffer layer 701 and a first metal layer 702 on the packaging layer. The buffer layer 701 can also be called a buffer base layer (Touch Barrier Layer, TBL). Further, the present invention patterns the first metal layer 702 by photolithography technology, and then grows a touch insulating layer 703 (Touch insulator, TLD). Then, the insulating layer 703 is patterned by photolithography or punching to form a columnar structure at both ends of the first metal layer 702. The pre-matched metal substance is filled in the columnar structure, and a second metal layer 704 is grown on the insulating layer 703, wherein the material of the second metal layer is the same as the material of the filled metal substance and together constitutes the second metal layer 704. Finally, the second metal layer 704 is photolithographically and patterned, and a protective layer 705 (TOC) is grown on the processed second metal layer 704.

[0054] The first metal layer 702 may also be referred to as a TMA (Touch Metal A) layer, and the second metal layer 703 may also be referred to as a TMB (Touch Metal B) layer. The film materials of the first metal layer 702 and the second metal layer 703 may be the same or different, and the present invention does not limit this. Typically, the film materials of the first metal layer 702 and the second metal layer 703 are the same, such as a copper metal layer.

[0055] See also Figure 8 FIG. 4 is a cross-sectional view of a possible peripheral circuit area. Figure 8The peripheral circuit area 20 shown includes a stacked packaging layer (not shown), a buffer layer 801, a first metal layer 802, an insulating layer 803, a second metal layer 804 and a protective layer 805, wherein the first metal layer 802 and the touch metal layer 34 in the test touch area 30 are the same film layer, and the touch metal layer is used to transmit an external input test signal to implement the test of the peripheral circuit, which is described in detail below. The various film layers in the peripheral circuit area 20 can be referred to the aforementioned Figure 7 The introduction of the corresponding film layers will not be repeated here.

[0056] In practical applications, the target film layer in the peripheral circuit area 20 and the target film layer with the same name in the display area 10 in the same display panel are the same film layer, and the target film layer can be specifically any one of the following: a buffer layer, a first metal layer, an insulating layer, a second metal layer and a protective layer, for example Figure 7 The buffer layer 701 and Figure 8 The buffer layer 801 in is the same / same film layer, etc.

[0057] like Figure 8 As shown, in a specific implementation, the present invention can grow a buffer layer 801 and a first metal layer 802 on the packaging layer. Further, the present invention patterns the first metal layer 802 by photolithography technology, and then grows a touch insulating layer 803. Then, the insulating layer 803 is patterned by photolithography or punching to expose the surface of the first metal layer 802 and form a corresponding columnar structure on its surface. The columnar structure is filled with a pre-configured metal substance to form the second metal layer 804. Finally, a protective layer 805 is grown on the second metal layer and the insulating layer 803. For the content not introduced in the embodiments of the present invention, please refer to the aforementioned Figure 7 The relevant introduction in the embodiments will not be repeated here.

[0058] See also Fig. 9 A possible structural diagram of a test touch area is shown. Fig. 9 In the embodiment, the test touch area 30 includes a substrate 31, a backplane inorganic layer 32, a buffer base layer (TBL) 33, a touch metal layer 34 and a touch insulator (TLD) 35 which are sequentially arranged. The material of the substrate 31 is not limited. For example, the substrate 31 can be a polyimide film layer (PI layer) made of a polyimide film material.

[0059] The backplane inorganic layer 32 refers to a film layer that acts as a metal isolation / insulation, which may include inorganic film layers such as an interlayer dielectric layer (ILD), a buffer layer (buffer layer), a barrier layer (barrier layer) and a passivation layer (PVX), and may optionally include a gate insulating layer (GI), which can be determined according to the actual needs of the user or the system, and the present invention does not limit it. The present invention does not limit the arrangement order of these inorganic film layers, which can be determined according to actual needs, for example, in the following order: ILD, GI, buffer, barrier and PVX. The material of these inorganic film layers can be silicon nitride, silicon oxide or other materials that support metal layer isolation, etc., which are not limited by the present invention. The material of the buffer base layer 33 is also not limited by the present invention, for example, it can also be silicon nitride, used for touch control / touch base, etc.

[0060] The touch metal layer 34 includes / is provided with a plurality of touch metal wires 340, which may also be referred to as a touch metal TMA (Touch Metal A) structure. The present invention does not limit the number and cross-sectional shape of the touch metal wires 340. For example, the cross-sectional shape of the touch metal wires in the figure may be a trapezoid. The touch metal wires 340 act as signal transmission lines. Each of the touch metal wires 340 is electrically connected to the peripheral circuit 201 and may be used to transmit a test signal to complete the test of the peripheral circuit 201 or the display panel 5 based on the test signal. Specifically, for example, the test signal may be used to test whether the display panel 5 is disconnected or short-circuited, which is not limited by the present invention.

[0061] It should be noted that, when preparing the same display panel 5, the buffer substrate layer of the present invention is different from the above-mentioned embodiment of the present invention (for example Figure 7 or Figure 8 The buffer layer in the embodiment) may be the same or the same film layer, the touch metal layer and the first metal layer in the above embodiment of the present invention are the same film layer, and the touch insulating layer and the insulating layer in the embodiment of the present invention are the same film layer, and the present invention does not limit this.

[0062] In practical applications, one end of each of the touch metal wires 340 is connected to the peripheral circuit 201, and the other end of the touch metal wire 340 needs to be described in different situations. Specifically, before the display panel 5 is shipped out of the factory, the other end of the touch metal wire 340 is connected to the test area ET on the substrate (referred to as the panel substrate) where the display panel 5 is located. When the display panel 5 is shipped out of the factory, the ET part on the panel substrate will be cut off by laser, and at this time, the other end of the touch metal wire 340 can be coated with packaging glue.

[0063] In an optional embodiment, the touch metal layer 34 may be a single-layer metal structure or a multi-layer metal structure. Preferably, the touch metal layer 34 is a multi-layer metal structure. The metal material used in each metal layer of the multi-layer metal structure is not limited in the present invention. For example, it may include but is not limited to copper Cu, aluminum Al, silver Ag, nickel Ni, cobalt Co or other metal materials. Optionally, the touch metal layer 34 may have a three-layer metal structure, such as titanium-aluminum-titanium (Ti / AL / Ti) or cobalt-aluminum-cobalt (Mo / AL / Mo), etc., which is not limited in the present invention.

[0064] In an alternative embodiment, see Fig.10 FIG. 3 is a schematic diagram showing a possible structure of a touch metal line 340 on a touch metal layer 34. Fig.10 In the embodiment, each of the touch metal wires 340 is provided with an opening 341, and the number and shape of the openings 341 are not limited by the present invention. In other words, the number of openings provided in each of the touch metal wires 340 is not limited, and they can be the same or different; the shape of each of the openings 341 can be, for example, a diamond, a circle, an ellipse, or other user-defined shapes, and the present invention does not limit this. The figure only uses 4 touch metal wires 340 and each of the touch metal wires 340 is provided with a diamond-shaped opening 341 as an example, but it does not constitute a limitation.

[0065] Further optionally, the openings 341 on two adjacent touch metal wires 340 are arranged in a staggered manner, in other words, the corresponding opening positions of the openings 341 on two adjacent touch metal wires 340 do not overlap or are different. Fig.10 In the example, three openings 341 are set on the first touch metal line, and four openings 341 are set on the second touch metal line. These seven openings 341 do not overlap each other in position, that is, they are arranged in a staggered manner. This makes it easy to cut the test area ET on the substrate where the display panel is located using a laser according to the openings (i.e., the opening positions) in each of the touch metal lines 340 when the display panel 5 is shipped out of the factory, thereby obtaining the final display panel 5 that can be shipped out of the factory.

[0066] It is understandable that since the opening positions on each of the touch metal wires 340 are arranged in a staggered manner, the opening positions on the touch metal wires 340 can be cut during laser cutting, thereby reducing panel cutting resistance, reducing laser cutting difficulty, and helping to improve product competitiveness.

[0067] By implementing the embodiment of the present invention, the present invention adds a test touch area between the panel edge line and the peripheral circuit in the display panel, and adopts a touch metal line (specifically a TMA structure) design in the test touch area, which will increase the distance between the PI layer and the touch metal layer (TMA) in the display panel. Usually, the distance can reach 2.15um, thereby reducing the panel short circuit caused by the bottom PI carbide contacting the touch metal layer, which is beneficial to improving the panel yield and product quality. And staggered openings are set on each of the touch metal lines to ensure that the opening position can be cut during laser cutting, reducing the difficulty of laser cutting.

[0068] See also Fig.11 , is a schematic flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention. Fig.11 The method shown is applied as above Figure 5-Figure 10 In the display panel 5 described in the embodiment, the method includes the following implementation steps:

[0069] S1101 , sequentially growing a backplane inorganic layer 32 and a buffer base layer (TBL layer) 33 on a substrate 31 .

[0070] In a specific implementation, the present invention may provide a substrate 31, on which a backplane inorganic layer 32 is grown, and on which a buffer base layer 33 is grown. The backplane inorganic layer 32 may also have multiple inorganic layers grown in sequence, for example, the backplane inorganic layer 32 may include inorganic layers such as ILD, buffer, barrier and PVX, which are not limited by the present invention. Figure 5-Figure 10 The relevant introduction or description in will not be repeated here.

[0071] S1102 , growing a touch metal layer 34 on the buffer base layer 33 .

[0072] In the present invention, a touch metal layer 34 may be grown on the buffer base layer 33. Optionally, the touch metal layer 34 may be a single-layer metal structure or a multi-layer metal structure. Preferably, the touch metal layer 34 is a multi-layer metal structure, for example, it has a multi-layer metal structure such as titanium-aluminum-titanium (Ti / AL / Ti) or cobalt-aluminum-cobalt (Mo / AL / Mo), but the present invention is not limited thereto.

[0073] In a specific embodiment, the present invention can grow a multi-layer metal structure on the buffer base layer to serve as the touch metal layer. Specifically, for example, the present invention can grow a multi-layer metal structure of titanium-aluminum-titanium structure on the buffer base layer.

[0074] S1103 , etching the touch metal layer 34 to obtain a plurality of touch metal lines 340 .

[0075] The present invention can use a mask process to perform corresponding etching on the touch metal layer 34, such as performing photolithography on a specific portion of the touch metal layer 34, so as to etch a plurality of touch metal lines 340 in the touch metal layer 34. The touch metal lines 340 are used to transmit test signals, so as to facilitate subsequent testing of target devices (such as peripheral circuits) in the display panel or the entire display panel based on the test signals. For details, please refer to the aforementioned Figure 5-Figure 10 The relevant introduction in the embodiments will not be repeated here.

[0076] S1104 , growing a touch insulating layer (TLD layer) 35 on the plurality of touch metal lines 340 to obtain a test touch area 30 ; wherein the test touch area 30 is located between the edge 40 of the display panel 5 and the peripheral circuit 201 of the display panel 5 .

[0077] The present invention can also grow a touch insulating layer 35 on the plurality of touch metal wires 340, thereby obtaining the display panel 5, and also obtaining the test touch area 30 in the display panel 5, wherein the test touch area 30 is located between the edge 40 of the display panel 5 and the peripheral circuit 201 of the display panel 5, and the plurality of touch metal wires 340 are located in the test touch area 30. In other words, step S803 should be to etch the touch metal layer 34 at the location of the test touch area 30, thereby obtaining the plurality of touch metal wires 340 in the test touch area 30.

[0078] In an optional embodiment, after step S1103, the present invention may perform punching on each of the touch metal wires 340, thereby obtaining an opening 341 on each of the touch metal wires 340. Specifically, the present invention may perform punching on each of the touch metal wires 340 using an overlapping punching process, thereby obtaining an opening 341 on each of the touch metal wires 340. Preferably, the openings 341 (i.e., the opening positions) on two adjacent touch metal wires 340 are arranged in a staggered manner.

[0079] In an optional embodiment, before the display panel 5 is shipped out of the factory, one end of the test touch area 30 (specifically, each touch metal line 340 in the test touch area) in the display panel 5 is electrically connected to the peripheral circuit 201 of the display panel, and the other end is electrically connected to the test area ET of the display panel. When the display panel is shipped out of the factory, the present invention can cut off the test area ET of the display panel along the edge line of the test touch area 30 according to the opening 341 (i.e., the position of the opening) on ​​each of the touch metal lines 340 to obtain the display panel 5 that can be shipped out of the factory. In this way, the opening position on the touch metal line 340 can be cut during laser cutting, thereby reducing the panel cutting resistance, reducing the difficulty of laser cutting, and helping to improve product competitiveness. Among them, the edge line of the test touch area 30 can also be the edge line of the display panel 5 after cutting.

[0080] For details not introduced or described in the embodiments of the present invention, please refer to the aforementioned Figure 5-Figure 10 The relevant introduction in the embodiments will not be repeated here.

[0081] An embodiment of the present invention further provides a display device, the display device comprising the above Figure 5-Figure 10 The display panel introduced in the embodiment described in the foregoing description may be specifically referred to above and will not be described in detail here.

[0082] One or more technical solutions provided in the embodiments of the present invention have at least the following technical effects or advantages: The present invention provides a display panel, the display panel includes a test touch area, the test touch area is located between the edge of the display panel and the peripheral circuit of the display panel, the test touch area includes a substrate, a backplane inorganic layer, a buffer base layer, a touch metal layer and a touch insulation layer arranged in sequence, wherein the touch metal layer is provided with a plurality of touch metal wires connected to the peripheral circuit, and the touch metal wires are used to transmit test signals to implement the test of the peripheral circuit or the display panel. In the above scheme, a test touch area is newly set in the display panel, and the test touch area is located between the edge of the display panel and the peripheral circuit of the display panel, so that the gate wiring in the backplane inorganic layer is replaced by the touch metal layer in the prior art to transmit the test signal, effectively increasing the distance between the substrate (such as the PI layer) and the conductor layer, that is, the touch metal layer in the display panel, and reducing the probability / proportion of the panel short circuit caused by the bottom PI carbide aggregation overlapping the touch metal layer during laser cutting, thereby facilitating the improvement of the panel yield. At the same time, the technical problem of short circuit of the panel during laser cutting in the existing display panel is also solved.

[0083] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0084] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A display panel, characterized in that: The display panel comprises: A test touch area, the test touch area is located between the edge of the display panel and the peripheral circuit of the display panel, and the test touch area includes a substrate, a backplane inorganic layer, a buffer base layer, a touch metal layer and a touch insulation layer arranged in sequence; The touch metal layer is provided with a plurality of touch metal lines connected to the peripheral circuit, and the touch metal lines are used to transmit test signals to implement the test of the display panel; The touch metal wire is provided with an opening; The openings on two adjacent touch metal wires are arranged in a staggered manner.

2. The display panel according to claim 1, characterized in that: The touch metal layer is a multi-layer metal structure.

3. The display panel according to claim 2, characterized in that: The touch metal layer is a titanium-aluminum-titanium structure.

4. The display panel according to claim 1, characterized in that: The display panel further includes: The display area includes a buffer layer, a first metal layer, an insulating layer, a second metal layer and a protective layer which are stacked, wherein the first metal layer and the touch metal layer are the same film layer, and the touch metal layer is used to transmit the test signal to realize the test of the display area.

5. The display panel according to claim 1, characterized in that: The peripheral circuit of the display panel is located in the peripheral circuit area of ​​the display panel, and the peripheral circuit area includes a buffer layer, a first metal layer, an insulating layer, a second metal layer and a protective layer that are stacked, wherein the first metal layer and the touch metal layer are the same film layer, and the touch metal layer is used to transmit the test signal to realize the test of the peripheral circuit.

6. A display device, characterized in that: The display device comprises the display panel as described in any one of claims 1 to 5.

7. A method for preparing a display panel, characterized in that: The method comprises: sequentially growing a backplane inorganic layer and a buffer base layer on the substrate; growing a touch metal layer on the buffer base layer; Etching the touch metal layer to obtain a plurality of touch metal lines; Growing a touch insulating layer on the plurality of touch metal lines to obtain a test touch area; wherein the test touch area is located between the edge of the display panel and the peripheral circuit of the display panel; After etching the touch metal layer to obtain a plurality of touch metal lines, the method further includes: Each of the touch metal lines is punched using an overlapping punching process, wherein the openings on two adjacent touch metal lines are arranged in a staggered manner.

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